WO2010124807A1 - Dispositif pour mesurer des forces agissant sur une tranche - Google Patents

Dispositif pour mesurer des forces agissant sur une tranche Download PDF

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Publication number
WO2010124807A1
WO2010124807A1 PCT/EP2010/002457 EP2010002457W WO2010124807A1 WO 2010124807 A1 WO2010124807 A1 WO 2010124807A1 EP 2010002457 W EP2010002457 W EP 2010002457W WO 2010124807 A1 WO2010124807 A1 WO 2010124807A1
Authority
WO
WIPO (PCT)
Prior art keywords
carrier
semiconductor wafer
processing unit
signal processing
forces
Prior art date
Application number
PCT/EP2010/002457
Other languages
German (de)
English (en)
Inventor
Jürgen Bruckmeier
Rainer Baumann
Original Assignee
Siltronic Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltronic Ag filed Critical Siltronic Ag
Publication of WO2010124807A1 publication Critical patent/WO2010124807A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/0061—Force sensors associated with industrial machines or actuators
    • G01L5/0076—Force sensors associated with manufacturing machines
    • G01L5/008—Force sensors integrated in an article or a dummy workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Definitions

  • the invention relates to a device for measuring forces which are exerted on the semiconductor wafer during transport or storage of a substantially round semiconductor wafer by means of a transport device used therefor.
  • the surface of the finished semiconductor wafer must meet the highest requirements so that the consumer of the semiconductor wafer can produce semiconductor components of the current generation on it. To avoid touching the surface, the semiconductor wafers are almost exclusively by means of
  • edge grippers that are used to transport the wafers must not cause any damage such as scratches, marks, edge breakouts or contamination at the edge of the window.
  • a decisive influencing factor is the force with which the gripping element is pressed against the edge of the pane.
  • the prior art for example US5092645
  • the invention therefore an object of the invention to provide a device that can be used without much retooling for measuring forces that are exerted by a variety of robots or cassettes on the semiconductor wafers.
  • This object is achieved by a device for measuring forces that are exerted on the semiconductor wafer during transport or storage of a substantially round semiconductor wafer by a transport device used therefor
  • a two-part support whose shape and dimensions substantially correspond to the shape and dimensions of the semiconductor wafer, so that the device, like the semiconductor wafer, can be transported or stored in the transport device,
  • a force sensor comprising a first part of the support, on which the forces to be measured act, with a second part of the Carrier connects, and converts the forces acting on the first part of the carrier forces into an electrical signal, - a signal processing unit, which further processes the electrical signal generated by the force sensor and - an energy storage, the force sensor and the
  • Signal processing unit supplied with electrical energy.
  • Fig. 1 shows schematically the structure of a device according to the invention in plan view.
  • Fig. 2 shows an exemplary structure of a parallel bending beam force sensor, as in the context of
  • Invention can be used in the side view (top) and the top view (bottom).
  • the force sensor 3 is integrated in a two-part carrier 1, 2, which has the shape and dimensions of
  • the device according to the invention likewise has a substantially round shape and a diameter of 300 mm.
  • the device is designed so that, like the corresponding semiconductor wafer, it can be grasped by robots or transported in cassettes.
  • the carrier In order to measure the forces acting, it is necessary to make the carrier in two parts. On the first, usually smaller part 1 of the carrier, the forces to be measured F.
  • the first part 1 of the carrier is connected to the second part 2 exclusively via the force sensor 3, so that on the forces acting on the first part 1 of the carrier F can be transmitted by the latter to the force sensor 3 and measured by it. Since in most cases forces F must be measured which act on the edge of the semiconductor wafers, the first part 1 of the carrier is preferably located at the edge of the device, as shown in FIG.
  • the force sensor 3 generates an electrical signal corresponding to the applied force F, which is forwarded to a signal processing unit 4.
  • Conventional force sensors can be used, for example parallel bending beam force sensors.
  • the remaining components of the device for example the signal processing unit 4 and the energy store 6 as well as possibly a transmitter or a data memory 5 are preferably accommodated on the larger second part 2 of the carrier.
  • the signal processing unit 4 ensures that the electrical signal generated by the force sensor 3 is read continuously or at predefined intervals and written, for example, in a data memory 5.
  • the electrical connections are designated 8 in FIG.
  • the components of the device (signal processing unit 4, energy storage 6 and, if present, data memory 5,
  • Device for wireless data transmission, real-time clock and possibly other components are for reasons of clean room suitability preferably either in a housing or with a suitable plastic, such as polyurethane, potted (in Fig. 1 denoted by reference numeral 7). It can thereby be achieved that the device can be used in a clean room of ISO Class 4 according to ISO 14644-1. Furthermore, for all parts of the device in the tests with gripping elements (eg edge grippers) or cassettes or other objects in the clean room in touch come using non-contaminating materials. Thus, it is preferably ensured that the entire surface of the device is free of metals.
  • a suitable plastic such as polyurethane, potted
  • the amount and the time course of the forces can be measured and recorded, which exert the respective transport devices used in a variety of gripping, transport and storage operations on a semiconductor wafer.
  • a transport device in this context, all devices are referred to, which are used for transport and storage of semiconductor wafers.
  • the term encompasses both the gripper elements of robots and cassettes in which semiconductor wafers are transported or stored.
  • the main advantages of the device according to the invention are that it does not have to be firmly integrated into a specific transport device and that it can also be used for the measurement of forces acting in cassettes.
  • the device according to the invention is versatile. The effort to retrofit robots or other transport devices is eliminated.
  • the device according to the invention should as far as possible be reproduced from the corresponding semiconductor wafer. This mainly concerns the following properties: shape, dimensions (diameter, thickness), edge profile, mass and the mechanical material properties (for example modulus of elasticity).
  • the center of gravity of the device is preferably in the middle of the device or at least near the middle.
  • the center of gravity of a round semiconductor wafer which as a rule has a homogeneous thickness, lies on the central axis. Therefore, preferably, the center of gravity of the device according to the invention in the vicinity of the point, without taking into account the symmetry reduced by the bipartite nature of the carrier and the additional components would represent the central axis, in particular within a circle concentric with the carrier, whose radius is equal to 50% of the radius of the carrier. This can be achieved by a suitable arrangement of the various components on the support. This ensures that the device rests flat, not tilting and thus a correct measurement of the forces is ensured.
  • Device related mass distribution should be as homogeneous as possible, i. There should be no pronounced isolated masses. This can be achieved in that the components of the device have as small a mass as possible in relation to the carrier. In addition, for this reason, a thin and extensively extended design of the signal processing unit, the energy storage device, the data memory or transmitter and possibly existing other components is preferred. Another advantage of the thin design is that the height or thickness of the device in this case differs least from the thickness of the corresponding semiconductor wafer and therefore the device can best be used under the spatial conditions adapted to the thin semiconductor wafers.
  • the device according to the invention has a mass which corresponds to the mass of the semiconductor wafers to be examined or at least does not deviate greatly therefrom.
  • the mass of the device is 50 to 200% of the mass of a corresponding semiconductor wafer. This avoids that the measurement results are falsified and that the device is too heavy, for example, for certain edge gripper.
  • a semiconductor wafer cut in two parts of the kind whose transport or handling is to be investigated a part of a suitable semiconductor wafer is cut out, for example by milling or water jet cutting.
  • the total mass of the device is always slightly higher than the mass of the corresponding semiconductor wafer, but the mass of the device is usually not more than twice as large as the mass of the semiconductor wafer.
  • a material can be selected for the carrier, which has a lower density than the material from which the semiconductor wafers consist. In this way it is possible to compensate for the additional mass of the components of the device by a lower mass of the carrier.
  • plastics having suitable properties may be used, e.g. Polyetheretherketone (PEEK) or a glass fiber reinforced plastic.
  • the device according to the invention is designed so that it can be used as universally as possible for determining the forces exerted by the most diverse transport devices on the semiconductor wafers.
  • the device according to the invention is designed for self-sufficient operation, ie no connection cables to the environment are necessary during the measurement, neither for supplying current nor for reading out the measured data.
  • the power supply is ensured by the energy storage device, preferably a rechargeable battery (eg a lithium polymer rechargeable battery).
  • a rechargeable battery eg a lithium polymer rechargeable battery
  • the Device has a data memory 5 (FIG. 1) in which the measurement data determined by the force sensor 3 and processed by the signal processing unit 4 are stored.
  • a data memory 5 (FIG. 1) in which the measurement data determined by the force sensor 3 and processed by the signal processing unit 4 are stored.
  • an additional interface is required via which the data can be read out after completion of the measurement.
  • the USB interface can also be used to charge the energy storage. Alternatively, it may be provided for a separate connection.
  • Another preferred embodiment has, instead of the data memory, a device for wireless data transmission with which the measurement data determined by the force sensor and processed by the signal processing unit can be transmitted to an external receiver, preferably by means of electromagnetic waves.
  • a device for wireless data transmission with which the measurement data determined by the force sensor and processed by the signal processing unit can be transmitted to an external receiver, preferably by means of electromagnetic waves.
  • known transmission techniques such as radio can be used.
  • a standard interface for radio transmission is known as Bluetooth ®.
  • the frequency of the data acquisition and storage or transmission can preferably be specified as desired.
  • the signal processing unit is therefore preferably programmable in this regard. For example, a data collection between one and 100 times per second.
  • the signal processing unit can also be programmed so that only when exceeding a predefined threshold value for the measured force storage or wireless transmission of the measured data takes place. If the defined threshold is subsequently fallen below again, it can be provided that the storage or transmission of the data is continued for a defined period of time.
  • the device according to the invention additionally has a real-time clock, so that the exact time and possibly the date of the measurement can be stored or transmitted with each force measurement.
  • the real-time clock is also powered by the energy storage device.
  • a silicon wafer with a diameter of 300 mm, a thickness of 780 ⁇ m and a mass of 130 g was used as a carrier for a device according to the invention. From the
  • Silicon wafer was cut out by water jet cutting a part (as shown in Fig. 1). This part, which represents the first part 1 of the carrier, was reconnected via a force sensor 3 to the rest of the silicon wafer (second part 2 of the carrier). For force measurement
  • Strain gauges used which are constructed as a parallel bending beam sensor.
  • the maximum power consumption of the sensor is 50 N, its measuring accuracy ⁇ 0.1 N.
  • the device also has a
  • Signal processing unit 4 (components: data logger, power supply, analog-to-digital converter) and a data memory 5 (DataFlash) with a capacity of 16 MBit.
  • energy storage 6 is a lithium-polymer battery with a capacity of 1500 mAh and a voltage of 3.7 V, the guaranteed a battery life of at least 24 h in continuous operation.
  • the device has a real-time clock and a USB interface for reading the data from the data memory, for charging the battery and for programming the signal processing unit 4.
  • the components of the device are potted with polyurethane (7) and arranged on the second part 2 of the carrier, that their center of gravity is exactly in the middle.
  • the maximum height (without carrier) is 8 mm.
  • the mass of the device including carrier is 252 g.
  • the entire device is cleanroom suitable, in particular usable in a cleanroom of ISO Class 4 according to ISO 14644-1.
  • the measuring device is designed to measure forces that act perpendicular to their edges parallel to the surfaces of the semiconductor wafers. This force is absorbed by the first part 1 of the carrier and forwarded to the force sensor 3.
  • the structure of the parallel bending beam force sensor is shown in Fig. 2. The actual
  • Parallel bending beam 33 is fixed on one side with a fastening device 32 on the second part 2 of the carrier (see Fig. 1). On the other hand, it is connected via a bracket 34 with a further fastening device 31 and via this with the first part 1 of the carrier.
  • the forces F acting parallel to the surface of the first part 1 of the carrier and perpendicular to its edge are transmitted to the bracket 34 via the fastening device 31. Due to the load, the two beams of the parallel bending beam 33 are deformed. This deformation can be measured by means not shown strain gauges. The measured stress is a measure of the applied force F.
  • the signal processing unit 4 continuously evaluates the measured values determined by the force sensor 3. Will be a predefined Threshold of the force exceeded, the corresponding measured values are stored in the data memory 5 until the threshold is fallen below again. Thereafter, readings are still written to the data store for a specified period of time. With each force measurement value, the date and time of the measurement is additionally stored. Each record is also provided with a running line number.
  • the frequency of the data storage can be set in the range from 1 to 100 Hz. It can also be specified from which threshold value of the measured force the measured values are stored and how long the follow-up time is to last after falling below the threshold again.
  • the signal processing unit 4 can be configured accordingly via the USB interface.
  • the described force measuring device like any semiconductor wafer having the dimensions given above (in particular with the same diameter, the same thickness and the same edge profile), can be gripped and transported by robotic grippers on the first part 1 of the carrier and in this case onto the first part 1 the forces acting on the wearer are measured.
  • the device can be placed in cassettes with the first part 1 of the support in advance, which are used for storage or transport of the corresponding silicon wafers and which are measured during storage or during transport forces acting on the first part 1 of the carrier.
  • the device according to the invention can also be adapted to other positions and angles of the force, so that it can be used to determine all conceivable forces during storage or during transport to a semiconductor wafer act. In particular, this critical transport processes can be identified, which act so large forces that the discs are damaged.

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  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne un dispositif pour mesurer des forces qui sont exercées lors du transport ou du logement d'une tranche sensiblement ronde par un dispositif de transport utilisé à cet effet sur la tranche, comprenant un support constitué d'au moins deux parties, dont la forme et les dimensions correspondent sensiblement à la forme et aux dimensions de la tranche, de sorte que le dispositif peut être transporté comme la tranche avec le dispositif de transport ou logé dans celui-ci, un capteur de force (3), qui relie une première partie (1) du support, sur laquelle les forces (F) à mesurer agissent, à une seconde partie (2) du support, et qui convertit les forces (F) agissant sur la première partie (1) du support en un signal électrique, une unité de traitement de signal (4), qui retraite le signal électrique généré par le capteur de force (3) et un accumulateur d'énergie (6) qui alimente le capteur de force (3) et l'unité de traitement de signal (4) en énergie électrique.
PCT/EP2010/002457 2009-04-29 2010-04-21 Dispositif pour mesurer des forces agissant sur une tranche WO2010124807A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009019452.5 2009-04-29
DE102009019452A DE102009019452A1 (de) 2009-04-29 2009-04-29 Vorrichtung zum Messen von Kräften, die auf eine Halbleiterscheibe wirken

Publications (1)

Publication Number Publication Date
WO2010124807A1 true WO2010124807A1 (fr) 2010-11-04

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ID=42333401

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Application Number Title Priority Date Filing Date
PCT/EP2010/002457 WO2010124807A1 (fr) 2009-04-29 2010-04-21 Dispositif pour mesurer des forces agissant sur une tranche

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DE (1) DE102009019452A1 (fr)
WO (1) WO2010124807A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011083028A1 (de) 2011-09-20 2013-03-21 Günter-Köhler-Institut für Fügetechnik und Werkstoffprüfung GmbH Baugruppe zur Montage eines Dehnungsmesselements auf einem Messobjekt

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4413442A1 (de) * 1994-04-18 1994-09-08 Fm Automation Elektronik Gmbh Montageplattform mit prozeßbeobachtender Funktion
US20040098216A1 (en) * 2002-11-04 2004-05-20 Jun Ye Method and apparatus for monitoring integrated circuit fabrication
US20050263760A1 (en) * 2004-05-28 2005-12-01 Eckhard Langer Semiconductor structure comprising a stress sensitive element and method of measuring a stress in a semiconductor structure
WO2008042903A2 (fr) * 2006-10-03 2008-04-10 Kla-Tencor Technologies Corporation Systèmes pour détecter une pression/force de cisaillement

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0333872B1 (fr) 1987-09-18 1995-08-23 Wacoh Corporation Pince du robot
US20070018469A1 (en) * 2005-07-25 2007-01-25 Multimetrixs, Llc Contamination-free edge gripping mechanism with withdrawable pads and method for loading/unloading and transferring flat objects

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4413442A1 (de) * 1994-04-18 1994-09-08 Fm Automation Elektronik Gmbh Montageplattform mit prozeßbeobachtender Funktion
US20040098216A1 (en) * 2002-11-04 2004-05-20 Jun Ye Method and apparatus for monitoring integrated circuit fabrication
US20050263760A1 (en) * 2004-05-28 2005-12-01 Eckhard Langer Semiconductor structure comprising a stress sensitive element and method of measuring a stress in a semiconductor structure
WO2008042903A2 (fr) * 2006-10-03 2008-04-10 Kla-Tencor Technologies Corporation Systèmes pour détecter une pression/force de cisaillement

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Publication number Publication date
DE102009019452A1 (de) 2010-11-25

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