WO2010138104A1 - Systems and methods for plasma application - Google Patents

Systems and methods for plasma application Download PDF

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Publication number
WO2010138104A1
WO2010138104A1 PCT/US2009/005398 US2009005398W WO2010138104A1 WO 2010138104 A1 WO2010138104 A1 WO 2010138104A1 US 2009005398 W US2009005398 W US 2009005398W WO 2010138104 A1 WO2010138104 A1 WO 2010138104A1
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WO
WIPO (PCT)
Prior art keywords
plasma
electrode
inner electrode
ionizable media
plasma device
Prior art date
Application number
PCT/US2009/005398
Other languages
French (fr)
Inventor
Il-Gyo Koo
Cameron A. Moore
George J. Collins
Jin-Hoon Cho
Original Assignee
Colorado State University Research Foundation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Colorado State University Research Foundation filed Critical Colorado State University Research Foundation
Priority to EP09845329.3A priority Critical patent/EP2435607B1/en
Priority to AU2009347179A priority patent/AU2009347179B2/en
Priority to JP2012513022A priority patent/JP2012528453A/en
Priority to CA2763869A priority patent/CA2763869A1/en
Publication of WO2010138104A1 publication Critical patent/WO2010138104A1/en

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Classifications

    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B18/00Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
    • A61B18/04Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by heating
    • A61B18/042Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by heating using additional gas becoming plasma
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32348Dielectric barrier discharge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32532Electrodes
    • H01J37/3255Material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00Generating plasma; Handling plasma
    • H05H1/24Generating plasma
    • H05H1/2406Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00Generating plasma; Handling plasma
    • H05H1/24Generating plasma
    • H05H1/2406Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
    • H05H1/2418Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the electrodes being embedded in the dielectric
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00Generating plasma; Handling plasma
    • H05H1/24Generating plasma
    • H05H1/2406Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
    • H05H1/2443Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the plasma fluid flowing through a dielectric tube
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/513Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using plasma jets
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00Generating plasma; Handling plasma
    • H05H1/24Generating plasma
    • H05H1/2406Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
    • H05H1/2431Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes using cylindrical electrodes, e.g. rotary drums
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00Generating plasma; Handling plasma
    • H05H1/24Generating plasma
    • H05H1/2406Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
    • H05H1/2443Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the plasma fluid flowing through a dielectric tube
    • H05H1/245Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the plasma fluid flowing through a dielectric tube the plasma being activated using internal electrodes

Definitions

  • the present disclosure relates to plasma devices and processes for surface processing and material removal or deposition. More particularly, the disclosure relates to an apparatus and method for generating and directing chemically reactive, plasma-generated species in a plasma device along with excited-state species (e.g., energetic photons) that are specific to the selected ingredients.
  • excited-state species e.g., energetic photons
  • Plasmas have the unique ability to create large amounts of chemical species, such as ions, radicals, electrons, excited-state (e.g., metastable) species, molecular fragments, photons, and the like.
  • the plasma species may be generated in a variety of internal energy states or external kinetic energy distributions by tailoring plasma electron temperature and electron density.
  • adjusting spatial, temporal and temperature properties of the plasma creates specific changes to the material being irradiated by the plasma species and associated photon fluxes.
  • Plasmas are also capable of generating photons including energetic ultraviolet photons that have sufficient energy to initiate photochemical and photocatalytic reaction paths in biological and other materials that are irradiated by the plasma photons.
  • Plasmas have broad applicability to provide alternative solutions to industrial, scientific and medical needs, especially workpiece surface processing at low temperature. Plasmas may be delivered to a workpiece, thereby affecting multiple changes in the properties of materials upon which the plasmas impinge. Plasmas have the unique ability to create large fluxes of radiation (e.g., ultraviolet), ions, photons, electrons and other excited- state (e.g., metastable) species which are suitable for performing material property changes with high spatial, material selectivity, and temporal control.
  • radiation e.g., ultraviolet
  • ions ions, photons, electrons and other excited- state (e.g., metastable) species which are suitable for performing material property changes with high spatial, material selectivity, and temporal control.
  • Plasmas may also remove a distinct upper layer of a workpiece but have little or no effect on a separate underlayer of the workpiece or it may be used to selectively remove a particular tissue from a mixed tissue region or selectively remove a tissue with minimal effect to adjacent organs of different tissue type.
  • One suitable application of the unique chemical species is to drive non- equilibrium or selective chemical reactions at or within the workpiece to provide for selective removal of only certain types of materials.
  • Such selective processes are especially sought in biological tissue processing (e.g., mixed or multi-layered tissue), which allows for cutting and removal of tissue at low temperatures with differential selectivity to underlayers and adjacent tissues. This is particularly useful for removal of biofilms, mixtures of fatty and muscle tissue, debridement of surface layers and removing of epoxy and other non-organic materials during implantation procedures.
  • the plasma species are capable of modifying the chemical nature of tissue surfaces by breaking chemical bonds, substituting or replacing surface-terminating species (e.g., surface functionalization) through volatilization, gasification or dissolution of surface materials (e.g., etching). With proper techniques, material choices and conditions, one can remove one type of tissue entirely without affecting a nearby different type of tissue. Controlling plasma conditions and parameters (including S-parameters, V, I, ⁇ , and the like) allows for the selection of a set of specific particles, which, in turn, allows for selection of chemical pathways for material removal or modification as well as selectivity of removal of desired tissue type.
  • the present disclosure provides for a system and method for creating plasma under a broad range of conditions including tailored geometries, various plasma feedstock media, number and location of electrodes and electrical excitation parameters (e.g., voltage, current, phase, frequency, pulse condition, etc.).
  • tailored geometries including tailored geometries, various plasma feedstock media, number and location of electrodes and electrical excitation parameters (e.g., voltage, current, phase, frequency, pulse condition, etc.).
  • the supply of electrical energy that ignites and sustains the plasma discharge is delivered through substantially conductive electrodes that are in contact with the ionizable media and other plasma feedstocks.
  • the present disclosure also provides for methods and apparatus that utilize specific electrode structures that improve and enhance desirable aspects of plasma operation such as higher electron temperature and higher secondary emission, hi particular, the present disclosure provides for porous media for controlled release of chemical reactants.
  • a plasma system includes a plasma device, an ionizable media source, and a power source.
  • the plasma device includes an inner electrode and an outer electrode coaxially disposed around the inner electrode.
  • the inner electrode includes a distal portion and an insulative layer that covers at least a portion of the inner electrode.
  • the ionizable media source is coupled to the plasma device and is configured to supply ionizable media thereto.
  • the power source is coupled to the inner and outer electrodes, and is configured to ignite the ionizable media at the plasma device to form a plasma effluent having an electron sheath layer about the exposed distal portion.
  • the insulative layer may be configured to limit the plasma effluent to the exposed distal portion and to provide a source of secondarily-emitted electrons that form at least a portion of the electron sheath layer.
  • the insulative layer may be formed from a material having a secondary electron emission yield from about 1 to about 10.
  • the inner electrode may be formed from a conductive metal and the insulative layer may be a metallic oxide of the conductive metal.
  • the plasma device further includes an electrode spacer.
  • the electrode spacer is disposed between the inner and outer electrodes.
  • the electrode spacer includes a central opening defined therein and is adapted for insertion of the inner electrode therethrough.
  • the electrode spacer includes at least one flow opening defined therein and is configured to receive the flow of the ionizable media.
  • the at least one flow opening may be disposed radially around the central opening.
  • a plasma device includes outer and inner electrodes.
  • the plasma device is configured to receive ionizable media.
  • the outer electrode has a substantially cylindrical tubular shape.
  • the inner electrode is coaxially disposed within the outer electrode.
  • the inner electrode includes a distal portion and an insulative layer.
  • the insulative layer covers at least a portion of the inner electrode.
  • the insulative layer is configured to limit the plasma effluent to the exposed distal portion and provide a source of secondarily-emitted electrons to form an electron sheath layer about the exposed distal portion.
  • the insulative layer may be from a material having a secondary electron emission yield from about 1 to about 10.
  • the inner conductor may be formed from a conductive metal and the insulative layer may be a metallic oxide of the conductive metal.
  • the plasma device may further include an electrode spacer.
  • the electrode spacer is disposed between the inner and outer electrodes.
  • the electrode spacer may include at least one flow opening defined therein and is configured to receive the flow of the ionizable media.
  • the at least one flow opening may be disposed radially around the central opening.
  • a plasma system in yet another embodiment of the present disclosure, includes inner and outer electrodes, an ionizable media source, and a power source.
  • the outer electrode has a substantially cylindrical tubular shape.
  • the inner electrode is coaxially disposed within the outer electrode.
  • the inner electrode includes a distal portion and an insulative layer that covers at least a portion of the inner electrode.
  • the insulative layer is configured to limit the plasma effluent to the exposed distal portion and provides a source of secondarily-emitted electrons.
  • the ionizable media source is coupled to the plasma device and is configured to supply ionizable media thereto.
  • the power source is coupled to the inner and outer electrodes, and is configured to ignite the ionizable media at the plasma device to form a plasma effluent having an electron sheath layer of a predetermined thickness formed from the secondarily-emitted electrons.
  • the electron sheath layer is formed about the exposed distal portion.
  • the insulative layer may be formed from a material having a secondary electron emission yield from about 1 to about 10.
  • the inner conductor may be formed from a conductive metal and the insulative layer may be a metallic oxide of the conductive metal.
  • the plasma device may further include an electrode spacer disposed between the inner and outer electrodes.
  • the electrode spacer may include a central opening defined therein and may be adapted for insertion of the inner electrode therethrough.
  • the electrode spacer may include at least one flow opening defined therein and may be configured for the flow of the ionizable media.
  • the at least one flow opening may be disposed radially around the central opening.
  • the predetermined thickness of the electron sheath layer may be adjustable by selecting a specific ionizable media having a predetermined media density and an average particle cross-section.
  • the predetermined thickness of the electron sheath layer may be inversely proportional to the media density of the ionizable media and the average particle cross-section.
  • Fig. 1 is a schematic diagram of a plasma system according to the present disclosure
  • Fig. 2A is a perspective, cross-sectional view of a plasma device according to the present disclosure
  • Figs. 2B - 2D are side, cross-sectional views of the plasma device of Fig. 2A;
  • Fig. 3 is a side, cross-sectional view of the plasma device of Fig. 2 A;
  • Fig. 4 is a front, cross-sectional view of the plasma device of Fig. 2 A according to the present disclosure
  • FIG. 5 is an enlarged cross-sectional view of a plasma device according to the present disclosure.
  • Fig. 6 is an enlarged cross-sectional view of a plasma device according to one embodiment of the present disclosure
  • Fig. 7 is a front, cross-sectional view of the plasma device of Fig. 2 A according to the present disclosure
  • FIG. 8 is a perspective, cross-sectional view of a plasma device according to the present disclosure.
  • FIG. 9 is a perspective, cross-sectional view of a plasma device according to the present disclosure.
  • Fig. 10 is a perspective, cross-sectional view of a plasma device according to the present disclosure.
  • Fig. 1 IA is a perspective, cross-sectional view of a plasma device according to the present disclosure
  • Fig. 1 IB is a top view of a plasma device of Fig. 1 IA according to the present disclosure
  • Fig. 11C is a top view of a plasma device of Fig. 1 IB according to the present disclosure
  • Fig. 12A is a perspective, cross-sectional view of a plasma device according to the present disclosure
  • Fig. 12B is a top view of a plasma device of Fig. 12A according to the present disclosure
  • Fig. 13 is a perspective, cross-sectional view of a plasma device according to the present disclosure.
  • Fig. 14 is a schematic diagram of a plasma system according to one embodiment of the present disclosure.
  • Fig. 15 is a side, cross-sectional view of a plasma device according to the present disclosure.
  • FIG. 16 is a close-up, side view of a plasma device according to the present disclosure.
  • Figs. 17A and 17B are plots relating to electron emissions according to the present disclosure.
  • FIGS. 18 A, 18B, and 18C show charts illustrating several tissue effects of a plasma device according to the present disclosure
  • Fig. 19 is a flow chart diagram of a method of plasma tissue treatment according to the present disclosure.
  • Fig. 20 is a flow chart diagram of another method of plasma tissue treatment according to the present disclosure.
  • Fig. 21 shows a gray-scale photograph of a plasma discharge according to the present disclosure
  • Fig. 22 shows a gray-scale photograph of another plasma discharge according to the present disclosure
  • Fig. 23 shows a color photograph of the plasma discharge of Fig. 21 according to the present disclosure
  • Fig. 24 shows a color photograph of the plasma discharge of Fig. 22 according to the present disclosure.
  • Plasmas are generated using electrical energy that is delivered as either direct current (DC) electricity or alternating current (AC) electricity at frequencies from about 0.1 hertz (Hz) to about 100 gigahertz (GHz), including radio frequency ("RF", from about 0.1 MHz to about 100 MHz) and microwave (“MW", from about 0.1 GHz to about 100 GHz) bands, using appropriate generators, electrodes, and antennas.
  • DC direct current
  • AC alternating current
  • RF radio frequency
  • MW microwave
  • the performance of the plasma chemical generation, the delivery system and the design of the electrical excitation circuitry are interrelated ⁇ as the choices of operating voltage, frequency and current levels (as well as phase) effect the electron temperature and electron density.
  • choices of electrical excitation and plasma device hardware also determine how a given plasma system responds dynamically to the introduction of new ingredients to the host plasma gas or liquid media.
  • the corresponding dynamic adjustment of the electrical drive such as via dynamic match networks or adjustments to voltage, current, or excitation frequency may be used to maintain controlled power transfer from the electrical circuit to the plasma.
  • a plasma system 10 includes a plasma device 12 that is coupled to a power source 14, an ionizable media source 16 and a precursor source 18.
  • Power source 14 includes any suitable components for delivering power or matching impedance to plasma device 12. More particularly, the power source 14 may be any radio frequency generator or other suitable power source capable of producing power to ignite the ionizable media to generate plasma.
  • the plasma device 12 may be utilized as an electrosurgical pencil for application of plasma to tissue and the power source 14 may be an electrosurgical generator that is adapted to supply the device 12 with electrical power at a frequency from about 0.1 MHz to about 2,450 MHz and in another embodiment from about 1 MHz to about 13.56 MHz.
  • the plasma may also be ignited by using continuous or pulsed direct current (DC) electrical energy.
  • DC direct current
  • the precursor source 18 may be a bubbler or a nebulizer configured to aerosolize precursor feedstocks prior to introduction thereof into the device 12.
  • the precursor source 18 may also be a micro droplet or injector system capable of generating predetermined refined droplet volume of the precursor feedstock from about 1 femtoliter to about 1 nanoliter in volume.
  • the precursor source 18 may also include a microfluidic device, a piezoelectric pump, or an ultrasonic vaporizer.
  • the system 10 provides a flow of plasma through the device 12 to a workpiece
  • Plasma feedstocks which include ionizable media and precursor feedstocks, are supplied by the ionizable media source 16 and the precursor source 18, respectively, to the plasma device 12.
  • the precursor feedstock and the ionizable media are provided to the plasma device 12 where the plasma feedstocks are ignited to form plasma effluent containing ions, radicals, photons from the specific excited species and metastables that carry internal energy to drive desired chemical reactions in the workpiece "W” or at the surface thereof.
  • the feedstocks may be mixed upstream from the ignition point or midstream thereof (e.g., at the ignition point) of the plasma effluent, as shown in Fig. 1 and described in more detail below.
  • the ionizable media source 16 provides ionizable feedstock to the plasma device 12.
  • the ionizable media source 16 is coupled to the plasma device 12 and may include a storage tank and a pump (not explicitly shown).
  • the ionizable media may be a liquid or a gas such as argon, helium, neon, krypton, xenon, radon, carbon dioxide, nitrogen, hydrogen, oxygen, etc. and their mixtures, and the like, or a liquid. These and other gases may be initially in a liquid form that is gasified during application.
  • the precursor source 18 provides precursor feedstock to the plasma device 12.
  • the precursor feedstock may be either in solid, gaseous or liquid form and may be mixed with the ionizable media in any state, such as solid, liquid (e.g., particulates or droplets), gas, and the combination thereof.
  • the precursor source 18 may include a heater, such that if the precursor feedstock is liquid, it may be heated into gaseous state prior to mixing with the ionizable media.
  • the precursors may be any chemical species capable of forming reactive species such as ions, electrons, excited-state (e.g., metastable) species, molecular fragments (e.g., radicals) and the like, when ignited by electrical energy from the power source 14 or when undergoing collisions with particles (electrons, photons, or other energy-bearing species of limited and selective chemical reactivity) formed from ionizable media 16.
  • reactive species such as ions, electrons, excited-state (e.g., metastable) species, molecular fragments (e.g., radicals) and the like, when ignited by electrical energy from the power source 14 or when undergoing collisions with particles (electrons, photons, or other energy-bearing species of limited and selective chemical reactivity) formed from ionizable media 16.
  • the precursors may include various reactive functional groups, such as acyl halide, alcohol, aldehyde, alkane, alkene, amide, amine, butyl, carboxlic, cyanate, isocyanate, ester, ether, ethyl, halide, haloalkane, hydroxyl, ketone, methyl, nitrate, nitro, nitrile, nitrite, nitroso, peroxide, hydroperoxide, oxygen, hydrogen, nitrogen, and combination thereof.
  • reactive functional groups such as acyl halide, alcohol, aldehyde, alkane, alkene, amide, amine, butyl, carboxlic, cyanate, isocyanate, ester, ether, ethyl, halide, haloalkane, hydroxyl, ketone, methyl, nitrate, nitro, nitrile, nitrite, nitroso, peroxide, hydroperoxide, oxygen
  • the chemical precursors may be water, halogenoalkanes, such as dichloromethane, tricholoromethane, carbon tetrachloride, difluoromethane, trifluoromethane, carbon tetrafluoride, and the like; peroxides, such as hydrogen peroxide, acetone peroxide, benzoyl peroxide, and the like; alcohols, such as methanol, ethanol, isopropanol, ethylene glycol, propylene glycol, alkalines such as NaOH, KOH, amines, alkyls, alkenes, and the like.
  • halogenoalkanes such as dichloromethane, tricholoromethane, carbon tetrachloride, difluoromethane, trifluoromethane, carbon tetrafluoride, and the like
  • peroxides such as hydrogen peroxide, acetone peroxide, benzoyl peroxide, and the like
  • the precursors and their functional groups may be delivered to a surface to react with the surface species (e.g., molecules) of the workpiece "W.”
  • the functional groups may be used to modify or replace existing surface terminations of the workpiece "W.”
  • the functional groups react readily with the surface species due to their high reactivity and the reactivity imparted thereto by the plasma.
  • the functional groups are also reacted within the plasma volume prior to delivering the plasma volume to the workpiece.
  • Some functional groups generated in the plasma can be reacted in situ to synthesize materials that subsequently form a deposition upon the surface.
  • This deposition may be used for stimulating healing, killing bacteria, and increasing hydrophilic or hydroscopic properties.
  • deposition of certain function groups may also allow for encapsulation of the surface to achieve predetermined gas/liquid diffusion, e.g., allowing gas permeation but preventing liquid exchange, to bond or stimulate bonding of surfaces, or as a physically protective layer.
  • the precursor source 18 and the ionizable media source 16 may be coupled to the plasma device 12 via tubing 13a and 13b, respectively.
  • the tubing 13a and 13b may be combined into tubing 13c to deliver a mixture of the ionizable media and the precursor feedstock to the device 12 at a proximal end thereof. This allows for the plasma feedstocks, e.g., the precursor feedstock and the ionizable gas, to be delivered to the plasma device 12 simultaneously prior to ignition of the mixture therein.
  • the ionizable media source 16 and the precursors source 18 may be coupled to the plasma device 12 via the tubing 13a and 13b at separate connections, e.g., the first connection 31 and a second connection 29, respectively, such that the mixing of the feedstocks occurs within the plasma device 12 upstream from the ignition point.
  • the plasma feedstocks are mixed proximally of the ignition point, which may be any point between the respective sources 16 and 18 and the plasma device 12, prior to ignition of the plasma feedstocks to create the desired mix of the plasma effluent species for each specific surface treatment on the workpiece "W.”
  • the plasma feedstocks may be mixed midstream, e.g., at the ignition point or downstream of the plasma effluent, directly into the plasma. More specifically, the first and second connections 31, 29 may be coupled to the device 12 at the ignition point, such that the precursor feedstocks and the ionizable media are ignited concurrently as they are mixed (Fig. 1). It is also envisioned that the ionizable media may be supplied to the device 12 proximally of the ignition point, while the precursor feedstocks are mixed therewith at the ignition point.
  • the ionizable media may be ignited in an unmixed state and the precursors may be mixed directly into the ignited plasma.
  • the plasma feedstocks Prior to mixing, the plasma feedstocks may be ignited individually.
  • the plasma feedstock is supplied at a predetermined pressure to create a flow of the medium through the device 12, which aids in the reaction of the plasma feedstocks and produces a plasma effluent.
  • the plasma according to the present disclosure is generated at or near atmospheric pressure under normal atmospheric conditions.
  • the device 12 includes an inner electrode 22 disposed coaxially within an outer electrode 23.
  • the outer electrode 23 has a substantially cylindrical tubular shape having an opening 25 (Fig. 3) defined therein.
  • the inner electrode 22 has a substantially cylindrical shape (e.g., rod-shaped).
  • the electrodes 22 and 23 may be formed from a conductive material suitable for ignition of plasma such as metals and metal-ceramic composites. In one embodiment, the electrodes 22 and 23 may be formed from a conductive metal including a native oxide or nitride compound disposed thereon.
  • the device 12 also includes an electrode spacer 27 disposed between the inner and outer electrodes 22 and 23.
  • the electrode spacer 27 may be disposed at any point between the inner and outer electrodes 22 and 23 to provide for a coaxial configuration between the inner and outer electrodes 22 and 23.
  • the electrode spacer 27 includes a central opening 40 adapted for insertion of the inner electrode 22 therethrough and one or more flow openings 42 disposed radially around the central opening 40 to allow for the flow of ionizable media and precursors through the device 12.
  • the electrode spacer 27 may be frictionally fitted to the electrodes 22 and 23 to secure the inner electrode 22 within the outer electrode 23.
  • the electrode spacer 27 is slidably disposed over the inner electrode 22.
  • the electrode spacer 27 may be formed from a dielectric material, such as ceramic, to provide capacitive coupling between the inner and outer electrodes 22 and 23.
  • distal end of the inner electrode 22 may extend past the distal end of the outer electrode 23.
  • the inner electrode 22 may be fully enclosed by the outer electrode 23.
  • the distal end the inner electrode 22 may be flush with the distal end of the outer electrode 23 (Fig. 2C).
  • the inner electrode 22 may be recessed within the outer electrode 23 (e.g., distal end of the inner electrode 22 is within the opening 25 as shown in Fig. 2D).
  • the electrode spacer 27 is secured to the outer electrode 23 but is slidably disposed over the inner electrode 22.
  • the inner electrode 22 may move through the opening 40. This allows for the outer electrode 23 and the electrode spacer 27 to be longitudinally movable along the inner electrode 22 thereby controlling the exposure of the distal end of the inner electrode 22.
  • the inner and outer electrodes 22 and 23 may be fixated in a coaxial configuration using other fixation mechanisms (e.g., clamps) that allow for adjustment of the exposure distance of the inner electrode 22.
  • One of the electrodes 22 and 23 may be an active electrode and the other may be a neutral or return electrode to facilitate in RF energy coupling.
  • Each of the electrodes 22 and 23 are coupled to the power source 14 that drives plasma generation and electron sheath formation close to the inner electrode 22, such that the energy from the power source 14 may be used to ignite the plasma feedstocks flowing through the device 12. More specifically, the ionizable media and the precursors flow through the device 12 through the opening 25 (e.g., through the electrode spacer 27 and between the inner and outer electrodes 22 and 23).
  • the inner electrode 22 may also include one or more openings (not explicitly shown) therethrough to facilitate the flow of ionizable media and the precursors.
  • the inner electrode 22 includes a coating 24 that covers at least a portion of the inner electrode 22 leaving an exposed (e.g., uninsulated or uncoated) distal portion 27 of the inner electrode 22 uninsulated.
  • the coating 24 may be disposed on the outer electrode 23 as discussed in more detail below with respect to Figs. 4-7 and 16.
  • the coating 24 may be formed from an insulative or semiconductive material deposited as a film unto the inner conductor (e.g., atomic layer deposition) or as a dielectric sleeve or layer.
  • the insulative cover 24 may be a native metal oxide.
  • the coating 24 limits the plasma action to the distal portion 27 and provides for the creation of a plasma effluent 31 having an energetic electron sheath layer 33.
  • the sheath layer 33 has a reaching distance "d" from about 1 to about 10 mm, suitable for contacting the sheath layer 33 to the workpiece "W" to promote volatilization and/or modification of chemical bonds at the surface thereof as discussed in more detail below with respect to Figs. 16 - 24.
  • the coating 24 provides for capacitive coupling between the inner and outer electrodes 22 and 23.
  • the resulting capacitive circuit element structure provides for a net negative bias potential at the surface of the inner electrode 22, which attracts the ions and other species from the plasma effluent. These species then bombard the coating 24 and release the electrons generating the sheath layer 33.
  • the sheath layer 33 is generated in part by the materials of the electrodes 22 and 23 and in particular by the coating 24.
  • Materials having high secondary electron emission property, ⁇ include insulators and/or semiconductors. These materials have a relatively high ⁇ , where ⁇ represents the number of electrons emitted per incident bombardment particle.
  • metals generally have a low ⁇ (e.g., less than 0.1) while insulative and semiconductor materials, such as metallic oxides have a high ⁇ , from about 1 to about 10 with some insulators exceeding a value of 20.
  • the coating 24 acts as a source of secondary emitted electrons, in addition to limiting the plasma to the distal end of the inner electrode 22.
  • Secondary electron emission, ⁇ may be described by the formula (1):
  • T secondary is the electron flux
  • Fj 0n is the ion flux.
  • Secondary emission occurs due to the impacts of plasma species (ions) onto the coating 24 when the ion impact collisions have sufficient energy to induce secondary electron emission, thus generating ⁇ -mode discharges.
  • discharges are said to be in ⁇ -mode when electron generation occurs preferentially at electrode surfaces (i.e., ⁇ > 1) instead of in the gas (an ⁇ -mode discharge).
  • may also be thought of as a ratio of the r seCondary (e.g., the electron flux) and Fj 0n (e.g., the ion flux).
  • the coating 24 may thin or be removed during the plasma operation.
  • the coating 24 may be continually replenished during the plasma operation. This may be accomplished by adding species that reformulate the native coating 24 on the inner and outer electrodes 22 and 23.
  • the precursor source 18 may provide either oxygen or nitrogen gas to the device 12 to replenish to oxide or nitride coating.
  • Generation of the sheath layer 33 is also controlled by the supply of the ionizable media and the precursors. Ionizable media and the precursors are selected that are relatively transparent to the energetic electrons released during secondary emission from the surface of the inner electrode 22. As stated above, the plasma is generated at atmospheric pressure. Due to the increased entropy at such pressure, the generated electrons undergo a multitude of collisions in a relatively short period of time and space forming the sheath layer
  • the thickness of the sheath layer 33 is defined by a formula (2):
  • N is the number of scattering centers, which may be the molecules of the ionizable media, the precursors and the atmospheric gases.
  • N defines the media density.
  • the variable, ⁇ is the average particle cross-section of the scattering centers.
  • the thickness of the sheath layer 33 is inversely proportional to the product of N and ⁇ .
  • a lower ⁇ may be provided by using specific ionizable media compounds with molecules having a low cross-section, such as hydrogen and helium.
  • the variable N may be lowered by heating the ionizable media to reduce the gas density and limiting the amount of media provided to the lowest amount needed to sustain the plasma reaction.
  • the present disclosure also relates to systems and methods for generating plasma effluents having the energetic electron sheath layer having a reaching distance "d."
  • the sheath layer 33 is produced by the combination of disclosed electrode structures, specific gas species, electrode materials, proper excitation conditions, and other media parameters.
  • the propagation of energetic electron for mm-sized distances provides for practical applications on a variety of surfaces, such as modification of chemical bonds on the surface and volatilization of surface compounds.
  • the coating 24 is disposed on the outer surface of the inner electrode 22 and on the inner surface of the outer electrode 23.
  • the surfaces of the inner and outer electrodes 22 and 23 facing the opening 25 include the coating 24.
  • the coating 24 may cover the entire surface of the inner and outer electrodes 22 and 23 (e.g., outer and inner surface thereof, respectively).
  • the coating 24 may cover only a portion of the electrodes 22 and 23, such as a distal, proximal (e.g., Fig. 3 illustrates an uncoated distal portion 27) or middle portions thereof.
  • the coating 24 may be a native oxide, or a native nitride of the metal from which the inner and outer electrodes are formed, or may be a deposited layer or a layer formed by ion implantation.
  • the inner and outer electrodes 22 and 23 are formed from an aluminum alloy and the coating 24 is aluminum oxide (Al 2 O 3 ) or aluminum nitride (AlN).
  • the inner and outer electrodes 22 and 23 are formed from a titanium alloy and the coating 24 is titanium oxide (TiO 2 ) or titanium nitride (TiN).
  • the inner and outer electrodes 22 and 23 and the coating 24 may also be configured as a heterogeneous system.
  • the inner and outer electrodes 22 and 23 may be formed from any suitable electrode substrate material (e.g., conductive metal or a semiconductor) and the coating 24 may be disposed thereon by various coating processes.
  • the coating 24 may be formed on the inner and outer electrodes 22 and 23 by exposure to an oxidizing environment, anodization, electrochemical processing, ion implantation, or deposition (e.g., sputtering, chemical vapor deposition, atomic layer deposition, etc.).
  • the coating 24 on electrodes 22 and 23 may be different on each electrode and may serve separate purposes.
  • One coating 24 (e.g., on the electrode 22) can be selected to promote increased secondary electron emission while coating 24 on the other electrode (e.g., electrode 23) can be selected to promote specific chemical reactions (e.g., act as a catalyst).
  • the coating 24 may also include a plurality of nanostructure pores 60, which may be arranged in a predetermined (e.g., unidirectional) form (Fig. 5) or in a random configuration (Fig. 6). Pores 60 may be formed during the coating processes discussed above. In one illustrative embodiment, the pores 60 may be treated to include one or more types of precursor feedstock 62 disposed therein.
  • Fig. 7 shows a side cross-sectional view of a plasma device 41 having an inner electrode 42 disposed coaxially within an outer electrode 43.
  • the outer electrode 43 has a substantially cylindrical tubular shape having an opening 45 defined therein.
  • the inner electrode 42 has a substantially cylindrical shape and may be fully enclosed by the outer electrode 43 or extend past the distal end of the outer electrode 43.
  • the device 41 also includes an electrode spacer (not explicitly shown) disposed between the inner and outer electrodes 42 and 43, similar to the electrode spacer 27.
  • the electrode spacer may be disposed at any point between the inner and outer electrodes 42 and 43 to provide for a coaxial configuration between the inner and outer electrodes 42 and 43.
  • the electrode spacer may be frictionally fitted to the electrodes 42 and 43 to secure the inner electrode 42 within the outer electrode 43.
  • the electrode spacer may be formed from a dielectric material, such as ceramic, to provide for capacitive coupling between the inner and outer electrodes 42 and 43.
  • Each of the inner and outer electrodes 42 and 43 may include a plurality of geometrical arrangements.
  • the inner and outer electrodes 42 and 43 include a plurality of grooves 55 disposed on the surface thereof.
  • the grooves 55 enhance the local electrical fields along the inner and outer electrodes 42 and 43.
  • the grooves 55 may also be covered by a groove coating 50, which is substantially similar to the coating 24 for similar functional purposes.
  • the grooves 55 are disposed on the outer surface of the inner electrode 42 and on the inner surface of the outer electrode 43.
  • the inner and outer electrodes 42 and 43 and the coating 50 may be formed from the materials discussed above with respect to the inner and outer electrodes 22 and 23.
  • the groove coating 50 may be formed from substantially similar materials as the coating 24, namely, a combination of aluminum, magnesium, or titanium metals, and oxides or nitrides thereof.
  • the grooves 55 may be arranged in parallel with a longitudinal axis defined by the inner and outer electrodes 42 and 43.
  • the grooves 45 may be arranged in a spiral configuration (e.g., rifled) on the inner and outer electrodes 42 and 43.
  • the inner electrode 43 may also include one or more side vents 49 to allow for additional gas flow into the opening 45.
  • a plasma device 112 includes an inner electrode 122 having a substantially cylindrical tubular shape having an opening 125 defined therethrough.
  • the inner electrode 122 has a distal end 126 and proximal end 124 that is coupled to the ionizable media source 16 and the precursor source 18 (Fig. 1).
  • the inner electrode 122 is also coupled to a porous member 128 at the distal end 126.
  • the porous member 128 disperses the plasma passing through the inner electrode 122 to generate a wide-area plasma effluent 129.
  • the inner electrode 122 may have an inner diameter a of 10 cm or less.
  • the porous member 128 may be formed from sintered or metal glass, ceramic mesh, and other porous materials suitable for dispersion of gas.
  • the porous member 128 may have a thickness b from about 0.1 to about 1.0 cm.
  • the plasma device 1 12 also includes an outer electrode 123 that also has a substantially cylindrical tubular or annular shape having a larger diameter than the diameter of the inner electrode 122.
  • the inner and outer electrodes 122 and 123 are concentrically disposed about a longitudinal axis A-A.
  • the outer electrode 123 has a shorter length than the inner electrode 122 and is disposed coaxially about the inner electrode 122.
  • the outer electrode 123 encloses a distal portion 130 of the inner electrode 122 and the porous member 128.
  • the electrodes 122 and 123 may be formed from an electrically conductive or semi-conducting material suitable for ignition of plasma such as metals and metal-ceramic composites. In one embodiment, the electrodes 122 and 123 may be formed from a conductive metal including a native oxide or nitride compound disposed thereon. [0087]
  • the plasma device 112 also includes a dielectric spacer 132 having puck-like or toroidal shape. The dielectric spacer 132 includes an opening 134 through the center thereof that is adapted for insertion of the inner electrode 122 therethrough. The dielectric spacer 132 is disposed between the inner and outer electrodes 122 and 123.
  • the dielectric spacer 132 may be frictionally fitted to the electrodes 122 and 123 to secure the inner electrode 122 within the outer electrode 123.
  • the dielectric spacer may have a thickness c from about 0.1 to about 1.0 cm (e.g., gauge).
  • the electrode spacer 132 may be formed from a dielectric material, such as a thin ceramic, to provide capacitive coupling between the inner and outer electrodes 122 and 123.
  • One of the electrodes 122 and 123 may be an active electrode and the other may be a neutral or return electrode to facilitate in RF energy coupling.
  • Each of the electrodes 122 and 123 are coupled to the power source 14 that drives plasma generation, such that the energy from the power source 14 may be used to ignite and sustain the plasma in feedstocks 127 flowing through the device 112 (e.g., through the opening 125).
  • Fig. 9 shows another illustrative embodiment of a plasma device 212 which includes a housing 211 enclosing a first electrode 222 and a second electrode 223 separated by a predetermined distance d, which may be from about 0.1 cm to about 1 cm.
  • the first electrode 222 is proximal of the second electrode 223 with respect to the supplied plasma feedstocks.
  • the housing 211 has a substantially cylindrical tubular shape having an opening 225 defined therethrough.
  • the housing 211 is formed from a dielectric material that insulates the first and second electrodes 222 and 223.
  • the housing 211 may have an inner diameter e of 10 cm or less.
  • the plasma device 212 includes a distal end 226 and proximal end 224 that is coupled to the ionizable media source 16 and the precursor source 18.
  • the first and second electrodes 222 and 223 are formed from conductive porous material, such as metal, metal- ceramic and semi-conducting composite meshes, porous sintered solids, and the like to permit the flow of plasma feedstocks 228 therethrough.
  • the first and second electrodes 222 and 223 disperse the plasma passing through the housing 21 1 to generate a dispersed wide-area plasma effluent 229.
  • One of the electrodes 222 and 223 may be an active electrode and the other may be a neutral or return electrode to facilitate in RF energy coupling.
  • Each of the electrodes 222 and 223 are coupled to the power source 14 that drives plasma generation, such that the energy from the power source 14 may be used to ignite the plasma feedstocks flowing through the device 212.
  • the electrodes 222 and 223 are separated by a predetermined distance and are capacitively or inductively coupled through the plasma effluent 229 and the housing 21 1. More specifically, the ionizable media and the precursors flow through the device 212 through the chambered opening 225. As energy is applied to the electrodes 222 and 223, the plasma feedstocks are ignited to form the plasma effluent 229.
  • Fig. 10 shows another illustrative embodiment of a plasma device 312 which includes a housing 311 enclosing a first electrode 322 and a second electrode 323.
  • the housing 311 has a substantially cylindrical tubular shape having a chambered opening 325 defined therethrough.
  • the housing 31 1 is formed from a dielectric material that insulates the first and second electrodes 322 and 323.
  • the housing 311 may have an inner diameter/of 10 cm or less.
  • the plasma device 312 includes a distal end 326 and proximal end 324 that is coupled to the ionizable media source 16 and the precursor source 18.
  • the first electrode 322 may be a cylindrical rod formed from a conductive metal (e.g., aluminum alloy) or semiconductive material, disposed coaxially within the housing 311.
  • the plasma device 312 also includes an electrode spacer 327 disposed between first electrode 322 and the housing 311.
  • the electrode spacer 327 is substantially similar to the electrode spacer 27 and may include a central opening 340 adapted for insertion of the inner electrode 322 therethrough and one or more flow openings 342 disposed radially around the central opening to allow for the flow of plasma feedstocks 328 (e.g., ionizable media and precursors) through the device 312.
  • the electrode spacer 327 may be frictionally fitted to the housing 311 and the first electrode 322 to secure the first electrode 22 within the housing 31 1.
  • the electrode spacer 327 may be formed from a dielectric material, such as ceramic.
  • the electrode spacer 327 may be formed integrally with the housing 31 1.
  • the first electrode 322 also includes an insulative layer 343, which may be formed integrally with the housing 31 1 and the electrode spacer 327.
  • the layer 343 may be formed from a dielectric material deposited as a film unto or grown on the inner conductor via processes including, but not limited to, sputtering, chemical vapor (e.g., atomic layer deposition, evaporation, electrochemical methods, or ion implantation.).
  • the insulative layer 343 may also be a native metal oxide or nitride if the first electrode 332 is formed from a suitable alloy, such as aluminum and titanium, hi particular, the first electrode 322 may be formed from an aluminum alloy and the layer 342 may be aluminum oxide (Al 2 O 3 ) or aluminum nitride (AlN). In another illustrative embodiment, the first electrode 322 may be formed from a titanium alloy and the layer 342 may be titanium oxide (TiO 2 ) or titanium nitride (TiN).
  • the second electrode 323 is formed from a conductive or semiconductive porous material, such as metal and metal-ceramic composite meshes, porous sintered solids and the like to permit the flow of plasma feedstocks 328 therethrough.
  • the second electrode 323 also disperses the plasma passing through the housing 311 to generate a wide-area plasma effluent 329.
  • One of the electrodes 322 and 323 may be an active electrode and the other may be a neutral or return electrode to facilitate in RF energy coupling.
  • Each of the electrodes 322 and 323 are coupled to the power source 14 that drives plasma generation, such that the energy from the power source 14 may be used to ignite the plasma feedstocks flowing through the device 312.
  • the electrodes 322 and 323 are capacitively or inductively coupled through the plasma effluent 329 and the housing 311. More specifically, the ionizable media and the precursors flow through the device 312 through the chambered opening 325. As energy is applied to the electrodes 322 and 323, the plasma feedstocks are ignited to form the plasma effluent 329.
  • Figs. HA - C show another illustrative embodiment of a plasma device 412 which includes a housing 411 and a dielectric spacer 432 having disk-like or toroidal shape disposed within the housing 411.
  • the dielectric spacer 432 may be frictionally fitted to the housing 411.
  • the dielectric spacer 432 may be formed integrally with the housing 411.
  • the dielectric spacer 432 includes a bottom surface 426 and a top surface 424 that is coupled to the ionizable media source 16 and the precursor source 18 (Fig. 1).
  • the electrode spacer 432 may be formed from a dielectric material, such as ceramic, plastic, and the like.
  • the dielectric spacer 432 includes one or more openings 434 through the center thereof to allow for the flow of plasma feedstocks 428 therethrough.
  • the dielectric spacer 432 may be formed from a porous dielectric media suitable for allowing gases to flow therethrough thereby obviating the need for openings 434.
  • the multiple openings 434 and/or porous nature of the dielectric spacer 432 provide for dispersion of the plasma passing therethrough to generate a wide-area plasma effluent 429.
  • the openings 434 may be of various shapes and sizes.
  • Fig. 1 IB shows the openings 434 as slits formed in the dielectric spacer 432.
  • Fig. HC shows the openings 434 as substantially cylindrical lumens. At its widest thickness g, the openings 434 may be from about 0.1 cm to about 1.0 cm.
  • the plasma device 412 also includes first and second electrodes 422 and 423 disposed within the dielectric spacer 432.
  • the first and second electrodes 422 and 423 may be cylindrical rods, formed from a conductive metal (e.g., aluminum alloy) and may be inserted into the dielectric spacer 432 in parallel configuration and equidistant from the center of the dielectric spacer 432.
  • the dielectric spacer 432 provides capacitive coupling between the inner and outer electrodes 422 and 423.
  • electrodes 422 and 423 may have one or more regions that form and present sharpened protuberances toward openings 434 to increase the local electric fields.
  • One of the electrodes 422 and 423 may be an active electrode and the other may be a neutral or return electrode to facilitate in RF energy coupling.
  • Each of the electrodes 422 and 423 are coupled to the power source 14 that drives plasma generation, such that the energy from the power source 14 may be used to ignite the plasma feedstocks flowing through the device 412.
  • the electrodes 422 and 423 are capacitively coupled through the plasma effluent 429 and the dielectric spacer 432. More specifically, the ionizable media and the precursors flow through the device 412 through the openings 434. As energy is applied to the electrodes 422 and 423, the plasma feedstocks are ignited to form the plasma effluent 429.
  • Figs. 12A - B show another illustrative embodiment of a plasma device 512 which includes a dielectric spacer 532 having a substantially disk shape.
  • the plasma device 512 includes a bottom surface 526 and a top surface 524 that is coupled to the ionizable media source and the precursor source 18 (Fig. 1).
  • the electrode spacer 532 may be formed from a dielectric material, such as ceramic, plastic, and the like.
  • the dielectric spacer 532 may be formed from a porous dielectric media suitable for allowing gases to flow therethrough, or otherwise have open ports to allow flow of plasma feedstocks 528 through the plasma device 512.
  • the electrode spacer 532 may have a thickness h from about 0.1 cm to about 1.0 cm.
  • the plasma device 512 also includes first and second electrodes 522 and 523.
  • the first and second electrodes 522 and 523 may also have a disk or plate shape and are disposed on the top and bottom surfaces 524 and 526, respectively.
  • the first and second electrodes 522 and 523 are formed from a conductive or semiconductive porous material, such as metal and metal-ceramic composite meshes, porous sintered solids, and the like to permit the flow of plasma feedstocks 528 therethrough, or otherwise have open ports to allow flow of plasma feedstocks 528 through the plasma device 512.
  • the first and second electrodes 522 and 523 may have a diameter / from about 0.1 cm to about 1.0 cm and a thicknessy from about 0.1 cm to about 1.0 cm.
  • the dielectric spacer 532 may have a larger diameter extending outside the periphery of the first and second electrodes 522 and 523, such that a border k is formed, which may be from about 0.1 cm to about 1.0 cm. This configuration enhances capacitive coupling between the inner and outer electrodes 522 and 523.
  • One or both of electrodes 522 and 523 may also be formed into predetermined surface shapes and features to induce effects such as inductive coupling.
  • the porous nature of the dielectric spacer 532 in conjunction with the first and second electrodes 522 and 523 provides for dispersion of the plasma passing therethrough to generate a wide-area plasma effluent 529.
  • One of the electrodes 522 and 523 may be an active electrode and the other may be a neutral or return electrode to facilitate in RF energy coupling.
  • Each of the electrodes 522 and 523 are coupled to the power source 14 that drives plasma generation, such that the energy from the power source 14 may be used to ignite the plasma feedstocks 528 flowing through the device 512.
  • the ionizable media and the precursors flow through the device 512 and as energy is applied to the electrodes 522 and 523, the plasma feedstocks are ignited to form the plasma effluent 529.
  • Fig. 13 shows another illustrative embodiment of a plasma device 612, which is a combination of the plasma device 212 of Fig. 9 and plasma device 512 of Fig. 12.
  • the plasma device 612 includes a housing 611 enclosing a dielectric spacer 632 having disk shape, a first electrode 622 and a second electrode 623.
  • the housing 611 may have an inner diameter / of 10 cm or less.
  • the plasma device 612 includes a bottom surface 626 and a top surface 624 that is coupled to the ionizable media source 16 and the precursor source 18 (Fig. 1).
  • the dielectric spacer 632 may be formed from a dielectric material, such as ceramic, plastic, and the like.
  • the dielectric spacer 632 may be formed from a porous dielectric media suitable for allowing gases to flow therethrough.
  • the dielectric spacer 632 has a thickness m from about 0.1 cm to about 1.0 cm.
  • the first and second electrodes 622 and 623 may also have a disk or plate shape and are disposed on the top and bottom surfaces 627 and 629, respectively.
  • the first and second electrodes 622 and 623 have a thickness n from about 0.1 cm to about 1.0 cm and are formed from a conductive porous material, such as metal and metal-ceramic composite meshes, porous sintered solids, and the like to permit the flow of plasma feedstocks 628 therethrough.
  • the porous nature of the dielectric spacer 632 in conjunction with the first and second electrodes 622 and 623 provides for dispersion of the plasma passing therethrough to generate a wide-area plasma effluent 629.
  • the dielectric spacer 632 also provides for capacitive coupling between the inner and outer electrodes 622 and 623.
  • One of the electrodes 622 and 623 may be an active electrode and the other may be a neutral or return electrode to facilitate in RF energy coupling.
  • Each of the electrodes 622 and 623 are coupled to the power source 14 that drives plasma generation, such that the energy from the power source 14 may be used to ignite and sustain the plasma feedstocks 628 flowing through the device 612.
  • one electrode may be a solid and the second electrode formed into a spiral or other highly inductive form to achieve inductive coupling.
  • the ionizable media and the precursors 628 flow through the device 612 and as energy is applied to the electrodes 622 and 623, the plasma feedstocks are ignited to form the plasma effluent 629.
  • FIGs. 14 and 15 show an illustrative embodiment of a plasma system 1100.
  • the system 1100 includes a plasma device 1112 that is coupled to a power source 1114, an ionizable media source 1 116 and a precursor source 1118.
  • Power source 1114 includes a signal generator 1250 coupled to an amplifier 1252.
  • the signal generator 1250 outputs a plurality of control signals to the amplifier 1252 reflective of the desired waveform.
  • the signal generator 1250 allows for control of desired waveform parameters (e.g., frequency, duty cycle, amplitude, pulsing, etc.).
  • signal generator 1250 may pulse the waveform, e.g., a continuous-wave waveform signal may be switched on and off at a duty cycle (the duty cycle may be fixed or variable) and at a different frequency from the frequency of the continuous-wave waveform.
  • the amplifier 1252 outputs the desired waveform at a frequency from about 0.1 MHz to about 2,450 MHz and in another embodiment from about 1 MHz to about 13.56 MHz.
  • the power source 1114 also includes a matching network 1254 coupled to the amplifier 1252.
  • the matching network 1254 may include one or more reactive and/or capacitive components that are configured to match the impedance of the load (e.g., plasma effluent) to the power source 1114 by switching the components or by frequency tuning.
  • the power source 1 114 is coupled to a plasma device 1112. As shown in Fig.
  • the plasma device 1112 may be utilized for application of plasma to tissue.
  • the device 1112 includes an inner electrode 1 122, which may be an aluminum alloy rod, disposed coaxially within an outer electrode 1 123.
  • the outer electrode 1123 may be an aluminum alloy tube having an opening 1 125.
  • the inner and outer electrode 1 122 and 1 123 are coupled to the power source 1114 via connectors 1256 and 1258, which are disposed around the inner electrode 1 122 and 1 123, respectively.
  • the connectors 1256 and 1258 may be copper connector blocks.
  • the device 1112 also includes a ceramic electrode spacer 1127 disposed between the inner and outer electrodes 1122 and 1 123.
  • the electrode spacer 1 127 may be disposed at any point between the inner and outer electrodes 1122 and 1123 to provide for a coaxial configuration between the inner and outer electrodes 1122 and 1123.
  • the electrode spacer 1 127 is substantially similar to the electrode spacer 27 and may include a central opening (not explicitly shown) adapted for insertion of the inner electrode 1122 therethrough and one or more flow openings (not explicitly shown) disposed radially around the central opening to allow for the flow of plasma feedstocks through the device 1112.
  • the electrode spacer 1127 may be frictionally fitted to the electrodes 1122 and 1123 to secure the inner electrode 1122 within the outer electrode 1123.
  • One of the electrodes 1122 and 1123 may be an active electrode and the other may be a neutral or return electrode to facilitate in RF energy coupling.
  • the plasma system 1100 also includes an ionizable media source 1116 and a precursor source 1118 coupled to the plasma device 1 112.
  • the ionizable media source 1116 provides ionizable feedstock, namely, helium gas, to the plasma device 1112.
  • the ionizable media source 1116 includes a storage tank for storing the helium gas.
  • the ionizable media source 1 116 is coupled to the precursor source 1118 via tubing 1262, which includes tubing 1262a coupled to the ionizable media source 1116.
  • the tubing 1262a branches into tubing 1262b and 1262c.
  • the tubing 1262c is coupled to the precursor source 1118, which may be a bubbler or a nebulizer, for aerosolizing precursor feedstocks, namely liquid hydrogen peroxide, prior to introduction thereof into the device 1112.
  • the feedstocks are mixed upstream of the device 1112 prior to introduction thereto.
  • the tubing 1262b bypasses the tubing 1262c and reconnects at tubing 1262d, which is coupled to the plasma device 1112 at a coupling 1264.
  • the coupling 1264 may be a Teflon union tee connected to the outer electrode 1123.
  • the tubing 1262 also includes valves 1260a, 1260b, 1260c which control the flow of the helium gas and the hydrogen peroxide through the tubing 1262a, 1262b, 1262c, respectively.
  • the tubing 1262 further includes mass flow controllers 1266b and 1266c adapted to control the flow of plasma feedstocks through the tubing 1260b and 1260c, respectively.
  • the system 1100 provides a flow of plasma through the device 1112 to the tissue.
  • Plasma feedstocks which include helium gas and hydrogen peroxide, are supplied by the ionizable media source 1 116 and the precursor source 1118, respectively, to the plasma device 1112, which are ignited to form plasma effluent containing ions, radicals, photons from the specific excited species and metastables that carry internal energy to drive desired chemical reactions with the tissue or at the surface thereof.
  • Plasma device 1 112 includes the inner electrode 1122 and the outer electrode 1123.
  • the plasma device 1112 also includes a coating 1124 disposed on the outer surface of the inner electrode 1122 and on the inner surface of the outer electrode 1123.
  • the coating 1 124 is substantially similar to the coating 24 that is discussed above with respect to Figs. 4-6.
  • the plasma device 11 12 may also include additional features discussed above with respect to Figs. 4-6 such as grooves disposed in a parallel or spiral configurations, nanostructure pores filled with precursor materials, and/or vents within the inner electrode 1 122.
  • the inner electrode 1122 may be disposed in a variety of configurations and spatial orientation with respect to the outer electrode 1123.
  • the inner electrode 1122 may be recessed, flush or extended relative to the outer electrode 1123 as shown in Figs. 2B - 2D.
  • the extended distance of the inner electrode 1122 may also be adjustable as discussed above with respect to Figs. 2A - 2D.
  • Fig. 16 illustrates working ranges L R J, L R 2 and L R 3 , and a distance Dy.
  • Outer electrode 1 123 includes a working range L Rj] of energetic secondary electron emissions.
  • Inner electrode 1122 includes working ranges L R>2 , and L R 3 of energetic secondary electron emissions having energy E.
  • the working ranges are representative of the thickness of energetic electron sheath layers 1133 and 1134, which are disposed about the inner and outer electrodes 1122 and 1 123, respectively.
  • a gap distance ⁇ shows the zone where the concentration of energetic secondary electrons is relatively lower. Coating the electrodes, as discussed above, reduces gap distance ⁇ . In some embodiments, distance ⁇ may be reduced to zero and/or working ranges L R1 ], and L R>2 may overlap thereby creating an hollow cathode effect.
  • Inner electrode 1112 includes a tip 1128 having a distance D T from tissue "T". Ranges L R I , L R 2 and L R 3 , indicate regions with a greatly increased concentration of electrons with relatively high energies that drive reactions in the gas phase.
  • the coating 1124 on electrodes 1122 and/or 1123 can increase or enhance working ranges L R1 i and L R>2 , and/or L R 3 of energetic secondary electrons.
  • varying the thickness of the coating 1124 can be used to adjust the working ranges L R I and L R 2 , and/or L Ri3.
  • the distance D ⁇ that tip 1128 is disposed from tissue "T” is adjustable to achieve a predetermined tissue effect (discussed in more detail below).
  • Formula (3) relates the reaction rate R that indicates an inelastic (energy expending) collision where an electron at energy E, e(E), interacts with gas particle X. As a result of the collision the electron may transfer energy to X. After the collision, the electron and particle will have different energies. The rate or efficiency of this reaction is controlled by the energy dependent cross-section ⁇ (£) of the particular reaction.
  • Figs 17A and 17B show two plots, respectively.
  • FIG. 17A shows a plot 1700 illustrating typical electron concentrations n e (E) versus energy for alpha-mode and gamma-mode discharges, and a typical collisional reaction cross-section.
  • Plot 1700 includes axes 1702, 1704, and 1706.
  • Axis 1702 shows the number of electrons at energy E (i.e., a distribution).
  • Axis 1704 shows energy E of electrons in electron-volts (eV).
  • Line 1708 illustrates the number of electrons at energy E (axis 1702) versus energy E (axis 1704) as would be found in an alpha-mode discharge.
  • Line 1712 illustrates the number of electrons at energy E (axis 1702) versus energy E (axis 1704) as would be found in a gamma- mode discharge, which results from enhancement of secondary emission in the gamma-mode discharge.
  • the probability of a collisional reaction between an electron and a gas particle depends on the reaction cross-section, ⁇ (E), a general form of which is shown here as a function of energy E (axis 1704) as line 1710.
  • Line 1710 shows the collision cross-section (axis 1706) versus Energy E (axis 1704).
  • plot 1720 shows the calculated point-by-point multiplication product of ⁇ (E) » n e (E), a numeric indication of chemical reaction probability, for each mode of discharge.
  • Plot 1702 includes an axis 1726 indicating the reaction probability at energy E.
  • Line 1728 shows the product ⁇ (E) # n e (E) for an alpha-mode discharge as a function of energy E (axis 1704).
  • Line 1732 shows the product ⁇ (E) # n e (E) for a gamma-mode discharge as a function of energy E (axis 1704).
  • the overall reaction rate for each mode of discharge is related to the integral of each line (the area under each line).
  • the reaction rate is given by the product of this quantity and the velocity distribution v(E), specifically ⁇ (E)*n e (E)*v(E).
  • the components of the product of Fig. 17B are shown in Fig. 17A.
  • Line 1728 indicates the point-by-point multiplication (convolution) of lines 1708 and 1710, and line 1732 indicates the convolution of lines 1712 and 1710.
  • line 1708 shows peak alpha electron emissions occurring at point 1708, and may correspond to an electron- voltage of about 1 eV to about 3 eV. The majority of chemical bonds and/or chemical reactions with the electrons occur within an energy range of about 2 eV to about 10 eV.
  • Line 1710 shows the likelihood of n e (E) with additional secondary electron emissions. This illustrates that the secondary electron emissions increase the probability that chemical reactions of feedstocks with electrons to form reactive radicals occur with tissue "T" within an energy range of secondary electron emissions.
  • plasma device 1112 is shown with inner electrode
  • Figs. 18A - 18C include charts illustrating the contributing physical effects affecting tissue "T” as a function of distance D T that inner electrode 1128 is disposed from tissue "T” (see Fig. 16).
  • Figs. 18 A and 18B illustrate the chemical effect, heating effect, and a blend of the two as a mixture effect that the plasma device 1112 has on tissue "T" (see Fig. 16).
  • tissue "T” see Fig. 16
  • more energetic secondary electrons in volume enhance chemical reactions for the chemical effect and the mixture effect, but produce minimal or no heating effect.
  • impinging secondary electrons on the tissue surface enhance chemical reactions both in the gas volume and at the tissue surface.
  • Secondary electron emissions also enhance tissue surface reactions when D T ⁇ L R3 but do not have electron stimulated surface reactions when D T ⁇ L R3 .
  • the condition of formula (4) must be satisfied as follows:
  • Fig. 18A also shows a condition during which the inner electrode 1 122 touches tissue "T” (see Fig. 16) therefore making D ⁇ ⁇ 0.
  • tissue "T” chemical effects are mostly blocked, while bulk heating effects are enhanced. This case is mostly dominated by I 2 R or j 2 p (Ohmic) heating.
  • I 2 R or j 2 p (Ohmic) heating When inner electrode 1122 touches tissue "T”, the inner electrode thermally conducts heat to the tissue. Additionally, inner electrode 1122 is capacitively coupled to Tissue "T" (when touching) and electrically conducts energy thereto. Also, when inner electrode 1122 touches the tissue, the reacted tissue is moved away exposing un-reacted tissue.
  • Coatings enhance secondary electron emissions, thereby increasing radical fluxes and energetic electrons as well as facilitate the surface heating effect.
  • the electrode coating 1124 increases radical densities to enhance tissue reactions at surfaces for the chemical effect. For the heating effect, the electrode coating 1124 increases radical, secondary and electron flux to enhance surface reactions on tissue.
  • FIG. 18C various effects of disposing inner electrode 1122 in spaced relation to tissue are illustrated.
  • Fig. 18C refers to the inner electrode 1122
  • the outer electrode 1124 may be disposed in spaced relation to the tissue "T”
  • both electrodes 1 122 and 1124 may be disposed in spaced relation to the tissue "T”
  • the sheath having a working range L R> may be disposed in spaced relation to tissue "T”.
  • one or more of plasma devices plasma device as described with reference to any one of Fig. 1 through 16 may be combined with the teachings of with Figs. 18A - 18C and may be chosen to achieve a target tissue effect or result.
  • Fig. 18C may be selected as a desired (or target) effect, and a plasma device as described with reference to any one of Fig. 1 through 16 (or equivalents or combinations thereof), the plasma device's position in relation to tissue "T", and/or the power applied to the plasma device may be adjusted or controlled for to achieve the desired tissue effect(s).
  • Fig. 18C will be described as follows with reference to plasma device 1 1 12 of
  • Fig. 16 When the electron sheaths are not in contact with tissue "T" (e.g., the sheath having working range L R,3 ) the heating effect is minimal (or no effect), the chemical effect is limited by lateral diffusion loss away from the tissue, directionality is present due to gas transport, and selectivity is present and is chemistry dominated.
  • tissue "T” e.g., the sheath having working range L R,3
  • the heating effect is minimal (or no effect)
  • the chemical effect is limited by lateral diffusion loss away from the tissue
  • directionality is present due to gas transport
  • selectivity is present and is chemistry dominated.
  • the sheath is in contact with tissue, the heating effect is small or limited, the chemical effect is strong (both chemical and electron flux effects), directionality is strongest (both gas transport and electron flux), and selectivity is strong (both chemical and electron flux effects).
  • the heating effect is a strong effect, the chemical effect is present but is reduced at the tissue-electrode interface, there is some directionality, and there is some selectivity on the sides but is reduced at the tissue-electrode interface.
  • the center electrode e.g., inner electrode 1 122
  • the heating effect is maximum, the chemical effect is limited (or minimal), the electrode shape dominates directionality, and for selectivity: the thermal effects dominate and there is some selectivity on the sides
  • the inner electrode 1122 transfers thermal energy to the tissue and is capacitively coupled to the tissue thereby conducting electricity through tissue "T".
  • Step 1902 provides a plasma device.
  • Step 1904 selects a tissue effect.
  • the tissue effect of step 1904 may be a heating effect, a chemical effect and/or a mixture effect as described above with respect to the Fig. 18 A.
  • Step 1906 positions the plasma device in spaced relation to the tissue in accordance with the selected tissue effect.
  • Step 1908 generates plasma.
  • Step 1910 emits secondarily emitted electrons via secondary electron emissions. The secondary electrons may be controlled to achieve one or more magnitudes of one or more selected tissue effects.
  • Step 2002 provides a plasma device.
  • Step 2004 selects a target directivity and/or a target selectivity as described above with respect to the Fig. 18C.
  • Directional secondary electrons predominately impinge on the bottom, as opposed to the sidewalls, of the tissue cuts.
  • Preferential irradiation of the bottom results in a directional tissue removal.
  • Choice of chemical radical flux and tissue type change the tissue removal rate, allowing the removal of one tissue type but not another. Selectivity between tissue types > 15 are achievable.
  • Step 2006 selects target magnitudes of a heating effect and/or a chemical effect according to the target directivity and/or target selectivity.
  • Step 2008 positions the plasma device in spaced relation to tissue in accordance with (1) the target magnitude of a heating effect; (2) the target magnitude of a chemical effect; (3) the target directivity; and/or (4) the target selectivity.
  • the selected relative magnitudes of the surface heating and chemical effects may be a function of the selected directivity and/or selectivity.
  • Step 2010 generates a plasma including energetic secondarily emitted electrons which may (D T ⁇ L R3 ) or may not (D T > L R3 ) impinge on the tissue surface.
  • Fig. 21 showing a gray-scale photograph of an example of plasma discharge having drawings thereon showing various regions according to the present disclosure.
  • Fig. 21 shows an inner electrode 2102, an outer electrode 2104, and an energetic electron sheath layer 2106.
  • the working ranges L R ⁇ 2 and L R>3 are identified.
  • the energetic electron sheath layer 2106 was photographed as having a generally purple color around a region about inner electrode 2102.
  • the general thickness of the generally-purple energetic electron sheath layer 2106 had a thickness of about L R 3 near the distal end of inner electrode 2102 and a thickness of about L R 2 in the region where electron sheath 2106 begins to extend to within outer electrode 2104.
  • the plasma system was setup as shown in Figs.
  • Fig. 23 shows a color photograph of the plasma discharge of Fig. 21 according to the present disclosure.
  • Fig. 23 also shows the inner electrode 2102, the outer electrode 2104, and the energetic electron sheath layer 2106.
  • the working ranges L R 2 and L R 3 are identified.
  • the energetic electron sheath layer 2106 is shown having a generally-purple color around a region about inner electrode 2102.
  • the general thickness of the generally-purple energetic electron sheath layer 2106 had a thickness of about L R>3 near the distal end of inner electrode 2102 and a thickness of about L R 2 in the region where energetic electron sheath layer 2106 begins to extend into within outer electrode 2104.
  • FIG. 22 shows a color photograph of an example of plasma discharge having drawings thereon showing various regions according to the present disclosure.
  • Fig. 22 shows an inner electrode 2108, an outer electrode 21 10, and an energetic electron sheath layer 2112.
  • the working ranges L R 2 and L R 3 are identified.
  • the energetic electron sheath layer 21 12 was photographed as having a generally orange-like color around a region about inner electrode 2108.
  • the general thickness of the generally orange-like energetic electron sheath layer 21 12 had a thickness of about L R 3 near the distal end of inner electrode 2108 and a thickness of about L R 2 in the region where energetic electron sheath layer 2106 begins to extend to within outer electrode 2110.
  • the plasma system was setup as shown in Figs.
  • the plasma effluent included a orange-like sheath layer in the extended region L R3 that is brighter and bigger than the L R3 of Example 1 , which indicates more efficient excitation of gas atoms due to increased collisions with energetic electrons.
  • the plasma effluent included a congruent larger orange-like layer that is believed to be produced by the energetic electrons within working distance L R3 .
  • Fig. 24 shows a color photograph of the plasma discharge of Fig. 22 according to the present disclosure.
  • Fig. 24 also shows the inner electrode 2108, the outer electrode 2110, and the energetic electron sheath layer 21126.
  • the working ranges L R;2 and L RJ3 are identified.
  • the energetic electron sheath layer 21 12 is shown having a generally orange-like color around a region about inner electrode 2108.
  • the general thickness of the generally orange-like energetic electron sheath layer 2112 had a thickness of about L R;3 near the distal end of inner electrode 2108 and a thickness of about L R12 in the region where energetic electron sheath layer 21 12 begins to extend into within outer electrode 2110.

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Abstract

The present disclosure provides for a plasma system. The plasma system includes a plasma device, an ionizable media source, and a power source. The plasma device includes an inner electrode and an outer electrode coaxially disposed around the inner electrode. The inner electrode includes a distal portion and an insulative layer that covers at least a portion of the inner electrode. The ionizable media source is coupled to the plasma device and is configured to supply ionizable media thereto. The power source is coupled to the inner and outer electrodes, and is configured to ignite the ionizable media at the plasma device to form a plasma effluent having an electron sheath layer about the exposed distal portion.

Description

SYSTEMS AND METHODS FOR PLASMA APPLICATION
CROSS-REFERENCE TO RELATED APPLICATION
[0001] The present application claims the benefit of and priority to International
Application No. PCT/US2009/045708 filed by Moore et al. on May 29, 2009, which claims the benefit of and priority to U.S. Provisional Application Serial No. 61/057,667 entitled . "PLASMA-BASED CHEMICAL SOURCE DEVICE AND METHOD OF USE THEREOF" filed by Moore et al. on May 30, 2008, the entire contents of which are incorporated by reference herein. BACKGROUND Technical Field
[0002] The present disclosure relates to plasma devices and processes for surface processing and material removal or deposition. More particularly, the disclosure relates to an apparatus and method for generating and directing chemically reactive, plasma-generated species in a plasma device along with excited-state species (e.g., energetic photons) that are specific to the selected ingredients. Background of Related Art
[0003] Electrical discharges in dense media, such as liquids and gases at or near atmospheric pressure, can, under appropriate conditions, result in plasma formation. Plasmas have the unique ability to create large amounts of chemical species, such as ions, radicals, electrons, excited-state (e.g., metastable) species, molecular fragments, photons, and the like. The plasma species may be generated in a variety of internal energy states or external kinetic energy distributions by tailoring plasma electron temperature and electron density. In addition, adjusting spatial, temporal and temperature properties of the plasma creates specific changes to the material being irradiated by the plasma species and associated photon fluxes. Plasmas are also capable of generating photons including energetic ultraviolet photons that have sufficient energy to initiate photochemical and photocatalytic reaction paths in biological and other materials that are irradiated by the plasma photons.
SUMMARY
[0004] Plasmas have broad applicability to provide alternative solutions to industrial, scientific and medical needs, especially workpiece surface processing at low temperature. Plasmas may be delivered to a workpiece, thereby affecting multiple changes in the properties of materials upon which the plasmas impinge. Plasmas have the unique ability to create large fluxes of radiation (e.g., ultraviolet), ions, photons, electrons and other excited- state (e.g., metastable) species which are suitable for performing material property changes with high spatial, material selectivity, and temporal control. Plasmas may also remove a distinct upper layer of a workpiece but have little or no effect on a separate underlayer of the workpiece or it may be used to selectively remove a particular tissue from a mixed tissue region or selectively remove a tissue with minimal effect to adjacent organs of different tissue type.
[0005] One suitable application of the unique chemical species is to drive non- equilibrium or selective chemical reactions at or within the workpiece to provide for selective removal of only certain types of materials. Such selective processes are especially sought in biological tissue processing (e.g., mixed or multi-layered tissue), which allows for cutting and removal of tissue at low temperatures with differential selectivity to underlayers and adjacent tissues. This is particularly useful for removal of biofilms, mixtures of fatty and muscle tissue, debridement of surface layers and removing of epoxy and other non-organic materials during implantation procedures. [0006] The plasma species are capable of modifying the chemical nature of tissue surfaces by breaking chemical bonds, substituting or replacing surface-terminating species (e.g., surface functionalization) through volatilization, gasification or dissolution of surface materials (e.g., etching). With proper techniques, material choices and conditions, one can remove one type of tissue entirely without affecting a nearby different type of tissue. Controlling plasma conditions and parameters (including S-parameters, V, I, Θ, and the like) allows for the selection of a set of specific particles, which, in turn, allows for selection of chemical pathways for material removal or modification as well as selectivity of removal of desired tissue type. The present disclosure provides for a system and method for creating plasma under a broad range of conditions including tailored geometries, various plasma feedstock media, number and location of electrodes and electrical excitation parameters (e.g., voltage, current, phase, frequency, pulse condition, etc.).
[0007] The supply of electrical energy that ignites and sustains the plasma discharge is delivered through substantially conductive electrodes that are in contact with the ionizable media and other plasma feedstocks. The present disclosure also provides for methods and apparatus that utilize specific electrode structures that improve and enhance desirable aspects of plasma operation such as higher electron temperature and higher secondary emission, hi particular, the present disclosure provides for porous media for controlled release of chemical reactants.
[0008] Controlling plasma conditions and parameters allows for selection of a set of specific particles, which, in turn, allows for selection of chemical pathways for material removal or modification as well as selectivity of removal of desired tissue type. The present disclosure also provides for a system and method for generating plasmas that operate at or near atmospheric pressure. The plasmas include electrons that drive reactions at material surfaces in concert with other plasma species. Electrons delivered to the material surface can initiate a variety of processes including bond scission, which enables volatilization in subsequent reactions. The electron-driven reactions act synergistically with associated fluxes to achieve removal rates of material greater than either of the reactions acting alone. [0009] In one embodiment of the present disclosure, a plasma system includes a plasma device, an ionizable media source, and a power source. The plasma device includes an inner electrode and an outer electrode coaxially disposed around the inner electrode. The inner electrode includes a distal portion and an insulative layer that covers at least a portion of the inner electrode. The ionizable media source is coupled to the plasma device and is configured to supply ionizable media thereto. The power source is coupled to the inner and outer electrodes, and is configured to ignite the ionizable media at the plasma device to form a plasma effluent having an electron sheath layer about the exposed distal portion. [0010] The insulative layer may be configured to limit the plasma effluent to the exposed distal portion and to provide a source of secondarily-emitted electrons that form at least a portion of the electron sheath layer. The insulative layer may be formed from a material having a secondary electron emission yield from about 1 to about 10. The inner electrode may be formed from a conductive metal and the insulative layer may be a metallic oxide of the conductive metal.
[0011] In another embodiment of the present disclosure, the plasma device further includes an electrode spacer. The electrode spacer is disposed between the inner and outer electrodes. The electrode spacer includes a central opening defined therein and is adapted for insertion of the inner electrode therethrough. The electrode spacer includes at least one flow opening defined therein and is configured to receive the flow of the ionizable media. The at least one flow opening may be disposed radially around the central opening. [0012] In another embodiment of the present disclosure, a plasma device includes outer and inner electrodes. The plasma device is configured to receive ionizable media. The outer electrode has a substantially cylindrical tubular shape. The inner electrode is coaxially disposed within the outer electrode. The inner electrode includes a distal portion and an insulative layer. The insulative layer covers at least a portion of the inner electrode. The insulative layer is configured to limit the plasma effluent to the exposed distal portion and provide a source of secondarily-emitted electrons to form an electron sheath layer about the exposed distal portion. The insulative layer may be from a material having a secondary electron emission yield from about 1 to about 10. The inner conductor may be formed from a conductive metal and the insulative layer may be a metallic oxide of the conductive metal. [0013] The plasma device may further include an electrode spacer. The electrode spacer is disposed between the inner and outer electrodes. The electrode spacer may include at least one flow opening defined therein and is configured to receive the flow of the ionizable media. The at least one flow opening may be disposed radially around the central opening.
[0014] In yet another embodiment of the present disclosure, a plasma system includes inner and outer electrodes, an ionizable media source, and a power source. The outer electrode has a substantially cylindrical tubular shape. The inner electrode is coaxially disposed within the outer electrode. The inner electrode includes a distal portion and an insulative layer that covers at least a portion of the inner electrode. The insulative layer is configured to limit the plasma effluent to the exposed distal portion and provides a source of secondarily-emitted electrons. The ionizable media source is coupled to the plasma device and is configured to supply ionizable media thereto. The power source is coupled to the inner and outer electrodes, and is configured to ignite the ionizable media at the plasma device to form a plasma effluent having an electron sheath layer of a predetermined thickness formed from the secondarily-emitted electrons. The electron sheath layer is formed about the exposed distal portion. [0015] The insulative layer may be formed from a material having a secondary electron emission yield from about 1 to about 10. The inner conductor may be formed from a conductive metal and the insulative layer may be a metallic oxide of the conductive metal. The plasma device may further include an electrode spacer disposed between the inner and outer electrodes. The electrode spacer may include a central opening defined therein and may be adapted for insertion of the inner electrode therethrough. The electrode spacer may include at least one flow opening defined therein and may be configured for the flow of the ionizable media. The at least one flow opening may be disposed radially around the central opening. The predetermined thickness of the electron sheath layer may be adjustable by selecting a specific ionizable media having a predetermined media density and an average particle cross-section. The predetermined thickness of the electron sheath layer may be inversely proportional to the media density of the ionizable media and the average particle cross-section.
BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The file of this patent contains at least one drawing executed in color. Copies of this patent with color drawing(s) will be provided by the Patent and Trademark Office upon request and payment of the necessary fee. The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the disclosure and, together with a general description of the disclosure given above, and the detailed description of the embodiments given below, serve to explain the principles of the disclosure, wherein:
[0017] Fig. 1 is a schematic diagram of a plasma system according to the present disclosure; [0018] Fig. 2A is a perspective, cross-sectional view of a plasma device according to the present disclosure;
[0019] Figs. 2B - 2D are side, cross-sectional views of the plasma device of Fig. 2A;
[0020] Fig. 3 is a side, cross-sectional view of the plasma device of Fig. 2 A;
[0021] Fig. 4 is a front, cross-sectional view of the plasma device of Fig. 2 A according to the present disclosure;
[0022] Fig. 5 is an enlarged cross-sectional view of a plasma device according to the present disclosure;
[0023] Fig. 6 is an enlarged cross-sectional view of a plasma device according to one embodiment of the present disclosure;
[0024] Fig. 7 is a front, cross-sectional view of the plasma device of Fig. 2 A according to the present disclosure;
[0025] Fig. 8 is a perspective, cross-sectional view of a plasma device according to the present disclosure;
[0026] Fig. 9 is a perspective, cross-sectional view of a plasma device according to the present disclosure;
[0027] Fig. 10 is a perspective, cross-sectional view of a plasma device according to the present disclosure;
[0028] Fig. 1 IA is a perspective, cross-sectional view of a plasma device according to the present disclosure;
[0029] Fig. 1 IB is a top view of a plasma device of Fig. 1 IA according to the present disclosure;
[0030] Fig. 11C is a top view of a plasma device of Fig. 1 IB according to the present disclosure; [0031] Fig. 12A is a perspective, cross-sectional view of a plasma device according to the present disclosure;
[0032] Fig. 12B is a top view of a plasma device of Fig. 12A according to the present disclosure;
[0033] Fig. 13 is a perspective, cross-sectional view of a plasma device according to the present disclosure;
[0034] Fig. 14 is a schematic diagram of a plasma system according to one embodiment of the present disclosure;
[0035] Fig. 15 is a side, cross-sectional view of a plasma device according to the present disclosure;
[0036] Fig. 16 is a close-up, side view of a plasma device according to the present disclosure;
[0037] Figs. 17A and 17B are plots relating to electron emissions according to the present disclosure;
[0038] Figs. 18 A, 18B, and 18C show charts illustrating several tissue effects of a plasma device according to the present disclosure;
[0039] Fig. 19 is a flow chart diagram of a method of plasma tissue treatment according to the present disclosure;
[0040] Fig. 20 is a flow chart diagram of another method of plasma tissue treatment according to the present disclosure;
[0041] Fig. 21 shows a gray-scale photograph of a plasma discharge according to the present disclosure;
[0042] Fig. 22 shows a gray-scale photograph of another plasma discharge according to the present disclosure; [0043] Fig. 23 shows a color photograph of the plasma discharge of Fig. 21 according to the present disclosure; and
[0044] Fig. 24 shows a color photograph of the plasma discharge of Fig. 22 according to the present disclosure.
DETAILED DESCRIPTION
[0045] Plasmas are generated using electrical energy that is delivered as either direct current (DC) electricity or alternating current (AC) electricity at frequencies from about 0.1 hertz (Hz) to about 100 gigahertz (GHz), including radio frequency ("RF", from about 0.1 MHz to about 100 MHz) and microwave ("MW", from about 0.1 GHz to about 100 GHz) bands, using appropriate generators, electrodes, and antennas. Choice of excitation frequency, the workpiece, as well as the electrical circuit that is used to deliver electrical energy to the circuit affects many properties and requirements of the plasma. The performance of the plasma chemical generation, the delivery system and the design of the electrical excitation circuitry are interrelated ~ as the choices of operating voltage, frequency and current levels (as well as phase) effect the electron temperature and electron density. Further, choices of electrical excitation and plasma device hardware also determine how a given plasma system responds dynamically to the introduction of new ingredients to the host plasma gas or liquid media. The corresponding dynamic adjustment of the electrical drive, such as via dynamic match networks or adjustments to voltage, current, or excitation frequency may be used to maintain controlled power transfer from the electrical circuit to the plasma.
[0046] Referring initially to Fig. 1, a plasma system 10 is disclosed. The system 10 includes a plasma device 12 that is coupled to a power source 14, an ionizable media source 16 and a precursor source 18. Power source 14 includes any suitable components for delivering power or matching impedance to plasma device 12. More particularly, the power source 14 may be any radio frequency generator or other suitable power source capable of producing power to ignite the ionizable media to generate plasma. The plasma device 12 may be utilized as an electrosurgical pencil for application of plasma to tissue and the power source 14 may be an electrosurgical generator that is adapted to supply the device 12 with electrical power at a frequency from about 0.1 MHz to about 2,450 MHz and in another embodiment from about 1 MHz to about 13.56 MHz. The plasma may also be ignited by using continuous or pulsed direct current (DC) electrical energy.
[0047] The precursor source 18 may be a bubbler or a nebulizer configured to aerosolize precursor feedstocks prior to introduction thereof into the device 12. The precursor source 18 may also be a micro droplet or injector system capable of generating predetermined refined droplet volume of the precursor feedstock from about 1 femtoliter to about 1 nanoliter in volume. The precursor source 18 may also include a microfluidic device, a piezoelectric pump, or an ultrasonic vaporizer.
[0048] The system 10 provides a flow of plasma through the device 12 to a workpiece
"W" (e.g., tissue). Plasma feedstocks, which include ionizable media and precursor feedstocks, are supplied by the ionizable media source 16 and the precursor source 18, respectively, to the plasma device 12. During operation, the precursor feedstock and the ionizable media are provided to the plasma device 12 where the plasma feedstocks are ignited to form plasma effluent containing ions, radicals, photons from the specific excited species and metastables that carry internal energy to drive desired chemical reactions in the workpiece "W" or at the surface thereof. The feedstocks may be mixed upstream from the ignition point or midstream thereof (e.g., at the ignition point) of the plasma effluent, as shown in Fig. 1 and described in more detail below. [0049] The ionizable media source 16 provides ionizable feedstock to the plasma device 12. The ionizable media source 16 is coupled to the plasma device 12 and may include a storage tank and a pump (not explicitly shown). The ionizable media may be a liquid or a gas such as argon, helium, neon, krypton, xenon, radon, carbon dioxide, nitrogen, hydrogen, oxygen, etc. and their mixtures, and the like, or a liquid. These and other gases may be initially in a liquid form that is gasified during application.
[0050] The precursor source 18 provides precursor feedstock to the plasma device 12.
The precursor feedstock may be either in solid, gaseous or liquid form and may be mixed with the ionizable media in any state, such as solid, liquid (e.g., particulates or droplets), gas, and the combination thereof. The precursor source 18 may include a heater, such that if the precursor feedstock is liquid, it may be heated into gaseous state prior to mixing with the ionizable media.
In one embodiment, the precursors may be any chemical species capable of forming reactive species such as ions, electrons, excited-state (e.g., metastable) species, molecular fragments (e.g., radicals) and the like, when ignited by electrical energy from the power source 14 or when undergoing collisions with particles (electrons, photons, or other energy-bearing species of limited and selective chemical reactivity) formed from ionizable media 16. More specifically, the precursors may include various reactive functional groups, such as acyl halide, alcohol, aldehyde, alkane, alkene, amide, amine, butyl, carboxlic, cyanate, isocyanate, ester, ether, ethyl, halide, haloalkane, hydroxyl, ketone, methyl, nitrate, nitro, nitrile, nitrite, nitroso, peroxide, hydroperoxide, oxygen, hydrogen, nitrogen, and combination thereof. In embodiments, the chemical precursors may be water, halogenoalkanes, such as dichloromethane, tricholoromethane, carbon tetrachloride, difluoromethane, trifluoromethane, carbon tetrafluoride, and the like; peroxides, such as hydrogen peroxide, acetone peroxide, benzoyl peroxide, and the like; alcohols, such as methanol, ethanol, isopropanol, ethylene glycol, propylene glycol, alkalines such as NaOH, KOH, amines, alkyls, alkenes, and the like. Such chemical precursors may be applied in substantially pure, mixed, or soluble form.
[0051] The precursors and their functional groups may be delivered to a surface to react with the surface species (e.g., molecules) of the workpiece "W." In other words, the functional groups may be used to modify or replace existing surface terminations of the workpiece "W." The functional groups react readily with the surface species due to their high reactivity and the reactivity imparted thereto by the plasma. In addition, the functional groups are also reacted within the plasma volume prior to delivering the plasma volume to the workpiece.
[0052] Some functional groups generated in the plasma can be reacted in situ to synthesize materials that subsequently form a deposition upon the surface. This deposition may be used for stimulating healing, killing bacteria, and increasing hydrophilic or hydroscopic properties. In addition, deposition of certain function groups may also allow for encapsulation of the surface to achieve predetermined gas/liquid diffusion, e.g., allowing gas permeation but preventing liquid exchange, to bond or stimulate bonding of surfaces, or as a physically protective layer.
[0053] The precursor source 18 and the ionizable media source 16 may be coupled to the plasma device 12 via tubing 13a and 13b, respectively. The tubing 13a and 13b may be combined into tubing 13c to deliver a mixture of the ionizable media and the precursor feedstock to the device 12 at a proximal end thereof. This allows for the plasma feedstocks, e.g., the precursor feedstock and the ionizable gas, to be delivered to the plasma device 12 simultaneously prior to ignition of the mixture therein.
[0054] In another embodiment, the ionizable media source 16 and the precursors source 18 may be coupled to the plasma device 12 via the tubing 13a and 13b at separate connections, e.g., the first connection 31 and a second connection 29, respectively, such that the mixing of the feedstocks occurs within the plasma device 12 upstream from the ignition point. In other words, the plasma feedstocks are mixed proximally of the ignition point, which may be any point between the respective sources 16 and 18 and the plasma device 12, prior to ignition of the plasma feedstocks to create the desired mix of the plasma effluent species for each specific surface treatment on the workpiece "W."
[0055] In a further embodiment, the plasma feedstocks may be mixed midstream, e.g., at the ignition point or downstream of the plasma effluent, directly into the plasma. More specifically, the first and second connections 31, 29 may be coupled to the device 12 at the ignition point, such that the precursor feedstocks and the ionizable media are ignited concurrently as they are mixed (Fig. 1). It is also envisioned that the ionizable media may be supplied to the device 12 proximally of the ignition point, while the precursor feedstocks are mixed therewith at the ignition point.
[0056] In a further illustrative embodiment, the ionizable media may be ignited in an unmixed state and the precursors may be mixed directly into the ignited plasma. Prior to mixing, the plasma feedstocks may be ignited individually. The plasma feedstock is supplied at a predetermined pressure to create a flow of the medium through the device 12, which aids in the reaction of the plasma feedstocks and produces a plasma effluent. The plasma according to the present disclosure is generated at or near atmospheric pressure under normal atmospheric conditions.
[0057] With reference to Figs. 1-3, the device 12 includes an inner electrode 22 disposed coaxially within an outer electrode 23. As shown in Fig. 2 A, the outer electrode 23 has a substantially cylindrical tubular shape having an opening 25 (Fig. 3) defined therein. The inner electrode 22 has a substantially cylindrical shape (e.g., rod-shaped). The electrodes 22 and 23 may be formed from a conductive material suitable for ignition of plasma such as metals and metal-ceramic composites. In one embodiment, the electrodes 22 and 23 may be formed from a conductive metal including a native oxide or nitride compound disposed thereon.
[0058] The device 12 also includes an electrode spacer 27 disposed between the inner and outer electrodes 22 and 23. The electrode spacer 27 may be disposed at any point between the inner and outer electrodes 22 and 23 to provide for a coaxial configuration between the inner and outer electrodes 22 and 23. The electrode spacer 27 includes a central opening 40 adapted for insertion of the inner electrode 22 therethrough and one or more flow openings 42 disposed radially around the central opening 40 to allow for the flow of ionizable media and precursors through the device 12. The electrode spacer 27 may be frictionally fitted to the electrodes 22 and 23 to secure the inner electrode 22 within the outer electrode 23. In another embodiment, the electrode spacer 27 is slidably disposed over the inner electrode 22. In one illustrative embodiment, the electrode spacer 27 may be formed from a dielectric material, such as ceramic, to provide capacitive coupling between the inner and outer electrodes 22 and 23.
[0059] As shown in Fig. 2B, distal end of the inner electrode 22 may extend past the distal end of the outer electrode 23. In another embodiment, as shown in Figs. 2C and ID, the inner electrode 22 may be fully enclosed by the outer electrode 23. In particular, the distal end the inner electrode 22 may be flush with the distal end of the outer electrode 23 (Fig. 2C). In a further embodiment, the inner electrode 22 may be recessed within the outer electrode 23 (e.g., distal end of the inner electrode 22 is within the opening 25 as shown in Fig. 2D).
[0060] The extended distance of the inner electrode 22 relative to the outer electrode
23 may be adjusted to achieve a desired spatial relationship between the electrodes 22 and 23. In one embodiment, the electrode spacer 27 is secured to the outer electrode 23 but is slidably disposed over the inner electrode 22. In other words, the inner electrode 22 may move through the opening 40. This allows for the outer electrode 23 and the electrode spacer 27 to be longitudinally movable along the inner electrode 22 thereby controlling the exposure of the distal end of the inner electrode 22. In another embodiment, the inner and outer electrodes 22 and 23 may be fixated in a coaxial configuration using other fixation mechanisms (e.g., clamps) that allow for adjustment of the exposure distance of the inner electrode 22.
[0061] One of the electrodes 22 and 23 may be an active electrode and the other may be a neutral or return electrode to facilitate in RF energy coupling. Each of the electrodes 22 and 23 are coupled to the power source 14 that drives plasma generation and electron sheath formation close to the inner electrode 22, such that the energy from the power source 14 may be used to ignite the plasma feedstocks flowing through the device 12. More specifically, the ionizable media and the precursors flow through the device 12 through the opening 25 (e.g., through the electrode spacer 27 and between the inner and outer electrodes 22 and 23). The inner electrode 22 may also include one or more openings (not explicitly shown) therethrough to facilitate the flow of ionizable media and the precursors. When the electrodes 22 and 23 are energized, the plasma feedstocks are ignited and form a plasma effluent which is emitted from the distal end of the device 12 onto the workpiece "W." [0062] As shown in Fig. 3, the inner electrode 22 includes a coating 24 that covers at least a portion of the inner electrode 22 leaving an exposed (e.g., uninsulated or uncoated) distal portion 27 of the inner electrode 22 uninsulated. In another embodiment, the coating 24 may be disposed on the outer electrode 23 as discussed in more detail below with respect to Figs. 4-7 and 16.
[0063] The coating 24 may be formed from an insulative or semiconductive material deposited as a film unto the inner conductor (e.g., atomic layer deposition) or as a dielectric sleeve or layer. In one illustrative embodiment, the insulative cover 24 may be a native metal oxide. The coating 24 limits the plasma action to the distal portion 27 and provides for the creation of a plasma effluent 31 having an energetic electron sheath layer 33. The sheath layer 33 has a reaching distance "d" from about 1 to about 10 mm, suitable for contacting the sheath layer 33 to the workpiece "W" to promote volatilization and/or modification of chemical bonds at the surface thereof as discussed in more detail below with respect to Figs. 16 - 24.
[0064] In addition, the coating 24 provides for capacitive coupling between the inner and outer electrodes 22 and 23. The resulting capacitive circuit element structure provides for a net negative bias potential at the surface of the inner electrode 22, which attracts the ions and other species from the plasma effluent. These species then bombard the coating 24 and release the electrons generating the sheath layer 33.
[0065] The sheath layer 33 is generated in part by the materials of the electrodes 22 and 23 and in particular by the coating 24. Materials having high secondary electron emission property, γ, in response to ion and/or photon bombardment are suitable for this task. Such materials include insulators and/or semiconductors. These materials have a relatively high γ, where γ represents the number of electrons emitted per incident bombardment particle. Thus, metals generally have a low γ (e.g., less than 0.1) while insulative and semiconductor materials, such as metallic oxides have a high γ, from about 1 to about 10 with some insulators exceeding a value of 20. Thus, the coating 24 acts as a source of secondary emitted electrons, in addition to limiting the plasma to the distal end of the inner electrode 22. [0066] Secondary electron emission, γ, may be described by the formula (1):
(i) Y * secondary' A i [0067] In formula (1) γ is the secondary electron emission yield or coefficient,
Tsecondary is the electron flux, and Fj0n is the ion flux. Secondary emission occurs due to the impacts of plasma species (ions) onto the coating 24 when the ion impact collisions have sufficient energy to induce secondary electron emission, thus generating γ-mode discharges. Generally discharges are said to be in γ-mode when electron generation occurs preferentially at electrode surfaces (i.e., γ > 1) instead of in the gas (an α-mode discharge). In other words, per each ion colliding with the coating 24, a predetermined number of secondary electrons are emitted. Thus, γ may also be thought of as a ratio of the rseCondary (e.g., the electron flux) and Fj0n (e.g., the ion flux).
[0068] These ion collisions with the surface of the coating 24, in turn, provide sufficient energy for secondary electron emission to generate γ discharges. The ability of coating materials such as coating 24 to generate γ discharges varies with several parameters, with the most influence due to the choice of materials having a high γ as discussed above. This property allows coatings 24 to act as a source of secondary emitted electrons or as a catalytic material to enhance selected chemical reaction paths.
[0069] Over time the coating 24 may thin or be removed during the plasma operation.
In order to maintain the coating 24 to continually provide a source of secondary emitted electrons, the coating 24 may be continually replenished during the plasma operation. This may be accomplished by adding species that reformulate the native coating 24 on the inner and outer electrodes 22 and 23. In one embodiment, the precursor source 18 may provide either oxygen or nitrogen gas to the device 12 to replenish to oxide or nitride coating. [0070] Generation of the sheath layer 33 is also controlled by the supply of the ionizable media and the precursors. Ionizable media and the precursors are selected that are relatively transparent to the energetic electrons released during secondary emission from the surface of the inner electrode 22. As stated above, the plasma is generated at atmospheric pressure. Due to the increased entropy at such pressure, the generated electrons undergo a multitude of collisions in a relatively short period of time and space forming the sheath layer
33.
[0071] The thickness of the sheath layer 33 is defined by a formula (2):
(2) Thickness = 1/Nσ
[0072] In formula (2), N is the number of scattering centers, which may be the molecules of the ionizable media, the precursors and the atmospheric gases. Thus, N defines the media density. The variable, σ, is the average particle cross-section of the scattering centers. The thickness of the sheath layer 33 is inversely proportional to the product of N and σ. Thus, decreasing N and σ allows for achieving a thicker sheath layer 33. A lower σ may be provided by using specific ionizable media compounds with molecules having a low cross-section, such as hydrogen and helium. The variable N may be lowered by heating the ionizable media to reduce the gas density and limiting the amount of media provided to the lowest amount needed to sustain the plasma reaction.
[0073] The present disclosure also relates to systems and methods for generating plasma effluents having the energetic electron sheath layer having a reaching distance "d." The sheath layer 33 is produced by the combination of disclosed electrode structures, specific gas species, electrode materials, proper excitation conditions, and other media parameters. The propagation of energetic electron for mm-sized distances provides for practical applications on a variety of surfaces, such as modification of chemical bonds on the surface and volatilization of surface compounds.
[0074] In another embodiment as shown in Figs. 4-6, the coating 24 is disposed on the outer surface of the inner electrode 22 and on the inner surface of the outer electrode 23. In other words, the surfaces of the inner and outer electrodes 22 and 23 facing the opening 25 include the coating 24. In one embodiment, the coating 24 may cover the entire surface of the inner and outer electrodes 22 and 23 (e.g., outer and inner surface thereof, respectively). In another embodiment, the coating 24 may cover only a portion of the electrodes 22 and 23, such as a distal, proximal (e.g., Fig. 3 illustrates an uncoated distal portion 27) or middle portions thereof.
[0075] The coating 24 may be a native oxide, or a native nitride of the metal from which the inner and outer electrodes are formed, or may be a deposited layer or a layer formed by ion implantation. In one illustrative embodiment, the inner and outer electrodes 22 and 23 are formed from an aluminum alloy and the coating 24 is aluminum oxide (Al2O3) or aluminum nitride (AlN). In another illustrative embodiment, the inner and outer electrodes 22 and 23 are formed from a titanium alloy and the coating 24 is titanium oxide (TiO2) or titanium nitride (TiN).
[0076] The inner and outer electrodes 22 and 23 and the coating 24 may also be configured as a heterogeneous system. The inner and outer electrodes 22 and 23 may be formed from any suitable electrode substrate material (e.g., conductive metal or a semiconductor) and the coating 24 may be disposed thereon by various coating processes. The coating 24 may be formed on the inner and outer electrodes 22 and 23 by exposure to an oxidizing environment, anodization, electrochemical processing, ion implantation, or deposition (e.g., sputtering, chemical vapor deposition, atomic layer deposition, etc.). [0077] In another embodiment the coating 24 on electrodes 22 and 23 may be different on each electrode and may serve separate purposes. One coating 24 (e.g., on the electrode 22) can be selected to promote increased secondary electron emission while coating 24 on the other electrode (e.g., electrode 23) can be selected to promote specific chemical reactions (e.g., act as a catalyst). [0078] As shown in Figs. 5 and 6, the coating 24 may also include a plurality of nanostructure pores 60, which may be arranged in a predetermined (e.g., unidirectional) form (Fig. 5) or in a random configuration (Fig. 6). Pores 60 may be formed during the coating processes discussed above. In one illustrative embodiment, the pores 60 may be treated to include one or more types of precursor feedstock 62 disposed therein. This allows for feeding of the precursor feedstock 62 directly into the plasma effluent either as a substitute for the precursor source 18 or in conjunction therewith. The precursor feedstock 62 may be the precursors discussed above with respect to the precursor source 18. In one embodiment, the precursor feedstock 62 may be a catalyst suitable for initiation of the chemical reactions between the precursor feedstock supplied from the precursor source 18 and the plasma. [0079] Fig. 7 shows a side cross-sectional view of a plasma device 41 having an inner electrode 42 disposed coaxially within an outer electrode 43. The outer electrode 43 has a substantially cylindrical tubular shape having an opening 45 defined therein. The inner electrode 42 has a substantially cylindrical shape and may be fully enclosed by the outer electrode 43 or extend past the distal end of the outer electrode 43.
[0080] The device 41 also includes an electrode spacer (not explicitly shown) disposed between the inner and outer electrodes 42 and 43, similar to the electrode spacer 27. The electrode spacer may be disposed at any point between the inner and outer electrodes 42 and 43 to provide for a coaxial configuration between the inner and outer electrodes 42 and 43. The electrode spacer may be frictionally fitted to the electrodes 42 and 43 to secure the inner electrode 42 within the outer electrode 43. In one illustrative embodiment, the electrode spacer may be formed from a dielectric material, such as ceramic, to provide for capacitive coupling between the inner and outer electrodes 42 and 43.
[0081] Each of the inner and outer electrodes 42 and 43 may include a plurality of geometrical arrangements. In one embodiment, as shown in Fig. 7, the inner and outer electrodes 42 and 43 include a plurality of grooves 55 disposed on the surface thereof. The grooves 55 enhance the local electrical fields along the inner and outer electrodes 42 and 43. The grooves 55 may also be covered by a groove coating 50, which is substantially similar to the coating 24 for similar functional purposes. The grooves 55 are disposed on the outer surface of the inner electrode 42 and on the inner surface of the outer electrode 43. The inner and outer electrodes 42 and 43 and the coating 50 may be formed from the materials discussed above with respect to the inner and outer electrodes 22 and 23. In one embodiment, the groove coating 50 may be formed from substantially similar materials as the coating 24, namely, a combination of aluminum, magnesium, or titanium metals, and oxides or nitrides thereof.
[0082] The grooves 55 may be arranged in parallel with a longitudinal axis defined by the inner and outer electrodes 42 and 43. In another embodiment, the grooves 45 may be arranged in a spiral configuration (e.g., rifled) on the inner and outer electrodes 42 and 43. The inner electrode 43 may also include one or more side vents 49 to allow for additional gas flow into the opening 45.
[0083] The present disclosure provides for a variety of plasma device embodiments and configurations suitable for wide area plasma treatment of tissue. Common to the disclosed embodiments is the uniform dispersion of plasma feedstocks in the vicinity of both active and return electrodes employed. In one embodiment, the plasma conditions provide for a plasma media that flows in a laminar form within plasma device 12. [0084] Fig. 8 shows a plasma device 112 includes an inner electrode 122 having a substantially cylindrical tubular shape having an opening 125 defined therethrough. The inner electrode 122 has a distal end 126 and proximal end 124 that is coupled to the ionizable media source 16 and the precursor source 18 (Fig. 1). The inner electrode 122 is also coupled to a porous member 128 at the distal end 126. The porous member 128 disperses the plasma passing through the inner electrode 122 to generate a wide-area plasma effluent 129. The inner electrode 122 may have an inner diameter a of 10 cm or less. The porous member 128 may be formed from sintered or metal glass, ceramic mesh, and other porous materials suitable for dispersion of gas. The porous member 128 may have a thickness b from about 0.1 to about 1.0 cm.
[0085] The plasma device 1 12 also includes an outer electrode 123 that also has a substantially cylindrical tubular or annular shape having a larger diameter than the diameter of the inner electrode 122. The inner and outer electrodes 122 and 123 are concentrically disposed about a longitudinal axis A-A. The outer electrode 123 has a shorter length than the inner electrode 122 and is disposed coaxially about the inner electrode 122. In particular, the outer electrode 123 encloses a distal portion 130 of the inner electrode 122 and the porous member 128.
[0086] The electrodes 122 and 123 may be formed from an electrically conductive or semi-conducting material suitable for ignition of plasma such as metals and metal-ceramic composites. In one embodiment, the electrodes 122 and 123 may be formed from a conductive metal including a native oxide or nitride compound disposed thereon. [0087] The plasma device 112 also includes a dielectric spacer 132 having puck-like or toroidal shape. The dielectric spacer 132 includes an opening 134 through the center thereof that is adapted for insertion of the inner electrode 122 therethrough. The dielectric spacer 132 is disposed between the inner and outer electrodes 122 and 123. In one embodiment, the dielectric spacer 132 may be frictionally fitted to the electrodes 122 and 123 to secure the inner electrode 122 within the outer electrode 123. The dielectric spacer may have a thickness c from about 0.1 to about 1.0 cm (e.g., gauge). In one illustrative embodiment, the electrode spacer 132 may be formed from a dielectric material, such as a thin ceramic, to provide capacitive coupling between the inner and outer electrodes 122 and 123.
[0088] One of the electrodes 122 and 123 may be an active electrode and the other may be a neutral or return electrode to facilitate in RF energy coupling. Each of the electrodes 122 and 123 are coupled to the power source 14 that drives plasma generation, such that the energy from the power source 14 may be used to ignite and sustain the plasma in feedstocks 127 flowing through the device 112 (e.g., through the opening 125). [0089] Fig. 9 shows another illustrative embodiment of a plasma device 212 which includes a housing 211 enclosing a first electrode 222 and a second electrode 223 separated by a predetermined distance d, which may be from about 0.1 cm to about 1 cm. The first electrode 222 is proximal of the second electrode 223 with respect to the supplied plasma feedstocks. The housing 211 has a substantially cylindrical tubular shape having an opening 225 defined therethrough. The housing 211 is formed from a dielectric material that insulates the first and second electrodes 222 and 223. The housing 211 may have an inner diameter e of 10 cm or less.
[0090] The plasma device 212 includes a distal end 226 and proximal end 224 that is coupled to the ionizable media source 16 and the precursor source 18. The first and second electrodes 222 and 223 are formed from conductive porous material, such as metal, metal- ceramic and semi-conducting composite meshes, porous sintered solids, and the like to permit the flow of plasma feedstocks 228 therethrough. The first and second electrodes 222 and 223 disperse the plasma passing through the housing 21 1 to generate a dispersed wide-area plasma effluent 229.
[0091] One of the electrodes 222 and 223 may be an active electrode and the other may be a neutral or return electrode to facilitate in RF energy coupling. Each of the electrodes 222 and 223 are coupled to the power source 14 that drives plasma generation, such that the energy from the power source 14 may be used to ignite the plasma feedstocks flowing through the device 212. The electrodes 222 and 223 are separated by a predetermined distance and are capacitively or inductively coupled through the plasma effluent 229 and the housing 21 1. More specifically, the ionizable media and the precursors flow through the device 212 through the chambered opening 225. As energy is applied to the electrodes 222 and 223, the plasma feedstocks are ignited to form the plasma effluent 229. [0092] Fig. 10 shows another illustrative embodiment of a plasma device 312 which includes a housing 311 enclosing a first electrode 322 and a second electrode 323. The housing 311 has a substantially cylindrical tubular shape having a chambered opening 325 defined therethrough. The housing 31 1 is formed from a dielectric material that insulates the first and second electrodes 322 and 323. The housing 311 may have an inner diameter/of 10 cm or less.
[0093] The plasma device 312 includes a distal end 326 and proximal end 324 that is coupled to the ionizable media source 16 and the precursor source 18. The first electrode 322 may be a cylindrical rod formed from a conductive metal (e.g., aluminum alloy) or semiconductive material, disposed coaxially within the housing 311.
[0094] The plasma device 312 also includes an electrode spacer 327 disposed between first electrode 322 and the housing 311. The electrode spacer 327 is substantially similar to the electrode spacer 27 and may include a central opening 340 adapted for insertion of the inner electrode 322 therethrough and one or more flow openings 342 disposed radially around the central opening to allow for the flow of plasma feedstocks 328 (e.g., ionizable media and precursors) through the device 312. The electrode spacer 327 may be frictionally fitted to the housing 311 and the first electrode 322 to secure the first electrode 22 within the housing 31 1. In one illustrative embodiment, the electrode spacer 327 may be formed from a dielectric material, such as ceramic. In another embodiment, the electrode spacer 327 may be formed integrally with the housing 31 1.
[0095] The first electrode 322 also includes an insulative layer 343, which may be formed integrally with the housing 31 1 and the electrode spacer 327. In another illustrative embodiment, the layer 343 may be formed from a dielectric material deposited as a film unto or grown on the inner conductor via processes including, but not limited to, sputtering, chemical vapor (e.g., atomic layer deposition, evaporation, electrochemical methods, or ion implantation.). The insulative layer 343 may also be a native metal oxide or nitride if the first electrode 332 is formed from a suitable alloy, such as aluminum and titanium, hi particular, the first electrode 322 may be formed from an aluminum alloy and the layer 342 may be aluminum oxide (Al2O3) or aluminum nitride (AlN). In another illustrative embodiment, the first electrode 322 may be formed from a titanium alloy and the layer 342 may be titanium oxide (TiO2) or titanium nitride (TiN).
[0096] The second electrode 323 is formed from a conductive or semiconductive porous material, such as metal and metal-ceramic composite meshes, porous sintered solids and the like to permit the flow of plasma feedstocks 328 therethrough. The second electrode 323 also disperses the plasma passing through the housing 311 to generate a wide-area plasma effluent 329.
[0097] One of the electrodes 322 and 323 may be an active electrode and the other may be a neutral or return electrode to facilitate in RF energy coupling. Each of the electrodes 322 and 323 are coupled to the power source 14 that drives plasma generation, such that the energy from the power source 14 may be used to ignite the plasma feedstocks flowing through the device 312. The electrodes 322 and 323 are capacitively or inductively coupled through the plasma effluent 329 and the housing 311. More specifically, the ionizable media and the precursors flow through the device 312 through the chambered opening 325. As energy is applied to the electrodes 322 and 323, the plasma feedstocks are ignited to form the plasma effluent 329.
[0098] Figs. HA - C show another illustrative embodiment of a plasma device 412 which includes a housing 411 and a dielectric spacer 432 having disk-like or toroidal shape disposed within the housing 411. The dielectric spacer 432 may be frictionally fitted to the housing 411. In one illustrative embodiment, the dielectric spacer 432 may be formed integrally with the housing 411.
[0099] The dielectric spacer 432 includes a bottom surface 426 and a top surface 424 that is coupled to the ionizable media source 16 and the precursor source 18 (Fig. 1). The electrode spacer 432 may be formed from a dielectric material, such as ceramic, plastic, and the like. The dielectric spacer 432 includes one or more openings 434 through the center thereof to allow for the flow of plasma feedstocks 428 therethrough. In one illustrative embodiment, the dielectric spacer 432 may be formed from a porous dielectric media suitable for allowing gases to flow therethrough thereby obviating the need for openings 434. The multiple openings 434 and/or porous nature of the dielectric spacer 432 provide for dispersion of the plasma passing therethrough to generate a wide-area plasma effluent 429. The openings 434 may be of various shapes and sizes. Fig. 1 IB shows the openings 434 as slits formed in the dielectric spacer 432. Fig. HC shows the openings 434 as substantially cylindrical lumens. At its widest thickness g, the openings 434 may be from about 0.1 cm to about 1.0 cm.
[00100] The plasma device 412 also includes first and second electrodes 422 and 423 disposed within the dielectric spacer 432. The first and second electrodes 422 and 423 may be cylindrical rods, formed from a conductive metal (e.g., aluminum alloy) and may be inserted into the dielectric spacer 432 in parallel configuration and equidistant from the center of the dielectric spacer 432. The dielectric spacer 432 provides capacitive coupling between the inner and outer electrodes 422 and 423. In one embodiment electrodes 422 and 423 may have one or more regions that form and present sharpened protuberances toward openings 434 to increase the local electric fields.
[00101] One of the electrodes 422 and 423 may be an active electrode and the other may be a neutral or return electrode to facilitate in RF energy coupling. Each of the electrodes 422 and 423 are coupled to the power source 14 that drives plasma generation, such that the energy from the power source 14 may be used to ignite the plasma feedstocks flowing through the device 412. The electrodes 422 and 423 are capacitively coupled through the plasma effluent 429 and the dielectric spacer 432. More specifically, the ionizable media and the precursors flow through the device 412 through the openings 434. As energy is applied to the electrodes 422 and 423, the plasma feedstocks are ignited to form the plasma effluent 429.
[00102] Figs. 12A - B show another illustrative embodiment of a plasma device 512 which includes a dielectric spacer 532 having a substantially disk shape. The plasma device 512 includes a bottom surface 526 and a top surface 524 that is coupled to the ionizable media source and the precursor source 18 (Fig. 1). The electrode spacer 532 may be formed from a dielectric material, such as ceramic, plastic, and the like. In one illustrative embodiment, the dielectric spacer 532 may be formed from a porous dielectric media suitable for allowing gases to flow therethrough, or otherwise have open ports to allow flow of plasma feedstocks 528 through the plasma device 512. The electrode spacer 532 may have a thickness h from about 0.1 cm to about 1.0 cm.
[00103] The plasma device 512 also includes first and second electrodes 522 and 523.
The first and second electrodes 522 and 523 may also have a disk or plate shape and are disposed on the top and bottom surfaces 524 and 526, respectively. The first and second electrodes 522 and 523 are formed from a conductive or semiconductive porous material, such as metal and metal-ceramic composite meshes, porous sintered solids, and the like to permit the flow of plasma feedstocks 528 therethrough, or otherwise have open ports to allow flow of plasma feedstocks 528 through the plasma device 512. The first and second electrodes 522 and 523 may have a diameter / from about 0.1 cm to about 1.0 cm and a thicknessy from about 0.1 cm to about 1.0 cm.
[00104] The dielectric spacer 532 may have a larger diameter extending outside the periphery of the first and second electrodes 522 and 523, such that a border k is formed, which may be from about 0.1 cm to about 1.0 cm. This configuration enhances capacitive coupling between the inner and outer electrodes 522 and 523. One or both of electrodes 522 and 523 may also be formed into predetermined surface shapes and features to induce effects such as inductive coupling. The porous nature of the dielectric spacer 532 in conjunction with the first and second electrodes 522 and 523 provides for dispersion of the plasma passing therethrough to generate a wide-area plasma effluent 529.
[00105] One of the electrodes 522 and 523 may be an active electrode and the other may be a neutral or return electrode to facilitate in RF energy coupling. Each of the electrodes 522 and 523 are coupled to the power source 14 that drives plasma generation, such that the energy from the power source 14 may be used to ignite the plasma feedstocks 528 flowing through the device 512. The ionizable media and the precursors flow through the device 512 and as energy is applied to the electrodes 522 and 523, the plasma feedstocks are ignited to form the plasma effluent 529.
[00106] Fig. 13 shows another illustrative embodiment of a plasma device 612, which is a combination of the plasma device 212 of Fig. 9 and plasma device 512 of Fig. 12. The plasma device 612 includes a housing 611 enclosing a dielectric spacer 632 having disk shape, a first electrode 622 and a second electrode 623. The housing 611 may have an inner diameter / of 10 cm or less. The plasma device 612 includes a bottom surface 626 and a top surface 624 that is coupled to the ionizable media source 16 and the precursor source 18 (Fig. 1). The dielectric spacer 632 may be formed from a dielectric material, such as ceramic, plastic, and the like. In one illustrative embodiment, the dielectric spacer 632 may be formed from a porous dielectric media suitable for allowing gases to flow therethrough. The dielectric spacer 632 has a thickness m from about 0.1 cm to about 1.0 cm. [00107] The first and second electrodes 622 and 623 may also have a disk or plate shape and are disposed on the top and bottom surfaces 627 and 629, respectively. The first and second electrodes 622 and 623 have a thickness n from about 0.1 cm to about 1.0 cm and are formed from a conductive porous material, such as metal and metal-ceramic composite meshes, porous sintered solids, and the like to permit the flow of plasma feedstocks 628 therethrough. The porous nature of the dielectric spacer 632 in conjunction with the first and second electrodes 622 and 623 provides for dispersion of the plasma passing therethrough to generate a wide-area plasma effluent 629. The dielectric spacer 632 also provides for capacitive coupling between the inner and outer electrodes 622 and 623. [00108] One of the electrodes 622 and 623 may be an active electrode and the other may be a neutral or return electrode to facilitate in RF energy coupling. Each of the electrodes 622 and 623 are coupled to the power source 14 that drives plasma generation, such that the energy from the power source 14 may be used to ignite and sustain the plasma feedstocks 628 flowing through the device 612. In one embodiment one electrode may be a solid and the second electrode formed into a spiral or other highly inductive form to achieve inductive coupling. The ionizable media and the precursors 628 flow through the device 612 and as energy is applied to the electrodes 622 and 623, the plasma feedstocks are ignited to form the plasma effluent 629.
[00109] Figs. 14 and 15 show an illustrative embodiment of a plasma system 1100.
The system 1100 includes a plasma device 1112 that is coupled to a power source 1114, an ionizable media source 1 116 and a precursor source 1118. Power source 1114 includes a signal generator 1250 coupled to an amplifier 1252. The signal generator 1250 outputs a plurality of control signals to the amplifier 1252 reflective of the desired waveform. The signal generator 1250 allows for control of desired waveform parameters (e.g., frequency, duty cycle, amplitude, pulsing, etc.). In some embodiments, signal generator 1250 may pulse the waveform, e.g., a continuous-wave waveform signal may be switched on and off at a duty cycle (the duty cycle may be fixed or variable) and at a different frequency from the frequency of the continuous-wave waveform. The amplifier 1252 outputs the desired waveform at a frequency from about 0.1 MHz to about 2,450 MHz and in another embodiment from about 1 MHz to about 13.56 MHz. The power source 1114 also includes a matching network 1254 coupled to the amplifier 1252. The matching network 1254 may include one or more reactive and/or capacitive components that are configured to match the impedance of the load (e.g., plasma effluent) to the power source 1114 by switching the components or by frequency tuning.
[00110] The power source 1 114 is coupled to a plasma device 1112. As shown in Fig.
15, the plasma device 1112 may be utilized for application of plasma to tissue. The device 1112 includes an inner electrode 1 122, which may be an aluminum alloy rod, disposed coaxially within an outer electrode 1 123. The outer electrode 1123 may be an aluminum alloy tube having an opening 1 125. As shown in Fig. 14, the inner and outer electrode 1 122 and 1 123 are coupled to the power source 1114 via connectors 1256 and 1258, which are disposed around the inner electrode 1 122 and 1 123, respectively. The connectors 1256 and 1258 may be copper connector blocks.
[00111] With reference to Fig. 15, the device 1112 also includes a ceramic electrode spacer 1127 disposed between the inner and outer electrodes 1122 and 1 123. The electrode spacer 1 127 may be disposed at any point between the inner and outer electrodes 1122 and 1123 to provide for a coaxial configuration between the inner and outer electrodes 1122 and 1123. The electrode spacer 1 127 is substantially similar to the electrode spacer 27 and may include a central opening (not explicitly shown) adapted for insertion of the inner electrode 1122 therethrough and one or more flow openings (not explicitly shown) disposed radially around the central opening to allow for the flow of plasma feedstocks through the device 1112. The electrode spacer 1127 may be frictionally fitted to the electrodes 1122 and 1123 to secure the inner electrode 1122 within the outer electrode 1123. One of the electrodes 1122 and 1123 may be an active electrode and the other may be a neutral or return electrode to facilitate in RF energy coupling.
[00112] With reference to Fig. 14, the plasma system 1100 also includes an ionizable media source 1116 and a precursor source 1118 coupled to the plasma device 1 112. The ionizable media source 1116 provides ionizable feedstock, namely, helium gas, to the plasma device 1112. The ionizable media source 1116 includes a storage tank for storing the helium gas. The ionizable media source 1 116 is coupled to the precursor source 1118 via tubing 1262, which includes tubing 1262a coupled to the ionizable media source 1116. The tubing 1262a branches into tubing 1262b and 1262c. The tubing 1262c is coupled to the precursor source 1118, which may be a bubbler or a nebulizer, for aerosolizing precursor feedstocks, namely liquid hydrogen peroxide, prior to introduction thereof into the device 1112. The feedstocks are mixed upstream of the device 1112 prior to introduction thereto. [00113] The tubing 1262b bypasses the tubing 1262c and reconnects at tubing 1262d, which is coupled to the plasma device 1112 at a coupling 1264. The coupling 1264 may be a Teflon union tee connected to the outer electrode 1123. The tubing 1262 also includes valves 1260a, 1260b, 1260c which control the flow of the helium gas and the hydrogen peroxide through the tubing 1262a, 1262b, 1262c, respectively. The tubing 1262 further includes mass flow controllers 1266b and 1266c adapted to control the flow of plasma feedstocks through the tubing 1260b and 1260c, respectively.
[00114] The system 1100 provides a flow of plasma through the device 1112 to the tissue. Plasma feedstocks, which include helium gas and hydrogen peroxide, are supplied by the ionizable media source 1 116 and the precursor source 1118, respectively, to the plasma device 1112, which are ignited to form plasma effluent containing ions, radicals, photons from the specific excited species and metastables that carry internal energy to drive desired chemical reactions with the tissue or at the surface thereof.
[00115] With reference to Fig. 16, a close-up, side view of a plasma device 1112 according to the present disclosure. Plasma device 1 112 includes the inner electrode 1122 and the outer electrode 1123. The plasma device 1112 also includes a coating 1124 disposed on the outer surface of the inner electrode 1122 and on the inner surface of the outer electrode 1123. The coating 1 124 is substantially similar to the coating 24 that is discussed above with respect to Figs. 4-6. In one embodiment, the plasma device 11 12 may also include additional features discussed above with respect to Figs. 4-6 such as grooves disposed in a parallel or spiral configurations, nanostructure pores filled with precursor materials, and/or vents within the inner electrode 1 122. In another embodiment, the inner electrode 1122 may be disposed in a variety of configurations and spatial orientation with respect to the outer electrode 1123. In particular, the inner electrode 1122 may be recessed, flush or extended relative to the outer electrode 1123 as shown in Figs. 2B - 2D. The extended distance of the inner electrode 1122 may also be adjustable as discussed above with respect to Figs. 2A - 2D. [00116] Fig. 16 illustrates working ranges LRJ, LR 2 and LR 3, and a distance Dy. Outer electrode 1 123 includes a working range LRj] of energetic secondary electron emissions. Inner electrode 1122 includes working ranges LR>2, and LR 3 of energetic secondary electron emissions having energy E. In other words, the working ranges are representative of the thickness of energetic electron sheath layers 1133 and 1134, which are disposed about the inner and outer electrodes 1122 and 1 123, respectively. A gap distance Δ shows the zone where the concentration of energetic secondary electrons is relatively lower. Coating the electrodes, as discussed above, reduces gap distance Δ. In some embodiments, distance Δ may be reduced to zero and/or working ranges LR1], and LR>2 may overlap thereby creating an hollow cathode effect. Inner electrode 1112 includes a tip 1128 having a distance DT from tissue "T". Ranges LR I, LR 2 and LR 3, indicate regions with a greatly increased concentration of electrons with relatively high energies that drive reactions in the gas phase. As discussed above, the coating 1124 on electrodes 1122 and/or 1123 can increase or enhance working ranges LR1 i and LR>2, and/or LR 3 of energetic secondary electrons. Thus, varying the thickness of the coating 1124 can be used to adjust the working ranges LR I and LR 2, and/or LRi3. Additionally or alternatively, the distance Dτ that tip 1128 is disposed from tissue "T" is adjustable to achieve a predetermined tissue effect (discussed in more detail below). [00117] (3) R(E) = σ(E) • ne(E) • v(E).
[00118] Formula (3) relates the reaction rate R that indicates an inelastic (energy expending) collision where an electron at energy E, e(E), interacts with gas particle X. As a result of the collision the electron may transfer energy to X. After the collision, the electron and particle will have different energies. The rate or efficiency of this reaction is controlled by the energy dependent cross-section σ(£) of the particular reaction. [00119] Referring now to Figs 17A and 17B that show two plots, respectively. Fig.
17A shows a plot 1700 illustrating typical electron concentrations ne(E) versus energy for alpha-mode and gamma-mode discharges, and a typical collisional reaction cross-section. Plot 1700 includes axes 1702, 1704, and 1706. Axis 1702 shows the number of electrons at energy E (i.e., a distribution). Axis 1704 shows energy E of electrons in electron-volts (eV). Line 1708 illustrates the number of electrons at energy E (axis 1702) versus energy E (axis 1704) as would be found in an alpha-mode discharge. Line 1712 illustrates the number of electrons at energy E (axis 1702) versus energy E (axis 1704) as would be found in a gamma- mode discharge, which results from enhancement of secondary emission in the gamma-mode discharge. The probability of a collisional reaction between an electron and a gas particle depends on the reaction cross-section, σ(E), a general form of which is shown here as a function of energy E (axis 1704) as line 1710. Line 1710 shows the collision cross-section (axis 1706) versus Energy E (axis 1704).
[00120] Referring now to Fig. 17B, plot 1720 shows the calculated point-by-point multiplication product of σ(E)»ne(E), a numeric indication of chemical reaction probability, for each mode of discharge. Plot 1702 includes an axis 1726 indicating the reaction probability at energy E. Line 1728 shows the product σ(E)#ne(E) for an alpha-mode discharge as a function of energy E (axis 1704). Line 1732 shows the product σ(E)#ne(E) for a gamma-mode discharge as a function of energy E (axis 1704). The overall reaction rate for each mode of discharge is related to the integral of each line (the area under each line). The reaction rate is given by the product of this quantity and the velocity distribution v(E), specifically σ(E)*ne(E)*v(E). The components of the product of Fig. 17B are shown in Fig. 17A. Line 1728 indicates the point-by-point multiplication (convolution) of lines 1708 and 1710, and line 1732 indicates the convolution of lines 1712 and 1710.
[00121] Referring again to Fig. 17A, line 1708 shows peak alpha electron emissions occurring at point 1708, and may correspond to an electron- voltage of about 1 eV to about 3 eV. The majority of chemical bonds and/or chemical reactions with the electrons occur within an energy range of about 2 eV to about 10 eV. Line 1710 shows the likelihood of ne(E) with additional secondary electron emissions. This illustrates that the secondary electron emissions increase the probability that chemical reactions of feedstocks with electrons to form reactive radicals occur with tissue "T" within an energy range of secondary electron emissions.
[00122] Referring again to Fig. 16, plasma device 1112 is shown with inner electrode
1 128 disposed a distance Dτ from tissue "T". Distance DT corresponds to the magnitudes of various physicals effects, each energetic physical effect affecting directivity, selectivity, heating and other aspects of the tissue processing of tissue "T". For DT » LR>3 the secondary electrons do not reach the tissue surface. Figs. 18A - 18C include charts illustrating the contributing physical effects affecting tissue "T" as a function of distance DT that inner electrode 1128 is disposed from tissue "T" (see Fig. 16).
[00123] Figs. 18 A and 18B illustrate the chemical effect, heating effect, and a blend of the two as a mixture effect that the plasma device 1112 has on tissue "T" (see Fig. 16). For DT > LR 3 more energetic secondary electrons in volume enhance chemical reactions for the chemical effect and the mixture effect, but produce minimal or no heating effect. As shown in Fig. 18A, impinging secondary electrons on the tissue surface enhance chemical reactions both in the gas volume and at the tissue surface. Secondary electron emissions also enhance tissue surface reactions when DT < LR3 but do not have electron stimulated surface reactions when DT < LR3. In summary for the energetic secondary electron emissions to enhance tissue surface reactions, the condition of formula (4) must be satisfied as follows:
[00124] (4) 0 < Dτ ≤LR 3
[00125] Fig. 18A also shows a condition during which the inner electrode 1 122 touches tissue "T" (see Fig. 16) therefore making Dτ< 0. When the inner electrode 1122 touches tissue "T", chemical effects are mostly blocked, while bulk heating effects are enhanced. This case is mostly dominated by I2R or j2p (Ohmic) heating. When inner electrode 1122 touches tissue "T", the inner electrode thermally conducts heat to the tissue. Additionally, inner electrode 1122 is capacitively coupled to Tissue "T" (when touching) and electrically conducts energy thereto. Also, when inner electrode 1122 touches the tissue, the reacted tissue is moved away exposing un-reacted tissue.
[00126] With reference to Fig. 18B, a chart illustrating effects of coating is shown.
Coatings enhance secondary electron emissions, thereby increasing radical fluxes and energetic electrons as well as facilitate the surface heating effect. The electrode coating 1124 increases radical densities to enhance tissue reactions at surfaces for the chemical effect. For the heating effect, the electrode coating 1124 increases radical, secondary and electron flux to enhance surface reactions on tissue.
[00127] With reference to Fig. 18C, various effects of disposing inner electrode 1122 in spaced relation to tissue are illustrated. Although, Fig. 18C refers to the inner electrode 1122, in some embodiments, the outer electrode 1124 may be disposed in spaced relation to the tissue "T", both electrodes 1 122 and 1124 may be disposed in spaced relation to the tissue "T", or the sheath having a working range LR>] may be disposed in spaced relation to tissue "T". Additionally or alternatively, one or more of plasma devices plasma device as described with reference to any one of Fig. 1 through 16 may be combined with the teachings of with Figs. 18A - 18C and may be chosen to achieve a target tissue effect or result. Anyone one or more of the chemical effect, the heating effect, the directivity, the selectivity, or any other effect as described in Fig. 18C may be selected as a desired (or target) effect, and a plasma device as described with reference to any one of Fig. 1 through 16 (or equivalents or combinations thereof), the plasma device's position in relation to tissue "T", and/or the power applied to the plasma device may be adjusted or controlled for to achieve the desired tissue effect(s).
[00128] Fig. 18C will be described as follows with reference to plasma device 1 1 12 of
Fig. 16. When the electron sheaths are not in contact with tissue "T" (e.g., the sheath having working range LR,3) the heating effect is minimal (or no effect), the chemical effect is limited by lateral diffusion loss away from the tissue, directionality is present due to gas transport, and selectivity is present and is chemistry dominated. When the sheath is in contact with tissue, the heating effect is small or limited, the chemical effect is strong (both chemical and electron flux effects), directionality is strongest (both gas transport and electron flux), and selectivity is strong (both chemical and electron flux effects). When the inner electrode 1122 touches tissue "T," the heating effect is a strong effect, the chemical effect is present but is reduced at the tissue-electrode interface, there is some directionality, and there is some selectivity on the sides but is reduced at the tissue-electrode interface. When the center electrode (e.g., inner electrode 1 122) extends into tissue, the heating effect is maximum, the chemical effect is limited (or minimal), the electrode shape dominates directionality, and for selectivity: the thermal effects dominate and there is some selectivity on the sides When the inner electrode 1122 extends into tissue or otherwise touches tissue "T", the inner electrode 1122 transfers thermal energy to the tissue and is capacitively coupled to the tissue thereby conducting electricity through tissue "T".
[00129] With reference to Fig. 19, a method 1900 for treating tissue is shown according to the present disclosure. Step 1902 provides a plasma device. Step 1904 selects a tissue effect. The tissue effect of step 1904 may be a heating effect, a chemical effect and/or a mixture effect as described above with respect to the Fig. 18 A. Step 1906 positions the plasma device in spaced relation to the tissue in accordance with the selected tissue effect. Step 1908 generates plasma. Step 1910 emits secondarily emitted electrons via secondary electron emissions. The secondary electrons may be controlled to achieve one or more magnitudes of one or more selected tissue effects.
[00130] With reference to Fig. 20, a flow chart diagram of a method 2000 of plasma tissue treatment is illustrated according to the present disclosure. Step 2002 provides a plasma device. Step 2004 selects a target directivity and/or a target selectivity as described above with respect to the Fig. 18C. Directional secondary electrons predominately impinge on the bottom, as opposed to the sidewalls, of the tissue cuts. Preferential irradiation of the bottom results in a directional tissue removal. Choice of chemical radical flux and tissue type change the tissue removal rate, allowing the removal of one tissue type but not another. Selectivity between tissue types > 15 are achievable.
[00131] Step 2006 selects target magnitudes of a heating effect and/or a chemical effect according to the target directivity and/or target selectivity. Step 2008 positions the plasma device in spaced relation to tissue in accordance with (1) the target magnitude of a heating effect; (2) the target magnitude of a chemical effect; (3) the target directivity; and/or (4) the target selectivity. The selected relative magnitudes of the surface heating and chemical effects may be a function of the selected directivity and/or selectivity. Step 2010 generates a plasma including energetic secondarily emitted electrons which may (DT < LR3) or may not (DT > LR3) impinge on the tissue surface.
EXAMPLE 1
[00132] For example 1, refer to Fig. 21 showing a gray-scale photograph of an example of plasma discharge having drawings thereon showing various regions according to the present disclosure. Fig. 21 shows an inner electrode 2102, an outer electrode 2104, and an energetic electron sheath layer 2106. The working ranges LR^2 and LR>3 are identified. The energetic electron sheath layer 2106 was photographed as having a generally purple color around a region about inner electrode 2102. The general thickness of the generally-purple energetic electron sheath layer 2106 had a thickness of about LR 3 near the distal end of inner electrode 2102 and a thickness of about LR 2 in the region where electron sheath 2106 begins to extend to within outer electrode 2104. The plasma system was setup as shown in Figs. 14 and 15 utilizing Helium gas as ionizable media, which has a relatively high O(E) resulting in small LR3 and at location Dτ and lack of secondary electrons, due to a relatively high electron collision cross section of Helium atoms. The σFeedstock(E) for the feedstock chemistry acts in the same way.
[00133] Fig. 23 shows a color photograph of the plasma discharge of Fig. 21 according to the present disclosure. Fig. 23 also shows the inner electrode 2102, the outer electrode 2104, and the energetic electron sheath layer 2106. The working ranges LR 2 and LR 3 are identified. The energetic electron sheath layer 2106 is shown having a generally-purple color around a region about inner electrode 2102. The general thickness of the generally-purple energetic electron sheath layer 2106 had a thickness of about LR>3 near the distal end of inner electrode 2102 and a thickness of about LR 2 in the region where energetic electron sheath layer 2106 begins to extend into within outer electrode 2104. EXAMPLE 2
[00134] For example 2, refer to Fig. 22 showing a color photograph of an example of plasma discharge having drawings thereon showing various regions according to the present disclosure. Fig. 22 shows an inner electrode 2108, an outer electrode 21 10, and an energetic electron sheath layer 2112. The working ranges LR 2 and LR 3 are identified. The energetic electron sheath layer 21 12 was photographed as having a generally orange-like color around a region about inner electrode 2108. The general thickness of the generally orange-like energetic electron sheath layer 21 12 had a thickness of about LR 3 near the distal end of inner electrode 2108 and a thickness of about LR 2 in the region where energetic electron sheath layer 2106 begins to extend to within outer electrode 2110. The plasma system was setup as shown in Figs. 14 and 15 utilizing Argon gas as ionizable media, which has a relatively low σ, resulting in a large LR3 and at location Dτ an abundance of energetic secondary electrons. The plasma effluent included a orange-like sheath layer in the extended region LR3 that is brighter and bigger than the LR3 of Example 1 , which indicates more efficient excitation of gas atoms due to increased collisions with energetic electrons. In addition, the plasma effluent included a congruent larger orange-like layer that is believed to be produced by the energetic electrons within working distance LR3.
[00135] Fig. 24 shows a color photograph of the plasma discharge of Fig. 22 according to the present disclosure. Fig. 24 also shows the inner electrode 2108, the outer electrode 2110, and the energetic electron sheath layer 21126. The working ranges LR;2 and LRJ3 are identified. The energetic electron sheath layer 21 12 is shown having a generally orange-like color around a region about inner electrode 2108. The general thickness of the generally orange-like energetic electron sheath layer 2112 had a thickness of about LR;3 near the distal end of inner electrode 2108 and a thickness of about LR12 in the region where energetic electron sheath layer 21 12 begins to extend into within outer electrode 2110. [00136] Although the illustrative embodiments of the present disclosure have been described herein with reference to the accompanying drawings, it is to be understood that the disclosure is not limited to those precise embodiments, and that various other changes and modifications may be effected therein by one skilled in the art without departing from the scope or spirit of the disclosure. Another example is overlapping working distances LRI and LR2 which causes hollow cathode enhancement of the radical flux density in the volume and RF at the surface. In particular, as discussed above this allows the tailoring of the relative populations of plasma species to meet needs for the specific process desired on the workpiece surface or in the volume of the reactive plasma.

Claims

What is claimed is:
1. A plasma system, comprising: a plasma device including an inner electrode and an outer electrode coaxially disposed around the inner electrode, wherein the inner electrode includes a distal portion and an insulative layer that covers at least a portion of the inner electrode; an ionizable media source coupled to the plasma device and configured to supply ionizable media thereto; and a power source coupled to the inner and outer electrodes and configured to ignite the ionizable media at the plasma device to form a plasma effluent having an electron sheath layer about the distal portion.
2. A plasma system according to claim 1, wherein the insulative layer is configured to limit the plasma effluent to the distal portion and to provide a source of secondarily-emitted electrons that form at least a part of the electron sheath layer.
3. A plasma system according to claim 2, wherein the insulative layer is formed from a material having a secondary electron emission yield from about 1 to about 10.
4. A plasma system according to claim 1, wherein the inner conductor is formed from a conductive metal and the insulative layer is a metallic oxide of the conductive metal.
5. A plasma system according to claim 1, wherein the plasma device further includes an electrode spacer disposed between the inner and outer electrodes.
6. A plasma system according to claim 5, wherein the electrode spacer includes a central opening defined therein and adapted for insertion of the inner electrode therethrough.
7. A plasma system according to claim 6, wherein the electrode spacer includes at least one flow opening defined therein and configured to receive the flow of the ionizable media, the at least one flow opening being disposed radially around the central opening.
8. A plasma device configured to receive ionizable media, comprising: an outer electrode having a substantially cylindrical tubular shape; and an inner electrode coaxially disposed within the outer electrode, the inner electrode including a distal portion and an insulative layer that covers at least a portion of the inner electrode, the insulative layer configured to limit the plasma effluent to the distal portion and to provide a source of secondarily-emitted electrons to form an electron sheath layer about the distal portion.
9. A plasma device according to claim 8, wherein the insulative layer is formed from a material having a secondary electron emission yield from about 1 to about 10.
10. A plasma device according to claim 8, wherein the inner conductor is formed from a conductive metal and the insulative layer is a metallic oxide of the conductive metal.
11. A plasma device according to claim 8, wherein the plasma device further includes an electrode spacer disposed between the inner and outer electrodes.
12. A plasma device according to claim 11, wherein the electrode spacer includes a central opening defined therein and adapted for insertion of the inner electrode therethrough.
13. A plasma device according to claim 12, wherein the electrode spacer includes at least one flow opening defined therein and configured to receive the flow of the ionizable media, the at least one flow opening being disposed radially around the central opening.
14. A plasma system, comprising: an outer electrode having a substantially cylindrical tubular shape; and an inner electrode coaxially disposed within the outer electrode, the inner electrode includes a distal portion and an insulative layer that covers at least a portion of the inner electrode, the insulative layer configured to limit the plasma effluent to the distal portion and to provide a source of secondarily-emitted electrons; an ionizable media source coupled to the plasma device and configured to supply ionizable media thereto; and a power source coupled to the inner and outer electrodes and configured to ignite the ionizable media at the plasma device to form a plasma effluent having an electron sheath layer of a predetermined thickness formed from the secondarily-emitted electrons, the electron sheath layer being formed about the distal portion.
15. A plasma system according to claim 14, wherein the insulative layer is formed from a material having a secondary electron emission yield from about 1 to about 10.
16. A plasma system according to claim 14, wherein the inner conductor is formed from a conductive metal and the insulative layer is a metallic oxide of the conductive metal.
17. A plasma system according to claim 14, wherein the plasma device further includes an electrode spacer disposed between the inner and outer electrodes.
18. A plasma system according to claim 17, wherein the electrode spacer includes a central opening defined therein and adapted for insertion of the inner electrode therethrough.
19. A plasma system according to claim 18, wherein the electrode spacer includes at least one flow opening defined therein and configured for the flow of the ionizable media, the at least one flow opening being disposed radially around the central opening.
20. A plasma system according to claim 14, wherein the predetermined thickness of the electron sheath layer is adjusted by selecting a specific ionizable media having a predetermined media density and an average particle cross-section.
21. A plasma system according to claim 20, wherein the predetermined thickness of the electron sheath layer is inversely proportional to the media density of the ionizable media and the average particle cross-section.
PCT/US2009/005398 2008-05-30 2009-09-30 Systems and methods for plasma application WO2010138104A1 (en)

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Families Citing this family (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8994270B2 (en) 2008-05-30 2015-03-31 Colorado State University Research Foundation System and methods for plasma application
JP2011522381A (en) 2008-05-30 2011-07-28 コロラド ステート ユニバーシティ リサーチ ファンデーション Plasma-based chemical source apparatus and method of use thereof
US8851012B2 (en) 2008-09-17 2014-10-07 Veeco Ald Inc. Vapor deposition reactor using plasma and method for forming thin film using the same
US8770142B2 (en) 2008-09-17 2014-07-08 Veeco Ald Inc. Electrode for generating plasma and plasma generator
US8871628B2 (en) 2009-01-21 2014-10-28 Veeco Ald Inc. Electrode structure, device comprising the same and method for forming electrode structure
US8257799B2 (en) 2009-02-23 2012-09-04 Synos Technology, Inc. Method for forming thin film using radicals generated by plasma
US8758512B2 (en) 2009-06-08 2014-06-24 Veeco Ald Inc. Vapor deposition reactor and method for forming thin film
EP2442833B1 (en) 2009-06-16 2018-10-17 TheraDep Technologies, Inc. Wound healing device
DE102009041167B4 (en) * 2009-09-11 2021-08-12 Erbe Elektromedizin Gmbh Multifunctional instrument and method for preventing the carbonization of tissue by means of a multifunctional instrument
DE102009044512B4 (en) * 2009-09-11 2021-08-12 Erbe Elektromedizin Gmbh Anti-carbonization device
US9649143B2 (en) * 2009-09-23 2017-05-16 Bovie Medical Corporation Electrosurgical system to generate a pulsed plasma stream and method thereof
US8222822B2 (en) 2009-10-27 2012-07-17 Tyco Healthcare Group Lp Inductively-coupled plasma device
JP5553460B2 (en) * 2010-03-31 2014-07-16 コロラド ステート ユニバーシティー リサーチ ファウンデーション Liquid-gas interface plasma device
CA2794895A1 (en) 2010-03-31 2011-10-06 Colorado State University Research Foundation Liquid-gas interface plasma device
US8834462B2 (en) 2010-06-01 2014-09-16 Covidien Lp System and method for sensing tissue characteristics
EP2394693A1 (en) * 2010-06-10 2011-12-14 Golsen Limited Electrical impulse stimulation device for the healing of wounds
US8771791B2 (en) 2010-10-18 2014-07-08 Veeco Ald Inc. Deposition of layer using depositing apparatus with reciprocating susceptor
US8723423B2 (en) * 2011-01-25 2014-05-13 Advanced Energy Industries, Inc. Electrostatic remote plasma source
US8877300B2 (en) * 2011-02-16 2014-11-04 Veeco Ald Inc. Atomic layer deposition using radicals of gas mixture
US9163310B2 (en) 2011-02-18 2015-10-20 Veeco Ald Inc. Enhanced deposition of layer on substrate using radicals
DE102011103464B4 (en) * 2011-06-03 2013-06-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Plasma ion source for a vacuum coating system
GB201110282D0 (en) * 2011-06-17 2011-08-03 Linde Ag Device for providing a flow of plasma
JP5844119B2 (en) * 2011-11-01 2016-01-13 長野日本無線株式会社 Plasma processing equipment
GB2501933A (en) * 2012-05-09 2013-11-13 Linde Ag device for providing a flow of non-thermal plasma
GB2509063A (en) * 2012-12-18 2014-06-25 Linde Ag Plasma device with earth electrode
DE102013100617B4 (en) * 2013-01-22 2016-08-25 Epcos Ag Device for generating a plasma and handheld device with the device
JP5717888B2 (en) * 2013-02-25 2015-05-13 東京エレクトロン株式会社 Plasma processing equipment
US9532826B2 (en) * 2013-03-06 2017-01-03 Covidien Lp System and method for sinus surgery
US9555145B2 (en) 2013-03-13 2017-01-31 Covidien Lp System and method for biofilm remediation
US20140276717A1 (en) * 2013-03-15 2014-09-18 Covidien Lp Bipolar gas plasma coagulation nozzle
US9376455B2 (en) 2013-11-27 2016-06-28 Veeco Ald Inc. Molecular layer deposition using reduction process
GB201401144D0 (en) * 2014-01-23 2014-03-12 Linde Ag Plasma device
US9133546B1 (en) * 2014-03-05 2015-09-15 Lotus Applied Technology, Llc Electrically- and chemically-active adlayers for plasma electrodes
JP6323260B2 (en) * 2014-08-29 2018-05-16 株式会社島津製作所 High frequency power supply
JP2016132576A (en) * 2015-01-15 2016-07-25 日本碍子株式会社 Electrode and electrode structure
US9666415B2 (en) * 2015-02-11 2017-05-30 Ford Global Technologies, Llc Heated air plasma treatment
US10368939B2 (en) 2015-10-29 2019-08-06 Covidien Lp Non-stick coated electrosurgical instruments and method for manufacturing the same
US10441349B2 (en) 2015-10-29 2019-10-15 Covidien Lp Non-stick coated electrosurgical instruments and method for manufacturing the same
EP3171676B1 (en) * 2015-11-17 2020-06-24 Leibniz-Institut für Plasmaforschung und Technologie e.V. Plasma generating device, plasma generating system and method of generating plasma
JP6974353B2 (en) 2016-02-01 2021-12-01 セラデップ テクノロジーズ インコーポレイテッド Systems and methods for delivering therapeutic agents
US10524849B2 (en) 2016-08-02 2020-01-07 Covidien Lp System and method for catheter-based plasma coagulation
EP3496515B1 (en) * 2016-08-02 2022-09-28 Feagle Co., Ltd Medical device including plasma supply device and plasma enhancement member
LU93222B1 (en) * 2016-09-15 2018-04-11 Luxembourg Inst Science & Tech List Post-discharge plasma coating device for wired substrates
US11583689B2 (en) * 2016-09-22 2023-02-21 Ajou University Industry-Academic Cooperation Foundation Composition for atopy or psoriasis treatment comprising liquid type plasma
CN106896067B (en) * 2017-03-06 2019-06-07 大连理工大学 Annular volume-is generated in atmospheric pressure along the experimental provision of face DBD
CN110662577A (en) * 2017-06-16 2020-01-07 积水化学工业株式会社 Active gas injection device and method for treating animals other than human
EP3639778A4 (en) * 2017-06-16 2021-03-24 Sekisui Chemical Co., Ltd. Medical treatment tool, method for using medical treatment tool, and method for irradiating reactive gas
EP3677306A4 (en) * 2017-08-31 2021-04-07 Sekisui Chemical Co., Ltd. Active gas irradiation device
KR102120552B1 (en) 2017-09-18 2020-06-08 아주대학교산학협력단 Composition for skin-soothing comprising liquid type plasma
US11432869B2 (en) 2017-09-22 2022-09-06 Covidien Lp Method for coating electrosurgical tissue sealing device with non-stick coating
US10709497B2 (en) 2017-09-22 2020-07-14 Covidien Lp Electrosurgical tissue sealing device with non-stick coating
US11690998B2 (en) 2017-10-31 2023-07-04 Theradep Technologies, Inc. Methods of treating bacterial infections
US11532458B2 (en) * 2018-05-30 2022-12-20 Toshiba Mitsubishi-Electric Industrial Systems Corporation Active gas generation apparatus
US20220047880A1 (en) * 2018-09-26 2022-02-17 L'oreal Device for generating cold plasma comprising electrodes and dielectrics
JP2020068180A (en) * 2018-10-26 2020-04-30 国立研究開発法人産業技術総合研究所 Plasma jet generation apparatus and plasma jet generation method
EP3917425A4 (en) * 2019-01-28 2023-01-18 APYX Medical Corporation Electrosurgical devices and systems having one or more porous electrodes
US11207124B2 (en) 2019-07-08 2021-12-28 Covidien Lp Electrosurgical system for use with non-stick coated electrodes
US11107661B2 (en) * 2019-07-09 2021-08-31 COMET Technologies USA, Inc. Hybrid matching network topology
CN114557137A (en) * 2019-10-04 2022-05-27 布莱尼茨等离子科学和技术研究所 System and method for operating a plasma jet configuration
EP3879946B1 (en) 2019-11-12 2023-02-15 Toshiba Mitsubishi-Electric Industrial Systems Corporation Activated gas generation device
WO2021106100A1 (en) 2019-11-27 2021-06-03 東芝三菱電機産業システム株式会社 Active gas generation device
US11369427B2 (en) 2019-12-17 2022-06-28 Covidien Lp System and method of manufacturing non-stick coated electrodes
DE102020117810A1 (en) 2020-07-07 2022-01-13 Olympus Winter & Ibe Gmbh High frequency electrode for use in a surgical handheld device, electrode instrument and resectoscope
US20220273351A1 (en) * 2021-03-01 2022-09-01 Olympus Medical Systems Corp. Treatment device for ablation

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5607509A (en) * 1992-11-04 1997-03-04 Hughes Electronics High impedance plasma ion implantation apparatus
US5961772A (en) * 1997-01-23 1999-10-05 The Regents Of The University Of California Atmospheric-pressure plasma jet
US6502588B2 (en) * 1996-04-15 2003-01-07 The Boeing Company Surface modification using an atmospheric pressure glow discharge plasma source
US20040075375A1 (en) * 2001-01-17 2004-04-22 Kanako Miyashita Plasma display panel and its manufacturing method

Family Cites Families (457)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US438257A (en) 1890-10-14 Picture-frame support
US2213820A (en) 1937-07-16 1940-09-03 Burdick Corp High frequency apparatus for therapeutic and surgical uses
US2598301A (en) 1946-10-19 1952-05-27 Rca Corp Method of and means for indicating frequency by resonance of charged particles
US3308050A (en) * 1960-08-01 1967-03-07 Siderurgie Fse Inst Rech Electric discharge apparatus for chemically reacting flowing gases
US3134947A (en) 1961-11-28 1964-05-26 Honeywell Regulator Co Amplitude stabilized transistor oscillator
FR1340509A (en) 1962-11-27 1963-10-18 Siemens Reiniger Werke Ag Safety device for high frequency surgical devices
US3434476A (en) * 1966-04-07 1969-03-25 Robert F Shaw Plasma arc scalpel
US3492074A (en) * 1967-11-24 1970-01-27 Hewlett Packard Co Atomic absorption spectroscopy system having sample dissociation energy control
US3903891A (en) 1968-01-12 1975-09-09 Hogle Kearns Int Method and apparatus for generating plasma
US4143337A (en) 1968-04-19 1979-03-06 Her Majesty The Queen In Right Of Canada, As Represented By The Minister Of National Defence Method of pumping
US4181897A (en) 1968-06-26 1980-01-01 Westinghouse Electric Corp. High power molecular gas laser
US3687832A (en) * 1970-11-23 1972-08-29 Surface Activation Corp Production of improved polymeric materials using electrical gas discharges
US3938525A (en) 1972-05-15 1976-02-17 Hogle-Kearns International Plasma surgery
US3838242A (en) 1972-05-25 1974-09-24 Hogle Kearns Int Surgical instrument employing electrically neutral, d.c. induced cold plasma
US4017707A (en) 1974-12-04 1977-04-12 Caterpillar Tractor Co. Method of and means for spacing control of plasma arc torch
US4010400A (en) 1975-08-13 1977-03-01 Hollister Donald D Light generation by an electrodeless fluorescent lamp
FR2371691A1 (en) 1976-11-19 1978-06-16 Anvar DEVICE FOR DETECTIONING OR MEASURING ELECTROMAGNETIC RADIATION AND PROCESS FOR IMPLEMENTATION
US4274919A (en) 1977-11-14 1981-06-23 General Atomic Company Systems for merging of toroidal plasmas
US4188426A (en) * 1977-12-12 1980-02-12 Lord Corporation Cold plasma modification of organic and inorganic surfaces
US4245178A (en) 1979-02-21 1981-01-13 Westinghouse Electric Corp. High-frequency electrodeless discharge device energized by compact RF oscillator operating in class E mode
FR2460589A1 (en) 1979-07-04 1981-01-23 Instruments Sa PLASMA GENERATOR
US4517495A (en) * 1982-09-21 1985-05-14 Piepmeier Edward H Multi-electrode plasma source
US4577165A (en) 1983-02-22 1986-03-18 Tokyo Denshi Kagaku Co., Ltd. High-frequency oscillator with power amplifier and automatic power control
US4699082A (en) * 1983-02-25 1987-10-13 Liburdi Engineering Limited Apparatus for chemical vapor deposition
US4629887A (en) 1983-03-08 1986-12-16 Allied Corporation Plasma excitation system
US4629940A (en) 1984-03-02 1986-12-16 The Perkin-Elmer Corporation Plasma emission source
JPH0336375Y2 (en) 1985-03-27 1991-08-01
AT388814B (en) 1985-11-15 1989-09-11 Paar Anton Kg METHOD AND DEVICE FOR PRODUCING AN HF-INDUCED PLASMA PLASMA
JPH0750634B2 (en) * 1985-12-02 1995-05-31 新日本製鐵株式会社 Processing torch using electric discharge
JPS62130777U (en) 1986-02-06 1987-08-18
US4901719A (en) 1986-04-08 1990-02-20 C. R. Bard, Inc. Electrosurgical conductive gas stream equipment
US4781175A (en) * 1986-04-08 1988-11-01 C. R. Bard, Inc. Electrosurgical conductive gas stream technique of achieving improved eschar for coagulation
CH670171A5 (en) * 1986-07-22 1989-05-12 Bbc Brown Boveri & Cie
ES2003363A6 (en) 1986-10-02 1988-11-01 Gh Ind Sa High frequency generator to be used in induction heating, laser, plasma and the alike
SU1438745A1 (en) 1986-12-24 1988-11-23 Всесоюзный научно-исследовательский и испытательный институт медицинской техники Ultrasonic surgical instrument
US4818916A (en) 1987-03-06 1989-04-04 The Perkin-Elmer Corporation Power system for inductively coupled plasma torch
US4956582A (en) 1988-04-19 1990-09-11 The Boeing Company Low temperature plasma generator with minimal RF emissions
US5025373A (en) 1988-06-30 1991-06-18 Jml Communications, Inc. Portable personal-banking system
DE3824970C2 (en) 1988-07-22 1999-04-01 Lindenmeier Heinz Feedback high frequency power oscillator
EP0366876B1 (en) * 1988-10-05 1993-05-12 Mitsubishi Jukogyo Kabushiki Kaisha Exhaust gas treating apparatus
CH677292A5 (en) * 1989-02-27 1991-04-30 Asea Brown Boveri
US5041110A (en) * 1989-07-10 1991-08-20 Beacon Laboratories, Inc. Cart for mobilizing and interfacing use of an electrosurgical generator and inert gas supply
US5223457A (en) 1989-10-03 1993-06-29 Applied Materials, Inc. High-frequency semiconductor wafer processing method using a negative self-bias
JPH03149797A (en) 1989-11-06 1991-06-26 Nkk Corp Transition type plasma torch
EP0507885B1 (en) 1990-01-04 1997-12-03 Mattson Technology Inc. A low frequency inductive rf plasma reactor
US5155547A (en) 1990-02-26 1992-10-13 Leco Corporation Power control circuit for inductively coupled plasma atomic emission spectroscopy
US5098430A (en) 1990-03-16 1992-03-24 Beacon Laboratories, Inc. Dual mode electrosurgical pencil
US5383019A (en) 1990-03-23 1995-01-17 Fisons Plc Inductively coupled plasma spectrometers and radio-frequency power supply therefor
GB9226335D0 (en) 1992-12-17 1993-02-10 Fisons Plc Inductively coupled plasma spectrometers and radio-frequency power supply therefor
NL9000809A (en) 1990-04-06 1991-11-01 Philips Nv PLASMA GENERATOR.
JP3063113B2 (en) * 1990-05-08 2000-07-12 日本電気株式会社 Chemical vapor deposition equipment
DE4019729A1 (en) 1990-06-21 1992-01-02 Leybold Ag ION SOURCE
US5304279A (en) 1990-08-10 1994-04-19 International Business Machines Corporation Radio frequency induction/multipole plasma processing tool
US5159173A (en) 1990-09-26 1992-10-27 General Electric Company Apparatus for reducing plasma constriction by intermediate injection of hydrogen in RF plasma gun
US5256138A (en) 1990-10-04 1993-10-26 The Birtcher Corporation Electrosurgical handpiece incorporating blade and conductive gas functionality
US5135604A (en) 1990-12-04 1992-08-04 Board Of Supervisors Of Louisiana State University And Agricultural And Mechanical College Analysis of radiofrequency discharges in plasma
FR2671929A1 (en) 1991-01-18 1992-07-24 Thomson Tubes Electroniques HEATING GENERATOR BY HIGH FREQUENCY.
US5117088A (en) * 1991-03-13 1992-05-26 The Lincoln Electric Company Device and method for starting electric arc of a welder
DE59105798D1 (en) * 1991-04-15 1995-07-27 Heraeus Noblelight Gmbh Irradiation facility.
EP0519087B1 (en) * 1991-05-21 1997-04-23 Hewlett-Packard GmbH Method for pretreating the surface of a medical device
EP0518544B1 (en) * 1991-06-10 2000-08-30 AT&T Corp. Anisotropic deposition of dielectrics
US6063233A (en) 1991-06-27 2000-05-16 Applied Materials, Inc. Thermal control apparatus for inductively coupled RF plasma reactor having an overhead solenoidal antenna
US20010054601A1 (en) 1996-05-13 2001-12-27 Jian Ding Low ceiling temperature process for a plasma reactor with heated source of a polymer-hardening precursor material
JP3142660B2 (en) 1991-09-02 2001-03-07 株式会社きもと Glow discharge plasma generating electrode and reactor using this electrode
US5849136A (en) 1991-10-11 1998-12-15 Applied Materials, Inc. High frequency semiconductor wafer processing apparatus and method
US5449356A (en) 1991-10-18 1995-09-12 Birtcher Medical Systems, Inc. Multifunctional probe for minimally invasive surgery
DE9117019U1 (en) 1991-11-27 1995-03-09 Erbe Elektromedizin GmbH, 72072 Tübingen Device for the coagulation of biological tissues
DE4139029C2 (en) 1991-11-27 1996-05-23 Erbe Elektromedizin Device for the coagulation of biological tissues
DE9117299U1 (en) 1991-11-27 2000-03-23 Erbe Elektromedizin GmbH, 72072 Tübingen Device for the coagulation of biological tissue
US6109268A (en) 1995-06-07 2000-08-29 Arthrocare Corporation Systems and methods for electrosurgical endoscopic sinus surgery
US7297145B2 (en) 1997-10-23 2007-11-20 Arthrocare Corporation Bipolar electrosurgical clamp for removing and modifying tissue
US6142992A (en) 1993-05-10 2000-11-07 Arthrocare Corporation Power supply for limiting power in electrosurgery
US6053172A (en) 1995-06-07 2000-04-25 Arthrocare Corporation Systems and methods for electrosurgical sinus surgery
US6355032B1 (en) 1995-06-07 2002-03-12 Arthrocare Corporation Systems and methods for selective electrosurgical treatment of body structures
US6102046A (en) 1995-11-22 2000-08-15 Arthrocare Corporation Systems and methods for electrosurgical tissue revascularization
US6086585A (en) 1995-06-07 2000-07-11 Arthrocare Corporation System and methods for electrosurgical treatment of sleep obstructive disorders
US6296638B1 (en) 1993-05-10 2001-10-02 Arthrocare Corporation Systems for tissue ablation and aspiration
US6190381B1 (en) 1995-06-07 2001-02-20 Arthrocare Corporation Methods for tissue resection, ablation and aspiration
US6063079A (en) 1995-06-07 2000-05-16 Arthrocare Corporation Methods for electrosurgical treatment of turbinates
US6024733A (en) 1995-06-07 2000-02-15 Arthrocare Corporation System and method for epidermal tissue ablation
US6770071B2 (en) 1995-06-07 2004-08-03 Arthrocare Corporation Bladed electrosurgical probe
US6974453B2 (en) 1993-05-10 2005-12-13 Arthrocare Corporation Dual mode electrosurgical clamping probe and related methods
US6183469B1 (en) 1997-08-27 2001-02-06 Arthrocare Corporation Electrosurgical systems and methods for the removal of pacemaker leads
US5902272A (en) 1992-01-07 1999-05-11 Arthrocare Corporation Planar ablation probe and method for electrosurgical cutting and ablation
US7429262B2 (en) 1992-01-07 2008-09-30 Arthrocare Corporation Apparatus and methods for electrosurgical ablation and resection of target tissue
US6210402B1 (en) 1995-11-22 2001-04-03 Arthrocare Corporation Methods for electrosurgical dermatological treatment
US5683366A (en) 1992-01-07 1997-11-04 Arthrocare Corporation System and method for electrosurgical tissue canalization
US6500173B2 (en) 1992-01-07 2002-12-31 Ronald A. Underwood Methods for electrosurgical spine surgery
US5697882A (en) 1992-01-07 1997-12-16 Arthrocare Corporation System and method for electrosurgical cutting and ablation
US5843019A (en) 1992-01-07 1998-12-01 Arthrocare Corporation Shaped electrodes and methods for electrosurgical cutting and ablation
DE9200452U1 (en) 1992-01-16 1992-06-04 Rau, Horst-Günter, Dr.med., 8000 München High frequency power assisted high pressure liquid jet cutting device
US5280154A (en) 1992-01-30 1994-01-18 International Business Machines Corporation Radio frequency induction plasma processing system utilizing a uniform field coil
US5586982A (en) * 1992-04-10 1996-12-24 Abela; George S. Cell transfection apparatus and method
JP3215487B2 (en) 1992-04-13 2001-10-09 セイコーインスツルメンツ株式会社 Inductively coupled plasma mass spectrometer
EP0636285B1 (en) 1992-04-16 1996-09-04 Advanced Energy Industries, Inc. Stabilizer for switch-mode powered rf plasma processing
US5300068A (en) 1992-04-21 1994-04-05 St. Jude Medical, Inc. Electrosurgical apparatus
JP2572924B2 (en) 1992-09-04 1997-01-16 醇 西脇 Surface treatment method of metal by atmospheric pressure plasma
US5526138A (en) 1992-10-05 1996-06-11 Asahi Kogaku Kabushiki Kaisha Still video device in which image signals corresponding to one frame can be divided and recorded on a plurality of tracks
US5720745A (en) 1992-11-24 1998-02-24 Erbe Electromedizin Gmbh Electrosurgical unit and method for achieving coagulation of biological tissue
JPH06196419A (en) * 1992-12-24 1994-07-15 Canon Inc Chemical vapor deposition device and manufacture of semiconductor device using same
US5466424A (en) * 1992-12-28 1995-11-14 Bridgestone Corporation Corona discharge surface treating method
US5401350A (en) 1993-03-08 1995-03-28 Lsi Logic Corporation Coil configurations for improved uniformity in inductively coupled plasma systems
US5320621A (en) 1993-05-05 1994-06-14 Birtcher Medial Systems, Inc. Technique for incorporating an electrode within a nozzle
US6235020B1 (en) 1993-05-10 2001-05-22 Arthrocare Corporation Power supply and methods for fluid delivery in electrosurgery
US6832996B2 (en) 1995-06-07 2004-12-21 Arthrocare Corporation Electrosurgical systems and methods for treating tissue
US6896674B1 (en) 1993-05-10 2005-05-24 Arthrocare Corporation Electrosurgical apparatus having digestion electrode and methods related thereto
US6391025B1 (en) 1993-05-10 2002-05-21 Arthrocare Corporation Electrosurgical scalpel and methods for tissue cutting
US6254600B1 (en) 1993-05-10 2001-07-03 Arthrocare Corporation Systems for tissue ablation and aspiration
US6915806B2 (en) 1993-05-10 2005-07-12 Arthrocare Corporation Method for harvesting graft vessel
JP3147137B2 (en) * 1993-05-14 2001-03-19 セイコーエプソン株式会社 Surface treatment method and device, semiconductor device manufacturing method and device, and liquid crystal display manufacturing method
DE4326037C2 (en) 1993-08-03 1997-01-16 Dieter C Dr Med Goebel Laser device
US5449432A (en) 1993-10-25 1995-09-12 Applied Materials, Inc. Method of treating a workpiece with a plasma and processing reactor having plasma igniter and inductive coupler for semiconductor fabrication
US5780862A (en) * 1994-01-11 1998-07-14 Siess; Harold E. Method and apparatus for generating ions
AU2003195A (en) 1994-06-21 1996-01-04 Boc Group, Inc., The Improved power distribution for multiple electrode plasma systems using quarter wavelength transmission lines
DK0784452T3 (en) 1994-08-29 2004-02-16 Plasma Surgical Invest Ltd Apparatus for stopping bleeding in living human and animal tissues
US5777289A (en) 1995-02-15 1998-07-07 Applied Materials, Inc. RF plasma reactor with hybrid conductor and multi-radius dome ceiling
JPH07176399A (en) * 1994-10-24 1995-07-14 Tokyo Electron Ltd Plasma processing device
WO1996019716A1 (en) 1994-12-20 1996-06-27 Varian Australia Pty. Ltd. Spectrometer with discharge limiting means
CA2209204C (en) 1994-12-30 2000-02-15 Technova Incorporated Medical coagulation apparatus
JPH08279495A (en) * 1995-02-07 1996-10-22 Seiko Epson Corp Method and system for plasma processing
EP0726593A1 (en) 1995-02-13 1996-08-14 Applied Materials, Inc. A high power, plasma-based, reactive species generator
US5688357A (en) 1995-02-15 1997-11-18 Applied Materials, Inc. Automatic frequency tuning of an RF power source of an inductively coupled plasma reactor
JPH08243755A (en) 1995-03-03 1996-09-24 Mitsubishi Materials Corp Welding torch for cladding by plasma arc welding
US6213999B1 (en) 1995-03-07 2001-04-10 Sherwood Services Ag Surgical gas plasma ignition apparatus and method
US6203542B1 (en) 1995-06-07 2001-03-20 Arthrocare Corporation Method for electrosurgical treatment of submucosal tissue
US6602248B1 (en) 1995-06-07 2003-08-05 Arthro Care Corp. Methods for repairing damaged intervertebral discs
US6264650B1 (en) 1995-06-07 2001-07-24 Arthrocare Corporation Methods for electrosurgical treatment of intervertebral discs
US6159208A (en) 1995-06-07 2000-12-12 Arthocare Corporation System and methods for electrosurgical treatment of obstructive sleep disorders
US5554172A (en) 1995-05-09 1996-09-10 The Larren Corporation Directed energy surgical method and assembly
US6363937B1 (en) 1995-06-07 2002-04-02 Arthrocare Corporation System and methods for electrosurgical treatment of the digestive system
US6837888B2 (en) 1995-06-07 2005-01-04 Arthrocare Corporation Electrosurgical probe with movable return electrode and methods related thereto
US6632193B1 (en) 1995-06-07 2003-10-14 Arthrocare Corporation Systems and methods for electrosurgical tissue treatment
US7393351B2 (en) 1995-06-07 2008-07-01 Arthrocare Corporation Apparatus and methods for treating cervical inter-vertebral discs
US7090672B2 (en) 1995-06-07 2006-08-15 Arthrocare Corporation Method for treating obstructive sleep disorder includes removing tissue from the base of tongue
US6149620A (en) 1995-11-22 2000-11-21 Arthrocare Corporation System and methods for electrosurgical tissue treatment in the presence of electrically conductive fluid
US6238391B1 (en) 1995-06-07 2001-05-29 Arthrocare Corporation Systems for tissue resection, ablation and aspiration
US6772012B2 (en) 1995-06-07 2004-08-03 Arthrocare Corporation Methods for electrosurgical treatment of spinal tissue
US7179255B2 (en) 1995-06-07 2007-02-20 Arthrocare Corporation Methods for targeted electrosurgery on contained herniated discs
US20050004634A1 (en) 1995-06-07 2005-01-06 Arthrocare Corporation Methods for electrosurgical treatment of spinal tissue
US6837887B2 (en) 1995-06-07 2005-01-04 Arthrocare Corporation Articulated electrosurgical probe and methods
WO1997013266A2 (en) 1995-06-19 1997-04-10 The University Of Tennessee Research Corporation Discharge methods and electrodes for generating plasmas at one atmosphere of pressure, and materials treated therewith
US6099523A (en) 1995-06-27 2000-08-08 Jump Technologies Limited Cold plasma coagulator
DE19524645C2 (en) 1995-07-06 2002-11-28 Soering Gmbh Safety gas system for HF surgery
TW283250B (en) 1995-07-10 1996-08-11 Watkins Johnson Co Plasma enhanced chemical processing reactor and method
US5865937A (en) 1995-08-21 1999-02-02 Applied Materials, Inc. Broad-band adjustable power ratio phase-inverting plasma reactor
US5631523A (en) 1995-09-19 1997-05-20 Beacon Light Products, Inc. Method of regulating lamp current through a fluorescent lamp by pulse energizing a driving supply
DE19537897A1 (en) 1995-09-19 1997-03-20 Erbe Elektromedizin Multi=functional surgical instrument suitable for variable surgical methods
US6264812B1 (en) 1995-11-15 2001-07-24 Applied Materials, Inc. Method and apparatus for generating a plasma
US6461350B1 (en) 1995-11-22 2002-10-08 Arthrocare Corporation Systems and methods for electrosurgical-assisted lipectomy
US6228082B1 (en) 1995-11-22 2001-05-08 Arthrocare Corporation Systems and methods for electrosurgical treatment of vascular disorders
US6896672B1 (en) 1995-11-22 2005-05-24 Arthrocare Corporation Methods for electrosurgical incisions on external skin surfaces
US6805130B2 (en) 1995-11-22 2004-10-19 Arthrocare Corporation Methods for electrosurgical tendon vascularization
US6228078B1 (en) 1995-11-22 2001-05-08 Arthrocare Corporation Methods for electrosurgical dermatological treatment
US7186234B2 (en) 1995-11-22 2007-03-06 Arthrocare Corporation Electrosurgical apparatus and methods for treatment and removal of tissue
US5977715A (en) 1995-12-14 1999-11-02 The Boeing Company Handheld atmospheric pressure glow discharge plasma source
EP0792091B1 (en) 1995-12-27 2002-03-13 Nippon Telegraph And Telephone Corporation Elemental analysis method
US6033582A (en) 1996-01-22 2000-03-07 Etex Corporation Surface modification of medical implants
US6471822B1 (en) 1996-01-24 2002-10-29 Applied Materials, Inc. Magnetically enhanced inductively coupled plasma reactor with magnetically confined plasma
US6252354B1 (en) 1996-11-04 2001-06-26 Applied Materials, Inc. RF tuning method for an RF plasma reactor using frequency servoing and power, voltage, current or DI/DT control
US6036878A (en) 1996-02-02 2000-03-14 Applied Materials, Inc. Low density high frequency process for a parallel-plate electrode plasma reactor having an inductive antenna
KR970064327A (en) 1996-02-27 1997-09-12 모리시다 요이치 High frequency power applying device, plasma generating device, plasma processing device, high frequency power applying method, plasma generating method and plasma processing method
US6353206B1 (en) 1996-05-30 2002-03-05 Applied Materials, Inc. Plasma system with a balanced source
US5858477A (en) 1996-12-10 1999-01-12 Akashic Memories Corporation Method for producing recording media having protective overcoats of highly tetrahedral amorphous carbon
US6534133B1 (en) * 1996-06-14 2003-03-18 Research Foundation Of State University Of New York Methodology for in-situ doping of aluminum coatings
IT1286157B1 (en) 1996-07-08 1998-07-07 Claudio Pier Paolo Zanon KIT FOR PERCUTANEOUS IMPLANTATION OF AN ARTERIAL SYSTEM FOR LOCOREGIONAL CHEMOTHERAPY TREATMENTS OF METASTASIS.
US6170428B1 (en) 1996-07-15 2001-01-09 Applied Materials, Inc. Symmetric tunable inductively coupled HDP-CVD reactor
US7357798B2 (en) 1996-07-16 2008-04-15 Arthrocare Corporation Systems and methods for electrosurgical prevention of disc herniations
US6726684B1 (en) 1996-07-16 2004-04-27 Arthrocare Corporation Methods for electrosurgical spine surgery
US6620155B2 (en) 1996-07-16 2003-09-16 Arthrocare Corp. System and methods for electrosurgical tissue contraction within the spine
US6468274B1 (en) 1996-07-16 2002-10-22 Arthrocare Corporation Systems and methods for treating spinal pain
US7104986B2 (en) 1996-07-16 2006-09-12 Arthrocare Corporation Intervertebral disc replacement method
US6027617A (en) * 1996-08-14 2000-02-22 Fujitsu Limited Gas reactor for plasma discharge and catalytic action
US5845488A (en) 1996-08-19 1998-12-08 Raytheon Company Power processor circuit and method for corona discharge pollutant destruction apparatus
JP3260352B2 (en) * 1996-08-29 2002-02-25 松下電器産業株式会社 Method of forming interlayer insulating film
US5909086A (en) 1996-09-24 1999-06-01 Jump Technologies Limited Plasma generator for generating unipolar plasma
US5866985A (en) 1996-12-03 1999-02-02 International Business Machines Corporation Stable matching networks for plasma tools
JP3985973B2 (en) 1996-12-12 2007-10-03 エルベ エレクトロメディツィン ゲーエムベーハー Coagulation device for coagulation of biological tissue
USRE37780E1 (en) 1996-12-18 2002-07-02 Sirap-Gema S.P.A. Method for the production of substantially open-cell polystyrene sheet
US6329757B1 (en) 1996-12-31 2001-12-11 The Perkin-Elmer Corporation High frequency transistor oscillator system
GB9703159D0 (en) 1997-02-15 1997-04-02 Helica Instr Limited Medical apparatus
CA2230774C (en) 1997-03-18 2007-06-26 F. Hoffmann-La Roche Ag Manufacture of ascorbyl monophosphates
DE29724247U1 (en) 1997-03-20 2000-08-03 Erbe Elektromedizin GmbH, 72072 Tübingen Device for the coagulation of biological tissue
US6579426B1 (en) 1997-05-16 2003-06-17 Applied Materials, Inc. Use of variable impedance to control coil sputter distribution
US6652717B1 (en) 1997-05-16 2003-11-25 Applied Materials, Inc. Use of variable impedance to control coil sputter distribution
FR2764163B1 (en) 1997-05-30 1999-08-13 Centre Nat Rech Scient INDUCTIVE PLASMA TORCH WITH REAGENT INJECTOR
US6071372A (en) 1997-06-05 2000-06-06 Applied Materials, Inc. RF plasma etch reactor with internal inductive coil antenna and electrically conductive chamber walls
US6855143B2 (en) 1997-06-13 2005-02-15 Arthrocare Corporation Electrosurgical systems and methods for recanalization of occluded body lumens
US6582423B1 (en) 1997-06-13 2003-06-24 Arthrocare Corporation Electrosurgical systems and methods for recanalization of occluded body lumens
JPH118225A (en) * 1997-06-17 1999-01-12 Nkk Corp Parallel plate plasma treatment apparatus
US6924455B1 (en) 1997-06-26 2005-08-02 Applied Science & Technology, Inc. Integrated plasma chamber and inductively-coupled toroidal plasma source
US7166816B1 (en) 1997-06-26 2007-01-23 Mks Instruments, Inc. Inductively-coupled torodial plasma source
US6815633B1 (en) 1997-06-26 2004-11-09 Applied Science & Technology, Inc. Inductively-coupled toroidal plasma source
US6150628A (en) 1997-06-26 2000-11-21 Applied Science And Technology, Inc. Toroidal low-field reactive gas source
US6027601A (en) 1997-07-01 2000-02-22 Applied Materials, Inc Automatic frequency tuning of an RF plasma source of an inductively coupled plasma reactor
GB9714142D0 (en) 1997-07-05 1997-09-10 Surface Tech Sys Ltd An arrangement for the feeding of RF power to one or more antennae
US5955886A (en) * 1997-07-10 1999-09-21 Pcp, Inc. Microliter-sized ionization device and method
DE19730127C2 (en) 1997-07-14 2001-04-12 Erbe Elektromedizin Dissecting instrument
DE19731931C2 (en) 1997-07-24 2001-04-19 Erbe Elektromedizin Device for RF coagulation of biological tissue using a flexible endoscope
US6345588B1 (en) 1997-08-07 2002-02-12 Applied Materials, Inc. Use of variable RF generator to control coil voltage distribution
US6110395A (en) 1997-08-26 2000-08-29 Trikon Technologies, Inc. Method and structure for controlling plasma uniformity
JP2001514444A (en) 1997-08-26 2001-09-11 アプライド マテリアルズ インコーポレイテッド Apparatus and method capable of sending stable power to a plasma processing chamber
US6183655B1 (en) 1997-09-19 2001-02-06 Applied Materials, Inc. Tunable process for selectively etching oxide using fluoropropylene and a hydrofluorocarbon
US5869832A (en) * 1997-10-14 1999-02-09 University Of Washington Device and method for forming ions
US5945790A (en) * 1997-11-17 1999-08-31 Schaefer; Raymond B. Surface discharge lamp
JP3057065B2 (en) * 1997-12-03 2000-06-26 松下電工株式会社 Plasma processing apparatus and plasma processing method
US6429400B1 (en) * 1997-12-03 2002-08-06 Matsushita Electric Works Ltd. Plasma processing apparatus and method
KR20010034002A (en) 1998-01-13 2001-04-25 키플링 켄트 High frequency inductive lamp and power oscillator
US6137237A (en) 1998-01-13 2000-10-24 Fusion Lighting, Inc. High frequency inductive lamp and power oscillator
US6313587B1 (en) 1998-01-13 2001-11-06 Fusion Lighting, Inc. High frequency inductive lamp and power oscillator
US6020794A (en) 1998-02-09 2000-02-01 Eni Technologies, Inc. Ratiometric autotuning algorithm for RF plasma generator
KR100521120B1 (en) 1998-02-13 2005-10-12 가부시끼가이샤 히다치 세이사꾸쇼 Method for treating surface of semiconductor device and apparatus thereof
US6047700A (en) 1998-03-30 2000-04-11 Arthrocare Corporation Systems and methods for electrosurgical removal of calcified deposits
US6254738B1 (en) 1998-03-31 2001-07-03 Applied Materials, Inc. Use of variable impedance having rotating core to control coil sputter distribution
DE19820240C2 (en) 1998-05-06 2002-07-11 Erbe Elektromedizin Electrosurgical instrument
CZ286310B6 (en) 1998-05-12 2000-03-15 Přírodovědecká Fakulta Masarykovy Univerzity Method of making physically and chemically active medium by making use of plasma nozzle and the plasma nozzle per se
US6763836B2 (en) 1998-06-02 2004-07-20 Arthrocare Corporation Methods for electrosurgical tendon vascularization
US6224447B1 (en) 1998-06-22 2001-05-01 Micron Technology, Inc. Electrode structures, display devices containing the same, and methods for making the same
SE518902C2 (en) 1998-06-24 2002-12-03 Plasma Surgical Invest Ltd plasma Cutter
US6222186B1 (en) 1998-06-25 2001-04-24 Agilent Technologies, Inc. Power-modulated inductively coupled plasma spectrometry
WO2000002423A2 (en) 1998-07-01 2000-01-13 Everbrite, Inc. Power supply for gas discharge lamp
US6787730B2 (en) 1998-07-09 2004-09-07 Damian Coccio Device for plasma incision of matter with a specifically tuned radiofrequency electromagnetic field generator
US7276063B2 (en) 1998-08-11 2007-10-02 Arthrocare Corporation Instrument for electrosurgical tissue treatment
US7435247B2 (en) 1998-08-11 2008-10-14 Arthrocare Corporation Systems and methods for electrosurgical tissue treatment
FR2782837B1 (en) 1998-08-28 2000-09-29 Air Liquide METHOD AND DEVICE FOR SURFACE TREATMENT BY ATMOSPHERIC PRESSURE PLASMA
DE19839826A1 (en) 1998-09-01 2000-03-02 Karl Fastenmeier High-frequency device for generating a plasma arc for the treatment of human tissue
US6265033B1 (en) * 1998-09-11 2001-07-24 Donald Bennett Hilliard Method for optically coupled vapor deposition
EP0989595A3 (en) * 1998-09-18 2001-09-19 Ims-Ionen Mikrofabrikations Systeme Gmbh Device for processing a surface of a substrate
US6132575A (en) 1998-09-28 2000-10-17 Alcatel Magnetron reactor for providing a high density, inductively coupled plasma source for sputtering metal and dielectric films
DE19844725A1 (en) * 1998-09-29 2000-03-30 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Gas discharge lamp with controllable light length
DE19848784C2 (en) 1998-10-22 2003-05-08 Erbe Elektromedizin probe
US6376972B1 (en) * 1998-11-19 2002-04-23 The United States Of America As Represented By The United States Department Of Energy Powerful glow discharge excilamp
US6182469B1 (en) 1998-12-01 2001-02-06 Elcor Corporation Hydrocarbon gas processing
DE19856307C1 (en) 1998-12-07 2000-01-13 Bosch Gmbh Robert Apparatus for producing a free cold plasma jet
JP2000183044A (en) * 1998-12-11 2000-06-30 Chemitoronics Co Ltd Plasma etching device and method
US6153852A (en) * 1999-02-12 2000-11-28 Thermal Conversion Corp Use of a chemically reactive plasma for thermal-chemical processes
JP3264898B2 (en) * 1999-02-25 2002-03-11 大村 智 Ultraviolet irradiation equipment for sterilization of liquid and muddy substances
US6582427B1 (en) 1999-03-05 2003-06-24 Gyrus Medical Limited Electrosurgery system
US6589437B1 (en) 1999-03-05 2003-07-08 Applied Materials, Inc. Active species control with time-modulated plasma
US20020022836A1 (en) * 1999-03-05 2002-02-21 Gyrus Medical Limited Electrosurgery system
US6464891B1 (en) 1999-03-17 2002-10-15 Veeco Instruments, Inc. Method for repetitive ion beam processing with a carbon containing ion beam
US6474258B2 (en) 1999-03-26 2002-11-05 Tokyo Electron Limited Apparatus and method for improving plasma distribution and performance in an inductively coupled plasma
US6237526B1 (en) 1999-03-26 2001-05-29 Tokyo Electron Limited Process apparatus and method for improving plasma distribution and performance in an inductively coupled plasma
JP4035916B2 (en) 1999-03-30 2008-01-23 松下電工株式会社 Plasma processing apparatus and plasma processing method
JP2000306884A (en) 1999-04-22 2000-11-02 Mitsubishi Electric Corp Apparatus and method for plasma treatment
US6958063B1 (en) 1999-04-22 2005-10-25 Soring Gmbh Medizintechnik Plasma generator for radio frequency surgery
US6206878B1 (en) * 1999-05-07 2001-03-27 Aspen Laboratories, Inc. Condition responsive gas flow adjustment in gas-assisted electrosurgery
US6890332B2 (en) 1999-05-24 2005-05-10 Csaba Truckai Electrical discharge devices and techniques for medical procedures
US6387088B1 (en) 1999-06-30 2002-05-14 John H. Shattuck Photoionization enabled electrochemical material removal techniques for use in biomedical fields
KR20020026528A (en) 1999-07-02 2002-04-10 키플링 켄트 High output lamp with high brightness
EP1203441A1 (en) 1999-07-13 2002-05-08 Tokyo Electron Limited Radio frequency power source for generating an inductively coupled plasma
US6646386B1 (en) 1999-07-20 2003-11-11 Tokyo Electron Limited Stabilized oscillator circuit for plasma density measurement
US6867859B1 (en) 1999-08-03 2005-03-15 Lightwind Corporation Inductively coupled plasma spectrometer for process diagnostics and control
EP1212775A1 (en) 1999-08-06 2002-06-12 Advanced Energy Industries, Inc. Inductively coupled ring-plasma source apparatus for processing gases and materials and method thereof
DE10085223T1 (en) 1999-11-23 2002-10-31 Fusion Lighting Inc Self-tuning electrodeless lamps
US6424232B1 (en) 1999-11-30 2002-07-23 Advanced Energy's Voorhees Operations Method and apparatus for matching a variable load impedance with an RF power generator impedance
US6328760B1 (en) 1999-12-20 2001-12-11 Robert G. James Pulsed plasma radiation device for emitting light in biologically significant spectral bands
US6291938B1 (en) 1999-12-31 2001-09-18 Litmas, Inc. Methods and apparatus for igniting and sustaining inductively coupled plasma
US6326584B1 (en) 1999-12-31 2001-12-04 Litmas, Inc. Methods and apparatus for RF power delivery
AU2001232946A1 (en) 2000-01-28 2001-08-20 Church And Dwight Co., Inc. Device for generating a pressurized stream of treating media
FR2805194B1 (en) 2000-02-18 2002-06-28 Air Liquide PLASMA ARC WORKING PROCESS AND INSTALLATION WITH GAS MIXTURE BASED ON HYDROGEN, NITROGEN AND / OR ARGON
US7300436B2 (en) 2000-02-22 2007-11-27 Rhytec Limited Tissue resurfacing
US6629974B2 (en) 2000-02-22 2003-10-07 Gyrus Medical Limited Tissue treatment method
US20060009763A1 (en) * 2000-02-22 2006-01-12 Rhytech Limited Tissue treatment system
US7335199B2 (en) * 2000-02-22 2008-02-26 Rhytec Limited Tissue resurfacing
US6723091B2 (en) 2000-02-22 2004-04-20 Gyrus Medical Limited Tissue resurfacing
JP4002960B2 (en) 2000-02-29 2007-11-07 独立行政法人物質・材料研究機構 Consumable electrode gas shield arc welding method and apparatus
AU2001239906A1 (en) 2000-03-01 2001-09-12 Tokyo Electron Limited Electrically controlled plasma uniformity in a high density plasma source
US6507155B1 (en) 2000-04-06 2003-01-14 Applied Materials Inc. Inductively coupled plasma source with controllable power deposition
JP3834183B2 (en) 2000-04-12 2006-10-18 ホシザキ電機株式会社 Open cell type automatic ice maker
US6365864B1 (en) * 2000-04-26 2002-04-02 Lincoln Global, Inc. Cleaning device for welding wire and method of cleaning welding wire
EP1288174A4 (en) * 2000-04-28 2005-06-08 Asahi Glass Co Ltd Glass coated with heat reflecting colored film and method for manufacturing the same
US6401652B1 (en) 2000-05-04 2002-06-11 Applied Materials, Inc. Plasma reactor inductive coil antenna with flat surface facing the plasma
JP2001332399A (en) 2000-05-25 2001-11-30 Mitsubishi Heavy Ind Ltd Plasma generating device and surface cleaning method using this
DE10030111B4 (en) 2000-06-19 2008-07-10 Erbe Elektromedizin Gmbh probe electrode
US6409933B1 (en) 2000-07-06 2002-06-25 Applied Materials, Inc. Plasma reactor having a symmetric parallel conductor coil antenna
US6305316B1 (en) 2000-07-20 2001-10-23 Axcelis Technologies, Inc. Integrated power oscillator RF source of plasma immersion ion implantation system
US7070596B1 (en) 2000-08-09 2006-07-04 Arthrocare Corporation Electrosurgical apparatus having a curved distal section
US6902564B2 (en) * 2001-08-15 2005-06-07 Roy E. Morgan Methods and devices for electrosurgery
US6459066B1 (en) 2000-08-25 2002-10-01 Board Of Regents, The University Of Texas System Transmission line based inductively coupled plasma source with stable impedance
US6539968B1 (en) * 2000-09-20 2003-04-01 Fugasity Corporation Fluid flow controller and method of operation
US20030158545A1 (en) 2000-09-28 2003-08-21 Arthrocare Corporation Methods and apparatus for treating back pain
US6475215B1 (en) * 2000-10-12 2002-11-05 Naim Erturk Tanrisever Quantum energy surgical device and method
JP3670208B2 (en) 2000-11-08 2005-07-13 アルプス電気株式会社 Plasma processing apparatus, plasma processing system, performance confirmation system thereof, and inspection method
JP3670209B2 (en) 2000-11-14 2005-07-13 アルプス電気株式会社 Plasma processing apparatus performance evaluation method, maintenance method, performance management system, performance confirmation system, and plasma processing apparatus
US6504307B1 (en) * 2000-11-30 2003-01-07 Advanced Cardiovascular Systems, Inc. Application of variable bias voltage on a cylindrical grid enclosing a target
EP2233605B1 (en) 2000-12-12 2012-09-26 Konica Corporation Optical film comprising an anti-reflection layer
KR20020077439A (en) * 2000-12-14 2002-10-11 코닌클리케 필립스 일렉트로닉스 엔.브이. Liquid crystal display laminate and method of manufacturing such
RU2183474C1 (en) 2001-02-09 2002-06-20 Пекшев Александр Валерьевич Method and device for producing gas flow containing no for treating biological object
EP1365699A2 (en) * 2001-03-02 2003-12-03 Palomar Medical Technologies, Inc. Apparatus and method for photocosmetic and photodermatological treatment
US7096819B2 (en) 2001-03-30 2006-08-29 Lam Research Corporation Inductive plasma processor having coil with plural windings and method of controlling plasma density
US7011790B2 (en) 2001-05-07 2006-03-14 Regents Of The University Of Minnesota Non-thermal disinfection of biological fluids using non-thermal plasma
US6921398B2 (en) 2001-06-04 2005-07-26 Electrosurgery Associates, Llc Vibrating electrosurgical ablator
US6837884B2 (en) 2001-06-18 2005-01-04 Arthrocare Corporation Electrosurgical apparatus having compound return electrode
JP2003007497A (en) 2001-06-19 2003-01-10 Pearl Kogyo Kk Atmospheric pressure plasma processing equipment
US6685803B2 (en) 2001-06-22 2004-02-03 Applied Materials, Inc. Plasma treatment of processing gases
US6642526B2 (en) 2001-06-25 2003-11-04 Ionfinity Llc Field ionizing elements and applications thereof
US6582429B2 (en) 2001-07-10 2003-06-24 Cardiac Pacemakers, Inc. Ablation catheter with covered electrodes allowing electrical conduction therethrough
US7160521B2 (en) 2001-07-11 2007-01-09 Applied Materials, Inc. Treatment of effluent from a substrate processing chamber
US6625555B2 (en) 2001-07-11 2003-09-23 Behavior Tech Computer Corporation Variable resistance measuring loop having compensational function for environmental factors
JP2003049276A (en) 2001-08-03 2003-02-21 Sekisui Chem Co Ltd Discharge plasma treatment device and treatment method using the same
JP2003049272A (en) * 2001-08-07 2003-02-21 Konica Corp Atmospheric pressure plasma treating device, atmospheric pressure plasma treating method and electrode system for atmospheric pressure plasma treating device
JP4772232B2 (en) 2001-08-29 2011-09-14 アジレント・テクノロジーズ・インク High frequency amplifier circuit and driving method of high frequency amplifier circuit
JP2003068721A (en) * 2001-08-29 2003-03-07 Sekisui Chem Co Ltd Discharge plasma processing apparatus
DE10145131B4 (en) * 2001-09-07 2004-07-08 Pva Tepla Ag Device for generating an active gas jet
AU2002362310A1 (en) 2001-09-14 2003-04-01 Arthrocare Corporation Methods and apparatus for treating intervertebral discs
JP3823037B2 (en) 2001-09-27 2006-09-20 積水化学工業株式会社 Discharge plasma processing equipment
DE10147998A1 (en) 2001-09-28 2003-04-10 Unaxis Balzers Ag Method and device for generating a plasma
EP1437977B1 (en) 2001-10-02 2014-05-21 ArthroCare Corporation Apparatus for electrosurgical removal and digestion of tissue
US6693253B2 (en) 2001-10-05 2004-02-17 Universite De Sherbrooke Multi-coil induction plasma torch for solid state power supply
US7084832B2 (en) 2001-10-09 2006-08-01 Plasma Control Systems, Llc Plasma production device and method and RF driver circuit with adjustable duty cycle
US7100532B2 (en) 2001-10-09 2006-09-05 Plasma Control Systems, Llc Plasma production device and method and RF driver circuit with adjustable duty cycle
US7132996B2 (en) 2001-10-09 2006-11-07 Plasma Control Systems Llc Plasma production device and method and RF driver circuit
US6840937B2 (en) 2001-10-18 2005-01-11 Electrosurgery Associates, Llc Electrosurgical ablator with aspiration
US7004941B2 (en) 2001-11-08 2006-02-28 Arthrocare Corporation Systems and methods for electrosurigical treatment of obstructive sleep disorders
US6920883B2 (en) 2001-11-08 2005-07-26 Arthrocare Corporation Methods and apparatus for skin treatment
DE10159152A1 (en) 2001-12-01 2003-06-12 Mtu Aero Engines Gmbh Process for gas purification
US20030108683A1 (en) * 2001-12-12 2003-06-12 Wu L. W. Manufacturing method for nano-porous coatings and thin films
TW497986B (en) * 2001-12-20 2002-08-11 Ind Tech Res Inst Dielectric barrier discharge apparatus and module for perfluorocompounds abatement
EP1467678A1 (en) * 2001-12-21 2004-10-20 Cardiovasc, Inc. Composite stent with polymeric covering and bioactive coating
JP2003211740A (en) 2002-01-17 2003-07-29 Fuji Xerox Co Ltd Printing controller, printing control method and printer
US7298091B2 (en) 2002-02-01 2007-11-20 The Regents Of The University Of California Matching network for RF plasma source
DE10204363A1 (en) 2002-02-02 2003-08-14 Schott Glas Interference coating to improve the energy balance of HID lamps
WO2003068055A2 (en) 2002-02-11 2003-08-21 Arthrocare Corporation Electrosurgical apparatus and methods for laparoscopy
EP1474203B1 (en) 2002-02-13 2016-06-15 ArthroCare Corporation Electrosurgical apparatus for treating joint tissue
DE10211609B4 (en) 2002-03-12 2009-01-08 Hüttinger Elektronik GmbH & Co. KG Method and power amplifier for generating sinusoidal high-frequency signals for operating a load
JP2003272896A (en) * 2002-03-14 2003-09-26 Fuse Technonet:Kk Plasma generating device
US20040003828A1 (en) 2002-03-21 2004-01-08 Jackson David P. Precision surface treatments using dense fluids and a plasma
JP2004006700A (en) 2002-03-27 2004-01-08 Seiko Epson Corp Surface processing method and substrate, film pattern forming method, electro-optical device manufacturing method, electro-optical device, and electronic apparatus
ATE339871T1 (en) 2002-03-28 2006-10-15 Apit Corp S A METHOD FOR SURFACE TREATMENT USING ATMOSPHERIC PLASMA AND DEVICE FOR PRODUCING SAME
TW200308187A (en) 2002-04-10 2003-12-16 Dow Corning Ireland Ltd An atmospheric pressure plasma assembly
US6780178B2 (en) 2002-05-03 2004-08-24 The Board Of Trustees Of The Leland Stanford Junior University Method and apparatus for plasma-mediated thermo-electrical ablation
US7227097B2 (en) 2002-05-08 2007-06-05 Btu International, Inc. Plasma generation and processing with multiple radiation sources
US20040086434A1 (en) 2002-11-04 2004-05-06 Gadgil Pradad N. Apparatus and method for treating objects with radicals generated from plasma
US20040129212A1 (en) 2002-05-20 2004-07-08 Gadgil Pradad N. Apparatus and method for delivery of reactive chemical precursors to the surface to be treated
US6819052B2 (en) 2002-05-31 2004-11-16 Nagano Japan Radio Co., Ltd. Coaxial type impedance matching device and impedance detecting method for plasma generation
US6855225B1 (en) 2002-06-25 2005-02-15 Novellus Systems, Inc. Single-tube interlaced inductively coupling plasma source
US7473377B2 (en) 2002-06-27 2009-01-06 Tokyo Electron Limited Plasma processing method
US6624583B1 (en) 2002-06-28 2003-09-23 Motorola, Inc. Method and apparatus for plasma treating a chemical species
TWI283899B (en) 2002-07-09 2007-07-11 Applied Materials Inc Capacitively coupled plasma reactor with magnetic plasma control
US6774569B2 (en) 2002-07-11 2004-08-10 Fuji Photo Film B.V. Apparatus for producing and sustaining a glow discharge plasma under atmospheric conditions
US6909237B1 (en) 2002-07-25 2005-06-21 The Regents Of The University Of California Production of stable, non-thermal atmospheric pressure rf capacitive plasmas using gases other than helium or neon
TWI264313B (en) 2002-08-07 2006-10-21 Access Business Group Int Llc Nonthermal plasma air treatment system
US20040025791A1 (en) 2002-08-09 2004-02-12 Applied Materials, Inc. Etch chamber with dual frequency biasing sources and a single frequency plasma generating source
EP1540714A4 (en) * 2002-08-26 2007-11-14 Sigma Lab Arizona Inc Barrier coatings produced by atmospheric glow discharge
US7199023B2 (en) * 2002-08-28 2007-04-03 Micron Technology, Inc. Atomic layer deposited HfSiON dielectric films wherein each precursor is independendently pulsed
SE523135C2 (en) 2002-09-17 2004-03-30 Smatri Ab Plasma spraying device
KR100530765B1 (en) 2002-10-04 2005-11-23 이규왕 Nanoporous dielectrics for plasma generator
SE524441C2 (en) 2002-10-04 2004-08-10 Plasma Surgical Invest Ltd Plasma surgical device for reducing bleeding in living tissue by means of a gas plasma
US6896775B2 (en) 2002-10-29 2005-05-24 Zond, Inc. High-power pulsed magnetically enhanced plasma processing
US7189940B2 (en) 2002-12-04 2007-03-13 Btu International Inc. Plasma-assisted melting
US7511246B2 (en) 2002-12-12 2009-03-31 Perkinelmer Las Inc. Induction device for generating a plasma
US7316682B2 (en) 2002-12-17 2008-01-08 Aaron Medical Industries, Inc. Electrosurgical device to generate a plasma stream
JP2004207145A (en) * 2002-12-26 2004-07-22 Sekisui Chem Co Ltd Discharge plasma processing device
US6876155B2 (en) 2002-12-31 2005-04-05 Lam Research Corporation Plasma processor apparatus and method, and antenna
US7048733B2 (en) 2003-09-19 2006-05-23 Baylis Medical Company Inc. Surgical perforation device with curve
WO2004071278A2 (en) 2003-02-05 2004-08-26 Arthrocare Corporation Temperature indicating electrosurgical apparatus and methods
US6781317B1 (en) 2003-02-24 2004-08-24 Applied Science And Technology, Inc. Methods and apparatus for calibration and metrology for an integrated RF generator system
WO2004094306A1 (en) 2003-04-21 2004-11-04 Techno Network Shikoku Co. Ltd. Hydrogen generator and hydrogen generating method
DE10334562B4 (en) 2003-07-29 2005-06-09 Erbe Elektromedizin Gmbh Surgical instrument
DE10335470A1 (en) 2003-08-02 2005-02-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method and device for coating or modifying surfaces
US7566333B2 (en) 2003-08-11 2009-07-28 Electromedical Associates Llc Electrosurgical device with floating-potential electrode and methods of using the same
US7563261B2 (en) 2003-08-11 2009-07-21 Electromedical Associates Llc Electrosurgical device with floating-potential electrodes
US7431857B2 (en) 2003-08-15 2008-10-07 Applied Materials, Inc. Plasma generation and control using a dual frequency RF source
US7510665B2 (en) 2003-08-15 2009-03-31 Applied Materials, Inc. Plasma generation and control using dual frequency RF signals
US7282244B2 (en) 2003-09-05 2007-10-16 General Electric Company Replaceable plate expanded thermal plasma apparatus and method
US7115185B1 (en) 2003-09-16 2006-10-03 Advanced Energy Industries, Inc. Pulsed excitation of inductively coupled plasma sources
FR2860123B1 (en) 2003-09-19 2005-11-11 Cit Alcatel INDUCTIVE THERMAL PLASMA TORCH
US8066659B2 (en) * 2004-06-15 2011-11-29 Ceramatec, Inc. Apparatus and method for treating and dispensing a material into tissue
WO2005039390A2 (en) 2003-10-20 2005-05-06 Arthrocare Corporation Electrosurgical method and apparatus for removing tissue within a bone body
WO2005049097A2 (en) 2003-11-13 2005-06-02 Jerome Canady Bipolar surgical forceps with argon plasma coagulation capability
US7426900B2 (en) 2003-11-19 2008-09-23 Tokyo Electron Limited Integrated electrostatic inductive coupling for plasma processing
US7157857B2 (en) 2003-12-19 2007-01-02 Advanced Energy Industries, Inc. Stabilizing plasma and generator interactions
EP1626613B8 (en) 2004-08-13 2007-03-07 Fuji Film Manufacturing Europe B.V. Method and arrangement for controlling a glow discharge plasma under atmospheric conditions
US7150745B2 (en) 2004-01-09 2006-12-19 Barrx Medical, Inc. Devices and methods for treatment of luminal tissue
US8075732B2 (en) * 2004-11-01 2011-12-13 Cymer, Inc. EUV collector debris management
US20050205211A1 (en) 2004-03-22 2005-09-22 Vikram Singh Plasma immersion ion implantion apparatus and method
JP2005276618A (en) 2004-03-24 2005-10-06 Japan Science & Technology Agency Device and method for generating microplasma
TWI240950B (en) 2004-03-26 2005-10-01 Chi Mei Optoelectronics Corp Thin film transistor, thin film transistor substrate, and methods for manufacturing the same
US7491200B2 (en) 2004-03-26 2009-02-17 Arthrocare Corporation Method for treating obstructive sleep disorder includes removing tissue from base of tongue
US7737382B2 (en) * 2004-04-01 2010-06-15 Lincoln Global, Inc. Device for processing welding wire
US20050241762A1 (en) 2004-04-30 2005-11-03 Applied Materials, Inc. Alternating asymmetrical plasma generation in a process chamber
ES2336804T5 (en) 2004-04-30 2013-03-06 Vlaamse Instelling Voor Technologisch Onderzoek (Vito) Immobilization of biomolecules using plasma technology at atmospheric pressure
US7117627B2 (en) 2004-06-02 2006-10-10 Tactical And Rescue Equipment, Llc Mounting assembly and methods of using same
US7365956B2 (en) 2004-06-14 2008-04-29 Douglas Burke Plasma driven, N-type semiconductor, thermoelectric power superoxide ion generator with critical bias conditions
US7292191B2 (en) 2004-06-21 2007-11-06 Theodore Anderson Tunable plasma frequency devices
US7892230B2 (en) 2004-06-24 2011-02-22 Arthrocare Corporation Electrosurgical device having planar vertical electrode and related methods
DE102004037084B4 (en) 2004-07-12 2008-07-31 Erbe Elektromedizin Gmbh APC device
US7214934B2 (en) 2004-07-22 2007-05-08 Varian Australia Pty Ltd Radio frequency power generator
US7715889B2 (en) 2004-07-29 2010-05-11 Kyocera Corporation Portable electronic device
US7506014B2 (en) 2004-08-06 2009-03-17 Malcolm Drummond Tunable multi-phase-offset direct digital synthesizer
US7478349B2 (en) * 2004-08-13 2009-01-13 National Instruments Corporation Automatically synchronizing timed circuits on I/O Devices
US7189939B2 (en) 2004-09-01 2007-03-13 Noritsu Koki Co., Ltd. Portable microwave plasma discharge unit
US20060046506A1 (en) * 2004-09-01 2006-03-02 Tokyo Electron Limited Soft de-chucking sequence
US7271363B2 (en) 2004-09-01 2007-09-18 Noritsu Koki Co., Ltd. Portable microwave plasma systems including a supply line for gas and microwaves
US7138067B2 (en) 2004-09-27 2006-11-21 Lam Research Corporation Methods and apparatus for tuning a set of plasma processing steps
JP2006114450A (en) 2004-10-18 2006-04-27 Yutaka Electronics Industry Co Ltd Plasma generating device
GB2420043B (en) 2004-11-03 2006-11-22 3Com Corp Rules engine for access control lists in network units
US7949407B2 (en) 2004-11-05 2011-05-24 Asthmatx, Inc. Energy delivery devices and methods
US20070258329A1 (en) 2005-01-27 2007-11-08 Timothy Winey Method and apparatus for the exploitation of piezoelectric and other effects in carbon-based life forms
JP4799947B2 (en) 2005-02-25 2011-10-26 株式会社ダイヘン High frequency power supply device and control method of high frequency power supply
US7887923B2 (en) * 2005-03-09 2011-02-15 Evonik Degussa Gmbh Plasma-sprayed layers of aluminium oxide
JP2006269095A (en) * 2005-03-22 2006-10-05 Takeshi Nagasawa Plasma generation device
US8221404B2 (en) * 2005-03-24 2012-07-17 Arqos Surgical, Inc. Electrosurgical ablation apparatus and method
JP2006278191A (en) * 2005-03-30 2006-10-12 Iwasaki Electric Co Ltd Plasma jet generating electrode
US8521274B2 (en) 2005-04-25 2013-08-27 Drexel University Methods for non-thermal application of gas plasma to living tissue
US8388618B2 (en) 2005-04-25 2013-03-05 Drexel University Control of mucus membrane bleeding with cold plasma
JP4769014B2 (en) 2005-04-28 2011-09-07 学校法人日本大学 Coaxial magnetized plasma generator and film forming apparatus using coaxial magnetized plasma generator
ES2430552T3 (en) 2005-04-29 2013-11-21 Vlaamse Instelling Voor Technologisch Onderzoek N.V. (Vito) Apparatus and procedure for purification and disinfection of liquid or gaseous substances
US7611509B2 (en) 2005-05-21 2009-11-03 Electromedical Associates Electrosurgical device
US7632267B2 (en) 2005-07-06 2009-12-15 Arthrocare Corporation Fuse-electrode electrosurgical apparatus
SE529058C2 (en) * 2005-07-08 2007-04-17 Plasma Surgical Invest Ltd Plasma generating device, plasma surgical device, use of a plasma surgical device and method for forming a plasma
SE529053C2 (en) 2005-07-08 2007-04-17 Plasma Surgical Invest Ltd Plasma generating device, plasma surgical device and use of a plasma surgical device
SE529056C2 (en) 2005-07-08 2007-04-17 Plasma Surgical Invest Ltd Plasma generating device, plasma surgical device and use of a plasma surgical device
FR2889204B1 (en) 2005-07-26 2007-11-30 Sidel Sas APPARATUS FOR THE PECVD DEPOSITION OF AN INTERNAL BARRIER LAYER ON A CONTAINER, COMPRISING A GAS LINE ISOLATED BY ELECTROVANNE
US7608839B2 (en) * 2005-08-05 2009-10-27 Mcgill University Plasma source and applications thereof
US7511281B2 (en) * 2005-08-31 2009-03-31 Ultraviolet Sciences, Inc. Ultraviolet light treatment chamber
US7651585B2 (en) * 2005-09-26 2010-01-26 Lam Research Corporation Apparatus for the removal of an edge polymer from a substrate and methods therefor
US7691278B2 (en) * 2005-09-27 2010-04-06 Lam Research Corporation Apparatus for the removal of a fluorinated polymer from a substrate and methods therefor
JP2009510709A (en) * 2005-10-04 2009-03-12 トパンガ テクノロジーズ,インク External resonator / cavity electrodeless plasma lamp and method of excitation with radio frequency energy
US7695633B2 (en) 2005-10-18 2010-04-13 Applied Materials, Inc. Independent control of ion density, ion energy distribution and ion dissociation in a plasma reactor
US7353771B2 (en) 2005-11-07 2008-04-08 Mks Instruments, Inc. Method and apparatus of providing power to ignite and sustain a plasma in a reactive gas generator
US7459899B2 (en) 2005-11-21 2008-12-02 Thermo Fisher Scientific Inc. Inductively-coupled RF power source
US7691101B2 (en) 2006-01-06 2010-04-06 Arthrocare Corporation Electrosurgical method and system for treating foot ulcer
JP2007188748A (en) 2006-01-13 2007-07-26 Ngk Insulators Ltd Remote type plasma processing method
JP5295485B2 (en) 2006-02-01 2013-09-18 株式会社栗田製作所 Liquid plasma type treatment liquid purification method and liquid plasma type treatment liquid purification apparatus
CA2642210A1 (en) 2006-02-17 2007-08-30 Hypertherm, Inc. Electrode for a contact start plasma arc torch and contact start plasma arc torch employing such electrodes
US7879034B2 (en) 2006-03-02 2011-02-01 Arthrocare Corporation Internally located return electrode electrosurgical apparatus, system and method
JP4109301B2 (en) 2006-08-08 2008-07-02 株式会社アドテック プラズマ テクノロジー Microwave plasma torch
JP5286517B2 (en) 2006-09-15 2013-09-11 国立大学法人長岡技術科学大学 Solution plasma reactor and method for producing nanomaterials using the device
US20080083701A1 (en) 2006-10-04 2008-04-10 Mks Instruments, Inc. Oxygen conditioning of plasma vessels
US20080099435A1 (en) 2006-10-30 2008-05-01 Michael Grimbergen Endpoint detection for photomask etching
US8017029B2 (en) 2006-10-30 2011-09-13 Applied Materials, Inc. Plasma mask etch method of controlling a reactor tunable element in accordance with the output of an array of optical sensors viewing the mask backside
US20080099436A1 (en) 2006-10-30 2008-05-01 Michael Grimbergen Endpoint detection for photomask etching
CA2668450A1 (en) 2006-11-02 2008-05-15 The University Of Notre Dame Du Lac Methods and apparatus for reducing drag via a plasma actuator
US20080179007A1 (en) 2007-01-30 2008-07-31 Collins Kenneth S Reactor for wafer backside polymer removal using plasma products in a lower process zone and purge gases in an upper process zone
US7928338B2 (en) 2007-02-02 2011-04-19 Plasma Surgical Investments Ltd. Plasma spraying device and method
JP5103956B2 (en) * 2007-03-12 2012-12-19 セイコーエプソン株式会社 Plasma processing equipment
JP5239178B2 (en) * 2007-03-12 2013-07-17 セイコーエプソン株式会社 Plasma processing equipment
US7633231B2 (en) 2007-04-23 2009-12-15 Cold Plasma Medical Technologies, Inc. Harmonic cold plasma device and associated methods
US20080285200A1 (en) 2007-05-15 2008-11-20 Jeffrey Messer System and method for forming and controlling electric arcs
US8735766B2 (en) 2007-08-06 2014-05-27 Plasma Surgical Investments Limited Cathode assembly and method for pulsed plasma generation
US7589473B2 (en) * 2007-08-06 2009-09-15 Plasma Surgical Investments, Ltd. Pulsed plasma device and method for generating pulsed plasma
JP4460014B2 (en) * 2007-09-09 2010-05-12 一男 清水 Plasma electrode
TWI354712B (en) 2007-09-10 2011-12-21 Ind Tech Res Inst Film coating system and isolating device
WO2009036579A1 (en) * 2007-09-21 2009-03-26 Hoffmann Neopac Ag Apparatus for plasma supported coating of the inner surface of tube-like packaging containers made of plastics with the assistance of a non-thermal reactive ambient pressure beam plasma
JP2011522381A (en) 2008-05-30 2011-07-28 コロラド ステート ユニバーシティ リサーチ ファンデーション Plasma-based chemical source apparatus and method of use thereof
US8994270B2 (en) * 2008-05-30 2015-03-31 Colorado State University Research Foundation System and methods for plasma application
WO2010008062A1 (en) 2008-07-18 2010-01-21 株式会社吉田製作所 Dental clinical apparatus and plasma jet applying device for dentistry
KR101044314B1 (en) 2008-11-25 2011-06-29 포항공과대학교 산학협력단 Coagulation apparatus using a cold plasma
JP2010242857A (en) 2009-04-06 2010-10-28 Toyota Motor Corp Gear transmission device for displacing meshing position by determining reduction in friction loss
CA2794895A1 (en) * 2010-03-31 2011-10-06 Colorado State University Research Foundation Liquid-gas interface plasma device
JP5553460B2 (en) * 2010-03-31 2014-07-16 コロラド ステート ユニバーシティー リサーチ ファウンデーション Liquid-gas interface plasma device
US20130116682A1 (en) * 2011-11-09 2013-05-09 Colorado State University Research Foundation Non-Stick Conductive Coating for Biomedical Applications
US20130261536A1 (en) * 2012-03-27 2013-10-03 Tyco Healthcare Group Lp System and Method for Cholecystectomy
US9269544B2 (en) * 2013-02-11 2016-02-23 Colorado State University Research Foundation System and method for treatment of biofilms
US9117636B2 (en) * 2013-02-11 2015-08-25 Colorado State University Research Foundation Plasma catalyst chemical reaction apparatus
US20140224643A1 (en) * 2013-02-11 2014-08-14 Colorado State University Research Foundation Homogenous plasma chemical reaction device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5607509A (en) * 1992-11-04 1997-03-04 Hughes Electronics High impedance plasma ion implantation apparatus
US6502588B2 (en) * 1996-04-15 2003-01-07 The Boeing Company Surface modification using an atmospheric pressure glow discharge plasma source
US5961772A (en) * 1997-01-23 1999-10-05 The Regents Of The University Of California Atmospheric-pressure plasma jet
US20040075375A1 (en) * 2001-01-17 2004-04-22 Kanako Miyashita Plasma display panel and its manufacturing method

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
See also references of EP2435607A4 *
SOBOLEWSKI, MARK A. ET AL.: "Current and Voltage Measurements in the Gaseous Electronics Conference RF Reference Cell.", J. RES. NATL. INST. STAND. TECHNOL., vol. 100, April 1995 (1995-04-01), pages 341, XP008148436, Retrieved from the Internet <URL:http://nvl.nist.gov/pub/nistpubjres/100/4/j14sob.pdf> [retrieved on 20100323] *

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