WO2010046955A1 - Electronic component and method for manufacturing electronic component - Google Patents

Electronic component and method for manufacturing electronic component Download PDF

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Publication number
WO2010046955A1
WO2010046955A1 PCT/JP2008/003030 JP2008003030W WO2010046955A1 WO 2010046955 A1 WO2010046955 A1 WO 2010046955A1 JP 2008003030 W JP2008003030 W JP 2008003030W WO 2010046955 A1 WO2010046955 A1 WO 2010046955A1
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WO
WIPO (PCT)
Prior art keywords
terminal
electronic component
contact portion
wire
terminal contact
Prior art date
Application number
PCT/JP2008/003030
Other languages
French (fr)
Japanese (ja)
Inventor
佐藤剛
佐藤誠二
Original Assignee
スミダコーポレーション株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by スミダコーポレーション株式会社 filed Critical スミダコーポレーション株式会社
Priority to PCT/JP2008/003030 priority Critical patent/WO2010046955A1/en
Priority to CN2008801312766A priority patent/CN102165642B/en
Priority to JP2010534609A priority patent/JP5006974B2/en
Publication of WO2010046955A1 publication Critical patent/WO2010046955A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0228—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections without preliminary removing of insulation before soldering or welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/06—Coil winding
    • H01F41/076—Forming taps or terminals while winding, e.g. by wrapping or soldering the wire onto pins, or by directly forming terminals from the wire
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10—Connecting leads to windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/023—Soldered or welded connections between cables or wires and terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H01F17/045—Fixed inductances of the signal type  with magnetic core with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core

Definitions

  • the present invention relates to an electronic component and a method for manufacturing the electronic component.
  • Arc welding is a method in which an ultra-high temperature arc is generated between a metal terminal, which is a welding base material, and a welding electrode to melt the metal terminal and join the wires that have been entangled therewith.
  • a metal terminal which is a welding base material
  • a welding electrode to melt the metal terminal and join the wires that have been entangled therewith.
  • external force such as gas pressure is applied to a molten metal lump melted by an arc, and this is forcibly biased to one side of a metal terminal, thereby dimensional stability of an electronic component after welding.
  • the invention of the welding method which aims at property is described.
  • the present invention has been made in view of the above problems, and an electronic component capable of forming a molten metal lump at a desired position regardless of the dimensions of a metal terminal or a wire and realizing high dimensional stability and yield, and The manufacturing method is provided.
  • the electronic component of the present invention includes a wire, A metal terminal made of a metal material and having a lump portion including the end of the wire; A base portion for supporting the metal terminal; A terminal abutting portion made of an insulating material and abutting against at least a part of the surface of the massive portion; Have
  • the wire connected to the end portion may extend to the opposite side of the block portion with the terminal contact portion interposed therebetween.
  • the terminal contact portion has a plate shape and is erected on the base portion.
  • the lump portion may be formed on one side of the main surface of the terminal contact portion.
  • a collar portion extending to the other side of the main surface may be formed at the upper end of the terminal contact portion.
  • the electronic component of the present invention may have lower wettability with respect to the molten metal material on the upper end surface of the flange than the unmelted metal material.
  • the end of the wire may be wound around the terminal contact portion and the metal terminal.
  • the base part and the terminal contact part may be integrally formed of the common insulating material.
  • the terminal contact portion may have a film shape covering at least a part of the lump portion.
  • the lump portion may have a diameter of 1 mm or less.
  • the method of manufacturing an electronic component of the present invention includes a step of melting a part or all of a metal terminal made of a metal material and entangled with a wire by arc heat by arc welding to form a molten metal lump, A step of biasing the molten metal mass to the side of the other side of the metal terminal by a regulating force of a terminal contact portion made of an insulating material and provided on the side of the metal terminal; Cooling and hardening the biased molten metal lump to form a lump that encloses part of the wire; and including.
  • the various components of the present invention do not necessarily have to be independent of each other.
  • a plurality of components are formed as a single member, and a single component is formed of a plurality of members. It may be that a certain component is a part of another component, a part of a certain component overlaps with a part of another component, or the like. Further, in the present invention, there are cases where the front-rear, left-right, up-down directions are defined, but this is defined for convenience in order to briefly explain the relative relationship between the components of the present invention. Does not necessarily correspond.
  • the electronic component manufacturing method of the present invention is described in a plurality of steps, the description order does not necessarily limit the order in which the plurality of steps are performed.
  • the electronic component manufacturing method of the present invention is not limited to the case where a plurality of steps are executed at different timings, and other steps are generated during the execution of a step, and the execution timing of a step. And some or all of the execution timings of other processes may overlap.
  • the metal terminal melted by the arc heat stably forms a lump on the opposite side of the terminal contact portion.
  • the high-heated lump portion breaks the copper wire, and a high-yield electronic component can be realized.
  • the reproducibility of the formation position of the massive portion is improved, an electronic component having excellent dimensional stability is provided. And since the said effect does not depend on the dimension of a metal terminal or a wire, even if an electronic component is miniaturized more and more, this can be show
  • FIG. 2 is an enlarged view of a region indicated by a broken line II in FIG. It is a perspective view which shows the state before a metal terminal and a wire are arc-welded. It is a perspective view which shows the state which sealed the electronic component with mold resin.
  • (A) to (c) is a schematic diagram showing an example of a method of manufacturing an electronic component according to the present embodiment.
  • (A), (b) is a fragmentary perspective view which shows 2nd embodiment of this invention.
  • (A), (b) is a partial side view which shows 3rd embodiment of this invention.
  • FIG. 1 is a perspective view showing an example of an electronic component 10 according to the first embodiment of the present invention. However, in the drawing, a part of the wound wire 12 is cut out to show the core part 50.
  • FIG. 2 is an enlarged view of a region indicated by a broken line II in FIG.
  • FIG. 3 is a perspective view showing a state before the metal terminal 20 and the wire 12 are arc-welded, and corresponds to FIG. 4 is a perspective view showing a state in which the electronic component 10 shown in FIG.
  • the electronic component 10 of the present embodiment includes a wire 12, a metal terminal 20 that is made of a metal material and includes a massive portion 22 that encloses the end portion 14 of the wire 12, and a base portion (a flange portion 52) that supports the metal terminal 20. And a terminal abutting portion 30 made of an insulating material and abutting against at least a part of the surface of the lump portion 22.
  • the electronic component 10 is a coil component in which the wire 12 is wound around the core portion 50.
  • the winding core portion 50 has a rod shape extending from the left front side in FIG. 1 to the right depth side, and substantially rectangular parallelepiped flange portions 52 (52a, 52b) are provided at both ends thereof.
  • the core 50 is made of a ferromagnetic material such as ferrite or amorphous material.
  • the collar portion 52 is made of an insulating resin material different from the core portion 50.
  • the flange portion 52 has a mounting hole (not shown) formed in the mounting surface 51 which is one surface.
  • the flange portions 52 are respectively attached to both ends of the core portion 50 by inserting the end portions of the core portion 50 into the mounting holes.
  • the metal terminal 20 of the present embodiment is provided so as to protrude from the other side surface of the flange portion 52 different from the mounting surface 51. That is, in the metal terminal 20 of the present embodiment, the flange portion 52 corresponds to a base portion that supports the metal terminal 20. A large number of wires 12 are wound around the core 50, and both ends are encased in the block 22 and are electrically connected to the metal terminal 20.
  • the metal terminal 20 is electrically connected to mounting terminals 54 (54a, 54b) protruding from the other side surface of the flange portion 52. Thereby, the mounting terminals 54 a and 54 b are electrically connected to each other through the wire 12.
  • the mounting terminal 54 of the present embodiment is formed in a plate shape that protrudes outward from the flange portion 52 in the axial direction. As shown in FIG. 4, the electronic component 10 is sealed with a mold resin 56 while only the mounting terminals 54 a and 54 b are exposed. The mounting terminals 54 a and 54 b are folded back so as to abut on a bottom surface 57 that is one surface of a substantially rectangular parallelepiped mold resin 56. Thereby, the surface-mount type electronic component 10 having the bottom surface 57 of the mold resin 56 as the mounting surface is manufactured.
  • the metal terminal 20 is obtained by melting the terminal member 26 shown in FIG. 3 by arc heat at the time of arc welding into a substantially spherical molten metal lump, which is further cooled and hardened to form a lump portion 22.
  • the metal terminal 20 of this embodiment is comprised only by the block part 22, this invention is not limited to this.
  • the metal terminal 20 may be composed of the block 22 and the unmelted terminal member 26.
  • the terminal member 26 a copper alloy such as phosphor bronze is preferably used from the viewpoint of strength and workability.
  • the terminal member 26 of this embodiment has a rectangular plate shape.
  • the terminal member 26 has a protrusion height from the flange 52 of 0.5 to 2 mm, a width along the terminal contact portion 30 of 0.2 to 1 mm, and a plate thickness of 0.05 to 0.00 mm. 5 mm.
  • the diameter of the block-shaped part 22 is 1 mm or less.
  • the diameter of the massive portion 22 means the major axis when the massive portion 22 is non-spherical.
  • a copper wire can be used for the wire 12 from the viewpoint of conductivity and winding properties.
  • the diameter of the wire 12 used in this embodiment is 0.03 to 0.05 mm.
  • the melting point of copper is generally lower than that of a copper alloy, and the thin wire 12 is easily broken by contact with the molten terminal member 26 as described above.
  • the terminal abutting portion 30 is a member that abuts against at least a part of the surface of the massive portion 22 and prevents the wire 12 except the end portion 14 and the massive portion 22 from contacting each other. That is, as shown in FIGS. 1 and 2, the wire 12 connected to the end portion 14 extends to the opposite side of the block portion 22 with the terminal contact portion 30 interposed therebetween.
  • the shape of the terminal contact portion 30 is not particularly limited, and may be a plate shape, a block shape, a film shape, or the like. More specifically, the terminal contact portion 30 of the present embodiment has a plate shape and is erected on the base portion (the flange portion 52), and the block portion 22 is formed on the main surface 32 of the terminal contact portion 30. It is formed on one side (the right front side in FIG. 2).
  • the main surface 32 of the terminal contact portion 30 refers to one or more surfaces constituting the terminal contact portion 30. It does not matter whether the shape of the main surface 32 is flat or curved. Further, the main surface 32 may be a surface having the maximum area among the surfaces constituting the terminal contact portion 30 or may be a surface having a non-maximum area.
  • the lump portion 22 is in contact with the main surface 32 of the terminal contact portion 30.
  • the block 22 may be in contact with only the main surface 32 with respect to the terminal contact portion 30, and may be in contact with the main surface 32 and the peripheral surface of the terminal contact portion 30 adjacent thereto. It may be.
  • the terminal contact part 30 of this embodiment is integrally shape
  • thermoplastic resin is preferably used from the viewpoint of moldability.
  • a liquid crystal polymer (LCP) is particularly preferably used from the viewpoints of heat resistance, high fluidity during molding, and low molding shrinkage.
  • an inorganic filler obtained by pulverizing an insulating inorganic material such as mica, silica, titanium oxide, magnesium hydroxide, or calcium carbonate may be mixed with the resin material.
  • FIGS. 5A to 5C are schematic views illustrating an example of a method for manufacturing the electronic component 10 according to the present embodiment (hereinafter sometimes referred to as the present method).
  • the method includes a melting step, a biasing step, and a cooling step.
  • the melting step part or all of the metal terminal 20 made of a metal material and having the wire 12 entangled is melted by arc heat by arc welding to form a molten metal lump 24.
  • the biasing step the molten metal lump 24 is biased to the other side of the metal terminal 20 by the regulating force of the terminal contact portion 30 made of an insulating material and provided on one side of the metal terminal 20.
  • the cooling step the biased molten metal lump 24 is cooled and hardened to form a lump 22 including a part of the wire 12.
  • the terminal member 26 and the terminal contact portion 30 that are in contact with each other are provided so as to protrude from the flange portion 52.
  • the upper end surface 28 of the terminal member 26 is located higher than the upper end surface 36 of the terminal contact portion 30.
  • the distance from the surface of the flange 52 provided with the terminal contact portion 30 is referred to as “height”.
  • the terminal member 26 and the terminal abutting portion 30 are formed so as to have substantially equal dimensions in the width direction corresponding to the depth direction of the drawing in FIG.
  • a flange portion 34 is formed extending to the other side of the main surface 32 (left side in the figure).
  • the flange portion 34 has a shape in which the upper end of the terminal contact portion 30 is folded back into an eaves shape, thereby expanding the area of the upper end surface 36 as compared to the transverse area of the base end portion of the terminal contact portion 30. is there.
  • the cross section of the metal terminal 20 and the terminal contact part 30 means a cross section cut perpendicularly to the protruding direction of the metal terminal 20.
  • the collar part 34 may be flat so that the upper end surface 36 is parallel to the collar part 52 as shown in the figure, or may be inclined in any direction. In the case of inclining, the molten metal lump 24 can be suitably guided in the direction by inclining downward from the terminal contact portion 30 toward the terminal member 26.
  • the end portion 14 of the wire 12 is wound around the terminal contact portion 30 and the metal terminal 20 together. That is, the terminal contact portion 30 functions as a binding terminal for the wire 12. As a result, the wire 12 is prevented from being loosened when the terminal member 26 is melted by the arc heat.
  • the flange portion 34 functions as a flange. For this reason, the winding looseness of the wire 12 when the terminal member 26 is not melted and when it is heated and melted is more preferably prevented.
  • a flange portion 34 is formed to project in the in-plane width direction of the main surface 32.
  • the shape of the main surface 32 may be T-shaped or cross-shaped, and the collar portion 34 may be extended in a direction intersecting the standing direction of the terminal contact portion 30.
  • it may replace with the said aspect and may protrude in both the surface directly opposite direction with respect to the main surface 32, and the in-plane width direction, and may form the collar part 34.
  • FIG. 5B is a schematic diagram showing the melting step.
  • a high voltage is applied to the arc electrode 40 in a state where the arc electrode 40 and the terminal member 26 are purged with a shielding gas (not shown). With such a high voltage, the arc electrode 40 and the terminal member 26 are electrically connected, and the shield gas becomes plasma 42 and becomes an extremely high temperature exceeding 10,000 ° C. The terminal member 26 is melted by the transmission of such ultra-high temperature arc heat.
  • the upper end surface 28 of the metal terminal 20 is higher than the upper end surface 36 of the terminal contact portion 30, that is, a position close to the arc electrode 40.
  • the terminal contact portion 30 is insulative, the arc electrode 40 and the terminal contact portion 30 are not electrically connected. In the melting process, the arc heat is not directly transmitted to the terminal contact portion 30 and the terminal member 26 receives the arc heat for a very short time. For this reason, due to the slow temperature response of the terminal contact portion 30, the terminal contact portion 30 does not melt or burn out before the terminal member 26.
  • FIG. 5C is a schematic diagram showing a biasing process and a cooling process.
  • the molten metal obtained by melting the terminal member 26 by arc heat has higher wettability with respect to the unmelted portion of the terminal member 26 than the terminal contact portion 30 which is a different material. That is, the wettability with respect to the molten metal material is lower on the upper end surface 36 of the flange 34 than the unmelted metal material. Therefore, in the biasing process, the molten metal lump 24 that is gradually melted from the upper end by the arc heat to increase in diameter is brought into contact with the terminal contact portion 30, so that the opposite side of the terminal contact portion 30. It is biased downward (right side of the figure). In this method, the melting step and the biasing step are performed simultaneously.
  • the fact that the melting step and the biasing step are performed at the same time means that some or all of the steps are performed at overlapping timing.
  • the biasing process may be performed after the melting process, or the melting process and the biasing process may be alternately repeated a plurality of times.
  • the terminal abutting portion 30 is provided with the flange 34 at the upper end, even if the molten metal lump 24 rides on the upper end surface 36 of the terminal abutting portion 30, the molten metal lump 24 remains on the flange 34. Over the terminal contact portion 30 side (left side of the figure). Then, the melting of the terminal member 26 proceeds and the molten metal mass 24 reaches the position where the wire 12 is bound, so that the wire 12 is included in the molten metal mass 24.
  • the arc electrode 40 is separated from the molten metal lump 24 or the arc voltage is stopped, whereby the molten metal lump 24 is gradually cooled and hardened to become the lump portion 22.
  • this method as shown in the figure, only a part of the upper end side of the terminal member 26 may be melted to form the lump portion 22, or as shown in FIGS. The entire length of the portion protruding from 52 (protruding portion) may be melted to form the massive portion 22.
  • the wire 12 entangled with the terminal contact portion 30 is pulled out in the direction opposite to the terminal member 26, that is, in the extending direction of the flange portion 34. . Thereby, even if the molten metal lump 24 falls from the terminal member 26 to the base portion (the flange portion 52), the wire 12 does not come into contact with the molten metal lump 24 and is not thermally damaged.
  • This method provides a method for manufacturing the electronic component 10 with a high yield without causing thermal damage to the wires 12 and other copper wires. Moreover, since the electronic component 10 obtained by this method has high reproducibility of the formation position of the block portion 22, it is excellent in dimensional stability and is well sealed by the mold resin 56 and is excellent in electrical characteristics and durability.
  • FIGS. 6A and 6B are partial perspective views showing a second embodiment of the present invention.
  • FIG. 2A shows a state in which the rod-shaped terminal member 26 is provided so as to protrude from the base portion (the flange portion 52).
  • FIG. 2B shows the electronic component 10 of the present embodiment formed by arc welding the terminal member 26 and the end portion 14 of the wire 12.
  • the cross-sectional shape of the terminal contact portion 30 is a U-shape.
  • the concave groove 38 of the terminal contact portion 30 extends in the protruding direction from the flange portion 52.
  • a rod-shaped terminal member 26 is fitted into the concave groove 38.
  • the terminal contact portion 30 is attached to the peripheral surface of the rod-shaped terminal member 26 excluding the front surface 29 corresponding to the left front side of FIG.
  • the prismatic terminal member 26 is illustrated, but a cylindrical terminal member 26 may be used instead.
  • the terminal contact portion 30 may be formed in a half-cylindrical shape, and the terminal member 26 may be attached to the inner surface thereof.
  • a surface facing the same direction as the front surface 29 of the terminal member 26 is referred to as a main surface 32.
  • the end portion 14 of the wire 12 is wound around the terminal member 26 and the terminal contact portion 30.
  • the molten metal block 24 formed by arc melting of the terminal member 26 is formed to be biased toward the front surface 29 due to the regulating force of the terminal contact portion 30. Then, the molten metal block 24 is cooled and hardened to form the block portion 22 in contact with the main surface 32 of the terminal contact portion 30.
  • the wire 12 extends to the opposite side of the block portion 22 with the terminal contact portion 30 interposed therebetween.
  • the wire 12 is a molten metal block except for the end portion 14 entangled with the terminal contact portion 30. No contact with 24. Thereby, also in the electronic component 10 of this embodiment, the heat damage of the wire 12 is prevented.
  • the terminal contact portion 30 has a plate shape, but the present invention is not limited to this.
  • the terminal contact portion 30 may be any member that guides the flow of the molten metal lump 24 in which the terminal member 26 is arc-melted in a predetermined direction, and the shape and arrangement position thereof are not limited.
  • the terminal contact portion 30 may be formed in a film shape that covers a part of the terminal member 26. That is, as the terminal contact portion 30 after arc welding, a film shape covering at least a part of the block portion 22 may be formed.
  • FIG. 7 (a) and 7 (b) are partial side views showing the third embodiment of the present invention.
  • FIG. 2A shows a state in which the rod-shaped terminal member 26 is provided so as to protrude from the base portion (the flange portion 52).
  • FIG. 2B shows the electronic component 10 of this embodiment formed by arc welding the terminal member 26 to the end portion 14 of the wire 12.
  • a heat-resistant insulating film is formed as the terminal contact portion 30 on one side surface of the terminal member 26 protruding from the base portion (the flange portion 52). Therefore, of the insulating film, the surface to be attached to the terminal member 26 becomes the main surface 32 of the terminal contact portion 30.
  • the insulating film organic insulating films such as polyurethane and enamel, and inorganic films such as flexible ceramics can be used.
  • the film thickness of an insulating film is not specifically limited.
  • the insulating film may be provided so as to cover the entire surface of one side surface of the terminal member 26 or may be provided so as to be partially covered.
  • the terminal contact part 30 of this embodiment may be connected to the base part (the collar part 52), or may be provided apart from the collar part 52.
  • the heat transfer from the terminal member 26 that has received the arc heat to the terminal contact portion 30 is delayed more than the heat conduction in the terminal member 26.
  • the terminal contact portion 30, which is an insulating film is not melted and follows the molten metal lump 24 while applying a regulating force to the molten metal lump 24. And deformed (see FIG. 7B).
  • the terminal contact portion 30 of the present embodiment forms the molten metal block 24 by being biased in the direction perpendicular to the main surface 32 (to the right in FIG. 5B).
  • the mass portion 22 is always stably formed in the direction.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Butt Welding And Welding Of Specific Article (AREA)
  • Coils Of Transformers For General Uses (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)

Abstract

An electronic component (10) comprises a wire (12) extending to the opposite side of a lump portion (22) while nipping a terminal abutting portion (30), a metal terminal (20) made of a metal material and having the lump portion (22) including the end (14) of the wire (12), a base portion (flange portion (52)) for supporting the metal terminal (20), and the terminal abutting portion (30) made of an insulating material to abut against at least a part of the surface of the lump portion (22) and molded integrally with the flange portion (52) of a common insulating material. Its manufacturing method is also provided.

Description

電子部品および電子部品の製造方法Electronic component and method for manufacturing electronic component
　本発明は、電子部品および電子部品の製造方法に関する。 The present invention relates to an electronic component and a method for manufacturing the electronic component.
　コイル部品に代表される電子部品において、アーク溶接を用いて金属端子とワイヤとを接合する方法が採用されている（下記特許文献１、２を参照）。
　アーク溶接は、溶接母材である金属端子と溶接電極との間に超高温のアークを発生させて金属端子を溶融し、これに絡げられていたワイヤを接合する方法である。
　ここで、特許文献２には、アークにより溶融した溶融金属塊にガス圧などの外力を付与してこれを金属端子の一方側に強制的に偏らせることにより、溶接後の電子部品の寸法安定性を図る溶接方法の発明が記載されている。 In an electronic component typified by a coil component, a method of joining a metal terminal and a wire using arc welding is employed (see Patent Documents 1 and 2 below).
Arc welding is a method in which an ultra-high temperature arc is generated between a metal terminal, which is a welding base material, and a welding electrode to melt the metal terminal and join the wires that have been entangled therewith.
Here, in Patent Document 2, external force such as gas pressure is applied to a molten metal lump melted by an arc, and this is forcibly biased to one side of a metal terminal, thereby dimensional stability of an electronic component after welding. The invention of the welding method which aims at property is described.
特開２００６－１５６９１７号公報JP 2006-156917 A 特開平１１－３２００８９号公報JP-A-11-320089
　しかしながら、近年の電子部品の小型化により、ワイヤ径や金属端子の寸法は益々小さくなっている。このため、特許文献２に記載の方法のように、アーク熱を受けた溶融金属塊に対して的確に外力を与えてこれを所望の位置で冷却硬化させることは困難となっている。
　ここで、溶融金属塊が所望の位置を外れた場合、電子部品としての外形寸法が不安定になるのみならず、金属端子に絡げられたワイヤまたはその他の銅線を溶融して破断させることが問題となる。 However, with the recent miniaturization of electronic components, wire diameters and metal terminal dimensions are becoming smaller. For this reason, as in the method described in Patent Document 2, it is difficult to accurately apply an external force to the molten metal block subjected to arc heat and to cool and harden it at a desired position.
Here, when the molten metal lump deviates from the desired position, not only the outer dimensions of the electronic component become unstable, but also the wire or other copper wire entangled with the metal terminal is melted and broken. Is a problem.
　本発明は上記課題に鑑みてなされたものであり、金属端子やワイヤの寸法によらず溶融金属塊を所望の位置に形成し、高い寸法安定性および歩留まりを実現することのできる電子部品、およびその製造方法を提供するものである。 The present invention has been made in view of the above problems, and an electronic component capable of forming a molten metal lump at a desired position regardless of the dimensions of a metal terminal or a wire and realizing high dimensional stability and yield, and The manufacturing method is provided.
　本発明の電子部品は、ワイヤと、
　金属材料からなり前記ワイヤの端部を内包する塊状部を備える金属端子と、
　前記金属端子を支持するベース部と、
　絶縁材料からなり前記塊状部の表面の少なくとも一部に対して当接する端子当接部と、
を有する。 The electronic component of the present invention includes a wire,
A metal terminal made of a metal material and having a lump portion including the end of the wire;
A base portion for supporting the metal terminal;
A terminal abutting portion made of an insulating material and abutting against at least a part of the surface of the massive portion;
Have
　また、本発明の電子部品は、前記端部に連なる前記ワイヤが、前記端子当接部を挟んで前記塊状部の反対側に延在していてもよい。 In the electronic component of the present invention, the wire connected to the end portion may extend to the opposite side of the block portion with the terminal contact portion interposed therebetween.
　また、本発明の電子部品は、前記端子当接部が、板状をなすとともに前記ベース部に立設されており、
　前記塊状部が、前記端子当接部の主面の一方側に形成されていてもよい。 Further, in the electronic component of the present invention, the terminal contact portion has a plate shape and is erected on the base portion.
The lump portion may be formed on one side of the main surface of the terminal contact portion.
　また、本発明の電子部品は、前記端子当接部の上端に、前記主面の他方側に伸びる庇部が形成されていてもよい。 Further, in the electronic component of the present invention, a collar portion extending to the other side of the main surface may be formed at the upper end of the terminal contact portion.
　また、本発明の電子部品は、溶融した前記金属材料に対する濡れ性が、未溶融の前記金属材料よりも前記庇部の上端面においてより低くてもよい。 Further, the electronic component of the present invention may have lower wettability with respect to the molten metal material on the upper end surface of the flange than the unmelted metal material.
　また、本発明の電子部品は、前記ワイヤの前記端部が、前記端子当接部および前記金属端子に対してともに巻回されていてもよい。 In the electronic component of the present invention, the end of the wire may be wound around the terminal contact portion and the metal terminal.
　また、本発明の電子部品は、前記ベース部と前記端子当接部とが、共通の前記絶縁材料により一体に成形されていてもよい。 Further, in the electronic component of the present invention, the base part and the terminal contact part may be integrally formed of the common insulating material.
　また、本発明の電子部品は、前記端子当接部が、前記塊状部の少なくとも一部を覆う膜状をなしてもよい。 Moreover, in the electronic component of the present invention, the terminal contact portion may have a film shape covering at least a part of the lump portion.
　また、本発明の電子部品は、前記塊状部の直径が１ｍｍ以下であってもよい。 Further, in the electronic component of the present invention, the lump portion may have a diameter of 1 mm or less.
　また本発明の電子部品の製造方法は、金属材料からなりワイヤが絡げられた金属端子の一部または全部を、アーク溶接によるアーク熱により溶融させて溶融金属塊を形成する工程と、
　絶縁材料からなり前記金属端子の一方側の側方に設けられた端子当接部の規制力により、前記溶融金属塊を前記金属端子の他方側の側方に偏倚させる工程と、
　偏倚した前記溶融金属塊を冷却硬化させて、前記ワイヤの一部を内包する塊状部を形成する工程と、
を含む。 Further, the method of manufacturing an electronic component of the present invention includes a step of melting a part or all of a metal terminal made of a metal material and entangled with a wire by arc heat by arc welding to form a molten metal lump,
A step of biasing the molten metal mass to the side of the other side of the metal terminal by a regulating force of a terminal contact portion made of an insulating material and provided on the side of the metal terminal;
Cooling and hardening the biased molten metal lump to form a lump that encloses part of the wire; and
including.
　なお、本発明の各種の構成要素は、必ずしも個々に独立した存在である必要はなく、複数の構成要素が一個の部材として形成されていること、一つの構成要素が複数の部材で形成されていること、ある構成要素が他の構成要素の一部であること、ある構成要素の一部と他の構成要素の一部とが重複していること、等でもよい。
　また、本発明では前後左右上下の方向を規定する場合があるが、これは本発明の構成要素の相対関係を簡単に説明するために便宜的に規定したものであって、重力方向の上下とは必ずしも対応するものではない。 The various components of the present invention do not necessarily have to be independent of each other. A plurality of components are formed as a single member, and a single component is formed of a plurality of members. It may be that a certain component is a part of another component, a part of a certain component overlaps with a part of another component, or the like.
Further, in the present invention, there are cases where the front-rear, left-right, up-down directions are defined, but this is defined for convenience in order to briefly explain the relative relationship between the components of the present invention. Does not necessarily correspond.
　さらに、本発明の電子部品の製造方法は、複数の工程により記載されているが、その記載の順番は複数の工程を実行する順番を必ずしも限定するものではない。また、本発明の電子部品の製造方法は、複数の工程が個々に相違するタイミングで実行されることに限定されず、ある工程の実行中に他の工程が発生すること、ある工程の実行タイミングと他の工程の実行タイミングとの一部ないし全部が重複していること、等でもよい。 Furthermore, although the electronic component manufacturing method of the present invention is described in a plurality of steps, the description order does not necessarily limit the order in which the plurality of steps are performed. In addition, the electronic component manufacturing method of the present invention is not limited to the case where a plurality of steps are executed at different timings, and other steps are generated during the execution of a step, and the execution timing of a step. And some or all of the execution timings of other processes may overlap.
　本発明によれば、絶縁性ゆえアーク熱を受けない端子当接部の存在のため、アーク熱で溶融した金属端子が、端子当接部の反対側に安定して塊状部を形成する。これにより、高熱の塊状部が銅線を破断する恐れがなく、高い歩留まりの電子部品を実現することができる。また、本発明によれば、塊状部の形成位置の再現性が向上するため、寸法安定性に優れる電子部品が提供される。そして、上記効果は金属端子やワイヤの寸法によることがないため、電子部品が益々小型化しても変わらずにこれを奏することができる。 According to the present invention, because of the presence of the terminal contact portion that does not receive arc heat due to insulation, the metal terminal melted by the arc heat stably forms a lump on the opposite side of the terminal contact portion. Thereby, there is no possibility that the high-heated lump portion breaks the copper wire, and a high-yield electronic component can be realized. Further, according to the present invention, since the reproducibility of the formation position of the massive portion is improved, an electronic component having excellent dimensional stability is provided. And since the said effect does not depend on the dimension of a metal terminal or a wire, even if an electronic component is miniaturized more and more, this can be show | played without changing.
本発明の実施形態にかかる電子部品の一例を示す斜視図である。It is a perspective view which shows an example of the electronic component concerning embodiment of this invention. 図１において破線IIにて示した領域の拡大図である。FIG. 2 is an enlarged view of a region indicated by a broken line II in FIG. 金属端子とワイヤとがアーク溶接される前の状態を示す斜視図である。It is a perspective view which shows the state before a metal terminal and a wire are arc-welded. 電子部品をモールド樹脂により封止した状態を示す斜視図である。It is a perspective view which shows the state which sealed the electronic component with mold resin. （ａ）から（ｃ）は本実施形態にかかる電子部品の製造方法の一例を示す模式図である。(A) to (c) is a schematic diagram showing an example of a method of manufacturing an electronic component according to the present embodiment. （ａ），（ｂ）は、本発明の第二実施形態を示す部分斜視図である。(A), (b) is a fragmentary perspective view which shows 2nd embodiment of this invention. （ａ），（ｂ）は、本発明の第三実施形態を示す部分側面図である。(A), (b) is a partial side view which shows 3rd embodiment of this invention.
　以下、本発明の実施形態を図面に基づいて説明する。尚、すべての図面において、同様な構成要素には同様の符号を付し、適宜説明を省略する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.
＜第一実施形態＞
（電子部品）
　図１は、本発明の第一実施形態にかかる電子部品１０の一例を示す斜視図である。ただし同図では、巻回されたワイヤ１２の一部を切り欠いて巻芯部５０を図示している。図２は、図１において破線IIにて示した領域の拡大図である。
　また、図３は、金属端子２０とワイヤ１２とがアーク溶接される前の状態を示す斜視図であり、図２に対応している。
　そして、図４は、図１に示す電子部品１０をモールド樹脂５６により封止した状態を示す斜視図である。 <First embodiment>
(Electronic parts)
FIG. 1 is a perspective view showing an example of an electronic component 10 according to the first embodiment of the present invention. However, in the drawing, a part of the wound wire 12 is cut out to show the core part 50. FIG. 2 is an enlarged view of a region indicated by a broken line II in FIG.
FIG. 3 is a perspective view showing a state before the metal terminal 20 and the wire 12 are arc-welded, and corresponds to FIG.
4 is a perspective view showing a state in which the electronic component 10 shown in FIG.
　まず、本実施形態の電子部品１０の概要について説明する。
　本実施形態の電子部品１０は、ワイヤ１２と、金属材料からなりワイヤ１２の端部１４を内包する塊状部２２を備える金属端子２０と、金属端子２０を支持するベース部（鍔部５２）と、絶縁材料からなり塊状部２２の表面の少なくとも一部に対して当接する端子当接部３０と、を有する。 First, the outline | summary of the electronic component 10 of this embodiment is demonstrated.
The electronic component 10 of the present embodiment includes a wire 12, a metal terminal 20 that is made of a metal material and includes a massive portion 22 that encloses the end portion 14 of the wire 12, and a base portion (a flange portion 52) that supports the metal terminal 20. And a terminal abutting portion 30 made of an insulating material and abutting against at least a part of the surface of the lump portion 22.
　次に、本実施形態の電子部品１０についてより詳細に説明する。
　電子部品１０は、巻芯部５０にワイヤ１２が巻回されたコイル部品である。
　巻芯部５０は、図１の左手前側から右奥行側に伸びる棒状をなし、その両端にそれぞれ略直方体状の鍔部５２（５２ａ，５２ｂ）が設けられている。巻芯部５０はフェライトやアモルファス材料などの強磁性材料からなる。 Next, the electronic component 10 of this embodiment will be described in more detail.
The electronic component 10 is a coil component in which the wire 12 is wound around the core portion 50.
The winding core portion 50 has a rod shape extending from the left front side in FIG. 1 to the right depth side, and substantially rectangular parallelepiped flange portions 52 (52a, 52b) are provided at both ends thereof. The core 50 is made of a ferromagnetic material such as ferrite or amorphous material.
　鍔部５２は、巻芯部５０とは異なる絶縁性の樹脂材料からなる。鍔部５２は一の面である装着面５１に装着穴（図示せず）が穿設されている。鍔部５２は、装着穴に対して巻芯部５０の端部を挿入することにより、巻芯部５０の両端にそれぞれ装着されている。 The collar portion 52 is made of an insulating resin material different from the core portion 50. The flange portion 52 has a mounting hole (not shown) formed in the mounting surface 51 which is one surface. The flange portions 52 are respectively attached to both ends of the core portion 50 by inserting the end portions of the core portion 50 into the mounting holes.
　本実施形態の金属端子２０は、鍔部５２のうち、装着面５１とは異なる他の側面より突出して設けられている。すなわち、本実施形態の金属端子２０においては、鍔部５２が、金属端子２０を支持するベース部にあたる。
　ワイヤ１２は、巻芯部５０に多数巻回されるとともに、両端がそれぞれ塊状部２２に内包されることにより金属端子２０に電気的に接続されている。
　金属端子２０は、鍔部５２の他の側面から突出した実装端子５４（５４ａ，５４ｂ）と電気的に接続されている。これにより、実装端子５４ａ，５４ｂはワイヤ１２を介して互いに電気的に導通している。 The metal terminal 20 of the present embodiment is provided so as to protrude from the other side surface of the flange portion 52 different from the mounting surface 51. That is, in the metal terminal 20 of the present embodiment, the flange portion 52 corresponds to a base portion that supports the metal terminal 20.
A large number of wires 12 are wound around the core 50, and both ends are encased in the block 22 and are electrically connected to the metal terminal 20.
The metal terminal 20 is electrically connected to mounting terminals 54 (54a, 54b) protruding from the other side surface of the flange portion 52. Thereby, the mounting terminals 54 a and 54 b are electrically connected to each other through the wire 12.
　本実施形態の実装端子５４は、鍔部５２より軸方向の両外側に突出する板状に形成されている。図４に示すように、電子部品１０は、実装端子５４ａ，５４ｂのみを露出させてモールド樹脂５６により封止される。そして、実装端子５４ａ，５４ｂは、略直方体状のモールド樹脂５６の一の面である底面５７に当接するように折り返される。これにより、モールド樹脂５６の底面５７を実装面とする表面実装型の電子部品１０が作製される。 The mounting terminal 54 of the present embodiment is formed in a plate shape that protrudes outward from the flange portion 52 in the axial direction. As shown in FIG. 4, the electronic component 10 is sealed with a mold resin 56 while only the mounting terminals 54 a and 54 b are exposed. The mounting terminals 54 a and 54 b are folded back so as to abut on a bottom surface 57 that is one surface of a substantially rectangular parallelepiped mold resin 56. Thereby, the surface-mount type electronic component 10 having the bottom surface 57 of the mold resin 56 as the mounting surface is manufactured.
　金属端子２０は、図３に示す端子部材２６を、アーク溶接時のアーク熱により溶融して略球状の溶融金属塊とし、さらにこれを冷却硬化させて塊状部２２としたものである。
　本実施形態の金属端子２０は塊状部２２のみにより構成されているが、本発明はこれに限られない。後述する図５に示すように、塊状部２２および未溶融の端子部材２６とから金属端子２０が構成されてもよい。 The metal terminal 20 is obtained by melting the terminal member 26 shown in FIG. 3 by arc heat at the time of arc welding into a substantially spherical molten metal lump, which is further cooled and hardened to form a lump portion 22.
Although the metal terminal 20 of this embodiment is comprised only by the block part 22, this invention is not limited to this. As shown in FIG. 5 to be described later, the metal terminal 20 may be composed of the block 22 and the unmelted terminal member 26.
　端子部材２６には、強度や加工性などの観点から、リン青銅などの銅合金が好適に用いられる。
　本実施形態の端子部材２６は矩形板状をなしている。端子部材２６の寸法は、一例として、鍔部５２からの突出高さが０．５～２ｍｍ、端子当接部３０に沿う幅寸法は０．２～１ｍｍ、板厚は０．０５～０．５ｍｍである。
　そして、塊状部２２の直径は１ｍｍ以下である。ここで、塊状部２２の直径とは、塊状部２２が非球形の場合はその長径を意味する。 For the terminal member 26, a copper alloy such as phosphor bronze is preferably used from the viewpoint of strength and workability.
The terminal member 26 of this embodiment has a rectangular plate shape. As an example, the terminal member 26 has a protrusion height from the flange 52 of 0.5 to 2 mm, a width along the terminal contact portion 30 of 0.2 to 1 mm, and a plate thickness of 0.05 to 0.00 mm. 5 mm.
And the diameter of the block-shaped part 22 is 1 mm or less. Here, the diameter of the massive portion 22 means the major axis when the massive portion 22 is non-spherical.
　ワイヤ１２には、導電性と巻回性の観点から銅線を用いることができる。本実施形態で用いられるワイヤ１２の直径は０．０３～０．０５ｍｍである。
　ここで、銅は銅合金に比べて一般に融点が低く、また、上記の如く細径のワイヤ１２は、溶融した端子部材２６との接触により容易に破断する。 A copper wire can be used for the wire 12 from the viewpoint of conductivity and winding properties. The diameter of the wire 12 used in this embodiment is 0.03 to 0.05 mm.
Here, the melting point of copper is generally lower than that of a copper alloy, and the thin wire 12 is easily broken by contact with the molten terminal member 26 as described above.
　端子当接部３０は、塊状部２２の表面の少なくとも一部に対して当接して、端部１４を除くワイヤ１２と塊状部２２とが互いに接触することを防止する部材である。
　すなわち、図１、２に示すように、端部１４に連なるワイヤ１２は、端子当接部３０を挟んで塊状部２２の反対側に延在している。 The terminal abutting portion 30 is a member that abuts against at least a part of the surface of the massive portion 22 and prevents the wire 12 except the end portion 14 and the massive portion 22 from contacting each other.
That is, as shown in FIGS. 1 and 2, the wire 12 connected to the end portion 14 extends to the opposite side of the block portion 22 with the terminal contact portion 30 interposed therebetween.
　端子当接部３０の形状は特に限定されず、板状、ブロック状または膜状などをとることができる。より具体的に、本実施形態の端子当接部３０は、板状をなすとともにベース部（鍔部５２）に立設されており、塊状部２２は、端子当接部３０の主面３２の一方側（図２における右手前側）に形成されている。
　ここで、端子当接部３０の主面３２とは、端子当接部３０を構成する一つまたは複数の面をいう。主面３２の形状は平面状であるか曲面状であるかを問わない。また、主面３２は、端子当接部３０を構成する面のうち最大面積の面であってもよく、非最大面積の面であってもよい。 The shape of the terminal contact portion 30 is not particularly limited, and may be a plate shape, a block shape, a film shape, or the like. More specifically, the terminal contact portion 30 of the present embodiment has a plate shape and is erected on the base portion (the flange portion 52), and the block portion 22 is formed on the main surface 32 of the terminal contact portion 30. It is formed on one side (the right front side in FIG. 2).
Here, the main surface 32 of the terminal contact portion 30 refers to one or more surfaces constituting the terminal contact portion 30. It does not matter whether the shape of the main surface 32 is flat or curved. Further, the main surface 32 may be a surface having the maximum area among the surfaces constituting the terminal contact portion 30 or may be a surface having a non-maximum area.
　塊状部２２は、端子当接部３０の主面３２と接触している。また、塊状部２２は、端子当接部３０に対して主面３２のみに対して接触していてもよく、主面３２およびこれに隣接する端子当接部３０の周面に対して接触していてもよい。 The lump portion 22 is in contact with the main surface 32 of the terminal contact portion 30. The block 22 may be in contact with only the main surface 32 with respect to the terminal contact portion 30, and may be in contact with the main surface 32 and the peripheral surface of the terminal contact portion 30 adjacent thereto. It may be.
　なお、本実施形態の端子当接部３０は、ベース部（鍔部５２）と共通の絶縁材料により一体に成形されている。すなわち、鍔部５２および端子当接部３０は、絶縁性の樹脂材料を同時成型することにより作製される。 In addition, the terminal contact part 30 of this embodiment is integrally shape | molded by the insulating material common to a base part (saddle part 52). That is, the flange portion 52 and the terminal contact portion 30 are manufactured by simultaneously molding an insulating resin material.
　かかる樹脂材料としては、成型性の観点から熱可塑性樹脂が好適に用いられる。このうち、耐熱性および成型時の流動性の高さと、成型収縮率の低さの観点から、液晶ポリマー（ＬＣＰ）が特に好適に用いられる。
　また、当該樹脂材料には、マイカ、シリカ、酸化チタン、水酸化マグネシウムまたは炭酸カルシウムなどの絶縁性の無機材料を粉末化した無機フィラーを混合してもよい。かかる無機フィラーを樹脂材料に混合することにより、端子当接部３０の耐熱性が向上し、アーク熱により溶融する端子部材２６からの熱伝達により端子当接部３０が溶融または焼損することが防止される。 As such a resin material, a thermoplastic resin is preferably used from the viewpoint of moldability. Among these, a liquid crystal polymer (LCP) is particularly preferably used from the viewpoints of heat resistance, high fluidity during molding, and low molding shrinkage.
In addition, an inorganic filler obtained by pulverizing an insulating inorganic material such as mica, silica, titanium oxide, magnesium hydroxide, or calcium carbonate may be mixed with the resin material. By mixing such an inorganic filler with a resin material, the heat resistance of the terminal contact portion 30 is improved, and the terminal contact portion 30 is prevented from melting or burning due to heat transfer from the terminal member 26 that is melted by arc heat. Is done.
（電子部品の製造方法）
　図５（ａ）から（ｃ）は、本実施形態にかかる電子部品１０の製造方法（以下、本方法という場合がある。）の一例を示す模式図である。 (Method for manufacturing electronic parts)
FIGS. 5A to 5C are schematic views illustrating an example of a method for manufacturing the electronic component 10 according to the present embodiment (hereinafter sometimes referred to as the present method).
　まず、本方法の概要について説明する。
　本方法は、溶融工程と、偏倚工程と、冷却工程とを含む。
　溶融工程では、金属材料からなりワイヤ１２が絡げられた金属端子２０の一部または全部を、アーク溶接によるアーク熱により溶融させて溶融金属塊２４を形成する。
　偏倚工程では、絶縁材料からなり金属端子２０の一方側の側方に設けられた端子当接部３０の規制力により、溶融金属塊２４を金属端子２０の他方側の側方に偏倚させる。
　冷却工程では、偏倚した溶融金属塊２４を冷却硬化させて、ワイヤ１２の一部を内包する塊状部２２を形成する。 First, an outline of this method will be described.
The method includes a melting step, a biasing step, and a cooling step.
In the melting step, part or all of the metal terminal 20 made of a metal material and having the wire 12 entangled is melted by arc heat by arc welding to form a molten metal lump 24.
In the biasing step, the molten metal lump 24 is biased to the other side of the metal terminal 20 by the regulating force of the terminal contact portion 30 made of an insulating material and provided on one side of the metal terminal 20.
In the cooling step, the biased molten metal lump 24 is cooled and hardened to form a lump 22 including a part of the wire 12.
　次に、本方法についてより詳細に説明する。
　図５（ａ）に示すように、互いに当接する端子部材２６および端子当接部３０が、鍔部５２から突出して設けられている。端子部材２６の上端面２８は、端子当接部３０の上端面３６よりも高い位置にある。なお、本方法に関し、ことわりなき場合、端子当接部３０が設けられた鍔部５２の表面からの距離を「高さ」という。
　端子部材２６と端子当接部３０は、同図の紙面奥行方向にあたる幅方向の寸法が略等しく形成されている。 Next, this method will be described in more detail.
As shown in FIG. 5A, the terminal member 26 and the terminal contact portion 30 that are in contact with each other are provided so as to protrude from the flange portion 52. The upper end surface 28 of the terminal member 26 is located higher than the upper end surface 36 of the terminal contact portion 30. In this method, unless otherwise noted, the distance from the surface of the flange 52 provided with the terminal contact portion 30 is referred to as “height”.
The terminal member 26 and the terminal abutting portion 30 are formed so as to have substantially equal dimensions in the width direction corresponding to the depth direction of the drawing in FIG.
　端子当接部３０の上端には、主面３２の他方側（同図左方）に伸びる庇部３４が形成されている。
　庇部３４は端子当接部３０の上端を庇（ひさし）状に折り返す形状とすることにより、端子当接部３０の基端部の横断面積に比べて上端面３６の面積を拡大するものである。なお、金属端子２０および端子当接部３０の横断面とは、金属端子２０の突出方向に対して垂直に切った断面をいう。 At the upper end of the terminal contact portion 30, a flange portion 34 is formed extending to the other side of the main surface 32 (left side in the figure).
The flange portion 34 has a shape in which the upper end of the terminal contact portion 30 is folded back into an eaves shape, thereby expanding the area of the upper end surface 36 as compared to the transverse area of the base end portion of the terminal contact portion 30. is there. In addition, the cross section of the metal terminal 20 and the terminal contact part 30 means a cross section cut perpendicularly to the protruding direction of the metal terminal 20.
　庇部３４は、同図に示すように上端面３６が鍔部５２に平行するように平坦としてもよく、いずれかの方向に傾斜させてもよい。傾斜させる場合、端子当接部３０から端子部材２６に向かって下り傾斜させることにより、溶融金属塊２４を当該方向に好適に案内することができる。 The collar part 34 may be flat so that the upper end surface 36 is parallel to the collar part 52 as shown in the figure, or may be inclined in any direction. In the case of inclining, the molten metal lump 24 can be suitably guided in the direction by inclining downward from the terminal contact portion 30 toward the terminal member 26.
　ワイヤ１２の端部１４は、端子当接部３０および金属端子２０に対してともに巻回されている。
　すなわち、端子当接部３０はワイヤ１２の絡げ端子として機能する。これにより、端子部材２６がアーク熱により溶融する際にワイヤ１２が巻き弛むことが防止される。
　ここで、端子当接部３０の上端に庇部３４を設けることにより、庇部３４が鍔として機能する。このため、端子部材２６の未溶融時および加熱溶融時におけるワイヤ１２の巻き弛みがさらに好適に防止される。
　なお、端子当接部３０に対するワイヤ１２の巻き弛みを防止する観点から、本実施形態の端子当接部３０に代えて、主面３２の面内幅方向に突出して庇部３４を形成してもよい。すなわち、主面３２の形状をＴ字状や十字状として、端子当接部３０の立設方向に対する交差方向に庇部３４を延出してもよい。
　また、上記態様に代えて、主面３２に対する面直反対方向および面内幅方向の両方に突出して庇部３４を形成してもよい。 The end portion 14 of the wire 12 is wound around the terminal contact portion 30 and the metal terminal 20 together.
That is, the terminal contact portion 30 functions as a binding terminal for the wire 12. As a result, the wire 12 is prevented from being loosened when the terminal member 26 is melted by the arc heat.
Here, by providing the flange portion 34 at the upper end of the terminal contact portion 30, the flange portion 34 functions as a flange. For this reason, the winding looseness of the wire 12 when the terminal member 26 is not melted and when it is heated and melted is more preferably prevented.
In addition, from the viewpoint of preventing the wire 12 from loosening with respect to the terminal contact portion 30, instead of the terminal contact portion 30 of the present embodiment, a flange portion 34 is formed to project in the in-plane width direction of the main surface 32. Also good. In other words, the shape of the main surface 32 may be T-shaped or cross-shaped, and the collar portion 34 may be extended in a direction intersecting the standing direction of the terminal contact portion 30.
Moreover, it may replace with the said aspect and may protrude in both the surface directly opposite direction with respect to the main surface 32, and the in-plane width direction, and may form the collar part 34. FIG.
　図５（ｂ）は、溶融工程を示す模式図である。
　溶融工程では、アーク電極４０と端子部材２６とをシールドガス（図示せず）でパージした状態で、アーク電極４０に高電圧を印加する。かかる高電圧により、アーク電極４０と端子部材２６とが導通するとともに、シールドガスはプラズマ４２となって１００００℃を超える超高温となる。端子部材２６は、かかる超高温のアーク熱が伝達されて溶融する。 FIG. 5B is a schematic diagram showing the melting step.
In the melting step, a high voltage is applied to the arc electrode 40 in a state where the arc electrode 40 and the terminal member 26 are purged with a shielding gas (not shown). With such a high voltage, the arc electrode 40 and the terminal member 26 are electrically connected, and the shield gas becomes plasma 42 and becomes an extremely high temperature exceeding 10,000 ° C. The terminal member 26 is melted by the transmission of such ultra-high temperature arc heat.
　ここで、金属端子２０の上端面２８は、端子当接部３０の上端面３６よりも高い位置、すなわちアーク電極４０に近接する位置にある。また、端子当接部３０は絶縁性であるため、アーク電極４０と端子当接部３０とは導通しない。そして、溶融工程において端子当接部３０にはアーク熱が直接伝達されることがなく、また端子部材２６がアーク熱を受ける時間はきわめて短時間である。このため、端子当接部３０の温度応答の緩慢さゆえ、端子部材２６よりも先に端子当接部３０が溶融または焼損することはない。 Here, the upper end surface 28 of the metal terminal 20 is higher than the upper end surface 36 of the terminal contact portion 30, that is, a position close to the arc electrode 40. Further, since the terminal contact portion 30 is insulative, the arc electrode 40 and the terminal contact portion 30 are not electrically connected. In the melting process, the arc heat is not directly transmitted to the terminal contact portion 30 and the terminal member 26 receives the arc heat for a very short time. For this reason, due to the slow temperature response of the terminal contact portion 30, the terminal contact portion 30 does not melt or burn out before the terminal member 26.
　図５（ｃ）は、偏倚工程および冷却工程を示す模式図である。
　ここで、アーク熱により端子部材２６が溶融してなる溶融金属は、異種材料である端子当接部３０よりも、端子部材２６の未溶融部分に対する濡れ性がより高い。すなわち、溶融した金属材料に対する濡れ性は、未溶融の金属材料よりも庇部３４の上端面３６においてより低い。
　したがって、偏倚工程では、アーク熱により端子部材２６が上端から徐々に溶融して大径化してなる溶融金属塊２４が、端子当接部３０に接触することにより、端子当接部３０の反対側（同図右方）に偏って下降する。
　本方法においては、上記溶融工程と偏倚工程とを同時におこなう。ここで、溶融工程と偏倚工程が同時に行われるとは、各工程の一部または全部が重複したタイミングでおこなわれることを意味する。ただし本方法に代えて、溶融工程の後に偏倚工程をおこなってもよく、または溶融工程と偏倚工程とを交互に繰り返して複数回おこなってもよい。 FIG. 5C is a schematic diagram showing a biasing process and a cooling process.
Here, the molten metal obtained by melting the terminal member 26 by arc heat has higher wettability with respect to the unmelted portion of the terminal member 26 than the terminal contact portion 30 which is a different material. That is, the wettability with respect to the molten metal material is lower on the upper end surface 36 of the flange 34 than the unmelted metal material.
Therefore, in the biasing process, the molten metal lump 24 that is gradually melted from the upper end by the arc heat to increase in diameter is brought into contact with the terminal contact portion 30, so that the opposite side of the terminal contact portion 30. It is biased downward (right side of the figure).
In this method, the melting step and the biasing step are performed simultaneously. Here, the fact that the melting step and the biasing step are performed at the same time means that some or all of the steps are performed at overlapping timing. However, instead of this method, the biasing process may be performed after the melting process, or the melting process and the biasing process may be alternately repeated a plurality of times.
　なお、端子当接部３０には上端に庇部３４が設けられているため、仮に溶融金属塊２４が端子当接部３０の上端面３６に乗り上げたとしても、溶融金属塊２４が庇部３４を乗り越えて端子当接部３０側（同図左方）に落下することはない。
　そして、端子部材２６の溶融が進行して溶融金属塊２４がワイヤ１２の絡げ位置に至ることにより、ワイヤ１２は溶融金属塊２４に内包される。 Since the terminal abutting portion 30 is provided with the flange 34 at the upper end, even if the molten metal lump 24 rides on the upper end surface 36 of the terminal abutting portion 30, the molten metal lump 24 remains on the flange 34. Over the terminal contact portion 30 side (left side of the figure).
Then, the melting of the terminal member 26 proceeds and the molten metal mass 24 reaches the position where the wire 12 is bound, so that the wire 12 is included in the molten metal mass 24.
　冷却工程では、アーク電極４０を溶融金属塊２４より離間させるか、またはアーク電圧を停止することにより、溶融金属塊２４は徐冷され、硬化して塊状部２２となる。
　本方法においては、同図に示すように、端子部材２６の上端側の一部のみを溶融して塊状部２２としてもよく、または図１、２に示すように、端子部材２６のうち鍔部５２より突出した部分（突出部）の全長を溶融して塊状部２２としてもよい。 In the cooling step, the arc electrode 40 is separated from the molten metal lump 24 or the arc voltage is stopped, whereby the molten metal lump 24 is gradually cooled and hardened to become the lump portion 22.
In this method, as shown in the figure, only a part of the upper end side of the terminal member 26 may be melted to form the lump portion 22, or as shown in FIGS. The entire length of the portion protruding from 52 (protruding portion) may be melted to form the massive portion 22.
　図５（ａ）から（ｃ）に示すように、端子当接部３０に絡げられたワイヤ１２は、端子部材２６の反対側、すなわち庇部３４の延出方向に向かって引き出されている。これにより、溶融金属塊２４が端子部材２６からベース部（鍔部５２）に落下したとしても、ワイヤ１２が溶融金属塊２４と接触して熱損傷を受けることがない。 As shown in FIGS. 5A to 5C, the wire 12 entangled with the terminal contact portion 30 is pulled out in the direction opposite to the terminal member 26, that is, in the extending direction of the flange portion 34. . Thereby, even if the molten metal lump 24 falls from the terminal member 26 to the base portion (the flange portion 52), the wire 12 does not come into contact with the molten metal lump 24 and is not thermally damaged.
　本方法によれば、ワイヤ１２その他の銅線を熱損傷することがなく歩留まりの高い電子部品１０の製造方法が提供される。また、本方法により得られる電子部品１０は、塊状部２２の形成位置の再現性が高いため、寸法安定性に優れ、モールド樹脂５６により良好に封止されて電気特性や耐久性に優れる。 This method provides a method for manufacturing the electronic component 10 with a high yield without causing thermal damage to the wires 12 and other copper wires. Moreover, since the electronic component 10 obtained by this method has high reproducibility of the formation position of the block portion 22, it is excellent in dimensional stability and is well sealed by the mold resin 56 and is excellent in electrical characteristics and durability.
　なお、本発明は上述の実施形態に限定されるものではなく、本発明の目的が達成される限りにおける種々の変形、改良等の態様も含む。以下、本発明を実現する他の態様について説明する。 It should be noted that the present invention is not limited to the above-described embodiment, and includes various modifications and improvements as long as the object of the present invention is achieved. Hereinafter, other modes for realizing the present invention will be described.
＜第二実施形態＞
　上記第一実施形態においては、板状の端子部材２６を溶融して金属端子２０を形成しているが、本発明はこれに限られない。
　図６（ａ），（ｂ）は、本発明の第二実施形態を示す部分斜視図である。同図（ａ）は、棒状の端子部材２６がベース部（鍔部５２）より突出して設けられた状態を示している。また、同図（ｂ）は、端子部材２６とワイヤ１２の端部１４とをアーク溶接してなる本実施形態の電子部品１０を示している。 <Second embodiment>
In the first embodiment, the metal terminal 20 is formed by melting the plate-like terminal member 26, but the present invention is not limited to this.
FIGS. 6A and 6B are partial perspective views showing a second embodiment of the present invention. FIG. 2A shows a state in which the rod-shaped terminal member 26 is provided so as to protrude from the base portion (the flange portion 52). FIG. 2B shows the electronic component 10 of the present embodiment formed by arc welding the terminal member 26 and the end portion 14 of the wire 12.
　本実施形態においては、同図（ａ）に示すように、端子当接部３０の横断面形状はコ字状である。端子当接部３０の凹溝３８は鍔部５２からの突出方向に延在している。そして、凹溝３８に対して棒状の端子部材２６が嵌め込まれている。換言すると、棒状の端子部材２６のうち、同図の左手前側にあたる前面２９を除く周面に対して端子当接部３０が装着されている。
　本実施形態では、角柱状の端子部材２６を例示するが、これに代えて円柱状の端子部材２６を用いてもよい。この場合、端子当接部３０を半割円筒状に形成し、その内面に端子部材２６を装着するとよい。 In the present embodiment, as shown in FIG. 5A, the cross-sectional shape of the terminal contact portion 30 is a U-shape. The concave groove 38 of the terminal contact portion 30 extends in the protruding direction from the flange portion 52. A rod-shaped terminal member 26 is fitted into the concave groove 38. In other words, the terminal contact portion 30 is attached to the peripheral surface of the rod-shaped terminal member 26 excluding the front surface 29 corresponding to the left front side of FIG.
In the present embodiment, the prismatic terminal member 26 is illustrated, but a cylindrical terminal member 26 may be used instead. In this case, the terminal contact portion 30 may be formed in a half-cylindrical shape, and the terminal member 26 may be attached to the inner surface thereof.
　本実施形態においては、端子当接部３０の側面のうち、端子部材２６の前面２９と同一の方向を向く面を主面３２と呼称する。
　ワイヤ１２の端部１４は、端子部材２６および端子当接部３０に対して巻回されている。 In the present embodiment, of the side surfaces of the terminal contact portion 30, a surface facing the same direction as the front surface 29 of the terminal member 26 is referred to as a main surface 32.
The end portion 14 of the wire 12 is wound around the terminal member 26 and the terminal contact portion 30.
　同図（ｂ）に示すように、端子部材２６がアーク溶融してなる溶融金属塊２４は、端子当接部３０の規制力により、前面２９の側に偏倚して形成される。そして、溶融金属塊２４が冷却硬化することにより、塊状部２２が端子当接部３０の主面３２に当接して形成される。 As shown in FIG. 5B, the molten metal block 24 formed by arc melting of the terminal member 26 is formed to be biased toward the front surface 29 due to the regulating force of the terminal contact portion 30. Then, the molten metal block 24 is cooled and hardened to form the block portion 22 in contact with the main surface 32 of the terminal contact portion 30.
　本実施形態においても、ワイヤ１２は端子当接部３０を挟んで塊状部２２の反対側に延在している。これにより、端子部材２６が完全に溶融して溶融金属塊２４が鍔部５２の表面に到達したとしても、ワイヤ１２は端子当接部３０に絡げられた端部１４を除き、溶融金属塊２４と接触することがない。これにより、本実施形態の電子部品１０においても、ワイヤ１２の熱損傷が防止される。 Also in this embodiment, the wire 12 extends to the opposite side of the block portion 22 with the terminal contact portion 30 interposed therebetween. As a result, even if the terminal member 26 is completely melted and the molten metal block 24 reaches the surface of the flange 52, the wire 12 is a molten metal block except for the end portion 14 entangled with the terminal contact portion 30. No contact with 24. Thereby, also in the electronic component 10 of this embodiment, the heat damage of the wire 12 is prevented.
＜第三実施形態＞
　上記第一および第二実施形態では、端子当接部３０が板状をなしているが、本発明はこれに限られない。端子当接部３０は、端子部材２６がアーク溶融した溶融金属塊２４の流下を所定方向に案内するものであればよく、その形状および配設位置は限定されるものではない。
　例えば、端子部材２６の一部を被覆する膜状に端子当接部３０を形成してもよい。すなわち、アーク溶接後の端子当接部３０としては、塊状部２２の少なくとも一部を覆う膜状をなしてもよい。 <Third embodiment>
In the first and second embodiments, the terminal contact portion 30 has a plate shape, but the present invention is not limited to this. The terminal contact portion 30 may be any member that guides the flow of the molten metal lump 24 in which the terminal member 26 is arc-melted in a predetermined direction, and the shape and arrangement position thereof are not limited.
For example, the terminal contact portion 30 may be formed in a film shape that covers a part of the terminal member 26. That is, as the terminal contact portion 30 after arc welding, a film shape covering at least a part of the block portion 22 may be formed.
　図７（ａ），（ｂ）は、本発明の第三実施形態を示す部分側面図である。同図（ａ）は、棒状の端子部材２６がベース部（鍔部５２）より突出して設けられた状態を示している。また、同図（ｂ）は、端子部材２６をワイヤ１２の端部１４とアーク溶接してなる本実施形態の電子部品１０を示している。 7 (a) and 7 (b) are partial side views showing the third embodiment of the present invention. FIG. 2A shows a state in which the rod-shaped terminal member 26 is provided so as to protrude from the base portion (the flange portion 52). FIG. 2B shows the electronic component 10 of this embodiment formed by arc welding the terminal member 26 to the end portion 14 of the wire 12.
　本実施形態においては、ベース部（鍔部５２）から突出した端子部材２６の一の側面に、端子当接部３０として耐熱性の絶縁皮膜を形成している。したがって、かかる絶縁皮膜のうち、端子部材２６への被着面が端子当接部３０の主面３２となる。
　絶縁皮膜としては、ポリウレタン・エナメルなどの有機絶縁皮膜や、フレキシブルセラミックスなどの無機皮膜を用いることができる。なお、絶縁皮膜の膜厚は特に限定されない。 In the present embodiment, a heat-resistant insulating film is formed as the terminal contact portion 30 on one side surface of the terminal member 26 protruding from the base portion (the flange portion 52). Therefore, of the insulating film, the surface to be attached to the terminal member 26 becomes the main surface 32 of the terminal contact portion 30.
As the insulating film, organic insulating films such as polyurethane and enamel, and inorganic films such as flexible ceramics can be used. In addition, the film thickness of an insulating film is not specifically limited.
　絶縁皮膜は、端子部材２６の一の側面の全面を被覆して設けられてもよく、部分被覆して設けられてもよい。また、本実施形態の端子当接部３０は、ベース部（鍔部５２）に接続されていてもよく、または鍔部５２から離間して設けられていてもよい。 The insulating film may be provided so as to cover the entire surface of one side surface of the terminal member 26 or may be provided so as to be partially covered. Moreover, the terminal contact part 30 of this embodiment may be connected to the base part (the collar part 52), or may be provided apart from the collar part 52.
　本実施形態によれば、上記溶融工程において、アーク熱を受けた端子部材２６から端子当接部３０への熱伝達は、端子部材２６内の熱伝導よりも遅延する。これにより、端子部材２６が溶融して溶融金属塊２４となるに際して、絶縁皮膜である端子当接部３０は未溶融であり、溶融金属塊２４に規制力を与えつつ、溶融金属塊２４に追随して変形する（図７（ｂ）を参照）。 According to the present embodiment, in the melting step, the heat transfer from the terminal member 26 that has received the arc heat to the terminal contact portion 30 is delayed more than the heat conduction in the terminal member 26. As a result, when the terminal member 26 is melted into the molten metal lump 24, the terminal contact portion 30, which is an insulating film, is not melted and follows the molten metal lump 24 while applying a regulating force to the molten metal lump 24. And deformed (see FIG. 7B).
　これにより、本実施形態の端子当接部３０は、溶融金属塊２４を主面３２の面直方向（同図（ｂ）の右方）に偏倚して形成する。かかる溶融金属塊２４を冷却硬化することにより、塊状部２２は常に当該方向に安定して形成されることとなる。 Thereby, the terminal contact portion 30 of the present embodiment forms the molten metal block 24 by being biased in the direction perpendicular to the main surface 32 (to the right in FIG. 5B). By cooling and hardening the molten metal mass 24, the mass portion 22 is always stably formed in the direction.

Claims (10)

  1. 　ワイヤと、
    　金属材料からなり前記ワイヤの端部を内包する塊状部を備える金属端子と、
    　前記金属端子を支持するベース部と、
    　絶縁材料からなり前記塊状部の表面の少なくとも一部に対して当接する端子当接部と、
    を有する電子部品。     Wire,
    A metal terminal made of a metal material and having a lump portion including the end of the wire;
    A base portion for supporting the metal terminal;
    A terminal abutting portion made of an insulating material and abutting against at least a part of the surface of the massive portion;
    Having electronic components.
  2. 　前記端部に連なる前記ワイヤが、前記端子当接部を挟んで前記塊状部の反対側に延在している請求項１に記載の電子部品。 2. The electronic component according to claim 1, wherein the wire connected to the end portion extends to the opposite side of the lump portion with the terminal contact portion interposed therebetween.
  3. 　前記端子当接部が、板状をなすとともに前記ベース部に立設されており、
    　前記塊状部が、前記端子当接部の主面の一方側に形成されていることを特徴とする請求項１または２に記載の電子部品。     The terminal contact portion has a plate shape and is erected on the base portion,
    The electronic component according to claim 1, wherein the massive portion is formed on one side of the main surface of the terminal contact portion.
  4. 　前記端子当接部の上端に、前記主面の他方側に伸びる庇部が形成されていることを特徴とする請求項３に記載の電子部品。 4. The electronic component according to claim 3, wherein a flange extending to the other side of the main surface is formed at an upper end of the terminal contact portion.
  5. 　溶融した前記金属材料に対する濡れ性が、未溶融の前記金属材料よりも前記庇部の上端面においてより低いことを特徴とする請求項４に記載の電子部品。 5. The electronic component according to claim 4, wherein wettability with respect to the molten metal material is lower on the upper end surface of the flange than with the unmelted metal material.
  6. 　前記ワイヤの前記端部が、前記端子当接部および前記金属端子に対してともに巻回されている請求項１から５のいずれかに記載の電子部品。 The electronic component according to any one of claims 1 to 5, wherein the end portion of the wire is wound around the terminal contact portion and the metal terminal.
  7. 　前記ベース部と前記端子当接部とが、共通の前記絶縁材料により一体に成形されている請求項１から６のいずれかに記載の電子部品。 The electronic component according to any one of claims 1 to 6, wherein the base portion and the terminal contact portion are integrally formed of the common insulating material.
  8. 　前記端子当接部が、前記塊状部の少なくとも一部を覆う膜状をなす請求項１または２に記載の電子部品。 The electronic component according to claim 1, wherein the terminal contact portion has a film shape covering at least a part of the lump portion.
  9. 　前記塊状部の直径が１ｍｍ以下である請求項１から８のいずれかに記載の電子部品。 The electronic component according to any one of claims 1 to 8, wherein a diameter of the massive portion is 1 mm or less.
  10. 　金属材料からなりワイヤが絡げられた金属端子の一部または全部を、アーク溶接によるアーク熱により溶融させて溶融金属塊を形成する工程と、
    　絶縁材料からなり前記金属端子の一方側の側方に設けられた端子当接部の規制力により、前記溶融金属塊を前記金属端子の他方側の側方に偏倚させる工程と、
    　偏倚した前記溶融金属塊を冷却硬化させて、前記ワイヤの一部を内包する塊状部を形成する工程と、
    を含む電子部品の製造方法。     A step of melting a part or all of a metal terminal made of a metal material and having a wire entangled by arc heat by arc welding to form a molten metal mass;
    A step of biasing the molten metal mass to the side of the other side of the metal terminal by a regulating force of a terminal contact portion made of an insulating material and provided on the side of the metal terminal;
    Cooling and hardening the biased molten metal lump to form a lump that encloses part of the wire; and
    Of electronic parts including
PCT/JP2008/003030 2008-10-24 2008-10-24 Electronic component and method for manufacturing electronic component WO2010046955A1 (en)

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JP4721637B2 (en) * 2003-12-25 2011-07-13 日本発條株式会社 Conductive contact holder, conductive contact unit, manufacturing method and inspection method of conductive contact holder
TW200901245A (en) * 2007-03-14 2009-01-01 Tdk Corp Wire connecting method and wire connection arrangement
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JPH11320089A (en) * 1998-05-08 1999-11-24 Omron Corp Arc welding method of wire to terminal
JP2006156917A (en) * 2003-12-24 2006-06-15 Denso Corp Ignition coil and joining method for its secondary coil assembly

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