Classifications

• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
  • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
  • G02B6/0005—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type
  • G02B6/0006—Coupling light into the fibre
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
  • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
  • G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
  • G02B19/0019—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having reflective surfaces only (e.g. louvre systems, systems with multiple planar reflectors)
  • G02B19/0023—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having reflective surfaces only (e.g. louvre systems, systems with multiple planar reflectors) at least one surface having optical power
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
  • G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
  • G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
  • G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
  • G02B19/0066—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED in the form of an LED array
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
  • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
  • G02B27/0938—Using specific optical elements
  • G02B27/0994—Fibers, light pipes
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
  • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
  • F21W2131/40—Lighting for industrial, commercial, recreational or military use
  • F21W2131/406—Lighting for industrial, commercial, recreational or military use for theatres, stages or film studios
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
  • G02B6/24—Coupling light guides
  • G02B6/42—Coupling light guides with opto-electronic elements
  • G02B6/4295—Coupling light guides with opto-electronic elements coupling with semiconductor devices activated by light through the light guide, e.g. thyristors, phototransistors

Definitions

• This invention relates, in general, to the creation of artificial light or illumination and, in particular, to an isolation fitting for an light emitting diode (LED) collimation optics modules that may be employed individually or arranged in an array on a common base and luminaires using the same.
• LED light emitting diode
• LED chip packages may contain multiple LED chips per package and have relatively simple optics on the package itself that necessitate a secondary optics system to provide any needed color mixing, collimation, or other beam shaping.
• These existing LED chip packages must balance power and beam shaping requirements including collimation and color mixing.
• stage lighting applications such as those related to the production of theatre, dance, opera and other performance arts
• the required intensity and distance from the area to be lit as well as the beam or field angle of the luminaire dictate that the LED chip packages have tremendous power.
• a well shaped beam is also needed.
• the brightness requirements are satisfied by use of a large number of LEDs, which, in turn, makes the collection of the light into a single uniform and homogenous pupil more difficult. Often power must be sacrificed for uniformity or visa versa. Solutions continue to be required that address the tradeoffs between power, on the one hand, and collimation and color mixing, on the other.
• an LED collimation optics module providing an isolation fitting and luminaire using the same are disclosed.
• the solutions presented herein mitigate the traditional tradeoffs between power, on the one hand, and collimation and color mixing, on the other.
• an LED chip provides a plurality of sources of light.
• An optical conductor is superposed on the LED chip to mix the light received from the plurality of sources of light.
• a sleeve is mounted to the LED chip and positioned about the optical conductor such that an annulus is located therebetween. The sleeve provides thermal heat sinking of the LED, EMI screening, light shielding, dust/dirt shielding, and general physical protection to the optical conductor.
• the mixed light After passing through the optical conductor, the mixed light enters a compound parabolic concentrator (CPC) which is coupled to the optical conductor.
• the CPC collimates the light received from the optical conductor such that a homogenous pupil is emitted.
• Figure IA is a perspective illustration of one embodiment of a luminaire incorporating an LED collimation optics module according to the teachings presented herein;
• Figure IB is a perspective illustration of the luminaire depicted in figure IA with a partial cut-away to better reveal internal components;
• Figure 1C is a perspective illustration showing in further detail an array of LED collimation optics modules of figures IA and IB;
• Figure 2A is a front elevated view of one embodiment of an LED collimation optics module
• Figure 2B is a transverse sectional view of the LED collimation optics module illustrated in figure 2A;
• Figure 2C is a top plan view of the LED collimation optics module illustrated in figure 2A;
• Figure 2D is a top plan view of an LED chip package
• Figure 2E is a top cross-section view of one embodiment of an optical conductor and sleeve
• Figure 2F is a top cross-section view of an alternative embodiment of an optical conductor and sleeve
• Figure 2G is a top cross-section view of a further embodiment of an optical conductor and sleeve
• Figure 3A is a traverse sectional view of a single light beam traversing the LED collimation optics module illustrated in figure 2A;
• Figure 3B is a traverse sectional view of a plurality of light beams traversing the LED collimation optics module illustrated in figure 2A. While the making and using of various embodiments of the present invention are discussed in detail below, it should be appreciated that the present invention provides many applicable inventive concepts which can be embodied in a wide variety of specific contexts. The specific embodiments discussed herein are merely illustrative of specific ways to make and use the invention, and do not delimit the scope of the present invention.
• a housing 12 is adapted to accommodate a base 14 and LED collimation optics modules, collectively numbered 16, and secured within the housing 12.
• the LED collimation optics modules include individual LED collimation optics modules 16-1, 16-2, 16-3, 16-4, 16-5, 16-6, and 16-7.
• a one-to-one correspondence is present between the number of heatsinks and the number of light emitting diode collimation optics modules 16.
• the heatsink subassembly 18 includes virtually silent fans that provide forced-air cooling for internal components including the light emitting diode collimation optics modules 16.
• the housing 12 is fitted in place by a yoke 20 swivelly connected to a support structure 22.
• An electronics subassembly 24 located throughout the housing 12, yoke 20, and support structure 22 provides motorized movement and electronics to the luminaire 10.
• the electronics subassembly 24 may include multiple on-board processors providing diagnostic and self- calibration functions as well as internal test routines and software update capabilities.
• the luminaire 10 may also include any other required electronics such as connection to power.
• a finishing lens 26 is included for adding end effects.
• the LED collimation optics modules 16 are disposed in a single layer close-packing arrangement 28 with LED collimation optics modules 16-1 through 16-6 being located in a hexagonal positioning in contact with a centrally positioned optics module 16-7.
• Each of the peripheral LED collimation optics modules 16-1 through 16-6 touches two adjacent peripheral LED collimation optics modules and the interiorly disposed LED collimation optics module 16- 7.
• the LED collimation optics module 16-1 touches adjacent LED collimation optics modules 16-2 and 16-6 as well as the collimation optics module 16-7 located in the interior.
• the array of the LED collimation optics modules 16-1 through 16-7 may have a diameter of 8 inches (8.32 cm) in one embodiment.
• an LED chip package 30 provides light to an optical conductor 32 that mixes the light.
• the optical conductor 32 may be a tubular, a light mixing tubular, a lightpipe, a rod, or a combination thereof, for example.
• a CPC 34 is coupled to the optical conductor 32 to collimate the light received from the optical conductor 32. Following collimation, light exists the luminaire 10 as a substantially homogenous pupil. Components of or the entirety of the luminaire 10 may be considered an optics module for stage lighting and related applications.
• FIGS. 2A through 2E depict the LED collimation optics module 16-4.
• An LED chip package 30 provides sources of light and includes multiple colored LED chips G, R, B, W arranged in an array 42 on a single elongated base member 44, which may include provisions for bonding lead wires (not shown). As illustrated, the LED chips G, R, B, W have been positioned to provide a desired angular emission pattern with respect to the optical conductor 32 and CPC 34 to increase color mixing. It should be appreciated, however, that depending on the application, the LED chips G, R, B, W may be arranged in other types of arrays.
• the LED chips G, R, B, W of the array 42 comprise conventional green, red, blue, and white LED chips that respectively emit green, red, blue, and white light. Such LED chips facilitate efficient injection into the optical conductor 32 and strongly enhance color mixing. As depicted, in order to further enhance the quality of the white light generated by the LED chip package, four LED chips including one red LED chip (R), one green chip (G), one blue LED chip (B), and one white LED chip (W) are utilized. It is contemplated, however, that as LED chip design advances, different numbers of LED chips and/or different color LED chips may be used in the array to optimize the quality of the light generated by the LED chip package 30.
• LED chips including one red LED chip (R), one green chip (G), one blue LED chip (B), and one amber LED chip (A) are utilized.
• LED chips including one red LED chip (R), two green chips (Gl, G2), and one blue LED chip (B) are utilized. It is further contemplated that both low- power and high-power LED chips may be used in the LED chip package 30.
• the elongated base member 44 may comprise an electrically insulative housing 46, made for example, of plastic or ceramic that encases a metal heat sink with a silicon submount disposed thereon.
• the metal heat sink provides heat sinking to the LED chip package 30 disposed thereon. Further heat dissipation is provided by the heatsink subassembly 18 which, as alluded, includes a virtually silent fan that furnishes forced-air cooling proximate to the metal heat sink.
• the elongated base member 44 may further include lead wires, which are electrically isolated from the metal heat sink and the LED chips G, R, B, W by the housing. Bond wires electrically connect the LED chips G, R, B, W to the lead wires.
• the optical conductor 32 has at a first end an input aperture 48 of a cross-sectional area ⁇ r ⁇ ' , wherein the radius is n, and at a second end an output aperture 50 of a second cross- sectional area ⁇ r ⁇ , wherein the radius is r 2 .
• the optical conductor 32 is superposed on the LED chip package 30 and the LED chips G, R, B, W to receive the light from the sources at the input aperture 48 and deliver the light to the output aperture 50.
• the first cross-sectional area ⁇ r 2 may be substantially equal to the second cross-sectional area ⁇ r-i so that the input aperture 48 and output aperture 50 have substantially equal diameters and r ⁇ may equal r 2 .
• a wall portion 52 which may be a cylindrical wall portion, connects the input aperture 48 with the output aperture 50 and may include a surface of revolution generally forming a cylinder.
• the wall portion 52 includes a reflective material 54 defining multiple transmission paths enabling mixing of the light within an interior space 56 from the input aperture 48 to the output aperture 50.
• the wall portion 52 may be a wall means for mixing light connecting the input aperture 48 with the output aperture 50.
• the length l ⁇ of the optical conductor 32 is determined by design parameters related to the mixing of the light emitted by the light sources. Additionally, the length l ⁇ of the optical conductor 32 is measured along a longitudinal axis of the optical conductor 32 which is substantially orthogonal to a horizontal axis of the LED chip package 30.
• the CPC 34 is coupled to the optical conductor 32.
• a body 60 which in one embodiment is a conical body, is formed at a first end with an entrance aperture 62 of a cross-sectional area ⁇ r ⁇ , wherein the radius is r$, and formed at a second end with an exit aperture 64 of a cross-sectional area ⁇ r 2 , wherein the radius is r?,.
• the entrance aperture 62 intersects the output aperture 50 and the conical body 60 is disposed to deliver the light to the exit aperture 64.
• a lip 72 at the second end may have a variety of forms including the illustrated arched edge which includes a sequence of abutting arches. This type of lip embodiment permits LED collimation optics modules to be placed in flush contact with one another in close-packing arrangements.
• a wall portion 66 which may be a curved wall portion, connects the entrance aperture
• the wall portion 66 includes a reflective material 68 enabling collimated transmission of the light from the entrance aperture 62 to the exit aperture 64.
• the wall portion 66 may be a wall means connecting the entrance aperture 62 with the exit aperture 64 and diverging from the cross sectional area ⁇ r ⁇ to the cross-sectional area ⁇ r 4 2 .
• the wall portion 66 may include a parabolic wall portion comprising a surface of revolution generally forming a conical shape.
• the length h of the CPC 34 is determined by design parameters related to the desired collimation and degree of light mixing, for example.
• the length h of the CPC 34 is measured along a longitudinal axis of the CPC 34 which is substantially aligned with the longitudinal axis of the optical conductor 32 and orthogonal to the horizontal axis of the LED chip package 30. It should be appreciated that depending on the application, the relationship between the lengths l ⁇ and h may vary from what is depicted.
• the CPC 34 is characterized by the fact that rays entering the device at its smaller aperture, the entrance aperture 62, are reflected only once from an interior surface to the curved wall portion 66 before exiting the CPC 34 at the larger aperture, the exit aperture 64.
• the CPC 34 is designed to collimate a given of flux of light of energy received at the input aperture 48.
• the concentrator disclosed herein which is termed a CPC whether or not the concentrator has a parabolic or other geometry, has a reflecting material 68 made of a prismatic, transparent, low-transmission loss dielectric material.
• the dielectric materials from which the reflecting material 68 of an interior surface 70 of the CPC 34 may be made include transparent polymers with a high index of refraction, such as, but no limited to, acrylic polymers or polycarbonate- based polymers.
• a sleeve 100 is connected to the LED chip package, or simply LED chip, 30 and positioned about the optical conductor 32 such that an annulus 102 is located therebetween.
• the longitudinal axis of the optical conductor 32 is aligned with a longitudinal axis of the sleeve 100.
• a seal 104 which may be an O-ring seal, for example, is located between the sleeve 100 and optical conductor 32 at an upper end of the annulus 102.
• a collar 106 is located at a lower end of the annulus 102 and disposed around the optical conductor 32 to form a seal thereat. It should be appreciated, however, that alternative sealing techniques may be used instead of or in addition to the seal 104 and the collar 106.
• a support structure 108 is coupled to the base 14 in order to seat and support the optical conductor 32 and the sleeve 100.
• a shoulder ring 110 seats the sleeve 100.
• a sealing gasket 112 seals the support structure 108 to the base 14 and fasteners 114, 116 couple the support structure 108 to the base 14.
• a thermally conductive path is present between the LED chip 30 and the sleeve 100 to provide for heat dissipation as will be discussed in further detail hereinbelow.
• Figures 2G and 2F depict embodiments of optical conductors 32 and sleeves 100 for use with the LED collimation optics modules 16 presented herein.
• the optical conductor 32 is not limited to a tubular, rod, or cylindrical shape. Rather, the optical conductor 32 may take a variety of shapes including those having sides or facets. In addition to having a variety of shapes, the optical conductor 32 may be a tubular or mixing tubular having a sidewall (e.g., figure 2E), a rod (e.g., figure 2F), a tubular 32a having a body therein 32b (e.g., figure 2G), or a combination therefore, for example.
• the bodies 60 of the CPCs 34 may vary in the number of sides or facets.
• the bodies 60 may have a variety of forms including the body 60 having a sidewall, being a solid member, having a sidewall member with a solid member disposed therein, or combinations thereof, for example.
• Figure 3 A depicts a single light beam traversing the LED collimation optics module 16- 4.
• the optical conductor 32 which may be a light-mixing rod or lightpipe, homogenizes the light bundle transmitted therein by the light sources.
• the intensity centroid of the light bundle moves in a longitudinal fashion from the input aperture 48 to the output aperture 50.
• the reflecting surfaces of the reflecting material 54 disposed along the light-mixing rod include surface normals that are perpendicular or inclined relative to the longitudinal or axial direction of the movement of the light therethrough.
• the reflective material furnishing pathways, such as pathways 80, 82, for light beams to travel and thereby mix with each other.
• the LED chips (G, R, B, W) have at least a partial direction of orientation toward the interior space 56 of the optical conductor 32.
• the CPC 34 is depicted in terms of a 9/B 0 , where B 1 denotes the input angle and ⁇ 0 denotes the output angle.
• B 1 denotes the input angle
• ⁇ 0 denotes the output angle.
• the geometry of one embodiment may be better understood by taking a segment of parabola PR having its focal point Q and rotating this segment around an axis of revolution, which is at an angle B 1 to the parabola's axis z, which is perpendicular to the horizontal axis x through the LED chip package 30.
• the axis of rotation about axis z defines the center of the entrance aperture and the exit aperture.
• Such a CPC construction is characterized by the all rays of light entering at the input aperture 48 at angles smaller than +/- B 1 with respect to the axis z will exit the CPC after no more than a single reflection within the angle of +/- ⁇ 0 with respect to the axis z.
• light beams 84, 86 are transmitted from LED chip R of the LED chip package 40.
• the angle of incidence from the light beam 84 is such that the light beam 84 does not contact the interior space 56 of the optical conductor 32.
• all or nearly all of the light beams contact the interior surface 56.
• the light beam 86 contacts the interior space 56 and subsequently is reflected from the reflective material 54 of the optical conductor 32 six times before entering the CPC 34 where the light beam 86 is collumated by a single reflection from the interior surface 70 the CPC 34.
• the multiple reflections in the optical conductor 32 cause the light beam 86 to cross the longitudinal axis z of the optical conductor 32, thereby contributing to light mixing.
• Figure 3B depicts a plurality of beams traversing the LED collimation optics module.
• the optical conductor 32 superposed on the LED chip 30 to receive the light from the sources of LEDs G, R, B, W at the input aperture 48.
• the LEDs G-I, R, B, W are at least partially oriented toward the interior space 56 of the optical conductor 32. As shown, there is a lateral offset between the LEDs G, R, B, W to provide for an angle of incidence between the LEDs and the reflective material 54 to furnish reflection therefrom.
• the optical conductor 32 provides multiple pathways 89 that are traversed by multiple light beams, collectivelly light bundle 88.
• the multiple pathways 89 mix the received light beams and cause the intensity centroid of the light bundle 88 to move in a longitudinal fashion from the input aperture 48 to the output aperture 50.
• the reflective material of the optical conductor is oriented to propagate the light from the input aperture 48 to the output aperture 50 where the mixed light is received by the CPC 34 at the entrance aperture 62. Collimated transmission of the light from the entrance aperture 62 to the exit aperture 64 then occurs to produce a substantially homogenous pupil from the single-reflection, collimated transmission within the CPC 34.
• the light bundle exits the exit aperture 64 as a substantially homogenous pupil 90.
• the sleeve 100 may be an isolation fitting that provides one or more of the following: thermal heat sinking, electromagnetic interference (EMI) shielding, light shielding, protection from dust/dirt, and physical protection.
• thermal heat sinking there is a thermally conductive path between the LED chip package 30, the support structure 108, and the sleeve 100.
• the thermally conductive path permits the sleeve 100 to absorb and dissipate heat from the LED chip package 30 by way of the transfer of thermal energy.
• the sleeve 100 which may comprise an EMI shielding-appropriate material, and annulus 102 limit the penetration of electromagnetic fields through the sleeve 100.
• any fields produced at the optical conductor 32 of the LED collimation optics module 16-4 will not affect the operation of LED collimation optics module 16-5, for example, and visa versa, thereby isolating the electromagnetic fields emanating from each of the LED collimation optics modules 16.
• the sleeve 100 which has a sealing engagement with the optical conductor 32 at each end of the annulus 102 provides an annulus 102 that may be clean and absent from dirt and dust. Additionally, the sleeve 100 provides physical shielding and protection to the optical conductor 32. Light is also contained within each annulus 32 such that light shielding is provided by the sleeve 100.
• the sleeve 100 as an isolation fitting protects the operation of the optical conductor 32 and, moreover, mitigates various types of interference which may arise between optical conductors of different LED collimation optics modules. While this invention has been described with reference to illustrative embodiments, this description is not intended to be construed in a limiting sense. Various modifications and combinations of the illustrative embodiments as well as other embodiments of the invention, will be apparent to persons skilled in the art upon reference to the description. It is, therefore, intended that the appended claims encompass any such modifications or embodiments.

Landscapes

• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Optics & Photonics (AREA)
• Non-Portable Lighting Devices Or Systems Thereof (AREA)
• Led Device Packages (AREA)
• Optical Couplings Of Light Guides (AREA)
• Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Priority Applications (6)

Applications Claiming Priority (2)

Publications (1)

Family

ID=42309529

Family Applications (1)

Country Status (8)

Cited By (2)

Families Citing this family (1)

Citations (4)

Family Cites Families (1)

• 2010
  • 2010-03-29 JP JP2012502856A patent/JP2012522350A/ja active Pending
  • 2010-03-29 CN CN2010800146906A patent/CN102369466A/zh active Pending
  • 2010-03-29 KR KR1020117025660A patent/KR20110134498A/ko unknown
  • 2010-03-29 CA CA2757050A patent/CA2757050A1/en not_active Abandoned
  • 2010-03-29 WO PCT/IB2010/051355 patent/WO2010113101A1/en active Application Filing
  • 2010-03-29 RU RU2011143927/28A patent/RU2011143927A/ru not_active Application Discontinuation
  • 2010-03-29 BR BRPI1007105A patent/BRPI1007105A2/pt not_active Application Discontinuation
  • 2010-03-29 EP EP10713004A patent/EP2414875A1/en not_active Withdrawn

Patent Citations (4)

Also Published As

Similar Documents

Legal Events