WO2009141145A1

WO2009141145A1 - Digital television receiver

Info

Publication number: WO2009141145A1
Application number: PCT/EP2009/003619
Authority: WO
Inventors: Michael Pauli
Original assignee: Novabase Digital Tv Technologies Gmbh
Priority date: 2008-05-23
Filing date: 2009-05-20
Publication date: 2009-11-26
Also published as: TWI440360B; CN102037725B; EP2124436B1; KR101194981B1; KR20110016950A; CL2009001256A1; PE20100190A1; BRPI0909581A2; AR071879A1; CN102037725A; TW201010427A; ATE554600T1; WO2009141145A4; EP2297943A1; EP2124436A1

Abstract

The present invention relates to a device for receiving digital television signals, as well as to a data processing module for digital television signals, wherein a device is provided for receiving digital television signals, with a main board and a module board port, wherein the module board port is provided on the main board, wherein the module board port exhibits an input interface, which is suitable for the one digital input data stream, and an output interface, which is suitable for an output signal, e.g., a television output signal in various forms.

Description

Digital Television Receiver

Field of Invention The invention relates to a device for receiving digital television signals, as well as to a data processing module for digital television signals.

Background of Invention

Digital television receivers (DFEG) are predominantly realized as so-called set-top boxes (STB), which can be placed in proximity to a playback device as a separate accessory, for example a conventional television with picture tubes or a modern plasma or LCD display. In principle, these STB can here consist of the functional units front end (tuner and demodulator), back end (demultiplexer, descrambler, programmable audio/video decoder, volatile RAM user memory, non-volatile NVRAM program and data memory), power supply, display and control elements (LED, infrared remote control receiver, possibly accompanied by card readers, keys, numeric or alphanumeric display), as well as various ports (power supply, high- frequency (HF) input and, if necessary, HF loop-through output, analog and/or digital video and audio outputs).

Set-top boxes are often manufactured using single-board technology, wherein all electronic components and ports are accommodated on a board. As a rule, the board here has multiple layers (4 or more layers), wherein highly integrated assemblies can be accommodated on the board, such as processors and memories as a BGA (ball grid array) or SMD (surface mounted device), as can additional semiconductors (ICs and discrete structural components) and passive components realized in SMD technology. Further, port and control components (female connectors, keys, LED/LCD displays) can be mounted using push-through technology, for example. Typical processor and memory clock frequencies range from 50 MHz to 500 MHz. Casings often consist of metal or plastic or a combination thereof. The current manufacturing process is associated with high costs for the board owing to the use of multiple layers, along with the very exacting precision requirements stemming from the port density or port spacing of the BGA and SMD components. This is associated with high investments in manufacturing technology, in particular relative to manufacturing equipment, specialized personnel qualification, and high data security requirements during the production of STB for receiving encrypted TV programs, owing to the necessary personalization in the final function test. The required high degree of automation in manufacturing a complex device often has a negative impact on the variability in selection of possible manufacturing sites.

In addition, a high technological outlay with respect to circuitry and casings is currently required to reduce emissions of parasitic, spurious electromagnetic radiation, brought about in particular by clock lines (e.g., memory clock lines).

In addition, specific set-top boxes must still be completely developed, tested and certified for each market, wherein it is virtually impossible to reuse development results on a hardware level.

Summary of Invention One object of the invention can be regarded as indicating a device for receiving digital television signals and a data processing module for digital television signals that permit a greater flexibility with regard to manufacture.

The present invention relates to a device for receiving digital television signals as well as to a data processing module for digital television signals according to the independent claims, wherein exemplary embodiments are described in the dependent claims. One embodiment of the invention provides a device for receiving digital television signals, which encompasses a main board and module board port, wherein the module board port is provided on the main board, and the module board port exhibits an input interface suitable for a digital input data stream and an output interface suitable for an output signal.

The invention enables a so-called chip on board (COB) technology, with which a module board port can be provided to lower the development, testing and certification costs, as well as the material and manufacturing costs. The modules can be manufactured, tested and personalized separately from the prefabricated product, thereby significantly lowering the data security requirements during assembly of the end product. In particular, a module can be manufactured for specific requirements, even if this involves complex manufacturing procedures. This modular structure allows for a quasi platform principle, in which a limited number of components can be combined into a much higher number of finished products, so as to in this way minimize the overall manufacturing cost for the entire product line. Further, manufacturing can be divided into high and low-complexity manufacturing segments. As a result, the entire product need not be subjected to a complex manufacturing process because the latter is only required to a limited extent, even if a majority of the manufacturing process does not even require any high complexity. In addition, a module port can also be provided for a power supply or voltage regulator.

This also makes it easy to adjust the device to varying power supply systems, for example with respect to voltage amplitude, voltage waveform, voltage type (direct or alternating voltage) or the frequency of an alternating voltage. A module port can also be realized for a front end module, on which the tuner and demodulator components can be adjusted based on the requirements for different markets, without having to change the overall design of the main board. Further, the digital clock or - A -

data lines can be shortened in this way, so that the entire arrangement emits less spurious radiation, and is also less sensitive to spurious radiation.

In an embodiment of the invention, the output signal is a baseband television output signal, e.g., an analog or digital television output signal.

In this way, signal processing can be entirely concentrated on the module up to the presence of the baseband television signal. As a result, these generally computationally intensive and also vulnerable processes can be concentrated in one area of a module.

In an embodiment of the invention, the module board port is manufactured using push-through technology.

In this way, prefabricated boards or modules can be placed on the main or carrier board without the need for an expensive assembly system. This technique can also be performed by less qualified personnel. Further, this assembly technique is robust and stable, and can also be done manually, if required.

In one embodiment of the invention, the module board port is designed using surface mounting technology.

This makes it possible to achieve a reliable bonding, which additionally exhibits a low overall height, and hence can lower the overall space required for a set-top box. Further, manufacturing can also take place with an automatic complement.

In one embodiment of the invention, the main board is a single-layer board. In this case, for example, the conductor plane can be provided on the bottom side of the board using push-through technology, or the conductor plane can be provided on the top side of the board using surface mounting technology.

Such a single-layer board is much easier to handle during manufacture and costs less to manufacture than a multi-layer board.

One embodiment of the invention provides a data processing module for digital television signals comprising a module board and an assembly group suitable for digital processing relative to digital television signals, wherein the module board exhibits an input interface suitable for a digital input stream, and an output interface suitable for an output signal, wherein the assembly exhibits an input connected with the input interface, and an output connected with the output interface.

In this way, for example, BGA/SMD as components can be concentrated on separate conductor boards or modules, and the modules can then be mounted on a main board, e.g., by means of bonding using push-through technology. In like manner, a tuner and demodulation assembly group can be designed as a module mounted with push- through technology, for example, the demodulated digital output signal of which is supplied to the assembly group on the module board as a serial data stream or to the digital signal, data processing and decoding assembly group via corresponding circuit-board conductors on the main board. Further, the power supply assembly group can be designed as a module mounted with push-through technology, so as to provide for at least a secondary voltage in the low- voltage range.

In an embodiment of the invention, the assembly group exhibits at least one structural unit from a group comprised of a data processor, a RAM memory, a flash memory and a smart card processor. This makes it possible to shorten the digital clock or data lines, as a result of which the entire arrangement emits less spurious radiation and is less sensitive to spurious radiation. In addition, no broadband and parallel data buses need be provided on the main board other than simple, serial digital data and control signals. Therefore, the complex wiring remains confined to the module board.

In an embodiment of the invention, the data processor exhibits at least one structural unit from a group comprised of a demultiplexer, a descrambler, a decryption device, an MPEG decoder and a digital/analog converter.

In this way, the digital signal, data processing and decoding assembly group can be accommodated on the module board, wherein the module can be designed as a module mounted with push-through technology, for example, and can exhibit all functional units required for signal processing, data storage, control, decrypting, decoding and digital-analog conversion. Such modules can be prefabricated, to enable their subsequent placement on the carrier or main board without any major outlay.

In an embodiment of the invention, the assembly group is at least partially accommodated on the module board using chip on board technology.

This makes it possible to greatly reduce the overall height, in addition to the wire path length, which are largely also responsible for disturbances. Undesired but unavoidable spurious radiation can here be greatly diminished, eliminating the need for screening measures. The cost and assembly outlay can be decreased as a result. Once fabricated, the assembly groups generally exhibit no more bonding problems, in particular if lacquered or cast. In an embodiment of the invention, at least a portion of the assembly group is cast on the module board. In another embodiment of the invention, several chips or dies are cast under a piece of casting compound.

As a result, the ports of safety-relevant assemblies are not exposed to unauthorized access. This is relevant in particular for access authorizations and keys, which are used to legitimize program access. Destroying the casting generally also destroys the bonding, thereby preventing access to safety-relevant information.

In an embodiment of the invention, the module board is a multi-layer board.

This makes it possible to also place and bond highly integrated assemblies on the module board. Multi-ply or multi-layer board structures are often already necessary for the ports of some assemblies just so that the large number of contact pieces can be connected. The multi-layer board configuration can be restricted to the module to limit the scope of complex manufacturing processes to the module.

In an embodiment of the invention, at least a portion of the assembly group is enveloped by a screen in such a way as to lower electromagnetic interferences on this portion of the assembly group.

Even though a chip on board (COB) technology proposed according to the present invention can also reduce interference to such an extent as to eliminate the need for screening measures, this approach involving local screening makes it possible to achieve a further, significant reduction in parasitic, spurious radiation, specifically for the sensitive assemblies, without having the screen the entire set-top box. In other words, any necessary protective measures against spurious radiation can be restricted to the module, e.g., in the form of a small and highly efficient screen, and no longer have to be extended to the entire main board.

One embodiment of the invention provides a device according to the invention for receiving digital television signals, with a data processing module according to the invention for digital television signals.

In this way, the modularized structure makes it possible to minimize the number of required module bonding points of the assembly group on the module board or the digital signal, data processing and decoding assembly group, e.g., to the bonding points needed for power supply, bonding points for taking the demodulated digital output signal of the digital signal, data processing and decoding assembly group, bonding points for outputting the decoded audio and video signals, bonding points for controlling the digital signal, data processing and decoding assembly group, or bonding points for connecting additional functional units. For example, the latter can be discretely mounted directly on the main board, e.g., using push-through technology, for example a reader for smart cards, an infrared receiver or a key strip. In other words, the highly integrated assemblies can be wired with each other on the module level, and the module can be secured via a few bonding points.

In an embodiment of the invention, the number of layers in the main board is lower than the number of layers in the module board.

This makes it possible to lower the costs for manufacturing the main board and assembling the end product, since only those areas or module boards that accommodate correspondingly highly integrated assemblies have to be fabricated using multi-layer technology. The main board that often has a significantly greater surface density can be designed with one or two layers, for example, while the module board significantly smaller by comparison can also exhibit four or more layers, depending on requirements. This holds true analogously for interfacing a tuner module or voltage supply module as well.

In an embodiment of the invention, the device for receiving digital television signals is designed as a set-top box.

However, a set-top box is not to be understood merely as an accessory in the literal sense, but also as a device implemented in a plug, for example, or built directly onto a plug, without external connecting line between the plug and device, so called stick solutions.

It should be noted that the embodiments of the invention described below relate in like measure to the devices for receiving digital television signals and the data processing module for digital television signals.

Of course, the individual features can also be used in combination with each other, which can in part yield advantageous effects going beyond the sum of individual effects.

These and other aspects of the present invention will be explained and illustrated by referring to the exemplary embodiments described below.

Short description of figures

Exemplary embodiments will be described below with reference to the following drawings.

Figure 1 shows the basic diagrammatic structure of a device for receiving digital television signals from prior art. Figure 2 shows an exemplary electrical block diagram of a device for receiving digital television signals. Figure 3 shows a basic structure of a device for receiving digital television signals according to the present invention. Figure 4 shows the basic structure of a main board with a data processing module for digital television signals according to the present invention. Figure 5 shows a basic sectional view of a main board with a data processing module for digital television signals according to the present invention.

Figure 6 shows the basic structure of a data processing unit for a device for receiving digital television signals or for a data processing module for digital television signals.

Figure 7 illustrates actual designs of particular components of a device for receiving digital television signals.

Detailed Description of Exemplary Embodiments

Figure 1 shows the basic structure of a device for receiving digital television signals, for example in the form of a set-top box, top view. In this case, the main board accommodates a plurality of assembly groups and components. In the embodiment shown on Figure 1, the main board 150 accommodates a tuner IC 10, a demodulator IC 30, as well as HF signal ports 20. These components are also referred to as front end components. The main board 150 also accommodates a so-called back end processor IC 40, a RAM memory 50, a flash memory 60 as well as a smart card IC 70. These components are generally referred to as back end components. Control and display elements 90 are also provided on the operating system. The board further accommodates a remodulator assembly group 100, remodulator HF ports 110, as well as a number of RCA/Toslink audio and video outputs 120. A power supply circuit 130 and power supply port 140 are also provided for energy supply.

Figure 2 shows the structural design of a device for receiving digital television signals in addition to their functional correlation, wherein the reference numbers used on Figure 1 will be employed analogously here as applicable.

Figure 3 shows the basic structural design of a device for receiving digital television signals, for example in the form of a set-top box according to the present invention. Instead of the main board 150, the device for receiving digital television signals 1 here exhibits a main board 160 modified from prior art, which functionally accommodates essentially the usual components already described with reference to Figure 1. However, as opposed to prior art, various assembly groups are modularly combined, and located on separate module boards 170, 180, 190. In the embodiment shown on Figure 3, for example, the tuner IC 10 and demodulator IC 30 are situated on a tuner module board or a board of a front end module 170. This front end module can be accessed from outside via the HF signal ports, thereby enabling an antenna or cable hookup, for example. Let it be noted here that the signal feed can not take place both from terrestrial systems like DVB-T, cable systems like DVB-C and satellite systems like DVB-S. Of course, this can also take place using other digital television broadcast systems, such as ISDB-T, ATSC or MMDS supported systems. Let it be noted that the connecting lines for the individual components on Figures 1 and 3 have been omitted for reasons of clarity, but their function is evident from Figure 2.

Also situated on a board of a data processing module for digital television signals 180 in the embodiment shown here is a back end processor IC 40, a RAM memory 50, a flash memory 60 and a smart card IC 70. In other words, the components for digital signal, data or decoding processing can be arranged on the module 180. Let it be noted that all of the aforementioned components do not absolutely have to be provided on the data processing module 180, but even a portion of these components or assembly groups can be provided there.

In addition, the pre-supply power circuit 130 can be arranged on a power supply module 190, which can be supplied with mains voltage, for example, via the power supply port 140. The power supply module can also be realized using push-through technology, for example, just as a tuner or front end module.

For example, this modular design makes it possible to prefabricate and in particular specify individual component groups, and then join the latter together modularly to create the corresponding functionalities. A power supply module can here be rated as a function of the regional mains voltage or mains frequency, for example, and be modularly inserted on or in the device for receiving digital television signals, wherein the remaining components can be retained essentially unchanged in this case, for example. This holds true analogously for the front end module 170 and back end module 180 as well, for example. In this case, attention can be focused on the peculiarities of different signals via correspondingly modified front end modules 170, for example, along with the varying requirements and specifications relative to data processing for digital television signals via the back end module 180. Highly integrated assemblies are implemented in particular in the back end module 180, for example a back end processor IC 40, RAM memory 50, flash memory 60 or a smart card IC 70. These assemblies are often applied using special bonding procedures, for example assembly processes implemented based on the BGA (ball grid array) or SMD (surface mounted device) techniques. In particular during the assembly of highly integrated components, such assembly techniques as a rule require a multi-ply or multi-layer board, in which the individual circuit-board conductors are situated in different layers lying one atop the other on one side of the board, or in several layers on either side of the board, just to enable such a large number of bonding points and incoming/outgoing leads. However, this type of processing and assembly of highly integrated components on multi-layer boards requires a very cautious and exact processing along with highly specialized machinery and automated systems. If each specification for a device used to receiving digital television signals required that a different board layout be generated for a main board, the outlay with be very high, wherein in particular complex machinery and complicated procedures would have to be used for the entire process of manufacturing the device for receiving digital television signals. However, the modular structural design now being proposed makes it possible to reduce and concentrate the area in which such multi-layer or multi-ply boards are required. In particular, for example, the back end module 180 can exhibit a board fabricated using multi-ply technology to enable bonding and attachment of the highly integrated components 40, 50, 60, 70. For example, defining interfaces in terms of the input or output makes it possible to keep the scope of this multi-layer board relatively low, since this module is provided with a separate board 184 (Figure 4 or Figure 5). This eliminates the need to design the entire main board 160 as a multi-layer or multi-ply board, in particular since numerous peripheral components and assembly groups do not dictate that a multi-layer board be used for assembly purposes. In this way, for example, the main board with its rudimentary assemblies can also be fabricated in systems that do not offer such an exacting manufacturing precision and quality, or by personnel that need not have extensive skills and knowledge in processing highly integrated assemblies. Further, the screening of sensitive assemblies can be spatially limited, for example to the actual back end module 180. In this way, the screening can essentially be concentrated on the relevant areas, and the casing components for the entire device do not absolutely have to geared toward the requirement of screening against interference. Rather, the casing of a set-top box can be made out of plastic, for example, while the assemblies of relevance in terms of interference can be screened on a module board in a far smaller spatial scope by screening casings. Let it be noted that while the COB technique can eliminate the need for screening under normal circumstances, screening may be desirable under special conditions, for example in environments that require lower spurious radiation levels, or in environments where higher interference can be expected.

Figure 4 shows a perspective view of the basic structure on a main board 160 carrying a module 180. The module 180 here exhibits a module board 184, which accommodates a number of assembly groups or components 40, 50, 60, 70, for example. Also provided are ports 181 with which the module 180 can be hooked up to the main board 160. Ports are analogously provided on the main board 160, which can in turn be used for connection to the ports 181 of the module 180. The module 180 here also exhibits an input interface 182 and an output interface 183, wherein the input interface 182 or output interface 183 of the module 180 shown in the embodiment on Figure 4 is connected with a corresponding interface 162 or 163 of the main board 160. As indicated by the schematic line, only the module 180 can be enveloped by a screening 200 in this way, wherein this screening 200 can remain essentially limited to the dimensions of the module 180 without having the screen other components of the main board 160 or the entire main board. Let it be noted that while the COB technique can eliminate the need for screening under normal circumstances, screening may be desirable under special conditions. Depending on the above, the expert will provide screening or not, and dimension whatever screening might be required.

Figure 5 shows a side view of the basic structure of a main board 160 with a ply or layer 165, in which printed-circuit conductors run. The ply or layer can be placed on the bottom side, e.g., using push-through technology, or on the top side of the board 160, e.g., using surface mounting technology. Push-through contacts 201 can be used to secure the module board 184 on the main board 160, for example. The module board 184 can here be provided with a multi-ply (multi-layer) structure that can exhibit a plurality of layers or plies 185. The plurality of layers can here be arranged both on the bottom side and top side of the module board 184. Of course, the number of layers 185 provided on the module board 184 is not limited to the number of four layers per side as depicted here, but each side can of course exhibit a higher or lower number of layers. The layers are insulated from each other, wherein these details have been omitted in the diagrammatic view on Figure 5 for reasons of clarity. Further, the multi-layer structure can also be provided on only one side of the module board 184. Components or assembly groups 40, 50, 60, 70 can then be accommodated on the module board itself, bonded in the respective layers 185 on the printed circuit boards via a bonding arrangement (not shown). In embodiments where the number of layers 165 in the main board 160 corresponds to the number of layers 185 in the module board 184, however, the modular technique enables bonding and conductor arrangements spaced less apart on the main or carrier board 160. The module 180 can also be assembled on the main board using surface mounting technology, even if this is not depicted on Figure 5 in this form.

Figure 6 shows an exemplary structure of a back end processor IC 40 or more generally a data processing unit 40. In this case, the data processing unit can incorporate a demultiplexer 41, a descrambler 42 or decryption device 43, an MPEG decoder 44 or a digital/analog converter 45. The descrambler 42 or decryption device 43 can be used as an option, and are not required for FTA (free-to-air) STB, for example. Since the descrambler 42 has already implemented decryption, only a descrambler 42 or decryption device 43 is here necessary. Therefore, Figure 6 must be understood as meaning that both units 42 and 43 do not have to be provided in this embodiment. For example, one embodiment involves preparing the signal fed into the data processor 40 via a demultiplexer and descrambler to isolate a signal for a channel. The channel-isolated signal is then decrypted by an optional decryption device 43 and then MPEG decoded, thereby yielding a displayable television signal. If needed, this signal can be supplied to a digital television device as a digital signal, or alternatively fed to a conventional analog television after a digital/analog conversion.

Figure 7 illustrates actual designs for components of a unique DVB technology concept for price driven markets. The so called Leapfrog Concept is a new developed product and production concept based on modules which allows customers conquering the worldwide market with price and quality leading set-top-boxes. The new concept allows customers to get already cost optimized ready to ship product or use own manufacturer to mount the modules locally together avoiding high import duties and allowing a efficient quality and delivery control. For manufacturers it allows to supply products to their local markets without the need to have full DVB developing power. So it is possible to support on technology and development to manufactures to development their home and accessible set-top-box markets.

The Product Concept allows for the STB concept 100% through-hole assembly technique on the carrier PCB (1 layer PCB). This includes backend modules containing CPU, memory and all SMD required components, internal assembled PSU (1 layer PCB) or using external wall mounted PSU alternative, tuner modules (with demodulator), AV connectivity such as RCA out, Remod and SCART, few simple through-hole components such as IR & LED, and simple voltage regulators, resistors, capacitors and coils. Figure 7 illustrates a device for receiving digital television signals 301. The product range is for example PayTV and Free-To- Air receiver, DVB-S, -T, -C, MMDS and ISDB-T receiver, a range from SD MPEG2 up to HD H.264 decoding, various CA systems integrations available such as but not limited to Nagravision, Mediaguard, Irdeto, Conax5/7, Cryptoworks and Betacrypt2.

The advantages of the leapfrog concept include that the leapfrog concept is designed for cost optimization on the final STB e.g. ready to use developed modules (MPEG backend, PSU, tuner, Carrier PCB), faster time to market due to CA vendor certified backend module, (cutting e.g. certification time to less than 20%), CE compliant modules lowering EMC/ESD effort for final product significantly, powerful software stack available to address most markets directly or with low effort, highest quality and lowest cost due to modular focused production optimization, optimized for both high automatisation and low-tech manufacturing sides with low labour costs. The leapfrog concept further provides for Pay TV DVB-S, -T and C receiver, DVB hardware concepts to address world-wide markets, all required modules to create a complete DVB solution, featured and powerful quality proven DVB software solutions based on over more as 12 years experience with DVB products for PC, STB, PVR and Hybrid, experienced markets EU, UK, NorDig area, LatAm, Asia (Korea, India and other).

Figure 7 further shows a backend module 302. The backend module contains several chipsets in a compressed form (die) with additional all required SMD parts and will be assembled as multi-pin module on the carrier PCB. It contains typically CPU (e.g. NXP8329), Secure Flash, RAM, audio DAC and amplifier, SmartCard driver (e.g. TDA8024), clock crystal, several passive components, and a size of ca. 51mm x 30mm.

The PSU module can be used an external wall mounting PSU or preferred an internal module and may provide for a wide range power supply 90/260 V, 50/60 Hz, availability for DVB-S and DVB-C/T, using 1 -layer PCB for cost optimization and a size of ca. 107mm x 68mm.

Fig. 7 also illustrates a front-end module 303. The front end (FE) is a simple standard FE with demodulator (NIM) or a module using standard tuner chipsets together with demodulator to allow simple assembly on the carrier PCB. All typical receptions types are available such as DVBS, -T, -C, MMDS and ISDB-T and serial TS interface to the backend module.

A carrier PCB carries the modules and few simple through-hole components to allow cost efficient and simple assembly at any required location optimizing duty and logistics costs. Standard software features are excellent easy-to-use graphical user interface, context referred help function, automatic and manual channel scan, separated program list for TV and radio, up to 5000 TV programs storable, up to 5000 Radio programs storable, up to 5 different favourite lists, an electronic program guide present/following EPG, 7-Day-EPG plus, additional grid-EPG optional, one- touch timer setting in EPG, multi language support, e.g. German, English, Turkish, Russian, Italian, French, Spanish, Portuguese, Greek, Swedish, Finnish, Danish, Czech and Dutch, integrated Teletext browser, DVB and EBU subtitling decoding (ETS 300 743), various specific integrations such as MHP, MHEG-5 vl .06, HTML browser, InView Teletext Extra, cable ready and more.

It should be noted that, in addition to receiving digital television signals, the present invention can also be used for receiving digital broadcast signals of any kind, in particular for any transmission of video and/or audio signals.

Let it be noted that the term "encompass" does not preclude additional elements and procedural steps, just as the term "a" and "an" does not rule out several elements. Reference List

1 Device for receiving digital television signals

10 Tuner IC

20 HF signal ports 30 Demodulator IC

40 Back end processor IC

41 Demultiplexer

42 Descrambler

43 Decryption device 44 MPEG decoder

45 Digital/analog converter

50 RAM memory

60 Flash memory

70 Smart card IC 80 Smart card slot

90 Control and display elements

100 Remodulator assembly group

110 Remodulator HF ports

120 RC A/Toslink audio and video outputs 130 Power supply circuit

140 Power supply port

150 Main board, conventional

160 Main board, per the invention

161 Module board port, main board side 162 Input interface, main board

163 Output interface, main board

165 Conductor layer of main board

170 Front end module

180 Back end module 181 Main board port, module side

182 Input interface, module or module board

183 Output interface, module or module board

184 Module board

185 Conductor path of module board 190 Power supply module

200 Screening

201 Push-through contacts

301 Device for receiving digital television signals

302 Back end module 303 Front end module

Claims

C l a i m s

1. A device for receiving digital television signals, comprising: a main board (160), and a module board port (161), wherein the module board port is provided on the main board, wherein the module board port exhibits an input interface (162) suitable for a digital input data stream, and an output interface (163) suitable for an output signal.

2. The device according to claim 1, wherein the output signal is a baseband television output signal.

3. The device according to one of claims 1 and 2, wherein the module board port (161) is designed using push-through technology.

4. The device according to one of claims 1 and 2, wherein the module board port ( 161 ) is designed using surface mounting technology.

5. The device according to one of claims 1 to 4, wherein the main board (160) is a single-layer board.

6. A data processing module for digital television signals, comprising: a module board (184), and at least one assembly group (40, 50, 60, 70) suitable for data processing for digital television signals, wherein the module board exhibits an input interface (182) suitable for a digital input stream, and an output interface (183) suitable for an output signal, wherein the assembly group exhibits an input connected with the input interface, and an output connected with the output interface.

7. The module according to claim 6, wherein the assembly group (40, 50, 60, 70) exhibits at least one assembly from a group comprised of:

- a data processor (40), - a RAM memory (50),

- a flash memory (60) and

- a smart card processor (70).

8. The module according to claim 7, wherein the data processor (40) exhibits at least one assembly from a group comprised of:

- a demultiplexer (41),

- a descrambler (42),

- a decryption device (43),

- an MPEG decoder (44) and - a digital/analog converter (45).

9. The module according to claim 7, wherein the data processor (40) exhibits a smart card processor (70) as well as either a descrambler (42) or decryption device (43) for receiving encrypted programs.

10. The module according to claim 7, wherein the assembly group exhibits at least one data processor (40), RAM memory (50) and flash memory (60), and the data processor exhibits at least one demultiplexer (41), MPEG decoder (44) and digital/analog converter (45).

11. The module according to one of claims 6 to 10, wherein the assembly group (40, 50, 60, 70) is at least partially applied to the module board (184) using chip on board technology.

12. The module according to one of claims 6 to 11 , wherein at least a portion of the assembly group (40, 50, 60, 70) is cast onto the module board (184).

13. The module according to one of claims 6 to 12, wherein the module board (184) is a multi-layer board.

14. The module according to one of claims 6 to 13, wherein at least a portion of the assembly group (40, 50, 60, 70) is enveloped by a screen (200) in such a way as to diminish electromagnetic interference on the at least one portion of the assembly group.

15. A device for receiving digital television signals according to one of claims 1 to 5, with a data processing module (180) for digital television signals according to one of claims 6 to 14.

16. The device according to claim 15, wherein the number of layers ( 165) of the main board (160) is lower than the number of layers (185) of the module board (184).

17. The device according to one of claims 1 to 5, 15 and 16, wherein the device (1) is designed as a set-top box of SCART stick.