WO2010086055A1 - Current controlled hall sensor - Google Patents

Current controlled hall sensor Download PDF

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Publication number
WO2010086055A1
WO2010086055A1 PCT/EP2009/066391 EP2009066391W WO2010086055A1 WO 2010086055 A1 WO2010086055 A1 WO 2010086055A1 EP 2009066391 W EP2009066391 W EP 2009066391W WO 2010086055 A1 WO2010086055 A1 WO 2010086055A1
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WO
WIPO (PCT)
Prior art keywords
hall sensor
capacitor
housing
sensor according
legs
Prior art date
Application number
PCT/EP2009/066391
Other languages
German (de)
French (fr)
Inventor
Marcus Meyer
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2010086055A1 publication Critical patent/WO2010086055A1/en

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/07—Hall effect devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item

Definitions

  • the invention relates to a current-controlled Hall sensor with an electrical
  • Capacitor electrically operatively connected to supply voltage independent sensing of magnetic fields with electrical connections of the Hall sensor.
  • Hall sensors are known in the art. They are used today in many applications for detecting magnetic fields. Three main evaluation methods are known: the analog evaluation, the digital voltage-based and the digital current-controlled evaluation. In particular, the last variant with a current-controlled Hall sensor is preferred due to their high robustness against interference in the electrical lines. In contrast, voltage-based Hall sensors are sensitive to disturbances in the supply voltage.
  • the Hall sensor In order to detect magnetic fields independent of supply voltage by means of a Hall sensor, the Hall sensor is associated with an electrical capacitor which is electrically connected to electrical connections of the Hall sensor, whereby the Hall sensor can be used as a magnetic field-controlled current source.
  • the capacitor fulfills several functions: it serves as a support
  • Capacity increases the ESD resistance and also improves the EMC properties.
  • SMD surface mount
  • the Hall sensor according to the invention is characterized by the design as a Hall sensor unit, with a housing enclosing at least the Hall sensor, lead out of which the terminals associated terminal legs, wherein the capacitor for bridging the terminals is connected to the connection legs.
  • the Hall sensor and the capacitor are designed as a Hall sensor unit, ie as a coherent and in particular fauxhandhabbarer composite.
  • the Hall sensor is enclosed by a housing, and its terminals are associated with connecting legs, which lead out of the housing. Outside of the housing, the Hall sensor can thereby be electrically contacted in a simple manner via the connecting legs.
  • the connection legs can also be used for mechanically fixing the Hall sensor unit, for example on a printed circuit board.
  • connection legs can be inserted into corresponding receiving openings of a printed circuit board and soldered therein.
  • the capacitor is connected to the terminals for bridging the terminals, for the supply voltage independent detection of magnetic fields. The electrical contact of the Hall sensor to the capacitor is thus created via the connecting legs.
  • the capacitor forms an integral part, so that it is always located close to the Hall sensor.
  • the connecting legs have housing-internal and external housing areas. This means that the connection legs extend in certain areas in the housing and partially outside the housing. As a result, the connection legs can be held particularly stable on the housing, whereby the Hall sensor unit is particularly robust.
  • the connecting legs each have at least one capacitor bearing surface for the capacitor.
  • the capacitor is mounted on the capacitor
  • the capacitor bearing surfaces are ensure a secure electrical contact and can also serve for mechanical protection of the capacitor. Due to this type of mounting, the capacitor can be placed very close to the Hall sensor, whereby an optimal effect is achieved.
  • the capacitor bearing surfaces are formed as enlarged punched surfaces.
  • the connecting legs are expediently produced in the production of the Hall sensor unit as a stamped grid. It is possible in a simple manner to provide common areas on the connecting legs. Thus, for example, the usual widened with punched gratings
  • the capacitor can be electrically connected to the latter in a simple manner after encasing the advantageously designed as a semiconductor element Hall sensor. An exchange of the capacitor in case of need, for example, during maintenance, is possible. Conveniently, the capacitor is on the
  • the capacitor bearing surfaces are formed in the housing-internal regions of the connecting legs.
  • the capacitor itself is also in the housing, in which the Hall sensor and the housing-internal areas of the connecting legs are arranged.
  • the housing is expediently slightly larger than in the previously described embodiment. The assembly of the Hall sensor unit is thus made easier overall, since the Hall sensor unit is now even easier to handle.
  • the capacitor is designed as a ceramic capacitor, that is, as an electrical capacitor with a ceramic dielectric.
  • Such ceramic capacitors are insensitive to voltages and overvoltage pulses and can withstand high temperatures.
  • terminals of the Hall sensor are connected by means of bonding connections with the connection legs.
  • the housing is a mold housing. In the production of the Hall sensor unit, this is molded or cast around the Hall sensor, in some areas around the connecting legs and optionally around the capacitor.
  • the Mold housing is an electrically non-conductive
  • Plastic housing Through the encapsulation / encapsulation of the items of the Hall sensor unit creates a particularly mechanically stable or stable unit.
  • Figure 1 shows a first embodiment of an advantageous Hall sensor in a schematic representation
  • FIG. 2 shows a second embodiment of an advantageous Hall sensor in a schematic representation.
  • the Hall sensor unit 1 shows a schematic representation of a first embodiment of a Hall sensor unit according to the invention 1.
  • the Hall sensor unit 1 has a designed as a semiconductor element 2 Hall sensor 3, on a support surface (English: the attach) or is arranged on a substrate 4.
  • the substrate 4 is part of a stamped grid 5, which further comprises three connecting legs 6, 7, 8, of which the connecting leg 7 optimally is onal.
  • the connecting legs 6, 7, 8 are aligned parallel to each other and have their Hall sensor 3 opposite end each having a contact surface 9, 10, 1 1.
  • the Hall sensor 3 is electrically operatively connected to one of the contact surfaces 9, 10, 11. While the connecting legs 6 and 8 were subsequently separated from the stamped grid 5, the optional connecting leg 7 goes into the substrate 4, on which the Hall sensor 3 is arranged over.
  • the connecting legs 6, 7 serve as connection lines for a supply voltage, or for a signal of the Hall sensor 3 detecting evaluation, such as a microcontroller, while the connection leg 8 serves as a ground line.
  • the connecting legs 6 and 7 are often combined in current-carrying (HaII) sensors. For reasons of compatibility and strength, the connecting leg 7 is often retained.
  • the Hall sensor 3, the substrate 4, the bonds 12 and the connection legs 6, 7, 8 in the region of their contact surfaces 9, 10, 1 1 are of a
  • Housing 13 which is designed as a (transfer) mold housing 14, enclosed.
  • the contact surfaces 9, 10, 11 thus form housing-internal regions 15, 16, 17 of the connection legs 6, 7, 8.
  • the remaining area of the respective connecting leg 6, 7, 8 correspondingly forms a housing-external area 18, 19, 20, which therefore lies outside the housing 13.
  • their housing-external area 18, 19, 20 are close to the housing 13 on the connecting legs 6 and 8 each have a capacitor bearing surface 21, 22 are formed.
  • the capacitor 23 thus bridges the terminals of the Hall sensor 3 assigned to the connection legs 6 and 8.
  • the capacitor 23 is soldered with its contact ends on the corresponding capacitor contact surface 21 and 22 in order to ensure reliable electrical and mechanical contact.
  • this Hall sensor unit 1 and the Hall sensor 3 is effectively used as a current-guided Hall sensor for supply voltage independent detection of magnetic fields.
  • the spatial proximity of the capacitor 23 to the Hall sensor 3 leads to a particularly effective EMC-Eingenschaft and increased ESD strength.
  • the capacitor 23 can be used as a support capacity, whereby the reliability is increased in network fluctuations.
  • the "chopper peaks" customary with clocked sensors can also be optimally suppressed due to the spatial proximity of the capacitor 23.
  • Connecting legs 6 and 8 allow a particularly simple and cost-effective production of the Hall sensor unit 1, which withstands high temperatures or temperature differences.
  • FIG. 2 shows a schematic representation of a second embodiment of the Hall sensor unit 1 according to the invention, wherein like parts are provided with the same reference numerals, so that reference is made to the preceding figure.
  • the capacitor bearing surfaces 21 and 22 are now formed in the housing-internal areas of the connecting legs 6, 8 and thus also the
  • Capacitor 23 is arranged in the housing 13.
  • the housing 13 is designed to be correspondingly larger or longer.
  • the second embodiment has the advantage that the capacitor 23 is now also supported and held by the housing 13 and overall characterized by a higher mechanical stability is ensured.
  • the capacitor 23 is arranged protected inside the housing 13, so that among other things, the assembly and handling of the Hall sensor unit 1 simplified.
  • the current-controlled Hall sensor unit 1 can, for example, arranged on components having little space, such as brush holders of an electric machine, and thus safely connected both mechanically and electrically in a simple manner. Due to the advantageous embodiment of the life of the Hall sensor 3 and a Hall sensor unit 1 having device is extended beyond and ensures high reliability, since only a small number of solder / contact points are available, which could fail.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)
  • Measuring Magnetic Variables (AREA)
  • Hall/Mr Elements (AREA)

Abstract

The invention relates to a current controlled Hall sensor (3) having an electric capacitor (23) that is operatively connected in an electric manner to electric connections of the Hall sensor (3) for the supply voltage-independent detection of magnetic fields. The design is provided as a Hall sensor unit (1), comprising a housing (13) which surrounds at least the Hall sensor (3) and from which connecting legs (6, 8) associated with the connections extend, wherein the capacitor (23) is connected to the connecting legs (6, 8) in order to bridge the connections.

Description

Beschreibung description
Titeltitle
Stromgeführter Hall-SensorCurrent-controlled Hall sensor
Die Erfindung betrifft einen stromgeführten Hall-Sensor mit einem elektrischenThe invention relates to a current-controlled Hall sensor with an electrical
Kondensator, der zum versorgungsspannungsunabhängigen Erfassen von Magnetfeldern mit elektrischen Anschlüssen des Hall-Sensors elektrisch wirkverbunden ist.Capacitor electrically operatively connected to supply voltage independent sensing of magnetic fields with electrical connections of the Hall sensor.
Stand der TechnikState of the art
Hall-Sensoren sind aus dem Stand der Technik bekannt. Sie werden heutzutage in vielen Applikationen zur Erfassung magnetischer Felder verwendet. Dabei sind drei wesentliche Auswertungsmethoden bekannt: Die analoge Auswertung, die digitale spannungsbasierte und die digitale stromgeführte Auswertung. Insbesondere die letzte Variante mit einem stromgeführten Hall-Sensor wird aufgrund ihrer hohen Robustheit gegen Störungen in den elektrischen Leitungen bevorzugt. Spannungsbasierte Hall-Sensoren reagieren dagegen empfindlich auf Störungen in der Versorgungsspannung.Hall sensors are known in the art. They are used today in many applications for detecting magnetic fields. Three main evaluation methods are known: the analog evaluation, the digital voltage-based and the digital current-controlled evaluation. In particular, the last variant with a current-controlled Hall sensor is preferred due to their high robustness against interference in the electrical lines. In contrast, voltage-based Hall sensors are sensitive to disturbances in the supply voltage.
Um versorgungsspannungsunabhängig mittels eines Hall-Sensors Magnetfelder zu erfassen, wird dem Hall-Sensor ein elektrischer Kondensator zugeordnet, der mit elektrischen Anschlüssen des Hall-Sensors elektrisch wirkverbunden ist, womit der Hall-Sensor als magnetfeld-gesteuerte Stromquelle verwendet werden kann. Der Kondensator erfüllt dabei mehrere Funktionen: Er dient als Stütz-In order to detect magnetic fields independent of supply voltage by means of a Hall sensor, the Hall sensor is associated with an electrical capacitor which is electrically connected to electrical connections of the Hall sensor, whereby the Hall sensor can be used as a magnetic field-controlled current source. The capacitor fulfills several functions: it serves as a support
Kapazität, erhöht die ESD-Festigkeit und verbessert darüber hinaus die EMV- Eigenschaften. Bei SMD-Bauteilen (oberflächenmontierbaren Bauteilen) ist es möglich, den Kondensator nahe an dem Hall-Sensor anzuordnen, wodurch sich seine Wirksamkeit erhöht. Bei „bedrahteten" Bauformen muss dann der ebenfalls „bedrahtete" Kondensator in der Nähe des Hall-Sensors platziert werden, was jedoch bei den heutigen Bauraumverringerungen schwierig ist. Offenbarung der ErfindungCapacity, increases the ESD resistance and also improves the EMC properties. For SMD (surface mount) devices, it is possible to place the capacitor close to the Hall sensor, thereby increasing its effectiveness. In the case of "leaded" designs, the "wired" capacitor must then be placed near the Hall sensor, which is difficult in today's installation space reductions. Disclosure of the invention
Der erfindungsgemäße Hall-Sensor ist gekennzeichnet durch die Ausbildung als Hall-Sensor-Einheit, mit einem zumindest den Hall-Sensor umschließenden Ge- häuse, aus welchem den Anschlüssen zugeordnete Anschlussbeine herausführen, wobei der Kondensator zum Überbrücken der Anschlüsse mit den Anschlussbeinen verbunden ist. Es ist also vorgesehen, dass der Hall-Sensor und der Kondensator als eine Hall-Sensor-Einheit, also als ein zusammenhängender und insbesondere zusammenhandhabbarer Verbund ausgebildet sind. Wobei der Hall-Sensor von einem Gehäuse umschlossen ist, und seinen Anschlüssen Anschlussbeine zugeordnet sind, die aus dem Gehäuse herausführen. Außerhalb des Gehäuses kann dadurch der Hall-Sensor auf einfache Art und Weise über die Anschlussbeine elektrisch kontaktiert werden. Darüber hinaus können die Anschlussbeine auch zum mechanischen Befestigen der Hall-Sensor-Einheit, beispielsweise an einer Leiterplatte, verwendet werden. Beispielsweise können die Anschlussbeine in entsprechende Aufnahmeöffnungen einer Leiterplatte eingesteckt und darin verlötet werden. Der Kondensator ist dabei zum Überbrücken der Anschlüsse, zum versorgungsspannungsunabhängigen Erfassen von Magnetfeldern, mit den Anschlussbeinen verbunden. Der elektrische Kontakt des Hall-Sensors zu dem Kondensator wird also über die Anschlussbeine erstellt.The Hall sensor according to the invention is characterized by the design as a Hall sensor unit, with a housing enclosing at least the Hall sensor, lead out of which the terminals associated terminal legs, wherein the capacitor for bridging the terminals is connected to the connection legs. It is thus provided that the Hall sensor and the capacitor are designed as a Hall sensor unit, ie as a coherent and in particular zusammenhandhabbarer composite. Wherein the Hall sensor is enclosed by a housing, and its terminals are associated with connecting legs, which lead out of the housing. Outside of the housing, the Hall sensor can thereby be electrically contacted in a simple manner via the connecting legs. In addition, the connection legs can also be used for mechanically fixing the Hall sensor unit, for example on a printed circuit board. For example, the connection legs can be inserted into corresponding receiving openings of a printed circuit board and soldered therein. The capacitor is connected to the terminals for bridging the terminals, for the supply voltage independent detection of magnetic fields. The electrical contact of the Hall sensor to the capacitor is thus created via the connecting legs.
Durch die Ausbildung als Hall-Sensor-Einheit bildet der Kondensator einen integralen Bestandteil, sodass er stets nahe an dem Hall-Sensor angeordnet ist. Über die Anschlussbeine, die üblicherweise einfacher zu kontaktieren sind als die Anschlüsse des Hall-Sensors selbst, kann dabei auf einfache Art und Weise die e- lektrische Verbindung zu dem Kondensator gewährleistet werden.The design as a Hall sensor unit, the capacitor forms an integral part, so that it is always located close to the Hall sensor. About the connecting legs, which are usually easier to contact than the terminals of the Hall sensor itself, can be ensured in a simple manner, the e- lektrische connection to the capacitor.
Vorteilhafterweise weisen die Anschlussbeine gehäuse-interne und gehäuseexterne Bereiche auf. Das bedeutet, dass die Anschlussbeine bereichsweise in dem Gehäuse und bereichsweise außerhalb des Gehäuses verlaufen. Dadurch können die Anschlussbeine besonders stabil an dem Gehäuse gehalten sein, wodurch die Hall-Sensor-Einheit besonders robust ausfällt.Advantageously, the connecting legs have housing-internal and external housing areas. This means that the connection legs extend in certain areas in the housing and partially outside the housing. As a result, the connection legs can be held particularly stable on the housing, whereby the Hall sensor unit is particularly robust.
Nach einer Weiterbildung der Erfindung weisen die Anschlussbeine jeweils mindestens eine Kondensator-Auflagefläche für den Kondensator auf. Wie der Name bereits sagt, liegt der Kondensator im montierten Zustand auf den Kondensator-According to a development of the invention, the connecting legs each have at least one capacitor bearing surface for the capacitor. As the name implies, the capacitor is mounted on the capacitor
Auflageflächen der Anschlussbeine auf. Die Kondensator-Auflageflächen ge- währleisten dabei einen sicheren elektrischen Kontakt und können darüber hinaus auch zur mechanischen Sicherung des Kondensators dienen. Aufgrund dieser Montageart kann der Kondensator sehr nahe an dem Hall-Sensor angeordnet werden, wodurch eine optimale Wirkung erzielt wird.Support surfaces of the connecting legs. The capacitor bearing surfaces are ensure a secure electrical contact and can also serve for mechanical protection of the capacitor. Due to this type of mounting, the capacitor can be placed very close to the Hall sensor, whereby an optimal effect is achieved.
Zweckmäßigerweise sind die Kondensator-Auflageflächen als vergrößerte Stanzflächen ausgebildet. Die Anschlussbeine werden bei der Fertigung der Hall- Sensor-Einheit zweckmäßigerweise als Stanzgitter hergestellt. Dabei ist es auf einfache Art und Weise möglich, verbreitete Bereiche an den Anschlussbeinen vorzusehen. So können beispielsweise die bei Stanzgittern üblichen verbreitertenConveniently, the capacitor bearing surfaces are formed as enlarged punched surfaces. The connecting legs are expediently produced in the production of the Hall sensor unit as a stamped grid. It is possible in a simple manner to provide common areas on the connecting legs. Thus, for example, the usual widened with punched gratings
Verbindungsbereiche, die später zertrennt werden, verwendet und gegebenenfalls zusätzlich vergrößert vorgesehen werden, sodass der Kondensator sicher auf den dadurch gebildeten Kondensator-Auflageflächen liegt.Used compound areas, which are later broken, and optionally additionally provided increased, so that the capacitor is safe on the condenser contact surfaces formed thereby.
Vorteilhafterweise sind die Kondensator-Auflageflächen in den gehäuse-externenAdvantageously, the capacitor bearing surfaces in the housing-external
Bereichen der Anschlussbeine ausgebildet. So kann der Kondensator auf einfache Art und Weise nach einer Einhausung des vorteilhafterweise als Halbleiterelement ausgebildeten Hall-Sensors mit Letzterem elektrisch verbunden werden. Auch ein Austausch des Kondensators im Bedarfsfall, beispielsweise bei einer Wartung, ist dadurch möglich. Zweckmäßigerweise wird der Kondensator auf dieFormed areas of the connecting legs. Thus, the capacitor can be electrically connected to the latter in a simple manner after encasing the advantageously designed as a semiconductor element Hall sensor. An exchange of the capacitor in case of need, for example, during maintenance, is possible. Conveniently, the capacitor is on the
Kondensator-Auflageflächen aufgelötet, um im Betrieb einen sicheren elektrischen Kontakt sowie einen sicheren Halt zu gewährleisten.Soldered capacitor pads to ensure safe electrical contact and secure hold during operation.
In einer weiteren Ausführungsform der Erfindung sind die Kondensator- Auflageflächen in den gehäuse-internen Bereichen der Anschlussbeine ausgebildet. Damit liegt auch der Kondensator selbst in dem Gehäuse, in dem auch der Hall-Sensor sowie die gehäuse-internen Bereiche der Anschlussbeine angeordnet sind. Dadurch wird die Stabilität der Hall-Sensor-Einheit weiter erhöht, da nunmehr auch der Kondensator durch das Gehäuse selbst geschützt und gehal- ten wird. Das Gehäuse ist dabei zweckmäßigerweise etwas größer als in der vorhergehend beschriebenen Ausführungsform ausgebildet. Die Montage der Hall-Sensor-Einheit gestaltet sich dadurch insgesamt einfacher, da die Hall- Sensor-Einheit nunmehr noch einfacher zu handhaben ist.In a further embodiment of the invention, the capacitor bearing surfaces are formed in the housing-internal regions of the connecting legs. Thus, the capacitor itself is also in the housing, in which the Hall sensor and the housing-internal areas of the connecting legs are arranged. As a result, the stability of the Hall sensor unit is further increased, since now also the capacitor is protected and held by the housing itself. The housing is expediently slightly larger than in the previously described embodiment. The assembly of the Hall sensor unit is thus made easier overall, since the Hall sensor unit is now even easier to handle.
Zweckmäßigerweise sind die Kondensator-Auflageflächen der gehäuse-externenConveniently, the capacitor bearing surfaces of the housing-external
Bereiche nahe zu dem Gehäuse ausgebildet, sodass der Kondensator möglichst nahe an dem Hall-Sensor angeordnet ist, und die höchstmögliche Wirksamkeit des „externen" Kondensators erzielt werden kann.Regions formed near the housing, so that the capacitor as possible is arranged close to the Hall sensor, and the highest possible efficiency of the "external" capacitor can be achieved.
Weiterhin ist vorgesehen, dass der Kondensator als Keramik-Kondensator, also als ein elektrischer Kondensator mit einem keramischen Dielektrikum ausgebildet ist. Derartige Keramikkondensatoren sind unempfindlich gegenüber Spannungen und Überspannungsimpulsen und halten auch hohen Temperaturen stand.Furthermore, it is provided that the capacitor is designed as a ceramic capacitor, that is, as an electrical capacitor with a ceramic dielectric. Such ceramic capacitors are insensitive to voltages and overvoltage pulses and can withstand high temperatures.
Ferner ist vorgesehen, dass die Anschlüsse des Hall-Sensors mittels Bond- Verbindungen mit den Anschlussbeinen verbunden sind.It is further provided that the terminals of the Hall sensor are connected by means of bonding connections with the connection legs.
Schließlich ist vorgesehen, dass das Gehäuse ein Mold-Gehäuse ist. Dieses wird bei der Herstellung der Hall-Sensor-Einheit um den Hall-Sensor, bereichsweise um die Anschlussbeine und gegebenenfalls um den Kondensator gespritzt be- ziehungsweise gegossen. Das Mold-Gehäuse ist ein elektrisch nicht leitfähigesFinally, it is provided that the housing is a mold housing. In the production of the Hall sensor unit, this is molded or cast around the Hall sensor, in some areas around the connecting legs and optionally around the capacitor. The Mold housing is an electrically non-conductive
Kunststoffgehäuse. Durch das Umgießen/Umspritzen der Einzelteile der Hall- Sensor-Einheit entsteht eine besonders mechanisch belastbare beziehungsweise stabile Einheit.Plastic housing. Through the encapsulation / encapsulation of the items of the Hall sensor unit creates a particularly mechanically stable or stable unit.
Im Folgenden soll die Erfindung anhand mehrerer Ausführungsbeispiele näher erläutert werden.In the following, the invention will be explained in more detail with reference to several embodiments.
Dazu zeigenShow this
Figur 1 ein erstes Ausführungsbeispiel eines vorteilhaften Hall-Sensors in einer schematischen Darstellung undFigure 1 shows a first embodiment of an advantageous Hall sensor in a schematic representation and
Figur 2 ein zweites Ausführungsbeispiel eines vorteilhaften Hall-Sensors in einer schematischen Darstellung.2 shows a second embodiment of an advantageous Hall sensor in a schematic representation.
Die Figur 1 zeigt in einer schematischen Darstellung ein erstes Ausführungsbeispiel einer erfindungsgemäßen Hall-Sensor-Einheit 1. Die Hall-Sensor-Einheit 1 weist einen als Halbleiterelement 2 ausgebildeten Hall-Sensor 3 auf, der auf einer Auflagefläche (englisch: die attach) beziehungsweise auf einem Substrat 4 angeordnet ist. Das Substrat 4 ist Bestandteil eines Stanzgitters 5, welches weiterhin drei Anschlussbeine 6, 7, 8 aufweist, von denen das Anschlussbein 7 opti- onal ist. Die Anschlussbeine 6, 7, 8 sind parallel zueinander ausgerichtet und weisen ihrem dem Hall-Sensor 3 gegenüberliegenden Ende jeweils eine Kontaktfläche 9, 10, 1 1 auf. Mittels Bondverbindungen 12 ist der Hall-Sensor 3 mit jeweils einer der Kontaktflächen 9, 10, 1 1 elektrisch wirkverbunden. Während die Anschlussbeine 6 und 8 nachträglich von dem Stanzgitter 5 getrennt wurden, geht das optionale Anschlussbein 7 in das Substrat 4, auf dem der Hall-Sensor 3 angeordnet ist über. Die Anschlussbeine 6, 7 dienen dabei als Anschlussleitungen für eine Versorgungsspannung, beziehungsweise für einen die Signale des Hall-Sensors 3 erfassende Auswerteeinheit, wie zum Beispiel ein Mikrocontroller, während das Anschlussbein 8 als Masse-Leitung dient. Die Anschlussbeine 6 und 7 sind bei stromgeführten (HaII-) Sensoren oft zusammengefasst. Aus Kom- patibilitäts- und Festigkeitsgründen bleibt das Anschlussbein 7 oft erhalten.1 shows a schematic representation of a first embodiment of a Hall sensor unit according to the invention 1. The Hall sensor unit 1 has a designed as a semiconductor element 2 Hall sensor 3, on a support surface (English: the attach) or is arranged on a substrate 4. The substrate 4 is part of a stamped grid 5, which further comprises three connecting legs 6, 7, 8, of which the connecting leg 7 optimally is onal. The connecting legs 6, 7, 8 are aligned parallel to each other and have their Hall sensor 3 opposite end each having a contact surface 9, 10, 1 1. By means of bonding connections 12, the Hall sensor 3 is electrically operatively connected to one of the contact surfaces 9, 10, 11. While the connecting legs 6 and 8 were subsequently separated from the stamped grid 5, the optional connecting leg 7 goes into the substrate 4, on which the Hall sensor 3 is arranged over. The connecting legs 6, 7 serve as connection lines for a supply voltage, or for a signal of the Hall sensor 3 detecting evaluation, such as a microcontroller, while the connection leg 8 serves as a ground line. The connecting legs 6 and 7 are often combined in current-carrying (HaII) sensors. For reasons of compatibility and strength, the connecting leg 7 is often retained.
Der Hall-Sensor 3, das Substrat 4, die Bondverbindungen 12 sowie die An- schlussbeine 6, 7, 8 im Bereich ihrer Kontaktflächen 9, 10, 1 1 sind von einemThe Hall sensor 3, the substrate 4, the bonds 12 and the connection legs 6, 7, 8 in the region of their contact surfaces 9, 10, 1 1 are of a
Gehäuse 13, das als (Transfer-)Mold-Gehäuse 14 ausgebildet ist, umschlossen. Vorliegend bilden somit die Kontaktflächen 9, 10, 1 1 gehäuseinterne Bereiche 15, 16, 17 der Anschlussbeine 6, 7, 8.Housing 13, which is designed as a (transfer) mold housing 14, enclosed. In the present case, the contact surfaces 9, 10, 11 thus form housing-internal regions 15, 16, 17 of the connection legs 6, 7, 8.
Der übrige Bereich des jeweiligen Anschlussbeins 6, 7, 8 bildet entsprechend einen gehäuse-externen Bereich 18, 19, 20, der also außerhalb des Gehäuses 13 liegt. In ihrem gehäuse-externen Bereich 18, 19, 20 sind nahe zu dem Gehäuse 13 an den Anschlussbeinen 6 und 8 jeweils eine Kondensator-Auflagefläche 21 , 22 ausgebildet. Auf den Kondensator-Auflageflächen 21 , 22 ist ein Kondensator 23, der als Keramikkondensator 24 ausgebildet ist, angeordnet und elektrisch mit diesen verbunden. Der Kondensator 23 überbrückt somit die den Anschlussbeinen 6 und 8 zugeordneten Anschlüsse des Hall-Sensors 3. Vorteilhafterweise ist der Kondensator 23 mit seinen Kontaktenden auf der entsprechenden Kondensator-Auflagefläche 21 und 22 angelötet, um einen sicheren elektrischen sowie me- chanischen Kontakt zu gewährleisten.The remaining area of the respective connecting leg 6, 7, 8 correspondingly forms a housing-external area 18, 19, 20, which therefore lies outside the housing 13. In their housing-external area 18, 19, 20 are close to the housing 13 on the connecting legs 6 and 8 each have a capacitor bearing surface 21, 22 are formed. On the capacitor bearing surfaces 21, 22, a capacitor 23, which is designed as a ceramic capacitor 24, arranged and electrically connected thereto. The capacitor 23 thus bridges the terminals of the Hall sensor 3 assigned to the connection legs 6 and 8. Advantageously, the capacitor 23 is soldered with its contact ends on the corresponding capacitor contact surface 21 and 22 in order to ensure reliable electrical and mechanical contact.
Durch die vorteilhafte nahe Anordnung des Kondensators 23 zu dem Hall-Sensor 3 ist diese Hall-Sensor-Einheit 1 beziehungsweise der Hall-Sensor 3 wirksam als stromgeführter Hall-Sensor zum versorgungsspannungsunabhängigen Erfassen von Magnetfeldern verwendbar. Die räumliche Nähe des Kondensators 23 zu dem Hall-Sensor 3 führt dabei zu einer besonders wirksamen EMV-Eingenschaft und erhöhten ESD-Festigkeit. Darüber hinaus ist der Kondensator 23 als Stütz- Kapazität nutzbar, wodurch die Funktionssicherheit bei Netzschwankungen erhöht wird. Auch die bei getakteten Sensoren üblichen „Chopper-Peaks" können aufgrund der räumlichen Nähe des Kondensators 23 optimal unterdrückt werden. Die Stanzgitterkonstruktion sowie die Anbindung des Kondensators 23 an denDue to the advantageous close arrangement of the capacitor 23 to the Hall sensor 3, this Hall sensor unit 1 and the Hall sensor 3 is effectively used as a current-guided Hall sensor for supply voltage independent detection of magnetic fields. The spatial proximity of the capacitor 23 to the Hall sensor 3 leads to a particularly effective EMC-Eingenschaft and increased ESD strength. In addition, the capacitor 23 can be used as a support capacity, whereby the reliability is increased in network fluctuations. The "chopper peaks" customary with clocked sensors can also be optimally suppressed due to the spatial proximity of the capacitor 23. The stamped grid construction and the connection of the capacitor 23 to the
Anschlussbeinen 6 und 8 erlaubt eine besonders einfache und kostengünstige Herstellung der Hall-Sensor-Einheit 1 , die auch hohen Temperaturen beziehungsweise Temperaturdifferenzen standhält.Connecting legs 6 and 8 allow a particularly simple and cost-effective production of the Hall sensor unit 1, which withstands high temperatures or temperature differences.
Die Figur 2 zeigt in einer schematischen Darstellung ein zweites Ausführungsbeispiel der erfindungsgemäßen Hall-Sensor-Einheit 1 , wobei gleiche Teile mit denselben Bezugszeichen versehen sind, sodass insofern auf die vorangehende Figur verwiesen wird. Im Unterschied zu dem vorhergehenden Ausführungsbeispiel sind nunmehr die Kondensator-Auflageflächen 21 und 22 in den gehäuse- internen Bereichen der Anschlussbeine 6, 8 ausgebildet und somit auch der2 shows a schematic representation of a second embodiment of the Hall sensor unit 1 according to the invention, wherein like parts are provided with the same reference numerals, so that reference is made to the preceding figure. In contrast to the previous embodiment, the capacitor bearing surfaces 21 and 22 are now formed in the housing-internal areas of the connecting legs 6, 8 and thus also the
Kondensator 23 in dem Gehäuse 13 angeordnet. Das Gehäuse 13 ist dazu entsprechend größer beziehungsweise länger ausgebildet. Die zweite Ausführungsform hat den Vorteil, dass der Kondensator 23 nunmehr auch durch das Gehäuse 13 gestützt und gehalten wird und insgesamt dadurch eine höhere mechani- sehe Stabilität gewährleistet ist. Darüber hinaus ist der Kondensator 23 im Inneren des Gehäuses 13 geschützt angeordnet, sodass sich unter Anderem auch die Montage und Handhabbarkeit der Hall-Sensor-Einheit 1 vereinfacht.Capacitor 23 is arranged in the housing 13. The housing 13 is designed to be correspondingly larger or longer. The second embodiment has the advantage that the capacitor 23 is now also supported and held by the housing 13 and overall characterized by a higher mechanical stability is ensured. In addition, the capacitor 23 is arranged protected inside the housing 13, so that among other things, the assembly and handling of the Hall sensor unit 1 simplified.
Durch die besonders kompakte Ausbildung der Hall-Sensor-Einheit 1 , bei der keine weiteren externen Bauelemente benötigt werden, wird im Vergleich zu bekannten Lösungen eine Platzersparnis erzielt. Die stromgesteuerte Hall-Sensor- Einheit 1 kann beispielsweise auch auf wenig Bauraum aufweisenden Komponenten, wie zum Beispiel Bürstenträgern einer elektrischen Maschine, angeordnet und damit sowohl mechanisch als auch elektrisch auf einfache Art und Weise sicher verbunden werden. Durch die vorteilhafte Ausbildung wird darüber hinaus die Lebensdauer des Hall-Sensors 3 beziehungsweise eines die Hall-Sensor- Einheit 1 aufweisenden Geräts verlängert und eine hohe Ausfallsicherheit gewährleistet, da nur eine geringe Anzahl von Löt-/Kontaktstellen vorhanden sind, die ausfallen könnten. Due to the particularly compact design of the Hall sensor unit 1, in which no further external components are needed, a space saving is achieved in comparison to known solutions. The current-controlled Hall sensor unit 1 can, for example, arranged on components having little space, such as brush holders of an electric machine, and thus safely connected both mechanically and electrically in a simple manner. Due to the advantageous embodiment of the life of the Hall sensor 3 and a Hall sensor unit 1 having device is extended beyond and ensures high reliability, since only a small number of solder / contact points are available, which could fail.

Claims

Ansprüche claims
1. Stromgeführter Hall-Sensor (3) mit einem elektrischen Kondensator (23) der zum versorgungsspannungsunabhängigen Erfassen von Magnetfeldern mit elektrischen Anschlüssen des Hall-Sensors (3) elektrisch wirkverbunden ist, gekennzeichnet durch die Ausbildung als Hall-Sensor-Einheit (1 ) mit einem zumindest den Hall-Sensor (3) umschließenden Gehäuse (13), aus welchem den Anschlüssen zugeordnete Anschlussbeine (6,8) herausführen, wobei der Kondensator (23) zum Überbrücken der Anschlüsse mit den Anschlussbeinen (6,8) verbunden ist.1. Current-controlled Hall sensor (3) with an electrical capacitor (23) for the supply voltage independent detection of magnetic fields with electrical terminals of the Hall sensor (3) is electrically connected, characterized by the design as a Hall sensor unit (1) with a housing (13) enclosing at least the Hall sensor (3), from which connection legs (6, 8) assigned to the terminals lead, the capacitor (23) being connected to the connection legs (6, 8) for bridging the terminals.
2. Hall-Sensor nach Anspruch 1 , dadurch gekennzeichnet, dass die Anschlussbeine (6,8) gehäuse-interne Bereiche (15,16,17) und gehäuseexterne Bereiche (18,19,20) aufweisen.2. Hall sensor according to claim 1, characterized in that the connecting legs (6,8) have housing-internal areas (15,16,17) and housing-external areas (18,19,20).
3. Hall-Sensor nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Anschlussbeine (6,8) jeweils mindestens eine Kondensator-Auflagefläche (21 ,22) für den Kondensator (23) aufweisen.3. Hall sensor according to one of the preceding claims, characterized in that the connecting legs (6,8) each have at least one capacitor bearing surface (21, 22) for the capacitor (23).
4. Hall-Sensor nach einem der vorhergehenden Ansprüche, dadurch gekenn- zeichnet, dass die Kondensator-Auflageflächen (21 ,22) als vergrößerte4. Hall sensor according to one of the preceding claims, characterized in that the capacitor bearing surfaces (21, 22) as an enlarged
Stanzflächen ausgebildet sind.Stamping surfaces are formed.
5. Hall-Sensor nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Kondensator-Auflageflächen (21 ,22) in den gehäuse- externen Bereichen (18,20) ausgebildet sind.5. Hall sensor according to one of the preceding claims, characterized in that the capacitor bearing surfaces (21, 22) in the housing-external areas (18,20) are formed.
6. Hall-Sensor nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Kondensator-Auflageflächen (21 ,22) in den gehäuseinternen Bereichen (15,16,17) ausgebildet sind. 6. Hall sensor according to one of the preceding claims, characterized in that the capacitor bearing surfaces (21, 22) in the housing-internal areas (15,16,17) are formed.
7. Hall-Sensor nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Kondensator-Auflageflächen (21 ,22) der gehäuseexternen Bereiche (18,19) nahe zu dem Gehäuse (13) ausgebildet sind.7. Hall sensor according to one of the preceding claims, characterized in that the capacitor bearing surfaces (21, 22) of the housing-external areas (18,19) are formed close to the housing (13).
8. Hall-Sensor nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass der Kondensator (23) als Keramik-Kondensator (24) ausgebildet ist.8. Hall sensor according to one of the preceding claims, characterized in that the capacitor (23) is designed as a ceramic capacitor (24).
9. Hall-Sensor nach einem der vorhergehenden Ansprüche, dadurch gekenn- zeichnet, dass die Anschlüsse des Hall-Sensors (3) mittels Bond- Verbindungen (12) mit den Anschlussbeinen (6,7,8) verbunden sind.9. Hall sensor according to one of the preceding claims, characterized in that the terminals of the Hall sensor (3) by means of bonding connections (12) to the connection legs (6,7,8) are connected.
10. Hall-Sensor nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Gehäuse (13) ein Mold-Gehäuse (14) ist. 10. Hall sensor according to one of the preceding claims, characterized in that the housing (13) is a mold housing (14).
PCT/EP2009/066391 2009-01-28 2009-12-04 Current controlled hall sensor WO2010086055A1 (en)

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