WO2010122877A1 - Device having magnetic member, and method for manufacturing the device - Google Patents

Device having magnetic member, and method for manufacturing the device Download PDF

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Publication number
WO2010122877A1
WO2010122877A1 PCT/JP2010/055657 JP2010055657W WO2010122877A1 WO 2010122877 A1 WO2010122877 A1 WO 2010122877A1 JP 2010055657 W JP2010055657 W JP 2010055657W WO 2010122877 A1 WO2010122877 A1 WO 2010122877A1
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WO
WIPO (PCT)
Prior art keywords
magnetic
metal
layer
support member
transmission line
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PCT/JP2010/055657
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French (fr)
Japanese (ja)
Inventor
利男 高橋
恭一 川瀬
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アルプス電気株式会社
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Publication of WO2010122877A1 publication Critical patent/WO2010122877A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07771—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object

Definitions

  • the present invention relates to a device structure including a magnetic member used for RFID or noise countermeasure, and a member containing metal.
  • FIG. 8 is a longitudinal sectional view of a conventional RFID device.
  • the metal member 1, the adhesive layer 2, the resin sheet 3, the adhesive layer 4, the magnetic sheet 5, the adhesive layer 6, and the RFID tag 7 are laminated in this order from the bottom.
  • the laminated sheet of the adhesive layer 2, the resin sheet 3, and the adhesive layer 4 is, for example, a double-sided tape. And the space
  • FIG. 9 is also a longitudinal sectional view of a conventional conventional RFID device, in which the thickness dimension H1 of the magnetic sheet 8 is thinner than the thickness dimension H2 of the magnetic sheet 5 in FIG.
  • the thickness dimension H2 of the magnetic sheet 5 shown in FIG. 8 is about 100 to 300 ⁇ m, but in FIG. 9, the thickness dimension H1 of the magnetic sheet 8 is made thinner than 100 ⁇ m.
  • the metal member 1 and the magnetic sheet 8 are stuck via a double-sided tape having a thickness T ⁇ b> 1 as in FIG. 8.
  • the RFID device when the metal member 1 is in the vicinity of the RFID tag 7 as shown in FIGS. 8 and 9, an eddy current is generated in the metal member 1 by the magnetic field from the reader / writer, and the demagnetizing field due to the eddy current is generated by wireless communication.
  • magnetic sheets 5 and 8 are inserted between the metal member 1 and the RFID tag 7 as shown in FIGS. .
  • the magnetic sheets 5 and 8 attract the magnetic flux from the reader / writer to the RFID tag 7 side so that the magnetic flux can penetrate between the reader / writer antenna and the RFID tag 7 antenna.
  • the attenuation of the received signal output can be reduced, and the RFID characteristics can be improved.
  • the installation position of the magnetic sheets 5 and 8 and the material selection of the magnetic sheet 8 between the metal member 1 and the RFID tag 7 are important parameters for adjusting the RFID characteristics regarding the resonance frequency and the maximum communication distance.
  • the interval T1 between the metal member 1 and the magnetic sheet 8 is the same.
  • the magnetic sheets 5 and 8 and the metal member 1 are attached via a double-sided tape.
  • the double-sided tape is used because the double-sided tape has adhesive layers 2 and 4 on both sides and is thick and easy to be compressed when pressed. This is because the adhesive layers 2 and 4 are appropriately crushed and firmly bonded between the magnetic sheets 5 and 8 and the metal member 1.
  • the interval T1 between the metal member 1 and the magnetic sheet 8 is easily widened, and when the magnetic sheet 8 is formed thin like the laminated structure of FIG. It is necessary to select a material having a high real part ⁇ ′ of the complex relative permeability with respect to the magnetic sheet 5.
  • the magnetic sheet 8 is formed with a small thickness to maintain the RFID device thin, and the resonance frequency is adjusted to be close to 13.56 MHz and the maximum communication distance is adjusted as much as possible.
  • Required a real part ⁇ ′ having a higher complex relative permeability is reduced, and there is a problem that it is difficult to stably obtain good RFID characteristics.
  • the magnetic sheet 8 is formed on the surface of the metal member 1 with the adhesive layer 2, the resin sheet 3, and the adhesive layer 4.
  • a laminated sheet is used for attachment, but with such a configuration, there is a problem that the interval T1 between the magnetic sheet 8 and the metal member 1 is likely to vary, and thus the maximum communication distance and resonance frequency vary.
  • the thinner the magnetic sheet 8 the greater the influence of variation between the magnetic sheet 8 and the metal member 1 on the RFID characteristics.
  • the interval T1 between the metal member 1 and the magnetic sheet 8 varies depending on the thickness of the double-sided tape.
  • the total thickness of 4 is thick, and the thickness tends to change greatly when crushed. For this reason, when the double-sided tape is used, it is difficult to stably adjust the RFID characteristics relating to the resonance frequency and the maximum communication distance.
  • RFID devices not only RFID devices but also other devices, for example, devices using a magnetic sheet as a noise countermeasure for a transmission line formed on a substrate, have a problem that reflection noise cannot be stably suppressed with the conventional configuration.
  • Reflected noise is caused by, for example, impedance mismatch between the transmission line and the IC. For this reason, the impedance of a transmission line can be changed by sticking a magnetic sheet to a transmission line, and reflection noise can be suppressed.
  • Patent Documents 1 and 2 each disclose an invention related to a device (RFID device) using a magnetic sheet, but do not disclose a configuration for solving the above-described conventional problems.
  • the present invention is for solving the above-described conventional problems, and in particular, the degree of freedom of material selection for the magnetic layer can be increased as compared with the conventional one, characteristic variation can be reduced, and further thinning can be realized. It aims at providing the device which has a magnetic member, and its manufacturing method.
  • the device having a magnetic member in the present invention, A member including a metal and a magnetic member;
  • the magnetic member has a structure in which a magnetic layer is formed directly on the surface of a support member, and the member including the metal, the first bonding layer, and the magnetic member are laminated in this order. is there.
  • the manufacturing method of the device having a magnetic member in the present invention A member including a metal and a magnetic member;
  • the magnetic member is formed directly on the surface of the support member to form the magnetic member, and the magnetic member is bonded to the surface of the member containing the metal by a first bonding layer.
  • the interval between the metal-containing member and the magnetic layer can be stably reduced as compared with the conventional case.
  • the degree of freedom of material selection for the magnetic layer can be increased compared to conventional devices, and in devices using magnetic members for RFID, the resonance frequency can be made close to 13.56 MHz, the maximum communication distance can be increased, and variations can be adjusted to be small.
  • the resonance frequency can be made close to 13.56 MHz, the maximum communication distance can be increased, and variations can be adjusted to be small.
  • a device that uses a magnetic member as a countermeasure against noise in the transmission line it is possible to reduce variations in impedance of the transmission line and effectively suppress reflection noise. In this embodiment, further thinning of the device can be promoted.
  • the metal-containing member, the first bonding layer, the support member, and the magnetic layer are laminated in this order.
  • the magnetic layer in the method for manufacturing a device having a magnetic member described above, can be formed directly on the surface of the support member simply and appropriately by forming the magnetic layer on the surface of the support member by a doctor blade method. It is preferable.
  • the first bonding layer is an adhesive layer provided in advance on a surface opposite to the surface on which the magnetic layer of the support member is formed, and the adhesive layer is protected with a peelable protective member.
  • the magnetic layer is directly formed on the surface of the support member, and then the protective member is removed, and the magnetic member is adhered to the surface of the member containing the metal by the adhesive layer. In this way, the magnetic layer is formed directly on the surface of the support member, and after that, it is only necessary to stick the magnetic member to the metal member with the adhesive layer, so that the number of manufacturing steps can be reduced and the manufacturing cost can be reduced.
  • the first metal-containing member, the magnetic member, and the second metal-containing member are included, and either the first metal-containing member or the second metal-containing member is included.
  • One is an RFID tag
  • the magnetic member has the first bonding layer between the support member and the member containing the first metal with the support member facing the member containing the first metal. It is preferable that the member including the magnetic layer and the second metal is attached via a second bonding layer.
  • the metal-containing member has a configuration in which a transmission line is provided on a substrate, and the magnetic member has the transmission line and the support in a state where the support member is directed toward the transmission line. It is preferable that the space between the members is attached via the first bonding layer. Thereby, the dispersion
  • the distance between the metal-containing member and the magnetic layer can be reduced as compared with the conventional case.
  • the freedom degree of material selection with respect to a magnetic layer can be made high compared with the past.
  • the variation between the magnetic layer and the metal member can be reduced as compared with the conventional case, so that the characteristic variation can be reduced, and further thinning of the device can be promoted.
  • a longitudinal sectional view of the RFID device according to the first embodiment is a plan view of a device in which a magnetic sheet is adhered to the surface of a transmission line for noise suppression, and (b) is cut along the line AA shown in (a) and viewed from the direction of the arrow.
  • Partial longitudinal sectional view Conceptual diagram of the doctor blade method, The partial expanded sectional view which expanded the vicinity of the magnetic member of this embodiment, and the 1st joined layer, A graph showing the frequency characteristics of the real part ⁇ ′ and the imaginary part ⁇ ′′ of the complex relative permeability of the magnetic sheet used in the conventional example, Conventional example, Examples 1 to 3, and a graph showing the relationship between the resonance frequency of a single tag and the maximum communication distance,
  • the longitudinal cross-sectional view of the RFID device in a 1st prior art example The longitudinal cross-sectional view of the RFID device in a 2nd prior art example.
  • FIG. 1 is a longitudinal sectional view of an RFID device according to this embodiment.
  • an RFID (Radio Frequency ID) device 10 includes an RFID tag (member containing a second metal) 11 including an antenna and an IC chip, a metal member (member containing a first metal) 12, A magnetic member (magnetic sheet) 13 inserted between the RFID tag 11 and the metal member 12 is provided.
  • the RFID tag 11 has a form in which an antenna and an IC chip are formed on a substrate.
  • the metal member 12 forms a part of the housing, for example, and is made of Al, Ti, Cr or the like.
  • the film thickness of the metal member 12 is about 0.05 to 0.5 mm.
  • the magnetic member 13 of the present embodiment shown in FIG. 1 has a configuration in which a magnetic layer 15 is directly formed on the surface of a support member 14.
  • the thickness dimension H5 of the support member 14 is about 10 to 40 ⁇ m.
  • the magnetic layer 15 is a powder of a soft magnetic material such as Sendust or Fe-M-Cr-PC (M is one or more of Sn, In, Zn, Ga, Al, Ni, B, and Si). It is a structure in which the body and scales are bonded with a binder resin.
  • the metal member 12 and the support member 14 are bonded via a first bonding layer 16. Further, as shown in FIG. 1, the magnetic layer 15 and the RFID tag 11 are bonded via a second bonding layer 17.
  • the thickness dimension H7 of the first bonding layer 16 is about 30 to 100 ⁇ m, and the thickness dimension H8 of the second bonding layer 17 is about 10 to 50 ⁇ m.
  • the RFID device 10 shown in FIG. 1 has a configuration in which the metal member 12, the first bonding layer 16, the support member 14, the magnetic layer 15, the second bonding layer 17, and the RFID tag 11 are stacked in this order. .
  • the interval T2 between the magnetic layer 15 and the metal member 12 can be obtained by (thickness dimension H7 of the first bonding layer 16 + thickness dimension H5 of the support member 14). .
  • a distance T2 between the magnetic layer 15 and the metal member 12 is about 40 to 140 ⁇ m.
  • the magnetic layer 15 is formed directly on the surface of the support member 14. In the present embodiment, only one bonding layer 16 is required in the interval between the magnetic member 13 and the metal member 12, and therefore, the interval between the magnetic layer 15 and the metal member 12 as compared with the related art. T2 can be reduced. That is, the magnetic layer 15 can be brought close to the metal member 12.
  • the resonance frequency becomes close to 13.56 MHz and a good maximum communication distance ( Maximum distance that can be communicated).
  • the practical range of the real part ⁇ ′ of the complex relative permeability of the magnetic layer 15 can be expanded. Therefore, the degree of freedom of material selection for the magnetic layer 15 can be increased, and the magnetic layer 15 can be easily made thinner.
  • the “practical range” refers to a range of the real part ⁇ ′ in which good RFID characteristics can be obtained with the magnetic layer 15 kept in a thin and substantially constant film thickness (for example, about 50 ⁇ m in the experiment described later). Point to.
  • the thickness H6 of the magnetic layer 15 can be adjusted to about 50 to 100 ⁇ m, and the real part ⁇ ′ (13.56 MHz) of the complex relative permeability of the magnetic layer 15 can be adjusted within the range of about 40 to 100.
  • the adhesive layers 2 and 4 located on both sides are crushed and are totalized.
  • the amount of change in the thick adhesive layers 2 and 4 was likely to fluctuate greatly, and the interval T1 between the magnetic sheet 8 and the metal member 1 was likely to vary.
  • the magnetic layer 15 is formed directly on the surface of the support member 14 to form the magnetic member 13, and the magnetic member 13 is formed on the surface of the metal member 12 by one layer of the first layer.
  • the interval T ⁇ b> 2 between the magnetic layer 15 and the metal member 12 can be reduced, and the variation in the interval T ⁇ b> 2 can be reduced as compared with the related art. As a result, it is easy to reduce variations in the resonance frequency and communication distance of the RFID device as compared to the conventional case.
  • the magnetic layer 15 is directly formed on the surface of the support member 14, so that further reduction in the thickness of the RFID device 10 can be promoted.
  • the support member 14 for directly forming the magnetic layer 15 is interposed between the metal member 12 and the magnetic layer 15, and the metal member 12 and the magnetic layer together with the first bonding layer 16.
  • 15 functions as a spacer for adjusting the interval T2 between the two. Therefore, in the laminated structure of FIG. 1, the interval T2 can be adjusted by adjusting the thickness dimension H5 of the support member 14. In the embodiment shown in FIG. 1, the distance between the magnetic layer 15 and the RFID tag 11 is adjusted by the thickness dimension H8 of the second bonding layer 17.
  • a resin sheet particularly a PET sheet
  • the support member 14 is not limited to a resin sheet as long as it is thin.
  • the support member 14 is directed toward the metal member 12 side, and the support member 14 and the metal member 12 are bonded via the first bonding layer 16, but the magnetic layer 15 is attached to the metal member 12.
  • the support member 14 that is harder and has better surface flatness than the side is directed to the metal member 12 side, so that the thin first bonding layer 16 causes the support member 14 and the metal member 12 to have a substantially predetermined interval. And can be bonded stably.
  • the bonding layers 16 and 17 are made of an adhesive or an adhesive.
  • the pressure-sensitive adhesive and the adhesive are not clearly distinguished. All materials used to join things together are configured as a joining layer.
  • an acrylic pressure-sensitive adhesive or a polyester film pressure-sensitive adhesive tape with an acrylic pressure-sensitive adhesive can be used as the pressure-sensitive adhesive layer.
  • the first bonding layer 16 is made of a gel-like solid material or a highly viscous liquid adhesive, and, for example, the first bonding layer 16 is an adhesive layer on the opposite surface of the support member 14 from which the magnetic layer 15 is formed.
  • the layer 16 is configured as a single-sided adhesive tape provided in advance.
  • the magnetic member 13 is attached to the surface of the metal member 12 by the first bonding layer (adhesive layer) 16 formed in advance on the surface of the support member 14 with the support member 14 facing the metal member 12 side. It has been configured. With such a configuration, simple assembly can be realized, and variation in the interval T2 between the magnetic layer 15 and the metal member 12 can be further reduced.
  • the second bonding layer 17 can be attached using a double-sided tape, and the RFID tag 11 and the magnetic member 13 can be attached using the double-sided tape.
  • the metal member 12, the second bonding layer 17, the magnetic layer 15, the support member 14, the first bonding layer 16, and the RFID tag 11 are stacked in this order.
  • the RFID tag 11 is a “member containing a first metal”
  • the metal member 12 is a “member containing a second metal”
  • the gap between the RFID tag 11 and the magnetic member (magnetic sheet) 13 is the first. Bonded by the bonding layer 16.
  • the magnetic member 13 is inserted between the RFID tag 11 and the metal member 12 in order to suppress degradation of the RFID characteristics. At this time, the magnetic member 13 and the metal member are inserted.
  • the support member 14 constituting the magnetic member 13 is directed toward the RFID tag 11, and the support member 14 and the RFID tag 11 are attached via the first bonding layer 16.
  • the magnetic layer 15 and the RFID tag 11 can be brought closer to each other at the interval T2, the variation in the interval T2 can be reduced, and the variation in the RFID characteristics can be reduced to effectively improve the characteristics.
  • FIG. 3 shows a device in which the magnetic member (magnetic sheet) 13 is used as a noise countermeasure in an electronic circuit composed of electronic components and transmission lines, where (a) is a plan view and (b) is (a).
  • FIG. 2 is a partial longitudinal sectional view taken along the line AA shown in FIG.
  • a transmission line 32 is formed on a substrate 31 to constitute a “metal-containing member”.
  • An electronic circuit such as an IC is provided on the substrate to constitute an electronic circuit.
  • the magnetic member (magnetic sheet) 13 of the present embodiment is attached to the transmission line 32 via the first bonding layer 16, so that the impedance of the transmission line 32 is increased. It is possible to suppress the reflection noise caused by impedance mismatch between the transmission line 32 and the IC.
  • the support member 14 of the magnetic member 13 is directed to the transmission line 32 side, and the support member 14 and the transmission line 32 are pasted via the thin first bonding layer 16. I wear it.
  • variation between the magnetic layer 15 and the transmission line 32 has a small dispersion
  • the thin first bonding layer 16 is formed by directing the support member 14 formed of a PET sheet or the like to be hard and excellent in surface flatness to the transmission line 32 side.
  • the support member 14 and the transmission line 32 can be properly bonded to each other and firmly bonded.
  • the first bonding layer 16 is an adhesive layer provided in advance on the surface opposite to the surface on which the magnetic layer 15 of the support member 14 is formed. Then, the magnetic member 13 can be easily attached to the transmission line 32 by the adhesive layer with the support member 14 facing the transmission line 32 side.
  • a mixed liquid (slurry) 20 having a binder resin material and magnetic powder constituting the magnetic layer is supplied into a doctor blade device 21 and a support member (PET sheet is suitable). ) 14, the mixed solution 20 is formed into a film with a predetermined thickness by the blade 23.
  • the doctor blade device 21 can be set to a predetermined temperature, the magnetic layer 15 can be applied and formed, and then dried to be cured.
  • the method of directly forming the magnetic layer 15 on the support member 14 is not limited to the doctor blade method, but it is easy to form the magnetic layer 15 to a predetermined thickness by using the doctor blade method, and while the support member 14 is being fed sequentially. It is preferable that the magnetic layer 15 can be continuously formed on the surface of the support member 14.
  • an adhesive layer (hereinafter referred to as an adhesive layer 16) as a first bonding layer 16 is provided in advance on the surface 14 a opposite to the surface 14 a forming the magnetic layer 15 of the support member 14. .
  • the magnetic layer 15 is directly formed on the surface 14 a of the support member 14 in a state where the adhesive layer 16 is protected by a peelable protective sheet (protective member) 24. Subsequently, the protective sheet 24 is peeled off and removed, and in the case of the RFID device 10 shown in FIG. 1, the magnetic member 13 is adhered to the surface of the metal member 12 by the adhesive layer 16, and subsequently, the surface of the magnetic layer 15 is adhered.
  • the RFID tag 11 is bonded through the second bonding layer 17.
  • the magnetic member 13 is attached to the surface of the RFID tag 11 by the adhesive layer 16, and then the magnetic layer 15 is bonded to the surface of the metal member 12 via the second bonding layer 17.
  • the magnetic member 13 is adhered to the surface of the transmission line 32 by the adhesive layer 16.
  • the magnetic layer 15 is directly formed on the support member 14, and thereafter, the magnetic member 13 is made of the metal member 12, the RFID tag 11, the transmission line 32, or the like by the adhesive layer 16 provided in advance on the support member 14. Therefore, the number of manufacturing steps can be reduced and the manufacturing cost can be reduced.
  • the device using the magnetic member (magnetic sheet) in this embodiment can be used for signal transmission devices, electronic devices, etc. other than those shown in FIGS.
  • RFID device experiment RFID devices of the following conventional examples and examples were formed.
  • 3M 5010B (about 100 ⁇ m thick) was used.
  • the real part ⁇ ′ (13.56 MHz) of the complex relative permeability of the magnetic sheet 5 (3M 5010B) was about 20.
  • 6 shows the frequency characteristics of the real part ⁇ ′ and the imaginary part ⁇ ′′ of the complex relative permeability of the magnetic sheet 5 (3M 5010B).
  • the magnetic sheet 5 and the metal member 1 are joined together. Used double-sided tape of adhesive layer 2 / resin sheet 3 / adhesive layer 4 and the interval T1 between the magnetic sheet 5 and the metal member 1 was 170 ⁇ m.
  • Example 1 An RFID device having a laminated structure shown in FIG. 1 was formed. HMSZS ⁇ (80R) made by Alps Electric was used for the magnetic layer 15.
  • Example 2 An RFID device having a laminated structure shown in FIG. 1 was formed.
  • HMXS ⁇ (60R) manufactured by Alps Electric was used for the magnetic layer 15 .
  • Example 3 An RFID device having a laminated structure shown in FIG. 1 was formed. HMSUS ⁇ (40R) made by Alps Electric was used for the magnetic layer 15.
  • Example 1 to 3 a support member (PET sheet) 14 and a first bonding layer (adhesive layer) 16 are interposed between the magnetic layer 15 and the metal member 12, and the interval T2 is set to 70 ⁇ m.
  • the thickness dimension H6 of each magnetic layer 15 of Examples 1 to 3 was set to about 50 ⁇ m.
  • the maximum communication distance almost equal to that of the conventional example was obtained. More specifically, as shown in Table 1 and FIG. 7, in Examples 1 to 3, the real part ⁇ ′ of the complex relative permeability is about half that of the conventional example in which the real part ⁇ ′ is about 40 to 80. It has been found that even when the layer 15 is used, the resonance frequency can be adjusted to around 13.56 MHz, the maximum communication distance can be made substantially equal, and the RFID device can be made thin at the same time.
  • the real part ⁇ ′ of the complex relative permeability of the magnetic layer necessary for obtaining good RFID characteristics can be adjusted within a relatively wide range by bringing the magnetic layer closer to the metal member, It was found that the degree of freedom in material selection can be increased.
  • the support member 14 was a PET sheet and the thickness was about 25 ⁇ m, and the thickness of the adhesive layer 16 was about 25 ⁇ m.
  • the distance between the magnetic layer and the transmission line is likely to change over a wide range. Also, the variation in the total thickness of the original adhesive layer tends to increase. Therefore, in the configuration of the conventional example, the interval between the magnetic layer and the transmission line is likely to vary, and therefore, as shown in Table 2, the impedance change rate increases and the impedance tends to vary.
  • the adhesive layer can be thinned and the thin adhesive layer can be held with a relatively hard PET sheet, the amount of change in the thickness of the adhesive layer can be reduced, and as shown in Table 2, between the magnetic layer and the transmission line Spacing variation can be reduced. Therefore, as shown in Table 2, the rate of change of impedance is smaller than that of the conventional example, and the variation in impedance can be effectively reduced as compared with the conventional example.

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  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
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Abstract

Provided is a device having a magnetic member, wherein specially the degree of freedom of selecting materials for a magnetic layer is improved compared with conventional devices, variance of characteristics is reduced, and the thickness is further reduced. A method for manufacturing such device is also provided. The device has a RFID tag (11), a metal member (12), and a magnetic member (13) inserted into between the RFID tag (11) and the metal member (12). The magnetic member (13) is configured such that a magnetic layer (15) is directly formed on the surface of a supporting member (14), and the metal member (12), a first bonding layer (16) and the magnetic member (13) are laminated in this order. Thus, an interval (T2) between the metal member (12) and the magnetic layer (15) is reduced compared with conventional cases, and the degree of freedom of selecting materials for the magnetic layer (15) is improved. Furthermore, since variance of the interval (T2) is reduced, variance of the RFID characteristics is reduced, and the thickness of the device is further reduced.

Description

磁性部材を有するデバイス及びその製造方法Device having magnetic member and manufacturing method thereof
　本発明は、ＲＦＩＤ用あるいはノイズ対策用として用いられる磁性部材と、金属を含む部材とを有して構成されるデバイス構造に関する。 The present invention relates to a device structure including a magnetic member used for RFID or noise countermeasure, and a member containing metal.
　図８は、従来のＲＦＩＤデバイスの縦断面図である。図８では、下から金属部材１、粘着層２、樹脂シート３、粘着層４、磁性シート５、粘着層６及びＲＦＩＤタグ７の順に積層されている。粘着層２、樹脂シート３、及び粘着層４の積層シートは例えば、両面テープである。そして金属部材１と磁性シート５の間の間隔が前記両面テープの厚さと同じＴ１となる。 FIG. 8 is a longitudinal sectional view of a conventional RFID device. In FIG. 8, the metal member 1, the adhesive layer 2, the resin sheet 3, the adhesive layer 4, the magnetic sheet 5, the adhesive layer 6, and the RFID tag 7 are laminated in this order from the bottom. The laminated sheet of the adhesive layer 2, the resin sheet 3, and the adhesive layer 4 is, for example, a double-sided tape. And the space | interval between the metallic member 1 and the magnetic sheet 5 becomes the same T1 as the thickness of the said double-sided tape.
　図９も、従来の従来のＲＦＩＤデバイスの縦断面図であるが、磁性シート８の厚さ寸法Ｈ１が、図８の磁性シート５の厚さ寸法Ｈ２よりも薄くなっている。例えば図８に示す磁性シート５の厚さ寸法Ｈ２は、１００～３００μｍ程度であるが、図９では磁性シート８の厚さ寸法Ｈ１を１００μｍよりも薄くしている。ただし図９に示す積層構造でも、図８と同様に、金属部材１と磁性シート８の間は厚さＴ１の両面テープを介して貼着されている。 FIG. 9 is also a longitudinal sectional view of a conventional conventional RFID device, in which the thickness dimension H1 of the magnetic sheet 8 is thinner than the thickness dimension H2 of the magnetic sheet 5 in FIG. For example, the thickness dimension H2 of the magnetic sheet 5 shown in FIG. 8 is about 100 to 300 μm, but in FIG. 9, the thickness dimension H1 of the magnetic sheet 8 is made thinner than 100 μm. However, also in the laminated structure shown in FIG. 9, the metal member 1 and the magnetic sheet 8 are stuck via a double-sided tape having a thickness T <b> 1 as in FIG. 8.
　ＲＦＩＤデバイスでは、図８，図９に示すようにＲＦＩＤタグ７の近傍に金属部材１がある場合、リーダライタからの磁界により金属部材１に渦電流が生じ、渦電流による反磁界が、無線通信に必要な磁界をキャンセルしてしまう問題があり、その問題を解決すべく、図８，図９のように磁性シート５，８を金属部材１と、ＲＦＩＤタグ７との間に挿入している。これにより、磁性シート５，８がリーダライタからの磁束をＲＦＩＤタグ７側に引き寄せて、リーダライタのアンテナとＲＦＩＤタグ７のアンテナ間に磁束を貫通させることができ、ＲＦＩＤタグ７のアンテナにて受信した信号出力の減衰量を小さくできＲＦＩＤ特性の向上を図ることが可能になる。 In the RFID device, when the metal member 1 is in the vicinity of the RFID tag 7 as shown in FIGS. 8 and 9, an eddy current is generated in the metal member 1 by the magnetic field from the reader / writer, and the demagnetizing field due to the eddy current is generated by wireless communication. In order to solve this problem, magnetic sheets 5 and 8 are inserted between the metal member 1 and the RFID tag 7 as shown in FIGS. . As a result, the magnetic sheets 5 and 8 attract the magnetic flux from the reader / writer to the RFID tag 7 side so that the magnetic flux can penetrate between the reader / writer antenna and the RFID tag 7 antenna. The attenuation of the received signal output can be reduced, and the RFID characteristics can be improved.
国際公開第２００７／０４６５２７号International Publication No. 2007/046527 特開２００８－３０１２９５号公報JP 2008-301295 A
　ところで、金属部材１とＲＦＩＤタグ７の間における磁性シート５，８の設置位置及び磁性シート８の材料選択は、共振周波数及び最大通信距離に関するＲＦＩＤ特性を調整するうえで重要なパラメータである。図８，図９の従来の積層構造では、金属部材１と磁性シート８間の間隔Ｔ１が同じである。 By the way, the installation position of the magnetic sheets 5 and 8 and the material selection of the magnetic sheet 8 between the metal member 1 and the RFID tag 7 are important parameters for adjusting the RFID characteristics regarding the resonance frequency and the maximum communication distance. In the conventional laminated structure of FIGS. 8 and 9, the interval T1 between the metal member 1 and the magnetic sheet 8 is the same.
　ここで上記したように、磁性シート５，８と金属部材１間は両面テープを介して貼着されている。両面テープを用いるのは、両面に粘着層２，４を有して厚みがあり押圧したときに圧縮させやすい両面テープを用いることで、磁性シート５，８の表面の凹凸形状に倣って両層の粘着層２，４を適切に押し潰し強固に磁性シート５，８と金属部材１間を貼着するためである。 Here, as described above, the magnetic sheets 5 and 8 and the metal member 1 are attached via a double-sided tape. The double-sided tape is used because the double-sided tape has adhesive layers 2 and 4 on both sides and is thick and easy to be compressed when pressed. This is because the adhesive layers 2 and 4 are appropriately crushed and firmly bonded between the magnetic sheets 5 and 8 and the metal member 1.
　このように厚みのある両面テープを用いることで、金属部材１と磁性シート８間の間隔Ｔ１が広がりやすく、図９の積層構造のように磁性シート８を薄く形成する場合には、図８の磁性シート５に対して複素比透磁率の実数部μ´が高い材料を選択することが必要とされる。すなわち、磁性シート８を薄い厚さで形成してＲＦＩＤデバイスの薄型化を維持し、しかも共振周波数を１３．５６ＭＨｚに近づけ、できる限り最大通信距離が大きくなるように調整するために、磁性シート８には、より高い複素比透磁率の実数部μ´が要求された。その結果、磁性シート８に対する材料選択の自由度が低くなり、良好なＲＦＩＤ特性を安定して得にくい問題が発生した。 By using such a thick double-sided tape, the interval T1 between the metal member 1 and the magnetic sheet 8 is easily widened, and when the magnetic sheet 8 is formed thin like the laminated structure of FIG. It is necessary to select a material having a high real part μ ′ of the complex relative permeability with respect to the magnetic sheet 5. In other words, the magnetic sheet 8 is formed with a small thickness to maintain the RFID device thin, and the resonance frequency is adjusted to be close to 13.56 MHz and the maximum communication distance is adjusted as much as possible. Required a real part μ ′ having a higher complex relative permeability. As a result, the degree of freedom in selecting the material for the magnetic sheet 8 is reduced, and there is a problem that it is difficult to stably obtain good RFID characteristics.
　また、図９に示す従来の積層構造では、磁性層（磁性シート）８を単独で形成した後、この磁性シート８を金属部材１の表面に、粘着層２、樹脂シート３及び粘着層４の積層シートを用いて貼着するが、このような構成では、磁性シート８と金属部材１との間の間隔Ｔ１がばらつきやすく、よって最大通信距離や共振周波数がばらつく問題があった。 Further, in the conventional laminated structure shown in FIG. 9, after the magnetic layer (magnetic sheet) 8 is formed alone, the magnetic sheet 8 is formed on the surface of the metal member 1 with the adhesive layer 2, the resin sheet 3, and the adhesive layer 4. A laminated sheet is used for attachment, but with such a configuration, there is a problem that the interval T1 between the magnetic sheet 8 and the metal member 1 is likely to vary, and thus the maximum communication distance and resonance frequency vary.
　また図９の従来の積層構造のように、薄い磁性シート８であるほど、ＲＦＩＤ特性に対する磁性シート８と金属部材１との間のばらつきの影響が大きくなりやすい。 Further, as in the conventional laminated structure of FIG. 9, the thinner the magnetic sheet 8, the greater the influence of variation between the magnetic sheet 8 and the metal member 1 on the RFID characteristics.
　特に、金属部材１と磁性シート８間を両面テープにより貼着した従来例では、金属部材１と磁性シート８間の間隔Ｔ１は、両面テープの厚みにより変動するが、両面テープは粘着層２，４の総厚が厚く、押し潰したときに厚みが大きく変化しやすい。このため両面テープを用いた場合には、共振周波数及び最大通信距離に関するＲＦＩＤ特性を安定して調整することが難しかった。 In particular, in the conventional example in which the metal member 1 and the magnetic sheet 8 are attached with a double-sided tape, the interval T1 between the metal member 1 and the magnetic sheet 8 varies depending on the thickness of the double-sided tape. The total thickness of 4 is thick, and the thickness tends to change greatly when crushed. For this reason, when the double-sided tape is used, it is difficult to stably adjust the RFID characteristics relating to the resonance frequency and the maximum communication distance.
　また、ＲＦＩＤデバイスのみならず他のデバイス、例えば、磁性シートを基板上に形成された伝送線路に対するノイズ対策用として用いるデバイスでも従来の構成では反射ノイズを安定して抑制できない問題が生じた。 In addition, not only RFID devices but also other devices, for example, devices using a magnetic sheet as a noise countermeasure for a transmission line formed on a substrate, have a problem that reflection noise cannot be stably suppressed with the conventional configuration.
　反射ノイズは、例えば、伝送線路とＩＣとのインピーダンスの不整合により生じる。このため伝送線路に磁性シートを貼り付けることで伝送線路のインピーダンスを変化させ反射ノイズを抑制することができる。 Reflected noise is caused by, for example, impedance mismatch between the transmission line and the IC. For this reason, the impedance of a transmission line can be changed by sticking a magnetic sheet to a transmission line, and reflection noise can be suppressed.
　しかしながら図８，図９に示す構成と同様に、磁性シート５，８と伝送線路間を両面テープで貼着すると、磁性シート５，８と伝送線路間の間隔の変動が大きくなり、伝送線路のインピーダンスのばらつきが大きくなる問題が生じた。このため磁性シート５，８と伝送線路間を両面テープで貼着する構成では、反射ノイズを安定して抑制することができなかった。 However, similarly to the configuration shown in FIGS. 8 and 9, when the magnetic sheets 5 and 8 and the transmission line are pasted with a double-sided tape, the variation in the distance between the magnetic sheets 5 and 8 and the transmission line becomes large. There was a problem that the variation in impedance became large. For this reason, in the structure which sticks between the magnetic sheets 5 and 8 and a transmission line with a double-sided tape, reflection noise was not able to be suppressed stably.
　特許文献１，２は、いずれも磁性シートを用いたデバイス（ＲＦＩＤデバイス）に関する発明が開示されているが、上記した従来の課題を解決するための構成は開示されていない。 Patent Documents 1 and 2 each disclose an invention related to a device (RFID device) using a magnetic sheet, but do not disclose a configuration for solving the above-described conventional problems.
　そこで本発明は上記従来の課題を解決するためのものであり、特に、従来に比べて磁性層に対する材料選択の自由度を高めることができ、特性ばらつきを小さくでき、更なる薄型化を実現できる磁性部材を有するデバイス及びその製造方法を提供することを目的としている。 Therefore, the present invention is for solving the above-described conventional problems, and in particular, the degree of freedom of material selection for the magnetic layer can be increased as compared with the conventional one, characteristic variation can be reduced, and further thinning can be realized. It aims at providing the device which has a magnetic member, and its manufacturing method.
　本発明における磁性部材を有するデバイスは、
　金属を含む部材と、磁性部材と、を有し、
　前記磁性部材は、磁性層が支持部材の表面に直接形成された構成であり、前記金属を含む部材、第１の接合層、及び前記磁性部材の順に積層されていることを特徴とするものである。 The device having a magnetic member in the present invention,
A member including a metal and a magnetic member;
The magnetic member has a structure in which a magnetic layer is formed directly on the surface of a support member, and the member including the metal, the first bonding layer, and the magnetic member are laminated in this order. is there.
　また本発明における磁性部材を有するデバイスの製造方法は、
　金属を含む部材と、磁性部材と、を有し、
　磁性層を支持部材の表面に直接形成して前記磁性部材を形成し、前記磁性部材を、前記金属を含む部材の表面に第１の接合層により接合することを特徴とするものである。 Moreover, the manufacturing method of the device having a magnetic member in the present invention,
A member including a metal and a magnetic member;
The magnetic member is formed directly on the surface of the support member to form the magnetic member, and the magnetic member is bonded to the surface of the member containing the metal by a first bonding layer.
　本発明では、従来に比べて、金属を含む部材と磁性層との間の間隔を安定して小さくすることができる。これにより、磁性層に対する材料選択の自由度を従来に比べて高くでき、磁性部材をＲＦＩＤ用として使用するデバイスでは、共振周波数を１３．５６ＭＨｚに近づけ最大通信距離を大きくでき且つばらつきを小さく調整でき、また磁性部材を伝送線路のノイズ対策用として使用するデバイスでは、伝送線路のインピーダンスのばらつきを小さくでき効果的に反射ノイズを抑制できる。そして本実施形態では、デバイスの更なる薄型化を促進できる。 In the present invention, the interval between the metal-containing member and the magnetic layer can be stably reduced as compared with the conventional case. As a result, the degree of freedom of material selection for the magnetic layer can be increased compared to conventional devices, and in devices using magnetic members for RFID, the resonance frequency can be made close to 13.56 MHz, the maximum communication distance can be increased, and variations can be adjusted to be small. In addition, in a device that uses a magnetic member as a countermeasure against noise in the transmission line, it is possible to reduce variations in impedance of the transmission line and effectively suppress reflection noise. In this embodiment, further thinning of the device can be promoted.
　本発明では、前記金属を含む部材、前記第１の接合層、前記支持部材、及び、前記磁性層の順に積層されていることが好適である。 In the present invention, it is preferable that the metal-containing member, the first bonding layer, the support member, and the magnetic layer are laminated in this order.
　また本発明では、上記した磁性部材を有するデバイスの製造方法において、前記磁性層をドクターブレード法により前記支持部材の表面に形成することが、簡単且つ適切に磁性層を支持部材表面に直接形成できて好適である。 In the present invention, in the method for manufacturing a device having a magnetic member described above, the magnetic layer can be formed directly on the surface of the support member simply and appropriately by forming the magnetic layer on the surface of the support member by a doctor blade method. It is preferable.
　また本発明では、前記第１の接合層は予め前記支持部材の前記磁性層を形成する面と反対面に設けられた粘着層であり、前記粘着層を剥離可能な保護部材により保護した状態で、前記支持部材の表面に前記磁性層を直接形成し、続いて、前記保護部材を除去して、前記粘着層により前記磁性部材を前記金属を含む部材の表面に貼着することが好ましい。このように支持部材の表面に磁性層を直接形成し、その後は、粘着層により磁性部材を金属部材に貼着するだけでよいので、製造工程数を少なく出来、また製造コストを抑えることが出来る。 In the present invention, the first bonding layer is an adhesive layer provided in advance on a surface opposite to the surface on which the magnetic layer of the support member is formed, and the adhesive layer is protected with a peelable protective member. Preferably, the magnetic layer is directly formed on the surface of the support member, and then the protective member is removed, and the magnetic member is adhered to the surface of the member containing the metal by the adhesive layer. In this way, the magnetic layer is formed directly on the surface of the support member, and after that, it is only necessary to stick the magnetic member to the metal member with the adhesive layer, so that the number of manufacturing steps can be reduced and the manufacturing cost can be reduced. .
　また本発明では、第１の金属を含む部材と、磁性部材と、第２の金属を含む部材とを有し、前記第１の金属を含む部材あるいは前記第２の金属を含む部材のどちらか一方がＲＦＩＤタグであり、前記磁性部材は、前記支持部材が前記第１の金属を含む部材側に向けられて前記支持部材と前記第１の金属を含む部材間が前記第１の接合層を介して貼着されており、前記磁性層と前記第２の金属を含む部材間が第２の接合層を介して貼着されていることが好ましい。これにより、共振周波数を１３．５６ＭＨｚに近づけ最大通信距離を大きくでき且つばらつきを小さく調整できる。 In the present invention, the first metal-containing member, the magnetic member, and the second metal-containing member are included, and either the first metal-containing member or the second metal-containing member is included. One is an RFID tag, and the magnetic member has the first bonding layer between the support member and the member containing the first metal with the support member facing the member containing the first metal. It is preferable that the member including the magnetic layer and the second metal is attached via a second bonding layer. Thereby, the resonance frequency can be made close to 13.56 MHz, the maximum communication distance can be increased, and the variation can be adjusted to be small.
　あるいは本発明では、前記金属を含む部材は基板上に伝送線路が設けられた構成であり、前記磁性部材は、前記支持部材が前記伝送線路側に向けられた状態で、前記伝送線路と前記支持部材との間が前記第１の接合層を介して貼着されていることが好ましい。これにより、伝送線路のインピーダンスのばらつきを小さくでき効果的に反射ノイズを抑制できる。 Alternatively, in the present invention, the metal-containing member has a configuration in which a transmission line is provided on a substrate, and the magnetic member has the transmission line and the support in a state where the support member is directed toward the transmission line. It is preferable that the space between the members is attached via the first bonding layer. Thereby, the dispersion | variation in the impedance of a transmission line can be made small and reflection noise can be suppressed effectively.
　本発明では、従来に比べて、金属を含む部材と磁性層との間の間隔を小さくすることができる。これにより、磁性層に対する材料選択の自由度を従来に比べて高くできる。また、従来に比べて、磁性層と金属部材との間のばらつきを小さくでき、よって特性ばらつきを小さくでき、またデバイスの更なる薄型化を促進できる。 In the present invention, the distance between the metal-containing member and the magnetic layer can be reduced as compared with the conventional case. Thereby, the freedom degree of material selection with respect to a magnetic layer can be made high compared with the past. In addition, the variation between the magnetic layer and the metal member can be reduced as compared with the conventional case, so that the characteristic variation can be reduced, and further thinning of the device can be promoted.
第１の実施形態におけるＲＦＩＤデバイスの縦断面図、A longitudinal sectional view of the RFID device according to the first embodiment, 第２の実施形態におけるＲＦＩＤデバイスの縦断面図、The longitudinal cross-sectional view of the RFID device in 2nd Embodiment, （ａ）は、磁性シートを伝送線路の表面にノイズ対策用とした貼着したデバイスの平面図であり（ｂ）は、（ａ）に示すＡ－Ａ線に沿って切断し矢印方向から見た部分縦断面図、(A) is a plan view of a device in which a magnetic sheet is adhered to the surface of a transmission line for noise suppression, and (b) is cut along the line AA shown in (a) and viewed from the direction of the arrow. Partial longitudinal sectional view, ドクターブレード法の概念図、Conceptual diagram of the doctor blade method, 本実施形態の磁性部材及び第１の接合層の付近を拡大した部分拡大断面図、The partial expanded sectional view which expanded the vicinity of the magnetic member of this embodiment, and the 1st joined layer, 従来例に用いた磁性シートの複素比透磁率の実数部μ´及び虚数部μ″の周波数特性を示すグラフ、A graph showing the frequency characteristics of the real part μ ′ and the imaginary part μ ″ of the complex relative permeability of the magnetic sheet used in the conventional example, 従来例、実施例１～３、及びタグ単体の共振周波数と最大通信距離との関係を示すグラフ、Conventional example, Examples 1 to 3, and a graph showing the relationship between the resonance frequency of a single tag and the maximum communication distance, 第１の従来例におけるＲＦＩＤデバイスの縦断面図、The longitudinal cross-sectional view of the RFID device in a 1st prior art example, 第２の従来例におけるＲＦＩＤデバイスの縦断面図。The longitudinal cross-sectional view of the RFID device in a 2nd prior art example.
　図１は、本実施形態におけるＲＦＩＤデバイスの縦断面図である。
　図１に示すようにＲＦＩＤ（Radio Frequency ID）デバイス１０は、アンテナ及びＩＣチップを備えるＲＦＩＤタグ（第２の金属を含む部材）１１と、金属部材（第１の金属を含む部材）１２と、ＲＦＩＤタグ１１と金属部材１２との間に挿入される磁性部材（磁性シート）１３とを有して構成される。 FIG. 1 is a longitudinal sectional view of an RFID device according to this embodiment.
As shown in FIG. 1, an RFID (Radio Frequency ID) device 10 includes an RFID tag (member containing a second metal) 11 including an antenna and an IC chip, a metal member (member containing a first metal) 12, A magnetic member (magnetic sheet) 13 inserted between the RFID tag 11 and the metal member 12 is provided.
　ＲＦＩＤタグ１１は、基板上にアンテナ及びＩＣチップが形成された形態である。
　金属部材１２は例えば筐体の一部を成しており、Ａｌ、Ｔｉ、Ｃｒ等で形成される。金属部材１２の膜厚は、０．０５～０．５ｍｍ程度である。 The RFID tag 11 has a form in which an antenna and an IC chip are formed on a substrate.
The metal member 12 forms a part of the housing, for example, and is made of Al, Ti, Cr or the like. The film thickness of the metal member 12 is about 0.05 to 0.5 mm.
　図１に示す本実施形態の磁性部材１３は支持部材１４の表面に磁性層１５が直接形成された構成である。支持部材１４の厚さ寸法Ｈ５は、１０～４０μｍ程度である。磁性層１５はセンダストやＦｅ－Ｍ－Ｃｒ－Ｐ－Ｃ（Ｍは、Ｓｎ，Ｉｎ，Ｚｎ，Ｇａ，Ａｌ，Ｎｉ，Ｂ，Ｓｉのいずれか一種または二種以上）などの軟磁性材料の粉体や鱗片がバインダー樹脂で結合された構成である。 The magnetic member 13 of the present embodiment shown in FIG. 1 has a configuration in which a magnetic layer 15 is directly formed on the surface of a support member 14. The thickness dimension H5 of the support member 14 is about 10 to 40 μm. The magnetic layer 15 is a powder of a soft magnetic material such as Sendust or Fe-M-Cr-PC (M is one or more of Sn, In, Zn, Ga, Al, Ni, B, and Si). It is a structure in which the body and scales are bonded with a binder resin.
　図１に示すように、金属部材１２と支持部材１４は第１の接合層１６を介して接合されている。また図１に示すように、磁性層１５とＲＦＩＤタグ１１は第２の接合層１７を介して接合されている。第１の接合層１６の厚さ寸法Ｈ７は、３０～１００μｍ程度、第２の接合層１７の厚さ寸法Ｈ８は、１０～５０μｍ程度である。 As shown in FIG. 1, the metal member 12 and the support member 14 are bonded via a first bonding layer 16. Further, as shown in FIG. 1, the magnetic layer 15 and the RFID tag 11 are bonded via a second bonding layer 17. The thickness dimension H7 of the first bonding layer 16 is about 30 to 100 μm, and the thickness dimension H8 of the second bonding layer 17 is about 10 to 50 μm.
　このように、図１に示すＲＦＩＤデバイス１０は、金属部材１２、第１の接合層１６、支持部材１４、磁性層１５、第２の接合層１７及びＲＦＩＤタグ１１の順に積層された構成である。 As described above, the RFID device 10 shown in FIG. 1 has a configuration in which the metal member 12, the first bonding layer 16, the support member 14, the magnetic layer 15, the second bonding layer 17, and the RFID tag 11 are stacked in this order. .
　本実施形態のＲＦＩＤデバイス１０では、磁性層１５と金属部材１２との間の間隔Ｔ２は、（第１の接合層１６の厚さ寸法Ｈ７＋支持部材１４の厚さ寸法Ｈ５）で求めることが出来る。磁性層１５と金属部材１２との間の間隔Ｔ２は、４０～１４０μｍ程度である。本実施形態では、磁性層１５を支持部材１４の表面に直接形成している。そして本実施形態では、磁性部材１３と金属部材１２との間の間隔内に１層だけ接合層１６があれば足り、よって、従来に比べて、磁性層１５と金属部材１２との間の間隔Ｔ２を小さくできる。すなわち磁性層１５を金属部材１２に近づけることができる。この結果、磁性層１５の厚さ寸法Ｈ６を薄い膜厚のままで複素比透磁率の実数部μ´を比較的低く設定しても、共振周波数を１３．５６ＭＨｚに近づけ良好な最大通信距離（通信可能な最大距離）を得ることができる。そして本実施形態では、磁性層１５の複素比透磁率の実数部μ´の実用範囲を広げることができる。よって、磁性層１５に対する材料選択の自由度を高くでき、また磁性層１５の薄膜化を促進しやすい。なお、「実用範囲」とは、磁性層１５を薄い略一定膜厚（例えば後述の実験では約５０μｍとしている）のままで、良好なＲＦＩＤ特性を得ることが可能な実数部μ´の範囲を指す。本実施形態では、磁性層１５の厚さ寸法Ｈ６を、５０～１００μｍ程度で、磁性層１５の複素比透磁率の実数部μ´(13.56MHz)を４０～１００程度の範囲内で調整できる。 In the RFID device 10 of the present embodiment, the interval T2 between the magnetic layer 15 and the metal member 12 can be obtained by (thickness dimension H7 of the first bonding layer 16 + thickness dimension H5 of the support member 14). . A distance T2 between the magnetic layer 15 and the metal member 12 is about 40 to 140 μm. In the present embodiment, the magnetic layer 15 is formed directly on the surface of the support member 14. In the present embodiment, only one bonding layer 16 is required in the interval between the magnetic member 13 and the metal member 12, and therefore, the interval between the magnetic layer 15 and the metal member 12 as compared with the related art. T2 can be reduced. That is, the magnetic layer 15 can be brought close to the metal member 12. As a result, even when the thickness H6 of the magnetic layer 15 is kept thin and the real part μ ′ of the complex relative permeability is set to a relatively low value, the resonance frequency becomes close to 13.56 MHz and a good maximum communication distance ( Maximum distance that can be communicated). In this embodiment, the practical range of the real part μ ′ of the complex relative permeability of the magnetic layer 15 can be expanded. Therefore, the degree of freedom of material selection for the magnetic layer 15 can be increased, and the magnetic layer 15 can be easily made thinner. The “practical range” refers to a range of the real part μ ′ in which good RFID characteristics can be obtained with the magnetic layer 15 kept in a thin and substantially constant film thickness (for example, about 50 μm in the experiment described later). Point to. In the present embodiment, the thickness H6 of the magnetic layer 15 can be adjusted to about 50 to 100 μm, and the real part μ ′ (13.56 MHz) of the complex relative permeability of the magnetic layer 15 can be adjusted within the range of about 40 to 100.
　また従来の積層構造（例えば図９）では、磁性部材（磁性シート）と金属部材間に両面テープを介在させて押圧したときに、両面に位置する粘着層２、４が夫々押し潰されて総厚の厚い粘着層２，４の変化量が大きく変動しやすく、磁性シート８と金属部材１間の間隔Ｔ１がばらつきやすかった。これに対して、図１に示す実施形態では、磁性層１５を支持部材１４表面に直接形成して磁性部材１３を構成し、この磁性部材１３を金属部材１２の表面に１層の第１の接合層１６を介して接合する構成とすることで、磁性層１５と金属部材１２間の間隔Ｔ２を小さく且つ間隔Ｔ２のばらつきを従来に比べて小さくすることができる。この結果、従来に比べてＲＦＩＤデバイスの共振周波数や通信距離のばらつきを小さくしやすい。 Further, in the conventional laminated structure (for example, FIG. 9), when the double-sided tape is interposed between the magnetic member (magnetic sheet) and the metal member and pressed, the adhesive layers 2 and 4 located on both sides are crushed and are totalized. The amount of change in the thick adhesive layers 2 and 4 was likely to fluctuate greatly, and the interval T1 between the magnetic sheet 8 and the metal member 1 was likely to vary. On the other hand, in the embodiment shown in FIG. 1, the magnetic layer 15 is formed directly on the surface of the support member 14 to form the magnetic member 13, and the magnetic member 13 is formed on the surface of the metal member 12 by one layer of the first layer. By adopting a configuration in which bonding is performed via the bonding layer 16, the interval T <b> 2 between the magnetic layer 15 and the metal member 12 can be reduced, and the variation in the interval T <b> 2 can be reduced as compared with the related art. As a result, it is easy to reduce variations in the resonance frequency and communication distance of the RFID device as compared to the conventional case.
　また図１に示す実施形態では、磁性層１５を支持部材１４表面に直接形成したことで、ＲＦＩＤデバイス１０の更なる薄型化を促進することができる。 In the embodiment shown in FIG. 1, the magnetic layer 15 is directly formed on the surface of the support member 14, so that further reduction in the thickness of the RFID device 10 can be promoted.
　図１に示す実施形態では、磁性層１５を直接形成するための支持部材１４が、金属部材１２と磁性層１５の間に介在し、第１の接合層１６と合わせて金属部材１２と磁性層１５との間の間隔Ｔ２を調整するためのスペーサとして機能している。よって図１の積層構造では、支持部材１４の厚さ寸法Ｈ５を調整することで間隔Ｔ２の調整を行うことが出来る。なお、図１に示す実施形態では、磁性層１５とＲＦＩＤタグ１１間の間隔は、第２の接合層１７の厚さ寸法Ｈ８にて調整する。 In the embodiment shown in FIG. 1, the support member 14 for directly forming the magnetic layer 15 is interposed between the metal member 12 and the magnetic layer 15, and the metal member 12 and the magnetic layer together with the first bonding layer 16. 15 functions as a spacer for adjusting the interval T2 between the two. Therefore, in the laminated structure of FIG. 1, the interval T2 can be adjusted by adjusting the thickness dimension H5 of the support member 14. In the embodiment shown in FIG. 1, the distance between the magnetic layer 15 and the RFID tag 11 is adjusted by the thickness dimension H8 of the second bonding layer 17.
　図１に示す実施形態では支持部材１４として樹脂シート、特にＰＥＴシートを好ましく適用できる。ただし支持部材１４は、薄板状であれば、樹脂シートに限定するものでない。 In the embodiment shown in FIG. 1, a resin sheet, particularly a PET sheet, can be preferably applied as the support member 14. However, the support member 14 is not limited to a resin sheet as long as it is thin.
　上記のように本実施形態では支持部材１４を金属部材１２側に向けて、支持部材１４と金属部材１２間を第１の接合層１６を介して貼着するが、磁性層１５を金属部材１２側に向けるよりも、硬く且つ表面の平坦性に優れた支持部材１４を金属部材１２側に向けることで、薄い第１の接合層１６により支持部材１４と金属部材１２間をほぼ所定の間隔にて密着させ安定して接合することが出来る。 As described above, in the present embodiment, the support member 14 is directed toward the metal member 12 side, and the support member 14 and the metal member 12 are bonded via the first bonding layer 16, but the magnetic layer 15 is attached to the metal member 12. The support member 14 that is harder and has better surface flatness than the side is directed to the metal member 12 side, so that the thin first bonding layer 16 causes the support member 14 and the metal member 12 to have a substantially predetermined interval. And can be bonded stably.
　接合層１６，１７は、粘着剤や接着剤で構成される。なお本実施形態では、粘着剤や接着剤を明確に区別するものではない。物どうしを接合するのに用いられる物質は全て接合層として構成される。例えば接合層１６，１７には粘着層としてアクリル系粘着剤またはアクリル系粘着剤が付いたポリエステルフィルム粘着テープ等を用いることが出来る。 The bonding layers 16 and 17 are made of an adhesive or an adhesive. In the present embodiment, the pressure-sensitive adhesive and the adhesive are not clearly distinguished. All materials used to join things together are configured as a joining layer. For example, for the bonding layers 16 and 17, an acrylic pressure-sensitive adhesive or a polyester film pressure-sensitive adhesive tape with an acrylic pressure-sensitive adhesive can be used as the pressure-sensitive adhesive layer.
　例えば第１の接合層１６は、ゲル状固体物や高粘性の液体の粘着剤により構成され、例えば、支持部材１４の磁性層１５を形成する面の反対面に粘着層である第１の接合層１６が予め設けられた片面の粘着テープとして構成されている。そして、図１では、支持部材１４を金属部材１２側に向けて支持部材１４の表面に予め形成された第１の接合層（粘着層）１６により磁性部材１３が金属部材１２の表面に貼着された構成となっている。このような構成とすることで、簡単な組立を実現でき、また、磁性層１５と金属部材１２間の間隔Ｔ２のばらつきをより小さくすることができる。 For example, the first bonding layer 16 is made of a gel-like solid material or a highly viscous liquid adhesive, and, for example, the first bonding layer 16 is an adhesive layer on the opposite surface of the support member 14 from which the magnetic layer 15 is formed. The layer 16 is configured as a single-sided adhesive tape provided in advance. In FIG. 1, the magnetic member 13 is attached to the surface of the metal member 12 by the first bonding layer (adhesive layer) 16 formed in advance on the surface of the support member 14 with the support member 14 facing the metal member 12 side. It has been configured. With such a configuration, simple assembly can be realized, and variation in the interval T2 between the magnetic layer 15 and the metal member 12 can be further reduced.
　なお第２の接合層１７の部分については両面テープを用い、ＲＦＩＤタグ１１と磁性部材１３間を前記両面テープを用いて貼着することが可能である。 It should be noted that the second bonding layer 17 can be attached using a double-sided tape, and the RFID tag 11 and the magnetic member 13 can be attached using the double-sided tape.
　図２では、金属部材１２、第２の接合層１７、磁性層１５、支持部材１４、第１の接合層１６及びＲＦＩＤタグ１１の順に積層されている。この実施形態ではＲＦＩＤタグ１１を「第１の金属を含む部材」とし、金属部材１２を「第２の金属を含む部材」として、ＲＦＩＤタグ１１と磁性部材（磁性シート）１３間を第１の接合層１６により接合している。金属部材１２がＲＦＩＤタグ１１の近傍に設けられる形態において、ＲＦＩＤ特性の低下を抑制すべく、ＲＦＩＤタグ１１と金属部材１２間に磁性部材１３を挿入するが、この際、磁性部材１３と金属部材１２間の間隔を小さく且つ安定した間隔に保ったほうがＲＦＩＤ特性の向上に有利な形態と、磁性部材１３とＲＦＩＤタグ１１間を小さく且つ安定した間隔に保ったほうがＲＦＩＤ特性に有利な形態とがある。どちらの形態としたほうがよいかは、ＲＦＩＤタグ１１及び金属部材１２の材質や形状、磁性層１５の材質や膜特性、使用用途等により変わる。図２に示す実施形態は、磁性部材１３を構成する支持材１４をＲＦＩＤタグ１１側に向けて、支持部材１４とＲＦＩＤタグ１１間を第１の接合層１６を介して貼着している。これにより、磁性層１５とＲＦＩＤタグ１１間を間隔Ｔ２にて近づけることができ、且つ間隔Ｔ２のばらつきを小さくでき、ＲＦＩＤ特性のばらつきを小さく効果的に特性の向上を図ることができる。 2, the metal member 12, the second bonding layer 17, the magnetic layer 15, the support member 14, the first bonding layer 16, and the RFID tag 11 are stacked in this order. In this embodiment, the RFID tag 11 is a “member containing a first metal”, the metal member 12 is a “member containing a second metal”, and the gap between the RFID tag 11 and the magnetic member (magnetic sheet) 13 is the first. Bonded by the bonding layer 16. In the form in which the metal member 12 is provided in the vicinity of the RFID tag 11, the magnetic member 13 is inserted between the RFID tag 11 and the metal member 12 in order to suppress degradation of the RFID characteristics. At this time, the magnetic member 13 and the metal member are inserted. There is a form in which it is advantageous to improve the RFID characteristics when the interval between 12 is kept small and stable, and a form in which it is advantageous for the RFID characteristics to keep the gap between the magnetic member 13 and the RFID tag 11 small and stable. is there. Which form should be used depends on the material and shape of the RFID tag 11 and the metal member 12, the material and film characteristics of the magnetic layer 15, and the intended use. In the embodiment shown in FIG. 2, the support member 14 constituting the magnetic member 13 is directed toward the RFID tag 11, and the support member 14 and the RFID tag 11 are attached via the first bonding layer 16. As a result, the magnetic layer 15 and the RFID tag 11 can be brought closer to each other at the interval T2, the variation in the interval T2 can be reduced, and the variation in the RFID characteristics can be reduced to effectively improve the characteristics.
　図３は磁性部材（磁性シート）１３を、電子部品や伝送線路で構成される電子回路におけるノイズ対策用として用いた場合のデバイスを示し、（ａ）は平面図、（ｂ）は（ａ）に示すＡ－Ａ線に沿って厚さ方向に切断し矢印方向から見たときの部分縦断面図を示す。 FIG. 3 shows a device in which the magnetic member (magnetic sheet) 13 is used as a noise countermeasure in an electronic circuit composed of electronic components and transmission lines, where (a) is a plan view and (b) is (a). FIG. 2 is a partial longitudinal sectional view taken along the line AA shown in FIG.
　図３（ａ）（ｂ）に示すように、基板３１上に伝送線路３２が形成されて「金属を含む部材」が構成される。また基板上にはＩＣ等の電子部品が設けられて電子回路を構成している。 As shown in FIGS. 3A and 3B, a transmission line 32 is formed on a substrate 31 to constitute a “metal-containing member”. An electronic circuit such as an IC is provided on the substrate to constitute an electronic circuit.
　図３（ａ）（ｂ）に示すように、本実施形態の磁性部材（磁性シート）１３を伝送線路３２に第１の接合層１６を介して貼着することで、伝送線路３２のインピーダンスを変化させ、伝送線路３２とＩＣ間のインピーダンスの不整合等で生じる反射ノイズを抑制することが出来る。 As shown in FIGS. 3A and 3B, the magnetic member (magnetic sheet) 13 of the present embodiment is attached to the transmission line 32 via the first bonding layer 16, so that the impedance of the transmission line 32 is increased. It is possible to suppress the reflection noise caused by impedance mismatch between the transmission line 32 and the IC.
　本実施形態では、図３（ｂ）に示すように、磁性部材１３の支持部材１４を伝送線路３２側に向けて薄い第１の接合層１６を介して支持部材１４と伝送線路３２間を貼着している。これにより両面テープを用いる場合に比べて、磁性層１５と伝送線路３２間の間隔をばらつきが小さく且つ支持部材１４と伝送線路３２間を安定して接合することができる。磁性層１５を伝送線路３２側に向けるよりも、ＰＥＴシート等で形成され硬く且つ表面平坦性に優れた支持部材１４を伝送線路３２側に向けることで薄い１層の第１の接合層１６により、支持部材１４と伝送線路３２間を適切に密着させて強固に接合できる。 In the present embodiment, as shown in FIG. 3B, the support member 14 of the magnetic member 13 is directed to the transmission line 32 side, and the support member 14 and the transmission line 32 are pasted via the thin first bonding layer 16. I wear it. Thereby, compared with the case where a double-sided tape is used, the dispersion | variation between the magnetic layer 15 and the transmission line 32 has a small dispersion | variation, and between the support member 14 and the transmission line 32 can be joined stably. Rather than directing the magnetic layer 15 to the transmission line 32 side, the thin first bonding layer 16 is formed by directing the support member 14 formed of a PET sheet or the like to be hard and excellent in surface flatness to the transmission line 32 side. In addition, the support member 14 and the transmission line 32 can be properly bonded to each other and firmly bonded.
　第１の接合層１６は支持部材１４の磁性層１５が形成される面と反対面に予め設けられた粘着層である。そして、支持部材１４を伝送線路３２側に向けて、前記粘着層により磁性部材１３を簡単に伝送線路３２に貼着することが可能である。 The first bonding layer 16 is an adhesive layer provided in advance on the surface opposite to the surface on which the magnetic layer 15 of the support member 14 is formed. Then, the magnetic member 13 can be easily attached to the transmission line 32 by the adhesive layer with the support member 14 facing the transmission line 32 side.
　次に本実施形態における磁性部材（磁性シート）を有するデバイスの製造方法を説明する。 Next, a method for manufacturing a device having a magnetic member (magnetic sheet) in this embodiment will be described.
　図４に示す工程では、磁性層を構成するバインダー樹脂材と磁性粉末とを有して成る混合液（スラリー）２０を、ドクターブレード装置２１内に供給し、支持部材（ＰＥＴシートが好適である）１４を引きながら、ブレード２３により混合液２０を所定厚さで成膜する。 In the step shown in FIG. 4, a mixed liquid (slurry) 20 having a binder resin material and magnetic powder constituting the magnetic layer is supplied into a doctor blade device 21 and a support member (PET sheet is suitable). ) 14, the mixed solution 20 is formed into a film with a predetermined thickness by the blade 23.
　例えば、ドクターブレード装置２１を所定温度に設定して、磁性層１５を塗布形成し、その後、乾燥させることで硬化させることが出来る。なお磁性層１５を支持部材１４上に直接形成する方法は、ドクターブレード法に限定されないが、ドクターブレード法を用いることで磁性層１５を所定厚に形成しやすく、また支持部材１４を順次送りながら連続して磁性層１５を支持部材１４表面に形成でき好適である。 For example, the doctor blade device 21 can be set to a predetermined temperature, the magnetic layer 15 can be applied and formed, and then dried to be cured. The method of directly forming the magnetic layer 15 on the support member 14 is not limited to the doctor blade method, but it is easy to form the magnetic layer 15 to a predetermined thickness by using the doctor blade method, and while the support member 14 is being fed sequentially. It is preferable that the magnetic layer 15 can be continuously formed on the surface of the support member 14.
　また図５に示すように支持部材１４の磁性層１５を形成する面１４ａと反対面１４ｂには予め第１の接合層１６としての粘着層（以下、粘着層１６と言う）が設けられている。図５に示すように粘着層１６を剥離可能な保護シート（保護部材）２４で保護した状態で、支持部材１４の表面１４ａに磁性層１５を直接形成する。続いて、保護シート２４を剥がして除去し、図１に示すＲＦＩＤデバイス１０であれば、粘着層１６により磁性部材１３を金属部材１２の表面に貼着し、続いて、磁性層１５の表面に第２の接合層１７を介してＲＦＩＤタグ１１を接合する。図２の形態では、粘着層１６により磁性部材１３をＲＦＩＤタグ１１の表面に貼着し、続いて、磁性層１５を、第２の接合層１７を介して金属部材１２の表面に接合する。あるいは図３に示す磁性部材１３をノイズ対策用として使用するデバイスでは、粘着層１６により磁性部材１３を伝送線路３２の表面に貼着する。 As shown in FIG. 5, an adhesive layer (hereinafter referred to as an adhesive layer 16) as a first bonding layer 16 is provided in advance on the surface 14 a opposite to the surface 14 a forming the magnetic layer 15 of the support member 14. . As shown in FIG. 5, the magnetic layer 15 is directly formed on the surface 14 a of the support member 14 in a state where the adhesive layer 16 is protected by a peelable protective sheet (protective member) 24. Subsequently, the protective sheet 24 is peeled off and removed, and in the case of the RFID device 10 shown in FIG. 1, the magnetic member 13 is adhered to the surface of the metal member 12 by the adhesive layer 16, and subsequently, the surface of the magnetic layer 15 is adhered. The RFID tag 11 is bonded through the second bonding layer 17. In the form of FIG. 2, the magnetic member 13 is attached to the surface of the RFID tag 11 by the adhesive layer 16, and then the magnetic layer 15 is bonded to the surface of the metal member 12 via the second bonding layer 17. Alternatively, in the device using the magnetic member 13 shown in FIG. 3 for noise suppression, the magnetic member 13 is adhered to the surface of the transmission line 32 by the adhesive layer 16.
　図５の構成では、支持部材１４に磁性層１５を直接形成し、その後は、支持部材１４に予め設けられた粘着層１６により、磁性部材１３を金属部材１２、ＲＦＩＤタグ１１あるいは伝送線路３２等の表面に貼着するだけでよいので、製造工程数を少なく出来、また製造コストを抑えることが出来る。 In the configuration of FIG. 5, the magnetic layer 15 is directly formed on the support member 14, and thereafter, the magnetic member 13 is made of the metal member 12, the RFID tag 11, the transmission line 32, or the like by the adhesive layer 16 provided in advance on the support member 14. Therefore, the number of manufacturing steps can be reduced and the manufacturing cost can be reduced.
　本実施形態における磁性部材（磁性シート）を用いたデバイスは、図１～図３以外の信号伝達デバイス、電子デバイス等に使用可能である。 The device using the magnetic member (magnetic sheet) in this embodiment can be used for signal transmission devices, electronic devices, etc. other than those shown in FIGS.
（ＲＦＩＤデバイスの実験）
　次の従来例及び実施例のＲＦＩＤデバイスを形成した。
（１）　従来例
　図８の積層構造のＲＦＩＤデバイスを形成した。磁性層（磁性シート）５には、３Ｍ製の５０１０Ｂ（厚さ１００μｍ程度）を使用した。前記磁性シート５（３Ｍ製５０１０Ｂ）の複素比透磁率の実数部μ´(13.56MHz)は２０程度であった。なお図６に、前記磁性シート５（３Ｍ製５０１０Ｂ）の複素比透磁率の実数部μ´及び虚数部μ″の周波数特性を示す。また、磁性シート５と金属部材１との間の接合には粘着層２／樹脂シート３／粘着層４の両面テープを用い、磁性シート５と金属部材１間の間隔Ｔ１を１７０μｍとした。 (RFID device experiment)
RFID devices of the following conventional examples and examples were formed.
(1) Conventional Example An RFID device having the laminated structure shown in FIG. 8 was formed. For the magnetic layer (magnetic sheet) 5, 3M 5010B (about 100 μm thick) was used. The real part μ ′ (13.56 MHz) of the complex relative permeability of the magnetic sheet 5 (3M 5010B) was about 20. 6 shows the frequency characteristics of the real part μ ′ and the imaginary part μ ″ of the complex relative permeability of the magnetic sheet 5 (3M 5010B). In addition, the magnetic sheet 5 and the metal member 1 are joined together. Used double-sided tape of adhesive layer 2 / resin sheet 3 / adhesive layer 4 and the interval T1 between the magnetic sheet 5 and the metal member 1 was 170 μm.
（２）　実施例１
　図１に示す積層構造のＲＦＩＤデバイスを形成した。磁性層１５にはアルプス電気製のＨＭＳＺＳ□（８０Ｒ）を用いた。 (2) Example 1
An RFID device having a laminated structure shown in FIG. 1 was formed. HMSZS □ (80R) made by Alps Electric was used for the magnetic layer 15.
（３）　実施例２
　図１に示す積層構造のＲＦＩＤデバイスを形成した。磁性層１５にはアルプス電気製のＨＭＳＸＳ□（６０Ｒ）を用いた。 (3) Example 2
An RFID device having a laminated structure shown in FIG. 1 was formed. For the magnetic layer 15, HMXS □ (60R) manufactured by Alps Electric was used.
（４）　実施例３
　図１に示す積層構造のＲＦＩＤデバイスを形成した。磁性層１５にはアルプス電気製のＨＭＳＵＳ□（４０Ｒ）を用いた。 (4) Example 3
An RFID device having a laminated structure shown in FIG. 1 was formed. HMSUS □ (40R) made by Alps Electric was used for the magnetic layer 15.
　実施例１～３において、磁性層１５と金属部材１２の間には、支持部材（ＰＥＴシート）１４と第１の接合層（粘着層）１６とが介在し、間隔Ｔ２を７０μｍとした。また実施例１～３の各磁性層１５の厚さ寸法Ｈ６を５０μｍ程度とした。 In Examples 1 to 3, a support member (PET sheet) 14 and a first bonding layer (adhesive layer) 16 are interposed between the magnetic layer 15 and the metal member 12, and the interval T2 is set to 70 μm. In addition, the thickness dimension H6 of each magnetic layer 15 of Examples 1 to 3 was set to about 50 μm.
　実験では、上記した従来例、及び、実施例１～３の各ＲＦＩＤデバイスを用いて、共振周波数と最大通信距離を求めた。リーダライタにはＤＥＮＳＯ　ＷＡＶＥ　ＰＲ－３０１ＲＫＭを用いた。なお実験では、タグ（ＩＣカード）単体での共振周波数及び最大通信距離も測定した。
　その実験結果が以下の表１及び図７に示されている。 In the experiment, the resonance frequency and the maximum communication distance were determined using the RFID devices of the above-described conventional example and Examples 1 to 3. DENSO WAVE PR-301 RKM was used as the reader / writer. In the experiment, the resonance frequency and maximum communication distance of a single tag (IC card) were also measured.
The experimental results are shown in Table 1 below and FIG.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
　表１及び図７に示すように、実施例１～３も従来例とほぼ同等の最大通信距離が得られた。詳述すると、表１及び図７に示すように、実施例１～３では、複素比透磁率の実数部μ´を４０～８０程度の従来例に比較して半分程度の厚さの薄い磁性層１５を使用しても、共振周波数を１３．５６ＭＨｚ付近に調整でき、また最大通信距離をほぼ同等にでき、ＲＦＩＤデバイスの薄型化も同時にできることがわかった。 As shown in Table 1 and FIG. 7, in Examples 1 to 3, the maximum communication distance almost equal to that of the conventional example was obtained. More specifically, as shown in Table 1 and FIG. 7, in Examples 1 to 3, the real part μ ′ of the complex relative permeability is about half that of the conventional example in which the real part μ ′ is about 40 to 80. It has been found that even when the layer 15 is used, the resonance frequency can be adjusted to around 13.56 MHz, the maximum communication distance can be made substantially equal, and the RFID device can be made thin at the same time.
　また、本実施例のように、磁性層を金属部材に近づけることで、良好なＲＦＩＤ特性を得るに必要な磁性層の複素比透磁率の実数部μ´を比較的広い範囲内で調整でき、材料選択の自由度を高くできることがわかった。 Further, as in this example, the real part μ ′ of the complex relative permeability of the magnetic layer necessary for obtaining good RFID characteristics can be adjusted within a relatively wide range by bringing the magnetic layer closer to the metal member, It was found that the degree of freedom in material selection can be increased.
（伝送線路に磁性シートを貼着した実験）
　伝送線路の表面に磁性シートを貼着した従来例及び実施例を形成した。
（１）　従来例
　図３に示す伝送線路３２の表面に磁性シートを貼着する際、中心シートの厚さが約４０μｍ、両面の各粘着層の厚さが約５０μｍ、総厚で約１４０μｍの両面テープ（東洋インキ製　ダブルフェースＲ２００）を用いた。また、複素比透磁率の実数部μ´が１００程度、複素比透磁率の虚数部μ″が最大でも３５程度の磁性シートを用いた。 (Experiment with magnetic sheet attached to the transmission line)
Conventional examples and examples in which a magnetic sheet was adhered to the surface of the transmission line were formed.
(1) Conventional Example When a magnetic sheet is attached to the surface of the transmission line 32 shown in FIG. 3, the thickness of the center sheet is about 40 μm, the thickness of each adhesive layer on both sides is about 50 μm, and the total thickness is about 140 μm. Double-sided tape (Toyo Ink Double Face R200) was used. A magnetic sheet having a real part μ ′ of complex relative permeability of about 100 and an imaginary part μ ″ of complex relative permeability of about 35 at the maximum was used.
（２）　実施例
　支持部材１４の一方の面に粘着層（第１の接合層）１６が予め形成された基材（寺岡製作所製　６３１Ｓ♯２５）を用い、基材の他方の面に磁性層１５をドクターブレード法により形成した。なお、このときの複素比透磁率の実数部μ´お及び虚数部μ″は上記の従来例とほぼ同等となるように調整した。 (2) Example A base material (631S # 25 manufactured by Teraoka Seisakusho) on which an adhesive layer (first bonding layer) 16 is formed in advance on one surface of the support member 14 is used, and a magnetic layer is formed on the other surface of the base material. 15 was formed by the doctor blade method. Note that the real part μ ′ and the imaginary part μ ″ of the complex relative permeability at this time were adjusted so as to be substantially the same as the above-described conventional example.
　また上記した基材は、支持部材１４がＰＥＴシートで厚さが約２５μｍ、粘着層１６の厚さが約２５μｍであった。 Further, in the above-described base material, the support member 14 was a PET sheet and the thickness was about 25 μm, and the thickness of the adhesive layer 16 was about 25 μm.
　以上のように従来例及び実施例のデバイスを構成した後、粘着層を押し潰しながら伝送線路と磁性層間の間隔を変化させ、伝送線路と磁性層間の間隔と、伝送線路のインピーダンスとの関係について調べた。
　その実験結果が以下の表２に示されている。 After configuring the devices of the conventional example and the embodiment as described above, the distance between the transmission line and the magnetic layer is changed while crushing the adhesive layer, and the relationship between the distance between the transmission line and the magnetic layer and the impedance of the transmission line Examined.
The experimental results are shown in Table 2 below.
Figure JPOXMLDOC01-appb-T000002
Figure JPOXMLDOC01-appb-T000002
　表２に示すように、従来例では、６７．６８Ωのインピーダンスを基準としてインピーダンスの変化率を求めた。 As shown in Table 2, in the conventional example, the rate of change in impedance was obtained with an impedance of 67.68Ω as a reference.
　従来例の場合、粘着層の総厚が厚いため厚さの変化量も大きくなり、表２に示すように、磁性層と伝送線路間の間隔が広範囲で変化しやすい。またもともとの粘着層の総厚のばらつきも大きくなりやすい。よって従来例の構成では、磁性層と伝送線路間の間隔がばらつきやすくなり、したがって、表２に示すようにインピーダンスの変化率が大きくなり、インピーダンスがばらつきやすくなる。 In the case of the conventional example, since the total thickness of the adhesive layer is large, the amount of change in thickness also increases, and as shown in Table 2, the distance between the magnetic layer and the transmission line is likely to change over a wide range. Also, the variation in the total thickness of the original adhesive layer tends to increase. Therefore, in the configuration of the conventional example, the interval between the magnetic layer and the transmission line is likely to vary, and therefore, as shown in Table 2, the impedance change rate increases and the impedance tends to vary.
　一方、表２に示すように、実施例では、７２．５３Ωのインピーダンスを基準としてインピーダンスの変化率を求めた。 On the other hand, as shown in Table 2, in the examples, the rate of change in impedance was obtained with an impedance of 72.53Ω as a reference.
　実施例では、粘着層を薄くでき、比較的硬いＰＥＴシートで薄い粘着層を保持できるため、粘着層の厚さの変化量を小さくでき、表２に示すように、磁性層と伝送線路間の間隔のばらつきを小さくできる。よって表２に示すようにインピーダンスの変化率は従来例に比べて小さく、インピーダンスのばらつきを従来例よりも効果的に小さくすることができる。 In the embodiment, since the adhesive layer can be thinned and the thin adhesive layer can be held with a relatively hard PET sheet, the amount of change in the thickness of the adhesive layer can be reduced, and as shown in Table 2, between the magnetic layer and the transmission line Spacing variation can be reduced. Therefore, as shown in Table 2, the rate of change of impedance is smaller than that of the conventional example, and the variation in impedance can be effectively reduced as compared with the conventional example.
１０　ＲＦＩＤデバイス
１１　タグ
１２　金属部材
１３　磁性部材（磁性シート）
１４　支持部材
１５　磁性層
１６　第１の接合層（粘着層）
１７　第２の接合層
２０　混合液
２１　ドクターブレード装置
２３　ブレード
２４　剥離シート
３１　基板
３２　伝送線路 10 RFID device 11 Tag 12 Metal member 13 Magnetic member (magnetic sheet)
14 Support member 15 Magnetic layer 16 First bonding layer (adhesive layer)
17 Second bonding layer 20 Liquid mixture 21 Doctor blade device 23 Blade 24 Release sheet 31 Substrate 32 Transmission line

Claims (10)

  1. 　金属を含む部材と、磁性部材と、を有し、
    　前記磁性部材は、磁性層が支持部材の表面に直接形成された構成であり、前記金属を含む部材、第１の接合層、及び前記磁性部材の順に積層されていることを特徴とする磁性部材を有するデバイス。     A member including a metal and a magnetic member;
    The magnetic member has a structure in which a magnetic layer is directly formed on the surface of a support member, and the magnetic member is laminated in the order of the metal-containing member, the first bonding layer, and the magnetic member. Having a device.
  2. 　前記金属を含む部材、前記第１の接合層、前記支持部材、及び前記磁性層の順に積層されている請求項１記載の磁性部材を有するデバイス。 The device having a magnetic member according to claim 1, wherein the metal-containing member, the first bonding layer, the support member, and the magnetic layer are laminated in this order.
  3. 　前記第１の接合層は、前記支持部材の前記磁性層が形成される面の反対面に予め設けられた粘着層であり、前記粘着層により前記磁性部材が前記金属を含む部材の表面に貼着されている請求項２記載の磁性部材を有するデバイス。 The first bonding layer is an adhesive layer provided in advance on a surface opposite to the surface on which the magnetic layer of the support member is formed, and the magnetic member is attached to the surface of the member containing the metal by the adhesive layer. A device comprising the magnetic member according to claim 2.
  4. 　第１の金属を含む部材と、磁性部材と、第２の金属を含む部材とを有し、前記第１の金属を含む部材あるいは前記第２の金属を含む部材のどちらか一方がＲＦＩＤタグであり、前記磁性部材は、前記支持部材が前記第１の金属を含む部材側に向けられて前記支持部材と前記第１の金属を含む部材間が前記第１の接合層を介して貼着されており、前記磁性層と前記第２の金属を含む部材間が第２の接合層を介して貼着されている請求項１ないし３のいずれか１項に記載の磁性部材を有するデバイス。 An RFID tag includes a member including a first metal, a magnetic member, and a member including a second metal, and one of the member including the first metal or the member including the second metal is an RFID tag. And the magnetic member is attached to the support member and the member including the first metal with the support member being directed toward the member including the first metal via the first bonding layer. 4. A device having a magnetic member according to claim 1, wherein a member including the magnetic layer and the second metal is bonded via a second bonding layer. 5.
  5. 　前記金属を含む部材は基板上に伝送線路が設けられた構成であり、前記磁性部材は、前記支持部材が前記伝送線路側に向けられた状態で、前記伝送線路と前記支持部材との間が前記第１の接合層を介して貼着されている請求項１ないし３のいずれか１項に記載の磁性部材を有するデバイス。 The member including the metal has a configuration in which a transmission line is provided on a substrate, and the magnetic member is between the transmission line and the support member in a state where the support member is directed to the transmission line side. The device which has a magnetic member of any one of Claim 1 thru | or 3 currently stuck through the said 1st joining layer.
  6. 　金属を含む部材と、磁性部材と、を有し、
    　磁性層を支持部材の表面に直接形成して前記磁性部材を形成し、前記磁性部材を、前記金属を含む部材の表面に第１の接合層により接合することを特徴とする磁性部材を有するデバイスの製造方法。     A member including a metal and a magnetic member;
    A magnetic layer is formed directly on the surface of a support member to form the magnetic member, and the magnetic member is bonded to the surface of the member containing the metal by a first bonding layer. Manufacturing method.
  7. 　前記磁性層をドクターブレード法により前記支持部材の表面に形成する請求項６記載の磁性部材を有するデバイスの製造方法。 The method for manufacturing a device having a magnetic member according to claim 6, wherein the magnetic layer is formed on the surface of the support member by a doctor blade method.
  8. 　前記第１の接合層は予め前記支持部材の前記磁性層を形成する面と反対面に設けられた粘着層であり、前記粘着層を剥離可能な保護部材により保護した状態で、前記支持部材の表面に前記磁性層を直接形成し、続いて、前記保護部材を除去して、前記粘着層により前記磁性部材を前記金属を含む部材の表面に貼着する請求項６又は７に記載の磁性部材を有するデバイスの製造方法。 The first bonding layer is an adhesive layer provided in advance on the surface of the support member opposite to the surface on which the magnetic layer is formed, and in a state where the adhesive layer is protected by a peelable protective member, The magnetic member according to claim 6 or 7, wherein the magnetic layer is directly formed on a surface, the protective member is subsequently removed, and the magnetic member is adhered to the surface of the member containing the metal by the adhesive layer. A method of manufacturing a device having
  9. 　第１の金属を含む部材と、磁性部材と、第２の金属を含む部材とを有し、前記第１の金属を含む部材あるいは前記第２の金属を含む部材のどちらか一方がＲＦＩＤタグであり、前記磁性部材の前記支持部材を、前記第１の金属を含む部材側に向けて前記支持部材と前記第１の金属を含む部材間を前記第１の接合層を介して貼着し、前記磁性層と前記第２の金属を含む部材間を第２の接合層を介して貼着する請求項６ないし８のいずれか１項に記載の磁性部材を有するデバイスの製造方法。 An RFID tag includes a member including a first metal, a magnetic member, and a member including a second metal, and one of the member including the first metal or the member including the second metal is an RFID tag. Yes, the support member of the magnetic member is adhered to the member side including the first metal between the support member and the member including the first metal via the first bonding layer, The manufacturing method of the device which has a magnetic member of any one of Claim 6 thru | or 8 which sticks between the said magnetic layer and the member containing the said 2nd metal through the 2nd joining layer.
  10. 　前記金属を含む部材は基板上に伝送線路が設けられた構成であり、前記磁性部材の前記支持部材を、前記伝送線路側に向けた状態で、前記伝送線路と前記支持部材との間を前記第１の接合層を介して貼着する請求項６ないし８のいずれか１項に記載の磁性部材を有するデバイスの製造方法。 The member including the metal has a configuration in which a transmission line is provided on a substrate, and the support member of the magnetic member is directed to the transmission line side, and the gap between the transmission line and the support member is The manufacturing method of the device which has a magnetic member of any one of Claim 6 thru | or 8 sticking through a 1st joining layer.
PCT/JP2010/055657 2009-04-22 2010-03-30 Device having magnetic member, and method for manufacturing the device WO2010122877A1 (en)

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JP2009-103738 2009-04-22
JP2009103738 2009-04-22

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001297905A (en) * 2000-04-17 2001-10-26 Tokin Corp High-frequency current suppressor
JP2006178638A (en) * 2004-12-21 2006-07-06 Toyo Seikan Kaisha Ltd Metallic material corresponding to ic tag, ic tag corresponding to metal, metallic container corresponding to ic tag, and method for manufacturing the metallic material corresponding to ic tag
JP2007094621A (en) * 2005-09-28 2007-04-12 Dainippon Printing Co Ltd Non contact ic tag label

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001297905A (en) * 2000-04-17 2001-10-26 Tokin Corp High-frequency current suppressor
JP2006178638A (en) * 2004-12-21 2006-07-06 Toyo Seikan Kaisha Ltd Metallic material corresponding to ic tag, ic tag corresponding to metal, metallic container corresponding to ic tag, and method for manufacturing the metallic material corresponding to ic tag
JP2007094621A (en) * 2005-09-28 2007-04-12 Dainippon Printing Co Ltd Non contact ic tag label

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