WO2011036514A1 - Procédé de production d'une couche anticorrosive sur un substrat - Google Patents

Procédé de production d'une couche anticorrosive sur un substrat Download PDF

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Publication number
WO2011036514A1
WO2011036514A1 PCT/IB2009/054183 IB2009054183W WO2011036514A1 WO 2011036514 A1 WO2011036514 A1 WO 2011036514A1 IB 2009054183 W IB2009054183 W IB 2009054183W WO 2011036514 A1 WO2011036514 A1 WO 2011036514A1
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WO
WIPO (PCT)
Prior art keywords
layer
substrate
metil
silane
tetra
Prior art date
Application number
PCT/IB2009/054183
Other languages
English (en)
Inventor
Ricardo Enrique Biana
Original Assignee
Alytus Corporation S.A.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alytus Corporation S.A. filed Critical Alytus Corporation S.A.
Priority to PCT/IB2009/054183 priority Critical patent/WO2011036514A1/fr
Priority to ARP100103442A priority patent/AR079186A1/es
Publication of WO2011036514A1 publication Critical patent/WO2011036514A1/fr

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04Coating on selected surface areas, e.g. using masks
    • C23C16/045Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/62Plasma-deposition of organic layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/50Multilayers
    • B05D7/56Three layers or more
    • B05D7/58No clear coat specified
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02Pretreatment of the material to be coated
    • C23C16/0272Deposition of sub-layers, e.g. to promote the adhesion of the main coating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40Oxides
    • C23C16/401Oxides containing silicon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/46Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16LPIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
    • F16L58/00Protection of pipes or pipe fittings against corrosion or incrustation
    • F16L58/02Protection of pipes or pipe fittings against corrosion or incrustation by means of internal or external coatings
    • F16L58/04Coatings characterised by the materials used
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16LPIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
    • F16L58/00Protection of pipes or pipe fittings against corrosion or incrustation
    • F16L58/02Protection of pipes or pipe fittings against corrosion or incrustation by means of internal or external coatings
    • F16L58/04Coatings characterised by the materials used
    • F16L58/14Coatings characterised by the materials used by ceramic or vitreous materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures

Definitions

  • the present invention relates to a new method for treating a surface of a substrate in order to confer protection against mechanical, thermal and chemical aggresion and, more particularly the invention refers to a method for applying, in sequence, at least two protective layers by well known techniques such as ionic implantation and plasma-enhanced chemical vapor deposition (PECVD) and a third layer such as one made of an epoxi .
  • PECVD plasma-enhanced chemical vapor deposition
  • PECVD plasma-enhanced chemical vapor deposition
  • PECVD plasma-enhanced chemical vapor deposition
  • PECVD plasma-enhanced chemical vapor deposition
  • PECVD plasma-enhanced chemical vapor deposition
  • PECVD plasma-enhanced chemical vapor deposition
  • PECVD plasma-enhanced chemical vapor deposition
  • Figure 1 shows a spectrogram of the first layer of a protective multilayer according to the invention, obtained by Fourier Transfom Infrared (FTIR) Spectroscopy, with the layer formed at 500 °C and without methane, and
  • FTIR Fourier Transfom Infrared
  • Figure 2 shows a spectrogram of the second layer of a protective multilayer of the invention, also obtained by Fourier Transfom Infrared (FTIR) Spectroscopy, wherein the layer was obtained at room temperature .
  • FTIR Fourier Transfom Infrared
  • the same refers to a method or process for treating a substrate, preferably a ferrous based material and more preferably a steel made element, and the invention is preferably applied to the oil field for treating tubular members such as tubings, piping, casings, and similar items employed in the oil industry, however the method of the invention, while described in particular connection to a particular industry and/or field the same may be applied to any equipment, and pieces where corrosion, mechanical and chemical resistance is an issue.
  • the invention refers to a method for the formation of an anticorrosive , mechanical and chemical resistant multi-layer in a substrate, such as a piping, and preferably the inner surface of the piping.
  • the method comprises at least the steps of: a) forming a first layer on the substrate by plasma-enhanced chemical vapour deposition (PECVD) with the substrate at a first temperature;
  • PECVD plasma-enhanced chemical vapour deposition
  • PECVD plasma-enhanced chemical vapor deposition
  • the first temperature at which the first layer is formed will be between about 300 °C to about 700 °C, preferably at about 500 °C, and the second temperature of the substrate is between about 0°C to about 100 °C and preferably at room temperature .
  • the first layer and the second layers, forming together a bi- layer, are formed by (PECVD) plasma- enhanced chemical vapor deposition of organosilicon precursors, whereby the both layers are formed of a compound of the formula general Si x O y C z .
  • the organosilicon precursors are Tri metil silane (CH3)3 SiH; Tetra metil silane (CH3)4 Si; Hexa metil disiloxane (Me3Si)2-0; Hexa metil disilazane (Me3Si ) 2NH ; Di metil di metoxi silane (Me3 ) 2Si (OMe) 2 ; Metil trimetoxi silane (CH3) Si (OCH3) 3 ; Tetra metil ciclo tetra siloxane (CH3- SiH-0-)4; Octa metil ciclo tetra siloxane ( (CH3 ) 2 -Si-O- ) 4 ; Tetra etoxi silane Si(OC2H5)4, and/or Tetra metoxi silane Si (OCH3) 4.
  • the formation of the first and second layers are made by PECVD, by employing organolsilicon precursors wherein the silanol is produced either in gaseous phase as well as on the substrate. Since the hydrogen bonding is relatively weak, with a substrate temperature high enough, such as higher than 500 °C, that is the first temperature, employed for deposition of the first layer, the Si-OH bond tends to break thus selectively promoting the formation of covalent bonds Si-O-Si, according to reaction : Si - OH + Si - OH Si - O- Si + H 2 0
  • the second layer is deposited at a second temperature, lower than the first one, whereby the above disclosed reaction is also carried out but more slowly. Under these conditions, if the rate of deposition or deposition velocity is slow enough, a substantial or complete elimination of the silanol is desirably obtained.
  • the ⁇ SiCH3 is never eliminated in its entirety because the carbon provides the necessary elasticity to the covering.
  • the first and the second layer formed according to the teachings of the invention have been analized by Fourier Transform Infrared (FTIR) spectroscopy and the results may be seen in the charts of Figures 1 and 2.
  • FTIR Fourier Transform Infrared
  • This layer actuates as a link or anchorage between the substrate and the second layer which will operate as a covering, layer or liner for anticorrosive protection.
  • This second layer will also form an anchoring layer for receiving a third layer of a mechanical-resistant and/or anticorrosive material such as an epoxi .
  • the second layer is preferably deposited at room temperature and methane may be added as a second reagent gas.
  • the resulting compounds may be observed in the FTIR spectroscopy for layer obtained by both processes.
  • a third layer is applied onto the second layer by a step of forming a third layer by applying a mechanical-resistant anticorrosive material in the second layer.
  • the mechanical-resistant anticorrosive material preferably comprises a polymeric material and more preferably an epoxi resin that may be applied at room temperature, preferably between about IOC and 40 °C.
  • the third layer that is the outermost layer, will provide the necessary mechanical protection and also it may provide an anticorrosive protection in addition to the protection already provided by the second layer.
  • the method preferably comprises the additional step of forming a base layer by ionic implantation in the substrate. This step is carried out before the step of forming the first layer.
  • the ionic implantation consists of the implantation of an element selected from the group consisting of N2 , C2 , Si, Cr, or others capable of modifying the structure of the substrate of the material and thus its properties.
  • Any convenient ion implantation equipment may be employed, typically consisting of an ion source, where ions of the desired element are produced, an accelerator, where the ions are electrostatically accelerated to a high energy, and a target chamber, where the ions impinge on a target, which is the material to be implanted.
  • Nitrogen or other ions can be implanted into a tube, a casing, a tool and any other metal or steel target .
  • the structural change caused by the implantation produces a surface compression in the steel, which prevents crack propagation and thus makes the material more resistant to fracture.
  • the chemical change can also make the tool more resistant to corrosion.
  • Ionic implantation is a well known technique and information about the same may be obtained from the publication Lasorsa, P-J. Morando, A. Rodrigo, "Effects of the plasma oxygen concentration on the formation of SiOxCy films by low temperature PECVD" Surface and Coatings Technology 195, p42-47, (2005).
  • the bi-layer covering formed by the first and the second layer deposited by PECVD will act as an anchorage surface between the base layer, or ion implanted substrate, and the third layer made of epoxi or other polimeric liner.
  • the bi-layer will also form an anticorrosive intermediate layer or barrier.
  • the process of the invention may be carried out in any metal substrate but it has shown effective results in oil field casing and tubes and specially in the covering of the internal surface of these tub
  • a substrate having at least one surface thereof protected by a multi- layer protection formed by the above described process comprises at least a) a first layer on the substrate applied by plasma-enhanced chemical vapor deposition (PECVD) with the substrate at a first temperature; b) a second layer on the first layer applied by plasma-enhanced chemical vapor deposition (PECVD) with the substrate at a second temperature, and c) a third layer formed of mechanical-resistant anticorrosive material in the second layer.
  • PECVD plasma-enhanced chemical vapor deposition
  • PECVD plasma-enhanced chemical vapor deposition
  • the first and second layers are formed by plasma-enhanced chemical vapor deposition (PECVD) of organosilicon precursors which may be selected from the group consisting of Tri metil silane (CH3)3 SiH; Tetra metil silane (CH3)4 Si; Hexa metil disiloxane (Me3Si)2-0; Hexa metil disilazane (Me3Si ) 2NH ; Di metil di metoxi silane (Me3 ) 2Si (OMe) 2 ; Metil trimetoxi silane (CH3 ) Si (0CH3 ) 3 ; Tetra metil ciclo tetra siloxane (CH3 -SiH-0- ) 4 ; Octa metil ciclo tetra siloxane ( (CH3) 2-Si-O-) 4; Tetra etoxi silane Si(OC2H5)4, and/or Tetra metoxi silane Si(OCH3)4.
  • PECVD plasma-enhanced chemical vapor deposition
  • the above mentioned first temperature is between about 300 °C to about 700 °C, preferably 500 °C
  • said second temperature is between about 0°C to about 100 °C, preferably room temperature.
  • the substrate may comprise a base layer applied by ionic implantation of an element selected from the group consisting of N2 , C2 , Si, Cr, or others capable of modifying the structure of the substrate of the material and thus its properties.
  • the substrate of the invention may be any metal member, preferably made of steel and more preferably tubular members, wherein the treated surface may be an inner surface of the member.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Ceramic Engineering (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

Cette invention concerne un procédé de formation d'une couche anticorrosive sur un substrat ainsi qu'un substrat traité au moyen dudit procédé et présentant une résistance mécanique et une résistance à la corrosion améliorées. Ledit procédé comprend les étapes consistant à former une première couche et une seconde couche sur le substrat par dépôt chimique en phase vapeur assisté par plasma (PECVD), le substrat étant à des températures différentes au cours de la formation de la première couche et au cours de la formation de la seconde couche.
PCT/IB2009/054183 2009-09-24 2009-09-24 Procédé de production d'une couche anticorrosive sur un substrat WO2011036514A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/IB2009/054183 WO2011036514A1 (fr) 2009-09-24 2009-09-24 Procédé de production d'une couche anticorrosive sur un substrat
ARP100103442A AR079186A1 (es) 2009-09-24 2010-09-22 Metodo para la produccion de una multi capa anticorrosiva en un substrato y substrato obtenido con dicha multi capa anticorrosiva

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IB2009/054183 WO2011036514A1 (fr) 2009-09-24 2009-09-24 Procédé de production d'une couche anticorrosive sur un substrat

Publications (1)

Publication Number Publication Date
WO2011036514A1 true WO2011036514A1 (fr) 2011-03-31

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PCT/IB2009/054183 WO2011036514A1 (fr) 2009-09-24 2009-09-24 Procédé de production d'une couche anticorrosive sur un substrat

Country Status (2)

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AR (1) AR079186A1 (fr)
WO (1) WO2011036514A1 (fr)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6383949B1 (en) * 1999-06-24 2002-05-07 Samsung Electronics Co., Ltd. Method of depositing an ozone-TEOS oxide film to eliminate its base material dependence, and apparatus for forming such a film at several different temperatures
US20090061201A1 (en) * 2007-09-05 2009-03-05 United Microelectronics Corp. Ultra low dielectric constant (k) dielectric layer and method of fabricating the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6383949B1 (en) * 1999-06-24 2002-05-07 Samsung Electronics Co., Ltd. Method of depositing an ozone-TEOS oxide film to eliminate its base material dependence, and apparatus for forming such a film at several different temperatures
US20090061201A1 (en) * 2007-09-05 2009-03-05 United Microelectronics Corp. Ultra low dielectric constant (k) dielectric layer and method of fabricating the same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
KIM ET AL: "Characteristics of low-k SiOC(-H) films deposited at various substrate temperature by PECVD using DMDMS/O2 precursor", THIN SOLID FILMS, ELSEVIER-SEQUOIA S.A. LAUSANNE, CH LNKD- DOI:10.1016/J.TSF.2007.06.097, vol. 516, no. 2-4, 17 November 2007 (2007-11-17), pages 340 - 344, XP022349541, ISSN: 0040-6090 *

Also Published As

Publication number Publication date
AR079186A1 (es) 2012-01-04

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