WO2011015236A1 - Appareil - Google Patents

Appareil Download PDF

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Publication number
WO2011015236A1
WO2011015236A1 PCT/EP2009/060118 EP2009060118W WO2011015236A1 WO 2011015236 A1 WO2011015236 A1 WO 2011015236A1 EP 2009060118 W EP2009060118 W EP 2009060118W WO 2011015236 A1 WO2011015236 A1 WO 2011015236A1
Authority
WO
WIPO (PCT)
Prior art keywords
transducer
base
providing
opening
gasket
Prior art date
Application number
PCT/EP2009/060118
Other languages
English (en)
Inventor
Preben Kvist
Claes Lundin
Original Assignee
Nokia Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Corporation filed Critical Nokia Corporation
Priority to PCT/EP2009/060118 priority Critical patent/WO2011015236A1/fr
Publication of WO2011015236A1 publication Critical patent/WO2011015236A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2811—Enclosures comprising vibrating or resonating arrangements for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/023—Screens for loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
    • H04M1/035—Improving the acoustic characteristics by means of constructional features of the housing, e.g. ribs, walls, resonating chambers or cavities
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/225—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only  for telephonic receivers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Definitions

  • the present invention relates to an apparatus.
  • the invention further relates to, but is not limited to, an apparatus for use in mobile devices.
  • acoustic transducers such as microphones, earpieces and speakers.
  • Such transducers are key components in mobile phone audio/acoustic design.
  • Telecommunication devices such as mobile or cellular handsets are known to include a receiver part which has an earpiece for at least reproducing a downlink or received audio signal.
  • the earpiece module is integrated within the housing of these devices and the integration techniques may vary.
  • the mechanical dimensions of portable devices have been generally reduced in size. This size reduction played an important role for transducer integrations, such as earpiece speaker modules, and forced designers to implement techniques that are space efficient. It has therefore become a general rule for earpieces that a 'conventional design' is applied to devices in recent years.
  • a 'conventional design' comprises known techniques such as 'open front' or 'front resonator' where no dedicated sealed back volume is required.
  • a 'conventional design' may also include additional sound outlet/s, in close proximity to the main outlet/s, to create an implementation known as 'leak tolerant' design.
  • 'Open front' implementations use a large outlet/s together with a very small or no dedicated front cavity that forms a resonance well above the passband.
  • 'Front resonator' implementations are formed with an acoustic resonator comprising a dedicated and sealed front cavity together with sound outlet/s in front of the earpiece.
  • the same techniques or other alternative approaches may require a dedicated and sealed rear acoustic cavity for the rear of earpiece speaker module.
  • the use of a sealed or dedicated rear acoustic cavity has been found less favourable because they require more space and mechanical arrangement in order to form a desired frequency response for the earpiece.
  • a sealed and dedicated rear cavity requires a device to be physically large enough to contain the rear acoustic cavity to produce acceptable frequency responses.
  • An example of a earpiece requiring a sealed rear cavity is a bass reflex earpiece design.
  • a large sealed rear cavity may be used for efficient and improved leak tolerant designs.
  • Such sealed or dedicated rear acoustic cavity earpiece integrations have been to be significantly reduced in size in recent years.
  • Earpiece modules thus may be electrically connected via spring contacts or leaf contacts. Alternatively, the earpiece module may use a soldered connection or another suitable type of connection to provide a reliable electrical interface.
  • a protective mesh or other porous material is generally designed to assist the audio reproduction quality aspects and maintain good reliability by protecting the earpiece from particles entering through the sound outlets.
  • portable devices have other apertures in the case (such as those provides for audio connectors, chargers connections, and card slots) where dust, other particles and water can enter the internal volume of the device. This dust, other small particles and water could easily reach the earpiece components causing component damage.
  • dynamic moving coil components radiate in each direction as the diaphragm moves forwards and backwards.
  • the construction of the transducer typically has open outlets on each side of the transducer which are free to air.
  • the permanent magnet of the moving coil transducers may attract metallic particles, which easily migrate through the portable device and reach the voice coil and diaphragm. These particles can damage the sensitive components and/or reduce the performance of these components when the apparatus is in operation.
  • apparatus comprising: a transducer comprising an air displacement component that is configured to move upon application of an electrical signal; a base comprising a first surface; a seal configured to seal a volume defined by the transducer and base first surface; and a leakage conduit, wherein the leakage conduit is configured to provide a partial opening for the volume defined by the transducer and the first surface of the base.
  • the seal may comprise a gasket configured with a gasket first surface adjacent the base first surface and a gasket second surface adjacent the transducer.
  • the gasket may comprise the leakage conduit.
  • the leakage conduit is preferably configured to acoustically tune a frequency response of the transducer.
  • the transducer may comprise a transducer element configured to convert electrical signals into acoustic waves and a transducer housing for supporting the transducer element from the base first surface.
  • the transducer housing may comprise a support wall within which is located the leakage conduit.
  • the transducer housing may comprise the seal.
  • the base may comprise the leakage conduit.
  • the apparatus may further comprise a filter for the leakage conduit configured to prevent particles from passing through the leakage conduit.
  • the apparatus may further comprise a housing configured to contain the transducer, base, seal and leakage conduit, wherein at least one opening may acoustically connect a first surface of the transducer to an exterior of the housing, and a rear volume is preferably partially defined by a second surface of the transducer opposite to the first surface.
  • the leakage conduit is preferably connected to the rear volume, and wherein the first surface of transducer is preferably acoustically separated from the second surface.
  • the rear volume is preferably coupled to an interior or an exterior of the housing via the leakage conduit.
  • the opening connecting the first surface of the transducer to an exterior of the housing may comprise a gaseous porous first surface filter.
  • a method comprising: providing an air displacement component configured to move upon application of an electrical signal; providing a base comprising a first surface; providing a seal configured to seal a volume defined by the air displacement component and base first surface; and providing a partial opening for the volume defined by the air displacement component and the first surface of the base.
  • Providing the seal may comprise providing a gasket configured with a gasket first surface adjacent the base first surface and a gasket second surface adjacent the transducer.
  • Providing a partial opening may comprise providing the partial opening in the gasket.
  • Providing a partial opening may comprise acoustically tuning the partial opening.
  • Providing a partial opening may comprise providing a partial opening in a housing configured to support an air displacement unit transducer element from the base first surface.
  • Providing the seal may comprise at least one of: gluing a housing configured to support an air displacement unit transducer element from the base first surface to the base first surface; heatstaking a housing to the base first surface; taping a housing to the base first surface; and ultrasonic wielding a housing to the base first surface.
  • Providing a partial opening may comprise providing the partial opening in the base.
  • the method may further comprise filtering the partial opening to prevent particles from passing through the partial opening.
  • the base may comprise a substrate which may be a printed wire board (PWB), a printed circuit board (PCB), a flexible terminal or any other suitable medium upon which the transducer may be electrically connected.
  • the first surface of the base is oppositely disposed to a second surface.
  • the second surface of the transducer is coupled to a rear volume.
  • the rear volume and the second surface of the transducer may be acoustically separated from the first surface.
  • the filter may comprise a suitably arranged mesh structure. It is understood that the first and second surfaces of the transducer may therefore according to the above embodiments be protected against environmental conditions such as dust, water and metallic particles.
  • the parameters of the leakage conduit may be designed to maintain or achieve a suitable frequency response for the apparatus.
  • suitably designed leakage conduit parameters may result in less damping and prevents any sensitivity reduction.
  • the electro-acoustic characteristics may be maintained as if the rear of an earpiece speaker module is left open.
  • the characteristics of the leakage conduit may be designed to provide a suitable degree of smoothing. The provision of a relatively flat frequency response for the apparatus may reduce the requirement for digital signal processing of the input signal.
  • a further filter protecting the connection between the first surface of the transducer to the exterior of the housing comprises which may be a suitably arranged mesh structure or cover.
  • the position and parameters of the filter may be suitably arranged.
  • the parameters of the mesh structure may be different from the leakage conduit filter.
  • the apparatus may comprise a display region, wherein the rear surface of the display region may face the first surface of the base.
  • the base may comprise electrical connections, wherein the transducer is preferably electrically coupled to the base.
  • the base is preferably in direct connection with one or more gaskets.
  • the base may comprise the leakage conduit and filter.
  • the apparatus is preferably a communications device.
  • FIG 1 shows schematically an electronic device apparatus employing embodiments of the invention
  • Figure 2 shows schematically a cross-sectional view of the apparatus shown in Figure 1 at the dashed line denoted "A" according to some embodiments of the application;
  • Figure 3 shows schematically a cross-sectional view through the apparatus shown in Figure 1 at the dashed line denoted "B" according to some embodiments of the application;
  • Figure 4 is a graph comparing the frequency response of an example conventional design against a uniformly sealed rear cavity
  • Figure 5 is a graph comparing the frequency response of an example conventional design against some further embodiments of the application.
  • Figure 6 shows schematically a cross-sectional view through the apparatus shown in Figure 1 at the dashed line denoted "B" according to some further embodiments of the application.
  • Figure 1 shows a schematic diagram of an exemplary apparatus or electronic device, which may incorporate protected transducers according to some embodiments.
  • the apparatus as shown in Figures 1 , 2, 3, and 6 are user equipment in the form of a mobile phone.
  • Figure 1 is a plan view of an apparatus suitable for operating as a mobile phone 10 according to some embodiments.
  • the mobile phone 10 may in some embodiments comprise an outer cover 100 which houses some internal components.
  • the outer cover may comprise a display region 102 through which a display panel is visible to a user.
  • the outer cover also in some embodiments comprises a sound hole 104.
  • the mobile phone 10 further comprises a visible feature 106 formed around the sound hole.
  • the visible feature 106 may in some embodiments include a separate bezel for the sound hole 104 or in some other embodiments may be formed as part of the outer cover 100 or the display region 102.
  • the mobile phone 10 may also comprise a volume control button 110 with which the user can control the volume of an output of the earpiece speaker module.
  • FIG 2 is a schematic cross-sectional view through the mobile phone 10 of Figure 1 at the dashed line denoted "A".
  • the outer cover 100 of the mobile phone may in some embodiments comprise a first portion 116 and a second portion 122.
  • the first portion which may in some embodiments be referred to as the A-cover, comprises a face portion 114 which includes the display region 102 and the sound hole 104, which constitutes the front surface of the mobile phone.
  • the first portion in some embodiments also comprises side wall portion 112 extending substantially perpendicularly from the face portion.
  • the second portion which in some embodiments may be referred to as the B-cover, comprises a ground wall portion
  • the A-cover side wall portion 112 may in some embodiments be configured to engage with the B-cover side wall portion 120.
  • the display panel may in some embodiments be provided beneath the display region 102 of the A-cover. In some other embodiments, a protective panel may be constructed in front of the display panel (not shown).
  • a protective panel may be constructed in front of the display panel (not shown).
  • the term "display panel" is used to refer to a LCD display component, it would be appreciated that the display panel may be any suitable display or type of display panel and associated electronics.
  • the display region 102 in some embodiments may also comprise a touch-sensitive panel provided immediately adjacent to the display region of the A-cover. In these embodiments the touch sensitive panel may be configured for providing input for the mobile phone 10. It will be understood that the mobile phone 10, in some embodiments, comprises a keypad instead of, or in addition to, the touch sensitive panel.
  • the display region 102 may in some embodiments and as shown in Figure 2 locate the sound hole 104. Although as shown in figure 2 there is only one sound hole 104 it would be appreciated that other embodiments may have multiple sound holes or outlets through which the sound waves generated in the case are passed to the user.
  • the sound hole or holes 104 may in some other embodiments be formed in the housing of the mobile phone 10 such as the A-cover. In some other embodiments, a single or plurality of apertures may be formed between the display region 102 and the A-cover.
  • the mobile phone 10 as shown in figure 2 also comprises in some embodiments a substrate 124.
  • the substrate may comprise a printed wire board (PWB), a printed circuit board (PCB), a flexible terminal or any other suitable medium upon which electrical components can be mounted.
  • PWB printed wire board
  • PCB printed circuit board
  • the term "substrate” is used to refer to a PWB.
  • the substrate 124 is in some embodiments provided beneath the display region 102 and located in the volume defined by the A-cover and the B-cover.
  • the substrate 124 in these embodiments comprises an upper surface 126 provided adjacent to the display region.
  • the upper surface of the substrate 124 in these embodiments faces the display region and the sound hole 104.
  • the substrate 124 also comprises a lower surface 128 disposed opposite to the upper surface.
  • the lower surface of the substrate 124 in these embodiments faces generally towards the ground wali portion 118 of the mobile phone 10 such as the B-cover.
  • the mobile phone 10 as shown in figure 2 also comprises in some embodiments an earpiece module 130.
  • the earpiece module 130 may in some embodiments be provided adjacent to the upper surface 126 of the substrate 124.
  • the earpiece module 130 in some embodiments may be a moving coil transducer and is in electrical connection with electronic components via the upper surface of the substrate 124. In some embodiments, the electrical connection is achieved via a flexible terminal 132 which is electrically connected to the substrate 124.
  • the earpiece module 130 may in some embodiments be provided with power and input signals via the substrate 124.
  • the earpiece module 130 is in some other embodiments electrically connected to the substrate 124 via spring contacts or leaf contacts not shown.
  • the earpiece module 130 may be electrically connected to the substrate 124 via a soldered connection or another suitable type of connection.
  • the earpiece module 130 in some embodiments comprises an air displacement component that is configured to move upon application of an electrical signal.
  • the air displacement component for example a diaphragm, in these embodiments has a front surface and a back surface (not shown).
  • the earpiece module 130 may in some embodiments comprise a different type of air displacement component.
  • the earpiece module 130 may comprise a piezo-electric transducer, a ceramic transducer or an electrostatic transducer.
  • the housing of the mobile phone 10 may comprise an aperture or sound hole 104.
  • the sound hole 104 in these embodiments is acoustically coupled to the earpiece module 130.
  • the upper surface 126 of the substrate 124 in some embodiments, as shown in Figure 2, faces generally towards the sound hole 104 and the lower surface 128 of the substrate faces generally away from the sound hole 104.
  • the air displacement component is in some embodiments provided between the upper surface of the substrate 124 and the sound hole 104.
  • a front volume 142 may in these embodiments be defined within the housing and acoustically coupled with the front surface of the air displacement component and the sound hole 104. The sound waves propagating from the front surface of the air displacement component may thus in some embodiments pass through the front cavity 142 and the sound hole 104.
  • the rear of earpiece module 130 in some embodiments faces the upper surface of the substrate. Sound waves propagating from the back surface of the air displacement component may be transferred through the internal phone volume using the rear surface of the earpiece module 130. In some embodiments, the sound waves propagating from the back surface of the air displacement component may pass through a cavity which is substantially sealed by the gasket 148 and propagate through a leakage channel before the internal phone volume. This is described in further detail later in the application.
  • the earpiece module 130 in some embodiments may be mounted within an enclosure 134.
  • the enclosure 134 in these embodiments encloses the earpiece module 130 either substantially or partially around its perimeter.
  • the enclosure 134 may in some embodiments be formed as part of the outer cover 100 or alternatively in some embodiments as part of the display region 102 or in other embodiments as the A-cover of the mobile phone 10.
  • the enclosure 134 may be a separate part constructed by using any suitable manufacturing techniques and may use a housing gasket 136 and a mechanical support element 138 which is constructed as part of the display region 102.
  • other suitable manufacturing techniques may be used to secure the enclosure 134 such as gluing, adhesive tape, heatstaking or ultrasonic welding process.
  • the earpiece module 130 may include additional structural or housing elements
  • the enclosure 134 comprises at least one support portion 140 for supporting the earpiece module around a perimeter of its front surface, either substantially or partially.
  • the support portion(s) may support the earpiece module 130 in a way that the front of the earpiece module 130 is disposed a predetermined distance under the lower surface 144 of the enclosure 134 where the sound hole 104 is positioned.
  • a front cavity 142 may be provided in such embodiments between the front of the earpiece module 130 and the lower surface 144 of the enclosure 134.
  • the front of the earpiece module 130 is in some embodiments in sealed connection against the support portion 140 of the enclosure 134, around the earpiece module 130 entire perimeter.
  • the sealed connection in some embodiments may be achieved using a suitable sealing material and may be a gasket 146.
  • the sealing material in some embodiments may be constructed within the enclosure 134 or may be constructed around the outer surface of the earpiece module 130. Consequently, in such embodiments sound waves are unable to flow directly from the front cavity to a rear side of the earpiece module 130 or vice versa. The frequency response of the earpiece module 130 is therefore kept constant.
  • the enclosure 134 in other embodiments may take any suitable configuration wherein the front of the earpiece speaker module may be supported, sealed and enclosed relative to the top surface of the housing of the mobile phone 10 where the sound hole 104 is positioned.
  • the sound hole 104 may be constructed under a bezel (not shown) which may substantially or partially hide the sound hole.
  • the sound hole 104 may be substantially or partially constructed under a suitable grill or mesh structure which may take various forms, shapes or materials and which may be designed in relation to the frequency response of the earpiece speaker module 130.
  • a filter or mesh structure 154 is provided in front of the sound hole 104.
  • the mesh structure 154 is configured to protect the earpiece module 130 against dust, water and other type of environmental conditions entering through the sound hole 104. The product reliability is therefore improved over apparatus without such mesh structures 154.
  • the acoustic properties of the mesh structure 154 may in some embodiments be chosen in relation to the frequency response of the earpiece module 130.
  • the characteristics of the mesh structure 154 such as acoustic transparency, density, softness may be suitably defined.
  • one or more than one gasket 148 may be provided between the enclosure 134 and the flexible terminal 132.
  • the gasket is provided between the enclosure 134 and the upper surface 126 of the substrate 124.
  • the gasket 148 may provide a seal either partially or substantially and in some embodiments the sealing feature may be uniform and air tight.
  • the sealing feature of the gasket 148 in some embodiments depends on other acoustic arrangements of the earpiece module 130. It is understood that in such embodiments as described above a rear cavity 150 is formed for the earpiece module 130.
  • the gasket 148 in some embodiments may be located on a flat surface 152 of the enclosure 134.
  • uppermost and lowermost surfaces of the gasket 148 are generally planar which allows the gasket 148 to form good seals with any horizontal planar surfaces into which they are brought in contact.
  • the gaskets according to embodiments are designed to be compressible when operational, and can be made of any suitable material such as poron, foam which may comprise polymeric composites, fillers and fibres, silicone, acrylic, rubber, EPDM, polyethylene, neoprene, vinyl nitrile.
  • the characteristics of the gasket such as acoustic transparency, density, softness may be suitably defined.
  • the gasket may comprise a suitably arranged adhesive tape which can be made of any suitable material such as rubber, acrylic, silicone.
  • the gaskets may not be separate entities but may instead be formed by treating suitable parts of the mobile phone.
  • the rear cavity 150 in some embodiments may affect the electro-acoustic characteristics of the earpiece module 130 and may influence the frequency response.
  • a leakage channel 156 may be formed within the side walls of the enclosure 134.
  • FIG. 3 shows a schematic cross-sectional view through the mobile phone 10 of Figure 1 at the dashed line denoted "B". Reference numerals are retained from previous Figures for like elements.
  • the physical dimensions of the leakage channel, which defines parameters of the leakage channel 156 may be set so as to obtain a desired frequency response for the earpiece module 130.
  • a suitably designed leakage channel 156 may result in less damping, prevent any possible sensitivity reduction and furthermore maintains the electro-acoustic characteristics to be similar to the open rear of earpiece module 130.
  • the characteristics of the leakage channel may be set in some embodiments so as to provide a suitable degree of smoothing of the frequency response for the earpiece module.
  • the design of the physical dimensions of the leakage channel may provide a relatively flat frequency response and therefore may reduce the requirement for digital signal processing of the input signal to the earpiece module 130. The flatter frequency response may further reduce the overall amount of processing performed by the mobile phone 10, and in some embodiments digital signal processing may be avoided altogether.
  • the physical dimensions of the leakage channel 156 may be large which may allow dust or other particles to reach the earpiece module 130. In these embodiments in order to minimize or completely eliminate particles from reaching the earpiece module 130 a second filter or mesh structure, a leakage channel mesh structure 158, may be suitably constructed.
  • the leakage channel mesh structure 158 may take any suitable shape and material.
  • the characteristics of the leakage channel mesh structure 158 such as acoustic transparency, density, softness may be suitably defined. Whilst the leakage channel mesh structure 158 protects the earpiece speaker module 130 against dust, water and other particles, the acoustic properties of the mesh structure 158 may be set in some embodiments so as to improve the frequency response of the earpiece speaker module 130.
  • the leakage channel 156 may be supported by a protective mesh or other porous material.
  • Figure 4 shows the frequency response 160 of a 'conventional' earpiece design, where the rear of the earpiece module is left open.
  • the earpiece module is a conventional moving coil transducer positioned between the upper surface 126 of the substrate 124 and the enclosure 134.
  • the physical distance between the substrate 124 and the display region 102 may therefore be small in comparison to the full height of the mobile phone 10.
  • a first peak of the frequency response shown in figure 4 at around 500 Hz, and is due to the acoustic resonance of the earpiece module 130.
  • a second peak of the frequency response shown in figure 4 is in the region of 1.6 kHz and results from the resonance of a high leakage volume formed by a high leak coupler used when measuring the frequency response.
  • the high leak coupler is measurement equipment and used when measuring the frequency response of the earpiece module 130.
  • the skilled person would understand that alternative acoustic measurement conditions may comprise a low leak coupler, a sealed coupler or a dummy head.
  • the third peak of the frequency response shown in figure 4 is around 6 kHz and is due to the Helmholtz resonance of air volume formed by a combination of the front volume 142 and the sound hole 104.
  • Figure 4 further shows by a dashed frequency response plot 162 the frequency response produced by some embodiments where the rear of earpiece module 130 is uniformly sealed and without any leakage channel.
  • the uniform sealing is produced in some embodiments as described above by using the gasket 148.
  • the use of the gasket 148 in some embodiments may cause a reduction in sensitivity as a result of the damping effect caused by the gasket sealing and may change the acoustic characteristics of the earpiece module 130.
  • Figure 5 shows the same frequency response of a 'conventional' earpiece design, where the rear of the earpiece module is left open by the line 160 and also shows the frequency response plot 164 by the dashed line the frequency response produced by some embodiments where the rear of earpiece module 130 is uniformly sealed by a gasket 148 but having a leakage channel 156.
  • the provision of the leakage channel 156 from the rear cavity 150 enables the earpiece module 130 in these embodiments to have a frequency response 164 similar and potentially more sensitive than the frequency response of the 'conventional' design with an open rear earpiece module.
  • the frequency response such as the frequency response shown in figure 5 by the dashed line 164, may be tuned in some embodiments as required by altering parameters of the various part of the acoustic system including, for example, the air volume of the front cavity 142, the dimensions of the sound hole 104, the air volume of the rear cavity 150 and the dimensions of the leakage channel 156. Also, the integration between the different parts of the acoustic system, as well as the shapes of the various apertures, and the materials used may in some embodiments affect the generated frequency response.
  • earpiece module 130 within the mobile phone 10 is an example system only and that as described above in some embodiments the generation of a seal by the use of a gasket and in further embodiments by the introduction of a leakage conduit channel 156 may be implemented in various systems not explicitly mentioned above.
  • the frequency response shown in figure 5 by the dashed line 164 is an example measurement result which is related to the example embodiment shown in Figure 3 and that various other frequency responses having alternative characteristics are not excluded by the invention.
  • the gasket 148 may comprise a controlled leakage channel. In such embodiments an additional leakage channel may not be required within the enclosure 134.
  • the gasket leakage channel may still be supported in some embodiments by a suitably designed protective mesh or other porous material.
  • the gasket 148 may be compressible and partially or substantially seal the rear surface of the earpiece module 130 against the first surface of the substrate and accordingly forms an acoustic cavity. In these embodiments the operation of the gasket 148 to produce a controlled leakage channel maintains the general performance of the earpiece module 130 in operation, such as during a speech call.
  • a suitably designed controlled leakage channel may result in less damping and prevents any sensitivity reduction.
  • the characteristics of the controlled leakage channel may in some embodiments be selected so as to provide a suitable degree of smoothing and to prevent a reduction in sensitivity as a result of damping which can be seen clearly in Figure 4.
  • a cross sectional view through the mobile terminal 10 of Figure 1 at the dashed line denoted "B" for some other embodiments is shown.
  • the gasket 148 is uniform and the enclosure 134 are provided without any leakage channel.
  • a leakage channel may be provided within the substrate 124 by a substrate leakage channel 156.
  • the substrate leakage channel 156 may in some embodiments be covered by a mesh structure 158 to protect against particle and dust entering the earpiece module 130.
  • any suitable filter may be used to protect against particles and dust entering the earpiece module 130 instead and/or as well as the mesh structure.
  • the substrate leakage channel 156 may in these embodiments further be suitably formed throughout the flexible terminal 132 and the substrate 124.
  • the shape, material and location of the gasket 148 and the mesh structure 158 may be selected based on the requirements of the designer of the mobile phone 10. For example, in some embodiments the shape and location of the gasket may be chosen so as to fit around the locations of other internal components (not shown) of the mobile phone 10.
  • the embodiments described with reference to Figures 1 to 6 are not leak tolerant design, however, according to alternative embodiments, additional sound hole/s may be provided on the A-cover near to the main sound hole 104. This may result in a leak tolerant acoustic system.
  • a suitably designed leak tolerant system may improve the sound quality of the earpiece module 130 because its low frequency performance may still be good without sealing the earpiece area against the user's ear and the frequency response becomes more independent of how the earpiece area is positioned against the ear.
  • the fluid present within the configurations shown in the above figures is air, it would be appreciated that other fluids may be used to conduct the acoustic waves role in the acoustic system.
  • the mobile phone 10 may comprise analogue and digital components configured to drive the earpiece module 130.
  • the mobile phone 10 thus in these embodiments may further comprise a digital signal processing (DSP) component.
  • DSP digital signal processing
  • the mobile phone 10 in same or other embodiments may comprise a microprocessor or processor configured to control and carry out the operations of the mobile phone 10.
  • the mobile phone may comprise a battery configured to power the electrical components of the mobile phone 10, such as for example the DSP component and processor.
  • the analogue and digital components configured to drive the earpiece module 130 may be in communication with the DSP component and with the microprocessor.
  • the DSP and/or the microprocessor may control the analogue and digital components configured to drive the earpiece module 130 to provide driving signals to the earpiece module 130.
  • the DSP component and/or the microprocessor may adjust signals fed to the earpiece module 130, for example by providing an at least one of: an equalizer function, a gain control, a dynamic range controller, an excessive diaphragm movement prevention.
  • the operation of the DSP module and/or the microprocessor may in some embodiments improve performance of audio playback.
  • Other alternative configurations are conceivable and are within the scope of this disclosure.
  • the embodiments described with reference to Figures 1 to 6 comprise the transducer/earpiece module 130 and the substrate 124 configured to provide an electrical interface to the earpiece module 130.
  • the substrate is furthermore configured to form a partially or substantially sealed rear cavity 150 defined by one surface of the transducer and one surface of the substrate.
  • the substrate may provide an electrical interface oniy.
  • the earpiece module/transducer 130 may be surrounded by a suitably designed housing structure.
  • the rear cavity 150 may in these embodiments be defined by the housing structure and the earpiece module/transducer 130.
  • the housing structure may in these embodiments further comprise the leakage conduit channel 156.
  • the housing structure may further comprise a filter for the leakage conduit configured to prevent particles from passing through the leakage conduit. It is understood that in such embodiments at least a substantial protection for the earpiece module 130 against dust and other small particles may be achieved.
  • a mobile phone 10 in some embodiments may comprise one or more of the transducers as described above.
  • apparatus comprising: a transducer comprising an air displacement component that is configured to move upon application of an electrical signal; a base comprising a first surface; a seal configured to seal a volume defined by the transducer and base first surface; and at least one leakage conduit, wherein the at least one leakage conduit is configured to provide a partial opening for the volume defined by the transducer and the first surface of the base.
  • mobile phone or user equipment is intended to cover any suitable type of equipment with an earpiece or speaker configuration, such as mp3 players, radio receivers and transceivers, and portable data processing devices or portable web browsers with audio capabilities.
  • acoustic sound channels is intended to cover sound outlets, channels and cavities, and that such sound channels may be formed integrally with the transducer, or as part of the mechanical integration of the transducer with the device.
  • circuitry refers to all of the following:
  • circuits and software and/or firmware
  • combinations of circuits and software such as: (i) to a combination of processor(s) or (ii) to portions of processor(s)/software (including digital signal processor(s)), software, and memory(ies) that work together to cause an apparatus, such as a mobile phone or server, to perform various functions and (c) to circuits, such as a microprocessor(s) or a portion of a microprocessor(s), that require software or firmware for operation, even if the software or firmware is not physically present.
  • circuitry' applies to all uses of this term in this application, including any claims.
  • the term 'circuitry' would also cover an implementation of merely a processor (or multiple processors) or portion of a processor and its (or their) accompanying software and/or firmware.
  • the term 'circuitry' would also cover, for example and if applicable to the particular claim element, a baseband integrated circuit or applications processor integrated circuit for a mobile phone or similar integrated circuit in server, a cellular network device, or other network device.

Abstract

La présente invention concerne un appareil équipé d’un transducteur comprenant un composant à déplacement d’air qui est configuré pour se déplacer en cas d’application d’un signal électrique, d’une base comprenant une première surface, d’un joint configuré pour sceller un volume défini par le transducteur et la première surface de la base, et au moins d’une conduite de fuite. La ou les conduites de fuite sont configurées pour disposer d’une ouverture partielle pour le volume défini par le transducteur et la première surface de la base.
PCT/EP2009/060118 2009-08-04 2009-08-04 Appareil WO2011015236A1 (fr)

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WO2011015236A1 true WO2011015236A1 (fr) 2011-02-10

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Cited By (6)

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US8644530B2 (en) 2011-09-29 2014-02-04 Nokia Corporation Dust protection of sound transducer
US8670586B1 (en) 2012-09-07 2014-03-11 Bose Corporation Combining and waterproofing headphone port exits
CN104104754A (zh) * 2013-04-04 2014-10-15 三星电子株式会社 受话器以及具有该受话器的移动终端装置
US9301040B2 (en) 2014-03-14 2016-03-29 Bose Corporation Pressure equalization in earphones
WO2018057372A1 (fr) * 2016-09-21 2018-03-29 Microsoft Technology Licensing, Llc Dispositif audio à affichage mobile
US20190116406A1 (en) * 2014-05-20 2019-04-18 Samsung Display Co., Ltd. Display apparatus

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US5953414A (en) * 1996-11-14 1999-09-14 Alcatel Piezo-electric speaker capsule for telephone handset
US20040084242A1 (en) * 2002-10-28 2004-05-06 Star Micronics Co., Ltd. Electromagnetic electroacoustic transducer

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Publication number Priority date Publication date Assignee Title
US5953414A (en) * 1996-11-14 1999-09-14 Alcatel Piezo-electric speaker capsule for telephone handset
US20040084242A1 (en) * 2002-10-28 2004-05-06 Star Micronics Co., Ltd. Electromagnetic electroacoustic transducer

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9473838B2 (en) 2011-09-29 2016-10-18 Nokia Technologies Oy Dust protection of sound transducer
US8644530B2 (en) 2011-09-29 2014-02-04 Nokia Corporation Dust protection of sound transducer
US8670586B1 (en) 2012-09-07 2014-03-11 Bose Corporation Combining and waterproofing headphone port exits
WO2014039384A1 (fr) * 2012-09-07 2014-03-13 Bose Corporation Combinaison et imperméabilisation vis-à-vis de l'eau de sorties d'orifice d'écouteur
CN104756518B (zh) * 2012-09-07 2018-08-17 伯斯有限公司 耳机以及装配包括电声换能器、壳体以及板的耳机的方法
CN104756518A (zh) * 2012-09-07 2015-07-01 伯斯有限公司 组合及防水的耳机端口出口
US9668040B2 (en) 2013-04-04 2017-05-30 Samsung Electronics Co., Ltd Receiver and mobile terminal device having the same
EP2787412A3 (fr) * 2013-04-04 2014-11-05 Samsung Electronics Co., Ltd Récepteur, terminal mobile ayant celui-ci, et procédé de fabrication du terminal mobile
CN104104754A (zh) * 2013-04-04 2014-10-15 三星电子株式会社 受话器以及具有该受话器的移动终端装置
US9301040B2 (en) 2014-03-14 2016-03-29 Bose Corporation Pressure equalization in earphones
US20190116406A1 (en) * 2014-05-20 2019-04-18 Samsung Display Co., Ltd. Display apparatus
CN111128059A (zh) * 2014-05-20 2020-05-08 三星显示有限公司 显示设备
CN111128059B (zh) * 2014-05-20 2021-11-23 三星显示有限公司 显示设备
US11310576B2 (en) 2014-05-20 2022-04-19 Samsung Display Co., Ltd. Display apparatus
WO2018057372A1 (fr) * 2016-09-21 2018-03-29 Microsoft Technology Licensing, Llc Dispositif audio à affichage mobile
US9942635B1 (en) 2016-09-21 2018-04-10 Microsoft Technology Licensing, Llc Audio device with movable display

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