WO2010083665A1 - Led散热发光一体管 - Google Patents

Led散热发光一体管 Download PDF

Info

Publication number
WO2010083665A1
WO2010083665A1 PCT/CN2009/070568 CN2009070568W WO2010083665A1 WO 2010083665 A1 WO2010083665 A1 WO 2010083665A1 CN 2009070568 W CN2009070568 W CN 2009070568W WO 2010083665 A1 WO2010083665 A1 WO 2010083665A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
dissipating
light
reflector
lens
Prior art date
Application number
PCT/CN2009/070568
Other languages
English (en)
French (fr)
Inventor
刘雪峰
Original Assignee
Liu Xuefeng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Liu Xuefeng filed Critical Liu Xuefeng
Publication of WO2010083665A1 publication Critical patent/WO2010083665A1/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Definitions

  • the utility model relates to a high-power LED heat-dissipating integrated tube. Background technique
  • the light-emitting diodes on the market are all components that emit light by a current-controlled PN diode.
  • a forward bias is applied to the PN diode
  • the P-type semiconductor portion flows into the electrons
  • the N-type semiconductor portion flows into the hole.
  • electrons and holes near the PN junction will disappear due to strong bonding.
  • some specific semiconductors, the electrons and holes they flow in have energy that can emit light, that is, a so-called light-emitting diode.
  • the main structure of the existing high-power light-emitting diode includes a housing base, a circuit substrate locked to the base of the housing, and a plurality of high-power light-emitting diodes directly locked to the circuit substrate, which pass Power supply wire connection; the combination can provide sufficient light source; however, a plurality of high-power light-emitting diodes on the circuit substrate generate a large amount of heat energy, and the heat energy can only be transmitted through the power supply wire or the circuit substrate and the housing base.
  • the heat dissipation effect is quite limited. After a period of use, these high-power LEDs will cause temperature rise due to the accumulation of heat, which in turn will affect their electrical properties. Shorten the service life of high-power illuminators.
  • the existing light-emitting tube is connected to the circuit board to realize electrical connection, and the structure is relatively complicated. Summary of the invention
  • the purpose of the utility model is to solve the problems in the prior art, and to provide a high-power LED heat-dissipating integrated tube with simple structure, convenient maintenance and low cost.
  • a high-power LED heat-dissipating integrated tube comprising a heat-conducting bracket, an LED light-emitting chip, a lens, a reflector and a heat dissipating device; the LED light-emitting chip is located at a center position of the reflector, and the reflector is in the heat-conducting bracket
  • the upper part of the heat-conducting bracket is covered with a lens, the LED light-emitting chip and the reflector are covered in the lens, and the lower end of the heat-conducting bracket is next to the heat-dissipating device
  • the heat-dissipating device comprises a heat-dissipating fin and a heat-dissipating elastic body, and the lower end of the heat-dissipating fin is connected to the heat-dissipating body.
  • the reflective angle of the reflector is 20° to 23°.
  • the heat dissipating fin is a cylindrical structure composed of a plurality of sheet-like bodies.
  • the utility model has the advantages that: the heat dissipation is fast, the circuit board is not needed, the structure is simple, the cost is low, the light efficiency is improved by 6% compared with the light-emitting tube without the reflector structure, and the heat-dissipating elastic body can be stretched according to the temperature, stretching Elastomer, the longer the elastomer, the faster the heat dissipation.
  • Figure 1 is a schematic view of the structure of the present invention.
  • Figure 2 is a front view of the heat sink fin.
  • FIG. 3 shows a top view of the heat sink fins.
  • a high-power LED heat-dissipating integrated tube includes a heat-conducting bracket 1 , an LED light-emitting chip 2 , a lens 3 , a reflector 4 and a heat sink; the LED light-emitting chip 2 is located at a center position of the reflector 4, and a reflector 4
  • the heat-dissipating device includes a heat-dissipating fin 5 and the heat dissipating elastic body 6, the lower end of the heat dissipating fin 5 is connected to the heat dissipating elastic body 6.
  • the reflective angle of the reflector is 20° to 23°, and the luminous efficiency is improved by 6% compared with the light-emitting tube having no reflector structure.
  • the heat dissipating fins 5 are cylindrical structures composed of a plurality of sheet-like bodies.
  • the utility model does not need to use a circuit board, directly connects the positive and negative electrodes of the LED light-emitting chip to the power source to realize electrical connection, and the LED light-emitting chip emits a large amount of heat while emitting light, and the heat-conducting bracket connected thereto can fully emit the LED light-emitting chip
  • the heat is transferred to the heat dissipating fins and the heat dissipating elastic body, and the heat is dissipated in time, so that the temperature of the LED light emitting chip is maintained at about 50 ° C, which prolongs the service life of the LED light emitting chip.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)

Description

LED散热发光一体管 技术领域
本实用新型涉及一种大功率 LED散热发光一体管。 背景技术
一般市面上的发光二级管，均是以电流控制 PN二极体来发光的组件。当在 PN二极体中加上顺向偏压时， P型半导体部分便会流入电子， 而 N型半导体部 分则流入电洞。另一方面，在 PN接合附近的电子与电洞会因为旺盛的接合而消 失。 此时， 某些特定的半导体， 其流入的电子与电洞具有可以发光的能量， 即 所谓的发光二极体。
然而， 不论是哪一种类型的发光二极体， 其使用周期寿命及可靠度都是受 到温度的影响控制， 当发光二极体通电后， 会将少量的电能转为光能而发亮， 其余绝大部分的电能均会变成热能散出。 所以对大功率的发光二极体来说， 其 芯片所接受的电能， 几乎都转化为热能， 因此大功率发光二极体的散热问题便 成为重要的研究课题。 现有高功率发光二极体的主要结构包括一壳体基座、 一 锁固于该壳体基座的电路基板， 及直接锁固于电路基板的多个大功率发光二级 体， 其通过电源导线连接； 该组合可以提供足够的光源； 但在电路基板上的多 个高功率发光二极体会产生大量的热能， 热能仅可通过电源导线或电路基板与 壳体基座接触处传导散出， 其散热效果相当有限， 在使用一段时间后， 这些大 功率发光二极管就会因为热量的累积， 导致温度上升， 进而使其电性受到影响， 縮短大功率发光体的使用寿命。
现有发光管与电路板相连实现电连接， 结构较为复杂。 发明内容
本实用新型的目的是解决现有技术中的问题， 提供一种结构简单、 维护方 便、 成本低的大功率 LED散热发光一体管。
本实用新型的技术方案是： 大功率 LED散热发光一体管， 包括导热支架、 LED发光芯片、 透镜、 反光体和散热装置； 所述 LED发光芯片位于反光体的中 心位置， 反光体在导热支架的上部， 导热支架的上部罩有透镜， LED发光芯片 和反光体罩在透镜内， 导热支架的下端紧接散热装置， 所述散热装置包括散热 翼片和散热弹性体， 散热翼片的下端连接散热弹性体。
所述反光体的反光角度是 20° 〜23° 。
优选， 所述散热翼片为由多个片状体围绕组成的圆柱形结构。
本实用新型的有益效果是： 散热快、 不需使用电路板、 结构简单、 成本低， 与没有反光体结构的发光管相比光效提高了 6%， 散热弹性体可根据温度变化， 拉伸弹性体， 弹性体越长散热速度越快。 附图说明
图 1 为本实用新型的结构示意图。
图 2 为散热翼片的主视图。
图 3 为散热翼片的俯视图。 具体实施方式
如图 1所示， 大功率 LED散热发光一体管， 包括导热支架 1、 LED发光芯 片 2、 透镜 3、 反光体 4和散热装置； 所述 LED发光芯片 2位于反光体 4的中 心位置， 反光体 4在导热支架 1 的上部， 导热支架 1 的上部罩有透镜 3， LED 发光芯片 2和反光体 4罩在透镜 3内， 导热支架 1的下端紧接散热装置， 所述 散热装置包括散热翼片 5和散热弹性体 6，散热翼片 5的下端连接散热弹性体 6。
所述反光体的反光角度是 20° 〜23 ° ， 与没有反光体结构的发光管相比光 效提高了 6%。
如图 2、 3所示， 所述散热翼片 5为由多个片状体围绕组成的圆柱形结构。 本实用新型不需使用电路板， 直接将 LED发光芯片的正负极与电源相连实 现电连接， LED发光芯片发光的同时产生大量的热量， 与其相接的导热支架能 充分地将 LED发光芯片发出的热量传导给散热翼片和散热弹性体， 及时将热量 散出， 使 LED发光芯片的温度维持在 50°C左右， 延长了 LED发光芯片的使用 寿命。
综上所述仅为本实用新型的实施例， 并非用来限定本新型的实施范围， 即 凡依本实用新型申请专利范围的内容所作的等效变化及修饰， 皆应属于本实用 新型的技术范畴。

Claims

权 利 要 求 书
1. 大功率 LED散热发光一体管， 其特征是： 包括导热支架、 LED发光芯片、 透镜、 反光体和散热装置； 所述 LED 发光芯片位于反光体的中心位置， 反 光体在导热支架的上部， 导热支架的上部罩有透镜， LED发光芯片和反光体 罩在透镜内， 导热支架的下端紧接散热装置， 所述散热装置包括散热翼片 和散热弹性体， 散热翼片的下端连接散热弹性体。
2. 根据权利要求 1所述的大功率 LED散热发光一体管， 其特征是： 所述反光 体的反光角度是 20 ° 〜23 ° 。
3. 根据权利要求 1所述的大功率 LED散热发光一体管， 其特征是： 所述散热 翼片为由多个片状体围绕组成的圆柱形结构。
PCT/CN2009/070568 2009-01-20 2009-02-27 Led散热发光一体管 WO2010083665A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CNU2009200042028U CN201293230Y (zh) 2009-01-20 2009-01-20 大功率led散热发光一体管
CN200920004202.8 2009-01-20

Publications (1)

Publication Number Publication Date
WO2010083665A1 true WO2010083665A1 (zh) 2010-07-29

Family

ID=41006708

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2009/070568 WO2010083665A1 (zh) 2009-01-20 2009-02-27 Led散热发光一体管

Country Status (2)

Country Link
CN (1) CN201293230Y (zh)
WO (1) WO2010083665A1 (zh)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005247160A (ja) * 2004-03-04 2005-09-15 Daido Signal Co Ltd Ｌｅｄ信号電球および色灯信号機
US7196358B1 (en) * 2005-11-25 2007-03-27 Solidlite Corporation Light emitting diode module with high heat dissipation
CN201034294Y (zh) * 2007-04-20 2008-03-12 诸建平 大功率led照明灯模组
CN201034307Y (zh) * 2007-05-30 2008-03-12 杭州五联照明科技有限公司 带散热结构的发光二极管照明装置
CN201177245Y (zh) * 2008-04-14 2009-01-07 李传锋 Led光源塔式弹性散热器
CN101344227A (zh) * 2007-06-30 2009-01-14 奥斯兰姆施尔凡尼亚公司 Led灯模块

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005247160A (ja) * 2004-03-04 2005-09-15 Daido Signal Co Ltd Ｌｅｄ信号電球および色灯信号機
US7196358B1 (en) * 2005-11-25 2007-03-27 Solidlite Corporation Light emitting diode module with high heat dissipation
CN201034294Y (zh) * 2007-04-20 2008-03-12 诸建平 大功率led照明灯模组
CN201034307Y (zh) * 2007-05-30 2008-03-12 杭州五联照明科技有限公司 带散热结构的发光二极管照明装置
CN101344227A (zh) * 2007-06-30 2009-01-14 奥斯兰姆施尔凡尼亚公司 Led灯模块
CN201177245Y (zh) * 2008-04-14 2009-01-07 李传锋 Led光源塔式弹性散热器

Also Published As

Publication number Publication date
CN201293230Y (zh) 2009-08-19

Similar Documents

Publication Publication Date Title
KR100998480B1 (ko) 열전달/발산 모듈을 구비한 반도체 발광 장치
TWM353308U (en) LED illumination device
WO2007009296A1 (fr) Panneau d’affichage lumineux
Wall et al. High-power LED package requirements
KR101276326B1 (ko) 비아홀을 갖는 인쇄회로기판, 이를 구비한 엘이디 모듈 및 led 조명장치
CN101852350A (zh) 一种设有专门散热装置的柱形led灯具
CN201706228U (zh) 一种配置散热装置的led锥形灯具
CN201803153U (zh) 一种具有良好散热效果的led灯具
CN206943847U (zh) 一种可快速组装的led灯
TW201043851A (en) LED lamp with heat dissipating structure
WO2010083665A1 (zh) Led散热发光一体管
CN201615379U (zh) 一种高效散热的led灯
TW200907241A (en) Light emitting diode lamp having heat dissipation module and its lamp holder structure
CN202229099U (zh) Led灯芯片及led灯
CN202349696U (zh) 一种高散热、抗光衰及高光效的发光二极管
US20100149799A1 (en) Led illuminating device and light engine thereof
Chan Electronic packaging for solid-state lighting
CN202091861U (zh) 一种使用陶瓷散热的led发光模块
CN203857345U (zh) 一种水冷却led路灯
CN202327758U (zh) 一种led光源组件
KR20190128362A (ko) 공랭식 히트싱크를 갖는 가로등 조명 기구
CN220526950U (zh) 一种半导体发光二极管
CN207796677U (zh) 一种改善散热性的led灯
CN201621514U (zh) 一种设有专门散热装置的柱形led灯具
CN202302830U (zh) Led灯

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09838632

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 09838632

Country of ref document: EP

Kind code of ref document: A1