WO2011027981A2 - Lens for an led package - Google Patents

Lens for an led package Download PDF

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Publication number
WO2011027981A2
WO2011027981A2 PCT/KR2010/005399 KR2010005399W WO2011027981A2 WO 2011027981 A2 WO2011027981 A2 WO 2011027981A2 KR 2010005399 W KR2010005399 W KR 2010005399W WO 2011027981 A2 WO2011027981 A2 WO 2011027981A2
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WO
WIPO (PCT)
Prior art keywords
lens
led
led package
led chip
heat transfer
Prior art date
Application number
PCT/KR2010/005399
Other languages
French (fr)
Korean (ko)
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WO2011027981A3 (en
Inventor
이동규
Original Assignee
(주)칸델라
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Publication of WO2011027981A2 publication Critical patent/WO2011027981A2/en
Publication of WO2011027981A3 publication Critical patent/WO2011027981A3/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
    • G02B19/0009—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only
    • G02B19/0014—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only at least one surface having optical power
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • G02B27/0955—Lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body

Definitions

  • the present invention relates to a lens for an LED package, and relates to a lens for an LED package which can emit light in various colors by preventing glare of the LED and preventing yellow bands from occurring.
  • a light emitting diode is a semiconductor device for generating light of various colors when a current is applied.
  • the color of light generated by the LED is mainly determined by the chemical constituents of the semiconductor of the LED.
  • the demand for these LEDs is steadily increasing because they have several advantages over filament-based light emitting devices, such as long life, low power, excellent initial driving characteristics, high vibration resistance, and high tolerance for repetitive power interruptions.
  • LED is being used as a backlight device for a lighting device and a large liquid crystal display (LCD). Since they require large outputs, these high power LEDs require a package structure with good heat dissipation.
  • LCD liquid crystal display
  • FIG. 1 is a view illustrating a general LED package and a state in which the LED package is mounted on a circuit board.
  • the LED package 10 includes a heat transfer member 14 that serves as a heat guide while seating the LED chip 12.
  • the LED chip 12 receives electricity from an external power source (not shown) through a pair of wires 16 and a pair of terminals 18 for supplying power.
  • the upper part of the heat transfer member 14 including the LED chip 12 is sealed by a sealing material 20 such as silicon, and the sealing material 20 is covered with a lens 22.
  • the housing 24 is installed around the heat transfer member 14 to support the heat transfer member 14 and the terminal 18.
  • the LED package 10 of FIG. 1 (a) is mounted on a circuit board 30 which is a heat sink as shown in FIG. 1 (b) to form an LED assembly 40.
  • a thermal conductive pad 36 such as solder is interposed between the heat transfer member 14 of the LED package 10 and the metal heat dissipation substrate 32 of the circuit board 30 to promote thermal conduction therebetween.
  • the terminal 18 is also stably connected to the circuit pattern 34 of the circuit board 30 by the solder 38.
  • the LED package 10 shown in FIG. 1 and the LED assembly 40 mounted on the circuit board 30 are focused on heat dissipation. That is, the LED package 10 is a heat transfer substrate 32 of the circuit board 30, the heat transfer member 14 through the heat conduction pad 36 or directly in order to discharge the heat generated from the LED chip 12 to the outside. ) In this case, most of the heat generated from the LED chip 12 is passed through the heat transfer member 14 through the heat transfer member 14 to the heat dissipation substrate 32 of the circuit board 30, only a small amount of heat of the LED package 10 It is released into the air through the surface, ie the housing 24 or the lens 22.
  • the conventional LED package 10 uses a method of implementing a white-based color by coating the phosphor material 46 on the surface of the LED chip 12.
  • the conventional LDE package 10 has a limitation in implementing the color of the lighting LED freely because the phosphor material 46 is directly applied to the surface of the LED chip 12.
  • the present invention is to solve the above problems of the prior art, the object of the present invention is to eliminate the glare and the yellow strip which is a fatal disadvantage of the existing LED.
  • Another object of the present invention is to enable uniform light emission, which is an advantage of incandescent and fluorescent lamps.
  • the heat transfer member that serves as a heat guide while seating the LED chip, and the LED chip is a pair of wires and terminals each formed to receive electricity through an external power source;
  • the LED package comprising a sealing material for sealing the upper portion of the LED chip and the heat transfer member, a lens covering the upper portion of the sealing material, a housing for supporting the heat transfer member and the terminal,
  • a bottom spherical surface is formed on a bottom surface of the lens, a dome portion is formed on an upper surface of the lens, an antireflective coating is formed on a bottom spherical surface of the lens, and a surface of the antireflective coating includes any one of a phosphor, a diffusing agent, and a diffusion film. Characterized in that one is formed.
  • a yellow or red color is applied to the bottom surface so that white light is emitted, and a phosphorescent material is coated thereon.
  • the lens is characterized in that the anti-reflective coating is formed on the surface of the dome.
  • the lens may include a first lens covering the sealing material and a second lens formed on the upper portion of the first lens to have a radius larger than that of the first lens.
  • the phosphorescent material is characterized in that it is blended with the silicon for optics in a 1: 1.
  • the color of the LED chip may be formed in a single color, and various colors may be easily implemented by forming phosphors of various colors in which silicon is blended on the lens.
  • the anti-reflective coating on the surface of the dome and the bottom spherical surface of the lens has the effect of improving the light transmittance to 98%.
  • the present invention forms a phosphor on the bottom spherical surface of the lens, thereby converting the straight LED light into a uniform surface emission state, eliminating the glare and yellow band generated by the LED, and makes the LED light uniform, By controlling the color temperature of light, it is possible to realize various LED colors.
  • the present invention has the effect that the phosphor material is formed on the bottom surface of the plurality of lenses, eliminating glare, and eliminates the yellow band generated by reflecting the LED chip shape when the lens is attached to the LED.
  • the phosphor is formed on the bottom spherical surface of the lens, and thus, when the phosphor is coated on the surface of the conventional LED chip, the color of the lighting LED can be freely realized.
  • the present invention has an effect that can easily implement a variety of color LED through the combination of phosphorescent material and silicon for one color LED chip.
  • the present invention can freely implement the color of the white and lighting LED by applying the anti-reflective coating and phosphorescent material.
  • the present invention can easily implement a multi-color LED by applying a lens formed with a phosphor material having a variety of colors to a single color LED.
  • 1 is a view showing a typical LED package.
  • FIG. 2 is a view showing one LED package to which a lens according to the present invention is applied.
  • FIG 3 shows another LED package in which a lens according to the present invention is applied on a blue LED chip.
  • FIG. 4 is a view showing another LED package in which the lens of the present invention is applied on a COB type LED chip.
  • FIG. 5 is a view showing another LED package in which the lens according to the present invention is assembled in a double structure.
  • the LED package includes a heat transfer member 14 serving as a heat guide while seating the LED chip 12.
  • a pair of wires 16 and a terminal 18 are connected to the LED chip 12, and electricity is supplied from the power supply to the LED chip 12 through the wire 16 and the terminal 18.
  • the upper part of the LED chip 12 and the heat transfer member 14 is sealed by a sealing material 20 such as silicon.
  • the upper portion of the sealing material 20 is covered with a lens 22.
  • the heat transfer member 14 and the terminal 18 are protected and supported by a housing 24 installed around it.
  • the lens for LED package according to the present invention covers the upper portion of the sealing material 20 to protect the upper portion of the heat transfer member 14 and the terminal 18.
  • the lens 22 is attached to the top of the housing 24.
  • a bottom spherical surface 50 positioned above the LED chip 12 is formed on the bottom surface of the lens 22, and a dome portion 52 is formed on the upper surface of the lens 22.
  • An antireflective coating 54 is formed on each surface of the bottom spherical surface 50 of the lens 22 and the dome portion 52. While the light transmittance of general glass lenses is 92% to 94%, antireflection coating (54) improves light transmittance to 98% to increase light transmittance. This anti-reflective coating 54 is to be changed to the surface emitting state according to the transmission of light.
  • a phosphorescent material 56 is coated on the surface of the antireflective coating 54 formed on the bottom spherical surface 50 of the lens 22.
  • the phosphor 56 prevents glare and prevents the shape of the LED chip 12 from being reflected through the lens 22 to eliminate yellow bands and change the surface light emission state according to the transmission of light.
  • a surface light source through the lens 22 is made, which is similar to the surface light of a fluorescent lamp.
  • the LED chip 12 may implement a variety of LED colors by controlling the color temperature of the light by changing the heating temperature by the control of the electrical signal.
  • the phosphor 56 has a color of yellow, green, red, blue, or a fluorescent color mixed with these colors. Accordingly, by applying phosphorescent materials 56 of various colors to the lens 22 for the single color LED chip 12, more various LED colors may be realized.
  • the phosphor 56 is basically 1: 1 mixed with the optical silicon, but may be blended in an appropriate ratio as necessary.
  • the phosphor 56 may be formed of oxide, nitride, silicate, phosphor, other compounds, and the like.
  • a diffuser or a diffusion film may be formed on the bottom spherical surface 50 of the lens 22 in place of the phosphor 56, thereby realizing the function of the phosphor 56.
  • the lens 22 for the LED package of the present invention may be assembled on the blue LED chip 58 to which the phosphor material 46 is coated, as illustrated in FIG. 3.
  • a color paint such as yellow or red may be applied to the bottom spherical surface 50 of the lens 22, and the anti-reflective coating 54 and the phosphor 56 may be applied to the surface of the color paint thus applied. Accordingly, when the blue LED chip 58 is turned on, the lens 22 passes through the phosphor 56 and the antireflective coating 54 of the bottom spherical surface 50 and is white to the outside through the dome portion 52. It emits a series of LED light.
  • the LED package lens 22 is provided on an LED chip 12 in the form of a chip on board (COB).
  • COB chip on board
  • An antireflective coating 54 is formed on the bottom spherical surface 50 and the dome portion 52 of the lens 22.
  • a phosphorescent material 56 is coated on the surface of the antireflective coating 54 formed on the bottom spherical surface 50 of the lens 22.
  • the bottom spherical surface 50 of the lens 22 may form a diffusion agent or a diffusion film in place of the phosphor material 56 to implement a function of the phosphor material 56.
  • the lens 22 includes a first lens 22a covering the sealing material 20 and a larger radius than the first lens 22 so that the lens 22a can be formed. It consists of a second lens 22b installed on the upper portion.
  • an anti-reflective coating 54 is formed on each of the bottom spherical surfaces 50 of the first and second lenses 22a and 22b and the surface of the dome portion 52, and each of the first and second lenses 22a and 22b is formed.
  • a phosphorescent material 56 may be formed on the antireflective coating 54 formed on the bottom spherical surface 50, and a diffusion agent or a diffusion film may be formed in place of the phosphorescent material 56.
  • the shape of the lens 22 may be various, such as semi-circular shape or aspherical surface, depending on the desired light pattern, micro lens is also possible. This is to improve the light output of the light emitting diode and to adjust the light distribution characteristics in the high output light emitting diode.
  • the anti-reflective coating 54 and phosphorescent material 56 can be easily applied to a plurality of LED chips 12 irrespective of the size can be diversified range of use.
  • an antireflective coating 54 is formed on the bottom spherical surface 50 of the lens 22.
  • the phosphor 56 is formed on the antireflective coating 54 formed on the bottom spherical surface 50 of the lens 22.
  • the phosphor 56 is made of oxide, nitride, silicate, phosphor, and other compounds, and has a color of any one of yellow, green, red, blue, and fluorescent colors formed by mixing.
  • an antireflective coating 54 is formed on the dome 52 of the lens 22.
  • an antireflective coating 54 on the dome portion 52 of the lens 22 can greatly improve the transmittance of light.
  • the lens 22 for the LED package is completed through the application of the anti-reflective coating 54 and the phosphorescent material 56.
  • the lens 22 of the present invention is applied with the anti-reflective coating 54 and the phosphorescent material 56, glare is prevented, and the yellow band appears when the shape of the LED chip 12 is reflected through the lens 22. It is removed to change the surface emitting state according to the transmission of light. As a result, a surface light source through the lens 22 is made, which is similar to that of a fluorescent lamp.
  • the method of applying the phosphorescent material 56 to the lens 22 of the present invention can avoid the conventional method of applying the phosphorescent material 56 to the blue LED chip 58.
  • the present invention may be applied to the bottom spherical surface 50 of the lens 22 by applying a phosphorescent material 56 appropriately blended with silicon to implement a desired color more clearly.
  • the lens 22 of the present invention can be easily applied to the integrated compact lens attached to the LED package.
  • the lens 22 of the present invention may be composed of a plurality of lenses, such as the first and second lenses 22a and 22b, and the anti-reflective coating 54, phosphorescent material 56, and a diffusing agent or diffusing film may be formed on each of them. It can form and use.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention relates to a lens for an LED package, comprising: a spherical floor surface formed on an undersurface thereof; a dome portion formed on a top surface of the lens; a non-reflective coating formed on the spherical floor surface of the lens; either a phosphorescent material, a diffusing agent, or a diffusion film formed on a surface of the non-reflective coating; and a non-reflective coating formed on a surface of the dome portion.

Description

LED 패키지용 렌즈Lens for LED Package
본 발명은 LED 패키지용 렌즈에 관한 것으로서, LED의 눈부심을 방지하고 황색 띠가 발생하지 않도록 하여 여러 가지 색상으로 발광할 수있도록 하는 LED 패키지용 렌즈에 관한 것이다.The present invention relates to a lens for an LED package, and relates to a lens for an LED package which can emit light in various colors by preventing glare of the LED and preventing yellow bands from occurring.
일반적으로 발광다이오드(LED: Light Emitting Diode)는 전류가 가해지면 다양한 색상의 빛을 발생시키기 위한 반도체 장치이다.In general, a light emitting diode (LED) is a semiconductor device for generating light of various colors when a current is applied.
LED에서 발생되는 빛의 색상은 주로 LED의 반도체를 구성하는 화학 성분에 의해 정해진다. 이러한 LED는 필라멘트에 기초한 발광 소자에 비해 긴 수명, 낮은 전원, 우수한 초기 구동 특성, 높은 진동 저항 및 반복적인 전원 단속에 대한 높은 공차 등의 여러 장점을 갖기 때문에 그 수요가 지속적으로 증가하고 있다.The color of light generated by the LED is mainly determined by the chemical constituents of the semiconductor of the LED. The demand for these LEDs is steadily increasing because they have several advantages over filament-based light emitting devices, such as long life, low power, excellent initial driving characteristics, high vibration resistance, and high tolerance for repetitive power interruptions.
최근 LED는 조명 장치 및 대형 LCD(Liquid Crystal Display)용 백라이트(Backlight) 장치로 채용되고 있다. 이들은 큰 출력을 요하므로 이러한 고출력 LED에는 우수한 방열 성능을 갖는 패키지 구조가 요구된다.Recently, LED is being used as a backlight device for a lighting device and a large liquid crystal display (LCD). Since they require large outputs, these high power LEDs require a package structure with good heat dissipation.
도 1은, 일반적인 LED 패키지 및 이 LED 패키지가 회로기판에 장착된 상태를 보여주는 도면이다.1 is a view illustrating a general LED package and a state in which the LED package is mounted on a circuit board.
먼저, 도 1(a)을 참조하면, LED 패키지(10)는 LED 칩(12)을 안착시키면서 열 안내역할을 하는 열전달부재(Heat Slug)(14)를 구비한다. LED 칩(12)은 전원을 공급하는 한 쌍의 와이어(16) 및 한 쌍의 단자(18)를 통해 외부 전원(도시 생략)으로부터 전기를 공급받는다. LED 칩(12)을 포함하여 열전달부재(14)의 상부는 실리콘 등과 같은 밀봉재(20)에 의해 밀봉되고, 이 밀봉재(20)에는 렌즈(22)가 덮인다. 하우징(24)이 열전달부재(14) 둘레에 설치되어 열전달부재(14) 및 단자(18)를 지지한다.First, referring to FIG. 1A, the LED package 10 includes a heat transfer member 14 that serves as a heat guide while seating the LED chip 12. The LED chip 12 receives electricity from an external power source (not shown) through a pair of wires 16 and a pair of terminals 18 for supplying power. The upper part of the heat transfer member 14 including the LED chip 12 is sealed by a sealing material 20 such as silicon, and the sealing material 20 is covered with a lens 22. The housing 24 is installed around the heat transfer member 14 to support the heat transfer member 14 and the terminal 18.
이와 같은 도 1(a)의 LED 패키지(10)는 도 1(b)에 도시한 바와 같이 히트 싱크인 회로기판(30)에 장착되어 LED 어셈블리(40)를 구성한다. 이때, 솔더와 같은 열전도 패드(36)가 LED 패키지(10)의 열전달부재(14)와 회로기판(30)의 금속 방열기판(32) 사이에 개재되어 이들 사이의 열전도를 촉진한다. 또한, 단자(18)도 역시 솔더(38)에 의해 회로기판(30)의 회로패턴(34)과 안정적으로 연결된다.The LED package 10 of FIG. 1 (a) is mounted on a circuit board 30 which is a heat sink as shown in FIG. 1 (b) to form an LED assembly 40. At this time, a thermal conductive pad 36 such as solder is interposed between the heat transfer member 14 of the LED package 10 and the metal heat dissipation substrate 32 of the circuit board 30 to promote thermal conduction therebetween. In addition, the terminal 18 is also stably connected to the circuit pattern 34 of the circuit board 30 by the solder 38.
이와 같이, 도 1에 도시된 LED 패키지(10) 및 이를 회로기판(30)에 장착한 LED 어셈블리(40)는 방열에 초점이 맞추어져 있다. 즉, LED 패키지(10)는 LED 칩(12)에서 발생하는 열을 외부로 방출하기 위해 열 전달 부재(14)가 열전도 패드(36)를 통해 또는 직접적으로 회로기판(30)의 방열기판(32)에 연결된다. 이렇게 되면, LED칩(12)에서 발생하는 열은 대부분 전도에 의해 열전달부재(14)를 거쳐 회로기판(30)의 방열기판(32)으로 빠져나가게 되고, 소량의 열만이 LED 패키지(10)의 표면 즉 하우징(24) 또는 렌즈(22) 등을 통해 공기 중으로 방출된다.As such, the LED package 10 shown in FIG. 1 and the LED assembly 40 mounted on the circuit board 30 are focused on heat dissipation. That is, the LED package 10 is a heat transfer substrate 32 of the circuit board 30, the heat transfer member 14 through the heat conduction pad 36 or directly in order to discharge the heat generated from the LED chip 12 to the outside. ) In this case, most of the heat generated from the LED chip 12 is passed through the heat transfer member 14 through the heat transfer member 14 to the heat dissipation substrate 32 of the circuit board 30, only a small amount of heat of the LED package 10 It is released into the air through the surface, ie the housing 24 or the lens 22.
그리고, 종래의 LED 패키지(10)는, LED 칩(12)의 표면에 인광소재(46)를 도포하여 백색 계열의 색상을 구현하는 방식을 사용한다. In addition, the conventional LED package 10 uses a method of implementing a white-based color by coating the phosphor material 46 on the surface of the LED chip 12.
하지만, 상기 LED의 광원이 렌즈를 통해 직접적으로 반사되기 때문에 눈부심이 발생하는 문제점이 있다. However, there is a problem that glare occurs because the light source of the LED is directly reflected through the lens.
그리고, 종래의 LDE 패키지(10)는 LED 칩(12)의 표면에 인광소재(46)를 직접 도포하기 때문에 조명용 LED의 색상을 자유롭게 구현하는 데 한계가 있었다. In addition, the conventional LDE package 10 has a limitation in implementing the color of the lighting LED freely because the phosphor material 46 is directly applied to the surface of the LED chip 12.
또한, 반구형인 렌즈가 LED칩의 모양을 확대시키기 때문에 방사면에 황색 띠가 발생하는 단점이 있다.In addition, since the hemispherical lens enlarges the shape of the LED chip, there is a disadvantage that a yellow band is generated on the radiation surface.
본 발명은 상기한 종래기술의 문제점을 해소하기 위한 것으로, 본 발명의 목적은 기존 LED의 치명적 단점인 눈부심과 황색 띠를 없애는데 있습니다.The present invention is to solve the above problems of the prior art, the object of the present invention is to eliminate the glare and the yellow strip which is a fatal disadvantage of the existing LED.
본 발명의 다른 목적은, 백열등과 형광등의 장점인 균일한 빛의 방사를 구현할 수 있도록 하는데 있습니다.Another object of the present invention is to enable uniform light emission, which is an advantage of incandescent and fluorescent lamps.
이러한 목적을 달성하기 위한 본 발명의 LED용 렌즈는, LED 칩을 안착시키면서 열안내 역할을 하는 열전달부재와, 상기 LED 칩은 외부 전원을 통해 전기를 공급받도록 형성되는 각각 한 쌍의 와이어 및 단자와, 상기 LED 칩 및 열전달부재의 상부를 밀봉하는 밀봉재와, 상기 밀봉재의 상부를 덮는 렌즈와, 열전달부재 및 단자를 지지하는 하우징을 포함하는 LED 패키지에 있어서, LED lens of the present invention for achieving the above object, the heat transfer member that serves as a heat guide while seating the LED chip, and the LED chip is a pair of wires and terminals each formed to receive electricity through an external power source; In the LED package comprising a sealing material for sealing the upper portion of the LED chip and the heat transfer member, a lens covering the upper portion of the sealing material, a housing for supporting the heat transfer member and the terminal,
상기 렌즈의 저면에는 바닥 구면이 형성되고, 상기 렌즈의 상면에는 돔부가 형성되며, 상기 렌즈의 바닥 구면에는 무반사 코팅이 형성되고, 상기 무반사 코팅의 표면에는 인광소재, 확산제 및 확산용 필름 중에서 어느 하나가 형성되는 것을 특징으로 한다. A bottom spherical surface is formed on a bottom surface of the lens, a dome portion is formed on an upper surface of the lens, an antireflective coating is formed on a bottom spherical surface of the lens, and a surface of the antireflective coating includes any one of a phosphor, a diffusing agent, and a diffusion film. Characterized in that one is formed.
상기 렌즈는 청색 LED 칩 상에 부착시킬 때 백색 계열의 빛이 발광되도록 바닥 구면에 황색 또는 적색을 도포시키고, 그 위에 인광소재를 도포하는 것을 특징으로 한다. When the lens is attached on a blue LED chip, a yellow or red color is applied to the bottom surface so that white light is emitted, and a phosphorescent material is coated thereon.
상기 렌즈는 상기 돔부의 표면에 무반사 코팅이 형성되는 것을 특징으로 한다. The lens is characterized in that the anti-reflective coating is formed on the surface of the dome.
상기 렌즈는, 밀봉재를 덮는 제1렌즈와, 상기 제1렌즈보다 반경을 더 크게 형성하여 상기 제1렌즈의 상부에 설치되는 제2렌즈를 포함하는 것을 특징으로 한다.The lens may include a first lens covering the sealing material and a second lens formed on the upper portion of the first lens to have a radius larger than that of the first lens.
상기한 인광소재는, 1:1로 광학용 실리콘과의 배합되는 것을 특징으로 한다.The phosphorescent material is characterized in that it is blended with the silicon for optics in a 1: 1.
상기 LED 칩의 색상은 단색으로 형성하고, 실리콘이 배합된 다양한 색상의 인광소재를 렌즈에 형성하여 여러 가지 색상을 용이하게 구현할 수 있다. The color of the LED chip may be formed in a single color, and various colors may be easily implemented by forming phosphors of various colors in which silicon is blended on the lens.
본 발명에 따르면, 렌즈의 돔부 및 바닥 구면의 표면에 무반사 코팅을 함으로써 빛의 투과율을 98%로 향상시킬 수 있는 효과가 있다. According to the present invention, the anti-reflective coating on the surface of the dome and the bottom spherical surface of the lens has the effect of improving the light transmittance to 98%.
또한, 본 발명은 인광소재를 렌즈의 바닥 구면에 형성함으로써, 직진성의 LED 빛을 균일한 면발광 상태로 변환하고, LED에서 발생되는 눈부심과 황색 띠를 없애며, LED빛의 방사가 균일하도록 하고, 빛의 색 온도(Color Temperature)를 조절하여 여러 가지의 LED 색상으로 구현할 수 있는 효과가 있다.In addition, the present invention forms a phosphor on the bottom spherical surface of the lens, thereby converting the straight LED light into a uniform surface emission state, eliminating the glare and yellow band generated by the LED, and makes the LED light uniform, By controlling the color temperature of light, it is possible to realize various LED colors.
또한, 본 발명은 복수개의 렌즈 바닥 구면에 인광소재가 형성되도록 함으로써, 눈부심을 없애고, LED에 렌즈 부착시 LED 칩 모양이 반사되어 나타나는 황색의 띠발생이 해소되는 효과가 있다.In addition, the present invention has the effect that the phosphor material is formed on the bottom surface of the plurality of lenses, eliminating glare, and eliminates the yellow band generated by reflecting the LED chip shape when the lens is attached to the LED.
또한, 본 발명은 렌즈의 바닥 구면에 인광소재를 형성함에 따라 종래의 LED 칩 표면에 인광소재가 도포된 경우 보다 조명용 LED의 색상을 자유롭게 구현할 수 있는 효과가 있다.In addition, according to the present invention, the phosphor is formed on the bottom spherical surface of the lens, and thus, when the phosphor is coated on the surface of the conventional LED chip, the color of the lighting LED can be freely realized.
또한, 본 발명은 한 가지 색상의 LED 칩에 대하여 인광소재와 실리콘의 배합을 통해서 여러 가지 색상의 LED를 용이하게 구현할 수 있는 효과가 있다. In addition, the present invention has an effect that can easily implement a variety of color LED through the combination of phosphorescent material and silicon for one color LED chip.
또한, 본 발명은 무반사 코팅과 인광소재를 적용함으로써 백색 및 조명용 LED의 색상을 자유롭게 구현할 수 있다.In addition, the present invention can freely implement the color of the white and lighting LED by applying the anti-reflective coating and phosphorescent material.
또한, 본 발명은 다양한 색상을 가진 인광소재가 형성된 렌즈를 단색의 LED에 적용함으로써, 여러 가지 색상의 LED를 용이하게 구현할 수 있다. In addition, the present invention can easily implement a multi-color LED by applying a lens formed with a phosphor material having a variety of colors to a single color LED.
도 1은 일반적인 LED 패키지를 도시한 도면이다. 1 is a view showing a typical LED package.
도 2는 본 발명에 따른 렌즈가 적용된 하나의 LED 패키지를 도시한 도면이다.2 is a view showing one LED package to which a lens according to the present invention is applied.
도 3은 본 발명의 따른 렌즈가 청색 LED 칩 상에 적용된 다른 LED 패키지를 도시한 도면이다.3 shows another LED package in which a lens according to the present invention is applied on a blue LED chip.
도 4는 본 발명의 따른 렌즈가 COB형태의 LED칩 상에 적용된 다른 LED 패키지를 도시한 도면이다.4 is a view showing another LED package in which the lens of the present invention is applied on a COB type LED chip.
도 5는 본 발명에 따른 렌즈를 2중 구조로 조립시킨 또 다른 LED 패키지를 도시한 도면이다.5 is a view showing another LED package in which the lens according to the present invention is assembled in a double structure.
이하, 본 발명의 바람직한 실시 예를 첨부된 도면을 참조하여 상세히 설명한다(종래기술과 동일한 구성요소에 대해서는 동일한 부호를 부여하여 설명한다). Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings (the same elements as in the prior art will be described with the same reference numerals).
LED 패키지는 도 2에 도시한 바와 같이, LED 칩(12)을 안착시키면서 열 안내 역할을 하는 열전달부재(14)를 구비한다. LED 칩(12)에는 한 쌍의 와이어(16) 및 단자(18)가 연결되고, 전원으로부터 와이어(16) 및 단자(18)를 통해 전기가 LED 칩(12)으로 공급된다. LED 칩(12) 및 열전달부재(14)의 상부에는 실리콘 등과 같은 밀봉재(20)에 의해 밀봉된다. 밀봉재(20)의 상부에는 렌즈(22)로 덮인다. 열전달부재(14) 및 단자(18)는 그 둘레에 설치되는 하우징(24)에 의하여 보호되고 지지된다.As shown in FIG. 2, the LED package includes a heat transfer member 14 serving as a heat guide while seating the LED chip 12. A pair of wires 16 and a terminal 18 are connected to the LED chip 12, and electricity is supplied from the power supply to the LED chip 12 through the wire 16 and the terminal 18. The upper part of the LED chip 12 and the heat transfer member 14 is sealed by a sealing material 20 such as silicon. The upper portion of the sealing material 20 is covered with a lens 22. The heat transfer member 14 and the terminal 18 are protected and supported by a housing 24 installed around it.
본 발명에 따른 LED 패키지용 렌즈의 특징부를 도 2를 참조하여 상세하게 설명한다.Features of the lens for LED package according to the present invention will be described in detail with reference to FIG. 2.
본 발명에 따른 LED 패키지용 렌즈는, 밀봉재(20)의 상부를 커버하여 열전달부재(14) 및 단자(18)의 상부를 보호한다. 렌즈(22)는 하우징(24)의 상부에 부착된다. The lens for LED package according to the present invention covers the upper portion of the sealing material 20 to protect the upper portion of the heat transfer member 14 and the terminal 18. The lens 22 is attached to the top of the housing 24.
도 2에 도시한 바와 같이, 렌즈(22)의 저면에는 LED 칩(12)의 상부에 위치하는 바닥 구면(50)이 형성되고, 렌즈(22)의 상부에는 돔부(52)가 형성되어 있다. 렌즈(22)의 바닥 구면(50) 및 돔부(52)의 각 표면에 무반사 코팅(54)이 형성된다. 일반적인 유리렌즈의 빛 투과율이 92%~94%인 데 비하여 무반사 코팅(Antireflection Coating:54)은 빛투과율을 98%로 향상시켜 빛 투과율을 높이게 된다. 이러한 무반사 코팅(54)은 빛의 투과에 따른 면발광 상태로 변화되도록 한다.As shown in FIG. 2, a bottom spherical surface 50 positioned above the LED chip 12 is formed on the bottom surface of the lens 22, and a dome portion 52 is formed on the upper surface of the lens 22. An antireflective coating 54 is formed on each surface of the bottom spherical surface 50 of the lens 22 and the dome portion 52. While the light transmittance of general glass lenses is 92% to 94%, antireflection coating (54) improves light transmittance to 98% to increase light transmittance. This anti-reflective coating 54 is to be changed to the surface emitting state according to the transmission of light.
또한, 렌즈(22)의 바닥 구면(50)에 형성된 무반사 코팅(54)의 표면에는 인광소재(56)가 코팅된다. 이러한 인광소재(56)는 눈부심을 방지하고, LED칩(12)의 형상이 렌즈(22)를 통해 반사됨을 차단하여 황색 띠를 없애며, 빛의 투과에 따른 면발광 상태로 변화시킨다. 이에 따라, 렌즈(22)를 통한 면광원이 만들어지면서 형광등의 면조명과 유사하게 된다. In addition, a phosphorescent material 56 is coated on the surface of the antireflective coating 54 formed on the bottom spherical surface 50 of the lens 22. The phosphor 56 prevents glare and prevents the shape of the LED chip 12 from being reflected through the lens 22 to eliminate yellow bands and change the surface light emission state according to the transmission of light. As a result, a surface light source through the lens 22 is made, which is similar to the surface light of a fluorescent lamp.
그리고, LED 칩(12)은 전기 신호의 조절로 발열 온도를 변화시켜 빛의 색 온도를 조절함으로써 LED 색상을 보다 다양하게 구현할 수 있다. In addition, the LED chip 12 may implement a variety of LED colors by controlling the color temperature of the light by changing the heating temperature by the control of the electrical signal.
인광소재(56)는 황색, 녹색, 적색, 청색, 또는 이들 색상이 혼합된 형광색 중 어느 하나의 색상을 가진다. 이에 단색의 LED 칩(12)에 대해 다양한 색상의 인광소재(56)을 렌즈(22)측에 적용함으로써 보다 다양한 LED 색상을 구현할 수 있다. The phosphor 56 has a color of yellow, green, red, blue, or a fluorescent color mixed with these colors. Accordingly, by applying phosphorescent materials 56 of various colors to the lens 22 for the single color LED chip 12, more various LED colors may be realized.
또한, 인광소재(56)는 기본적으로 광학용 실리콘과 1:1로 배합되나, 필요에 따라 적절한 비율로 배합될 수 있다. In addition, the phosphor 56 is basically 1: 1 mixed with the optical silicon, but may be blended in an appropriate ratio as necessary.
그리고, 인광소재(56)는 산화물(Oxide), 질화물(Nitride), 규산염(Silicate), 형광체, 이외 기타 화합물 등으로 이루어질 수 있다. In addition, the phosphor 56 may be formed of oxide, nitride, silicate, phosphor, other compounds, and the like.
대안적으로, 렌즈(22)의 바닥 구면(50) 측에는 인광소재(56)를 대신하여 확산제나 확산용 필름을 형성할 수 있고, 이를 통해 인광소재(56)의 기능을 구현할 수도 있다. Alternatively, a diffuser or a diffusion film may be formed on the bottom spherical surface 50 of the lens 22 in place of the phosphor 56, thereby realizing the function of the phosphor 56.
한편, 본 발명의 LED 패키지용 렌즈(22)는 도 3에 예시된 바와 같이, 인광소재(46)가 도포된 청색 LED 칩(58) 위에 조립될 수도 있다. 렌즈(22)의 바닥 구면(50)에는 황색 또는 적색 등과 같은 칼라도료가 도포될 수 있고, 이렇게 도포된 칼라도료의 표면에는 무반사코팅(54) 및 인광소재(56)가 도포될 수 있다. 이에 따라 청색 LED 칩(58)을 온(On)시키면, 렌즈(22)는 바닥 구면(50)의 인광소재(56) 및 무반사 코팅(54)을 거쳐 투과하고 돔부(52)를 통해 외부로 백색계열의 LED 빛을 발광시킨다. Meanwhile, the lens 22 for the LED package of the present invention may be assembled on the blue LED chip 58 to which the phosphor material 46 is coated, as illustrated in FIG. 3. A color paint such as yellow or red may be applied to the bottom spherical surface 50 of the lens 22, and the anti-reflective coating 54 and the phosphor 56 may be applied to the surface of the color paint thus applied. Accordingly, when the blue LED chip 58 is turned on, the lens 22 passes through the phosphor 56 and the antireflective coating 54 of the bottom spherical surface 50 and is white to the outside through the dome portion 52. It emits a series of LED light.
또한, LED 패키지용 렌즈(22)는, 도 4에 도시한 바와 같이, COB(Chip On Board) 형태의 LED 칩(12)상에 설치된다. 상기 렌즈(22)의 바닥 구면(50) 및 돔부(52)에는 무반사 코팅(54)이 형성된다. 또한, 렌즈(22)의 바닥 구면(50)에 형성된 무반사 코팅(54)의 표면에는 인광소재(56)가 코팅된다. In addition, as shown in FIG. 4, the LED package lens 22 is provided on an LED chip 12 in the form of a chip on board (COB). An antireflective coating 54 is formed on the bottom spherical surface 50 and the dome portion 52 of the lens 22. In addition, a phosphorescent material 56 is coated on the surface of the antireflective coating 54 formed on the bottom spherical surface 50 of the lens 22.
렌즈(22)의 바닥 구면(50)에는 인광소재(56)를 대신하여 확산제나 확산용 필름을 형성하여 인광소재(56)의 기능을 구현할 수도 있다. The bottom spherical surface 50 of the lens 22 may form a diffusion agent or a diffusion film in place of the phosphor material 56 to implement a function of the phosphor material 56.
또한, 렌즈(22)는, 도 5에 도시한 바와 같이, 밀봉재(20)를 덮는 제1렌즈(22a)와, 상기 제1렌즈(22) 보다 반경을 크게 하여 상기 제1렌즈(22a)의 상부에 설치되는 제2렌즈(22b)로 구성된다. In addition, as shown in FIG. 5, the lens 22 includes a first lens 22a covering the sealing material 20 and a larger radius than the first lens 22 so that the lens 22a can be formed. It consists of a second lens 22b installed on the upper portion.
또한, 제1 및 제2 렌즈(22a, 22b)의 각 바닥 구면(50) 및 돔부(52)의 표면에 무반사 코팅(54)이 형성되고, 제1 및 제2 렌즈(22a, 22b)의 각 바닥 구면(50)에 형성된 무반사 코팅(54)에는 인광소재(56)가 형성될 수 있고, 인광소재(56)를 대신하여 확산제나 확산용 필름가 형성될 수도 있다.In addition, an anti-reflective coating 54 is formed on each of the bottom spherical surfaces 50 of the first and second lenses 22a and 22b and the surface of the dome portion 52, and each of the first and second lenses 22a and 22b is formed. A phosphorescent material 56 may be formed on the antireflective coating 54 formed on the bottom spherical surface 50, and a diffusion agent or a diffusion film may be formed in place of the phosphorescent material 56.
한편, 렌즈(22)의 모양은, 원하는 광 패턴에 따라 반원 형상 또는 비구면 등 다양할 수 있으며, 마이크로 렌즈도 가능하다. 이는 고출력 발광 다이오드에서 발광 다이오드의 광 출력을 향상시키고, 배광 특성을 조절하기 위해서이다.On the other hand, the shape of the lens 22 may be various, such as semi-circular shape or aspherical surface, depending on the desired light pattern, micro lens is also possible. This is to improve the light output of the light emitting diode and to adjust the light distribution characteristics in the high output light emitting diode.
또한, 무반사 코팅(54) 및 인광소재(56)은, 크기에 관계없이 다수의 LED 칩(12)에 적용을 용이하게 할 수 있어 사용범위를 다양화할 수 있다.In addition, the anti-reflective coating 54 and phosphorescent material 56 can be easily applied to a plurality of LED chips 12 irrespective of the size can be diversified range of use.
이하, LED 패키지(10)에 부착되는 렌즈(22)에 대한 무반사 코팅(54) 및 인광소재(56)의 형성방법을 다음과 같이 설명한다. Hereinafter, a method of forming the anti-reflective coating 54 and the phosphor 56 on the lens 22 attached to the LED package 10 will be described.
먼저, 렌즈(22)의 바닥 구면(50)에 무반사 코팅(54)을 형성한다. First, an antireflective coating 54 is formed on the bottom spherical surface 50 of the lens 22.
그리고, 렌즈(22)의 바닥 구면(50)에 형성된 무반사 코팅(54) 위에 인광소재(56)를 형성한다. 인광소재(56)는 산화물(Oxide), 질화물(Nitride), 규산염(Silicate), 형광체, 그외 기타 화합물로 이루어지고, 황색, 녹색, 적색, 청색, 혼합으로 형성된 형광색 중 어느 하나의 색상을 가진다. The phosphor 56 is formed on the antireflective coating 54 formed on the bottom spherical surface 50 of the lens 22. The phosphor 56 is made of oxide, nitride, silicate, phosphor, and other compounds, and has a color of any one of yellow, green, red, blue, and fluorescent colors formed by mixing.
이어서, 렌즈(22)의 돔부(52)에 무반사 코팅(54)을 형성한다. 이러한 렌즈(22)의 돔부(52)에 대한 무반사 코팅(54)을 통해 빛의 투과율을 대폭 향상시킬 수 있다. Subsequently, an antireflective coating 54 is formed on the dome 52 of the lens 22. Through the anti-reflective coating 54 on the dome portion 52 of the lens 22 can greatly improve the transmittance of light.
상기한 바와 같이, LED 패키지용 렌즈(22)는, 무반사 코팅(54) 및 인광소재(56)의 도포를 통해 제조가 완료된다. As described above, the lens 22 for the LED package is completed through the application of the anti-reflective coating 54 and the phosphorescent material 56.
이와 같은 본 발명의 렌즈(22)는 무반사코팅(54) 및 인광소재(56)이 적용됨에 따라, 눈부심이 방지되고 LED칩(12)의 형상이 렌즈(22)를 통해 반사되어 나타나는 황색 띠가 제거되어 빛의 투과에 따른 면발광 상태로 변화시킨다. 이에 따라, 렌즈(22)를 통한 면광원이 만들어지면서 형광등의 면조명과 유사하게 된다.As the lens 22 of the present invention is applied with the anti-reflective coating 54 and the phosphorescent material 56, glare is prevented, and the yellow band appears when the shape of the LED chip 12 is reflected through the lens 22. It is removed to change the surface emitting state according to the transmission of light. As a result, a surface light source through the lens 22 is made, which is similar to that of a fluorescent lamp.
또한, 본 발명의 렌즈(22)에 인광소재(56)를 도포하는 방법을 사용함에 따라 종래의 인광소재(56)를 청색 LED 칩(58)에 도포시키는 방법을 회피할 수 있다. In addition, the method of applying the phosphorescent material 56 to the lens 22 of the present invention can avoid the conventional method of applying the phosphorescent material 56 to the blue LED chip 58.
그리고, 본 발명은 렌즈(22)의 바닥 구면(50)에 실리콘과 적절히 배합한 인광소재(56)를 도포하여 원하는 색상을 보다 선명하게 구현할 수 있다.In addition, the present invention may be applied to the bottom spherical surface 50 of the lens 22 by applying a phosphorescent material 56 appropriately blended with silicon to implement a desired color more clearly.
본 발명의 렌즈(22)는 LED 패키지에 부착된 일체형의 소형 렌즈에도 용이하게 적용할 수 있다. The lens 22 of the present invention can be easily applied to the integrated compact lens attached to the LED package.
또한, 본 발명의 렌즈(22)는 제1 및 2렌즈(22a, 22b) 등과 같이 복수개로 구성될 수 있고, 그 각각에 무반사 코팅(54), 인광소재(56) 및 확산제나 확산용 필름을 형성시켜 사용할 수 있다.In addition, the lens 22 of the present invention may be composed of a plurality of lenses, such as the first and second lenses 22a and 22b, and the anti-reflective coating 54, phosphorescent material 56, and a diffusing agent or diffusing film may be formed on each of them. It can form and use.

Claims (4)

  1. LED 칩(12)을 안착시키면서 열안내 역할을 하는 열전달부재(14)와, 상기 LED 칩(12)은 외부 전원을 통해 전기를 공급받도록 형성되는 각각 한 쌍의 와이어(16) 및 단자(18)와, 상기 LED 칩(12) 및 열전달부재(14)의 상부를 밀봉하는 밀봉재(20)와, 상기 밀봉재(20)의 상부를 덮는 렌즈(22)와, 상기 열전달부재(14) 및 단자(18)를 지지하는 하우징(24)을 포함하는 LED 패키지에 있어서, A heat transfer member 14 serving as a heat guide while seating the LED chip 12, and the LED chip 12 is a pair of wires 16 and terminals 18, each formed to receive electricity through an external power source. And a sealing material 20 for sealing an upper portion of the LED chip 12 and the heat transfer member 14, a lens 22 covering an upper portion of the sealing material 20, the heat transfer member 14 and a terminal 18. In the LED package comprising a housing 24 for supporting)
    상기 렌즈(22)의 저면에는 바닥 구면(50)이 형성되고, 상기 렌즈(22)의 상면에는 돔부(52)가 형성되며, A bottom spherical surface 50 is formed on a bottom surface of the lens 22, and a dome portion 52 is formed on an upper surface of the lens 22.
    상기 렌즈(22)의 바닥 구면(50)에는 무반사 코팅(54)이 형성되고, 상기 무반사 코팅(54)의 표면에는 인광소재(56), 확산제 및 확산용 필름 중에서 어느 하나가 형성되는 것을 특징으로 하는 LED 패키지용 렌즈. An antireflective coating 54 is formed on the bottom spherical surface 50 of the lens 22, and the surface of the antireflective coating 54 is formed of any one of a phosphorescent material 56, a diffusing agent and a film for diffusion. Lens for LED package.
  2. 제1항에 있어서,The method of claim 1,
    상기 렌즈(22)는 청색 LED 칩(58) 상에 부착시킬 때 백색 계열의 빛이 발광되도록 바닥 구면(50)에 황색 또는 적색을 도포시키고, 그 위에 인광소재(56)를 도포하는 것을 특징으로 하는 LED 패키지용 렌즈. When the lens 22 is attached on the blue LED chip 58, a yellow or red color is applied to the bottom spherical surface 50 so that white light is emitted, and the phosphor material 56 is coated thereon. Lens for LED package to say.
  3. 제 1 항에 있어서,      The method of claim 1,
    상기 렌즈(22)는, 돔부(52)의 표면에 무반사 코팅(54)이 형성되는 것을 특징으로 하는 LED 패키지용 렌즈. The lens 22, the LED package lens, characterized in that the anti-reflective coating (54) is formed on the surface of the dome (52).
  4. 제 1 항에 있어서,The method of claim 1,
    상기한 렌즈(22)는, 밀봉재(20)를 덮는 제1렌즈(22a)와, 상기 제1렌즈(22a)보다 반경을 더 크게 형성하여 상기 제1렌즈(22b)의 상부에 설치되는 제2렌즈(22b)를 포함하는 것을 특징으로 하는 LED 패키지용 렌즈.The lens 22 includes a first lens 22a covering the sealing material 20 and a second lens formed on the upper portion of the first lens 22b to have a radius larger than that of the first lens 22a. Lens for LED package comprising a lens (22b).
PCT/KR2010/005399 2009-09-02 2010-08-16 Lens for an led package WO2011027981A2 (en)

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