WO2011021353A1 - Filter apparatus and manufacturing method thereof - Google Patents

Filter apparatus and manufacturing method thereof Download PDF

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Publication number
WO2011021353A1
WO2011021353A1 PCT/JP2010/004830 JP2010004830W WO2011021353A1 WO 2011021353 A1 WO2011021353 A1 WO 2011021353A1 JP 2010004830 W JP2010004830 W JP 2010004830W WO 2011021353 A1 WO2011021353 A1 WO 2011021353A1
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WO
WIPO (PCT)
Prior art keywords
filter device
pipe
solder
lid
frame
Prior art date
Application number
PCT/JP2010/004830
Other languages
French (fr)
Japanese (ja)
Inventor
恭輝 浅川
俊昭 中村
英樹 難波
貴司 山田
辰夫 高橋
元祥 北川
Original Assignee
パナソニック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2009191560A external-priority patent/JP2011044900A/en
Priority claimed from JP2009203251A external-priority patent/JP2011055318A/en
Priority claimed from JP2009203250A external-priority patent/JP2011055317A/en
Priority claimed from JP2009249774A external-priority patent/JP2011097391A/en
Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Publication of WO2011021353A1 publication Critical patent/WO2011021353A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/007—Manufacturing frequency-selective devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/205—Comb or interdigital filters; Cascaded coaxial cavities
    • H01P1/2056—Comb filters or interdigital filters with metallised resonator holes in a dielectric block

Definitions

  • the present invention relates to a filter device used in a base station for communication and the like and a manufacturing method thereof.
  • FIG. 9 is a sectional view of a conventional filter device.
  • FIG. 10 is a cross-sectional view of a filter device in a conventional assembly process.
  • the filter device 1 includes an antenna terminal 60 and a metal housing 2 to which the antenna terminal 60 is attached.
  • the housing 2 includes a frame body 3, a partition 4, a lid 5, and a resonance element 6.
  • the frame 3 forming the outer shape of the housing 2 is made of metal and has an opening 3a on one side.
  • a metal lid 5 is attached to the opening 3a of the frame 3, and the opening 3a is closed.
  • a metal partition 4 is joined to the frame 3, and the inside of the frame 3 is partitioned into a plurality of hollow portions 7.
  • the resonance element 6 is disposed in each of the hollow portions 7 formed in this way, and is joined to the inner surface of the frame 3 by solder 8.
  • the resonant element 6 has a cylindrical shape, and is formed by punching a so-called surface-treated steel plate and then performing a curling process.
  • the surface-treated steel sheet a cold-rolled steel sheet having both surfaces subjected to copper plating is used.
  • the resonance element 6 is obtained by punching and curling a surface-treated steel plate that has been previously plated with copper. Therefore, the resonance element 6 is provided with the dividing portion 6b.
  • the assembly process is a process of assembling these after the process of preparing the resonant element 6, the frame body 3, the partition 4, and the lid 5.
  • the partition 4 and the resonance element 6 are arranged in the frame 3, the cream solder 8 is applied to the predetermined position by a dispenser 9 or the like, and the lid 5 is attached.
  • the cream solder is obtained by adding a flux to solder powder to form a cream.
  • the cream solder 8 is applied to the joint between the partition 4 and the frame 3 and the end of the frame 3 on the opening 3a side.
  • the resonant element 6 in the conventional filter device 1 since the resonant element 6 in the conventional filter device 1 is formed by curling, it has a dividing portion 6b on the side surface. Since the dividing portion 6b has a high potential, the resistance value of the dividing portion 6b greatly affects the Q value of the filter. Therefore, it is necessary that the dividing portion 6 b is also filled with the solder 8. Furthermore, since the potential of the upper end surface 6a of the resonance element 6 is also increased, the resistance value at the upper end surface 6a also greatly affects the Q value of the filter. Therefore, it is necessary to cover the upper end surface 6 a of the resonance element 6 with the solder 8. In the assembling process, the cream solder 8 is applied to the upper end surface 6 a of the resonance element 6, the dividing portion 6 b, and the entire outer peripheral surface on the lower end side of the resonance element 6.
  • the cream solder 8 is melted by heating, and the lower end of the partition 4 and the frame 3, the lower end of the resonance element 6 and the frame 3, the upper end of the partition 4 and the lid 5, and the frame. 3 ends of the opening 3a and the lid 5 are joined simultaneously.
  • the casing 2 is heated in the direction in which the lid 5 is on the upper side so that the cream solder 8 applied to the lower end portion and the dividing portion 6b of the resonance element 6 does not concentrate on the upper end surface 6a.
  • Patent Document 1 is known.
  • the cream solder 8 is applied to the entire circumference of the upper end surface 6 a of the resonance element 6, the upper end to the lower end of the dividing portion 6 b, and the entire outer peripheral surface on the lower end side of the resonance element 6. As a result, extra solder 8 is generated.
  • the viscosity of the excess solder 8 is lowered by heating in the heating process, the excess solder 8 flows downward along the dividing portion 6b, and the solder 8 accumulates around the lower end of the dividing portion 6b.
  • the shape of the corner at which the resonant element 6 and the frame 3 intersect greatly affects the Q value of the filter device 1. Therefore, when such a pool of solder 8 or the like occurs, the shape of the intersecting corner between the resonance element 6 and the frame 3 is not stable, and the Q value of the filter device 1 is not stable. As a result, variations occur in the value of the signal passing loss of the filter device 1.
  • the filter device of the present invention includes an antenna terminal, a hollow casing to which the antenna terminal is connected, and a resonance element provided in the casing.
  • the housing includes a metal frame having an opening and a metal lid attached to the opening of the frame. The vicinity of the end on the opening side of the housing and the lid are connected by solder.
  • the resonant element includes a metal pipe, a rough surface portion provided on a lower surface of the pipe, and a plating layer formed on the entire surface of the pipe including the rough surface portion, and at least the rough surface portion includes a plating layer and a housing. Are joined by solder.
  • the solder to be applied may be an amount of solder sufficient to join the rough surface portion of the resonant element and the housing.
  • the rough surface portion is formed at the lower end of the resonant element, the familiarity of the solder is good. Since the resonant element and the housing are reliably joined by a small amount of solder, variation in the amount of solder can be reduced. Therefore, it is difficult for solder to collect or drop around the resonant element, and the shape of the joint between the resonant element and the casing is stabilized. Thereby, since the dispersion
  • FIG. 1 is a cross-sectional view of a filter device according to Embodiment 1 of the present invention.
  • FIG. 2 is a cross-sectional view from above of the filter device according to Embodiment 1 of the present invention.
  • FIG. 3 is a process diagram illustrating the method for manufacturing the filter device according to the first embodiment of the present invention.
  • FIG. 4 is a cross-sectional view of the filter device in the assembly process according to Embodiment 1 of the present invention.
  • FIG. 5A is a top view of relevant parts of the resonant element according to Embodiment 1 of the present invention.
  • FIG. 5B is an essential part enlarged cross-sectional view of the resonance element according to Embodiment 1 of the present invention.
  • FIG. 6A is a cross-sectional view of the filter device according to Embodiment 2 of the present invention.
  • FIG. 6B is a cross-sectional view from above of the filter device according to Embodiment 2 of the present invention.
  • FIG. 7 is an enlarged cross-sectional view of a main part of the filter device according to Embodiment 2 of the present invention.
  • FIG. 8A is an enlarged cross-sectional view of a main part of a filter device in another example of Embodiment 2 of the present invention.
  • FIG. 8B is an enlarged cross-sectional view of a main part of a filter device in still another example of Embodiment 2 of the present invention.
  • FIG. 9 is a cross-sectional view of a conventional filter device.
  • FIG. 10 is a cross-sectional view of a filter device in a conventional assembly process.
  • FIG. 1 is a cross-sectional view of a filter device according to Embodiment 1 of the present invention.
  • FIG. 2 is a cross-sectional view from above of the filter device according to Embodiment 1 of the present invention.
  • the filter device 21 is an air cavity type filter device.
  • the filter device 21 includes a metal casing 22, a resonance element 23 installed in the metal casing 22, and an antenna terminal 22 a (used as a connector) connected to the casing 22. .
  • the housing 22 includes a frame body 24, a lid 25, and a partition 27, all of which are made of metal.
  • a surface-treated steel sheet having a copper plated layer on both sides is used.
  • the frame body 24 includes a bottom portion 24c that forms the bottom surface of the frame body 24, and a side surface 24b that stands on the end of the bottom portion 24c.
  • the side surface 24b is formed by being integrally bent from the bottom 24c.
  • the lid 25 is mounted so as to close an opening 24 a provided above the frame body 24, and is joined to the frame body 24 by solder 28 at the end of the opening 24 a of the frame body 24.
  • the partition 27 is disposed so as to partition the inside of the housing 22 into a plurality of hollow portions 26 (also referred to as cavities), and is joined to the lid 25 by solder 28 at the upper end and joined to the frame body 24 by solder 28 at the lower end. Note that the part where the partition 27 intersects the side surface 24 b is also joined by the solder 28.
  • the partition 27 has a cross shape, and four hollow portions 26 are formed in the housing 22. And the hollow part 26 electromagnetically couples by the coupling window 29 which connects adjacent hollow parts 26, and a four-stage filter will be formed.
  • FIG. 3 is a process diagram illustrating the method for manufacturing the filter device according to the first embodiment of the present invention.
  • FIG. 4 is a cross-sectional view of the filter device in the assembly process according to Embodiment 1 of the present invention. 3 and 4, the same reference numerals are used for the same components as those in FIGS. 1 and 2, and descriptions thereof are omitted.
  • the frame body 24 and the lid 25 are each produced by pressing.
  • the assembly step 42 the housing 22 is assembled after the processing step 41 as shown in FIG.
  • the partition 27 is attached to the frame body 24 and the resonance element 23 is fixed to the frame body 24.
  • the resonance element 23 is fixed to the frame body 24 in a direction in which the rough surface portion 31 b faces the frame body 24.
  • the assembly process 42 in the present embodiment includes a fixing process 43 and a mounting process 44.
  • the fixing process 43 the resonance element 23 is fixed to the frame body 24 by spot welding.
  • the mounting step 44 the partition 27 is mounted in the frame body 24. In the assembly process 42, either the fixing process 43 or the mounting process 44 may be performed first.
  • the cream solder 28 is applied to the joint portion between the frame body 24 and the lid 25 and the joint portion between the resonance element 23 and the frame body 24 by the dispenser 30.
  • the lid mounting step 46 the lid 25 is mounted on the opening 24 a of the frame 24 after the solder application step 45.
  • the brazing step 47 after the lid mounting step 46, the casing 22 to which the lid 25 is mounted is heated, so that the frame body 24 and the lid 25, the partition 27 and the frame body 24, the partition 27 and the lid 25, and the resonance. A joint portion between the element 23 and the housing 22 is joined by the solder 28.
  • the resonance element 23 is bonded to the frame body 24, but it may be bonded to the lid 25.
  • the solder 28 is applied to the joint where the resonance element 23 and the lid 25 intersect.
  • the resonance element 23 is fixed to the lid 25 in a direction in which the rough surface portion 31 b faces the lid 25.
  • the cream solder 28 is applied after the resonant element 23 is mounted and fixed, the cream solder 28 may be applied to a predetermined position and then the resonant element 23 may be mounted.
  • the lid 25 is plate-like, so that the solder 28 can be supplied using a metal mask or the like.
  • the joint portion between the lid 25 and the frame body 24, the joint portion between the lid 25 and the partition 27, and the joint portion between the resonance element 23 and the lid 25 are collectively screen-printed in advance using a metal mask or the like. Also good.
  • the solder 28 is applied to the lower end portion of the resonance element 23 (near the position where the inner peripheral surface of the resonance element 23 and the frame body 24 intersect). Furthermore, in this Embodiment, it apply
  • the solder 28 is applied to two positions at the lower end of the resonance element 23 at positions that divide the circumference of the resonance element 23 almost equally into two, so that the solder 28 is applied to the entire circumference of the resonance element 23. Becomes easier to flow. Therefore, since it is difficult for the solder 28 to be lost at the joint between the resonant element 23 and the housing 22, the Q value of the filter device 21 can be increased and the variation can be reduced.
  • the solder 28 is applied to two places, but the number is not limited to two, and the solder 28 may be applied at intervals that divide the circumference of the resonance element 23 at substantially equal intervals.
  • the resonance element 23 is hollow, and the solder 28 is applied in the vicinity of the position where the inner periphery of the resonance element 23 and the casing 22 intersect in order to join the resonance element 23 and the casing 22.
  • the solder 28 flows between the lower end surface 31b of the resonance element 23 and the housing 22 by a capillary phenomenon. This makes it difficult for the solder 28 to flow out of the resonant element. It is difficult for the solder 28 to accumulate or be missing around the resonant element, and the shape of the joint between the resonant element and the housing is stabilized. As a result, since the variation in the Q value of the filter device can be reduced, it is possible to realize a filter device in which the variation in signal passing loss is small.
  • FIG. 5A is a top view of the main part of the resonant element according to Embodiment 1 of the present invention.
  • FIG. 5B is an essential part enlarged cross-sectional view of the resonance element according to Embodiment 1 of the present invention.
  • the resonant element 23 will be described with reference to FIGS. 5A and 5B.
  • the resonant element 23 has a hollow cylindrical shape, and a pipe 31 is formed by curling a flat plate obtained by press-cutting a cold rolled steel plate (iron plate) into a predetermined shape, and a copper plating layer is formed on the entire surface of the pipe. Is. Since iron is curled in this way, a very inexpensive resonant element 23 can be obtained. Since the pipe 31 is processed by pressing, the cut surface is rough, and a rough surface portion 31a and a rough surface portion 31b are formed on the upper surface and the lower surface, respectively.
  • the entire surface of the pipe 31 including the rough surface portion 31a and the rough surface portion 31b is plated by bulk plating or the like.
  • the plating layer can be formed by a method such as bulk plating, a very inexpensive resonant element 23 can be realized.
  • the copper plating layer is formed on the surface of the pipe, the conductor resistance is very small. Therefore, the Q value is high and the signal passing loss can be reduced.
  • copper is used for the plating layer, but a metal such as silver may be used.
  • the resonance element 23 formed in this way is mounted so that the rough surface portion 31b side on the lower surface side faces the housing 22, and the rough surface portion 31b and the inner surface of the housing 22 are joined together by the solder 28.
  • the resonance element 23 is bonded to the inner surface of the frame body 24, but may be bonded to the lid 25.
  • the distance between the solder 28 applied to both sides of the dividing portion 31c and the dividing portion 31c is preferably set to be substantially the same distance. This makes it difficult for the solder 28 to be lost around the entire circumference of the resonant element 23. As a result, the Q value of the filter device 21 can be increased and variations can be reduced.
  • the entire resonance element 23 is copper-plated, it is not necessary to apply solder to the upper surface of the resonance element 23 as in the prior art. Further, since the lower surface of the resonance element 23 is also plated with copper and is rough, the solder 28 is well-fitted. For this reason, the amount of solder 28 is sufficient to join between the rough surface portion 31b and the inner surface of the frame body 24 (or the lid 25), so that the resonance element 23 and the housing 22 are reliably joined with a small amount of solder. it can. Accordingly, the variation in the amount of the solder 28 is reduced, and it is difficult for the solder 28 to be accumulated or missing around the resonance element 23. Thereby, it is possible to reduce the variation in the Q value and to realize the filter device 21 with a small variation in the signal passing loss.
  • the pipe 31 Since the pipe 31 is formed by curling, a continuous part 31c is formed from the upper end to the lower end of the pipe 31. As shown in FIG. 5A, the width 31d of the dividing portion 31c is narrowed from the inner surface of the pipe 31 toward the outer surface. As a result, the interval between the divided portions 31c becomes very small on the outer peripheral surface of the pipe 31, so that the copper plating is buried in the divided portions 31c, and the divided portions 31c are connected by copper plating. In the present embodiment, since the width of the dividing portion 31c on the surface side of the pipe 31 is 0.05 mm, the dividing portion 31c can be easily connected by copper plating using an inexpensive bulk plating method.
  • the burrs are bent in the direction to the outside of the pipe 31.
  • the width 31 d of the dividing portion 31 c can be narrower on the outer peripheral surface side than the inner periphery of the pipe 31. Therefore, the dividing part 31c can be more reliably filled and connected with copper plating.
  • the filter device 21 Since the dividing portion 31c is thus connected by plating, it is not necessary to apply the solder 28 to the dividing portion 31c. Therefore, the accumulation of the solder 28 around the resonance element 23 is less likely to occur. Thereby, it is possible to realize the filter device 21 in which the variation in the Q value is further small and the variation in the signal passage loss is small.
  • the resonance element 23 is fixed to the frame body 24 by spot welding. Therefore, in the step of applying the cream solder 28, the resonant element 23 is fixed in advance, so that the solder 28 can be applied by bringing the tip of the dispenser close to the joint between the resonant element 23 and the frame body 24. Thereby, it is possible to prevent unnecessary solder 28 from being applied to the periphery. Therefore, the variation in the shape of the solder 28 at the joint between the resonant element 23 and the frame 24 is further reduced. As a result, the variation in the Q value is reduced, and the filter device 21 having a small variation in the signal passing loss can be obtained.
  • the resonant element 23 is spot-welded in advance, even if the tip of the dispenser contacts the resonant element 23, the mounting position of the resonant element 23 does not shift. Therefore, the accuracy of the fixed position of the resonant element 23 can be increased, and the filter device 21 with a small variation in signal passing loss can be obtained.
  • a protrusion 32 protruding toward the resonance element 23 (inward) is formed at a position where the resonance element 23 is mounted on the frame 24.
  • the resonance element 23 is mounted so that the rough surface portion 31b contacts the protrusion 32, and a voltage is applied by bringing a spot welding electrode into contact with the upper surface of the resonance element 23 and the lower surface of the frame body 24.
  • a current flows through the contact portion between the resonant element 23 and the protrusion 32, and the contact portion is welded. Since only the contact portions need only be welded in this way, the range of metal oxidation generated by spot welding can be reduced. Accordingly, it is possible to prevent deterioration of the adhesive strength of the solder 28.
  • the accuracy of the fixed position of the resonance element 23 can be increased, and the filter device 21 with less variation in signal passing loss can be obtained.
  • FIG. 6A is a cross-sectional view of the filter device according to Embodiment 1 of the present invention.
  • FIG. 6B is a cross-sectional view from above of the filter device according to Embodiment 1 of the present invention.
  • FIG. 7 is an essential part enlarged cross-sectional view of the filter device according to Embodiment 1 of the present invention.
  • the filter device 11 includes an antenna terminal 12, a metal housing 13 to which the antenna terminal 12 is fixed, a resonance element 14 provided in the housing 13, and the housing 13. It is comprised by the output terminal 10 fixed to.
  • the antenna terminal 12 is connected to an antenna (not shown), and a reception signal received by the antenna is input.
  • the antenna terminal 12 is fixed to one side surface of the housing 13 with a screw or the like.
  • the housing 13 includes a frame 13b, a metal partition 13c, and a lid 15.
  • the frame body 13 b is made of metal and constitutes the outside of the housing 13.
  • the frame body 13b is composed of a top plate and side plates erected around the top plate, and has an opening 13a on one surface (the lower surface side in the figure).
  • the partition 13 c is arranged so as to divide the inside of the frame 13 b into a plurality of hollow portions 18.
  • the partition 13c is arranged in the frame 13b so as to divide the frame 13b into four hollow portions 18, and is combined so that the two partitions 13c intersect the central portion of the frame 13b. Yes.
  • a copper-plated steel plate is used for both the frame body 13b and the partition 13c.
  • the conductor part 15a is provided on the resin base material, and the lid
  • the lid 15 is mounted so that the conductor portion 15a closes the opening portion 13a.
  • the casing 13 forms a hollow rectangular parallelepiped shape by connecting the end of the frame 13b on the opening 13a side and the conductor 15a with the solder 16. At this time, it is important that at least the inner wall surface at the end of the opening 13a of the frame 13b and the conductor 15a are connected by the solder 16. This is because the passage loss of the filter device 11 increases when a missing portion of the solder 16 occurs at the end of the opening 13a.
  • the conductor portion 15a is made larger than the opening portion 13a, and the opening portion 13a is completely covered with the conductor portion 15a, so that the solder 16 can be reliably attached to the conductor portion 15a at the end portion of the opening portion 13a. I have to.
  • a single-sided copper-clad printed circuit board is used for the lid 15, a low-cost filter device 11 can be realized.
  • the upper end portion of the partition 13 c is connected to the frame body 13 b by the solder 16, and the lower end portion of the partition 13 c is connected to the conductor portion 15 a by the solder 16. Furthermore, in the location where the partitions 13c intersect at the center of the frame 13b, the partitions 13c are connected to each other by the solder 16. Further, at a location where the partition 13c and the side plate intersect in a T shape, the housing 13 is manufactured by connecting the partition 13c and the side plate with the solder 16.
  • a cylindrical metal resonant element 14 is disposed in each of the four hollow portions 18 of the housing 13 manufactured in this way.
  • the resonant element 14 is a pipe made of a solderable material. In the present embodiment, a copper pipe cut is used. This is because it is possible to reduce the weight by forming the resonance element 14 from resin and performing metal plating, but the metal film on the resin is weak against heat, and is likely to cause blistering and peeling, and in terms of reliability. This is because it is difficult to maintain a stable surface over a long period of time. In particular, since the potential concentrates on the surface of the resonance element 14 (particularly the upper end portion), if the plating or the like is peeled off at this portion, the signal passing loss becomes very large.
  • the filter device 11 having a stable surface state and high reliability.
  • the resonant element 14 in the present embodiment the resonant element in the first embodiment may be used. In this case, the same effect can be obtained.
  • the resonance element 14 is connected to the conductor portion 15 a of the lid 15 by solder 16.
  • the lid 15 is provided with a protrusion 17 protruding toward the inside of the housing 3 (upward in FIGS. 6A and 7).
  • the protrusion 17 is positioned on the inner peripheral surface side of the resonance element 14, and the outer periphery of the protrusion 17 has a shape along the inner periphery of the resonance element 14.
  • the filter device 11 with a small variation in pass frequency can be realized.
  • the recessed part 17a is formed in the outer peripheral part of the protrusion 17 in this Embodiment.
  • a gap is formed with respect to the inner periphery of the resonance element 14, and cream solder 16 is applied to the recess 17a in order to connect the resonance element 14 and the conductor portion 15a with the solder 16.
  • the resonance element 14 is connected to the conductor portion 15a of the lid 15 by the solder 16, but this may be connected to the frame 13b or the partition 13c.
  • the protrusion 17 is formed in the frame 13b and the partition 13c in the position where the resonant element 14 is mounted.
  • the resonant element 14 can be positioned with high accuracy by the protrusion 17, it is possible to reduce the variation in the passing frequency. Further, since it is not necessary to provide a conventional hole for positioning, it is possible to prevent the solder 16 from being lost on the outer peripheral surface of the resonance element 14. Furthermore, since a uniform fillet of the solder 16 can be formed at a location where the outer periphery of the resonance element 14 and the conductor portion 15a intersect, the filter device 11 with a small signal transmission loss can be realized.
  • the lid 15 is a printed circuit board, and the fracture surface of the resin base material is exposed on the side surface of the projection 17, and no conductor is formed on the side surface of the projection 17. Therefore, the flow of the solder 16 is blocked by the side surface of the protrusion 17, so that the solder 16 can hardly spread to the inner peripheral side of the resonance element 14. Thereby, a more uniform fillet shape of the solder 16 can be realized at a location where the outer periphery of the resonance element 14 and the conductor portion 15a intersect.
  • FIG. 8A is an enlarged cross-sectional view of a main part of a filter device according to another example of Embodiment 2 of the present invention.
  • FIG. 8B is an enlarged cross-sectional view of a main part of a filter device in still another example of Embodiment 2 of the present invention.
  • FIGS. 8A and 8B the same components as those in FIGS. 6 to 7 are denoted by the same reference numerals and description thereof is omitted.
  • 8A is different from FIG. 7 in that the protrusion 17c has a circular ring shape. That is, in FIG. 8A, the shape which has the dent in the center part of the protrusion 17 is shown.
  • the protrusion 17c may be a C-shape that connects the conductor portion 15a and the recessed portion. And when it is C-shaped, the cream solder 16 is apply
  • the protrusions 17b are a plurality of protrusions 17b provided discretely at positions corresponding to the inner peripheral surface of the resonance element 14.
  • the protrusion is formed on the lid 15, but it may be formed on the frame 13b or the partition 13c.
  • the protrusion 17c and the protrusion 17b are formed integrally with the lid 15, this may be prepared by fixing the protrusion 17c and the protrusion 17b separately to the lid 15.
  • the protrusion 17c and the protrusion 17b may be formed by solder or the like. That is, the protrusion may be planted on the lid 15.
  • the opening 13a of the frame body 13b is closed by the conductor portion 15a formed on the resin base material, whereby the conductor portion 15a and the frame body 13b serve as the inner wall of the hollow portion, and the filter device 11 Composed. Furthermore, since the lid 15 is connected to the frame body 13b by the solder 16, a thick portion for fastening screws or the like to the frame body 13b is unnecessary, and the frame body 13b can be formed of a thin steel plate or the like. it can. Therefore, the filter device 11 can be further reduced in weight.
  • At least the frame 13b is made of a metal material in order to prevent the filter device 11 from being destroyed by energy such as lightning (or induced lightning) flying to the antenna.
  • lightning flows from the metal ground terminal (not shown) fixed to the frame 13b to the ground via the frame 13b. That is, by using the frame 13b to which the antenna terminal 12 is fixed as a metal and grounding the frame 13b to the ground, lightning energy can be reliably dropped to the ground.
  • a metal having good conductivity such as copper can be used for the frame 13b.
  • the material is expensive, so the filter device 11 is expensive. Therefore, in the present embodiment, a surface-treated steel plate in which metal plating with good conductivity is applied to the front and back surfaces of the steel plate in advance is used, and the frame body 13b is formed by pressing this.
  • the frame 13b is plate-shaped and is formed of a steel plate that has been subjected to surface treatment in advance, the light and low-cost filter device 11 can be realized.
  • the surface-treated steel sheet with copper plating on both surfaces of the cold-rolled steel sheet is used, so that the resistance value is small and lightning can easily escape to the ground, and the loss of the received signal can be reduced.
  • the side plate in the present embodiment is formed integrally with the top plate by being bent in four directions from the periphery of the top plate. Therefore, it is not necessary to separately join the top plate and the side plate with the solder 16 or the like, and the low-cost filter device 11 can be realized. Furthermore, since the joining by the solder 16 is unnecessary, weight reduction is also realizable.
  • the partition 13c may be formed by resin molding and subjected to conductor plating. In this case, since the resin is not exposed in the coupling window 29, the signal passing loss can be greatly reduced. Further, since the conductor is formed on the entire surface of the partition 13c, the soldering characteristics between the frame 13b and the conductor portion 15a of the lid 15 are good. Moreover, when resin is used as the base material of the partition 13c, the filter device becomes light. Or what formed the lid
  • a double-sided board or a multilayer board may be used for the lid 15.
  • the filter device 11 by using the lower surface of the lid 15 as a ground, it is possible to realize the filter device 11 that is unlikely to leak a high-frequency signal.
  • the filter device 11 can be shielded more reliably.
  • the filter device and the manufacturing method thereof according to the present invention have an effect that the variation in signal passing loss is small, and are useful as a filter device used in a base station of a mobile phone or the like.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)

Abstract

A filter apparatus has: a housing provided with a metal frame body that has an opening section, a hollow section, a resonating element, and a metal cover to be mounted onto the opening section of the frame body; and an antenna terminal connected to the housing. The vicinity of the end section at the opening-section side of the housing and the cover are connected by soldering, and the resonating element has a metal pipe, a rough-surface section provided at least at the end section of the pipe, and a plating layer of copper or silver formed on the whole surface of the pipe, including the rough-surface section. The plating layer and the inner face of the housing are joined together by soldering, at least at the rough-surface section of the pipe. Since the resonating element can be joined together with a small amount of solder, solder will not tend to accumulate at the joining section, making the shape thereof stable, and enabling unevenness in the Q value to be made small.

Description

フィルタ装置とその製造方法Filter device and manufacturing method thereof
　本発明は、通信用などの基地局に用いられるフィルタ装置とその製造方法に関するものである。 The present invention relates to a filter device used in a base station for communication and the like and a manufacturing method thereof.
　以下、従来のフィルタ装置１について図面を用いて説明する。 Hereinafter, the conventional filter device 1 will be described with reference to the drawings.
　図９は従来のフィルタ装置の断面図である。図１０は、従来の組み立て工程におけるフィルタ装置の断面図である。図９において、フィルタ装置１は、アンテナ端子６０と、アンテナ端子６０が取り付けられる金属製の筐体２により構成される。ここで、筐体２は、枠体３と、仕切り４と、蓋５と、共振素子６によって構成されている。 FIG. 9 is a sectional view of a conventional filter device. FIG. 10 is a cross-sectional view of a filter device in a conventional assembly process. In FIG. 9, the filter device 1 includes an antenna terminal 60 and a metal housing 2 to which the antenna terminal 60 is attached. Here, the housing 2 includes a frame body 3, a partition 4, a lid 5, and a resonance element 6.
　筐体２の外形を形成する枠体３は金属製であり、一方に開口部３ａを有している。枠体３の開口部３ａには金属製の蓋５が装着され、開口部３ａが塞がれる。枠体３には、金属製の仕切り４が接合され、枠体３内が複数の中空部７へと仕切られる。 The frame 3 forming the outer shape of the housing 2 is made of metal and has an opening 3a on one side. A metal lid 5 is attached to the opening 3a of the frame 3, and the opening 3a is closed. A metal partition 4 is joined to the frame 3, and the inside of the frame 3 is partitioned into a plurality of hollow portions 7.
　共振素子６は、このようにして形成された中空部７のそれぞれに配置され、枠体３の内面へはんだ８によって接合されている。共振素子６は円筒状であり、いわゆる表面処理鋼板を打ち抜きし、その後にカーリング加工を行うことによって成形される。ここで表面処理鋼板には、冷間圧延鋼板の両面に銅めっき処理が施されたものを用いている。 The resonance element 6 is disposed in each of the hollow portions 7 formed in this way, and is joined to the inner surface of the frame 3 by solder 8. The resonant element 6 has a cylindrical shape, and is formed by punching a so-called surface-treated steel plate and then performing a curling process. Here, as the surface-treated steel sheet, a cold-rolled steel sheet having both surfaces subjected to copper plating is used.
　次に従来のフィルタ装置１の製造方法について説明する。共振素子６を準備する工程では、あらかじめ銅めっきが施された表面処理鋼板を打ち抜き、カーリングすることで、共振素子６を得る。したがって、共振素子６には分断部６ｂが設けられる。 Next, a method for manufacturing the conventional filter device 1 will be described. In the step of preparing the resonance element 6, the resonance element 6 is obtained by punching and curling a surface-treated steel plate that has been previously plated with copper. Therefore, the resonance element 6 is provided with the dividing portion 6b.
　一方、枠体３や仕切り４や蓋５はそれぞれを準備する工程で、あらかじめ銅めっきが施された表面処理鋼板を打ち抜き（枠体３については打ち抜いた後に折り曲げることにより）、枠体３や仕切り４や蓋５を得る。 On the other hand, in the step of preparing each of the frame body 3, the partition 4, and the lid 5, a surface-treated steel plate that has been subjected to copper plating in advance is punched (by bending the frame body 3 after being punched), the frame body 3 and the partition 4 and 5 are obtained.
　図１０において、組み立て工程は、共振素子６や枠体３、仕切り４、蓋５を準備する工程の後で、これらを組み立てる工程である。この組み立て工程では、枠体３の中に仕切り４や共振素子６を配置し、所定の位置にディスペンサ９などによってクリームはんだ８を塗布し、蓋５を装着する。ここで、クリームはんだとは、はんだの粉末にフラックスを加えて、クリーム状にしたものである。このとき仕切り４と枠体３との接合部と、枠体３の開口部３ａ側の端部にクリームはんだ８が塗布される。 10, the assembly process is a process of assembling these after the process of preparing the resonant element 6, the frame body 3, the partition 4, and the lid 5. In this assembling process, the partition 4 and the resonance element 6 are arranged in the frame 3, the cream solder 8 is applied to the predetermined position by a dispenser 9 or the like, and the lid 5 is attached. Here, the cream solder is obtained by adding a flux to solder powder to form a cream. At this time, the cream solder 8 is applied to the joint between the partition 4 and the frame 3 and the end of the frame 3 on the opening 3a side.
　ここで従来のフィルタ装置１における共振素子６はカーリング加工によって成形されているので、側面に分断部６ｂを有する。分断部６ｂは電位が高くなるので、分断部６ｂの抵抗値の値がフィルタのＱ値に大きく影響する。そこで、分断部６ｂもはんだ８によって埋められることが必要となる。さらに、共振素子６の上端面６ａも電位が高くなるので、上端面６ａでの抵抗値の値もフィルタのＱ値に大きく影響する。そこで共振素子６の上端面６ａもはんだ８で覆うことが必要となる。組立工程では、共振素子６の上端面６ａ、分断部６ｂ、共振素子６の下端側の外周面全周にクリームはんだ８を塗布する。 Here, since the resonant element 6 in the conventional filter device 1 is formed by curling, it has a dividing portion 6b on the side surface. Since the dividing portion 6b has a high potential, the resistance value of the dividing portion 6b greatly affects the Q value of the filter. Therefore, it is necessary that the dividing portion 6 b is also filled with the solder 8. Furthermore, since the potential of the upper end surface 6a of the resonance element 6 is also increased, the resistance value at the upper end surface 6a also greatly affects the Q value of the filter. Therefore, it is necessary to cover the upper end surface 6 a of the resonance element 6 with the solder 8. In the assembling process, the cream solder 8 is applied to the upper end surface 6 a of the resonance element 6, the dividing portion 6 b, and the entire outer peripheral surface on the lower end side of the resonance element 6.
　そしてこの組み立て工程の後で、加熱してクリームはんだ８を溶かして、仕切り４の下端部と枠体３や、共振素子６の下端と枠体３、仕切り４上端部と蓋５、さらに枠体３の開口部３ａ端部と蓋５とを同時に接合する。なお、このとき共振素子６の下端部や分断部６ｂへ塗布したクリームはんだ８が、上端面６ａへ集中してしまわないように、筐体２は蓋５側が上となる向きで加熱される。 After this assembly process, the cream solder 8 is melted by heating, and the lower end of the partition 4 and the frame 3, the lower end of the resonance element 6 and the frame 3, the upper end of the partition 4 and the lid 5, and the frame. 3 ends of the opening 3a and the lid 5 are joined simultaneously. At this time, the casing 2 is heated in the direction in which the lid 5 is on the upper side so that the cream solder 8 applied to the lower end portion and the dividing portion 6b of the resonance element 6 does not concentrate on the upper end surface 6a.
　加熱工程では、蓋５を装着し閉じた状態で加熱する。したがって、所定の箇所におけるはんだ付け状態を目視で検査することができない。しかし、共振素子６の上端面６ａ、分断部６ｂや共振素子６の下端部において確実にはんだ付けをする必要がある。そのために、組立工程においては共振素子６の上端面６ａの全周と、分断部６ｂの上端から下端までと、さらに共振素子６の下端側の外周面全体にクリームはんだ８を塗布している。なお、この出願の発明に関連する先行技術文献としては、例えば、特許文献１が知られている。 In the heating process, heating is performed with the lid 5 attached and closed. Therefore, the soldering state in a predetermined location cannot be visually inspected. However, it is necessary to securely solder the upper end surface 6 a of the resonance element 6, the dividing portion 6 b, and the lower end portion of the resonance element 6. Therefore, in the assembling process, the cream solder 8 is applied to the entire circumference of the upper end surface 6 a of the resonance element 6, the upper end to the lower end of the dividing portion 6 b, and the entire outer peripheral surface on the lower end side of the resonance element 6. As a prior art document related to the invention of this application, for example, Patent Document 1 is known.
　しかしながら、従来のフィルタ装置１では、共振素子６の上端面６ａの全周と、分断部６ｂの上端から下端までと、さらに共振素子６の下端側の外周面全体にクリームはんだ８を塗布しているので、余分なはんだ８が生じる。この余分なはんだ８は加熱工程の加熱によって粘度が下がると分断部６ｂに沿って下方へと流れ出し、分断部６ｂの下端あたりではんだ８の溜まりなどが生じてしまうこととなる。 However, in the conventional filter device 1, the cream solder 8 is applied to the entire circumference of the upper end surface 6 a of the resonance element 6, the upper end to the lower end of the dividing portion 6 b, and the entire outer peripheral surface on the lower end side of the resonance element 6. As a result, extra solder 8 is generated. When the viscosity of the excess solder 8 is lowered by heating in the heating process, the excess solder 8 flows downward along the dividing portion 6b, and the solder 8 accumulates around the lower end of the dividing portion 6b.
　共振素子６と枠体３との交差する角の形状が、フィルタ装置１のＱ値に大きく影響する。従って、このようなはんだ８のたまりなどが生じると共振素子６と枠体３との交差する角の形状が安定せず、フィルタ装置１のＱ値も安定しない。これにより、フィルタ装置１の信号の通過損失の値にばらつきが発生する。 The shape of the corner at which the resonant element 6 and the frame 3 intersect greatly affects the Q value of the filter device 1. Therefore, when such a pool of solder 8 or the like occurs, the shape of the intersecting corner between the resonance element 6 and the frame 3 is not stable, and the Q value of the filter device 1 is not stable. As a result, variations occur in the value of the signal passing loss of the filter device 1.
国際公開第２００８／０２６４９３号International Publication No. 2008/026493
　本発明のフィルタ装置は、アンテナ端子と、このアンテナ端子が接続された中空状の筐体と、この筐体の内に設けられた共振素子とを含んでいる。筐体は開口部を有した金属製の枠体と、この枠体の開口部に装着される金属製の蓋とを有している。筐体の開口部側の端部近傍と蓋とがはんだによって接続されている。共振素子は金属製のパイプと、このパイプの下面に設けられた粗面部と、粗面部を含むパイプの表面全体に形成されためっき層とを有し、少なくとも粗面部においてめっき層と筐体とがはんだによって接合されている。共振素子の全体がめっきされているので、塗布するはんだは、共振素子の粗面部と筐体との間が接合するだけのはんだ量でよい。また共振素子の下端に粗面部が形成されるので、はんだのなじみが良好である。少量のはんだによって確実に共振素子と筐体との間が接合されるので、はんだ量のばらつきを少なくできる。したがって、共振素子の周囲でのはんだの溜まりや欠落などが生じにくくなり、共振素子と筐体との接合部の形状が安定する。これにより、フィルタ装置のＱ値のばらつきが小さくできるので、信号の通過損失のばらつきが小さなフィルタ装置を実現できる。 The filter device of the present invention includes an antenna terminal, a hollow casing to which the antenna terminal is connected, and a resonance element provided in the casing. The housing includes a metal frame having an opening and a metal lid attached to the opening of the frame. The vicinity of the end on the opening side of the housing and the lid are connected by solder. The resonant element includes a metal pipe, a rough surface portion provided on a lower surface of the pipe, and a plating layer formed on the entire surface of the pipe including the rough surface portion, and at least the rough surface portion includes a plating layer and a housing. Are joined by solder. Since the entire resonant element is plated, the solder to be applied may be an amount of solder sufficient to join the rough surface portion of the resonant element and the housing. In addition, since the rough surface portion is formed at the lower end of the resonant element, the familiarity of the solder is good. Since the resonant element and the housing are reliably joined by a small amount of solder, variation in the amount of solder can be reduced. Therefore, it is difficult for solder to collect or drop around the resonant element, and the shape of the joint between the resonant element and the casing is stabilized. Thereby, since the dispersion | variation in Q value of a filter apparatus can be made small, the filter apparatus with a small dispersion | variation in the passage loss of a signal is realizable.
図１は、本発明の実施の形態１におけるフィルタ装置の断面図である。1 is a cross-sectional view of a filter device according to Embodiment 1 of the present invention. 図２は、本発明の実施の形態１におけるフィルタ装置の上方からの断面図である。FIG. 2 is a cross-sectional view from above of the filter device according to Embodiment 1 of the present invention. 図３は、本発明の実施の形態１におけるフィルタ装置の製造方法を示す工程図である。FIG. 3 is a process diagram illustrating the method for manufacturing the filter device according to the first embodiment of the present invention. 図４は、本発明の実施の形態１における組み立て工程におけるフィルタ装置の断面図である。FIG. 4 is a cross-sectional view of the filter device in the assembly process according to Embodiment 1 of the present invention. 図５Ａは、本発明の実施の形態１における共振素子の要部上面図である。FIG. 5A is a top view of relevant parts of the resonant element according to Embodiment 1 of the present invention. 図５Ｂは、本発明の実施の形態１における共振素子の要部拡大断面図である。FIG. 5B is an essential part enlarged cross-sectional view of the resonance element according to Embodiment 1 of the present invention. 図６Ａは、本発明の実施の形態２におけるフィルタ装置の断面図である。FIG. 6A is a cross-sectional view of the filter device according to Embodiment 2 of the present invention. 図６Ｂは、本発明の実施の形態２におけるフィルタ装置の上方からの断面図である。FIG. 6B is a cross-sectional view from above of the filter device according to Embodiment 2 of the present invention. 図７は、本発明の実施の形態２におけるフィルタ装置の要部拡大断面図である。FIG. 7 is an enlarged cross-sectional view of a main part of the filter device according to Embodiment 2 of the present invention. 図８Ａは、本発明の実施の形態２の他の例におけるフィルタ装置の要部拡大断面図である。FIG. 8A is an enlarged cross-sectional view of a main part of a filter device in another example of Embodiment 2 of the present invention. 図８Ｂは、本発明の実施の形態２の更に他の例におけるフィルタ装置の要部拡大断面図である。FIG. 8B is an enlarged cross-sectional view of a main part of a filter device in still another example of Embodiment 2 of the present invention. 図９は、従来のフィルタ装置の断面図である。FIG. 9 is a cross-sectional view of a conventional filter device. 図１０は、従来の組み立て工程におけるフィルタ装置の断面図である。FIG. 10 is a cross-sectional view of a filter device in a conventional assembly process.
　（実施の形態１）
　以下、本実施の形態におけるフィルタ装置２１について、図面を用いて説明する。図１は、本発明の実施の形態１におけるフィルタ装置の断面図である。図２は、本発明の実施の形態１におけるフィルタ装置の上方からの断面図である。 (Embodiment 1)
Hereinafter, the filter device 21 in the present embodiment will be described with reference to the drawings. FIG. 1 is a cross-sectional view of a filter device according to Embodiment 1 of the present invention. FIG. 2 is a cross-sectional view from above of the filter device according to Embodiment 1 of the present invention.
　図１、図２において、フィルタ装置２１は、エアーキャビティ方式のフィルタ装置である。フィルタ装置２１は、金属製の筐体２２と、金属製筐体２２内に設置される共振素子２３と、筐体２２に接続されるアンテナ端子２２ａ（コネクタとして用ている）によって構成されている。 1 and 2, the filter device 21 is an air cavity type filter device. The filter device 21 includes a metal casing 22, a resonance element 23 installed in the metal casing 22, and an antenna terminal 22 a (used as a connector) connected to the casing 22. .
　筐体２２は、枠体２４と、蓋２５と仕切り２７とを含み、それらはすべて金属製である。本実施の形態では、両面に銅めっきによる層を有した表面処理鋼板が用いられている。枠体２４は、枠体２４の底面を形成する底部２４ｃと、底部２４ｃの端部に立設された側面２４ｂとによって構成されている。本実施の形態では、側面２４ｂは底部２４ｃから一体に折り曲げられて形成されている。蓋２５は、枠体２４の上方に設けられた開口部２４ａを塞ぐように装着され、枠体２４の開口部２４ａ端で枠体２４とはんだ２８によって接合されている。 The housing 22 includes a frame body 24, a lid 25, and a partition 27, all of which are made of metal. In the present embodiment, a surface-treated steel sheet having a copper plated layer on both sides is used. The frame body 24 includes a bottom portion 24c that forms the bottom surface of the frame body 24, and a side surface 24b that stands on the end of the bottom portion 24c. In the present embodiment, the side surface 24b is formed by being integrally bent from the bottom 24c. The lid 25 is mounted so as to close an opening 24 a provided above the frame body 24, and is joined to the frame body 24 by solder 28 at the end of the opening 24 a of the frame body 24.
　仕切り２７は、筐体２２内を複数の中空部２６（キャビティともいう）に仕切るように配置され、上端でははんだ２８によって蓋２５と接合され、下端でははんだ２８によって枠体２４と接合される。なお、仕切り２７が側面２４ｂと交差する箇所もはんだ２８によって接合される。本実施の形態において、仕切り２７は十字形状であり、筐体２２内に４つの中空部２６が形成される。そして、隣接する中空部２６同士を連結する結合窓２９によって、中空部２６が電磁結合し４段のフィルタが形成されることとなる。 The partition 27 is disposed so as to partition the inside of the housing 22 into a plurality of hollow portions 26 (also referred to as cavities), and is joined to the lid 25 by solder 28 at the upper end and joined to the frame body 24 by solder 28 at the lower end. Note that the part where the partition 27 intersects the side surface 24 b is also joined by the solder 28. In the present embodiment, the partition 27 has a cross shape, and four hollow portions 26 are formed in the housing 22. And the hollow part 26 electromagnetically couples by the coupling window 29 which connects adjacent hollow parts 26, and a four-stage filter will be formed.
　このようなフィルタ装置２１の製造方法について説明する。図３は、本発明の実施の形態１におけるフィルタ装置の製造方法を示す工程図である。図４は、本発明の実施の形態１における組み立て工程におけるフィルタ装置の断面図である。図３、図４において、図１、図２と同じものには同じ符号を用いており、その説明は省略している。 A method for manufacturing such a filter device 21 will be described. FIG. 3 is a process diagram illustrating the method for manufacturing the filter device according to the first embodiment of the present invention. FIG. 4 is a cross-sectional view of the filter device in the assembly process according to Embodiment 1 of the present invention. 3 and 4, the same reference numerals are used for the same components as those in FIGS. 1 and 2, and descriptions thereof are omitted.
　加工工程４１では、枠体２４と蓋２５とをそれぞれプレス加工によって作製する。組み立て工程４２では、加工工程４１の後で、図４に示すように筐体２２の組み立てが行われる。なおこの組み立て工程では、枠体２４へ仕切り２７を装着するとともに、枠体２４へ共振素子２３を固定する。このとき、枠体２４には、粗面部３１ｂが枠体２４と対向する方向で共振素子２３が固定される。ここで、本実施の形態における組み立て工程４２では、固定工程４３と装着工程４４とを含み、固定工程４３では、共振素子２３をスポット溶接によって枠体２４へ固定する。一方装着工程４４では、枠体２４内へ仕切り２７を装着する。なお、この組み立て工程４２において、固定工程４３と装着工程４４とはいずれを先に行っても構わない。 In the processing step 41, the frame body 24 and the lid 25 are each produced by pressing. In the assembly step 42, the housing 22 is assembled after the processing step 41 as shown in FIG. In this assembly process, the partition 27 is attached to the frame body 24 and the resonance element 23 is fixed to the frame body 24. At this time, the resonance element 23 is fixed to the frame body 24 in a direction in which the rough surface portion 31 b faces the frame body 24. Here, the assembly process 42 in the present embodiment includes a fixing process 43 and a mounting process 44. In the fixing process 43, the resonance element 23 is fixed to the frame body 24 by spot welding. On the other hand, in the mounting step 44, the partition 27 is mounted in the frame body 24. In the assembly process 42, either the fixing process 43 or the mounting process 44 may be performed first.
　はんだ塗布工程４５は組み立て工程４２の後で、ディスペンサ３０によって、枠体２４と蓋２５との接合部ならびに共振素子２３と枠体２４との接合部へクリームはんだ２８を塗布する。そして蓋装着工程４６ははんだ塗布工程４５の後で、枠体２４の開口部２４ａへ蓋２５を装着する。ロウ付け工程４７は、蓋装着工程４６の後で、蓋２５が装着された筐体２２を加熱して、枠体２４と蓋２５、仕切り２７と枠体２４、仕切り２７と蓋２５、そして共振素子２３と筐体２２との接合部をはんだ２８によって接合する。 In the solder application step 45, after the assembly step 42, the cream solder 28 is applied to the joint portion between the frame body 24 and the lid 25 and the joint portion between the resonance element 23 and the frame body 24 by the dispenser 30. In the lid mounting step 46, the lid 25 is mounted on the opening 24 a of the frame 24 after the solder application step 45. In the brazing step 47, after the lid mounting step 46, the casing 22 to which the lid 25 is mounted is heated, so that the frame body 24 and the lid 25, the partition 27 and the frame body 24, the partition 27 and the lid 25, and the resonance. A joint portion between the element 23 and the housing 22 is joined by the solder 28.
　なお、本実施の形態において共振素子２３は、枠体２４に接合したが、これは蓋２５へ接合してもかまわない。この場合、共振素子２３と蓋２５とが交差する接合部へはんだ２８が塗布される。また蓋２５には、粗面部３１ｂが蓋２５と対向する方向で共振素子２３が固定される。 In this embodiment, the resonance element 23 is bonded to the frame body 24, but it may be bonded to the lid 25. In this case, the solder 28 is applied to the joint where the resonance element 23 and the lid 25 intersect. In addition, the resonance element 23 is fixed to the lid 25 in a direction in which the rough surface portion 31 b faces the lid 25.
　また、共振素子２３を装着・固定した後にクリームはんだ２８を塗布したが、あらかじめ定められた位置へクリームはんだ２８を塗布し、その後に共振素子２３を装着してもよい。共振素子２３を蓋２５側へ接合する場合には、蓋２５は板状であるのでメタルマスクなどを用いてはんだ２８を供給することもできる。具体的には、蓋２５と枠体２４との接合部、蓋２５と仕切り２７との接合部、共振素子２３と蓋２５との接合部とをメタルマスクなどによってあらかじめ一括でスクリーン印刷を行っても良い。 Further, although the cream solder 28 is applied after the resonant element 23 is mounted and fixed, the cream solder 28 may be applied to a predetermined position and then the resonant element 23 may be mounted. When the resonance element 23 is joined to the lid 25 side, the lid 25 is plate-like, so that the solder 28 can be supplied using a metal mask or the like. Specifically, the joint portion between the lid 25 and the frame body 24, the joint portion between the lid 25 and the partition 27, and the joint portion between the resonance element 23 and the lid 25 are collectively screen-printed in advance using a metal mask or the like. Also good.
　共振素子２３と枠体２４との間の接合部において、はんだ２８は、共振素子２３の下端部（共振素子２３の内周面と枠体２４とが交差する位置近傍）へ塗布される。さらに本実施の形態では、円周全周に塗布するのではなく、離散的に塗布している。ディスペンサなどを用いて連続して塗布する場合、温度などの影響により塗布量が大きく変動しやすくなる。離散的に点塗布を行うことにより、１箇所の塗布量のばらつきを小さくでき、はんだ２８があふれて流れ出ることが起こりにくくなる。本実施の形態においてはんだ２８は共振素子２３の下端部の２箇所に、共振素子２３の円周をほぼ均等に２分割するような位置に塗布されるので、共振素子２３の全周へはんだ２８が流れ易くなる。したがって、共振素子２３と筐体２２との接合部にはんだ２８の欠落などが生じにくくなるので、フィルタ装置２１のＱ値を大きくでき、ばらつきも小さくできる。尚、本実施例では、はんだ２８を２箇所に塗布したが、２箇所に限らず、共振素子２３の円周上をほぼ等分の間隔で分割する間隔で塗布しても良い。 At the joint between the resonance element 23 and the frame body 24, the solder 28 is applied to the lower end portion of the resonance element 23 (near the position where the inner peripheral surface of the resonance element 23 and the frame body 24 intersect). Furthermore, in this Embodiment, it apply | coats discretely instead of apply | coating to the perimeter of a circumference. In the case of continuous application using a dispenser or the like, the application amount tends to fluctuate greatly due to the influence of temperature or the like. By performing point application discretely, variation in the application amount at one place can be reduced, and the solder 28 does not easily overflow and flow out. In the present embodiment, the solder 28 is applied to two positions at the lower end of the resonance element 23 at positions that divide the circumference of the resonance element 23 almost equally into two, so that the solder 28 is applied to the entire circumference of the resonance element 23. Becomes easier to flow. Therefore, since it is difficult for the solder 28 to be lost at the joint between the resonant element 23 and the housing 22, the Q value of the filter device 21 can be increased and the variation can be reduced. In this embodiment, the solder 28 is applied to two places, but the number is not limited to two, and the solder 28 may be applied at intervals that divide the circumference of the resonance element 23 at substantially equal intervals.
　このように、共振素子２３を中空状とし、共振素子２３と筐体２２とを接合するために、共振素子２３の内周と筐体２２とが交差する位置の近傍にはんだ２８を塗布する。はんだ２８は毛細管現象によって共振素子２３の下端面３１ｂと筐体２２との間を流れる。これによりはんだ２８が共振素子の外側へ流れ出にくくなる。共振素子の周囲でのはんだ２８の溜まりや欠落などが生じにくくなり、共振素子と筐体との接合部の形状が安定する。その結果、フィルタ装置のＱ値のばらつきが小さくできるので、信号の通過損失のばらつきが小さなフィルタ装置を実現できる。 In this way, the resonance element 23 is hollow, and the solder 28 is applied in the vicinity of the position where the inner periphery of the resonance element 23 and the casing 22 intersect in order to join the resonance element 23 and the casing 22. The solder 28 flows between the lower end surface 31b of the resonance element 23 and the housing 22 by a capillary phenomenon. This makes it difficult for the solder 28 to flow out of the resonant element. It is difficult for the solder 28 to accumulate or be missing around the resonant element, and the shape of the joint between the resonant element and the housing is stabilized. As a result, since the variation in the Q value of the filter device can be reduced, it is possible to realize a filter device in which the variation in signal passing loss is small.
　図５Ａは、本発明の実施の形態１における共振素子の要部上面図である。図５Ｂは、本発明の実施の形態１における共振素子の要部拡大断面図である。 FIG. 5A is a top view of the main part of the resonant element according to Embodiment 1 of the present invention. FIG. 5B is an essential part enlarged cross-sectional view of the resonance element according to Embodiment 1 of the present invention.
　図５Ａ、図５Ｂを用いて、共振素子２３について説明する。共振素子２３は中空の円筒形状であり、冷間圧延鋼板（鉄板）を所定の形状にプレス切断した平板をカーリングしてパイプ３１を形成し、このパイプの全面に銅のめっき層が形成されたものである。このように鉄をカーリングして形成するので、非常に安価な共振素子２３を得ることができる。パイプ３１はプレス加工によって加工されるので切断面は粗面となり、上面と下面にはそれぞれ粗面部３１ａと粗面部３１ｂが形成される。そして、バルクめっきなどによって粗面部３１ａや粗面部３１ｂを含め、パイプ３１の全面にめっきが施される。このようにめっき層は、バルクめっきなどの方法で形成できるので、非常に安価な共振素子２３を実現できる。本実施の形態においてパイプの表面には、銅のめっき層が形成されているので、導体抵抗が非常に小さい。従ってＱ値が高く、信号の通過損失を小さくできる。尚、本実施の形態ではめっき層として銅を用いたが、銀などの金属でも良い。 The resonant element 23 will be described with reference to FIGS. 5A and 5B. The resonant element 23 has a hollow cylindrical shape, and a pipe 31 is formed by curling a flat plate obtained by press-cutting a cold rolled steel plate (iron plate) into a predetermined shape, and a copper plating layer is formed on the entire surface of the pipe. Is. Since iron is curled in this way, a very inexpensive resonant element 23 can be obtained. Since the pipe 31 is processed by pressing, the cut surface is rough, and a rough surface portion 31a and a rough surface portion 31b are formed on the upper surface and the lower surface, respectively. Then, the entire surface of the pipe 31 including the rough surface portion 31a and the rough surface portion 31b is plated by bulk plating or the like. Thus, since the plating layer can be formed by a method such as bulk plating, a very inexpensive resonant element 23 can be realized. In the present embodiment, since the copper plating layer is formed on the surface of the pipe, the conductor resistance is very small. Therefore, the Q value is high and the signal passing loss can be reduced. In this embodiment, copper is used for the plating layer, but a metal such as silver may be used.
　このようにして形成された共振素子２３は、下面側の粗面部３１ｂ側が筐体２２と対向する方向で装着され、粗面部３１ｂと筐体２２内面とがはんだ２８によって接合される。なお、本実施の形態において共振素子２３は枠体２４の内面へ接合しているが、蓋２５に接合してもよい。分断部３１ｃの両隣に塗布されたはんだ２８と分断部３１ｃとの間の距離は、ほぼ同じ距離としておくと良い。これによって共振素子２３全周ではんだ２８の欠落などが発生しにくくなる。その結果、フィルタ装置２１のＱ値を大きく、ばらつきも小さくできる。 The resonance element 23 formed in this way is mounted so that the rough surface portion 31b side on the lower surface side faces the housing 22, and the rough surface portion 31b and the inner surface of the housing 22 are joined together by the solder 28. In the present embodiment, the resonance element 23 is bonded to the inner surface of the frame body 24, but may be bonded to the lid 25. The distance between the solder 28 applied to both sides of the dividing portion 31c and the dividing portion 31c is preferably set to be substantially the same distance. This makes it difficult for the solder 28 to be lost around the entire circumference of the resonant element 23. As a result, the Q value of the filter device 21 can be increased and variations can be reduced.
　以上の構成によって、共振素子２３全体が銅めっきされているので、従来のように共振素子２３の上面にはんだを塗布する必要もない。また共振素子２３の下面も銅めっきが施されるとともに、粗面であるので、はんだ２８のなじみが良好である。そのため、粗面部３１ｂと枠体２４（あるいは蓋２５）の内面との間が接合するだけのはんだ２８の量ですむので、少量のはんだで確実に共振素子２３と筐体２２との間を接合できる。従って、はんだ２８の量のばらつきが少なくなり、共振素子２３の周囲でのはんだ２８の溜まりや欠落などが生じにくくなる。これにより、Ｑ値のばらつきを小さくでき、信号の通過損失のばらつきの小さなフィルタ装置２１を実現できる。 With the above configuration, since the entire resonance element 23 is copper-plated, it is not necessary to apply solder to the upper surface of the resonance element 23 as in the prior art. Further, since the lower surface of the resonance element 23 is also plated with copper and is rough, the solder 28 is well-fitted. For this reason, the amount of solder 28 is sufficient to join between the rough surface portion 31b and the inner surface of the frame body 24 (or the lid 25), so that the resonance element 23 and the housing 22 are reliably joined with a small amount of solder. it can. Accordingly, the variation in the amount of the solder 28 is reduced, and it is difficult for the solder 28 to be accumulated or missing around the resonance element 23. Thereby, it is possible to reduce the variation in the Q value and to realize the filter device 21 with a small variation in the signal passing loss.
　パイプ３１はカーリング加工によって形成されるため、パイプ３１の上端から下端まで連続した分断部３１ｃが形成される。図５Ａに示すように、分断部３１ｃの幅３１ｄは、パイプ３１の内面から外面に向かって狭くしている。これによって、パイプ３１の外周面では分断部３１ｃの間隔が非常に小さくなるので、分断部３１ｃに銅めっきが埋まり、分断部３１ｃは銅めっきで接続されることとなる。本実施の形態ではパイプ３１の表面側における分断部３１ｃの幅は０．０５ｍｍとしているので、安価なバルクめっき法を用いて容易に分断部３１ｃを銅めっきで接続できる。 Since the pipe 31 is formed by curling, a continuous part 31c is formed from the upper end to the lower end of the pipe 31. As shown in FIG. 5A, the width 31d of the dividing portion 31c is narrowed from the inner surface of the pipe 31 toward the outer surface. As a result, the interval between the divided portions 31c becomes very small on the outer peripheral surface of the pipe 31, so that the copper plating is buried in the divided portions 31c, and the divided portions 31c are connected by copper plating. In the present embodiment, since the width of the dividing portion 31c on the surface side of the pipe 31 is 0.05 mm, the dividing portion 31c can be easily connected by copper plating using an inexpensive bulk plating method.
　さらに本実施の形態では、パイプ３１をカーリング加工するときに、バリがパイプ３１の外方となる方向で曲げられる。これにより分断部３１ｃの幅３１ｄは、パイプ３１の内周に比べて外周面側を狭くできる。そのため、さらに確実に分断部３１ｃを銅めっきで埋めて接続させることができる。 Furthermore, in the present embodiment, when the pipe 31 is curled, the burrs are bent in the direction to the outside of the pipe 31. As a result, the width 31 d of the dividing portion 31 c can be narrower on the outer peripheral surface side than the inner periphery of the pipe 31. Therefore, the dividing part 31c can be more reliably filled and connected with copper plating.
　このように分断部３１ｃがめっきによって接続されているので、分断部３１ｃへはんだ２８を塗布する必要がない。従って、さらに共振素子２３の周囲でのはんだ２８の溜まりなどが生じにくくなる。これにより、さらにＱ値のばらつきが小さく、信号の通過損失のばらつきが小さなフィルタ装置２１を実現できる。 Since the dividing portion 31c is thus connected by plating, it is not necessary to apply the solder 28 to the dividing portion 31c. Therefore, the accumulation of the solder 28 around the resonance element 23 is less likely to occur. Thereby, it is possible to realize the filter device 21 in which the variation in the Q value is further small and the variation in the signal passage loss is small.
　固定工程４３において、共振素子２３を枠体２４に、スポット溶接によって固定する。そのため、クリームはんだ２８を塗布する工程において、共振素子２３はあらかじめ固定されているので、ディスペンサの先端を共振素子２３と枠体２４との接合部に近づけてはんだ２８を塗布できる。これによって、周囲にまで不要なはんだ２８が塗布されることを防ぐことができる。したがって、さらに共振素子２３と枠体２４との間の接合部のはんだ２８の形状のばらつきが少なくなる。その結果、Ｑ値のばらつきが小さくなり、信号の通過損失のばらつきの小さなフィルタ装置２１を得ることができる。また、あらかじめ共振素子２３がスポット溶接されているので、ディスペンサの先端が共振素子２３に接触したとしても、共振素子２３の装着の位置がずれない。したがって、共振素子２３の固定位置の精度を高くでき、さらに信号の通過損失のばらつきの小さなフィルタ装置２１を得ることができる。 In the fixing step 43, the resonance element 23 is fixed to the frame body 24 by spot welding. Therefore, in the step of applying the cream solder 28, the resonant element 23 is fixed in advance, so that the solder 28 can be applied by bringing the tip of the dispenser close to the joint between the resonant element 23 and the frame body 24. Thereby, it is possible to prevent unnecessary solder 28 from being applied to the periphery. Therefore, the variation in the shape of the solder 28 at the joint between the resonant element 23 and the frame 24 is further reduced. As a result, the variation in the Q value is reduced, and the filter device 21 having a small variation in the signal passing loss can be obtained. In addition, since the resonant element 23 is spot-welded in advance, even if the tip of the dispenser contacts the resonant element 23, the mounting position of the resonant element 23 does not shift. Therefore, the accuracy of the fixed position of the resonant element 23 can be increased, and the filter device 21 with a small variation in signal passing loss can be obtained.
　なお、この場合、図５Ｂに示すように、枠体２４において共振素子２３が装着される位置には、共振素子２３側（内方）へ突出した突起部３２を形成しておく。そして、共振素子２３は粗面部３１ｂが突起部３２へ当接するように搭載されて、共振素子２３の上面と枠体２４の下面とにスポット溶接の電極を接触させて、電圧がかけられる。このとき共振素子２３と突起部３２との接点部分に電流が流れて、この接点部が溶接される。このように接点部のみを溶接すればよいので、スポット溶接によって発生する金属の酸化の範囲を小さくできる。したがって、はんだ２８の接着力の悪化を防ぐことができる。 In this case, as shown in FIG. 5B, a protrusion 32 protruding toward the resonance element 23 (inward) is formed at a position where the resonance element 23 is mounted on the frame 24. The resonance element 23 is mounted so that the rough surface portion 31b contacts the protrusion 32, and a voltage is applied by bringing a spot welding electrode into contact with the upper surface of the resonance element 23 and the lower surface of the frame body 24. At this time, a current flows through the contact portion between the resonant element 23 and the protrusion 32, and the contact portion is welded. Since only the contact portions need only be welded in this way, the range of metal oxidation generated by spot welding can be reduced. Accordingly, it is possible to prevent deterioration of the adhesive strength of the solder 28.
　また、スポット溶接時に位置決め冶具などによって、固定位置を決めることにより、共振素子２３の固定位置の精度を高くでき、さらに信号の通過損失のばらつきの小さなフィルタ装置２１を得ることができる。 Further, by determining the fixed position with a positioning jig or the like during spot welding, the accuracy of the fixed position of the resonance element 23 can be increased, and the filter device 21 with less variation in signal passing loss can be obtained.
　（実施の形態２）
　図６Ａは、本発明の実施の形態１におけるフィルタ装置の断面図である。図６Ｂは、本発明の実施の形態１におけるフィルタ装置の上方からの断面図である。図７は、本発明の実施の形態１におけるフィルタ装置の要部拡大断面図である。 (Embodiment 2)
FIG. 6A is a cross-sectional view of the filter device according to Embodiment 1 of the present invention. FIG. 6B is a cross-sectional view from above of the filter device according to Embodiment 1 of the present invention. FIG. 7 is an essential part enlarged cross-sectional view of the filter device according to Embodiment 1 of the present invention.
　図６Ａ、図６Ｂ、図７において、フィルタ装置１１は、アンテナ端子１２と、アンテナ端子１２が固定される金属製の筐体１３と、筐体１３内に設けられる共振素子１４と、筐体１３に固定された出力端子１０で構成される。 6A, 6 </ b> B, and 7, the filter device 11 includes an antenna terminal 12, a metal housing 13 to which the antenna terminal 12 is fixed, a resonance element 14 provided in the housing 13, and the housing 13. It is comprised by the output terminal 10 fixed to.
　アンテナ端子１２はアンテナ（図示なし）に接続され、アンテナで受信した受信信号が入力される。アンテナ端子１２は筐体１３の一方の側面にネジなどによって固定される。筐体１３は、枠体１３ｂと金属製の仕切り１３ｃと蓋１５とを含んでいる。枠体１３ｂは、金属製であり、筐体１３の外側を構成する。ここで枠体１３ｂは天板と、天板の周囲に立設された側板とより構成され、一方の面（図中下面側）に開口部１３ａを有している。一方、仕切り１３ｃは、枠体１３ｂ内を複数の中空部１８へ区切るように配置される。本実施の形態において仕切り１３ｃは、枠体１３ｂを４つの中空部１８へ区切るように枠体１３ｂ内に配置され、枠体１３ｂの中央部に２枚の仕切り１３ｃが交差するように組み合わされている。なお実施の形態において、枠体１３ｂと仕切り１３ｃとは共に、銅めっき処理鋼板が用いられている。 The antenna terminal 12 is connected to an antenna (not shown), and a reception signal received by the antenna is input. The antenna terminal 12 is fixed to one side surface of the housing 13 with a screw or the like. The housing 13 includes a frame 13b, a metal partition 13c, and a lid 15. The frame body 13 b is made of metal and constitutes the outside of the housing 13. Here, the frame body 13b is composed of a top plate and side plates erected around the top plate, and has an opening 13a on one surface (the lower surface side in the figure). On the other hand, the partition 13 c is arranged so as to divide the inside of the frame 13 b into a plurality of hollow portions 18. In the present embodiment, the partition 13c is arranged in the frame 13b so as to divide the frame 13b into four hollow portions 18, and is combined so that the two partitions 13c intersect the central portion of the frame 13b. Yes. In the embodiment, a copper-plated steel plate is used for both the frame body 13b and the partition 13c.
　樹脂基材上に導体部１５ａが設けられ、蓋１５が形成されている。蓋１５は導体部１５ａが開口部１３ａを塞ぐように装着される。枠体１３ｂの開口部１３ａ側の端部と導体部１５ａとがはんだ１６により接続されることによって、筐体１３は中空の直方体形状を形成する。なおこのとき少なくとも、枠体１３ｂの開口部１３ａ端部の内壁面と導体部１５ａとの間がはんだ１６で接続されていることが重要である。これは、開口部１３ａの端部において、はんだ１６の欠落部分が生じるとフィルタ装置１１の通過損失が大きくなるためである。そのために、導体部１５ａは開口部１３ａよりも大きくし、開口部１３ａが導体部１５ａで完全に覆われるようにすることで、開口部１３ａ端部において導体部１５ａと確実にはんだ１６が付くようにしている。なお、本実施の形態では、蓋１５には片面の銅張りプリント基板を用いているので、低価格なフィルタ装置１１を実現できる。 The conductor part 15a is provided on the resin base material, and the lid | cover 15 is formed. The lid 15 is mounted so that the conductor portion 15a closes the opening portion 13a. The casing 13 forms a hollow rectangular parallelepiped shape by connecting the end of the frame 13b on the opening 13a side and the conductor 15a with the solder 16. At this time, it is important that at least the inner wall surface at the end of the opening 13a of the frame 13b and the conductor 15a are connected by the solder 16. This is because the passage loss of the filter device 11 increases when a missing portion of the solder 16 occurs at the end of the opening 13a. Therefore, the conductor portion 15a is made larger than the opening portion 13a, and the opening portion 13a is completely covered with the conductor portion 15a, so that the solder 16 can be reliably attached to the conductor portion 15a at the end portion of the opening portion 13a. I have to. In the present embodiment, since a single-sided copper-clad printed circuit board is used for the lid 15, a low-cost filter device 11 can be realized.
　仕切り１３ｃの上端部ははんだ１６によって枠体１３ｂと接続され、仕切り１３ｃの下端部ははんだ１６によって導体部１５ａと接続されている。さらに、枠体１３ｂの中央部で仕切り１３ｃ同士が交差する箇所では、それぞれの仕切り１３ｃ同士がはんだ１６で接続される。また、仕切り１３ｃと側板とがＴ字状に交差する箇所では、仕切り１３ｃと側板とがはんだ１６によって接続されることによって筐体１３が作製される。 The upper end portion of the partition 13 c is connected to the frame body 13 b by the solder 16, and the lower end portion of the partition 13 c is connected to the conductor portion 15 a by the solder 16. Furthermore, in the location where the partitions 13c intersect at the center of the frame 13b, the partitions 13c are connected to each other by the solder 16. Further, at a location where the partition 13c and the side plate intersect in a T shape, the housing 13 is manufactured by connecting the partition 13c and the side plate with the solder 16.
　このようにして作製された筐体１３の４つの中空部１８内のそれぞれには、円筒形状をなした金属製の共振素子１４が配置される。共振素子１４にははんだづけ可能な材料のパイプを用いる。本実施の形態では銅のパイプを切断したものを用いている。これは、共振素子１４を樹脂で形成し、金属めっきを施した方が軽量化が可能となるが、樹脂上の金属膜は熱などに弱く、ふくれや剥離などが生じやすく、信頼性面で長期に安定した表面を維持し難いためである。特に共振素子１４の表面（特に上端部）では電位が集中するため、この部分でのめっきなどが剥がれると、信号の通過損失が非常に大きくなる。そこで、共振素子１４に関しては銅パイプを切断したものを用いることにより、表面状態が安定し、信頼性の良好なフィルタ装置１１を実現できる。また、本実施の形態における共振素子１４に代えて、実施の形態１における共振素子を用いても良い。この場合にも同様の効果を得ることができる。 In each of the four hollow portions 18 of the housing 13 manufactured in this way, a cylindrical metal resonant element 14 is disposed. The resonant element 14 is a pipe made of a solderable material. In the present embodiment, a copper pipe cut is used. This is because it is possible to reduce the weight by forming the resonance element 14 from resin and performing metal plating, but the metal film on the resin is weak against heat, and is likely to cause blistering and peeling, and in terms of reliability. This is because it is difficult to maintain a stable surface over a long period of time. In particular, since the potential concentrates on the surface of the resonance element 14 (particularly the upper end portion), if the plating or the like is peeled off at this portion, the signal passing loss becomes very large. Therefore, by using a resonance element 14 that is obtained by cutting a copper pipe, it is possible to realize the filter device 11 having a stable surface state and high reliability. Further, instead of the resonant element 14 in the present embodiment, the resonant element in the first embodiment may be used. In this case, the same effect can be obtained.
　共振素子１４は蓋１５の導体部１５ａ上にはんだ１６によって接続されている。このとき共振素子１４を導体部１５ａの所定の位置へ精度良く装着するための位置決めとして、蓋１５には筐体３の内方（図６Ａ、図７の上方）へ向かって突出した突起１７を設けている。ここで突起１７は、共振素子１４の内周面側で位置決めするものであり、突起１７の外周は共振素子１４の内周に沿う形状をなしている。本実施の形態においては、突起１７の外周と共振素子１４の内周との間隔を０．１ｍｍとしているので、通過周波数のばらつきの小さなフィルタ装置１１を実現できる。 The resonance element 14 is connected to the conductor portion 15 a of the lid 15 by solder 16. At this time, as positioning for accurately mounting the resonance element 14 to a predetermined position of the conductor portion 15a, the lid 15 is provided with a protrusion 17 protruding toward the inside of the housing 3 (upward in FIGS. 6A and 7). Provided. Here, the protrusion 17 is positioned on the inner peripheral surface side of the resonance element 14, and the outer periphery of the protrusion 17 has a shape along the inner periphery of the resonance element 14. In the present embodiment, since the distance between the outer periphery of the protrusion 17 and the inner periphery of the resonant element 14 is 0.1 mm, the filter device 11 with a small variation in pass frequency can be realized.
　なお、本実施の形態における突起１７の外周部には、凹部１７ａが形成されている。凹部１７ａでは共振素子１４の内周に対し隙間が形成され、共振素子１４と導体部１５ａとをはんだ１６によって接続するために、クリームはんだ１６が凹部１７ａに塗布される。 In addition, the recessed part 17a is formed in the outer peripheral part of the protrusion 17 in this Embodiment. In the recess 17a, a gap is formed with respect to the inner periphery of the resonance element 14, and cream solder 16 is applied to the recess 17a in order to connect the resonance element 14 and the conductor portion 15a with the solder 16.
　本実施の形態において、共振素子１４は蓋１５の導体部１５ａ上にはんだ１６によって接続されているが、これは枠体１３ｂや仕切り１３ｃに接続しても構わない。その場合には、枠体１３ｂや仕切り１３ｃにおいて、共振素子１４が装着される位置に突起１７を形成する。 In this embodiment, the resonance element 14 is connected to the conductor portion 15a of the lid 15 by the solder 16, but this may be connected to the frame 13b or the partition 13c. In that case, the protrusion 17 is formed in the frame 13b and the partition 13c in the position where the resonant element 14 is mounted.
　以上のように、突起１７によって共振素子１４は精度良く位置決めできるので、通過させる周波数のばらつきを小さくできる。また、位置決めのために、従来のような孔を設ける必要がないので、共振素子１４の外周面においてはんだ１６の欠落を発生しにくくできる。さらに、共振素子１４の外周と導体部１５ａとが交差する箇所において、均一なはんだ１６のフィレットを形成できるので、信号の通過損失の小さなフィルタ装置１１を実現できる。 As described above, since the resonant element 14 can be positioned with high accuracy by the protrusion 17, it is possible to reduce the variation in the passing frequency. Further, since it is not necessary to provide a conventional hole for positioning, it is possible to prevent the solder 16 from being lost on the outer peripheral surface of the resonance element 14. Furthermore, since a uniform fillet of the solder 16 can be formed at a location where the outer periphery of the resonance element 14 and the conductor portion 15a intersect, the filter device 11 with a small signal transmission loss can be realized.
　加えて、本実施の形態において蓋１５はプリント基板であり、突起１７の側面では樹脂基材の破断面が露出することとなり、突起１７の側面には導体が形成されない。従って、はんだ１６は突起１７の側面で流れがせき止められるので、はんだ１６が共振素子１４の内周側へ広がりにくくできる。これにより、共振素子１４の外周と導体部１５ａとが交差する箇所において、さらに均一なはんだ１６のフィレット形状を実現できる。 In addition, in the present embodiment, the lid 15 is a printed circuit board, and the fracture surface of the resin base material is exposed on the side surface of the projection 17, and no conductor is formed on the side surface of the projection 17. Therefore, the flow of the solder 16 is blocked by the side surface of the protrusion 17, so that the solder 16 can hardly spread to the inner peripheral side of the resonance element 14. Thereby, a more uniform fillet shape of the solder 16 can be realized at a location where the outer periphery of the resonance element 14 and the conductor portion 15a intersect.
　図８Ａは、本発明の実施の形態２の他の例におけるフィルタ装置の要部拡大断面図である。図８Ｂは、本発明の実施の形態２の更に他の例におけるフィルタ装置の要部拡大断面図である。 FIG. 8A is an enlarged cross-sectional view of a main part of a filter device according to another example of Embodiment 2 of the present invention. FIG. 8B is an enlarged cross-sectional view of a main part of a filter device in still another example of Embodiment 2 of the present invention.
　なお、図８Ａ、図８Ｂにおいて、図６～図７と同じものには同じ番号を用いて、説明を省略している。図８Ａにおいて、突起１７ｃが円形のリング状である点が図７と異なっている。すなわち図８Ａでは、突起１７の中央部に凹みを有した形状を示している。なお突起１７ｃは、導体部１５ａと凹み部とを連結したＣ字型などでも構わない。そしてＣ字型である場合には、Ｃ字の端部同士の間の位置（凹みと導体部１５ａとが連結された箇所）にクリームはんだ１６を塗布する。 In FIGS. 8A and 8B, the same components as those in FIGS. 6 to 7 are denoted by the same reference numerals and description thereof is omitted. 8A is different from FIG. 7 in that the protrusion 17c has a circular ring shape. That is, in FIG. 8A, the shape which has the dent in the center part of the protrusion 17 is shown. The protrusion 17c may be a C-shape that connects the conductor portion 15a and the recessed portion. And when it is C-shaped, the cream solder 16 is apply | coated to the position (location where the dent and the conductor part 15a were connected) between C-shaped edge parts.
　図８Ｂにおいて、突起１７ｂは、複数個の突起１７ｂが共振素子１４の内周面に対応する位置に離散的に設けられたものである。なお、図８Ａや図８Ｂでは、突起を蓋１５上に形成したが、これは枠体１３ｂや仕切り１３ｃ上に形成しても構わない。また、突起１７ｃや突起１７ｂを蓋１５と一体に形成したが、これは別途突起１７ｃや突起１７ｂを準備し蓋１５へ固定しても良い。あるいは、はんだなどによって、突起１７ｃや突起１７ｂを形成しても良い。すなわち、突起は蓋１５に植設しても良い。 8B, the protrusions 17b are a plurality of protrusions 17b provided discretely at positions corresponding to the inner peripheral surface of the resonance element 14. In FIGS. 8A and 8B, the protrusion is formed on the lid 15, but it may be formed on the frame 13b or the partition 13c. Further, although the protrusion 17c and the protrusion 17b are formed integrally with the lid 15, this may be prepared by fixing the protrusion 17c and the protrusion 17b separately to the lid 15. Alternatively, the protrusion 17c and the protrusion 17b may be formed by solder or the like. That is, the protrusion may be planted on the lid 15.
　また、枠体１３ｂの開口部１３ａは樹脂基材上に形成された導体部１５ａで塞がれることによって、導体部１５ａと枠体１３ｂとが中空部の内壁の役割を果たし、フィルタ装置１１が構成される。さらに、蓋１５ははんだ１６によって枠体１３ｂへ接続されるので、枠体１３ｂにネジなどを止めるための肉厚部は不要であり、枠体１３ｂは薄い板厚の鋼板などによって形成することができる。従って、フィルタ装置１１のさらなる軽量化が可能となる。 Further, the opening 13a of the frame body 13b is closed by the conductor portion 15a formed on the resin base material, whereby the conductor portion 15a and the frame body 13b serve as the inner wall of the hollow portion, and the filter device 11 Composed. Furthermore, since the lid 15 is connected to the frame body 13b by the solder 16, a thick portion for fastening screws or the like to the frame body 13b is unnecessary, and the frame body 13b can be formed of a thin steel plate or the like. it can. Therefore, the filter device 11 can be further reduced in weight.
　ここでアンテナに飛来した雷（あるいは誘導雷）などのエネルギーによって、フィルタ装置１１が破壊することを防止するため、少なくとも枠体１３ｂには金属製の材料を用いる。これによって雷は枠体１３ｂを経由し、枠体１３ｂへ固定された金属製のグランド端子（図示せず）からグランドへと流れる。つまりアンテナ端子１２が固定される枠体１３ｂを金属とし、枠体１３ｂをグランドへ接地することによって、確実に雷のエネルギーをアースへ落とすことができる。 Here, at least the frame 13b is made of a metal material in order to prevent the filter device 11 from being destroyed by energy such as lightning (or induced lightning) flying to the antenna. As a result, lightning flows from the metal ground terminal (not shown) fixed to the frame 13b to the ground via the frame 13b. That is, by using the frame 13b to which the antenna terminal 12 is fixed as a metal and grounding the frame 13b to the ground, lightning energy can be reliably dropped to the ground.
　枠体１３ｂには、銅などの導電性の良好な金属を用いることができる。ところが、枠体１３ｂに銅板などを用いた場合、材料が高価であるので、フィルタ装置１１が高価となる。そこで、本実施の形態では鋼板の表裏面にあらかじめ導電性の良好な金属めっきが施された表面処理鋼板を用い、これをプレス加工することで枠体１３ｂを形成している。このように枠体１３ｂは板状であり、あらかじめ表面処理が施された鋼板によって形成されているので、軽量で低価格なフィルタ装置１１を実現できる。なお本実施の形態では冷間圧延鋼板の両面に銅めっきがされた表面処理鋼板を用いているので、抵抗値が小さく雷をアースへ逃がしやすいとともに、受信信号のロスも小さくできる。 A metal having good conductivity such as copper can be used for the frame 13b. However, when a copper plate or the like is used for the frame 13b, the material is expensive, so the filter device 11 is expensive. Therefore, in the present embodiment, a surface-treated steel plate in which metal plating with good conductivity is applied to the front and back surfaces of the steel plate in advance is used, and the frame body 13b is formed by pressing this. Thus, since the frame 13b is plate-shaped and is formed of a steel plate that has been subjected to surface treatment in advance, the light and low-cost filter device 11 can be realized. In the present embodiment, the surface-treated steel sheet with copper plating on both surfaces of the cold-rolled steel sheet is used, so that the resistance value is small and lightning can easily escape to the ground, and the loss of the received signal can be reduced.
　なお本実施の形態における側板は、天板の周囲から４方に折り曲げられることによって、天板と一体に形成されている。したがって、別途天板と側板とをはんだ１６などで接合する必要がなく、低価格なフィルタ装置１１を実現できる。さらに、はんだ１６による接合が不要であるので、軽量化も実現できる。 Note that the side plate in the present embodiment is formed integrally with the top plate by being bent in four directions from the periphery of the top plate. Therefore, it is not necessary to separately join the top plate and the side plate with the solder 16 or the like, and the low-cost filter device 11 can be realized. Furthermore, since the joining by the solder 16 is unnecessary, weight reduction is also realizable.
　また、仕切り１３ｃは樹脂成形し、その上に導体めっきを施したものを用いても良い。この場合、結合窓２９において樹脂の露出がないので、非常に信号の通過ロスを小さくできる。さらに仕切り１３ｃの全面に導体が形成されるので、枠体１３ｂ、蓋１５の導体部１５ａとのはんだづけ特性が良好である。また仕切り１３ｃの基材として樹脂を用いると、フィルタ装置は軽量になる。あるいは、蓋１５と仕切り１３ｃとを一体に成形したものを用いても良い。この場合、樹脂であるので軽量であることに加え、蓋１５と仕切り１３ｃとをはんだ１６で接続する必要がない。したがって、低価格であるとともに、さらなる軽量化が可能となる。 Further, the partition 13c may be formed by resin molding and subjected to conductor plating. In this case, since the resin is not exposed in the coupling window 29, the signal passing loss can be greatly reduced. Further, since the conductor is formed on the entire surface of the partition 13c, the soldering characteristics between the frame 13b and the conductor portion 15a of the lid 15 are good. Moreover, when resin is used as the base material of the partition 13c, the filter device becomes light. Or what formed the lid | cover 15 and the partition 13c integrally may be used. In this case, since it is resin, in addition to being lightweight, it is not necessary to connect the lid 15 and the partition 13c with the solder 16. Accordingly, it is possible to reduce the weight and further reduce the weight.
　さらに、蓋１５には両面基板や多層基板を用いても良い。そしてこの場合、蓋１５の下面をグランドとして用いることにより、高周波信号の漏洩などが発生しにくいフィルタ装置１１を実現できる。上下面をスルーホールなどで接続すると、さらに確実にフィルタ装置１１をシールドできる。 Furthermore, a double-sided board or a multilayer board may be used for the lid 15. In this case, by using the lower surface of the lid 15 as a ground, it is possible to realize the filter device 11 that is unlikely to leak a high-frequency signal. When the upper and lower surfaces are connected by a through hole or the like, the filter device 11 can be shielded more reliably.
　本発明にかかるフィルタ装置とその製造方法は、信号の通過損失のばらつきが小さいという効果を有し、携帯電話の基地局などに用いられるフィルタ装置として有用である。 The filter device and the manufacturing method thereof according to the present invention have an effect that the variation in signal passing loss is small, and are useful as a filter device used in a base station of a mobile phone or the like.
２１　　フィルタ装置
２２　　筐体
２２ａ　　アンテナ端子
２３　　共振素子
２４　　枠体
２４ａ　　開口部
２５　　蓋
２６　　中空部
２７　　仕切り
２８　　はんだ
３０　　ディスペンサ
３１　　パイプ
３１ａ　　粗面部
３１ｂ　　粗面部
３１ｃ　　分断部
３２　　突起部
４１　　加工工程
４２　　組み立て工程
４３　　固定工程
４４　　装着工程
４５　　塗布工程
４６　　蓋装着工程
４７　　ロウ付け工程 21 Filter device 22 Case 22a Antenna terminal 23 Resonant element 24 Frame 24a Opening portion 25 Lid 26 Hollow portion 27 Partition 28 Solder 30 Dispenser 31 Pipe 31a Rough surface portion 31b Rough surface portion 31c Dividing portion 32 Projection portion 41 Processing step 42 Assembly step 43 Fixing process 44 Mounting process 45 Application process 46 Lid mounting process 47 Brazing process

Claims (24)

  1. 開口部を有した金属製の枠体と、
    中空部と、
    共振素子と、
    前記枠体の前記開口部に装着される金属製の蓋と、
    を備えた筐体と、
    前記筐体に接続されたアンテナ端子と、
    を有し、
    前記筐体の前記開口部側の端部近傍と前記蓋とがはんだによって接続されており、
    前記共振素子は、
    金属製のパイプと、
    前記パイプの少なくとも端部に設けられた粗面部と、
    前記粗面部を含む前記パイプの表面全体に形成されためっき層と、
    を有し、
    少なくとも前記パイプの粗面部において、前記めっき層と前記筐体内面とがはんだによって接合された
    フィルタ装置。     A metal frame having an opening;
    A hollow part;
    A resonant element;
    A metal lid attached to the opening of the frame;
    A housing with
    An antenna terminal connected to the housing;
    Have
    Near the opening side end of the housing and the lid are connected by solder,
    The resonant element is
    A metal pipe,
    A rough surface provided at least at an end of the pipe;
    A plating layer formed on the entire surface of the pipe including the rough surface portion,
    Have
    The filter device in which the plating layer and the inner surface of the housing are joined together by solder at least on the rough surface portion of the pipe.
  2. 前記パイプは上端から下端まで連続して形成された分断部を有し、
    前記分断部では、前記めっき層同士が接続された
    請求項１に記載のフィルタ装置。     The pipe has a dividing portion formed continuously from the upper end to the lower end,
    The filter device according to claim 1, wherein the plating layers are connected to each other at the dividing portion.
  3. 前記パイプは鉄により形成されている
    請求項１に記載のフィルタ装置。     The filter device according to claim 1, wherein the pipe is made of iron.
  4. 前記分断部の幅は、前記パイプの内面側より外面側を狭くした
    請求項２に記載のフィルタ装置。     The filter device according to claim 2, wherein a width of the dividing portion is narrower on an outer surface side than an inner surface side of the pipe.
  5. 前記分断部におけるバリはパイプの外方となる方向に形成された
    請求項４に記載のフィルタ装置。     The burr | flash in the said parting part is a filter apparatus of Claim 4 formed in the direction used as the outward of a pipe.
  6. 前記パイプの端面の一部と前記枠体または前記蓋とがスポット溶接により固定された
    請求項１に記載のフィルタ装置。     The filter device according to claim 1, wherein a part of an end surface of the pipe and the frame or the lid are fixed by spot welding.
  7. 前記筐体の前記スポット溶接をする位置には、内方へ突出した突起部を設け、
    前記突起部と前記共振素子の下端面とが当接した
    請求項６に記載のフィルタ装置。     Providing a protrusion projecting inward at the spot welding position of the housing,
    The filter device according to claim 6, wherein the protrusion and the lower end surface of the resonance element are in contact with each other.
  8. 前記蓋は樹脂基材の少なくとも一方の面に導体部が形成されたものであり、
    前記開口部の先端部と前記導体部とが接続されるとともに、
    前記導体部と前記共振素子の下端部とがはんだづけされ、
    前記蓋には前記筐体の内方側へ突出する突起を設け、
    前記共振素子の内周面が前記突起で位置決めされる
    請求項６に記載のフィルタ装置。     The lid has a conductor portion formed on at least one surface of a resin base material,
    While the tip of the opening and the conductor are connected,
    The conductor and the lower end of the resonant element are soldered,
    The lid is provided with a protrusion protruding inward of the housing,
    The filter device according to claim 6, wherein an inner peripheral surface of the resonance element is positioned by the protrusion.
  9. 前記蓋にはプリント基板が用いられる
    請求項８に記載のフィルタ装置。     The filter device according to claim 8, wherein a printed circuit board is used for the lid.
  10. 前記突起の外周部は円形であるとともに、
    前記外周部は前記共振素子の内周面に沿って設けられた
    請求項８に記載のフィルタ装置。     The outer periphery of the protrusion is circular,
    The filter device according to claim 8, wherein the outer peripheral portion is provided along an inner peripheral surface of the resonance element.
  11. 前記突起の外周には、凹部が形成され、前記凹部にはんだが塗布される
    請求項８に記載のフィルタ装置。     The filter device according to claim 8, wherein a recess is formed on an outer periphery of the protrusion, and solder is applied to the recess.
  12. 複数個の突起が前記共振素子の内周面に沿って形成された
    請求項８に記載のフィルタ装置。     The filter device according to claim 8, wherein a plurality of protrusions are formed along an inner peripheral surface of the resonance element.
  13. 前記蓋にはプリント基板が用いられ、
    前記突起は前記プリント基板へ植設して形成された
    請求項１２に記載のフィルタ装置。     A printed circuit board is used for the lid,
    The filter device according to claim 12, wherein the protrusion is formed by being implanted in the printed circuit board.
  14. 少なくとも一方の端部に粗面部を有した金属製のパイプを製造し、
    前記パイプの表面にめっき処理を行うことにより共振素子を製造し、
    枠体と蓋とを準備し、
    前記枠体もしくは蓋のいずれか一方に、前記共振素子を前記粗面部が前記枠体もしくは蓋と対向する方向で設置し、
    枠体と蓋との接合部ならびに前記共振素子の下端部にはんだを塗布し、
    枠体に蓋を装着し、
    加熱して前記共振素子が接合された筐体を得る
    フィルタ装置の製造方法。     Producing a metal pipe having a rough surface at least at one end;
    A resonant element is manufactured by plating the surface of the pipe,
    Prepare the frame and lid,
    On either one of the frame or the lid, the resonant element is installed in a direction in which the rough surface portion faces the frame or the lid,
    Apply solder to the joint between the frame and the lid and the lower end of the resonant element,
    Attach a lid to the frame,
    A method for manufacturing a filter device, wherein the casing is obtained by heating to obtain a casing to which the resonant element is bonded.
  15. 前記共振素子を設置した後、前記はんだを塗布する前に、
    前記共振素子を枠体もしくは蓋へあらかじめ固定する
    請求項１４に記載のフィルタ装置の製造方法。     After installing the resonant element and before applying the solder,
    The method for manufacturing a filter device according to claim 14, wherein the resonance element is fixed to a frame body or a lid in advance.
  16. 前記固定は、スポット溶接とした
    請求項１５に記載のフィルタ装置の製造方法。     The method for manufacturing a filter device according to claim 15, wherein the fixing is spot welding.
  17. 前記パイプを製造する工程において、
    前記パイプはカーリングによって加工され、
    前記パイプにはカーリングにより形成される分断部を有し、
    少なくともパイプ表面側における前記分断部の幅は、前記めっき処理のめっきで埋められる
    請求項１４に記載のフィルタ装置の製造方法。     In the process of manufacturing the pipe,
    The pipe is processed by curling,
    The pipe has a dividing portion formed by curling,
    The method for manufacturing a filter device according to claim 14, wherein at least a width of the divided portion on the pipe surface side is filled with plating in the plating process.
  18. 前記分断部の幅は、パイプ内面より外面側を狭くする
    請求項１７に記載のフィルタ装置の製造方法。     The method of manufacturing a filter device according to claim 17, wherein the width of the dividing portion is narrower on the outer surface side than the inner surface of the pipe.
  19. 前記カーリングでは、前記分断部のバリがパイプの外方となる方向で曲げられた
    請求項１８に記載のフィルタ装置の製造方法。     The method for manufacturing a filter device according to claim 18, wherein, in the curling, the burrs at the dividing portion are bent in a direction toward the outside of the pipe.
  20. 前記はんだを塗布する工程において、
    前記はんだは、前記共振素子の内周面と、前記筐体の内面とが交差する位置の近傍へ塗布される
    請求項１４に記載のフィルタ装置の製造方法。     In the step of applying the solder,
    The method of manufacturing a filter device according to claim 14, wherein the solder is applied in the vicinity of a position where an inner peripheral surface of the resonance element and an inner surface of the housing intersect.
  21. 前記はんだは少なくとも２箇所以上の位置に離散的に塗布された
    請求項２０に記載のフィルタ装置の製造方法。     The method for manufacturing a filter device according to claim 20, wherein the solder is discretely applied to at least two positions.
  22. 前記はんだは、前記共振素子の円周上をほぼ等分の間隔で分割するように塗布された
    請求項２１に記載のフィルタ装置の製造方法。     The method for manufacturing a filter device according to claim 21, wherein the solder is applied so as to divide the circumference of the resonant element at substantially equal intervals.
  23. 前記パイプの表面全体にめっき層が形成されており、
    前記分断部はパイプの上端から下端まで連続して形成されており、
    前記分断部では、前記めっき層同士が接続された
    請求項２２に記載のフィルタ装置の製造方法。     A plating layer is formed on the entire surface of the pipe,
    The dividing portion is formed continuously from the upper end to the lower end of the pipe,
    The method for manufacturing a filter device according to claim 22, wherein the plating layers are connected to each other at the dividing portion.
  24. 前記分断部の両隣に塗布されたはんだと前記分断部との間の距離は、それぞれほぼ同じ距離とした
    請求項１７に記載のフィルタ装置の製造方法。     The method for manufacturing a filter device according to claim 17, wherein the distance between the solder applied on both sides of the divided portion and the divided portion is substantially the same.
PCT/JP2010/004830 2009-08-21 2010-07-30 Filter apparatus and manufacturing method thereof WO2011021353A1 (en)

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JP2009191560A JP2011044900A (en) 2009-08-21 2009-08-21 Filter device and method for manufacturing the same
JP2009-191560 2009-08-21
JP2009-203251 2009-09-03
JP2009-203250 2009-09-03
JP2009203251A JP2011055318A (en) 2009-09-03 2009-09-03 Filter device and method of manufacturing the same
JP2009203250A JP2011055317A (en) 2009-09-03 2009-09-03 Method of manufacturing filter device
JP2009-249774 2009-10-30
JP2009249774A JP2011097391A (en) 2009-10-30 2009-10-30 Filter apparatus

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115458884A (en) * 2022-10-20 2022-12-09 苏州诺泰信通讯有限公司 Design and processing method of ultra-deep cavity filter

Citations (3)

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Publication number Priority date Publication date Assignee Title
WO2008026493A1 (en) * 2006-08-31 2008-03-06 Panasonic Corporation Filter device and method for manufacturing the same
JP2008148280A (en) * 2006-11-13 2008-06-26 Matsushita Electric Ind Co Ltd Resonator
JP2010226469A (en) * 2009-03-24 2010-10-07 Japan Radio Co Ltd Band pass filter

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008026493A1 (en) * 2006-08-31 2008-03-06 Panasonic Corporation Filter device and method for manufacturing the same
JP2008148280A (en) * 2006-11-13 2008-06-26 Matsushita Electric Ind Co Ltd Resonator
JP2010226469A (en) * 2009-03-24 2010-10-07 Japan Radio Co Ltd Band pass filter

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115458884A (en) * 2022-10-20 2022-12-09 苏州诺泰信通讯有限公司 Design and processing method of ultra-deep cavity filter
CN115458884B (en) * 2022-10-20 2024-06-04 苏州诺泰信通讯有限公司 Ultra-deep cavity filter design processing method

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