WO2011017385A1 - Pumped liquid multiphase cooling system - Google Patents
Pumped liquid multiphase cooling system Download PDFInfo
- Publication number
- WO2011017385A1 WO2011017385A1 PCT/US2010/044327 US2010044327W WO2011017385A1 WO 2011017385 A1 WO2011017385 A1 WO 2011017385A1 US 2010044327 W US2010044327 W US 2010044327W WO 2011017385 A1 WO2011017385 A1 WO 2011017385A1
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- WO
- WIPO (PCT)
- Prior art keywords
- fluid
- evaporator
- cooling system
- pump
- devices
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20945—Thermal management, e.g. inverter temperature control
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20381—Thermal management, e.g. evaporation control
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20936—Liquid coolant with phase change
Definitions
- the present invention relates to pumped liquid multiphase cooling, and more particularly, to a system and method for metering the fluid flow available to multiple cold plate/evaporators of a pumped liquid multiphase cooling system.
- One such method is a pumped liquid multiphase cooling system 110 which is shown in FIG. 1 and comprises a cold plate/evaporator 120, a condenser 130 and a pump 140, connected to each other by fluid conduits 150.
- a fluid such as a two-phase R134A refrigerant is pumped through the system 110 to cool an electronic component attached to the cold plate/evaporator 120.
- the heat generated by the electronic component is transferred to the fluid, causing the fluid to partially vaporize.
- the fluid then travels to the condenser 120 wherein the heat is rejected from the system 110 and the fluid returns to the cold plate/evaporator 120 by way of the pump 140.
- a pumped liquid multiphase system of this type is disclosed in U.S. Patent Nos. 6,519,955 and 6,679,081 , both incorporated herein by reference.
- a problem with pumped liquid multiphase cooling system can exist when the system has multiple cold plate/evaporators positioned in parallel.
- a cold plate/evaporator has a heat load that is higher than the heat loads of the other cold plates.
- the higher heat load will result in more of the liquid refrigerant being vaporized and having a larger pressure drop than the pressure drop of the other cold plate/evaporators.
- the fluid, seeking the path of least resistance will flow to the remaining cold plate/evaporators, thus starving the cold plate/evaporator with the high heat load - which eventually will result in local superheating of the fluid.
- At least one embodiment of the invention provides a cooling system comprising: at least two components generating heat and required to be cooled; at least two evaporator devices, each in thermal contact with one of the at least two components; a pump having at least an inlet; a fluid circulated by the pump to the at least two evaporator devices, whereby the fluid is at least partially evaporated by the heat generated by the at least two components, creating a vapor; a condenser for condensing the vapor, creating a single liquid phase; a first fluid conduit for receiving the fluid from the pump, the first liquid conduit connected to the at least two evaporator devices in parallel; a second fluid conduit from the at least two evaporator devices, the second conduit connected to the condenser; and a fluid return line from the condenser to the inlet of the pump; an adjustable flow restrictor positioned upstream from each of the at least two evaporator devices, the flow restrictors providing a flow rate to the evaporator device at a rate
- At least one embodiment of the invention provides a cooling system comprising: at least two components generating heat and required to be cooled; at least two evaporator devices, each in thermal contact with one of the at least two components; a pump having at least an inlet; a fluid circulated by the pump to the at least two evaporator devices, whereby the fluid is at least partially evaporated by the heat generated by the at least two components, creating a vapor; a condenser for condensing the vapor, creating a single liquid phase; a first fluid conduit for receiving the fluid from the pump, the first fluid conduit connected to the at least two evaporator devices in parallel; a second fluid conduit from the at least two evaporator devices, the second conduit connected to the condenser; and a fluid return line from the condenser to the inlet of the pump; a means for sensing a fluid pressure or a fluid temperature on an outlet side of each evaporator device and a means for adjusting the fluid flow rate through each evaporator to
- FIG. 1 is a schematic diagram of a prior art pumped loop multiphase cooling system
- FIG. 2 is a schematic diagram of a pumped loop multiphase cooling system utilizing fixed orifice restrictors
- FIG. 3 is a schematic diagram of a pumped loop multiphase cooling system utilizing variable orifice restrictors.
- FIG. 4 is a schematic diagram of a pumped loop multiphase cooling system utilizing various flow control devices.
- FIG. 2 An embodiment of a cooling system 10 of the present invention is shown in FIG. 2.
- the system 10 comprises at least one pump 20, at least two evaporators 30, a condenser 40, and a liquid reservoir 50; the components connected to each other by various fluid conduits 60.
- the evaporators 30 each are in thermal contact with at least one electrical or electronic component which is capable of generating heat and is required to be cooled (a thermodynamic system is said to be in thermal contact with another system if it can exchange energy with it through the process of heat - thermal contact does not imply direct physical contact).
- a converter module 32 and an inverter module 34 are shown in FIGS. 2-4 as an example of these components; however the invention is not limited to a particular electrical or electronic component.
- a liquid cooled transformer 36 is also shown and works as an evaporator positioned in parallel with the converter modules 32 and the inverter modules 34.
- the cooling requirements of the components are predetermined and a fluid flow required to meet the cooling requirements can be provided by inserting fixed orifices 70 into the fluid conduit branches.
- the fixed orifices can be of any required diameter to ensure that the proper fluid flow is directed through the evaporator 30 in a manner that the fluid is never completely evaporated across any evaporator 30. It is noted that within a single branch, any evaporators that are in parallel should each have their own fixed orifices 72 into each sub parallel branch of the fluid conduit 60 for the same reasons as the primary parallel branches of the fluid circuit.
- adjustable flow restrictors 74, 76 can react to changes in the operating conditions of the system to be cooled to increase or decrease the fluid flow through the adjustable flow restrictors 74, 76.
- the adjustable flow restrictors 74, 76 may be a variable orifice restrictor, a needle valve, or any other flow metering device that has the ability to change the fluid flow through the restrictor in response to physical conditions at the restrictor.
- any evaporators that are in parallel should each have their own adjustable flow restrictors 74, 76 into each sub parallel branch of the fluid conduit 60 for the same reasons as the primary parallel branches of the fluid circuit.
- the adjustment of the fluid flow may also be accomplished using sensed pressure and/or temperature data either at the restrictor or based on feedback using sensed data from the outlet side of the evaporators.
- a mechanical pressure feedback flow control is shown at 82 which controls an adjustable flow restrictor in the form of a mechanical flow control restrictor 80 which is pressure compensated to adjust the fluid flow.
- Feedback can also be provided by sensors 90 positioned near the outlet of the evaporator devices 30.
- Pressure and/or temperature feedback such as that provided by sensors 90 can also be used to control an electromechanical flow control restrictor 88 to adjust fluid flow. It is also contemplated that a pressure compensated flow control restrictor may be provided with a bypass 86 that diverts excess flow to the liquid reservoir 50 or a secondary reservoir (not shown).
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A pumped liquid multi-phase cooling system is provided wherein the system has multiple cold plate/evaporators positioned in parallel. The flow through each leg of the parallel system is controlled by an adjustable flow restrictor which ensures that the appropriate flow exists at each cold plate/evaporator, especially when one cold plate/evaporator has a heat load that is higher than the heat loads of the other cold plates.
Description
PUMPED LIQUID MULTIPHASE COOLING SYSTEM
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] The present application claims the benefit of the filing date of U.S. Provisional Patent Application Serial No. 61/231 ,088, filed August 4, 2009, the disclosure of which is incorporated herein by reference in its entirety.
TECHNICAL FIELD
[0002] The present invention relates to pumped liquid multiphase cooling, and more particularly, to a system and method for metering the fluid flow available to multiple cold plate/evaporators of a pumped liquid multiphase cooling system.
BACKGROUND
[0003] Electrical and electronic components (e.g. microprocessors, IGBT's, power semiconductors, etc.) are most often cooled by air-cooled heat sinks with extended surfaces, directly attached to the surface to be cooled. A fan or blower moves air across the heat sink fins, removing the heat generated by the component. With increasing power densities, miniaturization of components, and shrinking of packaging, it is sometimes not possible to adequately cool electrical and electronic components with heat sinks and forced air flows.
When this occurs, other methods must be employed to remove heat from the components.
[0004] One such method is a pumped liquid multiphase cooling system 110 which is shown in FIG. 1 and comprises a cold plate/evaporator 120, a condenser 130 and a pump 140, connected to each other by fluid conduits 150. A fluid such as a two-phase R134A refrigerant is pumped through the system 110 to cool an electronic component attached to the cold plate/evaporator 120. In the cold plate/evaporator 120, the heat generated by the electronic component is transferred to the fluid, causing the fluid to partially vaporize. The fluid then travels to the condenser 120 wherein the heat is rejected from the system 110 and the fluid returns to the cold plate/evaporator 120 by way of the pump 140. A pumped liquid multiphase system of this type is disclosed in U.S. Patent Nos. 6,519,955 and 6,679,081 , both incorporated herein by reference.
[0005] However, a problem with pumped liquid multiphase cooling system can exist when the system has multiple cold plate/evaporators positioned in parallel. One example exists where a cold plate/evaporator has a heat load that is higher than the heat loads of the other cold plates. The higher heat load will result in more of the liquid refrigerant being vaporized and having a larger pressure drop than the pressure drop of the other cold plate/evaporators. The fluid, seeking the path of least resistance, will flow to the remaining cold
plate/evaporators, thus starving the cold plate/evaporator with the high heat load - which eventually will result in local superheating of the fluid.
[0006] It would therefore be an advantage over these existing systems if the fluid flow was properly managed across each of the cold plate/evaporators.
SUMMARY
[0007] At least one embodiment of the invention provides a cooling system comprising: at least two components generating heat and required to be cooled; at least two evaporator devices, each in thermal contact with one of the at least two components; a pump having at least an inlet; a fluid circulated by the pump to the at least two evaporator devices, whereby the fluid is at least partially evaporated by the heat generated by the at least two components, creating a vapor; a condenser for condensing the vapor, creating a single liquid phase; a first fluid conduit for receiving the fluid from the pump, the first liquid conduit connected to the at least two evaporator devices in parallel; a second fluid conduit from the at least two evaporator devices, the second conduit connected to the condenser; and a fluid return line from the condenser to the inlet of the pump; an adjustable flow restrictor positioned upstream from each of the at least two evaporator devices, the flow restrictors providing a flow rate to the evaporator device at a rate ensuring that the fluid does not completely evaporate in the evaporator device.
[0008] At least one embodiment of the invention provides a cooling system comprising: at least two components generating heat and required to be cooled; at least two evaporator devices, each in thermal contact with one of the at least two components; a pump having at least an inlet; a fluid circulated by the pump to the at least two evaporator devices, whereby the fluid is at least partially evaporated by the heat generated by the at least two components, creating a vapor; a condenser for condensing the vapor, creating a single liquid phase; a first fluid conduit for receiving the fluid from the pump, the first fluid conduit connected to the at least two evaporator devices in parallel; a second fluid conduit from the at least two evaporator devices, the second conduit connected to the condenser; and a fluid return line from the condenser to the inlet of the pump; a means for sensing a fluid pressure or a fluid temperature on an outlet side of each evaporator device and a means for adjusting the fluid flow rate through each evaporator to a predetermined value based on the sensed pressure or sensed temperature, wherein the predetermined flow rate is at a rate ensuring that the fluid does not completely evaporate in the evaporator devices.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] Embodiments of this invention will now be described in further detail with reference to the accompanying drawings, in which:
[0010] FIG. 1 is a schematic diagram of a prior art pumped loop multiphase cooling system;
[0011] FIG. 2 is a schematic diagram of a pumped loop multiphase cooling system utilizing fixed orifice restrictors;
[0012] FIG. 3 is a schematic diagram of a pumped loop multiphase cooling system utilizing variable orifice restrictors; and
[0013] FIG. 4 is a schematic diagram of a pumped loop multiphase cooling system utilizing various flow control devices.
DETAILED DESCRIPTION
[0014] An embodiment of a cooling system 10 of the present invention is shown in FIG. 2. The system 10 comprises at least one pump 20, at least two evaporators 30, a condenser 40, and a liquid reservoir 50; the components connected to each other by various fluid conduits 60. The evaporators 30 each are in thermal contact with at least one electrical or electronic component which is capable of generating heat and is required to be cooled (a thermodynamic system is said to be in thermal contact with another system if it can exchange energy with it through the process of heat - thermal contact does not imply direct physical contact). A converter module 32 and an inverter module 34 are shown in FIGS. 2-4 as an example of these components; however the invention
is not limited to a particular electrical or electronic component. A liquid cooled transformer 36 is also shown and works as an evaporator positioned in parallel with the converter modules 32 and the inverter modules 34. The cooling requirements of the components are predetermined and a fluid flow required to meet the cooling requirements can be provided by inserting fixed orifices 70 into the fluid conduit branches. The fixed orifices can be of any required diameter to ensure that the proper fluid flow is directed through the evaporator 30 in a manner that the fluid is never completely evaporated across any evaporator 30. It is noted that within a single branch, any evaporators that are in parallel should each have their own fixed orifices 72 into each sub parallel branch of the fluid conduit 60 for the same reasons as the primary parallel branches of the fluid circuit.
[0015] With fixed orifices, unexpected changes to the operating conditions of the system to be cooled may not be compensated for adequately. Referring now to FIG. 3, the fixed orifices in the previous figure have been replaced by adjustable flow restrictors 74 at the primary parallel branches and by adjustable flow restrictors 76 at the sub parallel branches of the fluid conduit 60. Adjustable flow restrictors 74, 76 can react to changes in the operating conditions of the system to be cooled to increase or decrease the fluid flow through the adjustable flow restrictors 74, 76. The adjustable flow restrictors 74, 76 may be a variable orifice restrictor, a needle valve, or any other flow metering device that has the ability to change the fluid flow through the
restrictor in response to physical conditions at the restrictor. As with the previous embodiment, within a single branch, any evaporators that are in parallel should each have their own adjustable flow restrictors 74, 76 into each sub parallel branch of the fluid conduit 60 for the same reasons as the primary parallel branches of the fluid circuit.
[0016] The adjustment of the fluid flow may also be accomplished using sensed pressure and/or temperature data either at the restrictor or based on feedback using sensed data from the outlet side of the evaporators. Referring now to FIG. 4, a mechanical pressure feedback flow control is shown at 82 which controls an adjustable flow restrictor in the form of a mechanical flow control restrictor 80 which is pressure compensated to adjust the fluid flow. Feedback can also be provided by sensors 90 positioned near the outlet of the evaporator devices 30.
[0017] Pressure and/or temperature feedback such as that provided by sensors 90 can also be used to control an electromechanical flow control restrictor 88 to adjust fluid flow. It is also contemplated that a pressure compensated flow control restrictor may be provided with a bypass 86 that diverts excess flow to the liquid reservoir 50 or a secondary reservoir (not shown).
[0018] Although the principles, embodiments and operation of the present invention have been described in detail herein, this is not to be construed as being limited to the particular illustrative forms disclosed. They will thus become apparent to those skilled in the art that various modifications of the embodiments herein can be made without departing from the spirit or scope of the invention.
Claims
CLAIMS What is claimed is: 1. A cooling system comprising:
at least two components generating heat;
at least two evaporator devices, each in thermal contact with one of the at least two components;
a pump having at least an inlet;
a fluid circulated by the pump to the at least two evaporator devices, whereby the fluid is at least partially evaporated by the heat generated by the at least two components, creating a vapor;
a condenser for condensing the vapor, creating a single liquid phase; a first fluid conduit for receiving the fluid from the pump, the first liquid conduit connected to the at least two evaporator devices in parallel;
a second fluid conduit from the at least two evaporator devices, the second conduit connected to the condenser; and a fluid return line from the condenser to the inlet of the pump;
an adjustable flow restrictor positioned upstream from each of the at least two evaporator devices, the flow restrictors providing a flow rate to the evaporator device at a rate ensuring that the fluid does not completely evaporate in the evaporator device
2. The cooling system of claim 1 , wherein the adjustable flow restrictor is a variable orifice restrictor or a needle valve.
3. The cooling system of claim 1 , wherein at least one of the adjustable flow restrictors is controlled by a fluid pressure.
4. The cooling system of claim 1 , wherein at least one of the adjustable flow restrictors is controlled by a fluid temperature.
5, The cooling system of claim 1 , wherein at least one of the adjustable flow restrictors is controlled by feedback of a condition downstream from an associated evaporator device.
6. The cooling system of claim 5, wherein the feedback of a condition downstream from an associated evaporator device is provided by a pressure sensor.
7. The cooling system of claim 5, wherein the feedback of a condition downstream from an associated evaporator device is provided by a temperature sensor.
8. The cooling system of claim 1 , wherein at least one of the adjustable flow restrictors is controlled by a mechanical pressure feedback downstream from an associated evaporator device.
9. The cooling system of claim 1 , wherein at least one of the adjustable flow restrictors is an electromechanical flow control device.
10. The cooling system of claim 1 , wherein at least one evaporator device is a cold plate.
11. A cooling system comprising:
at least two components generating heat and required to be cooled; at least two evaporator devices, each in thermal contact with one of the at least two components;
a pump having at least an inlet;
a fluid circulated by the pump to the at least two evaporator devices, whereby the fluid is at least partially evaporated by the heat generated by the at least two components, creating a vapor;
a condenser for condensing the vapor, creating a single liquid phase; a first fluid conduit for receiving the fluid from the pump, the first fluid conduit connected to the at least two evaporator devices in parallel; a second fluid conduit from the at least two evaporator devices, the second conduit connected to the condenser; and a fluid return line from the condenser to the inlet of the pump;
a means for sensing a fluid pressure or a fluid temperature on an outlet side of each evaporator device; and
a means for adjusting the fluid flow rate through each evaporator to a predetermined value based on the sensed pressure or sensed temperature, wherein the predetermined flow rate is at a rate ensuring that the fluid does not completely evaporate in the evaporator devices.
12. The cooling system of claim 11 , wherein the means for adjusting the fluid flow rate through each evaporator is provided by adjustable flow restrictors.
13. The cooling system of claim 12, wherein at least one of the adjustable flow restrictors is an electromechanical flow control device.
14. The cooling system of claim 12, wherein at least one of the adjustable flow restrictors is a variable orifice restrictor or a needle valve.
15. The cooling system of claim 11 , wherein the means for sensing a fluid pressure or a fluid temperature on an outlet side of each evaporator device is provided by a pressure sensor or a temperature sensor.
16. The cooling system of claim 11 , wherein at least one evaporator device is a cold plate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US23108809P | 2009-08-04 | 2009-08-04 | |
| US61/231,088 | 2009-08-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2011017385A1 true WO2011017385A1 (en) | 2011-02-10 |
Family
ID=43034610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US2010/044327 WO2011017385A1 (en) | 2009-08-04 | 2010-08-04 | Pumped liquid multiphase cooling system |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2011017385A1 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8368208B2 (en) | 2010-10-01 | 2013-02-05 | Raytheon Company | Semiconductor cooling apparatus |
| WO2013151526A1 (en) * | 2012-04-02 | 2013-10-10 | Parker-Hannifin Corporation | Cooling system and method |
| EP2734020A1 (en) * | 2012-11-19 | 2014-05-21 | ABB Technology AG | Cooling arrangement with a two-phase thermosyphon for cooling a multiplicity of electric devices |
| ITMI20130910A1 (en) * | 2013-06-03 | 2014-12-04 | Frascold S P A | COOLING DEVICE FOR A FREQUENCY CONVERTER, FREQUENCY CONVERTER UNIT INCLUDING THE Aforementioned COOLING AND REFRIGERATION SYSTEM OR AIR CONDITIONING INCLUDING THE CONVERTER UNIT |
| ITBO20130537A1 (en) * | 2013-09-30 | 2015-03-31 | Elenos Srl | PERFECT DEVICE FOR COOLING OF ELECTRIC AND ELECTRONIC POWER COMPONENTS |
| US9472487B2 (en) | 2012-04-02 | 2016-10-18 | Raytheon Company | Flexible electronic package integrated heat exchanger with cold plate and risers |
| US9553038B2 (en) | 2012-04-02 | 2017-01-24 | Raytheon Company | Semiconductor cooling apparatus |
| WO2021202580A1 (en) * | 2020-03-31 | 2021-10-07 | Gm Cruise Holdings Llc | Two-phase cooling systems for autonomous driving super computers |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0750166A2 (en) * | 1995-06-23 | 1996-12-27 | Mitsubishi Denki Kabushiki Kaisha | Refrigerant circulating system |
| US6415619B1 (en) * | 2001-03-09 | 2002-07-09 | Hewlett-Packard Company | Multi-load refrigeration system with multiple parallel evaporators |
| US6519955B2 (en) | 2000-04-04 | 2003-02-18 | Thermal Form & Function | Pumped liquid cooling system using a phase change refrigerant |
| US20060272342A1 (en) * | 2005-06-01 | 2006-12-07 | Bash Cullen E | Refrigeration system with parallel evaporators and variable speed compressor |
| WO2007102978A1 (en) * | 2006-03-08 | 2007-09-13 | Raytheon Company | System and method for cooling a server-based data center |
| US20080196867A1 (en) * | 2007-02-19 | 2008-08-21 | Liebert Corporation | Cooling Fluid Flow Regulation Distribution System and Method |
-
2010
- 2010-08-04 WO PCT/US2010/044327 patent/WO2011017385A1/en active Application Filing
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0750166A2 (en) * | 1995-06-23 | 1996-12-27 | Mitsubishi Denki Kabushiki Kaisha | Refrigerant circulating system |
| US6519955B2 (en) | 2000-04-04 | 2003-02-18 | Thermal Form & Function | Pumped liquid cooling system using a phase change refrigerant |
| US6679081B2 (en) | 2000-04-04 | 2004-01-20 | Thermal Form & Function, Llc | Pumped liquid cooling system using a phase change refrigerant |
| US6415619B1 (en) * | 2001-03-09 | 2002-07-09 | Hewlett-Packard Company | Multi-load refrigeration system with multiple parallel evaporators |
| US20060272342A1 (en) * | 2005-06-01 | 2006-12-07 | Bash Cullen E | Refrigeration system with parallel evaporators and variable speed compressor |
| WO2007102978A1 (en) * | 2006-03-08 | 2007-09-13 | Raytheon Company | System and method for cooling a server-based data center |
| US20080196867A1 (en) * | 2007-02-19 | 2008-08-21 | Liebert Corporation | Cooling Fluid Flow Regulation Distribution System and Method |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8368208B2 (en) | 2010-10-01 | 2013-02-05 | Raytheon Company | Semiconductor cooling apparatus |
| US9472487B2 (en) | 2012-04-02 | 2016-10-18 | Raytheon Company | Flexible electronic package integrated heat exchanger with cold plate and risers |
| WO2013151526A1 (en) * | 2012-04-02 | 2013-10-10 | Parker-Hannifin Corporation | Cooling system and method |
| US9553038B2 (en) | 2012-04-02 | 2017-01-24 | Raytheon Company | Semiconductor cooling apparatus |
| EP2734020A1 (en) * | 2012-11-19 | 2014-05-21 | ABB Technology AG | Cooling arrangement with a two-phase thermosyphon for cooling a multiplicity of electric devices |
| ITMI20130910A1 (en) * | 2013-06-03 | 2014-12-04 | Frascold S P A | COOLING DEVICE FOR A FREQUENCY CONVERTER, FREQUENCY CONVERTER UNIT INCLUDING THE Aforementioned COOLING AND REFRIGERATION SYSTEM OR AIR CONDITIONING INCLUDING THE CONVERTER UNIT |
| CN105493646A (en) * | 2013-06-03 | 2016-04-13 | 富拉思口德股份公司 | Cooling device for a frequency converter, converter assembly comprising said cooling device and refrigerating or conditioning plant comprising said converter assembly |
| US20160128241A1 (en) * | 2013-06-03 | 2016-05-05 | Frascold S.P.A. | Cooling device for a frequency converter, converter assembly comprising said cooling device and refrigerating or conditioning plant comprising said converter assembly |
| WO2014195870A1 (en) * | 2013-06-03 | 2014-12-11 | Frascold S.P.A. | Cooling device for a frequency converter, converter assembly comprising said cooling device and refrigerating or conditioning plant comprising said converter assembly |
| CN105493646B (en) * | 2013-06-03 | 2019-05-10 | 富拉思口德股份公司 | Equipment for freezing or adjusting |
| US10849256B2 (en) | 2013-06-03 | 2020-11-24 | Frascold S.P.A. | Cooling device for a frequency converter, converter assembly comprising said cooling device and refrigerating or conditioning plant comprising said converter assembly |
| ITBO20130537A1 (en) * | 2013-09-30 | 2015-03-31 | Elenos Srl | PERFECT DEVICE FOR COOLING OF ELECTRIC AND ELECTRONIC POWER COMPONENTS |
| WO2021202580A1 (en) * | 2020-03-31 | 2021-10-07 | Gm Cruise Holdings Llc | Two-phase cooling systems for autonomous driving super computers |
| US11191190B2 (en) | 2020-03-31 | 2021-11-30 | GM Cruise Holdings, LLC | Two-phase cooling systems for autonomous driving super computers |
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