WO2010018998A3 - 음/전 변환 패키지 - Google Patents

음/전 변환 패키지 Download PDF

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Publication number
WO2010018998A3
WO2010018998A3 PCT/KR2009/004507 KR2009004507W WO2010018998A3 WO 2010018998 A3 WO2010018998 A3 WO 2010018998A3 KR 2009004507 W KR2009004507 W KR 2009004507W WO 2010018998 A3 WO2010018998 A3 WO 2010018998A3
Authority
WO
WIPO (PCT)
Prior art keywords
acoustic
electrical signal
signal converting
present
electrical connection
Prior art date
Application number
PCT/KR2009/004507
Other languages
English (en)
French (fr)
Other versions
WO2010018998A2 (ko
Inventor
남건우
이정훈
김기담
정갑렬
Original Assignee
주식회사 씨에스티
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 씨에스티 filed Critical 주식회사 씨에스티
Publication of WO2010018998A2 publication Critical patent/WO2010018998A2/ko
Publication of WO2010018998A3 publication Critical patent/WO2010018998A3/ko

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/02Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04Structural association of microphone with electric circuitry therefor
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/06Arranging circuit leads; Relieving strain on circuit leads
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006Interconnection of transducer parts
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003Mems transducers or their use

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Telephone Set Structure (AREA)
  • Casings For Electric Apparatus (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

본 발명은 음/전 변환 패키지에 관한 것으로, 본 발명에서는 종래 기술에 따른 음/전 변환 패키지의 구조를 대폭 개선하여, 인쇄회로기판의 일부에 매립 트랜치를 형성한 후, 이 매립 트랜치 내에, 음/전 변환 소자, 신호처리회로세트 등을 각기 매립 수용시키고, 이를 통해, 음/전 변환 소자, 신호처리회로세트 등이 인쇄회로기판의 상부 영역을 불필요하게 점유하지 않음은 물론, 루프형 전기연결 와이어를 대체할 수 있는 직선형 전기연결 패턴의 심플한 구조를 통해 상호 전기적인 연결관계까지도 유연하게 형성할 수 있도록 유도함으로써, 생산자 측에서, <음/전 변환 소자 및 신호처리회로세트의 인쇄회로기판 상부 탑재 구조에 기인하였던 여러 문제점>, <음/전 변환 소자 접착·고정용 접착제 사용에 기인하였던 여러 문제점>, <전기연결 와이어의 루프형 배치구조에 기인하였던 여러 문제점> 등을 효과적으로 해결하면서, 사용자의 욕구에 종속된 최적의 제품을 융통성 있게 생산해낼 수 있도록 가이드 할 수 있다.
PCT/KR2009/004507 2008-08-12 2009-08-12 음/전 변환 패키지 WO2010018998A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020080078917A KR20100020224A (ko) 2008-08-12 2008-08-12 음/전 변환 패키지
KR10-2008-0078917 2008-08-12

Publications (2)

Publication Number Publication Date
WO2010018998A2 WO2010018998A2 (ko) 2010-02-18
WO2010018998A3 true WO2010018998A3 (ko) 2010-06-17

Family

ID=41669488

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/004507 WO2010018998A2 (ko) 2008-08-12 2009-08-12 음/전 변환 패키지

Country Status (2)

Country Link
KR (1) KR20100020224A (ko)
WO (1) WO2010018998A2 (ko)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5629578A (en) * 1995-03-20 1997-05-13 Martin Marietta Corp. Integrated composite acoustic transducer array
JPH09199824A (ja) * 1995-11-16 1997-07-31 Matsushita Electric Ind Co Ltd プリント配線板とその実装体
JP2004200766A (ja) * 2002-12-16 2004-07-15 Karaku Denshi Kofun Yugenkoshi コンデンサーマイクロホン及びその製造方法
US20060047215A1 (en) * 2004-09-01 2006-03-02 Welch Allyn, Inc. Combined sensor assembly
KR100675023B1 (ko) * 2005-09-14 2007-01-30 주식회사 비에스이 콘덴서 마이크로폰 및 이를 위한 패키징 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5629578A (en) * 1995-03-20 1997-05-13 Martin Marietta Corp. Integrated composite acoustic transducer array
JPH09199824A (ja) * 1995-11-16 1997-07-31 Matsushita Electric Ind Co Ltd プリント配線板とその実装体
JP2004200766A (ja) * 2002-12-16 2004-07-15 Karaku Denshi Kofun Yugenkoshi コンデンサーマイクロホン及びその製造方法
US20060047215A1 (en) * 2004-09-01 2006-03-02 Welch Allyn, Inc. Combined sensor assembly
KR100675023B1 (ko) * 2005-09-14 2007-01-30 주식회사 비에스이 콘덴서 마이크로폰 및 이를 위한 패키징 방법

Also Published As

Publication number Publication date
KR20100020224A (ko) 2010-02-22
WO2010018998A2 (ko) 2010-02-18

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