WO2011009680A3 - Optoelectronic unit, and method for the production of such a unit - Google Patents

Optoelectronic unit, and method for the production of such a unit Download PDF

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Publication number
WO2011009680A3
WO2011009680A3 PCT/EP2010/058516 EP2010058516W WO2011009680A3 WO 2011009680 A3 WO2011009680 A3 WO 2011009680A3 EP 2010058516 W EP2010058516 W EP 2010058516W WO 2011009680 A3 WO2011009680 A3 WO 2011009680A3
Authority
WO
WIPO (PCT)
Prior art keywords
unit
optoelectronic
production
base
component
Prior art date
Application number
PCT/EP2010/058516
Other languages
German (de)
French (fr)
Other versions
WO2011009680A2 (en
Inventor
Svetlana Levchuk
Gerhard Mitic
Original Assignee
Osram Gesellschaft mit beschränkter Haftung
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Gesellschaft mit beschränkter Haftung filed Critical Osram Gesellschaft mit beschränkter Haftung
Publication of WO2011009680A2 publication Critical patent/WO2011009680A2/en
Publication of WO2011009680A3 publication Critical patent/WO2011009680A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Laminated Bodies (AREA)

Abstract

An optoelectronic unit (10) comprises an optoelectronic component (1) and a base (11) therefor, said base (11) being used to dissipate the waste heat generated by the component (1). The base (11) has a layer (1) which adjoins the component (1) and is made of a composite material composed of a metal matrix and a reinforcement material that is embedded in the metal matrix.
PCT/EP2010/058516 2009-07-21 2010-06-17 Optoelectronic unit, and method for the production of such a unit WO2011009680A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200910034082 DE102009034082A1 (en) 2009-07-21 2009-07-21 Optoelectronic assembly and method for producing such a unit
DE102009034082.3 2009-07-21

Publications (2)

Publication Number Publication Date
WO2011009680A2 WO2011009680A2 (en) 2011-01-27
WO2011009680A3 true WO2011009680A3 (en) 2011-03-31

Family

ID=43383927

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2010/058516 WO2011009680A2 (en) 2009-07-21 2010-06-17 Optoelectronic unit, and method for the production of such a unit

Country Status (2)

Country Link
DE (1) DE102009034082A1 (en)
WO (1) WO2011009680A2 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0898310A2 (en) * 1997-08-19 1999-02-24 Sumitomo Electric Industries, Ltd. Heat sink for semiconductors and manufacturing process thereof
EP1124259A2 (en) * 2000-02-11 2001-08-16 ABB Semiconductors AG Cooling device for a high power semiconductor module
US20020150133A1 (en) * 1999-02-04 2002-10-17 Takeshi Aikiyo Mounting structure for semiconductor laser module
EP1821342A1 (en) * 2004-12-08 2007-08-22 A.L.M.T. Corp. Heat sink material, method for manufacturing such heat sink material, and semiconductor laser device
EP1862298A1 (en) * 2005-03-23 2007-12-05 Totankako Co., Ltd. Metal substrate/metal impregnated carbon composite material structure and method for manufacturing said structure
WO2009052814A2 (en) * 2007-10-26 2009-04-30 Dirk Lorenzen Cooling device for semiconductor elements, semiconductor cooling arrangement and method for producing the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6055154A (en) 1998-07-17 2000-04-25 Lucent Technologies Inc. In-board chip cooling system
US6498355B1 (en) 2001-10-09 2002-12-24 Lumileds Lighting, U.S., Llc High flux LED array
DE10234995A1 (en) 2002-07-31 2004-02-12 Osram Opto Semiconductors Gmbh Light diode arrangement including laser diodes for illumination and signaling has thermal chip connection and light diode module
US7253502B2 (en) 2004-07-28 2007-08-07 Endicott Interconnect Technologies, Inc. Circuitized substrate with internal organic memory device, electrical assembly utilizing same, and information handling system utilizing same
DE102004036960A1 (en) 2004-07-30 2006-03-23 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Printed circuit board and method for producing such a printed circuit board
DE102005063106A1 (en) 2005-12-30 2007-07-05 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Opto-electronic semiconductor chip e.g. laser diode chip, has semiconductor body including radiation penetration surface that is covered by passivation layer, where passivation layer contains material e.g. aluminum nitride

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0898310A2 (en) * 1997-08-19 1999-02-24 Sumitomo Electric Industries, Ltd. Heat sink for semiconductors and manufacturing process thereof
US20020150133A1 (en) * 1999-02-04 2002-10-17 Takeshi Aikiyo Mounting structure for semiconductor laser module
EP1124259A2 (en) * 2000-02-11 2001-08-16 ABB Semiconductors AG Cooling device for a high power semiconductor module
EP1821342A1 (en) * 2004-12-08 2007-08-22 A.L.M.T. Corp. Heat sink material, method for manufacturing such heat sink material, and semiconductor laser device
EP1862298A1 (en) * 2005-03-23 2007-12-05 Totankako Co., Ltd. Metal substrate/metal impregnated carbon composite material structure and method for manufacturing said structure
WO2009052814A2 (en) * 2007-10-26 2009-04-30 Dirk Lorenzen Cooling device for semiconductor elements, semiconductor cooling arrangement and method for producing the same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
KERNS J A ET AL: "DYMALLOY: A COMPOSITE SUBSTRATE FOR HIGH POWER DENSITY ELECTRONIC COMPONENTS", INTERNATIONAL JOURNAL OF MICROCIRCUITS AND ELECTRONIC PACKAGING, INTERNATIONAL MICROELECTRONICS & PACKAGING SOCIETY, US, vol. 19, no. 3, 1 July 1996 (1996-07-01), pages 206 - 211, XP000639483, ISSN: 1063-1674 *

Also Published As

Publication number Publication date
WO2011009680A2 (en) 2011-01-27
DE102009034082A1 (en) 2011-01-27

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