WO2010014550A2 - Method and apparatus for packaging crash sensors - Google Patents

Method and apparatus for packaging crash sensors Download PDF

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Publication number
WO2010014550A2
WO2010014550A2 PCT/US2009/051849 US2009051849W WO2010014550A2 WO 2010014550 A2 WO2010014550 A2 WO 2010014550A2 US 2009051849 W US2009051849 W US 2009051849W WO 2010014550 A2 WO2010014550 A2 WO 2010014550A2
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
crash sensor
inner layer
processing circuitry
Prior art date
Application number
PCT/US2009/051849
Other languages
French (fr)
Other versions
WO2010014550A3 (en
Inventor
Curt Douglas Campbell
Neil Gordon Murray, Jr.
Dion Parker
Original Assignee
Trw Automotive U.S. Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Trw Automotive U.S. Llc filed Critical Trw Automotive U.S. Llc
Priority to US13/002,696 priority Critical patent/US8966975B2/en
Priority to CN2009801292659A priority patent/CN102105335B/en
Priority to JP2011521222A priority patent/JP5685187B2/en
Priority to EP09803443.2A priority patent/EP2310232A4/en
Priority to BRPI0916519-3A priority patent/BRPI0916519B1/en
Priority to KR1020117003303A priority patent/KR101296426B1/en
Publication of WO2010014550A2 publication Critical patent/WO2010014550A2/en
Publication of WO2010014550A3 publication Critical patent/WO2010014550A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R21/00—Arrangements or fittings on vehicles for protecting or preventing injuries to occupants or pedestrians in case of accidents or other traffic risks
    • B60R21/01—Electrical circuits for triggering passive safety arrangements, e.g. airbags, safety belt tighteners, in case of vehicle accidents or impending vehicle accidents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0034—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an overmolded housing covering the PCB
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1676—Making multilayered or multicoloured articles using a soft material and a rigid material, e.g. making articles with a sealing part
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R21/00—Arrangements or fittings on vehicles for protecting or preventing injuries to occupants or pedestrians in case of accidents or other traffic risks
    • B60R21/01—Electrical circuits for triggering passive safety arrangements, e.g. airbags, safety belt tighteners, in case of vehicle accidents or impending vehicle accidents
    • B60R21/013—Electrical circuits for triggering passive safety arrangements, e.g. airbags, safety belt tighteners, in case of vehicle accidents or impending vehicle accidents including means for detecting collisions, impending collisions or roll-over
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0078—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for acceleration sensors, e.g. crash sensors, airbag sensors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer

Definitions

  • the present invention is directed to vehicle crash sensors and is more particularly direct to a method and apparatus for packaging vehicle crash sensors.
  • Such protection systems may include one or more vehicle crash sensors for detecting the occurence of a vehicle crash condition. When a vehicle crash condition is detected, the protection system may actuate an inflatable device, such as an air bag, for helping to protect an occupant of the vehicle.
  • vehicle crash sensors may include mechanical devices, such as switches, that close in response to deformation of the vehicle, The closure of the mechanical device indicates the occurrence of a vehicle crash condition.
  • Other vehicle crash sensors may include electrical devices, such as an accelerometer, for detection of a crash condition. When a processed output of the electrical device crosses a threshold level, a vehicle crash condition is determined.
  • Vehicle crash sensors for detecting a side impact to a vehicle must have particularly rapid response times as the time period for actuating an inflatable device for occupant protection during a side impact is significantly less than the time period for actuating an inflatable device for occupant protection during a front impact.
  • a crash sensor assembly includes a printed circuit board and a crash sensor mounted on the printed circuit board. At least one connector pin is mounted to the printed circuit board so as to permit external electrical communication with the crash sensor.
  • a first insert molded soft inner layer of material partially covers the printed circuit board and covers the crash sensor, and a second overmolded hard outer layer of material covers the first soft inner layer of material and bonded thereto and rigidly contacts the printed circuit board.
  • a crash sensor assembly comprising a printed circuit board; a crash sensor mounted on the printed circuit board; and processing circuitry mounted on the printed circuit board and connected to said crash sensor for processing a signal from the crash sensor. At least one connector is mounted to the printed circuit board so as to permit external electrical communication with the processing circuitry.
  • a first insert molded soft inner layer of material partially covers the printed circuit board, and covers the crash sensor, and the processing circuitry.
  • a second overmolded hard layer of material covers the first inner material and is bonded thereto and contacts the printed circuit board.
  • a method for assembling a crash sensor comprising the steps of mounting a crash sensor to a printed circuit board, mounting at least one connector to the printed circuit board so as to permit electrical communication with the crash sensor, insert molding a soft elastomeric inner layer of material to circuit board so as to partially cover the printed circuit, board and cover the crash sensor, and overmolding a hard outer layer of material over the first inner layer material and the printed circuit board.
  • a method for assembling a crash sensor comprising the steps of mounting a crash sensor to a printed circuit board, mounting processing circuitry to the printed circuit board and connecting the processing circuitry to said crash sensor for processing a signal from the crash sensor, mounting at least one connector to the printed circuit board and connecting the at least one connector to the processing circuitry to permit electrical communication with the processing circuitry, insert molding a soft elastoraeric inner layer of material to circuit board so as to partially cover the printed circuit board, and cover the crash sensor, and the processing circuitry, and ove ⁇ nolding a bard outer layer of material over the first inner layer of material and the printed circuit board.
  • Fig. 1 is a schematic diagram of a printed circuit board (“PCB") sub-assembly having a crash sensor and associated processing circuitry mounted thereon in accordance with one example embodiment of the present invention
  • Fig. 2 is schematic diagram of the PCB of Fig. 1 after it is insert molded with a first soft inner layer;
  • PCB printed circuit board
  • Fig.3 is a schematic diagram of the PCB of Fig. 1-2 insert molded with a second harder outer layer to its final design form;
  • Fig.4 is a side perspective view of the FCB of Figs. 1 -2 insert molded with a second harder outer layer to another final shape.
  • the crash sensor assembly 10 includes a primed circuit board (“PCB") 12 having a crash sensor in the form an accelerometer 14 and associated processing circuitry 16 operati vely mounted thereon.
  • PCB primed circuit board
  • the words "printed circuit board” is meant to also cover substrate, lead frame, printed wire board, armature, flex, circuits, bus bar, and. metal wire substrate and/or any device that provides interconnects between the electronic components and terminal connections for external communications.
  • Connectors 18 provide electrical connection to a vehicle bus to communicate with other actuatable restraint control circuitry of the vehicle in any known manner.
  • the crash sensor assembly 10 may be a front crash sensor, a side crash sensor, roll-over sensor, or positioned in any other known orientation so as to accomplish, a desired result.
  • the mounting location of the sensor assembly 10 can also be at any vehicle location.
  • the senor is overmolded or insert molded with a soft rubber/plastic material so as to partially surround the electronic circuit board and electronics and protect them from moisture exposure. This material also prevents thermal expansion shear damage to the electron components and their solder attachments on the circuit board. Certain, selective portions of the circuit, board remain exposed for hard contact to a hard outer shell material molded in a second process step.
  • the electronic devices such as accelerometers, resistors, capacitors and diodes are fully surrounded by the soft elastomeric plastic.
  • a hard outer shell is then molded over the first softer layer so as to bond to the inner soft rubber/plastic material to provide mechanical protection for the electron circuitry and also to transmit the crash impact pulse to the circuit board mounted accelerometer 14 because of the direct contact between the harder outer layer and the circuit board 12.
  • the hard outer shell also provides a mounting interface to the vehicle body.
  • the hard outer shell forms a continuous seamless molded structure around the electronic components that improves crash impulse acceleration force transmission from the vehicle body to the accelerometer 14.
  • the circuit board 10 is insert molded with the soft rubber/plastic elastomeric polymer (such as TPE (thermoplastic elastomer)) material 30 to coverall the components 14. 16 as shown.
  • a hard outer plastic body 40 (See Fig.4) (such as PA66 GF (polyamide 6, polyamide 66) PBT (polybutylene terephthalaie)) is bonded to the soft inner layer 30 and the circuit board 12 through an injection overmolding process.
  • the hard outer shell 40 provides the mechanical attachment to the vehicle body (not shown) and provides a vehicle wiring harness housing 50 Bonding and adhesion between the two layer materials
  • the final shape of the outer housing 40, 40' can be any desired shape.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Air Bags (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Connection Or Junction Boxes (AREA)

Abstract

A crash sensor assembly including a printed circuit board and a crash sensor mounted on the printed circuit board, At least one connector pin is mounted to the printed circuit board so as to permit external electrical communication with the crash sensor. A first insert molded soft inner layer of material partially covers the printed circuit board and covers the crash sensor, and a second overmolded hard outer layer of material covers the first soft inner layer of material and bonded thereto and rigidly contacts the printed circuit board.

Description

Related Patent Application
This application claims priority from U.S. Provisional Patent Application Serial No. 61/084,124, filed July 28, 2008, the subject matter of which is incorporated hereby incorporated by reference in its entirety.
Field of the Invention
The present invention is directed to vehicle crash sensors and is more particularly direct to a method and apparatus for packaging vehicle crash sensors.
Background of the Invention Actuatable vehicle occupant protection systems are known in the art. Such protection systems may include one or more vehicle crash sensors for detecting the occurence of a vehicle crash condition. When a vehicle crash condition is detected, the protection system may actuate an inflatable device, such as an air bag, for helping to protect an occupant of the vehicle. Certain types of vehicle crash sensors may include mechanical devices, such as switches, that close in response to deformation of the vehicle, The closure of the mechanical device indicates the occurrence of a vehicle crash condition. Other vehicle crash sensors may include electrical devices, such as an accelerometer, for detection of a crash condition. When a processed output of the electrical device crosses a threshold level, a vehicle crash condition is determined.
Vehicle crash sensors for detecting a side impact to a vehicle must have particularly rapid response times as the time period for actuating an inflatable device for occupant protection during a side impact is significantly less than the time period for actuating an inflatable device for occupant protection during a front impact. To help improve the response time of a vehicle crash sensor for sensing side impacts, it is common to locate the vehicle crash sensor at the side of the vehicle, such as on a side pillar or within the door of the vehicle. Crash sensors may be subject to harsh environmental conditions because of their mounting locations. Summary of the Invention
In accordance with one embodiment of the present invention, a crash sensor assembly includes a printed circuit board and a crash sensor mounted on the printed circuit board. At least one connector pin is mounted to the printed circuit board so as to permit external electrical communication with the crash sensor. A first insert molded soft inner layer of material partially covers the printed circuit board and covers the crash sensor, and a second overmolded hard outer layer of material covers the first soft inner layer of material and bonded thereto and rigidly contacts the printed circuit board.
In accordance with another embodiment of the present invention, a crash sensor assembly is provided comprising a printed circuit board; a crash sensor mounted on the printed circuit board; and processing circuitry mounted on the printed circuit board and connected to said crash sensor for processing a signal from the crash sensor. At least one connector is mounted to the printed circuit board so as to permit external electrical communication with the processing circuitry. A first insert molded soft inner layer of material partially covers the printed circuit board, and covers the crash sensor, and the processing circuitry. A second overmolded hard layer of material covers the first inner material and is bonded thereto and contacts the printed circuit board.
In accordance with another embodiment of the present invention, a method is provided for assembling a crash sensor comprising the steps of mounting a crash sensor to a printed circuit board, mounting at least one connector to the printed circuit board so as to permit electrical communication with the crash sensor, insert molding a soft elastomeric inner layer of material to circuit board so as to partially cover the printed circuit, board and cover the crash sensor, and overmolding a hard outer layer of material over the first inner layer material and the printed circuit board. In accordance with another embodiment of the present invention, a method is provided for assembling a crash sensor comprising the steps of mounting a crash sensor to a printed circuit board, mounting processing circuitry to the printed circuit board and connecting the processing circuitry to said crash sensor for processing a signal from the crash sensor, mounting at least one connector to the printed circuit board and connecting the at least one connector to the processing circuitry to permit electrical communication with the processing circuitry, insert molding a soft elastoraeric inner layer of material to circuit board so as to partially cover the printed circuit board, and cover the crash sensor, and the processing circuitry, and oveπnolding a bard outer layer of material over the first inner layer of material and the printed circuit board.
Brief Description of the Drawings
The foregoing and other features and advantages of the present invention will become apparent to those skilled in the art to which the present invention relates upon reading the following description with reference to the accompanying drawings, in which:
Fig. 1 is a schematic diagram of a printed circuit board ("PCB") sub-assembly having a crash sensor and associated processing circuitry mounted thereon in accordance with one example embodiment of the present invention; Fig. 2 is schematic diagram of the PCB of Fig. 1 after it is insert molded with a first soft inner layer;
Fig.3 is a schematic diagram of the PCB of Fig. 1-2 insert molded with a second harder outer layer to its final design form; and
Fig.4 is a side perspective view of the FCB of Figs. 1 -2 insert molded with a second harder outer layer to another final shape. Detailed Description
Referring to Fig. 1 , a crash sensor assembly 10, made in accordance with one example embodiment of the present invention, is shown. The crash sensor assembly 10 includes a primed circuit board ("PCB") 12 having a crash sensor in the form an accelerometer 14 and associated processing circuitry 16 operati vely mounted thereon. In this application, the words "printed circuit board" is meant to also cover substrate, lead frame, printed wire board, armature, flex, circuits, bus bar, and. metal wire substrate and/or any device that provides interconnects between the electronic components and terminal connections for external communications. Connectors 18 provide electrical connection to a vehicle bus to communicate with other actuatable restraint control circuitry of the vehicle in any known manner.
The crash sensor assembly 10 may be a front crash sensor, a side crash sensor, roll-over sensor, or positioned in any other known orientation so as to accomplish, a desired result. The mounting location of the sensor assembly 10 can also be at any vehicle location.
To environmentally protect the sensor assembly 10, the sensor is overmolded or insert molded with a soft rubber/plastic material so as to partially surround the electronic circuit board and electronics and protect them from moisture exposure. This material also prevents thermal expansion shear damage to the electron components and their solder attachments on the circuit board. Certain, selective portions of the circuit, board remain exposed for hard contact to a hard outer shell material molded in a second process step. The electronic devices, such as accelerometers, resistors, capacitors and diodes are fully surrounded by the soft elastomeric plastic. A hard outer shell is then molded over the first softer layer so as to bond to the inner soft rubber/plastic material to provide mechanical protection for the electron circuitry and also to transmit the crash impact pulse to the circuit board mounted accelerometer 14 because of the direct contact between the harder outer layer and the circuit board 12. The hard outer shell also provides a mounting interface to the vehicle body. The hard outer shell forms a continuous seamless molded structure around the electronic components that improves crash impulse acceleration force transmission from the vehicle body to the accelerometer 14.
Referring to Figs.2-4, the circuit board 10 is insert molded with the soft rubber/plastic elastomeric polymer (such as TPE (thermoplastic elastomer)) material 30 to coverall the components 14. 16 as shown. A hard outer plastic body 40 (See Fig.4) (such as PA66 GF (polyamide 6, polyamide 66) PBT (polybutylene terephthalaie)) is bonded to the soft inner layer 30 and the circuit board 12 through an injection overmolding process. The hard outer shell 40 provides the mechanical attachment to the vehicle body (not shown) and provides a vehicle wiring harness housing 50 Bonding and adhesion between the two layer materials
(soft inner layer and the hard outer layer) is an important factor in material selection.
The final shape of the outer housing 40, 40' can be any desired shape.
From the above description of the invention, those skilled in the art will perceive improvements, changes and modifications. Such improvements, changes and modifications within the skill of the art are intended to be covered by the appended claims,

Claims

Having described the invention, the following is claimed:
1. A crash sensor assembly comprising: a printed circuit board; a crash sensor mounted on the printed circuit board; at least one connector pin mounted to the printed circuit board so as to permit external electrical communication with the crash sensor; a first insert molded soft inner layer of material partially covering the printed circuit board and covering the crash sensor; and a second overmolded hard outer layer of material covering the first soft inner layer of material and bonded thereto and rigidly contacting the printed circuit board.
2. The crash sensor of claim 1 in which the soft inner layer of material is a thermoplastic elastomer,
3. The crash sensor of claim 1 in which the hard outer layer of material is a polybutyiene terephthalate.
4. A crash sensor assembly comprising: a printed circuit board; a crash sensor mounted on the printed circuit board; processing circuitry mounted on the printed circuit board and connected to said crash sensor for processing a signal from the crash sensor; at least one connector mounted to the printed circuit board so as to permit external electrical communication with the processing circuitry; a first insert molded soft inner layer of material partially covering the printed circuit board, and covering the crash sensor, and the processing circuitry; and a second overrøolded hard layer of material covering the first Inner material and bonded thereto and contacting the printed circuit board.
5. A method for assembling a crash sensor comprising the steps of: mounting a crash sensor to a printed circuit board; mounting at least one connector to the printed circuit board so as to permit electrical communication with the crash sensor; insert molding a soft elastomeric inner layer of material to circuit board so as to partially cover the printed circuit board and cover the crash sensor, and overmolding a hard outer layer of material over the first inner layer material and the printed circuit board.
6. A method for assembling a crash sensor comprising the steps of: mounting a crash sensor to a printed circuit board; mounting processing circuitry to the printed circuit board and connecting the processing circuitry to said crash sensor for processing a signal from the crash sensor; mounting at least one connector to the printed circuit board and connecting the at least one connector to the processing circuitry to permit electrical communication with the processing circuitry; insert molding a soft elastomeric inner layer of material to circuit board so as to partially cover the printed circuit board, and cover the crash sensor, and the processing circuitry; and overmolding a hard outer layer of material over the first inner layer of material and the printed circuit board.
PCT/US2009/051849 2008-07-28 2009-07-27 Method and apparatus for packaging crash sensors WO2010014550A2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US13/002,696 US8966975B2 (en) 2008-07-28 2009-07-27 Method and apparatus for packaging crash sensors
CN2009801292659A CN102105335B (en) 2008-07-28 2009-07-27 Method and apparatus for packaging crash sensors
JP2011521222A JP5685187B2 (en) 2008-07-28 2009-07-27 Method and apparatus for housing a vehicle collision sensor
EP09803443.2A EP2310232A4 (en) 2008-07-28 2009-07-27 Method and apparatus for packaging crash sensors
BRPI0916519-3A BRPI0916519B1 (en) 2008-07-28 2009-07-27 COLLISION SENSOR ASSEMBLY, AND METHOD FOR MOUNTING A COLLISION SENSOR
KR1020117003303A KR101296426B1 (en) 2008-07-28 2009-07-27 Method and apparatus for packaging crash sensors

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US8412408P 2008-07-28 2008-07-28
US61/084,124 2008-07-28

Publications (2)

Publication Number Publication Date
WO2010014550A2 true WO2010014550A2 (en) 2010-02-04
WO2010014550A3 WO2010014550A3 (en) 2010-03-25

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2009/051849 WO2010014550A2 (en) 2008-07-28 2009-07-27 Method and apparatus for packaging crash sensors

Country Status (7)

Country Link
US (1) US8966975B2 (en)
EP (1) EP2310232A4 (en)
JP (1) JP5685187B2 (en)
KR (1) KR101296426B1 (en)
CN (1) CN102105335B (en)
BR (1) BRPI0916519B1 (en)
WO (1) WO2010014550A2 (en)

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US8234034B2 (en) 2009-06-26 2012-07-31 Autoliv Asp, Inc. Enhanced electronic assembly
US20210245691A1 (en) * 2020-02-10 2021-08-12 Hyundai Mobis Co., Ltd. Airbag controller for vehicle

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US9235937B1 (en) 2013-06-05 2016-01-12 Analog Devices, Inc. Mounting method for satellite crash sensors
US9682500B2 (en) * 2013-09-30 2017-06-20 Apple Inc. Insert molded parts and methods for forming the same
US9648721B2 (en) 2014-03-06 2017-05-09 Trw Automotive U.S. Llc Apparatus for mounting a printed circuit board
US9260071B2 (en) * 2014-03-11 2016-02-16 Trw Automotive U.S. Llc Apparatus for snap mounting a crash sensor
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US10488231B2 (en) 2016-08-18 2019-11-26 Ford Global Technologies, Llc Sensor cover
USD809995S1 (en) * 2016-08-18 2018-02-13 Ford Motor Company Sensor cover
USD838230S1 (en) 2016-08-18 2019-01-15 Ford Motor Company Sensor cover
USD797646S1 (en) 2016-08-18 2017-09-19 Ford Motor Company Sensor cover
USD838231S1 (en) 2016-08-18 2019-01-15 Ford Motor Company Sensor cover
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KR20110036836A (en) 2011-04-11
KR101296426B1 (en) 2013-08-13
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BRPI0916519A2 (en) 2015-11-10
JP2011529420A (en) 2011-12-08
JP5685187B2 (en) 2015-03-18
EP2310232A2 (en) 2011-04-20
CN102105335B (en) 2013-07-24
EP2310232A4 (en) 2017-05-31
CN102105335A (en) 2011-06-22
US20110107835A1 (en) 2011-05-12
US8966975B2 (en) 2015-03-03

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