WO2009131078A1 - Fungicide composition and fungicidal resin composition including the same - Google Patents

Fungicide composition and fungicidal resin composition including the same Download PDF

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Publication number
WO2009131078A1
WO2009131078A1 PCT/JP2009/057799 JP2009057799W WO2009131078A1 WO 2009131078 A1 WO2009131078 A1 WO 2009131078A1 JP 2009057799 W JP2009057799 W JP 2009057799W WO 2009131078 A1 WO2009131078 A1 WO 2009131078A1
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Prior art keywords
compound
mass
resin
antifungal
composition
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PCT/JP2009/057799
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French (fr)
Japanese (ja)
Inventor
志保 中山
健二 野田
Original Assignee
株式会社アピア
テクノポリマー株式会社
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Priority claimed from JP2008116145A external-priority patent/JP5325450B2/en
Priority claimed from JP2008116146A external-priority patent/JP5325451B2/en
Application filed by 株式会社アピア, テクノポリマー株式会社 filed Critical 株式会社アピア
Publication of WO2009131078A1 publication Critical patent/WO2009131078A1/en

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    • AHUMAN NECESSITIES
    • A01AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01NPRESERVATION OF BODIES OF HUMANS OR ANIMALS OR PLANTS OR PARTS THEREOF; BIOCIDES, e.g. AS DISINFECTANTS, AS PESTICIDES OR AS HERBICIDES; PEST REPELLANTS OR ATTRACTANTS; PLANT GROWTH REGULATORS
    • A01N25/00Biocides, pest repellants or attractants, or plant growth regulators, characterised by their forms, or by their non-active ingredients or by their methods of application, e.g. seed treatment or sequential application; Substances for reducing the noxious effect of the active ingredients to organisms other than pests
    • A01N25/08Biocides, pest repellants or attractants, or plant growth regulators, characterised by their forms, or by their non-active ingredients or by their methods of application, e.g. seed treatment or sequential application; Substances for reducing the noxious effect of the active ingredients to organisms other than pests containing solids as carriers or diluents
    • A01N25/10Macromolecular compounds

Definitions

  • the present invention controls the growth of fungi, bacteria (including yeast, spore fungi, actinomycetes), wood-rotting fungi, algae and marine organisms, and further has fungicidal, fungicidal, antialgal, deodorizing and
  • the present invention relates to an antifungal resin composition which provides a molded article, a film and the like which are excellent in antiseptic properties and excellent in sustainability of these effects, and an antifungal agent composition contained therein.
  • Patent Document 1 discloses that a bioresistant agent to be blended in a resin includes a nitrile compound, a pyridine compound, a haloalkylthio compound, an organic iodo compound, a thiazole compound, and a benzimidazole compound.
  • Patent Document 2 discloses an industrial antibacterial composition comprising 2- (n-octyl) -4-isothiazolin-3-one, bis (2-pyridylthio-1-oxide) zinc salt and a benzimidazole compound as active ingredients.
  • a resin composition comprising polyvinyl chloride is disclosed.
  • Patent Document 3 contains 0.01 to 5 parts by mass of an inorganic composite containing zinc as an essential component with respect to 100 parts by mass of a thermoplastic resin mainly composed of a specific rubber-reinforced styrene resin.
  • An antibacterial thermoplastic resin composition is disclosed.
  • Patent Document 4 discloses an antibacterial composition containing a nitrile antibacterial agent, a pyridine antibacterial agent, a haloalkylthio antibacterial agent, an organic iodine antibacterial agent and a thiazole antibacterial agent as active ingredients, and these antibacterial agents. And an antibacterial composition containing a benzimidazole antibacterial agent.
  • Patent Document 5 includes 2-pyridinethiol-1-oxide sodium, 2,3,5,6-tetrachloro-4-methylsulfonylpyridine, 2- (n-octyl) -4-isothiazolin-3-one, and diiodomethyl.
  • -Antibacterial and fungicidal substances containing at least 0.1% (mass) of p-tolyl-sulfone, methyl (benzimidazol-2-yl) carbamate and 1,2-benzisothiazolin-3-one, An anti-algae and antibacterial composition is disclosed.
  • Patent Document 6 discloses a deodorizing composition containing a titanium phosphate compound having a specific structure or a condensate thereof as an active ingredient, a nitrile antibacterial agent, a pyridine antibacterial agent, a haloalkylthio antibacterial agent, and a benzimidazole type.
  • Antifungal agent, antibacterial agent and antibacterial agent containing 1 to 10% by mass of a mixture containing 0.1 to 40% by mass of each of two or more of antibacterial agent, organic iodine antibacterial agent, isothiazolyl antibacterial agent and thiazole antibacterial agent An odorant is disclosed.
  • Patent Document 7 discloses a wood preservative containing, as an active ingredient, an anionic surfactant containing a sulfonate or a lauryl sulfate ester salt, which has an effect of controlling against wood-rotting fungi (such as Prunus edulis and Kawaratake).
  • Patent Document 8 discloses an underwater harmful organism control agent containing an indole compound and a pyridine compound as active ingredients.
  • JP-A-9-157111 Japanese Patent Laying-Open No. 2005-23017 JP 2006-239904 A JP-A-8-92012 JP 2005-298494 A JP 2006-52209 A JP 2007-15959 A JP-A-10-45512
  • the object of the present invention is to control the growth of fungi, bacteria (including yeast, spore fungi, actinomycetes), wood-rotting fungi, algae and marine organisms, and furthermore, fungicidal, antifungal, antialgal, and deodorant It is an object of the present invention to provide an antifungal resin composition which gives a molded article (solid body, foam), a film and the like which are excellent in properties and antiseptic properties and have excellent sustainability of these effects.
  • the object of the present invention is to control the growth of fungi, bacteria (including yeast, spore fungi, actinomycetes), wood-rotting fungi, algae and marine organisms, and furthermore, fungicidal, antifungal, antialgal, and deodorant It is providing the antifungal agent composition which is excellent in the property and antiseptic property, and is excellent in the sustainability of these effects.
  • a resin, a benzimidazole compound, an organic iodo compound, a thiazole compound, and a haloalkylthio compound at a specific ratio.
  • the fungicide composition and the resin composition containing the fungicide, bacteria (including yeast, spore fungus, actinomycetes), wood-rot fungi, algae and marine organisms and wood decay are controlled and further prevented. It was found that a molded article having excellent fungiability, antibacterial properties, algae-proofing properties, deodorizing properties and antiseptic properties and excellent sustainability of these effects was obtained.
  • the organic iodo compound (b2) is an iodosulfonylbenzene derivative
  • the thiazole compound (b3) is a benzimidazole derivative having a thiazole group
  • the haloalkylthio compound (b4) is a haloalkylthiosulfamide derivative.
  • the antifungal composition [B] further contains an organic bromide compound (b5), and the content of the organic bromide compound (b5) is determined based on the compounds (b1), (b2), and (b3).
  • the antifungal resin composition as described in 1 above wherein the total amount of (b4) is 0.01 to 3 parts by mass, when the total is 100 parts by mass. 6).
  • Resin composition. 7 A molded product comprising the antifungal resin composition as described in 1 above. 8).
  • the mass percentage is 85% to 99.97% by mass, 0.01% to 5% by mass, 0.01% to 5% by mass, and 0.01% to 5% by mass, respectively, Fungi composition.
  • the haloalkylthio-based compound (b4) are 0.01 to 3 parts by mass when the total of the haloalkylthio compounds (b4) is 100 parts by mass.
  • the antifungal resin composition of the present invention fungi, bacteria (including yeast, spore fungus, actinomycetes), wood-rotting fungi, algae and marine organisms are propagated, and wood decay is further controlled. It is possible to obtain molded articles (solid bodies, foams), films and the like that are excellent in the properties, antibacterial properties, algae-proofing properties, deodorization properties and antiseptic properties and are excellent in the sustainability of these effects. Therefore, the antifungal resin composition of the present invention is suitable for a wide range of applications such as molding materials, paints (including inks), adhesives, sealing agents, and surface treatment agents.
  • the antifungal resin composition of the present invention further contains an organic bromide compound (b5), it is excellent in antibacterial properties against spore bacteria such as Bacillus genus, Clostridium genus, etc. and wood rot fungi.
  • the organic iodo compound (b2) is an iodosulfonylbenzene derivative
  • the thiazole compound (b3) is a benzimidazole derivative having a thiazole group
  • the haloalkylthio compound (b4) is a haloalkylthiosulfamide.
  • Spore fungi such as Bacillus cereus, Clostridium botulinum, Clostridium perfringens, etc., as well as Sugihiratake, Kawaratake, Statake, Namidatake, , Excellent resistance to wood-rotting fungi such as Fomitopsis palustris.
  • the fungicide composition of the present invention can be used as a powder-based composition; water, an organic solvent, or a composition dispersed or dissolved in a mixed medium thereof. Further, it is suitable for molding materials and molded articles prepared by blending with resins and the like; antiseptics; antifouling agents and the like. According to the fungicide composition of the present invention, fungi, bacteria (including yeast, spore fungus, actinomycetes), wood-rotting fungi, algae and marine organisms are propagated and the decay of wood is further controlled. It is excellent in antibacterial properties, algae control properties, deodorization properties and antiseptic properties, and is excellent in sustainability of these effects.
  • the antifungal resin composition of the present invention comprises [A] resin (hereinafter also referred to as “component [A]”) and [B] the following compounds (b1), (b2), (b3) and (b4).
  • component [A] resin
  • component [B] the following compounds
  • (b2) organic iodine compound 0.01 to 5% by mass organic iodine compound 0.01 to 5% by mass
  • thiazole compound 0.01
  • a fungicide composition hereinafter also referred to as “component [B]” containing 5 to 5% by mass and (b4) 0.01 to 5% by mass of a haloalkylthio compound.
  • the content of the product [B] is 0.01 to 10 parts by mass with respect to 100 parts by mass of the resin [A].
  • the component [A] is selected according to the purpose, use and the like.
  • the said component [A] may consist of only 1 type, and may consist of 2 or more types.
  • the property is not specifically limited, either, it may be solid or liquid.
  • the component [A] can be a polymer, a polymer-forming compound (precursor), a composition containing it (a composition for forming a polymer), or the like.
  • the component [A] may be either a thermoplastic resin or a curable (thermosetting, photocurable, electron beam curable, room temperature curable, etc.) resin.
  • the antifungal resin composition of the present invention is used.
  • the product is a thermoplastic resin composition, and in the latter case, it is a curable resin composition.
  • a preferred component [A] is a thermoplastic resin.
  • the component [A] is a thermoplastic resin
  • it is not particularly limited as long as it contains a polymer having thermoplasticity; rubber reinforced resin such as ABS resin, ASA resin, AES resin; polystyrene, styrene / acrylonitrile Styrene (co) polymers such as copolymers, styrene / maleic anhydride copolymers, (meth) acrylic acid esters / styrene copolymers; Olefin resins such as polyethylene and polypropylene; Polyester resins; Polyamide resins Polycarbonate resin; Polyarylate resin; Polyacetal resin; Vinyl chloride resin such as polyvinyl chloride, ethylene / vinyl chloride polymer, and polyvinylidene chloride; One kind of (meth) acrylic acid ester such as polymethyl methacrylate (PMMA) Acrylic resins such as (co) polymers using the above; polyphenyle Ethers; Polyphenylene sulfide; Fluorine resin
  • thermoplastic resins those suitable for forming a molded product include: rubber reinforced resin; polyester resin; olefin resin; polyamide resin; alloy of polyester resin and polycarbonate resin; polyester resin, rubber reinforced resin and Examples include polycarbonate resin alloys.
  • the rubber-reinforced resin is obtained by polymerizing a vinyl monomer (a2) containing an aromatic vinyl compound in the presence of a rubbery polymer (hereinafter referred to as “rubbery polymer (a1)”).
  • Rubber reinforced vinyl resin hereinafter referred to as “rubber reinforced vinyl resin (A1)”
  • (co) polymer (A2) A polymer (hereinafter referred to as “(co) polymer (A2)”).
  • the rubbery polymer (a1) may be a homopolymer or a copolymer as long as it is rubbery at room temperature, but it may be a diene polymer (diene rubber polymer). And non-diene polymers (non-diene rubber polymers) are preferred. Further, the rubber polymer (a1) may be a crosslinked polymer or a non-crosslinked polymer. These can be used alone or in combination of two or more.
  • diene polymers examples include homopolymers such as polybutadiene, polyisoprene, and polychloroprene; styrene / butadiene copolymers, styrene / butadiene / styrene copolymers, acrylonitrile / butadiene copolymers, and acrylonitrile / styrene / butadiene copolymers.
  • homopolymers such as polybutadiene, polyisoprene, and polychloroprene
  • styrene / butadiene copolymers styrene / butadiene / styrene copolymers
  • acrylonitrile / butadiene copolymers examples include acrylonitrile / styrene / butadiene copolymers.
  • Styrene / butadiene copolymer rubber such as polymer; styrene / isoprene copolymer, styrene / isoprene copolymer rubber such as styrene / isoprene / styrene copolymer, acrylonitrile / styrene / isoprene copolymer; natural rubber Etc.
  • These copolymers may be block copolymers or random copolymers.
  • These copolymers may be hydrogenated (however, the hydrogenation rate is less than 50%).
  • the said diene polymer can be used individually by 1 type or in combination of 2 or more types.
  • non-diene polymer examples include ethylene units and ethylene / ⁇ -olefin copolymer rubbers including units composed of ⁇ -olefins having 3 or more carbon atoms; urethane rubbers; acrylic rubbers; silicone rubbers; Examples include silicone / acrylic IPN rubbers; polymers obtained by hydrogenating (co) polymers containing units composed of conjugated diene compounds. These copolymers may be block copolymers or random copolymers. These copolymers may be hydrogenated (however, the hydrogenation rate is 50% or more).
  • the said non-diene polymer can be used individually by 1 type or in combination of 2 or more types.
  • the resin containing the rubber-reinforced vinyl resin (A1) obtained when a diene polymer is used as the rubber polymer (a1) is generally referred to as “ABS resin”. Further, a resin containing a rubber-reinforced vinyl resin (A1) obtained when ethylene / ⁇ -olefin and / or ethylene / ⁇ -olefin / non-conjugated diene copolymer is used as the rubbery polymer (a). Is generally referred to as “AES resin”. Furthermore, a resin containing a rubber-reinforced vinyl resin (A1) obtained when an acrylic rubber is used as the rubber polymer (a) is generally referred to as an “ASA resin”.
  • the vinyl monomer (a2) used for forming the rubber-reinforced vinyl resin (A1) may be an aromatic vinyl compound alone, or an aromatic vinyl compound and, for example, a vinyl cyanide compound, (meth)
  • a compound that can be copolymerized with an aromatic vinyl compound, such as an acrylate compound, a maleimide compound, or an acid anhydride, can be used alone or in combination of two or more. Therefore, the vinyl monomer (a2) is one or more aromatic vinyl compounds, or one or more aromatic vinyl compounds and one or more compounds copolymerizable with the aromatic vinyl compounds. A monomer in combination with can be used.
  • the aromatic vinyl compound is not particularly limited as long as it is a compound having at least one vinyl bond and at least one aromatic ring.
  • examples include styrene, ⁇ -methylstyrene, o-methylstyrene, p-methylstyrene, vinyltoluene, ⁇ -methylstyrene, ethylstyrene, p-tert-butylstyrene, vinylxylene, vinylnaphthalene, monochlorostyrene, dichloromethane.
  • examples thereof include styrene, monobromostyrene, dibromostyrene, and fluorostyrene. These can be used alone or in combination of two or more. Of these, styrene and ⁇ -methylstyrene are preferred.
  • Examples of the vinyl cyanide compound include acrylonitrile and methacrylonitrile. Of these, acrylonitrile is preferred. Moreover, these can be used individually by 1 type or in combination of 2 or more types.
  • Examples of the (meth) acrylic acid ester compound include methyl methacrylate, ethyl methacrylate, n-propyl methacrylate, isopropyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, tert-butyl methacrylate, methyl acrylate, acrylic Examples include ethyl acrylate, n-propyl acrylate, isopropyl acrylate, n-butyl acrylate, isobutyl acrylate, tert-butyl acrylate, and the like. These can be used alone or in combination of two or more.
  • maleimide compounds examples include maleimide, N-methylmaleimide, N-butylmaleimide, N-phenylmaleimide, N- (2-methylphenyl) maleimide, N- (4-hydroxyphenyl) maleimide, N-cyclohexylmaleimide and the like. Can be mentioned. These can be used alone or in combination of two or more.
  • a method in which maleic anhydride is copolymerized and then imidized may be used as another method for introducing a unit composed of a maleimide compound.
  • the acid anhydride examples include maleic anhydride, itaconic anhydride, citraconic anhydride, and the like. These can be used alone or in combination of two or more.
  • a vinyl compound having a functional group such as a hydroxyl group, an amino group, an epoxy group, an amide group, a carboxyl group, or an oxazoline group
  • a functional group such as a hydroxyl group, an amino group, an epoxy group, an amide group, a carboxyl group, or an oxazoline group
  • 2-hydroxyethyl methacrylate, 2-hydroxyethyl acrylate, hydroxystyrene N, N-dimethylaminomethyl methacrylate, N, N-dimethylaminomethyl acrylate, N, N-diethyl-p-aminomethylstyrene
  • Glycidyl methacrylate glycidyl acrylate, 3,4-oxycyclohexyl methacrylate, 3,4-oxycyclohexyl acrylate, vinyl glycidyl ether, methallyl glycidyl ether, allyl glycidyl ether
  • the rubber reinforced resin may be only the rubber reinforced vinyl resin (A1), or the rubber reinforced vinyl resin (A1). And a (co) polymer (A2) obtained by polymerization of a vinyl monomer.
  • the vinyl monomer include compounds used for forming the rubber-reinforced vinyl resin (A1), that is, aromatic vinyl compounds, cyanide vinyl compounds, (meth) acrylic acid ester compounds, maleimide compounds, acids.
  • One or more selected from an anhydride and a compound having a functional group can be used.
  • the (co) polymer (A2) is a polymer obtained by polymerizing components having exactly the same composition as the vinyl monomer (a2) used for forming the rubber-reinforced vinyl resin (A1). It may be a polymer obtained by polymerizing the same type of monomer with different compositions, or a polymer obtained by polymerizing different types of monomers with different compositions It may be. Two or more of these polymers may be contained.
  • the graft ratio of the rubber-reinforced vinyl resin (A1) is preferably 30 to 150% by mass, more preferably 50 to 120% by mass. If the graft ratio of the rubber-reinforced vinyl resin (A1) is too small, the surface appearance and impact resistance of the antifungal resin composition of the present invention and a molded product containing it may be lowered. On the other hand, if the graft ratio is too large, the molding processability is poor.
  • the graft ratio means x gram of rubber component in 1 gram of the rubber reinforced vinyl resin (A1), 1 gram of the rubber reinforced vinyl resin (A1) with acetone (however, the rubbery polymer (a1)).
  • the intrinsic viscosity [ ⁇ ] (methyl ethyl ketone) of the soluble component of acetone of the rubber-reinforced vinyl resin (A1) (however, acetonitrile is used when the rubbery polymer (a1) is an acrylic rubber). (Measured at 30 ° C.) is preferably 0.2 to 1 dl / g, more preferably 0.3 to 0.8 dl / g. By setting it as this range, it is excellent in the moldability of the antifungal resin composition of this invention, and is excellent also in the impact resistance of the obtained molded article.
  • the graft ratio and intrinsic viscosity [ ⁇ ] are the types and amounts of a polymerization initiator, a chain transfer agent, an emulsifier, a solvent, etc., when the rubber-reinforced vinyl resin (A1) is produced. It can be easily controlled by changing the polymerization temperature or the like.
  • Examples of the (co) polymer (A2) include the following (3) to (8).
  • the compound used for formation of the said rubber reinforced vinyl-type resin (A1) can be applied to each monomer, and a preferable compound is also the same.
  • One or more kinds of copolymers obtained by polymerizing an aromatic vinyl compound and a (meth) acrylic acid ester compound are examples of the (co) polymer (A2) include the following (3) to (8).
  • the compound used for formation of the said rubber reinforced vinyl-type resin (A1) can be applied to each monomer, and a preferable compound is also the same.
  • (4) One or more (co)
  • the (co) polymer (A2) include acrylonitrile / styrene copolymer, acrylonitrile / ⁇ -methylstyrene copolymer, acrylonitrile / styrene / methyl methacrylate copolymer, styrene / methyl methacrylate.
  • examples include copolymers, acrylonitrile / styrene / N-phenylmaleimide copolymers, and the like.
  • the intrinsic viscosity [ ⁇ ] (measured in methyl ethyl ketone at 30 ° C.) of the (co) polymer (A2) is preferably 0.2 to 0.8 dl / g. When the intrinsic viscosity [ ⁇ ] is within the above range, the physical property balance between molding processability and impact resistance is excellent.
  • the intrinsic viscosity [ ⁇ ] of the (co) polymer (A2) can be controlled by adjusting the production conditions, as in the case of the rubber-reinforced vinyl resin (A1).
  • Intrinsic viscosity [ ⁇ ] of a soluble component by acetone of the above rubber-reinforced resin (provided that acetonitrile is used when the rubbery polymer (a1) is an acrylic rubber) (measured in methyl ethyl ketone at 30 ° C.) Is preferably 0.2 to 0.8 dl / g.
  • the intrinsic viscosity [ ⁇ ] is within the above range, the physical property balance between molding processability and impact resistance is excellent.
  • the rubber-reinforced resin is a rubber-reinforced vinyl resin (A1), and a (co) polymer obtained by polymerization of a rubber-reinforced vinyl resin (A1) and a vinyl monomer (
  • the content of the rubbery polymer (a1) in the antifungal resin composition of the present invention is preferably 5 to 30% by mass.
  • the antifungal resin composition of the present invention and the molded product containing the same are excellent in impact resistance, surface appearance, rigidity, heat resistance and the like.
  • the olefin resin is not particularly limited as long as it is a polymer containing a monomer unit composed of an ⁇ -olefin having 2 or more carbon atoms.
  • a preferred olefin resin is a polymer containing a monomer unit composed of an ⁇ -olefin having 2 to 10 carbon atoms.
  • a copolymer mainly containing at least one monomer unit composed of a compound copolymerizable with the ⁇ -olefin can be used alone or in combination of two or more.
  • the olefin resin examples include polyethylene, polypropylene, ethylene / propylene copolymer, polybutene-1, and ethylene / butene-1 copolymer.
  • polyethylene, polypropylene, and propylene / ethylene copolymer are preferable, and a polymer including propylene units with respect to all monomer units of 50% by mass or more, that is, polypropylene and ethylene / propylene copolymers are more preferable.
  • the ethylene / propylene copolymer includes a random copolymer and a block copolymer, and a random copolymer is particularly preferable.
  • the olefin resin may be crystalline or amorphous. Preferably, it has a crystallinity of 20% or more by X-ray diffraction at room temperature.
  • the melting point (based on JIS K7121) of the olefin resin is preferably 40 ° C. or higher.
  • the molecular weight of the olefin resin is not particularly limited, but from the viewpoint of moldability, the melt flow rate (according to JIS K7210; hereinafter also referred to as “MFR”) is preferably 0.01 to 500 g / 10 min. And those having a molecular weight corresponding to each value are preferred.
  • olefin resin ionomer, ethylene / vinyl acetate copolymer, ethylene / vinyl alcohol copolymer, cyclic olefin copolymer, chlorinated polyethylene, and the like can be used.
  • the polyester resin is not particularly limited as long as it has an ester bond in the main chain of the molecule, and may be a saturated polyester resin or an unsaturated polyester resin. Of these, saturated polyester resins are preferred. Further, it may be a homopolymerized polyester or a copolyester. Further, it may be a crystalline resin or an amorphous resin.
  • polyester resins examples include polyalkylene terephthalates such as polyethylene terephthalate (PET), polypropylene terephthalate (PPT), polybutylene terephthalate (PBT), polyhexamethylene terephthalate, polycyclohexane-1,4-dimethyl terephthalate, and polyneopentyl terephthalate.
  • PET polyethylene terephthalate
  • PPT polypropylene terephthalate
  • PBT polybutylene terephthalate
  • polyhexamethylene terephthalate polycyclohexane-1,4-dimethyl terephthalate
  • polyneopentyl terephthalate examples include polyneopentyl terephthalate.
  • polyesters such as polyalkylene naphthalates such as polyethylene isophthalate, polyethylene naphthalate, polybutylene naphthalate, polyhexamethylene naphthalate, copolymer polyesters mainly containing alkylene terephthalate units and / or alkylene naphthalate units, liquid crystals Examples include polyester. Of these, polybutylene terephthalate is preferred. Moreover, these can be used individually by 1 type or in combination of 2 or more types.
  • the polycarbonate resin is not particularly limited as long as it has a carbonate bond in the main chain, and may be an aromatic polycarbonate or an aliphatic polycarbonate. Moreover, you may use combining these. In the present invention, an aromatic polycarbonate is preferable from the viewpoint of impact resistance, heat resistance, and the like.
  • the polycarbonate resin may have a terminal modified with an R—CO— group or an R′—O—CO— group (R and R ′ each represents an organic group). This polycarbonate resin can be used individually by 1 type or in combination of 2 or more types.
  • the viscosity average molecular weight of the polycarbonate resin is preferably 12,000 to 40,000 when converted from the solution viscosity measured at a temperature of 20 ° C. using methylene chloride as a solvent.
  • the polycarbonate resin may be used by mixing two or more polycarbonate resins having different viscosity average molecular weights as long as the overall viscosity average molecular weight falls within the above range.
  • the polycarbonate resin can be used as an alloy in combination with a polyester resin, or a rubber-reinforced resin and a polyester resin.
  • the polyamide-based resin is not particularly limited as long as it is a resin having an acid amide bond (—CO—NH—) in the main chain.
  • the polyamide-based resin include nylon 4, 6, 7, 8, 11, 12, 6.6, 6.9, 6.10, 6.11, 6.12, 6T, 6 / 6.6, 6 / 12, 6 / 6T, 6T / 6I and the like.
  • the terminal of a polyamide-type resin may be sealed with carboxylic acid, amine, etc.
  • the carboxylic acid include aliphatic monocarboxylic acids such as caproic acid, caprylic acid, capric acid, lauric acid, myristic acid, palmitic acid, stearic acid, and behenic acid.
  • amine examples include aliphatic primary amines such as hexylamine, octylamine, decylamine, laurylamine, myristylamine, palmitylamine, stearylamine, and behenylamine.
  • the said polyamide-type resin can be used individually by 1 type or in combination of 2 or more types.
  • the said component [A] is curable resin
  • this curable resin if it contains the polymer and / or precursor which produce
  • the antifungal resin composition of the present invention can be used as a paint, an adhesive, a sealing agent, etc. as well as forming a molded product.
  • Suitable resins in these cases include acrylic resins, polyvinyl acetate, polyvinyl alcohol, vinyl chloride resins, urethane resins, urea resins and the like.
  • component [B] is demonstrated.
  • the component [B] is a composition containing a benzimidazole compound (b1), an organic iodo compound (b2), a thiazole compound (b3), and a haloalkylthio compound (b4) in a predetermined ratio.
  • This component [B] may contain other components as required.
  • the benzimidazole compound (b1) is a compound having a benzimidazole ring and having no thiazole group and —S—C—X bond (X: halogen atom).
  • Examples of the benzimidazole compound (b1) include benzimidazole carbamic acid derivatives, thiobenzimidazole derivatives, sulfonyl group-containing benzimidazole derivatives, and the like. These can be used alone or in combination. In the present invention, a benzimidazole carbamic acid derivative is preferable.
  • the benzimidazole carbamic acid derivative is preferably a compound represented by the following general formula (1).
  • R 1 and R 2 are the same or different and are a hydrogen atom, a hydrocarbon group which may have a substituent, or other organic group, and R 3 has a hydrogen atom, a substituent.
  • Examples of the compound represented by the general formula (1) include methyl 1H-2-benzimidazolecarbamate, methyl 1-butylcarbamoyl-2-benzimidazolecarbamate, methyl 6-benzoyl-1H-2-benzimidazolecarbamate , 6- (2-thiophenecarbonyl) -1H-2-benzimidazole carbamate methyl and the like. These can be used alone or in combination of two or more.
  • the thiobenzimidazole derivative is preferably a compound represented by the following general formula (2).
  • R 1 and R 2 are the same or different and are a hydrogen atom, a hydrocarbon group which may have a substituent, or other organic group, and R 3 has a hydrogen atom, a substituent.
  • sulfonyl group-containing benzimidazole derivative examples include 1-dimethylaminosulfonyl-2-cyano-4-bromo-6-trifluoromethylbenzimidazole. These can be used alone or in combination of two or more.
  • benzimidazole compound (b1) As the benzimidazole compound (b1) according to the present invention, methyl 1H-2-benzimidazolecarbamate and methyl 1-butylcarbamoyl-2-benzimidazolecarbamate are preferable, and in particular, 1H-2-benzimidazolecarbamic acid. Methyl is particularly preferred.
  • the content of the benzimidazole compound (b1) contained in the component [B] is 85 when the total of the components (b1), (b2), (b3) and (b4) is 100% by mass. To 99.97% by mass, preferably 88 to 99.7% by mass, and more preferably 91.5 to 99.5% by mass.
  • the content of the benzimidazole compound (b1) is within the above range, the fungi, bacteria, wood decay fungi, algae and marine organisms are controlled to grow. It is excellent in deodorization and antiseptic properties and excellent in sustainability of these effects.
  • the organic iodine compound (b2) is an organic compound having an iodine atom, and is a compound having no thiazole group and —S—C—X (X: halogen atom). In addition, a chlorine atom may be included.
  • Examples of the organic iodo compound (b2) include an iodosulfonyl compound and an iodinated unsaturated aliphatic compound. These can be used alone or in combination. In the present invention, iodosulfonyl compounds are preferred.
  • the iodosulfonyl compound is preferably an iodosulfonylbenzene derivative, and examples thereof include diiodomethyl-p-tolylsulfone (also referred to as 1-diiodomethylsulfonyl 4-methylbenzene) and 1-diiodomethylsulfonyl 4-chlorobenzene. These can be used alone or in combination of two or more. Of these, diiodomethyl-p-tolylsulfone is preferred.
  • Examples of the iodinated unsaturated aliphatic compound include 3-iodo-2-propargylbutylcarbamic acid, 4-chlorophenyl-3-iodopropargyl formal, 3-ethoxycarbonyloxy-1-bromo-1,2-diiodo- Examples include 1-propene and 2,3,3-triiodoallyl alcohol. These can be used alone or in combination of two or more.
  • organic iodo compound (b2) As the organic iodo compound (b2) according to the present invention, diiodomethyl-p-tolylsulfone is particularly preferable.
  • the content of the organic iodine compound (b2) contained in the component [B] is 0 when the total of the components (b1), (b2), (b3) and (b4) is 100% by mass. 0.01 to 5% by mass, preferably 0.03 to 4% by mass, more preferably 0.05 to 3% by mass.
  • the content of the organic iodine compound (b2) is within the above range, the growth of fungi, bacteria, wood decay fungi, algae and marine organisms is controlled, and further, fungicidal, fungicidal, antialgal, It is excellent in deodorization and antiseptic properties and excellent in sustainability of these effects.
  • the thiazole-based compound (b3) is a compound having a thiazole group and having no —SC—X (X: halogen atom).
  • Examples of the thiazole-based compound (b3) include thiazole group-containing benzimidazole derivatives, isothiazolin-3-one derivatives, 1,2-benzisothiazolin-3-one derivatives, benzthiazole derivatives, and isothiazole derivatives. These can be used alone or in combination of two or more. In the present invention, thiazole group-containing benzimidazole derivatives are preferred.
  • the thiazole group-containing benzimidazole derivative is preferably a compound represented by the following general formula (3).
  • R 1 and R 2 are the same or different and each represents a hydrogen atom, a halogen atom, an amino group, a sulfonic acid (salt) group, a nitro group, a hydroxyl group, a hydrocarbon group which may have a substituent, It is another organic group, R 3 is a hydrogen atom, an alkyl group which may have a substituent, or an aryl group which may have a substituent, and R 5 is an alkylene group. M is 0 or 1. ]
  • Examples of the compound represented by the general formula (3) are shown below.
  • the compound on the left is 2- (4-thiazolyl) -1H-benzimidazole.
  • the isothiazolin-3-one derivative is preferably a compound represented by the following general formula (4).
  • R 6 and R 7 are the same or different and are a hydrogen atom, a halogen atom or a hydrocarbon group which may have a substituent, and R 8 represents a hydrocarbon which may have a substituent. It is a group.
  • Examples of the compound represented by the general formula (4) include 2-methyl-4-isothiazolin-3-one, 2- (n-octyl) -4-isothiazolin-3-one, and 5-chloro-2-methyl- 4-isothiazolin-3-one, 4,5-dichloro-2-cyclohexyl-4-isothiazolin-3-one, 2-methyl-5-phenyl-4-isothiazolin-3-one, 2-hydroxymethyl-4-isothiazoline -3-one and the like. These can be used alone or in combination of two or more.
  • the 1,2-benzisothiazolin-3-one derivative is preferably a compound represented by the following general formula (5).
  • R 9 and R 10 are the same or different and each represents a hydrogen atom, a halogen atom, a nitro group, a carboxyl group, a cyano group or a hydrocarbon group which may have a substituent, and R represents a hydrogen atom Or it is an organic group.
  • Examples of the compound represented by the general formula (5) include the following.
  • the benzthiazole derivative is preferably a compound represented by the following general formulas (6) and (7).
  • R 9 and R 10 are the same or different and each represents a hydrogen atom or a hydrocarbon group which may have a substituent; R represents —SM (M represents a metal atom such as Na or Zn; Or an organic group.
  • R 9, R 10 and R 11 are the same or different, a hydrogen atom or a substituent hydrocarbon group which may have a, R 12 is, R 13 are the same or different, organic It is a group.
  • Examples of the compound represented by the general formula (6) include 2- (4-thiocyanomethylthio) benzthiazole, 2-mercaptobenzthiazole sodium, and 2-mercaptobenzthiazole zinc. These can be used alone or in combination of two or more.
  • thiazole compound (b3) 2- (4-thiazolyl) -1H-benzimidazole is particularly preferable.
  • the content of the thiazole compound (b3) contained in the component [B] is 0.
  • the content is from 01 to 5% by mass, preferably from 0.03 to 4% by mass, and more preferably from 0.05 to 3% by mass.
  • the content of the thiazole compound (b3) is within the above range, the growth of fungi, bacteria, wood rot fungi, algae and marine organisms is controlled, and further, the fungicidal, fungicidal, antialgal, and deodorant properties are controlled. It has excellent properties and antiseptic properties and is excellent in sustainability of these effects.
  • the haloalkylthio compound (b4) is a haloalkylthio compound and is usually a compound having a —S—C—X bond (X: halogen atom).
  • Examples of the haloalkylthio compound (b4) include haloalkylthiosulfamide derivatives, haloalkylthiophthalimide derivatives, haloalkylthiotetrahydrophthalimide derivatives, and the like. These can be used alone or in combination. In the present invention, haloalkylthiosulfamide derivatives are preferred.
  • haloalkylthiosulfamide derivatives examples include N-trichloromethylthio-N- (phenyl) methylsulfamide, N-trichloromethylthio-N- (4-chlorophenyl) methylsulfamide, N- (1-fluoro-1 , 1,2,2-tetrachloroethylthio) -N- (phenyl) methylsulfamide, N- (1,1-difluoro-1,2,2-trichloroethylthio) -N- (phenyl) methylsulfamide N, N-dimethyl-N′-phenyl-N ′-(fluorodichloromethylthio) sulfamide, N, N-dimethyl-N ′-(p-tolyl) -N ′-(fluorodichloromethylthio) sulfamide, and the like.
  • haloalkylthiosulfamide derivatives N, N-dimethyl-N′-phenyl-N ′-(fluorodichloromethylthio) sulfamide is preferred.
  • haloalkylthiophthalimide derivatives include N-fluorodichloromethylthiophthalimide and N-trichloromethylthiophthalimide. These can be used alone or in combination of two or more.
  • haloalkylthiotetrahydrophthalimide derivative examples include N-1,1,2,2-tetrachloroethylthiotetrahydrophthalimide, N-trichloromethylthiotetrahydrophthalimide and the like. These can be used alone or in combination of two or more.
  • N, N-dimethyl-N′-phenyl-N ′-(fluorodichloromethylthio) sulfamide is particularly preferable.
  • the content of the haloalkylthio compound (b4) contained in the component [B] is 0 when the total of the components (b1), (b2), (b3) and (b4) is 100% by mass. 0.01 to 5% by mass, preferably 0.03 to 4% by mass, more preferably 0.05 to 2.5% by mass.
  • the fungi, bacteria, wood decay fungi, algae and marine organisms are controlled, and further, fungicidal, fungicidal, antialgal, It is excellent in deodorization and antiseptic properties and excellent in sustainability of these effects.
  • the said component [B] may consist of said component (b1), (b2), (b3) and (b4), and contains the other component which has an antifungal action and / or an antibacterial action It may be.
  • the ratio of the total amount of the components (b1), (b2), (b3) and (b4) to the component [B] is usually It is 90 to 100% by mass, preferably 95 to 100% by mass.
  • the component [B] may further contain an organic bromide compound (b5).
  • this component (b5) is contained, it is excellent in antibacterial properties against spore bacteria such as Bacillus genus, Clostridium genus and the like, and wood decay fungi.
  • component (b5) examples include 2,2-dibromo-3-nitrilopropionamide, 2,2-dibromo-4-nitrilobutanamide, 1,2-dibromo-2,4-dicyanobutane, 2-bromo-2 Nitrile group (cyan group) -containing compounds such as bromomethylglutaronitrile; 2-bromo-2-nitro-1,3-propanediol, 2-bromo-2-nitro-1,3-butanediol, 3-bromo Alcoholic hydroxyl group-containing compounds such as -3-nitro-2,4-pentanediol and 2,2-dibromo-2-nitroethanol; ⁇ -bromocinnamaldehyde, 2,2-dibromoacetophenone, 2,2-dibromo-4 '-Hydroxyacetophenone, 2-bromo-4'-hydroxyacetophenone, bis-1,4-bromoacetoxy-2-butene, benzy
  • nitrile groups such as 2,2-dibromo-3-nitrilopropionamide, 2,2-dibromo-2-nitroethanol, 1,2-dibromo-2,4-dicyanobutane (cyanide) are preferred.
  • alcoholic hydroxyl group containing compounds such as 2-bromo-2-nitro-1,3-propanediol; bis-1,4-bromoacetoxy-2-butene and hexabromodimethylsulfone, more preferably 2- Bromo-2-nitro-1,3-propanediol and 1,2-dibromo-2,4-dicyanobutane, particularly preferably 2-bromo-2-nitro-1,3-propanediol.
  • the content of the component (b5) is 100 parts by mass of the total of the components (b1), (b2), (b3), and (b4).
  • the amount is preferably 0.01 to 3 parts by mass, more preferably 0.02 to 2.5 parts by mass, and still more preferably 0.03 to 2 parts by mass.
  • the component (b1) is methyl 1H-2-benzimidazole carbamate
  • the component (b2) is an iodosulfonylbenzene derivative
  • the component (b3) is a benzimidazole derivative having a thiazole group
  • component (b4) is a haloalkylthiosulfamide derivative
  • the conventional content of components (b1), (b2), (b3), (b4) and (b5) is adjusted to the following proportions.
  • Spore fungi such as Bacillus cereus, Clostridium botulinum, Clostridium perfringens (Clostridial perfringens), and Sugihiratake, which were difficult to achieve with the fungicide composition
  • the content of each component is preferably 94.5-99.2% by mass, 0.1-2% by mass, 0.1-2% by mass and 0.1-1.5% by mass, more preferably 95.8-99% by mass, 0.35-1.5% by mass, 0.35 -1.5% by mass and 0.3-1.2% by mass.
  • the content of component (b5) is preferably 0.03 to 1.5 parts by mass when the total of components (b1), (b2), (b3) and (b4) is 100 parts by mass, More preferably, it is 0.05 to 0.8 part by mass.
  • Still other antibacterial agents include organic antibacterial agents, inorganic antibacterial agents, and organic / inorganic antibacterial agents.
  • organic antibacterial agents include nitrile compounds such as 2,4,5,6-tetrachloroisophthalonitrile and 5-chloro-2,4,6-trifluoroisophthalonitrile; 2,3,5,6- Examples thereof include pyridine compounds such as tetrachloro-4-methylsulfonylpyridine and sodium 2-pyridinethiol-1-oxide. These can be used alone or in combination of two or more.
  • the inorganic antibacterial agents include silver antibacterial agents such as silver ion retention type and silver complex salt retention type; titanium oxide antibacterial agents; copper antibacterial agents; zinc oxide antibacterial agents. These can be used alone or in combination of two or more.
  • the component [B] may be a powder mixture containing the components (b1), (b2), (b3), (b4), etc., and is dispersed in water, an organic solvent, or a mixed medium thereof. Alternatively, it may be a dissolved composition. In addition to the above powder mixture and the composition dispersed or dissolved in the medium, this component [B] can be used as a mixture containing a predetermined amount of additives to be described later.
  • the mixing method may be a conventionally known method, and may be either a dry method or a wet method. Examples of the mixing device include a rocking mill, a tumbler mixer, a drum mixer, a mixing shaker, a rocking shaker, a V-type mixer, and a W-type mixer.
  • the content of the component [B] is 0.01 to 10 parts by mass, preferably 0.05 to 8 parts, relative to 100 parts by mass of the component [A]. Part by mass, more preferably 0.08 to 5 parts by mass, particularly preferably 0.1 to 3 parts by mass.
  • the resulting molded article, film, etc. control the growth of fungi, bacteria, wood decay fungi, algae and marine organisms, and further, fungicidal, antibacterial It has excellent properties, anti-algae properties, deodorization properties and antiseptic properties, and is excellent in sustainability of these effects.
  • the external appearance properties such as a molded product obtained, will fall.
  • the antifungal resin composition of the present invention comprises an antioxidant, a plasticizer, an ultraviolet absorber, a weathering (light) agent, an antistatic agent, a lubricant, a crystal nucleating agent, a filler, a flame retardant, a foaming agent, a spreading agent.
  • the properties of the antifungal resin composition of the present invention are not particularly limited, and depending on the purpose, application, etc., a solid (pellet, powder mixture), liquid, a dispersion liquid in which raw material components are dispersed in a medium, a raw material It can be set as the solution etc. in which a component is melt
  • the antifungal resin composition of the present invention is preferably a solid and a molding material.
  • the antifungal resin composition of the present invention can be produced by supplying the raw material components or a mixture thereof to various extruders, Banbury mixers, kneaders, continuous kneaders and the like and kneading them.
  • a preferable production method is a method using an extruder, and among them, a method using a multi-screw extruder, and a method combining an extruder, a Banbury mixer, a continuous kneader and the like are preferable.
  • the raw material components are kneaded, the entire amount may be kneaded in a lump or may be kneaded while being divided and blended in multiple stages.
  • a molded article can be obtained using the antifungal resin composition of the present invention. Moreover, a molded article can also be obtained using the raw material composition formed by dividing the components [A] and [B] contained in the antifungal resin composition of the present invention into two or more. That is, the molded article of the present invention contains the above-mentioned antifungal resin composition of the present invention.
  • the molded product of the present invention may have a uniform composition throughout, or the concentration of the component [B] may vary in a predetermined direction, and the effect of the present invention is desired.
  • the specific part to be formed may be formed by the antifungal resin composition of the present invention.
  • the form thereof is not particularly limited, and is a predetermined shape body (film, fiber, tube, etc.) such as a plate shape, a linear shape, a ring shape, a net shape, a cylindrical shape, a semi-cylindrical shape, or a deformed shape. be able to. These may be either solid or foam.
  • the molded product of the present invention may include a through hole, a groove, a concave portion, a convex portion, and the like at an arbitrary place.
  • the molded product of the present invention uses a mold-resistant resin composition having a uniform composition such as pellets, injection molding, (co) extrusion molding (sheet molding, film molding), profile extrusion molding, press molding, vacuum molding, foaming. It can be produced by a known method such as molding, melt spinning, dry spinning, or wet spinning.
  • the antifungal resin composition can be produced so as to be unevenly distributed at the site.
  • the composition in which the content rate of component [B] in an antifungal resin composition differs can also be manufactured by supplying in steps, for example.
  • the component [A] and [B] are mixed in advance at a high concentration (for example, 3 to 50% by mass).
  • a high concentration for example, 3 to 50% by mass.
  • a resin layer containing the antifungal resin composition of the present invention is provided on the surface of an article or layer made of another material.
  • Laminate provided composite article, laminate film, laminate sheet, etc.
  • laminate comprising two or more resin layers containing the antifungal resin composition of the present invention.
  • the antifungal resin composition of the invention may be a laminate (composite article, laminated film, laminated sheet, etc.) provided with a film formed by using it as a paint or the like.
  • the antifungal resin composition of the present invention is a paint, an adhesive, a sealing agent, or the like
  • the components [A] and [B] and additives used as necessary are added with water and / or It can be produced by dispersing or dissolving in a medium composed of an organic solvent.
  • the paint is applied (brush coating, spraying, dipping), roll, flow, curtain, knife coating on the surface of a predetermined shape made of resin, metal, wood, paper, fiber, mortar, plaster, decorative gypsum board, etc. , Spin coating, printing, etc.), drying, etc., a film or the like can be formed.
  • the molded article of the present invention, or an article having a film or the like formed of the antifungal resin composition of the present invention generates or proliferates bacteria, organisms, etc. during use, transportation or storage of these products. However, it is suitable for use in a place where it adheres to or breeds a product.
  • the fungicide composition of the present invention contains a benzimidazole compound (b1), an organic iodine compound (b2), a thiazole compound (b3), and a haloalkylthio compound (b4), and each component.
  • a benzimidazole compound (b1) an organic iodine compound (b2), a thiazole compound (b3), and a haloalkylthio compound (b4), and each component.
  • the antifungal agent composition of the present invention can further contain an organic bromide compound (b5).
  • the description in said component [B] is applied about the compound of said component (b1), (b2), (b3), (b4) and (b5), a content rate, etc.
  • the antifungal composition of the present invention may further contain other antibacterial agents and the like as long as the effects of the present invention are not impaired.
  • examples of other antibacterial agents include organic antibacterial agents, inorganic antibacterial agents, and organic / inorganic antibacterial agents.
  • the antifungal composition of the present invention includes additives such as a dispersant, a spreading agent, a fragrance, an antioxidant, a bulking agent, an excipient, a colorant, and an antifreezing agent, depending on the purpose and application. It may contain.
  • the fungicide composition of the present invention may be a powder mixture (I) containing the above components (b1), (b2), (b3), (b4), etc., water, an organic solvent, or The composition (II) may be dispersed or dissolved in these mixed media.
  • the antifungal composition of the present invention can be obtained by mixing predetermined amounts of the above components (b1), (b2), (b3), (b4) and the like.
  • the mixing method may be a conventionally known method, and may be either a dry method or a wet method. Examples of the mixing device include a rocking mill, a tumbler mixer, a drum mixer, a mixing shaker, a rocking shaker, a V-type mixer, and a W-type mixer.
  • the antifungal composition of the present invention is the above powder mixture (I), it is suitable for molding materials prepared by blending with resin or the like; antiseptics; antifouling agents and the like. Using this molding material, it is also possible to make a molded product; a laminated product formed by laminating thin bodies.
  • the fungicide composition of the present invention is the composition (II), it is used as a paint or the like, and imparts antifungal properties to its surface by coating or spraying on a resin molded product, fiber or the like. be able to.
  • the fungicide composition of the present invention is suitable for use in a place where fungi, organisms, etc. are generated or proliferate during use, transportation or storage of the product, and adhere to or breed on the product.
  • the antifungal agent composition of the present invention, the antifungal resin composition of the present invention containing the same, and the molded product obtained using this resin composition are resistant to fungi, bacteria, wood decay fungi, algae, marine organisms, etc. And has resistance.
  • Examples of the fungus include those shown in Table 5.
  • bacteria examples include yeast, spore bacteria, actinomycetes, Escherichia coli, Pseudomonas aeruginosa, Bacillus subtilis, Staphylococcus aureus, and specific examples include Bacillus cereus, Bacillus subtilis, Clostridium botulinum, Clostridium perfringens, Escherichia coli, , Lactobacillus bulgericus, Micrococcus glamaticus, Paecilomyces lilacinus, Pseudomonas aeruginosa, Pseudomonas flureseus, Proteus vulgaris, Proteus vulgariz a, Rhizoctonia solani, Streptomyces aureofaciene, Staphylococcus aureus, Staphylococcus faecalis, Salmonella arizonae, Saccharomyces cerevisiae, Saccharomyces rouxii,
  • wood-rotting fungi examples include Sugihiratake, Kawaratake, Statake, Namidatake, Watakusaretake, Ouzuratake and the like.
  • algae examples include those shown in Table 7.
  • marine organisms include mussels, oysters, hydroworms, barnacles, sea anemones, mussels, and seaweeds.
  • the components used in the production of the resin composition are shown below. 1-1.
  • As the resin (A2) an ABS resin (trade name “Techno ABS 810”, manufactured by Techno Polymer Co., Ltd.) was used.
  • As the resin (A3) AES resin (trade name “Techno AES W210”, manufactured by Techno Polymer Co., Ltd.) was used.
  • AS resin (trade name “Sunrex SAN-R”, manufactured by Techno Polymer Co., Ltd.) was used.
  • the resin (A5) a polystyrene resin (trade name “PSJ polystyrene GPPS679”, manufactured by PS Japan Ltd.) was used.
  • the resin (A6) ABS / PC alloy (trade name “Excelloy CK20”, manufactured by Techno Polymer Co., Ltd.) was used.
  • the resin (A7) a polycarbonate resin (trade name “NOVAREX 7022A”, manufactured by Mitsubishi Engineering Plastics) was used.
  • a polypropylene resin (trade name “NOVATEC PPBC6C”, manufactured by Nippon Polypro Co., Ltd.) was used.
  • resin (A9) a polyethylene resin (trade name “NOVATEC LDLF122”, manufactured by Nippon Polyethylene Co., Ltd.) was used. Further, polybutylene terephthalate resin (trade name “Novaduran 5010R5”, manufactured by Mitsubishi Engineering Plastics) was used as the resin (A10).
  • composition was evaluated as follows. 2-1. Growth inhibitory minimum concentration Based on the test method described in “Koji Inspection Manual Color Chart” (published by Techno System) supervised by Kosuke Takatori, fungi, fungi, bacteria, algae, wood decay fungi and Each culture temperature, humidity, and medium in marine organisms were selected and the minimum growth inhibition concentration was measured. The unit of the numbers in the table is ppm. “-” Means that there was no effect.
  • Judgment criteria are “1” when the bacteria do not grow at all, “2” when the growth of the bacteria is 10% or less on the upper surface area of the test piece, and when 30% or less exceeding 10% Was “3”, “4” when 30% and 60% or less, and “5” when 60%. The results are shown in Table 6.
  • ⁇ Test bacterial solution (1) Mixed spore solution An aqueous solution obtained by removing agar from the medium was added to the spore, and the mixture was adjusted to 10 6 ⁇ 200,000 per milliliter and mixed in equal amounts. (2) Wetting liquid A 0.05 g / liter sodium laurate aqueous solution was used. ⁇ Culture conditions> Using a circulator with a temperature / humidity thermostat, the temperature was 28 ° C. to 30 ° C., the relative humidity was 85% or more, and the cells were cultured for 60 days.
  • test piece in the above section 2-2 a test bacterial solution containing the test bacteria (71 fungi) shown in Table 5, and a test bacterial solution containing the algae (27 species) shown in Table 7 was used to evaluate the sustainability of algae. That is, the test bacterial solution in the above section 2-2 is sprayed on the surface of the test piece disposed on the medium, and then the test bacterial solution containing algae (27 species) is sprayed under the following conditions: The cells were cultured for 28 days, and the degree of algae generation after 7 days, 14 days, 21 days and 28 days was observed.
  • Judgment criteria are “1” when there is no growth of algae, “2” when growth of algae is 10% or less on the surface area of the upper surface of the test piece, and when 20% or less exceeding 10% Is “3”, 20% is 30% or less and “4”, and 30% is “5”.
  • the results are shown in Table 8.
  • ⁇ Medium> 1.25 g KNO 3 , 1.25 g MgSO 4 .7H 2 O, 1.25 g NaCl, 0.05 g FeSO 4 .4H 2 O, 0.1 g CaCl 2 , 0.35 g K 3 HPO 4 and 15 g of agar were added to 1,000 ml of pure water and heated at 121 ° C. for 15 minutes to be dissolved.
  • the pH was adjusted to 5.8 to obtain a Detmer agar medium.
  • 1,500 Lux positive fluorescent lamp
  • Judgment criteria are “-” when there is no marine organism attached to the surface of the fungicide layer, “+” when the marine organism adheres to the surface area of the net string of 10% or less, and “+” 10%.
  • the case of exceeding 50% or less was designated as “++”, and the case of exceeding 50% was designated as “++++”.
  • Table 9 The results are shown in Table 9.
  • Comparative Example 1-1 is an example in which the content ratio of the component (b1) is small outside the scope of the present invention, that is, an example in which the content ratio of the components (b2) to (b4) is large and has an antifungal property. Few fungi were exhibited. In addition, even the fungi exhibiting the effect had a high growth inhibition minimum concentration. Comparative Example 1-2 is an example consisting of only component (b1), and there were few fungi exhibiting antifungal properties. In addition, even the fungi exhibiting the effect had a high growth inhibition minimum concentration. And the resistance with respect to a fungus and the sustainability of the effect with respect to algae were not enough.
  • Comparative Example 1-3 is an example not containing the components (b3) and (b4), and there were few fungi exhibiting antifungal properties. In addition, even the fungi exhibiting the effect had a high growth inhibition minimum concentration. Comparative Example 1-4 is an example not containing the components (b2) and (b4), and there were few fungi exhibiting antifungal properties. In addition, even the fungi exhibiting the effect had a high growth inhibition minimum concentration. Comparative Example 1-5 is an example not containing the components (b2) and (b3), and there were few fungi exhibiting fungicidal properties. In addition, even the fungi exhibiting the effect had a high growth inhibition minimum concentration.
  • Comparative Example 1-6 the composition of Example 2 in JP-A-8-92012, that is, the content of component (b1) is large outside the scope of the present invention, and the content of components (b2) to (b4) is high. This is a few examples, and there were few fungi exhibiting antifungal properties. In addition, even the fungi exhibiting the effect had a high growth inhibition minimum concentration. And the resistance with respect to a fungus and the sustainability of the effect with respect to algae were not enough. Comparative Examples 1-7 to 1-9 are all examples in which the content of component (b1) is small outside the scope of the present invention, that is, the content of components (b2) to (b4) is large. There were few fungi exhibiting antifungal properties.
  • each of Examples 1-1 to 1-10 is an example containing components (b1) to (b4) in a predetermined range, and includes fungi, bacteria (including yeast, spore fungus, actinomycetes), Controls the growth of wood-rotting fungi, algae and marine organisms, and the decay of wood, and also has excellent antifungal, antibacterial, algal, anti-odor and antiseptic properties, and excellent sustainability of these effects. I understand.
  • Test specimens for evaluation were prepared using an injection molding machine “35AD” (model name) manufactured by Nippon Steel Works, in which the pellets were sufficiently dried and the resin melting temperature was set to 180 ° C. to 240 ° C. It was obtained by cutting a flat molded product having a length of 80 mm, a width of 55 mm, and a thickness of 2.4 mm. The size is 30 mm in length, 30 mm in width, and 2.4 mm in thickness.
  • Comparative Example 2-5 the following evaluation was stopped because the antifungal agent composition bleeded out from the surface of the flat plate-shaped molded article, resulting in poor appearance.
  • ⁇ Test bacterial solution (1) Mixed spore solution An aqueous solution obtained by removing agar from the medium was added to the spore, and the mixture was adjusted to 10 6 ⁇ 200,000 per milliliter and mixed in equal amounts. (2) Wetting liquid A 0.05 g / liter sodium laurate aqueous solution was used. ⁇ Culture conditions> Using a circulator with a temperature / humidity thermostat, the temperature was 28 ° C. to 30 ° C., the relative humidity was 85% or more, and the cells were cultured for 60 days.
  • test piece in the above section 3-1, and a test bacterial solution containing the test bacteria (71 fungi) shown in Table 5, and a test bacterial solution containing the algae (27 species) shown in Table 7 was used to evaluate the sustainability of algae. That is, the test bacterial solution in the above section 3-1 is sprayed on the surface of the test piece disposed on the medium, and then the test bacterial solution containing algae (27 species) is sprayed under the following conditions: The cells were cultured for 28 days, and the degree of algae generation after 7 days, 14 days, 21 days and 28 days was observed.
  • Judgment criteria are “1” when there is no growth of algae, “2” when growth of algae is 10% or less on the surface area of the upper surface of the test piece, and when 20% or less exceeding 10% Is “3”, 20% is 30% or less and “4”, and 30% is “5”.
  • the results are shown in Table 17.
  • ⁇ Medium> 1.25 g KNO 3 , 1.25 g MgSO 4 .7H 2 O, 1.25 g NaCl, 0.05 g FeSO 4 .4H 2 O, 0.1 g CaCl 2 , 0.35 g K 3 HPO 4 and 15 g of agar were added to 1,000 ml of pure water and heated at 121 ° C. for 15 minutes to be dissolved.
  • the pH was adjusted to 5.8 to obtain a Detmer agar medium.
  • 1,500 Lux positive fluorescent lamp
  • Comparative Example 2-24 an actual net test was conducted using an acrylic paint not containing the antifungal agent composition [B]. Judgment criteria are “-” when there is no marine organism attached to the surface of the fungicide layer, “+” when the marine organism adheres to the surface area of the net string of 10% or less, and “+” 10%. The case of exceeding 50% or less was designated as “++”, and the case of exceeding 50% was designated as “++++”. The results are shown in Table 18.
  • Comparative Examples 2-1, 2-6, 2-14 and 2-18 are examples containing no component [B], and the resistance to fungi was poor (see Tables 15 and 16).
  • Comparative Examples 2-2 and 2-7 are examples containing the fungicide composition B12 consisting only of the component (b1), and the resistance to fungi and the sustainability of the effect on algae were not sufficient ( Table 15 and Table 17).
  • Example 2 in JP-A-8-92012 that is, the content of component (b1) is This is an example using the fungicide composition B16 which is outside the scope of the present invention and has a low content of components (b2), (b3) and (b4), and exhibits antifungal properties as described above. There are few fungi (see Table 4). Moreover, in these comparative examples, resistance to fungi and persistence of the effect on algae were not sufficient (Table 10, Table 11, Table 12, Table 13, Table 14, Table 15, Table 16, and Table 17). reference).
  • Comparative Examples 2-4, 2-9, 2-11, 2-12, 2-20 and 2-21 use the antifungal agent composition B17 in which the content of component (b1) is small outside the scope of the present invention.
  • the resistance to fungi and the persistence of the effect on algae were not sufficient (see Table 10, Table 11, Table 12, Table 14, Table 15, Table 16, and Table 17).
  • Comparative Examples 2-13 and 2-16 are examples using the fungicide composition B18 in which the content of the component (b1) is small outside the scope of the present invention, and the resistance to fungi and the effect on algae are Persistence was not sufficient (see Table 12, Table 13, Table 16, and Table 17).
  • Comparative Examples 2-22 and 2-23 are examples using a paint containing the antifungal agent composition B17 in which the content ratio of the component (b1) is small outside the scope of the present invention. Yes, marine life repellent was not enough. Comparative Example 2-24 was an example containing no component [B], and the repellent properties of marine organisms were not sufficient (see Table 18).
  • Examples 2-1 to 2-33 are examples using the components (b1) to (b4) or the component [B] containing the components (b1) to (b5) in a predetermined ratio.
  • bacteria including yeast, spore fungus, actinomycetes
  • wood decay fungi including yeast, spore fungus, actinomycetes
  • algae and marine life and wood decay
  • the molded article of the present invention, or an article having a film or the like formed of the antifungal resin composition of the present invention generates or proliferates bacteria, organisms, etc. during use, transportation or storage of these products. However, it is suitable for use in a place where it adheres to or breeds a product. Specific fields include weak electricity-related products, daily necessities, sports / leisure products, building and civil engineering materials, agricultural and forestry materials, fishery materials, industrial materials, materials for public institutions, transportation-related materials, textile products, etc. It is done.
  • Weak electricity-related products include refrigerators, washing machines, vacuum cleaners, fans, dryers, air conditioners, telephones, electric kettles, rice cookers, dishwashers, dish dryers, microwave ovens, mixers, VTRs, TVs, watches, stereos , Tape recorders, OA devices, etc., and can be a housing, a handle, a tray, or the like.
  • Living items include bathroom items, kitchen items (triangular corners, chopping boards, balls, lanterns, etc.), laundry items, cleaning items (brushes, etc.), rugs, interior items, stationery items (fountain pens, mechanical pencils, ballpoint pens, etc.), curtains , Towels, bedding, beds, rain gear, garbage baskets, flower vases, gardening tools, flower pots, cushions, bags, flags, etc.
  • sports / leisure goods include sports equipment, sports clothing, protectors, gloves, shoe materials, saddle materials, grip taping materials, pool equipment, park equipment, beach equipment, shading materials, tents, ropes, boat yacht equipment, etc. .
  • Examples of building civil engineering materials include tents, curing sheets, curing meshes, antifouling membrane materials, canvases, roofing materials, artificial turf, building interior materials, interior material reinforcing fibers, paint reinforcing fibers, and wall soil reinforcing fibers.
  • Agricultural and forestry materials include water tanks, cocoons, agricultural hoses, agricultural films, greenhouse equipment, cold cocoons, hydroponics materials, insect nets, and the like.
  • Examples of fishery materials include fishing nets, aquaculture equipment, mooring ropes, fenders, sea anchors, and floating bodies.
  • Industrial materials include water pipes, hoses, conveyor belts, land nets, land ropes, filters, felts, various containers, packaging materials, drainage side gutters, water treatment materials, food processing plant materials, control devices, and home appliances. And buttons such as computers, operation instruments, optical instruments, various medical instruments, water evaporation materials, and the like.
  • materials for public institutions and traffic-related materials interior and exterior materials for automobiles, door handles, hanging leather, buttons for operating vending machines, escalator handles, guide ropes, road signs, materials for advertisement signs, interiors for hospitals and nursing homes Goods materials, interior materials and the like.
  • textile products include woven knitted fabrics, fabrics, spunbonds, felts, synthetic paper intermediate products, and further processed clothing (outer clothes, work clothes, underwear, socks, hats, etc.) and knitted clothing. , Industrial sewing products, strings, tapes, ropes, ribbons and the like.
  • the processed product is also used for the purpose of giving the effect of the present invention to nearby articles.
  • a product can be arranged for the purpose of preventing the invasion of bacteria and fungi, or a mesh product can be arranged for the purpose of reducing the invasion of flying bacteria.
  • the fungicide composition of the present invention is also suitable for use in a place where bacteria, organisms, etc. are generated or proliferate during use, transportation or storage of the product, and adhere to or propagate the product.
  • it can be used in the fields of paper / pulp industry, chemical industry, high-tech industry, livestock industry, fishery industry, agriculture, forestry, etc., specifically, fiber, wood / building materials, leather, adhesive, metal Processing oil, rubber, plastic film, cooling water, electrical equipment, optical equipment, air conditioner, ship bottom, fishing nets, fishing supplies, pharmaceuticals, agricultural chemicals, water, cosmetics / toiletries, sanitary goods, household goods, sports equipment , Leisure equipment, school supplies, toys, food storage, hospitals, facilities installed in nursing homes, and the like.

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Abstract

Provided are a fungicidal resin composition and a fungicide composition that are capable of controlling proliferation of fungi, bacteria (including yeasts, spore fungi, antinomyces), wood destroying fungi, algae and marine life, further, are excellent in fungicidal property, antifungal property, algae resistant property, antibromic property and antiputrefactive property, and are available in the form of a molded article or a membrane to be also excellent in continuity of effects thereof. The resin composition contains a resin, and the fungicide composition including, in predetermined quantities respectively, a benzimidazole system compound, an organic iodive system compound, a thiazole system compound and a haloalkylthio system compound. A content of the antifungal composition is 0.01 - 10 parts by mass with respect to 100 parts by mass of the resin.

Description

防かび剤組成物及びそれを含む防かび性樹脂組成物Antifungal agent composition and antifungal resin composition containing the same
 本発明は、真菌、細菌(酵母、芽胞菌、放線菌を含む)、木材腐朽菌、藻類及び海洋生物の繁殖を防除し、更に、防かび性、防菌性、防藻性、防臭性及び防腐性に優れ、これらの効果の持続性に優れる成形品、皮膜等を与える防かび性樹脂組成物及びそれに含まれる防かび剤組成物に関する。 The present invention controls the growth of fungi, bacteria (including yeast, spore fungi, actinomycetes), wood-rotting fungi, algae and marine organisms, and further has fungicidal, fungicidal, antialgal, deodorizing and The present invention relates to an antifungal resin composition which provides a molded article, a film and the like which are excellent in antiseptic properties and excellent in sustainability of these effects, and an antifungal agent composition contained therein.
 従来、清潔、快適且つ健康な環境を得る目的で、あるいは、資源及び製品の微生物、細菌等による劣化を抑制する目的で、防菌剤、防かび剤等を含む、成形品、皮膜、これらの形成材料等が広く用いられている。
 例えば、特許文献1には、樹脂に配合する生物抵抗性を有する薬剤が、ニトリル系化合物、ピリジン系化合物、ハロアルキルチオ系化合物、有機ヨード系化合物、チアゾール系化合物及びベンズイミダゾール系化合物からなる群より選択される少なくとも4種の化合物であり、且つ、薬剤の含有量が、成形品を構成する全成分に対して0.05~30重量%の範囲である生物抵抗性成形品が開示されている。
 特許文献2には、2-(n-オクチル)-4-イソチアゾリン-3-オン、ビス(2-ピリジルチオ-1-オキシド)亜鉛塩及びベンズイミダゾール系化合物を有効成分とする工業用抗菌組成物と、ポリ塩化ビニルとからなる樹脂組成物が開示されている。
 また、特許文献3には、特定のゴム強化スチレン系樹脂を主成分とする熱可塑性樹脂100質量部に対して、亜鉛を必須成分として含有する無機系複合物0.01~5質量部を配合してなる抗菌性熱可塑性樹脂組成物が開示されている。
Conventionally, for the purpose of obtaining a clean, comfortable and healthy environment, or for the purpose of suppressing the deterioration of resources and products due to microorganisms, bacteria, etc., molded articles, films, and the like containing antibacterial agents and fungicides, etc. Forming materials are widely used.
For example, Patent Document 1 discloses that a bioresistant agent to be blended in a resin includes a nitrile compound, a pyridine compound, a haloalkylthio compound, an organic iodo compound, a thiazole compound, and a benzimidazole compound. Disclosed is a bioresistant molded article that is at least four selected compounds and that has a drug content in the range of 0.05 to 30% by weight with respect to all components constituting the molded article. .
Patent Document 2 discloses an industrial antibacterial composition comprising 2- (n-octyl) -4-isothiazolin-3-one, bis (2-pyridylthio-1-oxide) zinc salt and a benzimidazole compound as active ingredients. A resin composition comprising polyvinyl chloride is disclosed.
Patent Document 3 contains 0.01 to 5 parts by mass of an inorganic composite containing zinc as an essential component with respect to 100 parts by mass of a thermoplastic resin mainly composed of a specific rubber-reinforced styrene resin. An antibacterial thermoplastic resin composition is disclosed.
 また、防菌剤、防かび剤等は、清潔、快適且つ健康な環境を得る目的で、あるいは、資源及び製品の微生物による劣化を抑制する目的で、各種産業に用いられる製品において、極めて重要な位置を占めるようになっている。
 例えば、特許文献4には、ニトリル系抗菌剤、ピリジン系抗菌剤、ハロアルキルチオ系抗菌剤、有機ヨード系抗菌剤及びチアゾール系抗菌剤を有効成分として含有する抗菌組成物、並びに、これらの抗菌剤とベンズイミダゾール系抗菌剤とを含有する抗菌組成物が開示されている。
 特許文献5には、2-ピリジンチオール-1-オキシドナトリウム、2,3,5,6-テトラクロロ-4-メチルスルホニルピリジン、2-(n-オクチル)-4-イソチアゾリン-3-オン、ジヨードメチル-p-トリル-スルホン、メチル(ベンズイミダゾール-2-イル)カルバメート及び1,2-ベンズイソチアゾリン-3-オンの2種以上を、それぞれ0.1%(質量)以上含む防菌、防かび、防藻、抗菌組成物が開示されている。
 特許文献6には、特定の構造を有するリン酸チタニウム系化合物又はその縮合体を有効成分とする消臭組成物に、ニトリル系抗菌剤、ピリジン系抗菌剤、ハロアルキルチオ系抗菌剤、ベンズイミダゾール系抗菌剤、有機ヨード系抗菌剤、イソチアゾリル系抗菌剤及びチアゾール系抗菌剤の2種以上をそれぞれ0.1~40質量%含む混合物を1~10質量%を加えた防かび剤、抗菌剤及び消臭剤が開示されている。
In addition, antibacterial agents, fungicides, etc. are extremely important in products used in various industries for the purpose of obtaining a clean, comfortable and healthy environment, or for the purpose of suppressing degradation of resources and products by microorganisms. Occupies a position.
For example, Patent Document 4 discloses an antibacterial composition containing a nitrile antibacterial agent, a pyridine antibacterial agent, a haloalkylthio antibacterial agent, an organic iodine antibacterial agent and a thiazole antibacterial agent as active ingredients, and these antibacterial agents. And an antibacterial composition containing a benzimidazole antibacterial agent.
Patent Document 5 includes 2-pyridinethiol-1-oxide sodium, 2,3,5,6-tetrachloro-4-methylsulfonylpyridine, 2- (n-octyl) -4-isothiazolin-3-one, and diiodomethyl. -Antibacterial and fungicidal substances containing at least 0.1% (mass) of p-tolyl-sulfone, methyl (benzimidazol-2-yl) carbamate and 1,2-benzisothiazolin-3-one, An anti-algae and antibacterial composition is disclosed.
Patent Document 6 discloses a deodorizing composition containing a titanium phosphate compound having a specific structure or a condensate thereof as an active ingredient, a nitrile antibacterial agent, a pyridine antibacterial agent, a haloalkylthio antibacterial agent, and a benzimidazole type. Antifungal agent, antibacterial agent and antibacterial agent containing 1 to 10% by mass of a mixture containing 0.1 to 40% by mass of each of two or more of antibacterial agent, organic iodine antibacterial agent, isothiazolyl antibacterial agent and thiazole antibacterial agent An odorant is disclosed.
 特許文献7には、木材腐朽菌(オオウズラタケ、カワラタケ等)に対して防除効果を有する、スルホン酸塩あるいはラウリル硫酸エステル塩を含むアニオン系界面活性剤を有効成分とする木材防腐剤が開示されている。
 また、特許文献8には、インドール化合物及びピリジン化合物を有効成分として含む水中有害付着生物防除剤が開示されている。
Patent Document 7 discloses a wood preservative containing, as an active ingredient, an anionic surfactant containing a sulfonate or a lauryl sulfate ester salt, which has an effect of controlling against wood-rotting fungi (such as Prunus edulis and Kawaratake). Yes.
Patent Document 8 discloses an underwater harmful organism control agent containing an indole compound and a pyridine compound as active ingredients.
特開平9-157111号JP-A-9-157111 特開2005-23017号Japanese Patent Laying-Open No. 2005-23017 特開2006-239904号JP 2006-239904 A 特開平8-92012号JP-A-8-92012 特開2005-298494号JP 2005-298494 A 特開2006-52209号JP 2006-52209 A 特開2007-15959号JP 2007-15959 A 特開平10-45512号JP-A-10-45512
 上記特許文献1~3から明らかなように、近年、提案される樹脂組成物等は、その目的に合わせて、複数の成分を所定割合で組み合わせてなる防かび剤を含有するものがほとんどであり、このような組成物において、抵抗性(忌避性)のスペクトル及び効果の持続性が未だ十分ではないといった問題、重金属成分により水質汚染を招くといった問題があった。
 本発明の目的は、真菌、細菌(酵母、芽胞菌、放線菌を含む)、木材腐朽菌、藻類及び海洋生物の繁殖を防除し、更に、防かび性、防菌性、防藻性、防臭性及び防腐性に優れ、これらの効果の持続性に優れる成形品(中実体、発泡体)、皮膜等を与える防かび性樹脂組成物を提供することにある。
As is apparent from the above Patent Documents 1 to 3, in recent years, most of the proposed resin compositions and the like contain an antifungal agent comprising a combination of a plurality of components in a predetermined ratio according to the purpose. In such a composition, there have been a problem that the resistance (repellency) spectrum and the sustainability of the effect are not yet sufficient, and a heavy metal component causes water pollution.
The object of the present invention is to control the growth of fungi, bacteria (including yeast, spore fungi, actinomycetes), wood-rotting fungi, algae and marine organisms, and furthermore, fungicidal, antifungal, antialgal, and deodorant It is an object of the present invention to provide an antifungal resin composition which gives a molded article (solid body, foam), a film and the like which are excellent in properties and antiseptic properties and have excellent sustainability of these effects.
 また、上記特許文献4~8から明らかなように、近年、提案される防菌剤、防かび剤等は、その目的に合わせて、複数の成分を所定の割合で含有するものがほとんどである。しかしながら、抗菌スペクトルが狭いといった問題や、効果の持続性が未だ十分ではないといった問題があった。
 本発明の目的は、真菌、細菌(酵母、芽胞菌、放線菌を含む)、木材腐朽菌、藻類及び海洋生物の繁殖を防除し、更に、防かび性、防菌性、防藻性、防臭性及び防腐性に優れ、これらの効果の持続性に優れる防かび剤組成物を提供することにある。
Further, as is apparent from the above Patent Documents 4 to 8, most of the recently proposed antibacterial agents, fungicides and the like contain a plurality of components at a predetermined ratio in accordance with the purpose. . However, there are problems such as a narrow antibacterial spectrum and a problem that the sustainability of the effect is not yet sufficient.
The object of the present invention is to control the growth of fungi, bacteria (including yeast, spore fungi, actinomycetes), wood-rotting fungi, algae and marine organisms, and furthermore, fungicidal, antifungal, antialgal, and deodorant It is providing the antifungal agent composition which is excellent in the property and antiseptic property, and is excellent in the sustainability of these effects.
 本発明者は、上記課題を解決すべく、鋭意研究した結果、樹脂、並びに、ベンズイミダゾール系化合物と、有機ヨード系化合物と、チアゾール系化合物と、ハロアルキルチオ系化合物とを特定の割合で含む防かび剤組成物及びこれを含有する樹脂組成物により、真菌、細菌(酵母、芽胞菌、放線菌を含む)、木材腐朽菌、藻類及び海洋生物の繁殖並びに木材の腐朽を防除し、更に、防かび性、防菌性、防藻性、防臭性及び防腐性に優れ、これらの効果の持続性に優れる成形品が得られたことを見出した。 As a result of diligent research to solve the above problems, the present inventor has found that a resin, a benzimidazole compound, an organic iodo compound, a thiazole compound, and a haloalkylthio compound at a specific ratio. The fungicide composition and the resin composition containing the fungicide, bacteria (including yeast, spore fungus, actinomycetes), wood-rot fungi, algae and marine organisms and wood decay are controlled and further prevented. It was found that a molded article having excellent fungiability, antibacterial properties, algae-proofing properties, deodorizing properties and antiseptic properties and excellent sustainability of these effects was obtained.
 本発明は、以下に示される。
1.〔A〕樹脂と、〔B〕下記化合物(b1)、(b2)、(b3)及び(b4)の合計を100質量%とした場合に、(b1)ベンズイミダゾール系化合物85~99.97質量%、(b2)有機ヨード系化合物0.01~5質量%、(b3)チアゾール系化合物0.01~5質量%及び(b4)ハロアルキルチオ系化合物0.01~5質量%を含む防かび剤組成物と、を含有し、上記防かび剤組成物〔B〕の含有量が、上記樹脂〔A〕100質量部に対して、0.01~10質量部であることを特徴とする防かび性樹脂組成物。
2.上記ベンズイミダゾール系化合物(b1)がベンズイミダゾールカルバミン酸誘導体である上記1に記載の防かび性樹脂組成物。
3.上記ベンズイミダゾールカルバミン酸誘導体が、1H-2-ベンズイミダゾールカルバミン酸メチル及び1-ブチルカルバモイル-2-ベンズイミダゾールカルバミン酸メチルから選ばれる少なくとも1種である上記2に記載の防かび性樹脂組成物。
4.上記有機ヨード系化合物(b2)がヨードスルホニルベンゼン誘導体であり、上記チアゾール系化合物(b3)がチアゾール基を有するベンズイミダゾール誘導体であり、上記ハロアルキルチオ系化合物(b4)がハロアルキルチオスルファミド誘導体である上記1に記載の防かび性樹脂組成物。
5.上記防かび剤組成物〔B〕が、更に、有機ブロム系化合物(b5)を含有し、該有機ブロム系化合物(b5)の含有量は、上記化合物(b1)、(b2)、(b3)及び(b4)の合計を100質量部とした場合に、0.01~3質量部である上記1に記載の防かび性樹脂組成物。
6.上記有機ブロム系化合物が、2-ブロモ-2-ニトロ-1,3-プロパンジオール及び1,2-ジブロモ-2,4-ジシアノブタンから選ばれる少なくとも1種である上記5に記載の防かび性樹脂組成物。
7.上記1に記載の防かび性樹脂組成物を含むことを特徴とする成形品。
8.ベンズイミダゾール系化合物(b1)と、有機ヨード系化合物(b2)と、チアゾール系化合物(b3)と、ハロアルキルチオ系化合物(b4)とを含有し、各成分の含有量が、これらの合計を100質量%とした場合に、それぞれ、85~99.97質量%、0.01~5質量%、0.01~5質量%、及び、0.01~5質量%であることを特徴とする防かび剤組成物。
9.更に、有機ブロム系化合物(b5)を含有し、該有機ブロム系化合物(b5)の含有量は、上記ベンズイミダゾール系化合物(b1)、上記有機ヨード系化合物(b2)、上記チアゾール系化合物(b3)及び上記ハロアルキルチオ系化合物(b4)の合計を100質量部とした場合に、0.01~3質量部である上記8に記載の防かび剤組成物。
The present invention is shown below.
1. (B1) benzimidazole-based compound 85 to 99.97 mass when the total of [A] resin and [B] the following compounds (b1), (b2), (b3) and (b4) is 100 mass% %, (B2) 0.01 to 5% by mass of an organic iodine compound, (b3) 0.01 to 5% by mass of a thiazole compound and (b4) 0.01 to 5% by mass of a haloalkylthio compound And the fungicide composition [B] is contained in an amount of 0.01 to 10 parts by mass with respect to 100 parts by mass of the resin [A]. Resin composition.
2. 2. The antifungal resin composition according to 1 above, wherein the benzimidazole compound (b1) is a benzimidazole carbamic acid derivative.
3. 3. The fungicidal resin composition according to 2 above, wherein the benzimidazole carbamate derivative is at least one selected from methyl 1H-2-benzimidazole carbamate and methyl 1-butylcarbamoyl-2-benzimidazole carbamate.
4). The organic iodo compound (b2) is an iodosulfonylbenzene derivative, the thiazole compound (b3) is a benzimidazole derivative having a thiazole group, and the haloalkylthio compound (b4) is a haloalkylthiosulfamide derivative. The antifungal resin composition as described in 1 above.
5). The antifungal composition [B] further contains an organic bromide compound (b5), and the content of the organic bromide compound (b5) is determined based on the compounds (b1), (b2), and (b3). And the antifungal resin composition as described in 1 above, wherein the total amount of (b4) is 0.01 to 3 parts by mass, when the total is 100 parts by mass.
6). The antifungal property as described in 5 above, wherein the organic bromide compound is at least one selected from 2-bromo-2-nitro-1,3-propanediol and 1,2-dibromo-2,4-dicyanobutane. Resin composition.
7). A molded product comprising the antifungal resin composition as described in 1 above.
8). It contains a benzimidazole compound (b1), an organic iodo compound (b2), a thiazole compound (b3), and a haloalkylthio compound (b4), and the content of each component is 100 in total. When the mass percentage is 85% to 99.97% by mass, 0.01% to 5% by mass, 0.01% to 5% by mass, and 0.01% to 5% by mass, respectively, Fungi composition.
9. Furthermore, it contains an organic bromide compound (b5), and the content of the organic bromide compound (b5) is such that the benzimidazole compound (b1), the organic iodine compound (b2), and the thiazole compound (b3). ) And the haloalkylthio-based compound (b4) are 0.01 to 3 parts by mass when the total of the haloalkylthio compounds (b4) is 100 parts by mass.
 本発明の防かび性樹脂組成物によれば、真菌、細菌(酵母、芽胞菌、放線菌を含む)、木材腐朽菌、藻類及び海洋生物の繁殖並びに木材の腐朽を防除し、更に、防かび性、防菌性、防藻性、防臭性及び防腐性に優れ、これらの効果の持続性に優れる成形品(中実体、発泡体)、皮膜等を得ることができる。従って、本発明の防かび性樹脂組成物は、成形品の形成材料、塗料(インキを含む)、接着剤、シーリング剤、表面処理剤等、広い用途に好適である。また、本発明の防かび性樹脂組成物を含む成形材料、成形品等とした場合には、ブリードアウトが発生しにくいので、上記効果の低下、並びに、表面外観性の低下を招くことがない。更に、本発明の防かび性樹脂組成物を含む成形品又は皮膜を、船舶の船底部、海中における配設物、漁具等の水と接触する部分に用いた場合には、フジツボ、イガイ等の水中有害付着生物の付着、繁茂を抑制することができ、そして、重金属を含まないので水質汚染を招くことがほとんどない。
 本発明の防かび性樹脂組成物が、更に、有機ブロム系化合物(b5)を含有する場合には、バシルス属、クロストリジウム属等の芽胞菌及び木材腐朽菌に対する防菌性に優れる。また、上記有機ヨード系化合物(b2)がヨードスルホニルベンゼン誘導体であり、上記チアゾール系化合物(b3)がチアゾール基を有するベンズイミダゾール誘導体であり、上記ハロアルキルチオ系化合物(b4)がハロアルキルチオスルファミド誘導体であり、上記有機ブロム系化合物(b5)の含有量が、0.01~3質量部である場合には、従来の防かび剤を含む樹脂組成物では効果を得ることが難しかった、バチルス セレウス(Bacillus cereus)、クロストリジウム ボツリナム(Clostridium botulinum)、クロストリジウム パーフリンジェンス(Clostridium perfringens)等の芽胞菌、並びに、スギヒラタケ、カワラタケ、シュタケ、ナミダタケ、ワタグサレタケ、オオウズラタケ等の木材腐朽菌に対する抵抗性に優れる。
According to the antifungal resin composition of the present invention, fungi, bacteria (including yeast, spore fungus, actinomycetes), wood-rotting fungi, algae and marine organisms are propagated, and wood decay is further controlled. It is possible to obtain molded articles (solid bodies, foams), films and the like that are excellent in the properties, antibacterial properties, algae-proofing properties, deodorization properties and antiseptic properties and are excellent in the sustainability of these effects. Therefore, the antifungal resin composition of the present invention is suitable for a wide range of applications such as molding materials, paints (including inks), adhesives, sealing agents, and surface treatment agents. In addition, in the case of a molding material, molded article or the like containing the antifungal resin composition of the present invention, bleed-out is unlikely to occur, and thus the above effect and the surface appearance are not deteriorated. . Further, when the molded article or film containing the antifungal resin composition of the present invention is used on the bottom of a ship, an arrangement in the sea, a portion that comes into contact with water such as fishing gear, barnacles, mussels, etc. Adhesion and overgrowth of underwater harmful organisms can be suppressed, and since it does not contain heavy metals, it hardly causes water pollution.
When the antifungal resin composition of the present invention further contains an organic bromide compound (b5), it is excellent in antibacterial properties against spore bacteria such as Bacillus genus, Clostridium genus, etc. and wood rot fungi. The organic iodo compound (b2) is an iodosulfonylbenzene derivative, the thiazole compound (b3) is a benzimidazole derivative having a thiazole group, and the haloalkylthio compound (b4) is a haloalkylthiosulfamide. When the content of the organic bromide compound (b5) is 0.01 to 3 parts by mass, it is difficult to obtain an effect with a conventional resin composition containing an antifungal agent. Spore fungi such as Bacillus cereus, Clostridium botulinum, Clostridium perfringens, etc., as well as Sugihiratake, Kawaratake, Statake, Namidatake, , Excellent resistance to wood-rotting fungi such as Fomitopsis palustris.
 本発明の防かび剤組成物は、粉体系組成物;水、有機溶剤、又は、これらの混合媒体に分散あるいは溶解された組成物等として用いることができる。また、樹脂等に配合して調製されてなる成形材料及び成形品;防腐剤;防汚剤等に好適である。
 本発明の防かび剤組成物によれば、真菌、細菌(酵母、芽胞菌、放線菌を含む)、木材腐朽菌、藻類及び海洋生物の繁殖並びに木材の腐朽を防除し、更に、防かび性、防菌性、防藻性、防臭性及び防腐性に優れ、これらの効果の持続性に優れる。本発明の防かび剤組成物を含む成形材料、成形品等とした場合には、ブリードアウトが発生しにくいので、上記効果の低下、並びに、表面外観性の低下を招くことがない。また、船舶の船底部、海中における配設物、漁具等の水と接触する部分に用いた場合には、フジツボ、イガイ等の水中有害付着生物の付着、繁茂を抑制することができ、そして、重金属を含まないので水質汚染を招くことがほとんどない。
The fungicide composition of the present invention can be used as a powder-based composition; water, an organic solvent, or a composition dispersed or dissolved in a mixed medium thereof. Further, it is suitable for molding materials and molded articles prepared by blending with resins and the like; antiseptics; antifouling agents and the like.
According to the fungicide composition of the present invention, fungi, bacteria (including yeast, spore fungus, actinomycetes), wood-rotting fungi, algae and marine organisms are propagated and the decay of wood is further controlled. It is excellent in antibacterial properties, algae control properties, deodorization properties and antiseptic properties, and is excellent in sustainability of these effects. In the case of a molding material, molded article or the like containing the fungicidal composition of the present invention, bleeding out is unlikely to occur, and thus the above effect and the surface appearance are not deteriorated. In addition, when used on the bottom of a ship, underwater arrangements, parts that come into contact with water such as fishing gear, it is possible to suppress the adhesion and overgrowth of underwater harmful organisms such as barnacles and mussels, and Because it does not contain heavy metals, it hardly causes water pollution.
 以下、本発明を詳しく説明する。
 本発明の防かび性樹脂組成物は、〔A〕樹脂(以下、「成分〔A〕」ともいう。)と、〔B〕下記化合物(b1)、(b2)、(b3)及び(b4)の合計を100質量%とした場合に、(b1)ベンズイミダゾール系化合物85~99.97質量%、(b2)有機ヨード系化合物0.01~5質量%、(b3)チアゾール系化合物0.01~5質量%及び(b4)ハロアルキルチオ系化合物0.01~5質量%を含む防かび剤組成物(以下、「成分〔B〕」ともいう。)と、を含有し、上記防かび剤組成物〔B〕の含有量が、上記樹脂〔A〕100質量部に対して、0.01~10質量部であることを特徴とする。
The present invention will be described in detail below.
The antifungal resin composition of the present invention comprises [A] resin (hereinafter also referred to as “component [A]”) and [B] the following compounds (b1), (b2), (b3) and (b4). (B1) benzimidazole compound 85 to 99.97% by mass, (b2) organic iodine compound 0.01 to 5% by mass, (b3) thiazole compound 0.01 And a fungicide composition (hereinafter also referred to as “component [B]”) containing 5 to 5% by mass and (b4) 0.01 to 5% by mass of a haloalkylthio compound. The content of the product [B] is 0.01 to 10 parts by mass with respect to 100 parts by mass of the resin [A].
 本発明の防かび性樹脂組成物は、広い用途に適用できることから、上記成分〔A〕は、目的、用途等に応じて、選択される。上記成分〔A〕は、1種のみからなるものであってよいし、2種以上からなるものであってもよい。また、その性状も、特に限定されず、固体であってよいし、液状であってもよい。
 尚、本発明において、上記成分〔A〕は、重合体、重合体形成化合物(前駆体)、それを含む組成物(重合体形成用組成物)等とすることができる。
Since the antifungal resin composition of the present invention can be applied to a wide range of uses, the component [A] is selected according to the purpose, use and the like. The said component [A] may consist of only 1 type, and may consist of 2 or more types. Moreover, the property is not specifically limited, either, it may be solid or liquid.
In the present invention, the component [A] can be a polymer, a polymer-forming compound (precursor), a composition containing it (a composition for forming a polymer), or the like.
 上記成分〔A〕は、熱可塑性樹脂及び硬化性(熱硬化性、光硬化性、電子線硬化性、室温硬化性等)樹脂のいずれでもよく、前者の場合、本発明の防かび性樹脂組成物は、熱可塑性樹脂組成物であり、後者の場合は、硬化性樹脂組成物である。本発明において、好ましい成分〔A〕は、熱可塑性樹脂である。 The component [A] may be either a thermoplastic resin or a curable (thermosetting, photocurable, electron beam curable, room temperature curable, etc.) resin. In the former case, the antifungal resin composition of the present invention is used. The product is a thermoplastic resin composition, and in the latter case, it is a curable resin composition. In the present invention, a preferred component [A] is a thermoplastic resin.
 上記成分〔A〕が熱可塑性樹脂である場合、熱可塑性を有する重合体を含むものであれば、特に限定されず、ABS樹脂、ASA樹脂、AES樹脂等のゴム強化樹脂;ポリスチレン、スチレン・アクリロニトリル共重合体、スチレン・無水マレイン酸共重合体、(メタ)アクリル酸エステル・スチレン共重合体等のスチレン系(共)重合体;ポリエチレン、ポリプロピレン等のオレフィン系樹脂;ポリエステル系樹脂;ポリアミド系樹脂;ポリカーボネート樹脂;ポリアリレート樹脂;ポリアセタール樹脂;ポリ塩化ビニル、エチレン・塩化ビニル重合体、ポリ塩化ビニリデン等の塩化ビニル系樹脂;ポリメタクリル酸メチル(PMMA)等の(メタ)アクリル酸エステルの1種以上を用いた(共)重合体等のアクリル系樹脂;ポリフェニレンエーテル;ポリフェニレンサルファイド;ポリテトラフルオロエチレン、ポリフッ化ビニリデン等のフッ素樹脂;ポリイミド、ポリアミドイミド、ポリエーテルイミド等のイミド系樹脂;ポリエーテルケトン、ポリエーテルエーテルケトン等のケトン系樹脂;ポリスルホン、ポリエーテルスルホン等のスルホン系樹脂;ウレタン系樹脂;ポリ酢酸ビニル;ポリエチレンオキシド;ポリビニルアルコール;ポリビニルエーテル;ポリビニルブチラール;フェノキシ樹脂;感光性樹脂;液晶ポリマー;生分解性プラスチック等が挙げられる。これらは、1種単独であるいは2種以上を組み合わせて用いることができる。
 上記熱可塑性樹脂のうち、成形品の形成に好適なものとして、ゴム強化樹脂;ポリエステル系樹脂;オレフィン系樹脂;ポリアミド系樹脂;ポリエステル系樹脂及びポリカーボネート樹脂のアロイ;ポリエステル系樹脂、ゴム強化樹脂及びポリカーボネート樹脂のアロイ等が挙げられる。
When the component [A] is a thermoplastic resin, it is not particularly limited as long as it contains a polymer having thermoplasticity; rubber reinforced resin such as ABS resin, ASA resin, AES resin; polystyrene, styrene / acrylonitrile Styrene (co) polymers such as copolymers, styrene / maleic anhydride copolymers, (meth) acrylic acid esters / styrene copolymers; Olefin resins such as polyethylene and polypropylene; Polyester resins; Polyamide resins Polycarbonate resin; Polyarylate resin; Polyacetal resin; Vinyl chloride resin such as polyvinyl chloride, ethylene / vinyl chloride polymer, and polyvinylidene chloride; One kind of (meth) acrylic acid ester such as polymethyl methacrylate (PMMA) Acrylic resins such as (co) polymers using the above; polyphenyle Ethers; Polyphenylene sulfide; Fluorine resins such as polytetrafluoroethylene and polyvinylidene fluoride; Imide resins such as polyimide, polyamideimide and polyetherimide; Ketone resins such as polyetherketone and polyetheretherketone; Polysulfone and polyether Examples include sulfone resins such as sulfones; urethane resins; polyvinyl acetate; polyethylene oxide; polyvinyl alcohol; polyvinyl ether; polyvinyl butyral; phenoxy resins; These can be used alone or in combination of two or more.
Among the above thermoplastic resins, those suitable for forming a molded product include: rubber reinforced resin; polyester resin; olefin resin; polyamide resin; alloy of polyester resin and polycarbonate resin; polyester resin, rubber reinforced resin and Examples include polycarbonate resin alloys.
 上記ゴム強化樹脂は、ゴム質重合体(以下、「ゴム質重合体(a1)」という。)の存在下に、芳香族ビニル化合物を含むビニル系単量体(a2)を重合して得られたゴム強化ビニル系樹脂(以下、「ゴム強化ビニル系樹脂(A1)」という。)、又は、このゴム強化ビニル系樹脂(A1)と、ビニル系単量体に由来する構造単位を含む(共)重合体(以下、「(共)重合体(A2)」という。)とからなる混合物、である。 The rubber-reinforced resin is obtained by polymerizing a vinyl monomer (a2) containing an aromatic vinyl compound in the presence of a rubbery polymer (hereinafter referred to as “rubbery polymer (a1)”). Rubber reinforced vinyl resin (hereinafter referred to as “rubber reinforced vinyl resin (A1)”) or the rubber reinforced vinyl resin (A1) and a structural unit derived from a vinyl monomer ) A polymer (hereinafter referred to as “(co) polymer (A2)”).
 上記ゴム質重合体(a1)は、室温でゴム質であれば、単独重合体であってもよいし、共重合体であってもよいが、ジエン系重合体(ジエン系ゴム質重合体)及び非ジエン系重合体(非ジエン系ゴム質重合体)が好ましい。更に、上記ゴム質重合体(a1)は、架橋重合体であってもよいし、非架橋重合体であってもよい。これらは、1種単独であるいは2種以上を組み合わせて用いることができる。 The rubbery polymer (a1) may be a homopolymer or a copolymer as long as it is rubbery at room temperature, but it may be a diene polymer (diene rubber polymer). And non-diene polymers (non-diene rubber polymers) are preferred. Further, the rubber polymer (a1) may be a crosslinked polymer or a non-crosslinked polymer. These can be used alone or in combination of two or more.
 上記ジエン系重合体としては、ポリブタジエン、ポリイソプレン、ポリクロロプレン等の単独重合体;スチレン・ブタジエン共重合体、スチレン・ブタジエン・スチレン共重合体、アクリロニトリル・ブタジエン共重合体、アクリロニトリル・スチレン・ブタジエン共重合体等のスチレン・ブタジエン系共重合体ゴム;スチレン・イソプレン共重合体、スチレン・イソプレン・スチレン共重合体、アクリロニトリル・スチレン・イソプレン共重合体等のスチレン・イソプレン系共重合体ゴム;天然ゴム等が挙げられる。これらの共重合体は、ブロック共重合体でもよいし、ランダム共重合体でもよい。また、これらの共重合体は水素添加(但し、水素添加率は50%未満。)されたものであってもよい。上記ジエン系重合体は、1種単独であるいは2種以上を組み合わせて用いることができる。 Examples of the diene polymers include homopolymers such as polybutadiene, polyisoprene, and polychloroprene; styrene / butadiene copolymers, styrene / butadiene / styrene copolymers, acrylonitrile / butadiene copolymers, and acrylonitrile / styrene / butadiene copolymers. Styrene / butadiene copolymer rubber such as polymer; styrene / isoprene copolymer, styrene / isoprene copolymer rubber such as styrene / isoprene / styrene copolymer, acrylonitrile / styrene / isoprene copolymer; natural rubber Etc. These copolymers may be block copolymers or random copolymers. These copolymers may be hydrogenated (however, the hydrogenation rate is less than 50%). The said diene polymer can be used individually by 1 type or in combination of 2 or more types.
 また、上記非ジエン系重合体としては、エチレン単位と、炭素数3以上のα-オレフィンからなる単位を含むエチレン・α-オレフィン系共重合体ゴム;ウレタン系ゴム;アクリル系ゴム;シリコーンゴム;シリコーン・アクリル系IPNゴム;共役ジエン系化合物よりなる単位を含む(共)重合体を水素添加してなる重合体等が挙げられる。これらの共重合体は、ブロック共重合体であってもよいし、ランダム共重合体であってもよい。また、これらの共重合体は水素添加(但し、水素添加率は50%以上。)されたものであってもよい。上記非ジエン系重合体は、1種単独であるいは2種以上を組み合わせて用いることができる。 Examples of the non-diene polymer include ethylene units and ethylene / α-olefin copolymer rubbers including units composed of α-olefins having 3 or more carbon atoms; urethane rubbers; acrylic rubbers; silicone rubbers; Examples include silicone / acrylic IPN rubbers; polymers obtained by hydrogenating (co) polymers containing units composed of conjugated diene compounds. These copolymers may be block copolymers or random copolymers. These copolymers may be hydrogenated (however, the hydrogenation rate is 50% or more). The said non-diene polymer can be used individually by 1 type or in combination of 2 or more types.
 上記ゴム質重合体(a1)として、ジエン系重合体を用いた場合に得られるゴム強化ビニル系樹脂(A1)を含む樹脂は、一般に、「ABS樹脂」といわれている。また、上記ゴム質重合体(a)として、エチレン・α-オレフィン及び/又はエチレン・α-オレフィン・非共役ジエン共重合体を用いた場合に得られるゴム強化ビニル系樹脂(A1)を含む樹脂は、一般に、「AES樹脂」といわれている。更に、上記ゴム質重合体(a)として、アクリル系ゴムを用いた場合に得られるゴム強化ビニル系樹脂(A1)を含む樹脂は、一般に、「ASA樹脂」といわれている。 The resin containing the rubber-reinforced vinyl resin (A1) obtained when a diene polymer is used as the rubber polymer (a1) is generally referred to as “ABS resin”. Further, a resin containing a rubber-reinforced vinyl resin (A1) obtained when ethylene / α-olefin and / or ethylene / α-olefin / non-conjugated diene copolymer is used as the rubbery polymer (a). Is generally referred to as “AES resin”. Furthermore, a resin containing a rubber-reinforced vinyl resin (A1) obtained when an acrylic rubber is used as the rubber polymer (a) is generally referred to as an “ASA resin”.
 上記ゴム強化ビニル系樹脂(A1)の形成に用いられるビニル系単量体(a2)は、芳香族ビニル化合物のみでもよいし、この芳香族ビニル化合物と、例えば、シアン化ビニル化合物、(メタ)アクリル酸エステル化合物、マレイミド系化合物、酸無水物等の、芳香族ビニル化合物と共重合可能な化合物とを、それぞれ、1種単独であるいは2種以上を組み合わせて用いることができる。
 従って、上記ビニル系単量体(a2)としては、芳香族ビニル化合物の1種以上、あるいは、芳香族ビニル化合物の1種以上と、該芳香族ビニル化合物と共重合可能な化合物の1種以上とを組み合わせた単量体を用いることができる。
The vinyl monomer (a2) used for forming the rubber-reinforced vinyl resin (A1) may be an aromatic vinyl compound alone, or an aromatic vinyl compound and, for example, a vinyl cyanide compound, (meth) A compound that can be copolymerized with an aromatic vinyl compound, such as an acrylate compound, a maleimide compound, or an acid anhydride, can be used alone or in combination of two or more.
Therefore, the vinyl monomer (a2) is one or more aromatic vinyl compounds, or one or more aromatic vinyl compounds and one or more compounds copolymerizable with the aromatic vinyl compounds. A monomer in combination with can be used.
 上記芳香族ビニル化合物としては、少なくとも1つのビニル結合と、少なくとも1つの芳香族環とを有する化合物であれば、特に限定されることなく用いることができる。その例としては、スチレン、α-メチルスチレン、o-メチルスチレン、p-メチルスチレン、ビニルトルエン、β-メチルスチレン、エチルスチレン、p-tert-ブチルスチレン、ビニルキシレン、ビニルナフタレン、モノクロロスチレン、ジクロロスチレン、モノブロモスチレン、ジブロモスチレン、フルオロスチレン等が挙げられる。これらは、1種単独であるいは2種以上を組み合わせて用いることができる。また、これらのうち、スチレン及びα-メチルスチレンが好ましい。 The aromatic vinyl compound is not particularly limited as long as it is a compound having at least one vinyl bond and at least one aromatic ring. Examples include styrene, α-methylstyrene, o-methylstyrene, p-methylstyrene, vinyltoluene, β-methylstyrene, ethylstyrene, p-tert-butylstyrene, vinylxylene, vinylnaphthalene, monochlorostyrene, dichloromethane. Examples thereof include styrene, monobromostyrene, dibromostyrene, and fluorostyrene. These can be used alone or in combination of two or more. Of these, styrene and α-methylstyrene are preferred.
 上記シアン化ビニル化合物としては、アクリロニトリル、メタクリロニトリル等が挙げられる。これらのうち、アクリロニトリルが好ましい。また、これらは、1種単独であるいは2種以上を組み合わせて用いることができる。
 上記(メタ)アクリル酸エステル化合物としては、メタクリル酸メチル、メタクリル酸エチル、メタクリル酸n-プロピル、メタクリル酸イソプロピル、メタクリル酸n-ブチル、メタクリル酸イソブチル、メタクリル酸tert-ブチル、アクリル酸メチル、アクリル酸エチル、アクリル酸n-プロピル、アクリル酸イソプロピル、アクリル酸n-ブチル、アクリル酸イソブチル、アクリル酸tert-ブチル等が挙げられる。これらは、1種単独であるいは2種以上を組み合わせて用いることができる。
Examples of the vinyl cyanide compound include acrylonitrile and methacrylonitrile. Of these, acrylonitrile is preferred. Moreover, these can be used individually by 1 type or in combination of 2 or more types.
Examples of the (meth) acrylic acid ester compound include methyl methacrylate, ethyl methacrylate, n-propyl methacrylate, isopropyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, tert-butyl methacrylate, methyl acrylate, acrylic Examples include ethyl acrylate, n-propyl acrylate, isopropyl acrylate, n-butyl acrylate, isobutyl acrylate, tert-butyl acrylate, and the like. These can be used alone or in combination of two or more.
 上記マレイミド系化合物としては、マレイミド、N-メチルマレイミド、N-ブチルマレイミド、N-フェニルマレイミド、N-(2-メチルフェニル)マレイミド、N-(4-ヒドロキシフェニル)マレイミド、N-シクロヘキシルマレイミド等が挙げられる。これらは、1種単独であるいは2種以上を組み合わせて用いることができる。尚、マレイミド系化合物からなる単位を導入する他の方法としては、例えば、無水マレイン酸を共重合し、その後イミド化する方法でもよい。
 上記酸無水物としては、無水マレイン酸、無水イタコン酸、無水シトラコン酸等が挙げられる。これらは、1種単独であるいは2種以上を組み合わせて用いることができる。
Examples of the maleimide compounds include maleimide, N-methylmaleimide, N-butylmaleimide, N-phenylmaleimide, N- (2-methylphenyl) maleimide, N- (4-hydroxyphenyl) maleimide, N-cyclohexylmaleimide and the like. Can be mentioned. These can be used alone or in combination of two or more. In addition, as another method for introducing a unit composed of a maleimide compound, for example, a method in which maleic anhydride is copolymerized and then imidized may be used.
Examples of the acid anhydride include maleic anhydride, itaconic anhydride, citraconic anhydride, and the like. These can be used alone or in combination of two or more.
 また、上記化合物以外に、必要に応じて、ヒドロキシル基、アミノ基、エポキシ基、アミド基、カルボキシル基、オキサゾリン基等の官能基を有するビニル系化合物を用いることができる。例えば、メタクリル酸2-ヒドロキシエチル、アクリル酸2-ヒドロキシエチル、ヒドロキシスチレン、メタクリル酸N,N-ジメチルアミノメチル、アクリル酸N,N-ジメチルアミノメチル、N,N-ジエチル-p-アミノメチルスチレン、メタクリル酸グリシジル、アクリル酸グリシジル、メタクリル酸3,4-オキシシクロヘキシル、アクリル酸3,4-オキシシクロヘキシル、ビニルグリシジルエーテル、メタリルグリシジルエーテル、アリルグリシジルエーテル、メタクリルアミド、アクリルアミド、メタクリル酸、アクリル酸、ビニルオキサゾリン等が挙げられる。これらは、1種単独であるいは2種以上を組み合わせて用いることができる。 In addition to the above compounds, a vinyl compound having a functional group such as a hydroxyl group, an amino group, an epoxy group, an amide group, a carboxyl group, or an oxazoline group can be used as necessary. For example, 2-hydroxyethyl methacrylate, 2-hydroxyethyl acrylate, hydroxystyrene, N, N-dimethylaminomethyl methacrylate, N, N-dimethylaminomethyl acrylate, N, N-diethyl-p-aminomethylstyrene Glycidyl methacrylate, glycidyl acrylate, 3,4-oxycyclohexyl methacrylate, 3,4-oxycyclohexyl acrylate, vinyl glycidyl ether, methallyl glycidyl ether, allyl glycidyl ether, methacrylamide, acrylamide, methacrylic acid, acrylic acid And vinyl oxazoline. These can be used alone or in combination of two or more.
 尚、前述のように、上記成分〔A〕がゴム強化樹脂である場合には、このゴム強化樹脂が、ゴム強化ビニル系樹脂(A1)のみであってもよく、ゴム強化ビニル系樹脂(A1)と、ビニル系単量体の重合によって得られた(共)重合体(A2)とからなる混合物であってもよい。このビニル系単量体としては、上記ゴム強化ビニル系樹脂(A1)の形成に用いた化合物、即ち、芳香族ビニル化合物、シアン化ビニル化合物、(メタ)アクリル酸エステル化合物、マレイミド系化合物、酸無水物及び官能基を有する化合物から選ばれる1種以上を用いることができる。従って、上記(共)重合体(A2)は、上記ゴム強化ビニル系樹脂(A1)の形成に用いたビニル系単量体(a2)と全く同じ組成の成分を重合して得られる重合体であってもよいし、異なる組成で同じ種類の単量体を重合して得られる重合体であってもよいし、更には、異なる組成で異なる種類の単量体を重合して得られる重合体であってもよい。これらの各重合体が2種以上含まれるものであってもよい。 As described above, when the component [A] is a rubber reinforced resin, the rubber reinforced resin may be only the rubber reinforced vinyl resin (A1), or the rubber reinforced vinyl resin (A1). And a (co) polymer (A2) obtained by polymerization of a vinyl monomer. Examples of the vinyl monomer include compounds used for forming the rubber-reinforced vinyl resin (A1), that is, aromatic vinyl compounds, cyanide vinyl compounds, (meth) acrylic acid ester compounds, maleimide compounds, acids. One or more selected from an anhydride and a compound having a functional group can be used. Therefore, the (co) polymer (A2) is a polymer obtained by polymerizing components having exactly the same composition as the vinyl monomer (a2) used for forming the rubber-reinforced vinyl resin (A1). It may be a polymer obtained by polymerizing the same type of monomer with different compositions, or a polymer obtained by polymerizing different types of monomers with different compositions It may be. Two or more of these polymers may be contained.
 上記ゴム強化ビニル系樹脂(A1)のグラフト率は、好ましくは30~150質量%、より好ましくは50~120質量%である。上記ゴム強化ビニル系樹脂(A1)のグラフト率が小さすぎると、本発明の防かび性樹脂組成物及びそれを含む成形品の表面外観性及び耐衝撃性が低下することがある。また、グラフト率が大きすぎると、成形加工性が劣る。
 ここで、グラフト率とは、上記ゴム強化ビニル系樹脂(A1)1グラム中のゴム成分をxグラム、上記ゴム強化ビニル系樹脂(A1)1グラムをアセトン(但し、ゴム質重合体(a1)がアクリル系ゴムである場合には、アセトニトリルを使用。)に溶解させた際の不溶分をyグラムとしたときに、次式により求められる値である。
 グラフト率(質量%)={(y-x)/x}×100
The graft ratio of the rubber-reinforced vinyl resin (A1) is preferably 30 to 150% by mass, more preferably 50 to 120% by mass. If the graft ratio of the rubber-reinforced vinyl resin (A1) is too small, the surface appearance and impact resistance of the antifungal resin composition of the present invention and a molded product containing it may be lowered. On the other hand, if the graft ratio is too large, the molding processability is poor.
Here, the graft ratio means x gram of rubber component in 1 gram of the rubber reinforced vinyl resin (A1), 1 gram of the rubber reinforced vinyl resin (A1) with acetone (however, the rubbery polymer (a1)). Is an acrylic rubber, acetonitrile is used.) When the insoluble content when dissolved in y-gram is obtained, the value is obtained by the following formula.
Graft rate (mass%) = {(y−x) / x} × 100
 また、上記ゴム強化ビニル系樹脂(A1)のアセトン(但し、ゴム質重合体(a1)がアクリル系ゴムである場合には、アセトニトリルを使用。)による可溶成分の極限粘度[η](メチルエチルケトン中、30℃で測定)は、好ましくは0.2~1dl/g、より好ましくは0.3~0.8dl/gである。この範囲とすることにより、本発明の防かび性樹脂組成物の成形加工性に優れ、得られる成形品の耐衝撃性にも優れる。
 尚、上記グラフト率及び極限粘度[η]は、上記ゴム強化ビニル系樹脂(A1)を製造するときの、重合開始剤、連鎖移動剤、乳化剤、溶剤等の種類や量、更には重合時間、重合温度等を変えることにより、容易に制御することができる。
In addition, the intrinsic viscosity [η] (methyl ethyl ketone) of the soluble component of acetone of the rubber-reinforced vinyl resin (A1) (however, acetonitrile is used when the rubbery polymer (a1) is an acrylic rubber). (Measured at 30 ° C.) is preferably 0.2 to 1 dl / g, more preferably 0.3 to 0.8 dl / g. By setting it as this range, it is excellent in the moldability of the antifungal resin composition of this invention, and is excellent also in the impact resistance of the obtained molded article.
The graft ratio and intrinsic viscosity [η] are the types and amounts of a polymerization initiator, a chain transfer agent, an emulsifier, a solvent, etc., when the rubber-reinforced vinyl resin (A1) is produced. It can be easily controlled by changing the polymerization temperature or the like.
 上記(共)重合体(A2)としては、下記(3)~(8)に例示される。尚、各単量体は、上記ゴム強化ビニル系樹脂(A1)の形成に用いられる化合物を適用でき、好ましい化合物も同様である。
(3)芳香族ビニル化合物のみを重合して得られた(共)重合体の1種以上。
(4)(メタ)アクリル酸エステル化合物のみを重合して得られた(共)重合体の1種以上。
(5)芳香族ビニル化合物及びシアン化ビニル化合物を重合して得られた共重合体の1種以上。
(6)芳香族ビニル化合物及び(メタ)アクリル酸エステル化合物を重合して得られた共重合体の1種以上。
(7)芳香族ビニル化合物、シアン化ビニル化合物及び他の化合物を重合して得られた共重合体の1種以上。
(8)芳香族ビニル化合物と、シアン化ビニル化合物を除く他の化合物とを重合して得られた共重合体の1種以上。
 これらは、1種単独であるいは2種以上を組み合わせて用いることができる。
Examples of the (co) polymer (A2) include the following (3) to (8). In addition, the compound used for formation of the said rubber reinforced vinyl-type resin (A1) can be applied to each monomer, and a preferable compound is also the same.
(3) One or more (co) polymers obtained by polymerizing only aromatic vinyl compounds.
(4) One or more (co) polymers obtained by polymerizing only (meth) acrylic acid ester compounds.
(5) One or more types of copolymers obtained by polymerizing an aromatic vinyl compound and a vinyl cyanide compound.
(6) One or more kinds of copolymers obtained by polymerizing an aromatic vinyl compound and a (meth) acrylic acid ester compound.
(7) One or more types of copolymers obtained by polymerizing aromatic vinyl compounds, vinyl cyanide compounds and other compounds.
(8) One or more types of copolymers obtained by polymerizing an aromatic vinyl compound and other compounds excluding the vinyl cyanide compound.
These can be used alone or in combination of two or more.
 従って、上記(共)重合体(A2)の具体例としては、アクリロニトリル・スチレン共重合体、アクリロニトリル・α-メチルスチレン共重合体、アクリロニトリル・スチレン・メタクリル酸メチル共重合体、スチレン・メタクリル酸メチル共重合体、アクリロニトリル・スチレン・N-フェニルマレイミド共重合体等が挙げられる。 Accordingly, specific examples of the (co) polymer (A2) include acrylonitrile / styrene copolymer, acrylonitrile / α-methylstyrene copolymer, acrylonitrile / styrene / methyl methacrylate copolymer, styrene / methyl methacrylate. Examples include copolymers, acrylonitrile / styrene / N-phenylmaleimide copolymers, and the like.
 上記(共)重合体(A2)の極限粘度[η](メチルエチルケトン中、30℃で測定)は、好ましくは0.2~0.8dl/gである。極限粘度[η]が上記範囲内であると、成形加工性及び耐衝撃性の物性バランスに優れる。尚、この(共)重合体(A2)の極限粘度[η]は、上記ゴム強化ビニル系樹脂(A1)の場合と同様、製造条件を調整することにより制御することができる。 The intrinsic viscosity [η] (measured in methyl ethyl ketone at 30 ° C.) of the (co) polymer (A2) is preferably 0.2 to 0.8 dl / g. When the intrinsic viscosity [η] is within the above range, the physical property balance between molding processability and impact resistance is excellent. The intrinsic viscosity [η] of the (co) polymer (A2) can be controlled by adjusting the production conditions, as in the case of the rubber-reinforced vinyl resin (A1).
 上記ゴム強化樹脂のアセトン(但し、ゴム質重合体(a1)がアクリル系ゴムである場合には、アセトニトリルを使用。)による可溶成分の極限粘度[η](メチルエチルケトン中、30℃で測定)は、好ましくは0.2~0.8dl/gである。極限粘度[η]が上記範囲内であると、成形加工性と耐衝撃性との物性バランスに優れる。 Intrinsic viscosity [η] of a soluble component by acetone of the above rubber-reinforced resin (provided that acetonitrile is used when the rubbery polymer (a1) is an acrylic rubber) (measured in methyl ethyl ketone at 30 ° C.) Is preferably 0.2 to 0.8 dl / g. When the intrinsic viscosity [η] is within the above range, the physical property balance between molding processability and impact resistance is excellent.
 ここで、上記ゴム強化樹脂が、ゴム強化ビニル系樹脂(A1)である場合、及び、ゴム強化ビニル系樹脂(A1)と、ビニル系単量体の重合によって得られた(共)重合体(A2)とよりなる混合物である場合のいずれにおいても、本発明の防かび性樹脂組成物中のゴム質重合体(a1)の含有量は、好ましくは5~30質量%である。上記ゴム質重合体(a1)の含有量が上記範囲にあると、本発明の防かび性樹脂組成物及びそれを含む成形品の耐衝撃性、表面外観性、剛性、耐熱性等に優れる。 Here, when the rubber-reinforced resin is a rubber-reinforced vinyl resin (A1), and a (co) polymer obtained by polymerization of a rubber-reinforced vinyl resin (A1) and a vinyl monomer ( In any case of the mixture comprising A2), the content of the rubbery polymer (a1) in the antifungal resin composition of the present invention is preferably 5 to 30% by mass. When the content of the rubbery polymer (a1) is in the above range, the antifungal resin composition of the present invention and the molded product containing the same are excellent in impact resistance, surface appearance, rigidity, heat resistance and the like.
 上記オレフィン系樹脂は、炭素数が2以上のα-オレフィンからなる単量体単位を含む重合体であれば、特に限定されない。好ましいオレフィン系樹脂は、炭素数2~10のα-オレフィンからなる単量体単位を含む重合体である。従って、炭素数2~10のα-オレフィンからなる単量体単位の1種以上を主として含む(共)重合体;炭素数2~10のα-オレフィンからなる単量体単位の1種以上と、このα-オレフィンと共重合可能な化合物からなる単量体単位の1種以上とを主として含む共重合体等が挙げられる。これらは、1種単独であるいは2種以上を組み合わせて用いることができる。 The olefin resin is not particularly limited as long as it is a polymer containing a monomer unit composed of an α-olefin having 2 or more carbon atoms. A preferred olefin resin is a polymer containing a monomer unit composed of an α-olefin having 2 to 10 carbon atoms. Accordingly, a (co) polymer mainly containing at least one monomer unit composed of an α-olefin having 2 to 10 carbon atoms; one or more monomer units composed of an α-olefin having 2 to 10 carbon atoms; And a copolymer mainly containing at least one monomer unit composed of a compound copolymerizable with the α-olefin. These can be used alone or in combination of two or more.
 上記オレフィン系樹脂としては、ポリエチレン、ポリプロピレン、エチレン・プロピレン共重合体、ポリブテン-1、エチレン・ブテン-1共重合体等が挙げられる。これらのうち、ポリエチレン、ポリプロピレン、プロピレン・エチレン共重合体が好ましく、プロピレン単位を全単量体単位に対して、50質量%以上含む重合体、即ち、ポリプロピレン、エチレン・プロピレン共重合体がより好ましい。尚、上記エチレン・プロピレン共重合体としては、ランダム共重合体、ブロック共重合体等があるが、ランダム共重合体が特に好ましい。 Examples of the olefin resin include polyethylene, polypropylene, ethylene / propylene copolymer, polybutene-1, and ethylene / butene-1 copolymer. Among these, polyethylene, polypropylene, and propylene / ethylene copolymer are preferable, and a polymer including propylene units with respect to all monomer units of 50% by mass or more, that is, polypropylene and ethylene / propylene copolymers are more preferable. . The ethylene / propylene copolymer includes a random copolymer and a block copolymer, and a random copolymer is particularly preferable.
 上記オレフィン系樹脂は、結晶性であってよいし、非晶性であってもよい。好ましくは、室温下、X線回折により、20%以上の結晶化度を有するものである。
 上記オレフィン系樹脂の融点(JIS K7121に準拠)は、好ましくは40℃以上である。
 また、上記オレフィン系樹脂の分子量は特に限定されないが、成形性の観点から、メルトフローレート(JIS K7210に準拠。以下、「MFR」ともいう。)は、好ましくは0.01~500g/10分であり、各値に相当する分子量を有するものが好ましい。
The olefin resin may be crystalline or amorphous. Preferably, it has a crystallinity of 20% or more by X-ray diffraction at room temperature.
The melting point (based on JIS K7121) of the olefin resin is preferably 40 ° C. or higher.
The molecular weight of the olefin resin is not particularly limited, but from the viewpoint of moldability, the melt flow rate (according to JIS K7210; hereinafter also referred to as “MFR”) is preferably 0.01 to 500 g / 10 min. And those having a molecular weight corresponding to each value are preferred.
 上記オレフィン系樹脂としては、アイオノマー、エチレン・酢酸ビニル共重合体、エチレン・ビニルアルコール共重合体、環状オレフィン共重合体、塩素化ポリエチレン等を用いることもできる。 As the olefin resin, ionomer, ethylene / vinyl acetate copolymer, ethylene / vinyl alcohol copolymer, cyclic olefin copolymer, chlorinated polyethylene, and the like can be used.
 上記ポリエステル系樹脂は、分子の主鎖中にエステル結合を有する樹脂であれば、特に限定されず、飽和ポリエステル樹脂であってよいし、不飽和ポリエステル樹脂であってもよい。これらのうち、飽和ポリエステル樹脂が好ましい。また、単独重合ポリエステルであってよいし、共重合ポリエステルであってもよい。更に、結晶性樹脂であってよいし、非晶性樹脂であってもよい。 The polyester resin is not particularly limited as long as it has an ester bond in the main chain of the molecule, and may be a saturated polyester resin or an unsaturated polyester resin. Of these, saturated polyester resins are preferred. Further, it may be a homopolymerized polyester or a copolyester. Further, it may be a crystalline resin or an amorphous resin.
 上記ポリエステル系樹脂としては、ポリエチレンテレフタレート(PET)、ポリプロピレンテレフタレート(PPT)、ポリブチレンテレフタレート(PBT)、ポリヘキサメチレンテレフタレート、ポリシクロヘキサン-1,4-ジメチルテレフタレート、ポリネオペンチルテレフタレート等のポリアルキレンテレフタレート、ポリエチレンイソフタレート、ポリエチレンナフタレート、ポリブチレンナフタレート、ポリヘキサメチレンナフタレート等のポリアルキレンナフタレート等の単独重合ポリエステル、アルキレンテレフタレート単位及び/又はアルキレンナフタレート単位を主として含有する共重合ポリエステル、液晶ポリエステル等が挙げられる。これらのうち、ポリブチレンテレフタレートが好ましい。また、これらは、1種単独であるいは2種以上を組み合わせて用いることができる。 Examples of the polyester resins include polyalkylene terephthalates such as polyethylene terephthalate (PET), polypropylene terephthalate (PPT), polybutylene terephthalate (PBT), polyhexamethylene terephthalate, polycyclohexane-1,4-dimethyl terephthalate, and polyneopentyl terephthalate. , Homopolymerized polyesters such as polyalkylene naphthalates such as polyethylene isophthalate, polyethylene naphthalate, polybutylene naphthalate, polyhexamethylene naphthalate, copolymer polyesters mainly containing alkylene terephthalate units and / or alkylene naphthalate units, liquid crystals Examples include polyester. Of these, polybutylene terephthalate is preferred. Moreover, these can be used individually by 1 type or in combination of 2 or more types.
 上記ポリカーボネート樹脂は、主鎖にカーボネート結合を有するものであれば、特に限定されず、芳香族ポリカーボネートでよいし、脂肪族ポリカーボネートでもよい。また、これらを組み合わせて用いてもよい。本発明においては、耐衝撃性、耐熱性等の観点から、芳香族ポリカーボネートが好ましい。尚、このポリカーボネート樹脂は、末端が、R-CO-基、R’-O-CO-基(R及びR’は、いずれも有機基を示す。)に変性されたものであってもよい。このポリカーボネート樹脂は、1種単独であるいは2種以上を組み合わせて用いることができる。 The polycarbonate resin is not particularly limited as long as it has a carbonate bond in the main chain, and may be an aromatic polycarbonate or an aliphatic polycarbonate. Moreover, you may use combining these. In the present invention, an aromatic polycarbonate is preferable from the viewpoint of impact resistance, heat resistance, and the like. The polycarbonate resin may have a terminal modified with an R—CO— group or an R′—O—CO— group (R and R ′ each represents an organic group). This polycarbonate resin can be used individually by 1 type or in combination of 2 or more types.
 上記ポリカーボネート樹脂の粘度平均分子量は、溶媒として塩化メチレンを用い、温度20℃で測定された溶液粘度より換算した場合、好ましくは12,000~40,000である。この粘度平均分子量が上記範囲にあると、成形加工性に優れ、得られる成形品の耐衝撃性、靭性及び耐薬品性に優れる。
 上記ポリカーボネート樹脂は、全体としての粘度平均分子量が上記範囲に入るものであれば、異なる粘度平均分子量を有するポリカーボネート樹脂の2種以上を混合して用いてもよい。
The viscosity average molecular weight of the polycarbonate resin is preferably 12,000 to 40,000 when converted from the solution viscosity measured at a temperature of 20 ° C. using methylene chloride as a solvent. When this viscosity average molecular weight is in the above range, the molding processability is excellent, and the resulting molded article is excellent in impact resistance, toughness and chemical resistance.
The polycarbonate resin may be used by mixing two or more polycarbonate resins having different viscosity average molecular weights as long as the overall viscosity average molecular weight falls within the above range.
 上記ポリカーボネート樹脂は、上述のように、ポリエステル系樹脂と、あるいは、ゴム強化樹脂及びポリエステル系樹脂と組み合わせて、アロイとして用いることもできる。 As described above, the polycarbonate resin can be used as an alloy in combination with a polyester resin, or a rubber-reinforced resin and a polyester resin.
 上記ポリアミド系樹脂は、主鎖に酸アミド結合(-CO-NH-)を有する樹脂であれば、特に限定されない。
 上記ポリアミド系樹脂としては、ナイロン4、6、7、8、11、12、6.6、6.9、6.10、6.11、6.12、6T、6/6.6、6/12、6/6T、6T/6I等が挙げられる。
 尚、ポリアミド系樹脂の末端は、カルボン酸、アミン等で封止されていてもよい。カルボン酸としては、カプロン酸、カプリル酸、カプリン酸、ラウリン酸、ミリスチン酸、パルミチン酸、ステアリン酸、ベヘニン酸等の脂肪族モノカルボン酸が挙げられる。また、アミンとしては、ヘキシルアミン、オクチルアミン、デシルアミン、ラウリルアミン、ミリスチルアミン、パルミチルアミン、ステアリルアミン、ベヘニルアミン等の脂肪族第1級アミン等が挙げられる。
 上記ポリアミド系樹脂は、1種単独であるいは2種以上を組み合わせて用いることができる。
The polyamide-based resin is not particularly limited as long as it is a resin having an acid amide bond (—CO—NH—) in the main chain.
Examples of the polyamide-based resin include nylon 4, 6, 7, 8, 11, 12, 6.6, 6.9, 6.10, 6.11, 6.12, 6T, 6 / 6.6, 6 / 12, 6 / 6T, 6T / 6I and the like.
In addition, the terminal of a polyamide-type resin may be sealed with carboxylic acid, amine, etc. Examples of the carboxylic acid include aliphatic monocarboxylic acids such as caproic acid, caprylic acid, capric acid, lauric acid, myristic acid, palmitic acid, stearic acid, and behenic acid. Examples of the amine include aliphatic primary amines such as hexylamine, octylamine, decylamine, laurylamine, myristylamine, palmitylamine, stearylamine, and behenylamine.
The said polyamide-type resin can be used individually by 1 type or in combination of 2 or more types.
 また、上記成分〔A〕が硬化性樹脂である場合、この硬化性樹脂としては、それ自身で、又は、硬化剤等により硬化樹脂を生成する重合体及び/又は前駆体を含むものであれば、特に限定されず、アクリル系樹脂、エポキシ樹脂、フェノール系樹脂、不飽和ポリエステル系樹脂、アルキド樹脂、メラミン樹脂、ウレタン系樹脂、尿素樹脂、シリコーン樹脂、ポリサルファイド樹脂、ポリイミド樹脂、ビスマレイミド・トリアジン樹脂、フラン樹脂、キシレン樹脂、グアナミン樹脂、ジシクロペンタジエン樹脂等が挙げられる。これらは、1種単独であるいは2種以上を組み合わせて用いることができる。 Moreover, when the said component [A] is curable resin, as this curable resin, if it contains the polymer and / or precursor which produce | generate cured resin by itself or with a hardening | curing agent etc. , Not particularly limited, acrylic resin, epoxy resin, phenolic resin, unsaturated polyester resin, alkyd resin, melamine resin, urethane resin, urea resin, silicone resin, polysulfide resin, polyimide resin, bismaleimide / triazine resin , Furan resin, xylene resin, guanamine resin, dicyclopentadiene resin and the like. These can be used alone or in combination of two or more.
 尚、本発明の防かび性樹脂組成物は、成形品を形成するだけでなく、塗料、接着剤、シーリング剤等とすることもできる。これらの場合に好適な樹脂として、アクリル系樹脂、ポリ酢酸ビニル、ポリビニルアルコール、塩化ビニル系樹脂、ウレタン系樹脂、尿素樹脂等が挙げられる。 In addition, the antifungal resin composition of the present invention can be used as a paint, an adhesive, a sealing agent, etc. as well as forming a molded product. Suitable resins in these cases include acrylic resins, polyvinyl acetate, polyvinyl alcohol, vinyl chloride resins, urethane resins, urea resins and the like.
 次に、成分〔B〕について説明する。
 上記成分〔B〕は、ベンズイミダゾール系化合物(b1)、有機ヨード系化合物(b2)、チアゾール系化合物(b3)及びハロアルキルチオ系化合物(b4)を、それぞれ、所定の割合で含む組成物である。この成分〔B〕は、必要に応じて、他の成分を含有してもよい。
Next, component [B] is demonstrated.
The component [B] is a composition containing a benzimidazole compound (b1), an organic iodo compound (b2), a thiazole compound (b3), and a haloalkylthio compound (b4) in a predetermined ratio. . This component [B] may contain other components as required.
 上記ベンズイミダゾール系化合物(b1)は、ベンズイミダゾール環を有する化合物であり、チアゾール基、及び、-S-C-X結合(X:ハロゲン原子)を有さない化合物である。
 上記ベンズイミダゾール系化合物(b1)としては、ベンズイミダゾールカルバミン酸誘導体、チオベンズイミダゾール誘導体、スルホニル基含有ベンズイミダゾール誘導体等が挙げられる。これらは、単独であるいは組み合わせて用いることができる。本発明においては、ベンズイミダゾールカルバミン酸誘導体が好ましい。
The benzimidazole compound (b1) is a compound having a benzimidazole ring and having no thiazole group and —S—C—X bond (X: halogen atom).
Examples of the benzimidazole compound (b1) include benzimidazole carbamic acid derivatives, thiobenzimidazole derivatives, sulfonyl group-containing benzimidazole derivatives, and the like. These can be used alone or in combination. In the present invention, a benzimidazole carbamic acid derivative is preferable.
 上記ベンズイミダゾールカルバミン酸誘導体は、好ましくは、下記一般式(1)で表される化合物である。
Figure JPOXMLDOC01-appb-C000001
〔式中、R及びRは、同一又は異なって、水素原子、置換基を有してもよい炭化水素基若しくは他の有機基であり、Rは、水素原子、置換基を有してもよいアルキル基、置換基を有してもよいアリール基若しくは他の有機基であり、Rは、炭化水素基である。〕
 上記一般式(1)で表される化合物としては、1H-2-ベンズイミダゾールカルバミン酸メチル、1-ブチルカルバモイル-2-ベンズイミダゾールカルバミン酸メチル、6-ベンゾイル-1H-2-ベンズイミダゾールカルバミン酸メチル、6-(2-チオフェンカルボニル)-1H-2-ベンズイミダゾールカルバミン酸メチル等が挙げられる。これらは、1種単独であるいは2種以上を組み合わせて用いることができる。
The benzimidazole carbamic acid derivative is preferably a compound represented by the following general formula (1).
Figure JPOXMLDOC01-appb-C000001
[In the formula, R 1 and R 2 are the same or different and are a hydrogen atom, a hydrocarbon group which may have a substituent, or other organic group, and R 3 has a hydrogen atom, a substituent. An alkyl group that may be substituted, an aryl group that may have a substituent, or another organic group, and R 4 is a hydrocarbon group. ]
Examples of the compound represented by the general formula (1) include methyl 1H-2-benzimidazolecarbamate, methyl 1-butylcarbamoyl-2-benzimidazolecarbamate, methyl 6-benzoyl-1H-2-benzimidazolecarbamate , 6- (2-thiophenecarbonyl) -1H-2-benzimidazole carbamate methyl and the like. These can be used alone or in combination of two or more.
 上記チオベンズイミダゾール誘導体は、好ましくは、下記一般式(2)で表される化合物である。
Figure JPOXMLDOC01-appb-C000002
〔式中、R及びRは、同一又は異なって、水素原子、置換基を有してもよい炭化水素基若しくは他の有機基であり、Rは、水素原子、置換基を有してもよいアルキル基、又は、置換基を有してもよいアリール基であり、Rは、有機基である。〕
The thiobenzimidazole derivative is preferably a compound represented by the following general formula (2).
Figure JPOXMLDOC01-appb-C000002
[In the formula, R 1 and R 2 are the same or different and are a hydrogen atom, a hydrocarbon group which may have a substituent, or other organic group, and R 3 has a hydrogen atom, a substituent. An alkyl group that may be substituted, or an aryl group that may have a substituent, and R is an organic group. ]
 また、上記スルホニル基含有ベンズイミダゾール誘導体としては、1-ジメチルアミノスルホニル-2-シアノ-4-ブロモ-6-トリフルオロメチルベンズイミダゾール等が挙げられる。これらは、1種単独であるいは2種以上を組み合わせて用いることができる。 Examples of the sulfonyl group-containing benzimidazole derivative include 1-dimethylaminosulfonyl-2-cyano-4-bromo-6-trifluoromethylbenzimidazole. These can be used alone or in combination of two or more.
 本発明に係るベンズイミダゾール系化合物(b1)としては、1H-2-ベンズイミダゾールカルバミン酸メチル及び1-ブチルカルバモイル-2-ベンズイミダゾールカルバミン酸メチルが好ましく、なかでも、1H-2-ベンズイミダゾールカルバミン酸メチルが特に好ましい。 As the benzimidazole compound (b1) according to the present invention, methyl 1H-2-benzimidazolecarbamate and methyl 1-butylcarbamoyl-2-benzimidazolecarbamate are preferable, and in particular, 1H-2-benzimidazolecarbamic acid. Methyl is particularly preferred.
 上記成分〔B〕に含有される上記ベンズイミダゾール系化合物(b1)の含有量は、成分(b1)、(b2)、(b3)及び(b4)の合計を100質量%とした場合に、85~99.97質量%であり、好ましくは88~99.7質量%、より好ましくは91.5~99.5質量%である。このベンズイミダゾール系化合物(b1)の含有量が上記範囲にあると、真菌、細菌、木材腐朽菌、藻類及び海洋生物の繁殖を防除し、更に、防かび性、防菌性、防藻性、防臭性及び防腐性に優れ、これらの効果の持続性に優れる。 The content of the benzimidazole compound (b1) contained in the component [B] is 85 when the total of the components (b1), (b2), (b3) and (b4) is 100% by mass. To 99.97% by mass, preferably 88 to 99.7% by mass, and more preferably 91.5 to 99.5% by mass. When the content of the benzimidazole compound (b1) is within the above range, the fungi, bacteria, wood decay fungi, algae and marine organisms are controlled to grow. It is excellent in deodorization and antiseptic properties and excellent in sustainability of these effects.
 上記有機ヨード系化合物(b2)は、ヨウ素原子を有する有機化合物であり、チアゾール基、及び、-S-C-X(X:ハロゲン原子)を有さない化合物である。尚、塩素原子を含んでもよい。
 上記有機ヨード系化合物(b2)としては、ヨードスルホニル化合物、ヨウ化不飽和脂肪族化合物等が挙げられる。これらは、単独であるいは組み合わせて用いることができる。本発明においては、ヨードスルホニル化合物が好ましい。
The organic iodine compound (b2) is an organic compound having an iodine atom, and is a compound having no thiazole group and —S—C—X (X: halogen atom). In addition, a chlorine atom may be included.
Examples of the organic iodo compound (b2) include an iodosulfonyl compound and an iodinated unsaturated aliphatic compound. These can be used alone or in combination. In the present invention, iodosulfonyl compounds are preferred.
 上記ヨードスルホニル化合物としては、ヨードスルホニルベンゼン誘導体が好ましく、ジヨードメチル-p-トリルスルホン(1-ジヨードメチルスルホニル4-メチルベンゼンともいう。)、1-ジヨードメチルスルホニル4-クロロベンゼン等が挙げられる。これらは、1種単独であるいは2種以上を組み合わせて用いることができる。尚、これらのうち、ジヨードメチル-p-トリルスルホンが好ましい。
 また、上記ヨウ化不飽和脂肪族化合物としては、3-ヨード-2-プロパルギルブチルカルバミン酸、4-クロロフェニル-3-ヨードプロパルギルホルマール、3-エトキシカルボニルオキシ-1-ブロモ-1,2-ジヨード-1-プロペン、2,3,3-トリヨードアリルアルコール等が挙げられる。これらは、1種単独であるいは2種以上を組み合わせて用いることができる。
The iodosulfonyl compound is preferably an iodosulfonylbenzene derivative, and examples thereof include diiodomethyl-p-tolylsulfone (also referred to as 1-diiodomethylsulfonyl 4-methylbenzene) and 1-diiodomethylsulfonyl 4-chlorobenzene. These can be used alone or in combination of two or more. Of these, diiodomethyl-p-tolylsulfone is preferred.
Examples of the iodinated unsaturated aliphatic compound include 3-iodo-2-propargylbutylcarbamic acid, 4-chlorophenyl-3-iodopropargyl formal, 3-ethoxycarbonyloxy-1-bromo-1,2-diiodo- Examples include 1-propene and 2,3,3-triiodoallyl alcohol. These can be used alone or in combination of two or more.
 本発明に係る有機ヨード系化合物(b2)としては、ジヨードメチル-p-トリルスルホンが特に好ましい。 As the organic iodo compound (b2) according to the present invention, diiodomethyl-p-tolylsulfone is particularly preferable.
 上記成分〔B〕に含有される上記有機ヨード系化合物(b2)の含有量は、成分(b1)、(b2)、(b3)及び(b4)の合計を100質量%とした場合に、0.01~5質量%であり、好ましくは0.03~4質量%、より好ましくは0.05~3質量%である。この有機ヨード系化合物(b2)の含有量が上記範囲にあると、真菌、細菌、木材腐朽菌、藻類及び海洋生物の繁殖を防除し、更に、防かび性、防菌性、防藻性、防臭性及び防腐性に優れ、これらの効果の持続性に優れる。 The content of the organic iodine compound (b2) contained in the component [B] is 0 when the total of the components (b1), (b2), (b3) and (b4) is 100% by mass. 0.01 to 5% by mass, preferably 0.03 to 4% by mass, more preferably 0.05 to 3% by mass. When the content of the organic iodine compound (b2) is within the above range, the growth of fungi, bacteria, wood decay fungi, algae and marine organisms is controlled, and further, fungicidal, fungicidal, antialgal, It is excellent in deodorization and antiseptic properties and excellent in sustainability of these effects.
 上記チアゾール系化合物(b3)は、チアゾール基を有する化合物であり、-S-C-X(X:ハロゲン原子)を有さない化合物である。
 上記チアゾール系化合物(b3)としては、チアゾール基含有ベンズイミダゾール誘導体、イソチアゾリン-3-オン誘導体、1,2-ベンズイソチアゾリン-3-オン誘導体、ベンズチアゾール誘導体、イソチアゾール誘導体等が挙げられる。これらは、1種単独であるいは2種以上を組み合わせて用いることができる。本発明においては、チアゾール基含有ベンズイミダゾール誘導体が好ましい。
The thiazole-based compound (b3) is a compound having a thiazole group and having no —SC—X (X: halogen atom).
Examples of the thiazole-based compound (b3) include thiazole group-containing benzimidazole derivatives, isothiazolin-3-one derivatives, 1,2-benzisothiazolin-3-one derivatives, benzthiazole derivatives, and isothiazole derivatives. These can be used alone or in combination of two or more. In the present invention, thiazole group-containing benzimidazole derivatives are preferred.
 上記チアゾール基含有ベンズイミダゾール誘導体は、好ましくは、下記一般式(3)で表される化合物である。
Figure JPOXMLDOC01-appb-C000003
〔式中、R及びRは、同一又は異なって、水素原子、ハロゲン原子、アミノ基、スルホン酸(塩)基、ニトロ基、ヒドロキシル基、置換基を有してもよい炭化水素基、他の有機基であり、Rは、水素原子、置換基を有してもよいアルキル基、又は、置換基を有してもよいアリール基であり、Rは、アルキレン基である。また、mは0又は1である。〕
The thiazole group-containing benzimidazole derivative is preferably a compound represented by the following general formula (3).
Figure JPOXMLDOC01-appb-C000003
[Wherein, R 1 and R 2 are the same or different and each represents a hydrogen atom, a halogen atom, an amino group, a sulfonic acid (salt) group, a nitro group, a hydroxyl group, a hydrocarbon group which may have a substituent, It is another organic group, R 3 is a hydrogen atom, an alkyl group which may have a substituent, or an aryl group which may have a substituent, and R 5 is an alkylene group. M is 0 or 1. ]
 上記一般式(3)で表される化合物としては、以下に例示される。
Figure JPOXMLDOC01-appb-C000004
 左側の化合物は、2-(4-チアゾリル)-1H-ベンズイミダゾールである。
Figure JPOXMLDOC01-appb-C000005
Figure JPOXMLDOC01-appb-C000006
Figure JPOXMLDOC01-appb-C000007
Figure JPOXMLDOC01-appb-C000008
Examples of the compound represented by the general formula (3) are shown below.
Figure JPOXMLDOC01-appb-C000004
The compound on the left is 2- (4-thiazolyl) -1H-benzimidazole.
Figure JPOXMLDOC01-appb-C000005
Figure JPOXMLDOC01-appb-C000006
Figure JPOXMLDOC01-appb-C000007
Figure JPOXMLDOC01-appb-C000008
 上記イソチアゾリン-3-オン誘導体は、好ましくは、下記一般式(4)で表される化合物である。
Figure JPOXMLDOC01-appb-C000009
〔式中、R及びRは、同一又は異なって、水素原子、ハロゲン原子若しくは置換基を有してもよい炭化水素基であり、Rは、置換基を有してもよい炭化水素基である。〕
The isothiazolin-3-one derivative is preferably a compound represented by the following general formula (4).
Figure JPOXMLDOC01-appb-C000009
[Wherein R 6 and R 7 are the same or different and are a hydrogen atom, a halogen atom or a hydrocarbon group which may have a substituent, and R 8 represents a hydrocarbon which may have a substituent. It is a group. ]
 上記一般式(4)で表される化合物としては、2-メチル-4-イソチアゾリン-3-オン、2-(n-オクチル)-4-イソチアゾリン-3-オン、5-クロロ-2-メチル-4-イソチアゾリン-3-オン、4,5-ジクロロ-2-シクロヘキシル-4-イソチアゾリン-3-オン、2-メチル-5-フェニル-4-イソチアゾリン-3-オン、2-ヒドロキシメチル-4-イソチアゾリン-3-オン等が挙げられる。これらは、1種単独であるいは2種以上を組み合わせて用いることができる。 Examples of the compound represented by the general formula (4) include 2-methyl-4-isothiazolin-3-one, 2- (n-octyl) -4-isothiazolin-3-one, and 5-chloro-2-methyl- 4-isothiazolin-3-one, 4,5-dichloro-2-cyclohexyl-4-isothiazolin-3-one, 2-methyl-5-phenyl-4-isothiazolin-3-one, 2-hydroxymethyl-4-isothiazoline -3-one and the like. These can be used alone or in combination of two or more.
 上記1,2-ベンズイソチアゾリン-3-オン誘導体は、好ましくは、下記一般式(5)で表される化合物である。
Figure JPOXMLDOC01-appb-C000010
〔式中、R及びR10は、同一又は異なって、水素原子、ハロゲン原子、ニトロ基、カルボキシル基、シアノ基若しくは置換基を有してもよい炭化水素基であり、Rは、水素原子又は有機基である。〕
The 1,2-benzisothiazolin-3-one derivative is preferably a compound represented by the following general formula (5).
Figure JPOXMLDOC01-appb-C000010
[Wherein R 9 and R 10 are the same or different and each represents a hydrogen atom, a halogen atom, a nitro group, a carboxyl group, a cyano group or a hydrocarbon group which may have a substituent, and R represents a hydrogen atom Or it is an organic group. ]
 上記一般式(5)で表される化合物としては、以下に例示される。
Figure JPOXMLDOC01-appb-C000011
Figure JPOXMLDOC01-appb-C000012
Figure JPOXMLDOC01-appb-C000013
Examples of the compound represented by the general formula (5) include the following.
Figure JPOXMLDOC01-appb-C000011
Figure JPOXMLDOC01-appb-C000012
Figure JPOXMLDOC01-appb-C000013
 上記ベンズチアゾール誘導体は、好ましくは、下記一般式(6)及び(7)で表される化合物である。
Figure JPOXMLDOC01-appb-C000014
〔式中、R及びR10は、同一又は異なって、水素原子若しくは置換基を有してもよい炭化水素基であり、Rは、-SM(Mは、Na、Zn等の金属原子である)又は有機基である。〕
Figure JPOXMLDOC01-appb-C000015
〔式中、R、R10及びR11は、同一又は異なって、水素原子若しくは置換基を有してもよい炭化水素基であり、R12は、R13は、同一又は異なって、有機基である。〕
The benzthiazole derivative is preferably a compound represented by the following general formulas (6) and (7).
Figure JPOXMLDOC01-appb-C000014
[In the formula, R 9 and R 10 are the same or different and each represents a hydrogen atom or a hydrocarbon group which may have a substituent; R represents —SM (M represents a metal atom such as Na or Zn; Or an organic group. ]
Figure JPOXMLDOC01-appb-C000015
Wherein, R 9, R 10 and R 11 are the same or different, a hydrogen atom or a substituent hydrocarbon group which may have a, R 12 is, R 13 are the same or different, organic It is a group. ]
 上記一般式(6)で表される化合物としては、2-(4-チオシアノメチルチオ)ベンズチアゾール、2-メルカプトベンズチアゾールナトリウム、2-メルカプトベンズチアゾール亜鉛等が挙げられる。これらは、1種単独であるいは2種以上を組み合わせて用いることができる。 Examples of the compound represented by the general formula (6) include 2- (4-thiocyanomethylthio) benzthiazole, 2-mercaptobenzthiazole sodium, and 2-mercaptobenzthiazole zinc. These can be used alone or in combination of two or more.
 上記チアゾール系化合物(b3)としては、2-(4-チアゾリル)-1H-ベンズイミダゾールが特に好ましい。 As the thiazole compound (b3), 2- (4-thiazolyl) -1H-benzimidazole is particularly preferable.
 上記成分〔B〕に含有される上記チアゾール系化合物(b3)の含有量は、成分(b1)、(b2)、(b3)及び(b4)の合計を100質量%とした場合に、0.01~5質量%であり、好ましくは0.03~4質量%、より好ましくは0.05~3質量%である。このチアゾール系化合物(b3)の含有量が上記範囲にあると、真菌、細菌、木材腐朽菌、藻類及び海洋生物の繁殖を防除し、更に、防かび性、防菌性、防藻性、防臭性及び防腐性に優れ、これらの効果の持続性に優れる。 The content of the thiazole compound (b3) contained in the component [B] is 0. When the sum of the components (b1), (b2), (b3) and (b4) is 100% by mass. The content is from 01 to 5% by mass, preferably from 0.03 to 4% by mass, and more preferably from 0.05 to 3% by mass. When the content of the thiazole compound (b3) is within the above range, the growth of fungi, bacteria, wood rot fungi, algae and marine organisms is controlled, and further, the fungicidal, fungicidal, antialgal, and deodorant properties are controlled. It has excellent properties and antiseptic properties and is excellent in sustainability of these effects.
 上記ハロアルキルチオ系化合物(b4)は、ハロアルキルチオ系化合物であり、通常、-S-C-X結合(X:ハロゲン原子)を有する化合物である。
 上記ハロアルキルチオ系化合物(b4)としては、ハロアルキルチオスルファミド誘導体、ハロアルキルチオフタルイミド誘導体、ハロアルキルチオテトラヒドロフタルイミド誘導体等が挙げられる。これらは、単独であるいは組み合わせて用いることができる。本発明においては、ハロアルキルチオスルファミド誘導体が好ましい。
The haloalkylthio compound (b4) is a haloalkylthio compound and is usually a compound having a —S—C—X bond (X: halogen atom).
Examples of the haloalkylthio compound (b4) include haloalkylthiosulfamide derivatives, haloalkylthiophthalimide derivatives, haloalkylthiotetrahydrophthalimide derivatives, and the like. These can be used alone or in combination. In the present invention, haloalkylthiosulfamide derivatives are preferred.
 上記ハロアルキルチオスルファミド誘導体としては、N-トリクロロメチルチオ-N-(フェニル)メチルスルファミド、N-トリクロロメチルチオ-N-(4-クロロフェニル)メチルスルファミド、N-(1-フルオロ-1,1,2,2-テトラクロロエチルチオ)-N-(フェニル)メチルスルファミド、N-(1,1-ジフルオロ-1,2,2-トリクロロエチルチオ)-N-(フェニル)メチルスルファミド、N,N-ジメチル-N'-フェニル-N'-(フルオロジクロロメチルチオ)スルファミド、N,N-ジメチル-N’-(p-トリル)-N’-(フルオロジクロロメチルチオ)スルファミド等が挙げられる。これらは、1種単独であるいは2種以上を組み合わせて用いることができる。上記ハロアルキルチオスルファミド誘導体のうち、N,N-ジメチル-N'-フェニル-N'-(フルオロジクロロメチルチオ)スルファミドが好ましい。
 上記ハロアルキルチオフタルイミド誘導体としては、N-フルオロジクロロメチルチオフタルイミド、N-トリクロロメチルチオフタルイミド等が挙げられる。これらは、1種単独であるいは2種以上を組み合わせて用いることができる。
 また、上記ハロアルキルチオテトラヒドロフタルイミド誘導体としては、N-1,1,2,2-テトラクロロエチルチオテトラヒドロフタルイミド、N-トリクロロメチルチオテトラヒドロフタルイミド等が挙げられる。これらは、1種単独であるいは2種以上を組み合わせて用いることができる。
Examples of the haloalkylthiosulfamide derivatives include N-trichloromethylthio-N- (phenyl) methylsulfamide, N-trichloromethylthio-N- (4-chlorophenyl) methylsulfamide, N- (1-fluoro-1 , 1,2,2-tetrachloroethylthio) -N- (phenyl) methylsulfamide, N- (1,1-difluoro-1,2,2-trichloroethylthio) -N- (phenyl) methylsulfamide N, N-dimethyl-N′-phenyl-N ′-(fluorodichloromethylthio) sulfamide, N, N-dimethyl-N ′-(p-tolyl) -N ′-(fluorodichloromethylthio) sulfamide, and the like. . These can be used alone or in combination of two or more. Of the above haloalkylthiosulfamide derivatives, N, N-dimethyl-N′-phenyl-N ′-(fluorodichloromethylthio) sulfamide is preferred.
Examples of the haloalkylthiophthalimide derivatives include N-fluorodichloromethylthiophthalimide and N-trichloromethylthiophthalimide. These can be used alone or in combination of two or more.
Examples of the haloalkylthiotetrahydrophthalimide derivative include N-1,1,2,2-tetrachloroethylthiotetrahydrophthalimide, N-trichloromethylthiotetrahydrophthalimide and the like. These can be used alone or in combination of two or more.
 本発明に係るハロアルキルチオ系化合物(b4)としては、N,N-ジメチル-N'-フェニル-N'-(フルオロジクロロメチルチオ)スルファミドが特に好ましい。 As the haloalkylthio compound (b4) according to the present invention, N, N-dimethyl-N′-phenyl-N ′-(fluorodichloromethylthio) sulfamide is particularly preferable.
 上記成分〔B〕に含有される上記ハロアルキルチオ系化合物(b4)の含有量は、成分(b1)、(b2)、(b3)及び(b4)の合計を100質量%とした場合に、0.01~5質量%であり、好ましくは0.03~4質量%、より好ましくは0.05~2.5質量%である。このハロアルキルチオ系化合物(b4)の含有量が上記範囲にあると、真菌、細菌、木材腐朽菌、藻類及び海洋生物の繁殖を防除し、更に、防かび性、防菌性、防藻性、防臭性及び防腐性に優れ、これらの効果の持続性に優れる。 The content of the haloalkylthio compound (b4) contained in the component [B] is 0 when the total of the components (b1), (b2), (b3) and (b4) is 100% by mass. 0.01 to 5% by mass, preferably 0.03 to 4% by mass, more preferably 0.05 to 2.5% by mass. When the content of the haloalkylthio compound (b4) is in the above range, the fungi, bacteria, wood decay fungi, algae and marine organisms are controlled, and further, fungicidal, fungicidal, antialgal, It is excellent in deodorization and antiseptic properties and excellent in sustainability of these effects.
 上記成分〔B〕は、上記成分(b1)、(b2)、(b3)及び(b4)からなるものであってよいし、防かび作用及び/又は抗菌作用を有する他の成分を含有するものであってもよい。後者の場合、本発明による効果を十分なものとするために、上記成分〔B〕に対する、上記成分(b1)、(b2)、(b3)及び(b4)の合計量の割合は、通常、90~100質量%、好ましくは95~100質量%である。 The said component [B] may consist of said component (b1), (b2), (b3) and (b4), and contains the other component which has an antifungal action and / or an antibacterial action It may be. In the latter case, the ratio of the total amount of the components (b1), (b2), (b3) and (b4) to the component [B] is usually It is 90 to 100% by mass, preferably 95 to 100% by mass.
 上記成分〔B〕は、更に、有機ブロム系化合物(b5)を含有したものとすることができる。この成分(b5)を含有すると、バシルス属、クロストリジウム属等の芽胞菌並びに木材腐朽菌に対する防菌性に優れる。
 上記成分(b5)としては、2,2-ジブロモ-3-ニトリロプロピオンアミド、2,2-ジブロモ-4-ニトリロブタンアミド、1,2-ジブロモ-2,4-ジシアノブタン、2-ブロモ-2-ブロモメチルグルタロニトリル等のニトリル基(シアン基)含有化合物;2-ブロモ-2-ニトロ-1,3-プロパンジオール、2-ブロモ-2-ニトロ-1,3-ブタンジオール、3-ブロモ-3-ニトロ-2,4-ペンタンジオール、2,2-ジブロモ-2-ニトロエタノール等のアルコール性水酸基含有化合物;α-ブロモシンナムアルデヒド、2,2-ジブロモアセトフェノン、2,2-ジブロモ-4’-ヒドロキシアセトフェノン、2-ブロモ-4’-ヒドロキシアセトフェノン、ビス-1,4-ブロモアセトキシ-2-ブテン、ベンジルブロモアセテート、1,2-ジブロモプロピオンアルデヒド、N-ブロモアセトアミド、ヘキサブロモジメチルスルホン、ブロモメチルチオシアネート、ω-ブロモオキシイミノアセトフェノン、ブロモ酢酸エチルチオフェニルエステル、5-ブロモ-5-ニトロ-1,3-ジオキサン、5-ブロモサリチルアニリド、3,4-ジブロモサリチルアニリド、3,4’,5-トリブロモサリチルアニリド、3,5-ジブロモサリチル酸、3,5-ジブロモサリチルアルデヒド、2,4,6-トリブロモフェノール、1-ブロモ-3-エトキシカルボニルオキシ-1,2-ジヨード-1-プロペン等が挙げられる。これらは、1種単独であるいは2種以上を組み合わせて用いることができる。尚、上記化合物のうち、好ましくは2,2-ジブロモ-3-ニトリロプロピオンアミド、2,2-ジブロモ-2-ニトロエタノール、1,2-ジブロモ-2,4-ジシアノブタン等のニトリル基(シアン基)含有化合物;2-ブロモ-2-ニトロ-1,3-プロパンジオール等のアルコール性水酸基含有化合物;ビス-1,4-ブロモアセトキシ-2-ブテン及びヘキサブロモジメチルスルホン、より好ましくは2-ブロモ-2-ニトロ-1,3-プロパンジオール及び1,2-ジブロモ-2,4-ジシアノブタン、特に好ましくは2-ブロモ-2-ニトロ-1,3-プロパンジオールである。
The component [B] may further contain an organic bromide compound (b5). When this component (b5) is contained, it is excellent in antibacterial properties against spore bacteria such as Bacillus genus, Clostridium genus and the like, and wood decay fungi.
Examples of the component (b5) include 2,2-dibromo-3-nitrilopropionamide, 2,2-dibromo-4-nitrilobutanamide, 1,2-dibromo-2,4-dicyanobutane, 2-bromo-2 Nitrile group (cyan group) -containing compounds such as bromomethylglutaronitrile; 2-bromo-2-nitro-1,3-propanediol, 2-bromo-2-nitro-1,3-butanediol, 3-bromo Alcoholic hydroxyl group-containing compounds such as -3-nitro-2,4-pentanediol and 2,2-dibromo-2-nitroethanol; α-bromocinnamaldehyde, 2,2-dibromoacetophenone, 2,2-dibromo-4 '-Hydroxyacetophenone, 2-bromo-4'-hydroxyacetophenone, bis-1,4-bromoacetoxy-2-butene, benzyl Bromoacetate, 1,2-dibromopropionaldehyde, N-bromoacetamide, hexabromodimethylsulfone, bromomethyl thiocyanate, ω-bromooxyiminoacetophenone, bromoacetic acid ethylthiophenyl ester, 5-bromo-5-nitro-1,3 -Dioxane, 5-bromosalicylanilide, 3,4-dibromosalicylanilide, 3,4 ', 5-tribromosalicylanilide, 3,5-dibromosalicylic acid, 3,5-dibromosalicylaldehyde, 2,4,6- And tribromophenol, 1-bromo-3-ethoxycarbonyloxy-1,2-diiodo-1-propene, and the like. These can be used alone or in combination of two or more. Of the above compounds, nitrile groups such as 2,2-dibromo-3-nitrilopropionamide, 2,2-dibromo-2-nitroethanol, 1,2-dibromo-2,4-dicyanobutane (cyanide) are preferred. Group) containing compounds; alcoholic hydroxyl group containing compounds such as 2-bromo-2-nitro-1,3-propanediol; bis-1,4-bromoacetoxy-2-butene and hexabromodimethylsulfone, more preferably 2- Bromo-2-nitro-1,3-propanediol and 1,2-dibromo-2,4-dicyanobutane, particularly preferably 2-bromo-2-nitro-1,3-propanediol.
 上記成分〔B〕が、上記成分(b5)を含む場合、この成分(b5)の含有量は、上記成分(b1)、(b2)、(b3)及び(b4)の合計を100質量部とした場合に、好ましくは0.01~3質量部、より好ましくは0.02~2.5質量部、更に好ましくは0.03~2質量部である。この成分(b5)が上記割合で含有される成分〔B〕を用いると、得られる成形品、皮膜等において、真菌、細菌、藻類、木材腐朽菌、海洋生物等に対する優れた抵抗性を得ることができる。特に、上記成分(b1)が1H-2-ベンズイミダゾールカルバミン酸メチルであり、上記成分(b2)がヨードスルホニルベンゼン誘導体であり、上記成分(b3)がチアゾール基を有するベンズイミダゾール誘導体であり、上記成分(b4)がハロアルキルチオスルファミド誘導体である場合には、成分(b1)、(b2)、(b3)、(b4)及び(b5)を下記の含有割合とすることにより、従来の防かび剤組成物では効果を得ることが難しかった、バチルス セレウス(Bacillus cereus)、クロストリジウム ボツリナム(Clostridium botulinum)、クロストリジウム パーフリンジェンス(Clostridium perfringens)等の芽胞菌、並びに、スギヒラタケ、カワラタケ、シュタケ、ナミダタケ、ワタグサレタケ、オオウズラタケ等の木材腐朽菌に対する抵抗性に優れる。即ち、成分(b1)、(b2)、(b3)及び(b4)の合計を100質量%とした場合に、各成分の含有量は、それぞれ、好ましくは94.5~99.2質量%、0.1~2質量%、0.1~2質量%及び0.1~1.5質量%、より好ましくは95.8~99質量%、0.35~1.5質量%、0.35~1.5質量%及び0.3~1.2質量%である。そして、成分(b5)の含有量は、成分(b1)、(b2)、(b3)及び(b4)の合計を100質量部とした場合に、好ましくは0.03~1.5質量部、より好ましくは0.05~0.8質量部である。 When the component [B] includes the component (b5), the content of the component (b5) is 100 parts by mass of the total of the components (b1), (b2), (b3), and (b4). In this case, the amount is preferably 0.01 to 3 parts by mass, more preferably 0.02 to 2.5 parts by mass, and still more preferably 0.03 to 2 parts by mass. When component [B] containing this component (b5) in the above proportion is used, excellent resistance to fungi, bacteria, algae, wood decay fungi, marine organisms, etc. is obtained in the obtained molded article, film, etc. Can do. In particular, the component (b1) is methyl 1H-2-benzimidazole carbamate, the component (b2) is an iodosulfonylbenzene derivative, the component (b3) is a benzimidazole derivative having a thiazole group, In the case where component (b4) is a haloalkylthiosulfamide derivative, the conventional content of components (b1), (b2), (b3), (b4) and (b5) is adjusted to the following proportions. Spore fungi such as Bacillus cereus, Clostridium botulinum, Clostridium perfringens (Clostridial perfringens), and Sugihiratake, which were difficult to achieve with the fungicide composition Bamboo, Pycnoporus cinnabarinus, Namidatake, Watagusaretake, the resistance to wood-rotting fungi such as Fomitopsis palustris excellent. That is, when the total of components (b1), (b2), (b3) and (b4) is 100% by mass, the content of each component is preferably 94.5-99.2% by mass, 0.1-2% by mass, 0.1-2% by mass and 0.1-1.5% by mass, more preferably 95.8-99% by mass, 0.35-1.5% by mass, 0.35 -1.5% by mass and 0.3-1.2% by mass. The content of component (b5) is preferably 0.03 to 1.5 parts by mass when the total of components (b1), (b2), (b3) and (b4) is 100 parts by mass, More preferably, it is 0.05 to 0.8 part by mass.
 更に他の抗菌剤としては、有機系抗菌剤、無機系抗菌剤、有機・無機抗菌剤等が挙げられる。
 有機系抗菌剤としては、2,4,5,6-テトラクロロイソフタロニトリル、5-クロロ-2,4,6-トリフルオロイソフタロニトリル等のニトリル系化合物;2,3,5,6-テトラクロロ-4-メチルスルホニルピリジン、2-ピリジンチオール-1-オキシドナトリウム等のピリジン系化合物等が挙げられる。これらは、1種単独であるいは2種以上を組み合わせて用いることができる。
 無機系抗菌剤としては、銀イオン保持タイプ、銀錯塩保持タイプ等の銀系抗菌剤;酸化チタン系抗菌剤;銅系抗菌剤;酸化亜鉛系抗菌剤等が挙げられる。これらは、1種単独であるいは2種以上を組み合わせて用いることができる。
Still other antibacterial agents include organic antibacterial agents, inorganic antibacterial agents, and organic / inorganic antibacterial agents.
Examples of organic antibacterial agents include nitrile compounds such as 2,4,5,6-tetrachloroisophthalonitrile and 5-chloro-2,4,6-trifluoroisophthalonitrile; 2,3,5,6- Examples thereof include pyridine compounds such as tetrachloro-4-methylsulfonylpyridine and sodium 2-pyridinethiol-1-oxide. These can be used alone or in combination of two or more.
Examples of the inorganic antibacterial agents include silver antibacterial agents such as silver ion retention type and silver complex salt retention type; titanium oxide antibacterial agents; copper antibacterial agents; zinc oxide antibacterial agents. These can be used alone or in combination of two or more.
 上記成分〔B〕は、上記の成分(b1)、(b2)、(b3)、(b4)等を含む粉体混合物であってよいし、水、有機溶剤、又は、これらの混合媒体に分散あるいは溶解されてなる組成物であってもよい。また、この成分〔B〕は、上記の粉体混合物、及び、媒体に分散あるいは溶解されてなる組成物以外に、後述する添加剤を所定量含む混合物等として用いることができる。混合方法は、従来、公知の方法であってよく、乾式法及び湿式法のいずれでもよい。混合装置としては、ロッキングミル、タンブラーミキサー、ドラムミキサー、ミキシングシェーカー、ロッキングシェーカー、V型混合機、W型混合機等が挙げられる。 The component [B] may be a powder mixture containing the components (b1), (b2), (b3), (b4), etc., and is dispersed in water, an organic solvent, or a mixed medium thereof. Alternatively, it may be a dissolved composition. In addition to the above powder mixture and the composition dispersed or dissolved in the medium, this component [B] can be used as a mixture containing a predetermined amount of additives to be described later. The mixing method may be a conventionally known method, and may be either a dry method or a wet method. Examples of the mixing device include a rocking mill, a tumbler mixer, a drum mixer, a mixing shaker, a rocking shaker, a V-type mixer, and a W-type mixer.
 本発明の防かび性樹脂組成物において、上記成分〔B〕の含有量は、上記成分〔A〕100質量部に対して、0.01~10質量部であり、好ましくは0.05~8質量部、より好ましくは0.08~5質量部、特に好ましくは0.1~3質量部である。この成分〔B〕の含有量が上記範囲にあると、得られる成形品、皮膜等において、真菌、細菌、木材腐朽菌、藻類及び海洋生物の繁殖を防除し、更に、防かび性、防菌性、防藻性、防臭性及び防腐性に優れ、これらの効果の持続性に優れる。尚、上記成分〔B〕の含有量が多すぎると、得られる成形品等の外観性が低下する。 In the antifungal resin composition of the present invention, the content of the component [B] is 0.01 to 10 parts by mass, preferably 0.05 to 8 parts, relative to 100 parts by mass of the component [A]. Part by mass, more preferably 0.08 to 5 parts by mass, particularly preferably 0.1 to 3 parts by mass. When the content of this component [B] is in the above range, the resulting molded article, film, etc., control the growth of fungi, bacteria, wood decay fungi, algae and marine organisms, and further, fungicidal, antibacterial It has excellent properties, anti-algae properties, deodorization properties and antiseptic properties, and is excellent in sustainability of these effects. In addition, when there is too much content of the said component [B], the external appearance properties, such as a molded product obtained, will fall.
 また、本発明の防かび性樹脂組成物は、酸化防止剤、可塑剤、紫外線吸収剤、耐候(光)剤、帯電防止剤、滑剤、結晶核剤、充填剤、難燃剤、発泡剤、展着剤、増量剤、賦形剤、硬化剤、着色剤、香料、分散剤、レベリング剤、消泡剤、艶消剤、凍結防止剤等の添加剤を含有してもよい。 Further, the antifungal resin composition of the present invention comprises an antioxidant, a plasticizer, an ultraviolet absorber, a weathering (light) agent, an antistatic agent, a lubricant, a crystal nucleating agent, a filler, a flame retardant, a foaming agent, a spreading agent. You may contain additives, such as an adhesive agent, an extender, an excipient | filler, a hardening | curing agent, a coloring agent, a fragrance | flavor, a dispersing agent, a leveling agent, an antifoamer, a matting agent, and an antifreezing agent.
 本発明の防かび性樹脂組成物の性状は、特に限定されず、目的、用途等に応じて、固体(ペレット、粉末混合物)、液状、原料成分が媒体中に分散されてなる分散液、原料成分が媒体中に溶解されてなる溶液等とすることができる。 The properties of the antifungal resin composition of the present invention are not particularly limited, and depending on the purpose, application, etc., a solid (pellet, powder mixture), liquid, a dispersion liquid in which raw material components are dispersed in a medium, a raw material It can be set as the solution etc. in which a component is melt | dissolved in a medium.
 本発明の防かび性樹脂組成物は、固体であり、且つ、成形品の形成材料であることが好ましい。この場合、本発明の防かび性樹脂組成物は、原料成分又はその混合物を、各種押出機、バンバリーミキサー、ニーダー、連続ニーダー等に供給し、混練することにより製造することができる。好ましい製造方法は、押出機を用いる方法であり、なかでも、多軸押出機を用いる方法、及び、押出機と、バンバリーミキサー、連続ニーダー等とを組み合わせた方法が好ましい。更に、原料成分の混練に際して、全量を一括して混練してもよく、多段等の、分割配合しながら混練してもよい。 The antifungal resin composition of the present invention is preferably a solid and a molding material. In this case, the antifungal resin composition of the present invention can be produced by supplying the raw material components or a mixture thereof to various extruders, Banbury mixers, kneaders, continuous kneaders and the like and kneading them. A preferable production method is a method using an extruder, and among them, a method using a multi-screw extruder, and a method combining an extruder, a Banbury mixer, a continuous kneader and the like are preferable. Furthermore, when the raw material components are kneaded, the entire amount may be kneaded in a lump or may be kneaded while being divided and blended in multiple stages.
 本発明の防かび性樹脂組成物を用いて、成形品を得ることができる。また、本発明の防かび性樹脂組成物に含有される成分〔A〕及び〔B〕等を2以上に分割させてなる原料組成物を用いて、成形品を得ることもできる。即ち、本発明の成形品は、上記本発明の防かび性樹脂組成物を含む。
 本発明の成形品は、その全体に渡って均一組成であってよいし、所定の方向に対して成分〔B〕の濃度が変化しているものであってよいし、本発明の効果を所望する特定の部位が、上記本発明の防かび性樹脂組成物により形成されたものであってもよい。
A molded article can be obtained using the antifungal resin composition of the present invention. Moreover, a molded article can also be obtained using the raw material composition formed by dividing the components [A] and [B] contained in the antifungal resin composition of the present invention into two or more. That is, the molded article of the present invention contains the above-mentioned antifungal resin composition of the present invention.
The molded product of the present invention may have a uniform composition throughout, or the concentration of the component [B] may vary in a predetermined direction, and the effect of the present invention is desired. The specific part to be formed may be formed by the antifungal resin composition of the present invention.
 本発明の成形品において、その形態は、特に限定されず、板状、線状、輪状、網状、筒状、半筒状等の所定形状体(フィルム、繊維、管等)又は異形体とすることができる。これらは、中実体及び発泡体のいずれでもよい。また、本発明の成形品は、任意の場所に、貫通孔、溝、凹部、凸部等を備えてもよい。 In the molded article of the present invention, the form thereof is not particularly limited, and is a predetermined shape body (film, fiber, tube, etc.) such as a plate shape, a linear shape, a ring shape, a net shape, a cylindrical shape, a semi-cylindrical shape, or a deformed shape. be able to. These may be either solid or foam. In addition, the molded product of the present invention may include a through hole, a groove, a concave portion, a convex portion, and the like at an arbitrary place.
 本発明の成形品は、ペレット等の均一組成の防かび性樹脂組成物を用いて、射出成形、(共)押出成形(シート成形、フィルム成形)、異形押出成形、プレス成形、真空成形、発泡成形、溶融紡糸、乾式紡糸、湿式紡糸等の公知の方法により製造することができる。また、上記のように、所望の部位に、本発明の効果を発現させる場合には、その部位に、防かび性樹脂組成物が偏在するように製造することができる。また、防かび性樹脂組成物における、成分〔B〕の含有割合の異なる組成物を、例えば、段階的に供給して製造することもできる。 The molded product of the present invention uses a mold-resistant resin composition having a uniform composition such as pellets, injection molding, (co) extrusion molding (sheet molding, film molding), profile extrusion molding, press molding, vacuum molding, foaming. It can be produced by a known method such as molding, melt spinning, dry spinning, or wet spinning. In addition, as described above, when the effect of the present invention is expressed at a desired site, the antifungal resin composition can be produced so as to be unevenly distributed at the site. Moreover, the composition in which the content rate of component [B] in an antifungal resin composition differs can also be manufactured by supplying in steps, for example.
 本発明の成形品が、筐体等である場合の製造方法としては、成分〔A〕及び〔B〕を混合する際に、予め、成分〔B〕を高濃度(例えば、3~50質量%)としたマスターバッチ樹脂(S1)と、成分〔B〕を含有していない成分〔A〕の残部からなるマスターバッチ(S2)とを調製し、(共)押出成形あるいは射出成形する際に、マスターバッチ(S2)を供給することで、成分〔B〕の分散性をより向上させることができる。 When the molded article of the present invention is a housing or the like, the component [A] and [B] are mixed in advance at a high concentration (for example, 3 to 50% by mass). When preparing the master batch resin (S1) and the master batch (S2) composed of the remainder of the component [A] not containing the component [B], and (co) extrusion molding or injection molding, By supplying the master batch (S2), the dispersibility of the component [B] can be further improved.
 本発明において、上記本発明の防かび性樹脂組成物によって形成された成形品以外に、他の材料からなる物品又は層の表面に、上記本発明の防かび性樹脂組成物を含む樹脂層を備える積層物(複合物品、積層フィルム、積層シート等);上記本発明の防かび性樹脂組成物を含む樹脂層の2種以上からなる積層物;他の材料からなる物品の表面に、上記本発明の防かび性樹脂組成物を、塗料等として用いて形成された皮膜を備える積層物(複合物品、積層フィルム、積層シート等)とすることもできる。 In the present invention, in addition to the molded article formed from the antifungal resin composition of the present invention, a resin layer containing the antifungal resin composition of the present invention is provided on the surface of an article or layer made of another material. Laminate provided (composite article, laminate film, laminate sheet, etc.); laminate comprising two or more resin layers containing the antifungal resin composition of the present invention; The antifungal resin composition of the invention may be a laminate (composite article, laminated film, laminated sheet, etc.) provided with a film formed by using it as a paint or the like.
 本発明の防かび性樹脂組成物が、塗料、接着剤、シーリング剤等である場合には、成分〔A〕及び〔B〕と、必要に応じて用いられる添加剤とを、水及び/又は有機溶剤からなる媒体中において、分散又は溶解することにより製造することができる。塗料は、樹脂、金属、木材、紙、繊維、モルタル、漆喰、化粧石膏ボード等からなる所定形状物の表面に、塗布(刷毛塗り、スプレー、浸漬(ディッピング)、ロール、フロー、カーテン、ナイフコート、スピンコート、印刷等)、乾燥等することにより、皮膜等を形成することができる。 When the antifungal resin composition of the present invention is a paint, an adhesive, a sealing agent, or the like, the components [A] and [B] and additives used as necessary are added with water and / or It can be produced by dispersing or dissolving in a medium composed of an organic solvent. The paint is applied (brush coating, spraying, dipping), roll, flow, curtain, knife coating on the surface of a predetermined shape made of resin, metal, wood, paper, fiber, mortar, plaster, decorative gypsum board, etc. , Spin coating, printing, etc.), drying, etc., a film or the like can be formed.
 本発明の成形品、又は、本発明の防かび性樹脂組成物により形成された皮膜等を有する物品は、これらの製品を使用中、輸送中又は保管中に、菌、生物等が発生あるいは繁茂し、製品に付着、繁殖等する場所における用途に好適である。 The molded article of the present invention, or an article having a film or the like formed of the antifungal resin composition of the present invention generates or proliferates bacteria, organisms, etc. during use, transportation or storage of these products. However, it is suitable for use in a place where it adheres to or breeds a product.
 本発明の防かび剤組成物は、ベンズイミダゾール系化合物(b1)と、有機ヨード系化合物(b2)と、チアゾール系化合物(b3)と、ハロアルキルチオ系化合物(b4)とを含有し、各成分の含有量が、これらの合計を100質量%とした場合に、それぞれ、85~99.97質量%、0.01~5質量%、0.01~5質量%、及び、0.01~5質量%であることを特徴とする。
 本発明の防かび剤組成物は、更に、有機ブロム系化合物(b5)を含有することができる。
 上記成分(b1)、(b2)、(b3)、(b4)及び(b5)の化合物、含有割合等については、上記成分〔B〕における記載が適用される。
The fungicide composition of the present invention contains a benzimidazole compound (b1), an organic iodine compound (b2), a thiazole compound (b3), and a haloalkylthio compound (b4), and each component. When the total content is 100% by mass, 85 to 99.97% by mass, 0.01 to 5% by mass, 0.01 to 5% by mass, and 0.01 to 5%, respectively. It is characterized by mass%.
The antifungal agent composition of the present invention can further contain an organic bromide compound (b5).
The description in said component [B] is applied about the compound of said component (b1), (b2), (b3), (b4) and (b5), a content rate, etc.
 本発明の防かび剤組成物は、本発明の効果を損なわない範囲で更に他の抗菌剤等を含有してもよい。他の抗菌剤としては、有機系抗菌剤、無機系抗菌剤、有機・無機抗菌剤等が挙げられる。
 また、本発明の防かび剤組成物は、目的、用途等に応じて、分散剤、展着剤、香料、酸化防止剤、増量剤、賦形剤、着色剤、凍結防止剤等の添加剤を含有してもよい。
The antifungal composition of the present invention may further contain other antibacterial agents and the like as long as the effects of the present invention are not impaired. Examples of other antibacterial agents include organic antibacterial agents, inorganic antibacterial agents, and organic / inorganic antibacterial agents.
In addition, the antifungal composition of the present invention includes additives such as a dispersant, a spreading agent, a fragrance, an antioxidant, a bulking agent, an excipient, a colorant, and an antifreezing agent, depending on the purpose and application. It may contain.
 本発明の防かび剤組成物は、上記の成分(b1)、(b2)、(b3)、(b4)等を含む粉体混合物(I)であってよいし、水、有機溶剤、又は、これらの混合媒体に分散あるいは溶解されてなる組成物(II)であってもよい。
 本発明の防かび剤組成物は、上記の成分(b1)、(b2)、(b3)、(b4)等の所定量を混合することにより得ることができる。混合方法は、従来、公知の方法であってよく、乾式法及び湿式法のいずれでもよい。混合装置としては、ロッキングミル、タンブラーミキサー、ドラムミキサー、ミキシングシェーカー、ロッキングシェーカー、V型混合機、W型混合機等が挙げられる。
 本発明の防かび剤組成物が、上記粉体混合物(I)である場合、樹脂等に配合して調製されてなる成形材料;防腐剤;防汚剤等に好適である。この成形材料を用いて、成形品;薄肉体を積層してなる積層品等とすることもできる。また、本発明の防かび剤組成物が、上記組成物(II)である場合、塗料等として用い、樹脂成形品、繊維等に塗布あるいは噴霧することにより、その表面に防かび性を付与することができる。
The fungicide composition of the present invention may be a powder mixture (I) containing the above components (b1), (b2), (b3), (b4), etc., water, an organic solvent, or The composition (II) may be dispersed or dissolved in these mixed media.
The antifungal composition of the present invention can be obtained by mixing predetermined amounts of the above components (b1), (b2), (b3), (b4) and the like. The mixing method may be a conventionally known method, and may be either a dry method or a wet method. Examples of the mixing device include a rocking mill, a tumbler mixer, a drum mixer, a mixing shaker, a rocking shaker, a V-type mixer, and a W-type mixer.
When the antifungal composition of the present invention is the above powder mixture (I), it is suitable for molding materials prepared by blending with resin or the like; antiseptics; antifouling agents and the like. Using this molding material, it is also possible to make a molded product; a laminated product formed by laminating thin bodies. In addition, when the fungicide composition of the present invention is the composition (II), it is used as a paint or the like, and imparts antifungal properties to its surface by coating or spraying on a resin molded product, fiber or the like. be able to.
 本発明の防かび剤組成物は、製品を使用中、輸送中又は保管中に、菌、生物等が発生あるいは繁茂し、製品に付着、繁殖等する場所における用途に好適である。 The fungicide composition of the present invention is suitable for use in a place where fungi, organisms, etc. are generated or proliferate during use, transportation or storage of the product, and adhere to or breed on the product.
 本発明の防かび剤組成物及びそれを含む本発明の防かび性樹脂組成物並びにこの樹脂組成物を用いて得られる成形品は、真菌、細菌、木材腐朽菌、藻類、海洋生物等に対して抵抗性を有する。
 真菌としては、例えば、表5に示されたものが挙げられる。
 細菌としては、酵母、芽胞菌、放線菌、大腸菌、緑膿菌、枯草菌、黄色ブドウ球菌等が挙げられ、具体例は、Bacillus cereus、Bacillus subtillis、Clostridium botulinum、Clostridium perfringens、Escherichia coli、Enterbacter aerogenes、Lactobacillus bulgericus、Micrococcus glatamicus、Paecilomyces lilacinus、Pseudomonas aeruginosa、Pseudononas fluresceus、Proteus vulgaris、Pythium vanterpoolii、Rhizoctonia violacea、Rhizoctonia solani、Streptomyces aureofaciene、Staphylococcus aureus、Staphylococcus faecalis、Salmonella arizonae、Saccharomyces cerevisiae、Saccharomyces rouxii、Streptoverticillium reticulum、Salmonella paratyphi等である。
 木材腐朽菌としては、スギヒラタケ、カワラタケ、シュタケ、ナミダタケ、ワタグサレタケ、オオウズラタケ等が挙げられる。
 藻類としては、例えば、表7に示されたものが挙げられる。
 海洋生物としては、イガイ、イギス、ヒドロ虫、フジツボ、イソギンチャク、ムラサキガイ、海藻等が挙げられる。
The antifungal agent composition of the present invention, the antifungal resin composition of the present invention containing the same, and the molded product obtained using this resin composition are resistant to fungi, bacteria, wood decay fungi, algae, marine organisms, etc. And has resistance.
Examples of the fungus include those shown in Table 5.
Examples of the bacteria include yeast, spore bacteria, actinomycetes, Escherichia coli, Pseudomonas aeruginosa, Bacillus subtilis, Staphylococcus aureus, and specific examples include Bacillus cereus, Bacillus subtilis, Clostridium botulinum, Clostridium perfringens, Escherichia coli, , Lactobacillus bulgericus, Micrococcus glamaticus, Paecilomyces lilacinus, Pseudomonas aeruginosa, Pseudomonas flureseus, Proteus vulgaris, Proteus vulgariz a, Rhizoctonia solani, Streptomyces aureofaciene, Staphylococcus aureus, Staphylococcus faecalis, Salmonella arizonae, Saccharomyces cerevisiae, Saccharomyces rouxii, Streptoverticillium reticulum, is a Salmonella paratyphi and the like.
Examples of the wood-rotting fungi include Sugihiratake, Kawaratake, Statake, Namidatake, Watakusaretake, Ouzuratake and the like.
Examples of algae include those shown in Table 7.
Examples of marine organisms include mussels, oysters, hydroworms, barnacles, sea anemones, mussels, and seaweeds.
 以下に実施例を挙げ、本発明を更に詳細に説明するが、本発明の主旨を超えない限り、本発明はかかる実施例に限定されるものではない、尚、下記において、部及び%は、特に断らない限り、質量基準である。 The present invention will be described in more detail with reference to the following examples. However, the present invention is not limited to these examples as long as the gist of the present invention is not exceeded. In the following, parts and% are: Unless otherwise noted, it is based on mass.
1.原料成分
 樹脂組成物の製造に用いた成分を以下に示す。
1-1.成分〔A〕
 樹脂(A1)として、ABS樹脂(商品名「テクノABS 350」、テクノポリマー社製)を用いた。
 樹脂(A2)として、ABS樹脂(商品名「テクノABS 810」、テクノポリマー社製)を用いた。
 樹脂(A3)として、AES樹脂(商品名「テクノAES W210」、テクノポリマー社製)を用いた。
 樹脂(A4)として、AS樹脂(商品名「サンレックス SAN-R」、テクノポリマー社製)を用いた。
 樹脂(A5)として、ポリスチレン樹脂(商品名「PSJポリスチレン GPPS679」、PSジャパン社製)を用いた。
 樹脂(A6)として、ABS/PCアロイ(商品名「エクセロイ CK20」、テクノポリマー社製)を用いた。
 樹脂(A7)として、ポリカーボネート樹脂(商品名「ノバレックス 7022A」、三菱エンジニアリングプラスチックス社製)を用いた。
 樹脂(A8)として、ポリプロピレン樹脂(商品名「ノバテック PPBC6C」、日本ポリプロ社製)を用いた。
 樹脂(A9)として、ポリエチレン樹脂(商品名「ノバテック LDLF122」、日本ポリエチレン社製)を用いた。
 また、樹脂(A10)として、ポリブチレンテレフタレート樹脂(商品名「ノバデュラン 5010R5」、三菱エンジニアリングプラスチックス社製)を用いた。
1. Raw material components The components used in the production of the resin composition are shown below.
1-1. Ingredient [A]
ABS resin (trade name “Techno ABS 350”, manufactured by Techno Polymer Co., Ltd.) was used as the resin (A1).
As the resin (A2), an ABS resin (trade name “Techno ABS 810”, manufactured by Techno Polymer Co., Ltd.) was used.
As the resin (A3), AES resin (trade name “Techno AES W210”, manufactured by Techno Polymer Co., Ltd.) was used.
As the resin (A4), AS resin (trade name “Sunrex SAN-R”, manufactured by Techno Polymer Co., Ltd.) was used.
As the resin (A5), a polystyrene resin (trade name “PSJ polystyrene GPPS679”, manufactured by PS Japan Ltd.) was used.
As the resin (A6), ABS / PC alloy (trade name “Excelloy CK20”, manufactured by Techno Polymer Co., Ltd.) was used.
As the resin (A7), a polycarbonate resin (trade name “NOVAREX 7022A”, manufactured by Mitsubishi Engineering Plastics) was used.
As the resin (A8), a polypropylene resin (trade name “NOVATEC PPBC6C”, manufactured by Nippon Polypro Co., Ltd.) was used.
As the resin (A9), a polyethylene resin (trade name “NOVATEC LDLF122”, manufactured by Nippon Polyethylene Co., Ltd.) was used.
Further, polybutylene terephthalate resin (trade name “Novaduran 5010R5”, manufactured by Mitsubishi Engineering Plastics) was used as the resin (A10).
1-2.成分〔B〕
 ベンズイミダゾール系化合物(b1)として、下記の化合物(b11)及び(b12)を用いた。
(b11)1H-2-ベンズイミダゾールカルバミン酸メチル
Figure JPOXMLDOC01-appb-C000016
(b12)1-ブチルカルバモイル-2-ベンズイミダゾールカルバミン酸メチル
Figure JPOXMLDOC01-appb-C000017
 有機ヨード系化合物(b2)として、下記の化合物(b21)及び(b22)を用いた。
(b21)ジヨードメチル-p-トリルスルホン
Figure JPOXMLDOC01-appb-C000018
(b22)1-ジヨードメチルスルホニル-4-クロロベンゼン
 チアゾール系化合物(b3)として、下記の化合物(b31)及び(b32)を用いた。
(b31)2-(4-チアゾリル)-1H-ベンズイミダゾール
(b32)2-(n-オクチル)-4-イソチアゾリン-3-オン
1-2. Ingredient [B]
The following compounds (b11) and (b12) were used as the benzimidazole compound (b1).
(B11) Methyl 1H-2-benzimidazolecarbamate
Figure JPOXMLDOC01-appb-C000016
(B12) Methyl 1-butylcarbamoyl-2-benzimidazolecarbamate
Figure JPOXMLDOC01-appb-C000017
The following compounds (b21) and (b22) were used as the organic iodine compound (b2).
(B21) Diiodomethyl-p-tolylsulfone
Figure JPOXMLDOC01-appb-C000018
(B22) 1-Diiodomethylsulfonyl-4-chlorobenzene As the thiazole compound (b3), the following compounds (b31) and (b32) were used.
(B31) 2- (4-thiazolyl) -1H-benzimidazole (b32) 2- (n-octyl) -4-isothiazolin-3-one
 ハロアルキルチオ系化合物(b4)として、下記の化合物(b41)及び(b42)を用いた。
(b41)N,N-ジメチル-N’-フェニル-N’-(フルオロジクロロメチルチオ)スルファミド
Figure JPOXMLDOC01-appb-C000019
(b42)N-フルオロジクロロメチルチオフタルイミド
Figure JPOXMLDOC01-appb-C000020
 有機ブロム系化合物(b5)として、下記の化合物(b51)及び(b52)を用いた。
(b51)2-ブロモ-2-ニトロ-1,3-プロパンジオール
(b52)1,2-ジブロモ-2,4-ジシアノブタン
 また、他の化合物(b6)として、下記の化合物(b61)及び(b62)を用いた。
(b61)2,4,5,6-テトラクロロイソフタロニトリル
(b62)2,3,5,6-テトラクロロ-4-メチルスルホニルピリジン
The following compounds (b41) and (b42) were used as the haloalkylthio compounds (b4).
(B41) N, N-dimethyl-N′-phenyl-N ′-(fluorodichloromethylthio) sulfamide
Figure JPOXMLDOC01-appb-C000019
(B42) N-fluorodichloromethylthiophthalimide
Figure JPOXMLDOC01-appb-C000020
The following compounds (b51) and (b52) were used as the organic bromide compound (b5).
(B51) 2-Bromo-2-nitro-1,3-propanediol (b52) 1,2-dibromo-2,4-dicyanobutane Other compounds (b6) include the following compounds (b61) and ( b62) was used.
(B61) 2,4,5,6-tetrachloroisophthalonitrile (b62) 2,3,5,6-tetrachloro-4-methylsulfonylpyridine
2.防かび剤組成物の調製及びその評価
  実施例1-1~1-10及び比較例1-1~1-9
 上記の成分(b1)~(b6)を、表1及び表2に記載の割合で、V型混合機に供給し、室温で30分間混合し、防かび剤組成物B1~B19を得た。
Figure JPOXMLDOC01-appb-T000021
Figure JPOXMLDOC01-appb-T000022
2. Preparation of fungicides composition and evaluation thereof Examples 1-1 to 1-10 and Comparative Examples 1-1 to 1-9
The above components (b1) to (b6) were supplied to a V-type mixer at the ratios shown in Tables 1 and 2, and mixed at room temperature for 30 minutes to obtain antifungal compositions B1 to B19.
Figure JPOXMLDOC01-appb-T000021
Figure JPOXMLDOC01-appb-T000022
 各組成物について、以下の評価を行った。
2-1.生育阻止最小濃度
 高鳥浩介監修「かび検査マニュアルカラー図譜」(テクノシステム社発行)に記載された試験法に基づき、表3及び表4に示す、真菌(カビ)、細菌、藻類、木材腐朽菌及び海洋生物における、それぞれの培養温度、湿度及び培地を選定して生育阻止最小濃度を測定した。表中の数字の単位はppmである。また、「-」は、効果が無かったことを意味する。
Figure JPOXMLDOC01-appb-T000023
Figure JPOXMLDOC01-appb-T000024
Each composition was evaluated as follows.
2-1. Growth inhibitory minimum concentration Based on the test method described in “Koji Inspection Manual Color Chart” (published by Techno System) supervised by Kosuke Takatori, fungi, fungi, bacteria, algae, wood decay fungi and Each culture temperature, humidity, and medium in marine organisms were selected and the minimum growth inhibition concentration was measured. The unit of the numbers in the table is ppm. “-” Means that there was no effect.
Figure JPOXMLDOC01-appb-T000023
Figure JPOXMLDOC01-appb-T000024
2-2.真菌に対する抵抗性評価
 ポリブチレンテレフタレート樹脂(商品名「ノバデュラン5010R5」、三菱エンジニアリングプラスチックス社製)に、含有量が0.5%となるように、実施例1-1及び1-3並びに比較例1-2及び1-6の防かび剤組成物を配合させてなる各試験片と、表5に示す試験菌(真菌71菌)とを用いて、下記条件に基づくアピザス法、即ち、培地上に配設された試験片の表面に、試験菌液を噴霧した後、60日間培養させ、14日後、28日後、48日後及び60日後における菌の発育の程度を観察した。判定基準は、菌が全く発育しない場合を「1」、菌の発育が、試験片の上面の表面積10%以下であった場合を「2」、10%を超えて30%以下であった場合を「3」、30%を超えて60%以下であった場合を「4」、60%を超えた場合を「5」とした。その結果を表6に示す。
<培地>
 0.7gのKHPOと、0.7gのKHPOと、0.7gのMgSO・7HOと、1.0gのNHNOと、0.005gのNaClと、0.002gのFeSO・7HOと、0.002gのZnSO・7HOと、0.001gのMnSO・7HOと、15gの寒天とを、1,000ミリリットルの純水に投入し、121℃で20分間加熱し、溶解させた。その後、0.01規定のNaOH水溶液を添加してpH6.0~6.5に調整し、無機塩寒天培地を得た。
<試験菌液>
(1)混合胞子液
 培地から寒天を除いた水溶液を胞子に加え、1ミリリットルあたり、10±200,000個に調整し、等量混和させてなるものを用いた。
(2)湿潤液
 0.05g/リットルのラウリル酸ナトリウム水溶液を用いた。
<培養条件>
 温度・湿度サーモスタット付きサーキュレーターを用い、温度28℃~30℃、相対湿度85%以上とし、60日間培養した。
Figure JPOXMLDOC01-appb-T000025
Figure JPOXMLDOC01-appb-T000026
2-2. Evaluation of Resistance to Fungi Examples 1-1 and 1-3 and Comparative Examples were made so that the content was 0.5% in polybutylene terephthalate resin (trade name “Novaduran 5010R5”, manufactured by Mitsubishi Engineering Plastics). Using each test piece comprising the antifungal composition of 1-2 and 1-6 and the test fungus (71 fungi) shown in Table 5, the apizza method based on the following conditions, that is, on the medium After spraying the test bacterial solution on the surface of the test piece disposed in the plate, the cells were cultured for 60 days, and the degree of bacterial growth after 14 days, 28 days, 48 days and 60 days was observed. Judgment criteria are “1” when the bacteria do not grow at all, “2” when the growth of the bacteria is 10% or less on the upper surface area of the test piece, and when 30% or less exceeding 10% Was “3”, “4” when 30% and 60% or less, and “5” when 60%. The results are shown in Table 6.
<Medium>
0.7 g KH 2 PO 4 , 0.7 g K 2 HPO 4 , 0.7 g MgSO 4 .7H 2 O, 1.0 g NH 4 NO 3 , 0.005 g NaCl, 0 .002 g of FeSO 4 .7H 2 O, 0.002 g of ZnSO 4 .7H 2 O, 0.001 g of MnSO 4 .7H 2 O, and 15 g of agar are added to 1,000 ml of pure water. And heated at 121 ° C. for 20 minutes to dissolve. Thereafter, an aqueous 0.01 N NaOH solution was added to adjust the pH to 6.0 to 6.5 to obtain an inorganic salt agar medium.
<Test bacterial solution>
(1) Mixed spore solution An aqueous solution obtained by removing agar from the medium was added to the spore, and the mixture was adjusted to 10 6 ± 200,000 per milliliter and mixed in equal amounts.
(2) Wetting liquid A 0.05 g / liter sodium laurate aqueous solution was used.
<Culture conditions>
Using a circulator with a temperature / humidity thermostat, the temperature was 28 ° C. to 30 ° C., the relative humidity was 85% or more, and the cells were cultured for 60 days.
Figure JPOXMLDOC01-appb-T000025
Figure JPOXMLDOC01-appb-T000026
2-3.藻類に対する持続性評価
 上記2-2項における各試験片、及び、表5に示す試験菌(真菌71菌)を含む試験菌液と、表7に示す藻類(27種)を含む試験菌液とを用いて、藻類に対する持続性評価を行った。即ち、培地上に配設された試験片の表面に、上記2-2項における試験菌液を噴霧し、続いて、藻類(27種)を含む試験菌液を噴霧し、下記の条件下、28日間培養させ、7日後、14日後、21日後及び28日後における藻の発生の程度を観察した。判定基準は、藻の発育が全くない場合を「1」、藻の発育が試験片の上面の表面積10%以下であった場合を「2」、10%を超えて20%以下であった場合を「3」、20%を超えて30%以下であった場合を「4」、30%を超えた場合を「5」とした。その結果を表8に示す。
<培地>
 1.25gのKNOと、1.25gのMgSO・7HOと、1.25gのNaClと、0.05gのFeSO・4HOと、0.1gのCaClと、0.35gのKHPOと、15gの寒天とを、1,000ミリリットルの純水に投入し、121℃で15分間加熱し、溶解させた。その後、pH5.8に調整し、Detmer寒天培地を得た。
<培養条件>
 孵卵器内で、温度27℃±5℃、相対湿度95%±5%とし、60日間培養した。培養中、1日のうち8時間は、1,500Lux(陽光蛍光灯)の光を照射、残りの16時間は無照射とし、28日間繰り返した。
Figure JPOXMLDOC01-appb-T000027
2-3. Sustainability evaluation for algae Each test piece in the above section 2-2, a test bacterial solution containing the test bacteria (71 fungi) shown in Table 5, and a test bacterial solution containing the algae (27 species) shown in Table 7 Was used to evaluate the sustainability of algae. That is, the test bacterial solution in the above section 2-2 is sprayed on the surface of the test piece disposed on the medium, and then the test bacterial solution containing algae (27 species) is sprayed under the following conditions: The cells were cultured for 28 days, and the degree of algae generation after 7 days, 14 days, 21 days and 28 days was observed. Judgment criteria are “1” when there is no growth of algae, “2” when growth of algae is 10% or less on the surface area of the upper surface of the test piece, and when 20% or less exceeding 10% Is “3”, 20% is 30% or less and “4”, and 30% is “5”. The results are shown in Table 8.
<Medium>
1.25 g KNO 3 , 1.25 g MgSO 4 .7H 2 O, 1.25 g NaCl, 0.05 g FeSO 4 .4H 2 O, 0.1 g CaCl 2 , 0.35 g K 3 HPO 4 and 15 g of agar were added to 1,000 ml of pure water and heated at 121 ° C. for 15 minutes to be dissolved. Thereafter, the pH was adjusted to 5.8 to obtain a Detmer agar medium.
<Culture conditions>
The cells were cultured in an incubator at a temperature of 27 ° C. ± 5 ° C. and a relative humidity of 95% ± 5% for 60 days. During the cultivation, the light was irradiated with 1,500 Lux (positive fluorescent lamp) for 8 hours per day, and the remaining 16 hours were unirradiated, and repeated for 28 days.
Figure JPOXMLDOC01-appb-T000027
Figure JPOXMLDOC01-appb-T000028
Figure JPOXMLDOC01-appb-T000028
2-4.海洋生物に対する実網試験
 実施例1-3及び比較例1-7の防かび剤組成物を、含有量が1%及び4%となるように、固形分濃度80%のアクリル系塗料に添加し、撹拌することにより2種の懸濁液を調製した。その後、ナイロン6からなる漁網用の網(番線により60cm角に展開)を、上記懸濁液に浸漬、定着させ、網の表面に防かび層を形成した。次いで、この網を、海水面下6mの位置に、6ヶ月間吊し、1ヶ月ごとに海洋生物の付着の有無を観察した。また、比較例1-10として、防かび剤組成物を付着させていない網の評価も行った。判定基準は、防かび層表面に対して、海洋生物の付着が全くない場合を「-」、海洋生物の付着が、網紐の表面積10%以下であった場合を「+」、10%を超えて50%以下であった場合を「++」、50%を超えた場合を「+++」とした。その結果を表9に示す。
Figure JPOXMLDOC01-appb-T000029
2-4. Real net test for marine organisms The fungicidal compositions of Examples 1-3 and Comparative Examples 1-7 were added to an acrylic paint having a solid content of 80% so that the content was 1% and 4%. Two suspensions were prepared by stirring. Thereafter, a net for fishing net made of nylon 6 (expanded into a 60 cm square by a wire) was immersed and fixed in the suspension to form a fungicidal layer on the surface of the net. Next, this net was suspended at a position 6 m below the sea level for 6 months, and the presence of marine organisms was observed every month. In addition, as Comparative Example 1-10, evaluation was also made on a net without the antifungal agent composition attached thereto. Judgment criteria are “-” when there is no marine organism attached to the surface of the fungicide layer, “+” when the marine organism adheres to the surface area of the net string of 10% or less, and “+” 10%. The case of exceeding 50% or less was designated as “++”, and the case of exceeding 50% was designated as “++++”. The results are shown in Table 9.
Figure JPOXMLDOC01-appb-T000029
2-5.評価結果について
 比較例1-1は、成分(b1)の含有割合が本発明の範囲外で少ない例、即ち、成分(b2)~(b4)の含有割合が多い例であり、防かび性が発揮される菌類が少なかった。また、効果を発現する菌類であっても、その生育阻止最小濃度が高かった。
 比較例1-2は、成分(b1)のみからなる例であり、防かび性が発揮される菌類が少なかった。また、効果を発現する菌類であっても、その生育阻止最小濃度が高かった。そして、真菌に対する抵抗性、及び、藻類に対する効果の持続性が十分ではなかった。
 比較例1-3は、成分(b3)及び(b4)を含有しない例であり、防かび性が発揮される菌類が少なかった。また、効果を発現する菌類であっても、その生育阻止最小濃度が高かった。
 比較例1-4は、成分(b2)及び(b4)を含有しない例であり、防かび性が発揮される菌類が少なかった。また、効果を発現する菌類であっても、その生育阻止最小濃度が高かった。
 比較例1-5は、成分(b2)及び(b3)を含有しない例であり、防かび性が発揮される菌類が少なかった。また、効果を発現する菌類であっても、その生育阻止最小濃度が高かった。
 比較例1-6は、特開平8-92012号における実施例2の組成、即ち、成分(b1)の含有割合が本発明の範囲外で多く、成分(b2)~(b4)の含有割合が少ない例であり、防かび性が発揮される菌類が少なかった。また、効果を発現する菌類であっても、その生育阻止最小濃度が高かった。そして、真菌に対する抵抗性、及び、藻類に対する効果の持続性が十分ではなかった。
 比較例1-7~1-9は、いずれも、成分(b1)の含有割合が本発明の範囲外で少ない例、即ち、成分(b2)~(b4)の含有割合が多い例であり、防かび性が発揮される菌類が少なかった。また、効果を発現する菌類であっても、その生育阻止最小濃度が高かった。そして、比較例1-7では、海洋生物に対する実網試験において十分な効果が得られなかった。
 比較例1-10は、防かび剤組成物が含有されていないため、海洋生物に対する実網試験において全く効果が得られなかった。
 一方、実施例1-1~1-10は、いずれも、成分(b1)~(b4)を所定の範囲で含有する例であり、真菌、細菌(酵母、芽胞菌、放線菌を含む)、木材腐朽菌、藻類及び海洋生物の繁殖並びに木材の腐朽を防除し、更に、防かび性、防菌性、防藻性、防臭性及び防腐性に優れ、これらの効果の持続性に優れることが分かる。尚、実施例1-1~1-10の組成物0.5部と、ポリブチレンテレフタレート樹脂(商品名「ノバデュラン5010R5」、三菱エンジニアリングプラスチックス社製)99.5部とを250℃で溶融混練した後、射出成形して得られた成形品の表面外観を観察したところ、防かび剤組成物のブリードアウトは全く見られなかった。
2-5. Evaluation Results Comparative Example 1-1 is an example in which the content ratio of the component (b1) is small outside the scope of the present invention, that is, an example in which the content ratio of the components (b2) to (b4) is large and has an antifungal property. Few fungi were exhibited. In addition, even the fungi exhibiting the effect had a high growth inhibition minimum concentration.
Comparative Example 1-2 is an example consisting of only component (b1), and there were few fungi exhibiting antifungal properties. In addition, even the fungi exhibiting the effect had a high growth inhibition minimum concentration. And the resistance with respect to a fungus and the sustainability of the effect with respect to algae were not enough.
Comparative Example 1-3 is an example not containing the components (b3) and (b4), and there were few fungi exhibiting antifungal properties. In addition, even the fungi exhibiting the effect had a high growth inhibition minimum concentration.
Comparative Example 1-4 is an example not containing the components (b2) and (b4), and there were few fungi exhibiting antifungal properties. In addition, even the fungi exhibiting the effect had a high growth inhibition minimum concentration.
Comparative Example 1-5 is an example not containing the components (b2) and (b3), and there were few fungi exhibiting fungicidal properties. In addition, even the fungi exhibiting the effect had a high growth inhibition minimum concentration.
In Comparative Example 1-6, the composition of Example 2 in JP-A-8-92012, that is, the content of component (b1) is large outside the scope of the present invention, and the content of components (b2) to (b4) is high. This is a few examples, and there were few fungi exhibiting antifungal properties. In addition, even the fungi exhibiting the effect had a high growth inhibition minimum concentration. And the resistance with respect to a fungus and the sustainability of the effect with respect to algae were not enough.
Comparative Examples 1-7 to 1-9 are all examples in which the content of component (b1) is small outside the scope of the present invention, that is, the content of components (b2) to (b4) is large. There were few fungi exhibiting antifungal properties. In addition, even the fungi exhibiting the effect had a high growth inhibition minimum concentration. In Comparative Example 1-7, a sufficient effect was not obtained in the real net test for marine organisms.
Since Comparative Example 1-10 did not contain the fungicide composition, no effect was obtained in the real net test for marine organisms.
On the other hand, each of Examples 1-1 to 1-10 is an example containing components (b1) to (b4) in a predetermined range, and includes fungi, bacteria (including yeast, spore fungus, actinomycetes), Controls the growth of wood-rotting fungi, algae and marine organisms, and the decay of wood, and also has excellent antifungal, antibacterial, algal, anti-odor and antiseptic properties, and excellent sustainability of these effects. I understand. It should be noted that 0.5 parts of the compositions of Examples 1-1 to 1-10 and 99.5 parts of polybutylene terephthalate resin (trade name “Novaduran 5010R5”, manufactured by Mitsubishi Engineering Plastics) were melt-kneaded at 250 ° C. Then, when the surface appearance of the molded product obtained by injection molding was observed, no bleed-out of the fungicide composition was observed.
3.防かび性樹脂組成物の調製及び評価
  実施例2-1~2-31及び比較例2-1~2-21
 上記の成分〔A〕(A1~A10)、及び、表1又は表2で示される成分〔B〕(B1、B3、B4、B5、B12、B16、B17及びB18)を、表10~表14に記載の割合で、ヘンシェルミキサーに供給し、室温で混合した後、ナカタニ機械社製単軸押出機「NVC50」(型式名)を用いて溶融混練し、ペレット(防かび性樹脂組成物)とした。尚、溶融混練の際のシリンダー温度は、成分〔A〕が(A1)~(A6)である場合には、200℃~230℃、(A7)である場合には、230℃~260℃、(A8)及び(A9)である場合には、180℃~210℃、(A10)である場合には、230℃~260℃とした。
Figure JPOXMLDOC01-appb-T000030
Figure JPOXMLDOC01-appb-T000031
Figure JPOXMLDOC01-appb-T000032
Figure JPOXMLDOC01-appb-T000033
Figure JPOXMLDOC01-appb-T000034
3. Preparation and Evaluation of Antifungal Resin Composition Examples 2-1 to 2-31 and Comparative Examples 2-1 to 2-21
The above components [A] (A1 to A10) and the components [B] (B1, B3, B4, B5, B12, B16, B17 and B18) shown in Table 1 or Table 2 are used in Tables 10 to 14 The mixture is supplied to a Henschel mixer at the ratio described in the above, mixed at room temperature, melt-kneaded using a single-screw extruder “NVC50” (model name) manufactured by Nakatani Machinery Co., Ltd., and pellets (antifungal resin composition) did. The cylinder temperature during melt kneading is 200 ° C. to 230 ° C. when the component [A] is (A1) to (A6), and 230 ° C. to 260 ° C. when it is (A7). In the case of (A8) and (A9), it was set to 180 ° C. to 210 ° C., and in the case of (A10), it was set to 230 ° C. to 260 ° C.
Figure JPOXMLDOC01-appb-T000030
Figure JPOXMLDOC01-appb-T000031
Figure JPOXMLDOC01-appb-T000032
Figure JPOXMLDOC01-appb-T000033
Figure JPOXMLDOC01-appb-T000034
 上記で得られたペレットについて、下記評価を行った。評価用の試験片は、ペレットを十分に乾燥した後、樹脂の溶融温度が180℃~240℃となるように設定した日本製鋼所社製射出成形機「35AD」(型式名)を用いて作製した、長さ80mm、幅55mm及び厚さ2.4mmの平板状成形品を切削加工することにより得た。大きさは、長さ30mm、幅30mm及び厚さ2.4mmである。尚、比較例2-5では、上記平板状成形品の表面より、防かび剤組成物がブリードアウトし、外観不良となったため、下記評価を中止した。 The following evaluation was performed on the pellets obtained above. Test specimens for evaluation were prepared using an injection molding machine “35AD” (model name) manufactured by Nippon Steel Works, in which the pellets were sufficiently dried and the resin melting temperature was set to 180 ° C. to 240 ° C. It was obtained by cutting a flat molded product having a length of 80 mm, a width of 55 mm, and a thickness of 2.4 mm. The size is 30 mm in length, 30 mm in width, and 2.4 mm in thickness. In Comparative Example 2-5, the following evaluation was stopped because the antifungal agent composition bleeded out from the surface of the flat plate-shaped molded article, resulting in poor appearance.
3-1.真菌に対する抵抗性評価
 上記防かび性樹脂組成物からなる各試験片と、表5に示す試験菌(真菌71菌)とを用いて、下記条件に基づくアピザス法、即ち、培地上に配設された試験片の表面に、試験菌液を噴霧した後、60日間培養させ、14日後、28日後、48日後及び60日後における菌の発育の程度を観察した。判定基準は、菌が全く発育しない場合を「1」、菌の発育が、試験片の上面の表面積10%以下であった場合を「2」、10%を超えて30%以下であった場合を「3」、30%を超えて60%以下であった場合を「4」、60%を超えた場合を「5」とした。その結果を表15及び表16に示す。
<培地>
 0.7gのKHPOと、0.7gのKHPOと、0.7gのMgSO・7HOと、1.0gのNHNOと、0.005gのNaClと、0.002gのFeSO・7HOと、0.002gのZnSO・7HOと、0.001gのMnSO・7HOと、15gの寒天とを、1,000ミリリットルの純水に投入し、121℃で20分間加熱し、溶解させた。その後、0.01規定のNaOH水溶液を添加してpH6.0~6.5に調整し、無機塩寒天培地を得た。
<試験菌液>
(1)混合胞子液
 培地から寒天を除いた水溶液を胞子に加え、1ミリリットルあたり、10±200,000個に調整し、等量混和させてなるものを用いた。
(2)湿潤液
 0.05g/リットルのラウリル酸ナトリウム水溶液を用いた。
<培養条件>
 温度・湿度サーモスタット付きサーキュレーターを用い、温度28℃~30℃、相対湿度85%以上とし、60日間培養した。
Figure JPOXMLDOC01-appb-T000035
Figure JPOXMLDOC01-appb-T000036
3-1. Evaluation of resistance to fungi Using each test piece made of the above-mentioned fungicidal resin composition and the test bacteria (71 fungi) shown in Table 5, the apizza method based on the following conditions, that is, disposed on the medium: The surface of the test piece was sprayed with the test bacterial solution and cultured for 60 days, and the degree of bacterial growth after 14 days, 28 days, 48 days and 60 days was observed. Judgment criteria are “1” when the bacteria do not grow at all, “2” when the growth of the bacteria is 10% or less on the upper surface area of the test piece, and when 30% or less exceeding 10% Was “3”, “4” when 30% and 60% or less, and “5” when 60%. The results are shown in Table 15 and Table 16.
<Medium>
0.7 g KH 2 PO 4 , 0.7 g K 2 HPO 4 , 0.7 g MgSO 4 .7H 2 O, 1.0 g NH 4 NO 3 , 0.005 g NaCl, 0 .002 g of FeSO 4 .7H 2 O, 0.002 g of ZnSO 4 .7H 2 O, 0.001 g of MnSO 4 .7H 2 O, and 15 g of agar are added to 1,000 ml of pure water. And heated at 121 ° C. for 20 minutes to dissolve. Thereafter, an aqueous 0.01 N NaOH solution was added to adjust the pH to 6.0 to 6.5 to obtain an inorganic salt agar medium.
<Test bacterial solution>
(1) Mixed spore solution An aqueous solution obtained by removing agar from the medium was added to the spore, and the mixture was adjusted to 10 6 ± 200,000 per milliliter and mixed in equal amounts.
(2) Wetting liquid A 0.05 g / liter sodium laurate aqueous solution was used.
<Culture conditions>
Using a circulator with a temperature / humidity thermostat, the temperature was 28 ° C. to 30 ° C., the relative humidity was 85% or more, and the cells were cultured for 60 days.
Figure JPOXMLDOC01-appb-T000035
Figure JPOXMLDOC01-appb-T000036
3-2.藻類に対する持続性評価
 上記3-1項における各試験片、及び、表5に示す試験菌(真菌71菌)を含む試験菌液と、表7に示す藻類(27種)を含む試験菌液とを用いて、藻類に対する持続性評価を行った。即ち、培地上に配設された試験片の表面に、上記3-1項における試験菌液を噴霧し、続いて、藻類(27種)を含む試験菌液を噴霧し、下記の条件下、28日間培養させ、7日後、14日後、21日後及び28日後における藻の発生の程度を観察した。判定基準は、藻の発育が全くない場合を「1」、藻の発育が試験片の上面の表面積10%以下であった場合を「2」、10%を超えて20%以下であった場合を「3」、20%を超えて30%以下であった場合を「4」、30%を超えた場合を「5」とした。その結果を表17に示す。
<培地>
 1.25gのKNOと、1.25gのMgSO・7HOと、1.25gのNaClと、0.05gのFeSO・4HOと、0.1gのCaClと、0.35gのKHPOと、15gの寒天とを、1,000ミリリットルの純水に投入し、121℃で15分間加熱し、溶解させた。その後、pH5.8に調整し、Detmer寒天培地を得た。
<培養条件>
 孵卵器内で、温度27℃±5℃、相対湿度95%±5%とし、60日間培養した。培養中、1日のうち8時間は、1,500Lux(陽光蛍光灯)の光を照射、残りの16時間は無照射とし、28日間繰り返した。
Figure JPOXMLDOC01-appb-T000037
3-2. Sustainability evaluation for algae Each test piece in the above section 3-1, and a test bacterial solution containing the test bacteria (71 fungi) shown in Table 5, and a test bacterial solution containing the algae (27 species) shown in Table 7 Was used to evaluate the sustainability of algae. That is, the test bacterial solution in the above section 3-1 is sprayed on the surface of the test piece disposed on the medium, and then the test bacterial solution containing algae (27 species) is sprayed under the following conditions: The cells were cultured for 28 days, and the degree of algae generation after 7 days, 14 days, 21 days and 28 days was observed. Judgment criteria are “1” when there is no growth of algae, “2” when growth of algae is 10% or less on the surface area of the upper surface of the test piece, and when 20% or less exceeding 10% Is “3”, 20% is 30% or less and “4”, and 30% is “5”. The results are shown in Table 17.
<Medium>
1.25 g KNO 3 , 1.25 g MgSO 4 .7H 2 O, 1.25 g NaCl, 0.05 g FeSO 4 .4H 2 O, 0.1 g CaCl 2 , 0.35 g K 3 HPO 4 and 15 g of agar were added to 1,000 ml of pure water and heated at 121 ° C. for 15 minutes to be dissolved. Thereafter, the pH was adjusted to 5.8 to obtain a Detmer agar medium.
<Culture conditions>
The cells were cultured in an incubator at a temperature of 27 ° C. ± 5 ° C. and a relative humidity of 95% ± 5% for 60 days. During the cultivation, the light was irradiated with 1,500 Lux (positive fluorescent lamp) for 8 hours per day, and the remaining 16 hours were unirradiated, and repeated for 28 days.
Figure JPOXMLDOC01-appb-T000037
3-3.海洋生物に対する実網試験
  実施例2-32及び2-33並びに比較例2-22~2-24
 防かび剤組成物B3及びB17を、含有量が1%及び4%となるように、固形分濃度80%のアクリル系樹脂を含む塗料に添加し、撹拌することにより、各々、2種の懸濁液を調製した。その後、ナイロン6からなる漁網用の網(番線により60cm角に展開)を、上記懸濁液に浸漬、定着させ、網の表面に防かび層を形成した。次いで、この網を、海水面下6mの位置に、6ヶ月間吊し、1ヶ月ごとに海洋生物の付着の有無を観察した。また、比較例2-24として、防かび剤組成物〔B〕を配合していないアクリル系塗料を用いた実網試験を行った。判定基準は、防かび層表面に対して、海洋生物の付着が全くない場合を「-」、海洋生物の付着が、網紐の表面積10%以下であった場合を「+」、10%を超えて50%以下であった場合を「++」、50%を超えた場合を「+++」とした。その結果を表18に示す。
Figure JPOXMLDOC01-appb-T000038
3-3. Real net test on marine organisms Examples 2-32 and 2-33 and Comparative Examples 2-22 to 2-24
The fungicidal compositions B3 and B17 were added to a paint containing an acrylic resin having a solid content of 80% so that the content would be 1% and 4%, respectively, and stirred to obtain two types of suspensions. A suspension was prepared. Thereafter, a net for fishing net made of nylon 6 (expanded into a 60 cm square by a wire) was immersed and fixed in the suspension to form a fungicidal layer on the surface of the net. Next, this net was suspended at a position 6 m below the sea level for 6 months, and the presence of marine organisms was observed every month. Further, as Comparative Example 2-24, an actual net test was conducted using an acrylic paint not containing the antifungal agent composition [B]. Judgment criteria are “-” when there is no marine organism attached to the surface of the fungicide layer, “+” when the marine organism adheres to the surface area of the net string of 10% or less, and “+” 10%. The case of exceeding 50% or less was designated as “++”, and the case of exceeding 50% was designated as “++++”. The results are shown in Table 18.
Figure JPOXMLDOC01-appb-T000038
3-4.評価結果について
 比較例2-1、2-6、2-14及び2-18は、成分〔B〕を含有しない例であり、真菌に対する抵抗性が劣っていた(表15及び表16参照)。
 比較例2-2及び2-7は、成分(b1)のみからなる防かび剤組成物B12を含有する例であり、真菌に対する抵抗性、及び、藻類に対する効果の持続性が十分ではなかった(表15及び表17参照)。
 比較例2-3、2-8、2-10、2-15、2-17及び2-19は、特開平8-92012号における実施例2の組成、即ち、成分(b1)の含有割合が本発明の範囲外で多く、成分(b2)、(b3)及び(b4)の含有割合が少ない防かび剤組成物B16を用いた例であり、前述のように、防かび性が発揮される菌類が少ない(表4参照)。また、これらの比較例において、真菌に対する抵抗性、及び、藻類に対する効果の持続性が十分ではなかった(表10、表11、表12、表13、表14、表15、表16及び表17参照)。
 比較例2-4、2-9、2-11、2-12、2-20及び2-21は、成分(b1)の含有割合が本発明の範囲外で少ない防かび剤組成物B17を用いた例であり、真菌に対する抵抗性、及び、藻類に対する効果の持続性が十分ではなかった(表10、表11、表12、表14、表15、表16及び表17参照)。
 比較例2-13及び2-16は、成分(b1)の含有割合が本発明の範囲外で少ない防かび剤組成物B18を用いた例であり、真菌に対する抵抗性、及び、藻類に対する効果の持続性が十分ではなかった(表12、表13、表16及び表17参照)。
 また、海洋生物に対する実網試験において、比較例2-22及び2-23は、成分(b1)の含有割合が本発明の範囲外で少ない防かび剤組成物B17を含む塗料を用いた例であり、海洋生物の忌避性が十分ではなかった。比較例2-24は、成分〔B〕を含有しない例であり、海洋生物の忌避性が十分ではなかった(表18参照)。
 一方、実施例2-1~2-33は、成分(b1)~(b4)、又は、成分(b1)~(b5)を所定の割合で含有する成分〔B〕を用いた例であり、真菌、細菌(酵母、芽胞菌、放線菌を含む)、木材腐朽菌、藻類及び海洋生物の繁殖並びに木材の腐朽を防除し、更に、防かび性、防菌性、防藻性、防臭性及び防腐性に優れ、これらの効果の持続性に優れることが分かる。尚、実施例2-1~2-31の組成物を射出成形して得られた成形品の表面外観を観察したところ、防かび剤組成物のブリードアウトは全く見られなかった。
3-4. Evaluation Results Comparative Examples 2-1, 2-6, 2-14 and 2-18 are examples containing no component [B], and the resistance to fungi was poor (see Tables 15 and 16).
Comparative Examples 2-2 and 2-7 are examples containing the fungicide composition B12 consisting only of the component (b1), and the resistance to fungi and the sustainability of the effect on algae were not sufficient ( Table 15 and Table 17).
In Comparative Examples 2-3, 2-8, 2-10, 2-15, 2-17 and 2-19, the composition of Example 2 in JP-A-8-92012, that is, the content of component (b1) is This is an example using the fungicide composition B16 which is outside the scope of the present invention and has a low content of components (b2), (b3) and (b4), and exhibits antifungal properties as described above. There are few fungi (see Table 4). Moreover, in these comparative examples, resistance to fungi and persistence of the effect on algae were not sufficient (Table 10, Table 11, Table 12, Table 13, Table 14, Table 15, Table 16, and Table 17). reference).
Comparative Examples 2-4, 2-9, 2-11, 2-12, 2-20 and 2-21 use the antifungal agent composition B17 in which the content of component (b1) is small outside the scope of the present invention. The resistance to fungi and the persistence of the effect on algae were not sufficient (see Table 10, Table 11, Table 12, Table 14, Table 15, Table 16, and Table 17).
Comparative Examples 2-13 and 2-16 are examples using the fungicide composition B18 in which the content of the component (b1) is small outside the scope of the present invention, and the resistance to fungi and the effect on algae are Persistence was not sufficient (see Table 12, Table 13, Table 16, and Table 17).
Further, in the real net test for marine organisms, Comparative Examples 2-22 and 2-23 are examples using a paint containing the antifungal agent composition B17 in which the content ratio of the component (b1) is small outside the scope of the present invention. Yes, marine life repellent was not enough. Comparative Example 2-24 was an example containing no component [B], and the repellent properties of marine organisms were not sufficient (see Table 18).
On the other hand, Examples 2-1 to 2-33 are examples using the components (b1) to (b4) or the component [B] containing the components (b1) to (b5) in a predetermined ratio. Controls fungi, bacteria (including yeast, spore fungus, actinomycetes), wood decay fungi, algae and marine life, and wood decay, and also has fungicidal, fungicidal, antialgal, deodorant and It turns out that it is excellent in antisepticity and is excellent in the sustainability of these effects. When the surface appearance of the molded products obtained by injection molding of the compositions of Examples 2-1 to 2-31 was observed, no bleed-out of the fungicide composition was observed.
 本発明の成形品、又は、本発明の防かび性樹脂組成物により形成された皮膜等を有する物品は、これらの製品を使用中、輸送中又は保管中に、菌、生物等が発生あるいは繁茂し、製品に付着、繁殖等する場所における用途に好適である。
 具体的な分野としては、弱電関係製品、生活用品、スポーツ・レジャー用品、建築土木資材、農林業用資材、漁業用資材、産業用資材、公共機関用資材、交通関係資材、繊維製品等が挙げられる。
 弱電関係製品としては、冷蔵庫、洗濯機、掃除機、扇風機、乾燥機、空調機、電話機、電気ポット、炊飯器、食器洗浄機、食器乾燥機、電子レンジ、ミキサー、VTR、テレビ、時計、ステレオ、テープレコーダー,OA機器等が挙げられ、筐体、取っ手、トレイ等とすることができる。
 生活用品としては、浴室用品、台所用品(三角コーナー、まな板、ボール、ざる等)、洗濯物干し用品、掃除用品(ブラシ等)、敷物、インテリア用品、文具(万年筆、シャープペンシル、ボールペン等)、カーテン、タオル、寝具、ベッド、雨具、ゴミ籠、花器、園芸用具、植木鉢、クッション、幟、旗等が挙げられる。
 スポーツ・レジャー用品としては、スポーツ用具、スポーツ衣料、プロテクター、手袋、靴材、鞄材、グリップテーピング材、プール用品、公園用品、海浜用具、遮光材、テント、ロープ、ボートヨット用品等が挙げられる。
 建築土木資材としては、テント類、養生シート、養生メッシュ、汚濁防止膜材、帆布、ルーフィング材、人工芝、建物内装材、同内装材補強繊維、塗料補強繊維、壁土補強繊維等が挙げられる。
 農林業用資材としては、水槽、桶、農業ホース、農業用フィルム、温室器材、寒冷紗、水耕栽培用資材、防虫ネット等が挙げられる。
 漁業用資材としては、漁網、養殖用器材、係留ロープ、防舷材、シーアンカー、浮体等が挙げられる。
 産業用資材としては、水道管、ホース、コンベアベルト、陸上ネット、陸上ロープ、フィルター、フェルト、各種容器、梱包材、排水取水側溝材、水処理材、食品加工場用資材や、制御装置、家電、コンピュータ等のボタン類、操作器具、光学機器、各種医療器具、水の蒸発材等が挙げられる。
 公共機関用資材及び交通関係資材としては、自動車内外装材、ドアの取っ手、吊り革、自動販売機操作ボタン、エスカレーターの持ち手、案内ロープ、道路標識、広告掲示用品材、病院や療養所用のインテリア用品材、内装材等が挙げられる。
 繊維製品としては、繊維製品には織編み物、不機布、スパンボンド、フェルト、合成紙の中間製品や、更に加工された衣服(外衣、作業服、下着、靴下、帽子等)、衣料用編み物、産業用縫製品、紐、テープ、ロープ、リボン等が挙げられる。
 また、加工された製品は、本発明の効果を、近傍の物品に与える目的でも使用される。例えば、細菌やかびの侵入を阻止する目的で製品を配置したり、飛来菌の侵入を少なくする目的でメッシュ製品を配置したりすることができる。
The molded article of the present invention, or an article having a film or the like formed of the antifungal resin composition of the present invention generates or proliferates bacteria, organisms, etc. during use, transportation or storage of these products. However, it is suitable for use in a place where it adheres to or breeds a product.
Specific fields include weak electricity-related products, daily necessities, sports / leisure products, building and civil engineering materials, agricultural and forestry materials, fishery materials, industrial materials, materials for public institutions, transportation-related materials, textile products, etc. It is done.
Weak electricity-related products include refrigerators, washing machines, vacuum cleaners, fans, dryers, air conditioners, telephones, electric kettles, rice cookers, dishwashers, dish dryers, microwave ovens, mixers, VTRs, TVs, watches, stereos , Tape recorders, OA devices, etc., and can be a housing, a handle, a tray, or the like.
Living items include bathroom items, kitchen items (triangular corners, chopping boards, balls, lanterns, etc.), laundry items, cleaning items (brushes, etc.), rugs, interior items, stationery items (fountain pens, mechanical pencils, ballpoint pens, etc.), curtains , Towels, bedding, beds, rain gear, garbage baskets, flower vases, gardening tools, flower pots, cushions, bags, flags, etc.
Examples of sports / leisure goods include sports equipment, sports clothing, protectors, gloves, shoe materials, saddle materials, grip taping materials, pool equipment, park equipment, beach equipment, shading materials, tents, ropes, boat yacht equipment, etc. .
Examples of building civil engineering materials include tents, curing sheets, curing meshes, antifouling membrane materials, canvases, roofing materials, artificial turf, building interior materials, interior material reinforcing fibers, paint reinforcing fibers, and wall soil reinforcing fibers.
Agricultural and forestry materials include water tanks, cocoons, agricultural hoses, agricultural films, greenhouse equipment, cold cocoons, hydroponics materials, insect nets, and the like.
Examples of fishery materials include fishing nets, aquaculture equipment, mooring ropes, fenders, sea anchors, and floating bodies.
Industrial materials include water pipes, hoses, conveyor belts, land nets, land ropes, filters, felts, various containers, packaging materials, drainage side gutters, water treatment materials, food processing plant materials, control devices, and home appliances. And buttons such as computers, operation instruments, optical instruments, various medical instruments, water evaporation materials, and the like.
As materials for public institutions and traffic-related materials, interior and exterior materials for automobiles, door handles, hanging leather, buttons for operating vending machines, escalator handles, guide ropes, road signs, materials for advertisement signs, interiors for hospitals and nursing homes Goods materials, interior materials and the like.
As textile products, textile products include woven knitted fabrics, fabrics, spunbonds, felts, synthetic paper intermediate products, and further processed clothing (outer clothes, work clothes, underwear, socks, hats, etc.) and knitted clothing. , Industrial sewing products, strings, tapes, ropes, ribbons and the like.
The processed product is also used for the purpose of giving the effect of the present invention to nearby articles. For example, a product can be arranged for the purpose of preventing the invasion of bacteria and fungi, or a mesh product can be arranged for the purpose of reducing the invasion of flying bacteria.
 本発明の防かび剤組成物もまた、製品を使用中、輸送中又は保管中に、菌、生物等が発生あるいは繁茂し、製品に付着、繁殖等する場所における用途に好適である。例えば、紙・パルプ工業、化学工業、ハイテク産業、畜産業、水産業、農業、林業等の分野で使用することができ、具体的には、繊維、木材・建築資材、皮革、接着剤、金属加工油剤、ゴム・プラスチック・フィルム、冷却水、電気機器、光学機器、空調機、船舶等の船底、漁網等の漁具、医薬品、農薬、水、化粧品・トイレタリー用品、サニタリー用品、家庭用品、スポーツ用品、レジャー用品、学用品、玩具や、食品保存、病院、老人ホーム等に配設された設備等が挙げられる。 The fungicide composition of the present invention is also suitable for use in a place where bacteria, organisms, etc. are generated or proliferate during use, transportation or storage of the product, and adhere to or propagate the product. For example, it can be used in the fields of paper / pulp industry, chemical industry, high-tech industry, livestock industry, fishery industry, agriculture, forestry, etc., specifically, fiber, wood / building materials, leather, adhesive, metal Processing oil, rubber, plastic film, cooling water, electrical equipment, optical equipment, air conditioner, ship bottom, fishing nets, fishing supplies, pharmaceuticals, agricultural chemicals, water, cosmetics / toiletries, sanitary goods, household goods, sports equipment , Leisure equipment, school supplies, toys, food storage, hospitals, facilities installed in nursing homes, and the like.

Claims (9)

  1.  〔A〕樹脂と、
     〔B〕下記化合物(b1)、(b2)、(b3)及び(b4)の合計を100質量%とした場合に、(b1)ベンズイミダゾール系化合物85~99.97質量%、(b2)有機ヨード系化合物0.01~5質量%、(b3)チアゾール系化合物0.01~5質量%及び(b4)ハロアルキルチオ系化合物0.01~5質量%を含む防かび剤組成物と、
    を含有し、上記防かび剤組成物〔B〕の含有量が、上記樹脂〔A〕100質量部に対して、0.01~10質量部であることを特徴とする防かび性樹脂組成物。
    [A] resin;
    [B] When the total of the following compounds (b1), (b2), (b3) and (b4) is 100% by mass, (b1) benzimidazole compound 85 to 99.97% by mass, (b2) organic An antifungal composition comprising 0.01 to 5% by mass of an iodo compound, 0.01 to 5% by mass of (b3) thiazole compound and 0.01 to 5% by mass of (b4) a haloalkylthio compound;
    And the antifungal agent composition [B] is 0.01 to 10 parts by mass with respect to 100 parts by mass of the resin [A]. .
  2.  上記ベンズイミダゾール系化合物(b1)がベンズイミダゾールカルバミン酸誘導体である請求項1に記載の防かび性樹脂組成物。 The antifungal resin composition according to claim 1, wherein the benzimidazole compound (b1) is a benzimidazole carbamic acid derivative.
  3.  上記ベンズイミダゾールカルバミン酸誘導体が、1H-2-ベンズイミダゾールカルバミン酸メチル及び1-ブチルカルバモイル-2-ベンズイミダゾールカルバミン酸メチルから選ばれる少なくとも1種である請求項2に記載の防かび性樹脂組成物。 The fungicidal resin composition according to claim 2, wherein the benzimidazole carbamate derivative is at least one selected from methyl 1H-2-benzimidazole carbamate and methyl 1-butylcarbamoyl-2-benzimidazole carbamate. .
  4.  上記有機ヨード系化合物(b2)がヨードスルホニルベンゼン誘導体であり、上記チアゾール系化合物(b3)がチアゾール基を有するベンズイミダゾール誘導体であり、上記ハロアルキルチオ系化合物(b4)がハロアルキルチオスルファミド誘導体である請求項1に記載の防かび性樹脂組成物。 The organic iodo compound (b2) is an iodosulfonylbenzene derivative, the thiazole compound (b3) is a benzimidazole derivative having a thiazole group, and the haloalkylthio compound (b4) is a haloalkylthiosulfamide derivative. The antifungal resin composition according to claim 1.
  5.  上記防かび剤組成物〔B〕が、更に、有機ブロム系化合物(b5)を含有し、該有機ブロム系化合物(b5)の含有量は、上記化合物(b1)、(b2)、(b3)及び(b4)の合計を100質量部とした場合に、0.01~3質量部である請求項1に記載の防かび性樹脂組成物。 The antifungal composition [B] further contains an organic bromide compound (b5), and the content of the organic bromide compound (b5) is determined based on the compounds (b1), (b2), and (b3). And the antifungal resin composition according to claim 1, which is 0.01 to 3 parts by mass when the total of (b4) is 100 parts by mass.
  6.  上記有機ブロム系化合物が、2-ブロモ-2-ニトロ-1,3-プロパンジオール及び1,2-ジブロモ-2,4-ジシアノブタンから選ばれる少なくとも1種である請求項5に記載の防かび性樹脂組成物。 6. The fungicides according to claim 5, wherein the organic bromide compound is at least one selected from 2-bromo-2-nitro-1,3-propanediol and 1,2-dibromo-2,4-dicyanobutane. Resin composition.
  7.  請求項1に記載の防かび性樹脂組成物を含むことを特徴とする成形品。 A molded product comprising the antifungal resin composition according to claim 1.
  8.  ベンズイミダゾール系化合物(b1)と、有機ヨード系化合物(b2)と、チアゾール系化合物(b3)と、ハロアルキルチオ系化合物(b4)とを含有し、各成分の含有量が、これらの合計を100質量%とした場合に、それぞれ、85~99.97質量%、0.01~5質量%、0.01~5質量%、及び、0.01~5質量%であることを特徴とする防かび剤組成物。 It contains a benzimidazole compound (b1), an organic iodo compound (b2), a thiazole compound (b3), and a haloalkylthio compound (b4), and the content of each component is 100 in total. When the mass percentage is 85% to 99.97% by mass, 0.01% to 5% by mass, 0.01% to 5% by mass, and 0.01% to 5% by mass, respectively, Fungi composition.
  9.  更に、有機ブロム系化合物(b5)を含有し、該有機ブロム系化合物(b5)の含有量は、上記ベンズイミダゾール系化合物(b1)、上記有機ヨード系化合物(b2)、上記チアゾール系化合物(b3)及び上記ハロアルキルチオ系化合物(b4)の合計を100質量部とした場合に、0.01~3質量部である請求項8に記載の防かび剤組成物。 Furthermore, it contains an organic bromide compound (b5), and the content of the organic bromide compound (b5) is such that the benzimidazole compound (b1), the organic iodine compound (b2), and the thiazole compound (b3). ) And the haloalkylthio-based compound (b4) are 0.01 to 3 parts by mass, based on 100 parts by mass.
PCT/JP2009/057799 2008-04-25 2009-04-17 Fungicide composition and fungicidal resin composition including the same WO2009131078A1 (en)

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JPH0892012A (en) * 1994-09-26 1996-04-09 Senkawa:Kk Antimicrobial composition
JPH09157112A (en) * 1995-12-06 1997-06-17 Toyobo Co Ltd Resin fiber composite sheet having resistance to organism
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JPH0892012A (en) * 1994-09-26 1996-04-09 Senkawa:Kk Antimicrobial composition
JPH09157112A (en) * 1995-12-06 1997-06-17 Toyobo Co Ltd Resin fiber composite sheet having resistance to organism
JPH09157111A (en) * 1995-12-06 1997-06-17 Toyobo Co Ltd Molded article having resistance to organisms, its production and finished product using the same
JP2006335707A (en) * 2005-06-03 2006-12-14 Shinto Fine Co Ltd Moldproof and algaproof composition

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111109297A (en) * 2019-12-31 2020-05-08 上海海洋大学 Application of shell powder of mytilus coruscus in bacteriostasis of marine bacteria

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