WO2010137306A1

WO2010137306A1 - Ic medium and manufacturing method thereof

Info

Publication number: WO2010137306A1
Application number: PCT/JP2010/003516
Authority: WO
Inventors: 田中洵介
Original assignee: 凸版印刷株式会社
Priority date: 2009-05-26
Filing date: 2010-05-26
Publication date: 2010-12-02
Also published as: JPWO2010137306A1; TW201104582A

Abstract

An IC medium has a first fold-removal line that is formed so as to surround the area wherein an IC carrier is to be installed. The IC medium also has a second fold-removal line that is formed so as to connect a first point on the outer circumference, and a second point on the first fold-removal line. The IC medium also has a third fold-removal line that is formed so as to connect a third point on a side on the outer circumference that is different from the side on which the first point exists, and a fourth point on a side on the first fold-removal line that is different from the side on which the second point exists.

Description

IC medium and manufacturing method thereof

The present invention relates to an IC medium with an IC carrier used for a SIM (Subscriber Identity Module) card or the like and a method for manufacturing the same.
This application claims priority based on Japanese Patent Application No. 2009-126226 filed in Japan on May 26, 2009, the contents of which are incorporated herein by reference.

The SIM card is a contact type IC card defined by the ISO / IEC 7816 standard. The SIM card has a card width of about 15 mm, a card depth of about 25 mm, and a card thickness of about 0.76 mm.
SIM cards are smaller in size than IC cards. The SIM card is manufactured on an existing IC card manufacturing line. That is, the SIM card is manufactured by a process of punching into the size of the SIM card after manufacturing an existing IC card.

FIG. 9 is a plan view showing an example of a conventional card 100 with an IC carrier.
FIG. 10 is a cross-sectional view showing an example of a conventional card 100 with an IC carrier.
As shown in FIG. 9, an opening 110 having an outer peripheral shape of a SIM card size is provided around a portion where the external terminal of the contact type IC carrier 101 is present, leaving a plurality of bridge portions 111. The SIM card including the IC carrier 101 is obtained by pressing the inside of the opening 110 to destroy and remove the bridge portion 111.
The opening 110 is formed by punching. A method of leaving the bridge portion 111 as it is at the time of punching and a method of thinning the bridge portion 111 by press working are known.
As shown in FIG. 10, the contact type IC carrier 101 includes an external connection terminal 106 and an IC module 107.

However, in these methods, since the opening 110 formed by punching is formed in the IC card base material 102, there is a problem that debris and burrs are generated, and a cleaning and disposal process is required. Moreover, since there is the opening 110, when printing on the surface of the IC carrier-equipped card 100, it is difficult to perform printing with a normal card printer.
Further, when the bridge portion 111 is subjected to press work, two steps of punching and press work are required, which is disadvantageous in terms of productivity.
Further, after the opening 110 is formed, foreign objects are caught in the opening 110 when the IC carrier card 100 is inserted into a conventional card reader when performing an inspection without removing the SIM card. There was a problem that there was.

Also known is a configuration of a card with an IC carrier that has a SIM card size opening in the IC card substrate, a SIM card size IC carrier in the opening, and is fixed with a backing film. (See Patent Document 1).

Even when the configuration of the card with an IC carrier described in Patent Document 1 is used, since the opening is formed by punching, there is the same problem as described above.
Moreover, the process of bonding a backing film is required, which is disadvantageous in terms of productivity.

JP 07-276870 A

An object of the present invention is to provide an IC medium in which an area where an IC carrier is mounted can be easily folded and separated from the IC medium, and a manufacturing method thereof.

(1) An IC medium according to an aspect of the present invention includes a first fold line formed so as to surround an area where an IC carrier is mounted, a first point on an outer periphery, and the first fold line. A second folding line formed to connect a second point on the line, a third point on a side different from a side on the outer periphery where the first point is, and the second point And a third break line formed to connect a fourth point on a side different from the side on the first break line where the point is located.
In this aspect, as the first folding operation, the second folding line and the third folding line are broken simultaneously. Then, as a second folding operation, a region where the IC carrier is mounted, which is a region surrounded by the first folding line, is folded from the remaining IC medium. Thereby, the area where the IC carrier is mounted can be separated from the IC medium by only two folding operations.

(2) Moreover, the IC medium according to this aspect may be made of a hard base material.

(3) Further, in the IC medium according to the present aspect, the second point or the fourth point may be other than the vertex of the first folding line.
In this aspect, when the second folding line and the third folding line are broken at the same time in the first folding operation, the IC carrier is detected from the straight line connecting the second point and the fourth point. The area to be mounted protrudes.
Therefore, in the second folding operation, the protruding area can be grasped and the area where the IC carrier is mounted can be separated from the IC medium. Therefore, in the second folding operation, the area where the IC carrier is mounted can be easily separated from the IC medium.

(4) Further, in the IC medium according to this aspect, the first folding line is formed in a polygon, and the second folding line is connected to the first side of the polygon. The third folding line may be formed so as to be connected to the second side opposite to the first side.
In this aspect, the second crease line and the third crease line are formed so as to be connected to opposite sides of a polygonal region on which the IC carrier is mounted. Therefore, the direction in which the second break line is formed and the direction in which the third break line is formed are the same direction. Therefore, in the first folding operation, the second folding line and the third folding line can be easily broken.

(5) In the IC medium according to this aspect, the fourth point may be on an extension line of the second folding line.
In this aspect, force acts equally on the second and third folding lines during the first folding operation. Therefore, at the time of the first folding operation, the second folding line and the third folding line can be easily broken at the same time.

(6) Further, in the IC medium according to this aspect, the second point may be outside the center of the first side, and the fourth point may be outside the center of the second side. .
In this aspect, by performing the first folding operation, when the IC medium is divided into two, the area where the IC carrier is mounted tends to remain on the IC medium that is largely divided. Therefore, it is possible to easily predict which of the IC media divided into two will have the area where the IC media is mounted.

(7) Further, in the IC medium according to this aspect, the polygon has a short side and a long side, and the long side of the polygon is relative to the side adjacent to the side where the first point is located. The second point and the fourth point may be on the short side of the polygon.
In this aspect, the long side of the IC medium and the long side of the polygonal region on which the IC carrier is mounted are parallel, and the second and third folding lines are mounted on the IC carrier. Connected to the short side of the polygonal area. Therefore, the force applied to the IC medium during the first folding operation is dispersed in the long side direction of the IC medium. Therefore, it is possible to prevent the IC carrier from being destroyed by applying a large force to the IC carrier mounted in the polygonal region.

(8) Further, in the IC medium according to this aspect, the first to third crease lines may be formed in a half cut shape or a perforation shape.
In this aspect, the first to third crease lines are formed in a half cut shape or a perforated shape. Therefore, the IC medium can be easily divided into two in the first folding operation. In the second folding operation, the area where the IC carrier is mounted can be easily broken from the divided IC medium.

(9) Moreover, in the IC medium according to this aspect, the third break line may have a curved portion.

(10) Further, in the IC medium according to this aspect, the third folding line may have an inflection point.
In this aspect, when the third folding line has a curved portion, a crack progresses from the end of the third folding line along the third folding line due to an unexpected external force or the like. , It is possible to reduce the progress of cracks that proceed linearly at the curved portion. Moreover, the progress of cracks can be further reduced by using the third break line including a plurality of continuous curves having inflection points.

(11) According to another aspect of the present invention, there is provided a method of manufacturing an IC medium, wherein a first fold line is formed so as to surround an area where an IC carrier is mounted, the first point on the outer periphery, Forming a second break line so as to connect to a second point on one break line, and a third point on a side different from a side on the outer periphery where the first point is, A third folding line is formed so as to connect a fourth point on a side different from the side on the first folding line where the second point exists.

According to the present invention, the area where the IC carrier is mounted can be easily folded and separated from the IC medium.

It is a top view which shows an example of the card | curd with IC carrier by embodiment of this invention. It is sectional drawing which shows an example of the card | curd with IC carrier by embodiment of this invention. It is sectional drawing which shows another example of the card | curd with IC carrier by embodiment of this invention. It is a top view explaining an example of the card | curd with IC carrier by embodiment of this invention. It is a top view explaining other examples of a card with an IC carrier by an embodiment of the present invention. It is a top view explaining another example of the card | curd with IC carrier by embodiment of this invention. It is another top view explaining an example of the card | curd with IC carrier by embodiment of this invention. It is a top view which shows another example of the card | curd 20 with IC carrier by embodiment of this invention. It is a top view which shows an example of the card | curd with the conventional IC carrier. It is sectional drawing which shows an example of the card | curd with the conventional IC carrier.

FIG. 1 is a plan view showing an example of a card 1 with an IC carrier according to an embodiment of the present invention. The card 1 with an IC carrier in FIG. 1 includes a card substrate 2. The card substrate 2 has a rectangular shape and has a pair of short sides E1 and E2 and a pair of long sides E3 and E4. The apex of the rectangular card substrate 2 is cut out in an arc shape. The card substrate 2 has an IC carrier part 3. The IC carrier unit 3 is an area where an IC carrier 11 such as a SIM card is mounted. A first folding line L1 is formed on the outer periphery of the IC carrier portion 3. Further, the card base 2 is formed with a second break line L2 and a third break line L3. The second folding line L2 and the third folding line L3 are formed so as to connect the outer periphery of the card 1 with IC carrier and the first folding line L1.

More specifically, the card 1 with an IC carrier (also referred to as an IC medium) shown in FIG. 1 has a folding line L1 (first line) so as to surround the IC carrier part 3 which is a region where the IC carrier 11 is mounted. 1 is also formed).
The card 1 with IC carrier is connected to a point P1 (also referred to as a first point) on the outer periphery and a point P2 (also referred to as a second point) on the first folding line L1. A folding line L2 (also referred to as a second folding line) is formed.
Further, the card with IC carrier 1 has a point P3 (also referred to as a third point) located on a side E2 different from the side E1 on the outer periphery where the point P1 is located, and a side H1 on the folding line L1 where the point P2 is located. A fold line L3 (also referred to as a third fold line) is formed so as to connect P4 (also referred to as a fourth point) located on a side H2 that is different from the line H2.

In FIG. 1, the point P2 or the point P4 is other than the vertex of the break line L1.

Further, in FIG. 1, the folding line L1 is formed in a substantially rectangular shape that is a polygon. Further, the folding line L2 is formed so as to be connected to a side H1 (also referred to as a first side) of the substantially rectangular folding line L1. Further, the folding line L3 is formed so as to be connected to H2 (also referred to as a second side) facing the side H1.

Further, in FIG. 1, the point P4 is on the extension line of the folding line L2. Further, the break line L3 is also an extension of the break line L2 in the vicinity of the point P4.

Further, in FIG. 1, the point P2 is located outside the center of the side H1. Further, the point P4 is other than the center of the second side H2.

FIG. 2 is a sectional view showing an example of the card 1 with IC carrier according to the embodiment of the present invention. FIG. 2 is a region including the IC carrier portion 3 and shows a cross section in the short side direction of the card 1 with IC carrier.
In FIG. 2, the folding line L1 has a half-cut shape in which a cut is formed only from one side of the card 1 with IC carrier. The folding line L1 may be formed as shown in FIG.

FIG. 3 is a cross-sectional view showing another example of the card with IC carrier 1 according to the embodiment of the present invention. FIG. 3 is a region including the IC carrier portion 3 and shows a cross section in the short side direction of the card 1 with IC carrier.
As in the case of FIG. 2, the IC carrier 11 (FIG. 1) includes an external connection terminal 6 and an IC module 7.
In FIG. 3, the folding line L <b> 1 has a half cut shape in which cuts are formed from both surfaces of the card 1 with IC carrier.

In the present embodiment, the shape of the cross section of the break line L1 is the half cut shape or the perforated shape described in FIGS. Accordingly, the IC carrier 11 can be folded from the card 1 with IC carrier without forming the opening 110 as in the conventional card 100 with IC carrier (FIG. 9). Therefore, there is no need for a mold for forming the opening 110 (FIG. 9), and the IC carrier portion 3 on which the IC carrier 11 is mounted can be manufactured without generating debris or burrs.
Moreover, in this embodiment, the opening part 110 (FIG. 9) is not formed in the card | curd 1 with IC carrier. Therefore, when performing printing on the card 1 with an IC carrier, a normal card printer or printing machine can be used without using a special printing method.

The IC carrier part 3 of the present embodiment can be broken and separated from the card 1 with IC carrier. The IC carrier part 3 cut off from the IC carrier card 1 can be used as a SIM card or the like.
The size of the IC carrier part 3 is not particularly limited. For example, when the IC carrier part 3 is used as a SIM card, the short side direction can be about 15 mm and the long side direction can be about 25 mm. When the IC carrier part 3 is used as a SIM card, as shown in FIG. 1, one rectangular vertex having a pair of short sides H1 and H2 opposed to a pair of opposed long sides H3 and H4 is slanted. A pentagonal shape cut into two can be used. The shape of the IC carrier portion 3 is not limited to a pentagonal shape that is a substantially square shape, and may be a circular shape or a polygonal shape such as a triangular shape or a rectangular shape.
In the present embodiment, a case is described in which a SIM is mounted as an IC carrier in the IC carrier unit 3, but the present invention is not limited to this. For example, a mini IC card other than the SIM may be mounted on the IC carrier unit 3. Further, a micro SIM (micro SIM) or a communication medium capable of non-contact communication (for example, non-contact type IC) may be mounted on the IC carrier unit 3.

As shown in FIGS. 2 and 3, the IC carrier 11 (FIG. 1) mounted on the IC carrier unit 3 includes an external connection terminal 6 and an IC module 7 connected to the external connection terminal 6. As the external connection terminal 6 and the IC module 7, those similar to those used for a known contact IC card, SIM card or the like can be used.
The IC carrier 11 may be a dual type connected to the IC module 7 including the antenna and connected to the external connection terminal 6. Further, as the IC carrier 11, a hybrid type having the IC module 7 connected to the external connection terminal 6 in the IC carrier portion 3 and another IC module connected to the antenna may be used.
Further, as the IC carrier 11, a non-contact type having the IC module 7 connected to the antenna may be used.

As the card substrate 2 (FIG. 1) of the card 1 with IC carrier of the present embodiment, a plastic substrate, a paper substrate, or the like can be used. As the plastic base material, a polyester base material such as polyethylene terephthalate (PET), an acrylic base material, a vinyl chloride base material, a biodegradable plastic base material such as polylactic acid plastic, or the like can be used.
Moreover, you may use the hard base material using engineering plastics, such as a polycarbonate, as the card base material 2 of the card | curd 1 with an IC carrier of this embodiment.

As the paper base material, any material may be used as long as it has strength as the card base material 2. For example, as the material of the card base material 2, a hard paper base material using compression-fixed paper or a base material using a wooden member may be used. Specifically, as the material for the card substrate 2, a material in which a plurality of vulcanized fibers made of natural cellulose as a raw material are laminated can be used.
By using a hard paper base material, it has sufficient strength as the card base material 2 and can be recycled after use. Conventionally, the portion remaining after separating the IC carrier has been discarded, but this portion can also be used as a recycling target. In addition, accessories and ticket design can be used effectively to provide other added value.

In the case of the IC carrier 101 removal mechanism using the conventional opening 110 (FIG. 9), the IC carrier 101 can be separated and removed by folding the bridge portion 111 that connects the opening 110 and the other opening 110. .
On the other hand, in the present embodiment, a folding line L1 having a half-cut shape (FIG. 2) or a perforation shape is used as the IC carrier 11 removal mechanism. In these half-cut shapes or perforated shapes, the cross-sectional area of the portion connecting the IC carrier portion 3 and the IC carrier-equipped card 1 main body is smaller than that of the aforementioned bridge portion 111 (FIG. 9). Therefore, the IC carrier part can be separated and removed by folding the part connecting the IC carrier part 3 and the IC carrier-equipped card 1 body.

In the case of the removal mechanism using the conventional opening 110 (FIG. 9), an impact when the bridge 111 (FIG. 9) is folded may be transmitted in the IC carrier 101 and a crack may occur. However, in the removing mechanism using the half-cut shape (FIG. 2) or the perforated line L1 of the present embodiment, the impact when the IC carrier portion 3 is removed from the card 1 with the IC carrier is affected by the bridge portion described above. It is much smaller than the impact when folding 111 (FIG. 9). For this reason, in the present embodiment, cracks are unlikely to occur in the IC carrier portion 3. In the present embodiment, when a hard base is used as the card base 2 of the card 1 with an IC carrier, the card base 2 has a high strength but is less flexible than a general plastic base. This is particularly effective because the part 3 is easily cracked.

The first folding line L1 can be formed by performing a half cut process or a perforation process. The perforation may be formed by intermittent through holes or may be formed by intermittent half through holes. It is preferable to form the first folding line L1 by using half-cut processing because of high productivity.

When half-cutting is performed, it is preferable to cut about 60 to 90% of the total thickness size in the thickness direction of the card 1 with IC carrier.
If the depth of cut is less than this, the impact at the time of folding becomes large, and when a hard base material is used as the material of the card base material 2, there is a possibility that a crack may occur in the IC carrier part 3.
On the other hand, if the cut is larger than this, the IC carrier part 3 may be removed from the card 1 with the IC carrier by an impact during transportation before the IC carrier part 3 is folded.
At this time, as shown in FIG. 2, a cut may be made only on the front surface or the back surface of the card 1 with IC carrier. However, as shown in FIG. 3, it is preferable to cut from both sides of the IC carrier-attached card 1 because burrs are hardly generated on the card base 2 when the card carrier 2 is folded.

The line width of the folding line L1 is preferably in the range of 0.1 to 0.7 mm.
If the line width of the folding line L1 is smaller than this range, it is difficult to make a cut, and there is a possibility that the durability of use of the mass production machine is lowered.
On the other hand, if the line width of the folding line L1 is larger than this range, the printing process suitability is deteriorated. Moreover, if the line width of the folding line L1 is larger than this range, the design of the IC carrier-attached card 1 may be adversely affected.
Moreover, design freedom is ensured by setting the line width of the folding line L1 within the above range. Furthermore, even when the IC card with IC carrier 1 is sucked and transported, there is no opening for air to escape, so there are no restrictions on the machine used for transport.

The folding lines L2 and L3 are formed so as to connect the folding line L1 and the outer periphery of the card 1 with the IC carrier.
The folding lines L2 and L3 may be cut in the entire length.
Further, the folding lines L2 and L3 have a portion where the cut is formed and a portion where the cut is not formed, so that the portion where the cut is formed and the break line L1 are 0.1 mm. The connection may be made through a portion where a cut of about 2.0 mm is not formed. In addition, the normal cuts of the folding lines L2 and L3 are made through a part where a cut of about 0.1 mm to 2.0 mm, which is smaller in cut amount (cut) than the other parts of the folding lines L2 and L3, is formed. You may connect the part in which the amount of cut was formed, and the folding line L1.

The cuts of the normal cut amounts of the break lines L2 and L3 are made through the portions where the cut lines L2 and L3 are not formed or the portions where the cut amount is smaller than the other portions. By connecting the formed part and the folding line L1, the folding line L1 when an unexpected crack occurs in the part where the cuts of the normal cutting amounts of the folding lines L2 and L3 are formed. It is possible to prevent cracks from reaching.

The folding lines L2, L3 can be formed by half-cut processing or perforation processing. It is preferable to use half-cut processing because of higher productivity than to use perforation. In addition, as the cross-sectional shape of the folding lines L2 and L3, a shape that is completely or partially penetrated can be used instead of the half-cut shape (FIG. 2) or the perforation shape.
When the folding lines L2 and L3 are formed by half-cut processing, the same half-cut processing as that for forming the folding line L1 can be used.
In the case of carrying out half-cut processing, a portion where a cut of about 0.1 mm to 2.0 mm is not formed in the middle of the folding line or a portion formed of a cut that is completely penetrated may be provided. Accordingly, when the crack progresses along the break line from the end of the break line due to an unexpected external force or the like, the progress of the crack can be stopped.

Further, the folding lines L2 and L3 are cut into a connection portion (the first point P1 and the third point P3 in FIG. 1) with the outer periphery of the card 1 with IC carrier of about 0.1 mm to 2.0 mm. You may connect via the part in which is not formed. Further, the folding lines L2 and L3 are attached to the IC carrier through a portion in which a cut of about 0.1 mm to 2.0 mm, which is smaller in cut amount (cut) than the other portions of the folding lines L2 and L3, is formed. You may connect the outer peripheral part of the card | curd 1. FIG. By doing so, it is possible to prevent the cracks in the folding lines L2 and L3 from being unexpectedly generated when the IC carrier-attached card 1 with vibration is conveyed, during issuance or inspection process with bending.

FIG. 4 is a plan view for explaining an example of the card 1 with IC carrier according to the embodiment of the present invention.
In the present embodiment, the third point P3 where the longer break line L3 of the break lines L2 and L3 is connected to the outer periphery of the IC carrier-attached card 1 is defined by the sides H3 and H4 of the IC carrier part 3. It is preferable not to be between points P16 and P18 on the outer peripheral portion of the card 1 with IC carrier that extends in the lateral direction of the card substrate 2 (the extending direction of the straight lines B3 and B4 in FIG. 4).
Before the IC carrier part 3 is removed, a bending stress load is remarkably applied to the card 1 with IC carrier, and cracks are formed in the folding lines L2 and L3 connected to the outer peripheral part of the card 1 with IC carrier. Even if it enters, it is possible to prevent the crack from being transmitted to the break line L1, and to prevent the IC carrier 11 from being unintentionally dropped.

Depending on the design of the tear line, each side H1, H2, H3, H4 of the IC carrier portion 3 and the corresponding card substrate 2 in the horizontal or vertical direction (straight lines B1, B2, B3, B4 in FIG. 4). In the break line connecting the outer circumferences E1, E2, E3, and E4 that extend and reach in the extending direction of the IC card, the connection point between the break line and the outer circumference of the IC carrier card 1 It is preferable not to be between the points P15 and P17, between the points P16 and P18, between the points P11 and P13, or between the points P12 and P14 on the outer periphery.

Further, each side H1, H2, H3, H4 of the IC carrier part 3 and the corresponding card base 2 are extended in the horizontal direction or the vertical direction (extension direction of the straight lines B1, B2, B3, B4 in FIG. 4). In the folding lines connecting the outer circumferences E1, E2, E3, E4, the connection points between the folding lines and the outer circumference of the IC carrier-equipped card 1 are the sides E1, E2, E3, E4 of the IC carrier-equipped card 1. It is desirable that it is outside the region of 1/3 of the central part.
When a load is applied unintentionally during conveyance of the card 1 with an IC carrier or during processing, a force to bend greatly is applied to the center of the card 1 with an IC carrier. That is, the deformation amount of the card with IC carrier 1 is large. Cracks that enter the break line due to accidental bending (deformation) maximize the curvature and concentrate stress, so the break line is connected near the center of each side of the IC carrier card 1 The impact is great. In particular, the influence is greater when the folding line is longer than when the folding line is short.
For example, as shown in FIG. 4, the longer folding line L3 is connected to a point P3 connecting to the right side E2 on the outer periphery of the IC carrier-equipped card 1 other than a region of 1/3 of the center of the right side E2. ing.

In the present embodiment, the folding line preferably has a curved portion.
Cracks in the folding line that enter when an unintentional load is applied during transport of the card 1 with IC carrier or during processing, the crack progresses from the outer peripheral side to the part connected by the half cut of the folding line Go. The progress of this crack is likely to proceed in the linear direction, and may reach the IC carrier portion 3 which is an area where the IC carrier 11 is mounted. Providing a curved portion on the folding line can reduce the progress of cracks in the portion connected by the half cut of the folding line. In particular, since the influence of cracking is larger when the folding line is longer than when the folding line is short, the longer folding line preferably has a curved portion.
Moreover, it is preferable that a curve part consists of a some curve which has an inflection point. Since the direction of the folding line changes at the inflection point, it is possible to suppress the cracking of the part connected by the half cut of the folding line that reaches the curve, at the past the inflection point.

In FIG. 1, the folding line L3 has one inflection point, but is not limited thereto. For example, the break line may be formed in an arc shape or a curve having two or more inflection points.
For example, the folding line L3 may be an arcuate curve having one end as the fourth point P4 and the other end as the upper side E3 of the card 1 with IC carrier.
Further, for example, the break line L3 is a curve having one end as a fourth point P4 and the other end as an intersection of an extension line of the second break line L2 and the right side E2 of the card 1 with IC carrier. A curve having three inflection points may be used.

For example, the shape of the tear line L3 of the card 1 with IC carrier may be as shown in FIG. 5 or FIG.
In FIG. 5, the folding line L3 formed so as to connect the point P4 and the point P3 has a shape that protrudes upward in the drawing.
In FIG. 6, the folding line L3 formed so as to connect the point P4 and the point P3 has a shape that protrudes downward in the drawing.

Only at least one of the folding lines L2 and L3 may be formed. However, it is preferable to form the folding lines L2 and L3 on the card 1 with the IC carrier. When the folding line L1 has a shape having a pair of opposing long sides H3 and H4 and a pair of opposing short sides H1 and H2, each folding line L2 and L3 has an opposing long side H3, It is preferable to connect with each folding line L1 of H4 or each folding line L1 of the opposing short sides H1 and H2. The folding line L3 is preferably positioned on a line substantially extending the folding line L2, preferably on the extended line, in the vicinity of the point P4 connected to the folding line L1.

It is another top view explaining an example of the card | curd 1 with an IC carrier by embodiment of this invention. In the present embodiment, the folding line L1 may have a substantially square shape.
By making the folding line L1 into such a shape, when folding along the folding lines L2 and L3, one of the regions divided into two by sandwiching the folding lines L2 and L3 can be easily performed. Can be removed. Thereafter, the IC carrier 11 can be easily removed by folding the end of the IC carrier portion 3 as a trigger. Specifically, when the folding is performed with the portion near the top and bottom of the IC carrier portion 3 as a power point in the region divided into two with the folding lines L2 and L3 sandwiched, the folding lines L2 and L3 and the folding lines A part of the line L1 is bent as an action point. By making the folding line L1 into a substantially square shape, there is little variation in the distance between the force point and the action point, and the area can be easily divided into two with the folding lines L2 and L3 and a part of the folding line L1 in between. Either of them can be easily removed.

Moreover, it is preferable that the folding line L3 is formed toward the short side E2 of the outer periphery of the card | curd base material 2 from the intersection P2 with the folding line L1.
Generally, the card 1 with an IC carrier is easy to bend in the long side direction.
Therefore, when the folding lines L2 and L3 are formed in the long side direction, unexpected separation of the IC carrier 11 can be prevented due to a bending load applied at the time of machine conveyance or IC issuance.

Further, considering the addition of bending, it is preferable that the IC carrier portion 3 is arranged at a position that is off the center of the card where the most force is applied when the card 1 with IC carrier is bent.

Moreover, it is preferable that the points P2 and P4 that connect the folding lines L2 and L3 and the folding line L1 are located at a position deviated from the center line of the IC carrier portion 3 (straight lines A1 and A2 in FIG. 4).
When the points P2 and P4 are on the center line of the IC carrier portion 3, when folding along the folding lines L2 and L3, the folding lines L2 and L3 shown in FIG. There is a possibility that the IC carrier 11 remains in both the area on the side where the area is divided and the area where the area is broken. However, if the points P2 and P4 are at positions deviating from the center line of the IC carrier part 3, when the break lines L2 and L3 are broken and divided into two, the smaller area (area 12 in FIG. 7). ), The IC carrier portion 3 often remains in the larger area (area 13 in FIG. 7).

In the first folding operation, when the IC carrier-equipped card 1 is divided into two, the smaller area (area 12 in FIG. 7) and the area excluding the area of the IC carrier portion 3, The ratio with the larger area (region 13 in FIG. 7) may be 45:55 to 20:80, and more preferably 35:65 to 20:80. If the ratio of the smaller area to the larger area when the IC carrier card 1 is divided into two in the first folding operation is 50:50, which of the IC carrier sections 3 It is inconvenient for an operator who does not know whether it remains in the area.

Further, the long side direction of the break line L1 is parallel to the long side direction of the card substrate 2, and points P2, P4 connecting the break line L1 and the break lines L2, L3 are the break line L1. It is preferable to be in the short side direction.
That is, the polygonal polygonal line L1 has short sides H1 and H2 and long sides H3 and H4. The substantially rectangular long sides H3 and H4 are parallel to the side E1 and the side E3 and E4 adjacent to the side E1. Further, the point P2 and the point P4 are on the substantially rectangular short sides H1 and H2.

In the present embodiment, the folding line L3 is a curve as shown in FIG. This curve is larger than the width X1 (FIG. 7) between the point P4 at one end of the folding line L3 and the upper side E3 of the card base 2 and the upper side E3 of the card base 2 at the other end P3 of the folding line L3. The width X2 (FIG. 7) is smaller. That is, when extending from the point P4 at one end to the point P3 at the other end, the folding line L3 is not a region having a larger area (region 13 in FIG. 7) but a region having a smaller area (FIG. 7). Bent into area 12).

As a result, the folding operator is strong in the vicinity of the IC carrier portion 3 in the region 12 of FIG. 7 by holding the vicinity of the IC carrier portion 3 in the region 12 (FIG. 7) with a finger. You can apply power. During the folding operation, the card base 2 is folded in the order of points P1, P2, P4, and P3. However, since the width X2 is smaller than the width X1, the last is compared with the first stage of folding. Less force is required at each stage.
The folding line L3 may be formed so as to be a straight line from the point P4 on the extension line of the folding line L2 toward the side E2 of the card 1 with IC carrier.

The card with IC carrier 1 of the present embodiment can be manufactured as follows.
First, a contact IC card is obtained by the same method as the conventional contact IC card manufacturing method.
Specifically, a housing portion for the IC module 7 and the external connection terminal 6 is formed on the card base 2 by milling (counterbore) processing or the like, and the IC module 7 and the external connection terminal 6 are housed in the housing portion.
In the case of a non-contact IC card using an antenna instead of a contact IC card, the antenna and the IC module 7 are formed in a portion to be the IC carrier portion 3. Similarly, in the case of a dual type or hybrid type IC card, the antenna, the external connection terminal 6, the IC module 7 and the like are formed in a portion to be the IC carrier portion 3.

Next, the folding line L1 and the folding lines L2, L3 are formed. More specifically, in the manufacturing method of the card with IC carrier 1 of the present embodiment, the folding line L1 is formed so as to surround the IC carrier portion 3 that is the region where the IC carrier 11 is mounted. Then, the break line L2 is formed so as to connect the point P1 on the outer periphery of the card 1 with the IC carrier and the point P2 on the break line L1. Then, a point P3 located on a side E2 different from the side E1 on the outer periphery of the IC carrier-equipped card 1 with the point P1 and a point P4 located on a side H2 different from the side H1 on the folding line L1 where the point P2 is located A break line L3 is formed so as to connect the two.

When forming the folding line L1 and / or the folding lines L2, L3 by half-cutting, it can be formed by pressing with a cutter such as a Thomson blade or a rotary die cutter, and half-cut by laser engraving. A shape may be formed.
Moreover, when forming the folding line L1 and / or the folding lines L2 and L3 by perforation, it is formed by a method of pressing using a perforation blade or by continuously performing fine drilling with a laser or the like. Can do.
Further, when the folding lines L2 and L3 are formed by penetrating cuts, they can be formed by pressing the card so as to penetrate the card using a cutter such as a Thomson blade or a rotary die cutter.

Also, after the card 1 with IC carrier is created, the surface can be printed. For printing, a known method for printing on a card can be used.

In addition, in this embodiment mentioned above, although the case where the folding line L3 was a curve was demonstrated, it is not limited to this. For example, the folding line L3 may be formed by connecting a plurality of straight lines.

FIG. 8 is a plan view showing another example of the card with IC carrier 20 according to the embodiment of the present invention. The configuration of the card with IC carrier 20 in FIG. 8 is similar to the configuration of the card with IC carrier 1 in FIG. For this reason, the same portions are denoted by the same reference numerals, and description thereof is omitted.
The IC carrier part 23 of the card 20 with IC carrier of FIG. 8 is different from the card 1 with IC carrier of FIG. 1 having a substantially square shape in that it has a heart shape.

In addition, although FIG. 8 demonstrates the case where the shape of the IC carrier part 23 is a heart shape, it is not limited to this. For example, the shape of the IC carrier portion 23 may be other shapes such as a leaf shape.
Also, the IC carrier card 1 of FIG. 1 in which the IC carrier 11 such as a SIM card is mounted on the IC carrier portion 23 of the IC carrier card 20 of FIG. 8 in that a non-contact type IC 21 is mounted. Is different.

According to the present embodiment described with reference to FIG. 1 to FIG. 8, the IC carrier part 3 (or IC carrier part 23), which is a region where the IC carrier 11 (or non-contact IC 21) is mounted, is used as an IC medium. Can be easily folded and separated from the IC carrier card 1 (or the IC carrier card 20).
In the present embodiment described with reference to FIGS. 1 to 8, the IC carrier part 3 (or IC carrier part 23) can be removed from the IC carrier card 1 (or IC carrier card 20). For this purpose, no opening is used. Therefore, there is no generation of waste or burrs during production, and the productivity can be improved. Furthermore, since there is no opening, it can be processed by the same apparatus and method as the post-processing of a conventional card with an IC carrier during post-processing such as subsequent printing.

<Example 1>
As the card substrate 2, a vulcanized fiber having a multilayer structure with a thickness of 0.76 mm was used.
First, a housing portion for the IC module 7 and the external connection terminal 6 was formed by a milling process, and after the IC module and the external connection terminal were installed, they were punched into a card shape.
Thereafter, the IC module 7 and the external connection terminal 6 have an outer periphery obtained by obliquely cutting one of the quadrangular vertices having a short side direction of 15 mm and a long side direction of 25 mm as shown in FIG. IC carrier part 3 was set up.

Next, a folding line L1 along the outer periphery of the IC carrier part 3 and two folding lines L2 and L3 connecting the short side direction of the outer periphery of the IC carrier part 3 and the outer periphery of the card 1 with the IC carrier. The card 1 with an IC carrier was obtained by forming by half-cutting using a Thomson blade. Half cut was cut 0.3 mm from both sides.
A part of the two folding lines L2 and L3 is located on a straight line connecting at least the points P2 and P4. Further, these points P2 and P4 are deviated from the center lines of the IC carrier part 3 (straight lines A1 and A2 in FIG. 4).
Further, the contact type IC carrier 11 is mounted on a point P3 at one end of the longer one of the two folding lines L2 and L3 by using a curved portion as shown in FIG. Further, the IC carrier portion 3 is extended in the horizontal direction or the vertical direction of the card base 2 so as not to overlap with the points P16 and P18 (FIG. 4) on the outer peripheral portion of the card 1 with the IC carrier.
In the first folding operation, when the IC carrier card 1 is divided into two, the smaller area, the area excluding the area of the IC carrier section 3, and the larger area The ratio was set at an area ratio of 75:25.

When the card 1 with IC carrier thus obtained is folded with the upper and lower vicinity of the IC carrier portion 3 of the card base 2 as a power point, the notch above the break line L1 and the break lines L2, L3 It was easy to divide along. After that, when the exposed IC carrier part 3 was pinched and bent, the IC carrier part 3 could be easily folded from the card base 2 along the lower notch of the folding line L1.

The present invention can be applied to an IC medium that can easily fold and separate a region where an IC carrier is mounted from an IC medium, a manufacturing method thereof, and the like.

1 ... Card with IC carrier,
2. Card base material,
3. IC carrier part,
6 ... External connection terminal,
7 ... IC module,
11. IC carrier,
20 ... Card with IC carrier,
21... Non-contact IC,
23 ... IC carrier part,
110 ... opening,
111 ... Bridge part,
L1 ... Folding line,
L2 ... Folding line,
L3 ··· Folding line

Claims

A first folding line formed so as to surround a region where the IC carrier is mounted;
A second break line formed to connect a first point on the outer periphery and a second point on the first break line;
A third point on a side different from the side on the outer periphery where the first point is present, and a fourth point on a side different from the side on the first folding line where the second point is located; A third break line formed to connect
An IC medium having
2. The IC medium according to claim 1, comprising a hard base material.
2. The IC medium according to claim 1, wherein the second point or the fourth point is other than a vertex of the first folding line.
The first break line is formed in a polygon;
The second folding line is formed to connect to the first side of the polygon;
The IC medium according to claim 1, wherein the third break line is formed so as to be connected to a second side opposite to the first side.
2. The IC medium according to claim 1, wherein the fourth point is on an extension line of the second folding line.
The second point is other than the center of the first side;
The IC medium according to claim 4, wherein the fourth point is located at a position other than the center of the second side.
The polygon has a short side and a long side;
The long side of the polygon is parallel to the side adjacent to the side where the first point is,
The IC medium according to claim 4, wherein the second point and the fourth point are on a short side of the polygon.
2. The IC medium according to claim 1, wherein the first to third folding lines are formed in a half cut shape or a perforation shape.
2. The IC medium according to claim 1, wherein the third break line has a curved portion.
2. The IC medium according to claim 1, wherein the third folding line has an inflection point.
Forming a first folding line so as to surround an area where the IC carrier is mounted;
Forming a second break line so as to connect the first point on the outer periphery and the second point on the first break line;
A third point on a side different from the side on the outer periphery where the first point is present, and a fourth point on a side different from the side on the first folding line where the second point is located; A method of manufacturing an IC medium in which a third break line is formed so as to connect the two.