WO2010083014A3 - Floating-body/gate dram cell - Google Patents

Floating-body/gate dram cell Download PDF

Info

Publication number
WO2010083014A3
WO2010083014A3 PCT/US2009/069642 US2009069642W WO2010083014A3 WO 2010083014 A3 WO2010083014 A3 WO 2010083014A3 US 2009069642 W US2009069642 W US 2009069642W WO 2010083014 A3 WO2010083014 A3 WO 2010083014A3
Authority
WO
WIPO (PCT)
Prior art keywords
gate
cell
floating
dram cell
drive
Prior art date
Application number
PCT/US2009/069642
Other languages
French (fr)
Other versions
WO2010083014A2 (en
Inventor
Jerry G. Fossum
Zhichao Lu
Original Assignee
University Of Florida Research Foundation Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University Of Florida Research Foundation Inc. filed Critical University Of Florida Research Foundation Inc.
Priority to US13/124,066 priority Critical patent/US8787072B2/en
Publication of WO2010083014A2 publication Critical patent/WO2010083014A2/en
Publication of WO2010083014A3 publication Critical patent/WO2010083014A3/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/7841Field effect transistors with field effect produced by an insulated gate with floating body, e.g. programmable transistors
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/403Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh
    • G11C11/404Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh with one charge-transfer gate, e.g. MOS transistor, per cell
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/20DRAM devices comprising floating-body transistors, e.g. floating-body cells
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2211/00Indexing scheme relating to digital stores characterized by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C2211/401Indexing scheme relating to cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C2211/4016Memory devices with silicon-on-insulator cells

Abstract

Memory cell structures and biasing schemes are provided. Certain embodiments pertain to a modified floating-body gate cell, which can provide improved retention times. In one embodiment, a gated diode is used to drive the gate of a second transistor structure of a cell. In another embodiment, a body-tied-source (BTS) field effect transistor is used to drive the gate of the second transistor structure of a cell.
PCT/US2009/069642 2007-10-01 2009-12-29 Floating-body/gate dram cell WO2010083014A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US13/124,066 US8787072B2 (en) 2007-10-01 2009-12-29 Floating-body/gate DRAM cell

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14428909P 2009-01-13 2009-01-13
US61/144,289 2009-01-13

Publications (2)

Publication Number Publication Date
WO2010083014A2 WO2010083014A2 (en) 2010-07-22
WO2010083014A3 true WO2010083014A3 (en) 2010-09-30

Family

ID=42340250

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2009/069642 WO2010083014A2 (en) 2007-10-01 2009-12-29 Floating-body/gate dram cell

Country Status (1)

Country Link
WO (1) WO2010083014A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102427025B (en) * 2011-08-17 2015-05-20 上海华力微电子有限公司 Method for manufacturing DRAM (dynamic random access memory) of gate-last 2 transistor

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6317349B1 (en) * 1999-04-16 2001-11-13 Sandisk Corporation Non-volatile content addressable memory
US20050013163A1 (en) * 2003-05-13 2005-01-20 Richard Ferrant Semiconductor memory cell, array, architecture and device, and method of operating same
KR20080080449A (en) * 2007-03-01 2008-09-04 가부시끼가이샤 도시바 Semiconductor memory device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6317349B1 (en) * 1999-04-16 2001-11-13 Sandisk Corporation Non-volatile content addressable memory
US20050013163A1 (en) * 2003-05-13 2005-01-20 Richard Ferrant Semiconductor memory cell, array, architecture and device, and method of operating same
KR20080080449A (en) * 2007-03-01 2008-09-04 가부시끼가이샤 도시바 Semiconductor memory device

Also Published As

Publication number Publication date
WO2010083014A2 (en) 2010-07-22

Similar Documents

Publication Publication Date Title
WO2012178199A3 (en) Memory array architecture with two-terminal memory cells
WO2010045087A3 (en) Oc dram cell with increased sense margin
WO2009046114A3 (en) Two-transistor floating-body dynamic memory cell
WO2010117898A3 (en) Methods, devices, and systems relating to memory cells having a floating body
WO2011031749A3 (en) Dram cell utilizing a doubly gated vertical channel
WO2014137652A3 (en) Vertical bit line tft decoder for high voltage operation
WO2011063292A3 (en) Semiconductor device having strain material
WO2010096803A3 (en) Rigid semiconductor memory having amorphous metal oxide semiconductor channels
DE602007009181D1 (en) Memory cell equipped with transistors with double gate, independent and asymmetric gates
WO2012170409A3 (en) Techniques for providing a semiconductor memory device
TW200717804A (en) Semiconductor device
WO2009005075A3 (en) A method of driving a semiconductor memory device and a semiconductor memory device
BRPI0809982A2 (en) DESIGN METHODS AND MAGNETORRESISTORY RANDOM ACCESS MEMORY OF TORQUE TRANSFER BY SPIN.
WO2008024171A8 (en) Dram transistor with recessed gates and methods of fabricating the same
JP2012064930A5 (en) Semiconductor memory device
JP2012028756A5 (en) Semiconductor device
JP2012146965A5 (en) Semiconductor device
TW200707653A (en) Two-sided surround access transistor for a 4.5F2 DRAM cell
WO2007111745A3 (en) Split gate memory cell in a finfet
JP2012256398A5 (en) Semiconductor device
TW201207854A (en) Semiconductor device and method for driving the same
TW200943538A (en) Semiconductor storage device
WO2010118181A3 (en) Shared transistor in a spin-torque transfer magnetic random access memory (sttmram) cell
TW200729211A (en) Memory devices including floating body transistor capacitorless memory cells and related methods
EP1858025B8 (en) Semiconductor memory operated by internal and external refresh

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09838576

Country of ref document: EP

Kind code of ref document: A2

WWE Wipo information: entry into national phase

Ref document number: 13124066

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 09838576

Country of ref document: EP

Kind code of ref document: A2