WO2009127253A1 - A waveguide filter arrangement - Google Patents
A waveguide filter arrangement Download PDFInfo
- Publication number
- WO2009127253A1 WO2009127253A1 PCT/EP2008/054591 EP2008054591W WO2009127253A1 WO 2009127253 A1 WO2009127253 A1 WO 2009127253A1 EP 2008054591 W EP2008054591 W EP 2008054591W WO 2009127253 A1 WO2009127253 A1 WO 2009127253A1
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- WO
- WIPO (PCT)
- Prior art keywords
- mountable
- wave
- waveguide
- guide part
- main side
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/207—Hollow waveguide filters
Definitions
- the present invention relates to a surface-mountable waveguide filter arrangement comprising a first surface-mountable wave-guide part, a second surface-mountable wave-guide part and a dielectric carrier material, the dielectric carrier material comprising a first main side and a second main side, each main side having a respective metalization pattern.
- the first surface-mountable wave-guide part comprises a first wall, a second wall a third wall and an open side, which second and third walls are arranged to contact at least a part of the corresponding metalization pattern on the first main side when the first surface-mountable wave-guide part is mounted, all the walls together essentially forming a U-shape.
- the second surface- mountable wave-guide part comprises a first wall, a second wall a third wall and an open side, which second and third walls are arranged to contact at least a part of the corresponding metalization pattern on the second main side when the second surface-mountable wave-guide part is mounted, all the walls together essentially forming a U-shape.
- a transmission line is normally formed on a dielectric carrier material. Due to losses in the dielectric carrier material, it is sometimes not possible to use any transmission lines.
- the diplexer may have to be realized in waveguide technology. Waveguides are normally filled with air or other low-loss materials.
- Waveguide components such as diplexers, used today are large mechanical components screwed into a mechanical cabinet and connected to different parts such as for example an antenna via some type of wave-guide flange. It is desirable to mount waveguide components on a dielectric carrier material, such that it forms a surface-mounted waveguide structure.
- Such a surface-mounted waveguide is normally made having three walls and one open side. Metal ization is then provided on the side of the dielectric carrier material facing the waveguide, where the metalization serves as the remaining wall of the waveguide, thus closing the waveguide structure when the waveguide is fitted to the dielectric carrier material.
- a surface-mountable waveguide is disclosed in the paper "Surface-mountable metalized plastic waveguide filter suitable for high volume production" by Thomas J M ⁇ ller, Wilfried Grabherr, and Bernd Adelseck, 33 rd European Microwave Conference, Kunststoff 2003.
- a surface-mountable waveguide is arranged to be mounted on a so-called footprint on a circuit board.
- a microstrip conductor to waveguide transition is disclosed, where the end of the microstrip conductor acts as a probe for feeding the waveguide's opening.
- a surface-mounted waveguide filter P1 of a known type is shown from one of its short ends, being mounted on a printed circuit board (PCB) P2.
- the electric field (E-field) P3 is shown, running mainly perpendicular to the surface of the PCB P2.
- each filter in the diplexer structure has to be calibrated by means of screws (one screw P4 shown in Figure 1 ) which are screwed into a filter wall.
- the screws form matching elements when they protrude the filter wall, entering cavity structures of the filter in a previously known way.
- the object of the present invention is to provide a surface-mountable waveguide filter, where the disadvantages above are taken care of, i.e. a surface-mountable waveguide filter where the components do not need calibration by hand, which today normally is performed by means of screws.
- the surface-mountable waveguide parts when the surface-mountable waveguide parts are mounted, their respective open sides face each other, the dielectric carrier material being positioned between the first surface-mountable wave-guide part and the second surface-mountable wave-guide part.
- the surface-mountable waveguide parts together form a waveguide filter with separate frequency band defining means being positioned between the first surface-mountable wave-guide part and the second surface-mountable wave-guide part, the electrical field being oriented mainly parallel to the first and second main sides.
- the separate frequency band defining means is comprised in the metalization pattern formed on one of the main sides.
- the separate frequency band defining means is constituted by an electrically conducting sheet which is positioned between one of the waveguide parts and its adjacent main side.
- Using a separate frequency defining means reduces the complexity of the two waveguide components. To change frequency, only the separate frequency defining means has to be redesigned.
- the waveguide components include no frequency defining means. This makes it possible to manufacture the waveguide components in high volume independently to the frequency.
- the invention gives the opportunity to built filter structures in a modular way, this gives a huge number of combination of channel frequencies.
- the invention can be assembled in an ordinary pick and place process.
- Figure 1 is an end view of a prior art configuration
- Figure 2a shows an end view of a first embodiment example
- Figure 2b shows a perspective view of a first embodiment example
- Figure 3 shows a typical frequency band defining copper pattern
- Figure 4 shows a dielectric material prepared for a second embodiment example
- Figure 5 shows an end view of the second embodiment example
- Figure 6 shows an electrically conducting sheet as used in the second embodiment example.
- Figure 7 shows a perspective view of a magnetic feeding probe.
- a dielectric carrier material 1 is shown, having a first main side 2 and a second main side 3, originally having a metallic copper cladding on both sides.
- the copper on the first and second main sides 2, 3 is etched or milled away to such an extent that desired copper patterns are formed on the first and second main sides 2, 3.
- a first surface-mountable waveguide part 4 is mounted on a part of the copper pattern on the first main side 2, and a second surface- mountable waveguide part 5 is mounted on a part of the copper pattern on the second main side 3, together forming a composite waveguide structure 6.
- Each wave-guide part 4, 5 is made in an electrically conducting material and has three respective walls 7, 8 9; 10, 11 , 12 and one open side 13, 14, which is arranged to face the dielectric carrier material 1.
- the dielectric carrier material 1 being positioned between the surface- mountable waveguide parts 4, 5, such that the surface-mountable waveguide parts 4, 5 together form a waveguide filter, the E-field E being oriented mainly parallel to the first and second main sides 2, 3.
- a first wall 7 is arranged to be parallel to the dielectric carrier material 1 when the first surface-mountable wave-guide part 4 is mounted, and then held at a distance from said material by means of a second wall 8 and third wall 9, which second and third walls 8, 9 are arranged to contact the part of the copper pattern on the first main side 2, all the walls 7, 8, 9 together essentially forming a U-shape when regarding the first surface-mountable wave-guide part 4 from its short end.
- the second surface-mountable wave-guide part 5 has the same configuration of its walls 10, 11 , 12.
- the wave-guide parts 4, 5 are mounted in a known way, each having a longitudinally extending flange part 15, 16; 17, 18 comprised in each of the second walls 8, 11 and third walls 9, 12, the flanges 15, 16; 17, 18 being arranged to be the parts of these walls 8, 11 ; 9, 12 which contact the parts of the respective copper patterns when the wave-guide parts 4, 5 are mounted.
- the flanges 15, 16; 17, 18 are soldered, or glued by means of electrically conducting glue.
- the copper is removed from one of the main sides 2, 3, in this example the second main side 3, in a shape mainly corresponding to the open sides 13, 14 of the surface-mountable waveguide parts 4, 5, leaving the corresponding footprint (not shown) for mounting of the second waveguide part 5.
- the copper is removed in such a way that a copper pattern 19 is formed on the dielectric carrier material 1.
- the copper pattern 19 constitutes a first type of frequency band defining means for the surface-mountable wave-guide filter, where thus only the dielectric carrier material's copper cladding comprises the frequency-specific parts, and not any of the surface-mountable waveguide parts 4, 5.
- the copper pattern 19 in this case also comprises the corresponding footprint.
- a number of openings 19a, 19b, 19c, 19d, 19e, 19f, 19g, 19h constitutes an example of how such a frequency band defining copper pattern may appear.
- the dielectric carrier material 1 is not penetrated.
- the apertures are formed by openings through both the copper cladding and the dielectric carrier material 1 , for example by means of drilling or milling.
- an aperture 20 is formed through both the copper cladding and the dielectric carrier material 1 , for example by means of drilling or milling, the aperture mainly corresponding to the open sides 13, 14 of the surface-mountable waveguide parts 4, 5, leaving on the first main side 2 a footprint 21 for the first surface-mountable waveguide part 4.
- a corresponding footprint is formed for the second surface-mountable waveguide part 5.
- a number of via holes are made in the footprints 21 , connecting them.
- a thin electrically conducting sheet 22 is inserted between one of the surface- mountable waveguide parts 4, 5 and its adjacent main side 2, 3, in this example between the first surface-mountable waveguide part 5 and the first main side 2.
- the sheet 22 is thus in electrical contact with the first surface- mountable waveguide part 5 and the first main side 2.
- the electrically conducting sheet 22 constitutes a second type of frequency band defining means for the surface-mountable wave-guide filter, where thus only the electrically conducting sheet 22 comprises the frequency-specific parts, and not any of the surface-mountable waveguide parts 4, 5, the dielectric carrier material 1 or its copper cladding. This simplifies the design, since only the frequency band defining electrically conducting sheet 22, which normally is etched or laser-milled, has to be changed for obtaining different frequency characteristics.
- a high degree of freedom and versatility is acquired, since it is now possible to choose the desired components from a number of prefabricated parts and mount them in such a way that a desired filter and diplexer is obtained.
- a modular building block technique may be used, offering a large number of combinations.
- Such a modular building block technique is of course suitable for a so-called pick and place machine, which automatically assembles the desired waveguide structures.
- a magnetic probe 23 is feeding a waveguide part 24.
- the present invention is not limited to the embodiment examples according to the above, but may vary freely within the scope of the appended claims.
- the copper used may be any suitable conducting material constituting a metalization, for example silver or gold. All patterns formed in the metalization form metalization patterns.
- the metalization may be deposited onto the dielectric material by various methods, for example printing, plating, or rolling. There may also be several layers of metalization, for example an additional layer comprising solder.
- the electrically conducting sheet used as an alternative frequency band defining means, is made in any suitable conducting material, for example copper, silver or gold.
- the sheet may also be made in a non-conducting material, such as plastic, which is covered by a thin layer of metalization.
- the waveguide parts may also be made in a non-conducting material, such as plastic, which is covered by a thin layer of metalization.
- the dielectric material may comprise several layers if necessary, the layers comprising different types of circuitry. Such a layer structure may also be necessary for mechanical reasons.
- the flanges may be of any suitable form, generally forming flange parts.
- All fastenings of parts are preferably made by means of soldering or gluing with electrically conducting glue or other suitable adhesive. Mechanical retention is of course also possible, i.e. using screws or the like.
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Abstract
The present invention relates to a surface-mountable waveguide filter arrangement comprising a first surface-mountable wave-guide part (4), a second surface-mountable wave-guide part (5) and a dielectric carrier material (1), the dielectric carrier material (1) comprising a first main side (2) and a second main side (3), each main side (2, 3) having a respective metalization pattern. Each surface-mountable wave-guide part (4, 5) comprises a first wall (7, 10), a second wall (8, 11) a third wall (9, 12) and an open side (13, 14), which second and third walls (8, 9; 11, 12) are arranged to contact at least a part of the corresponding metalization pattern on the first main side (2) and second main side (3), respectively, when the surface-mountable wave-guide parts (4, 5) are mounted. When the surface- mountable waveguide parts (4, 5) are mounted, their respective open sides (13, 14) face each other, the dielectric carrier material (1) being positioned between the surface-mountable wave-guide parts (4, 5), such that they together form a waveguide filter with separate frequency band defining means (19, 22) being positioned between them.
Description
TITLE
A waveguide filter arrangement
TECHNICAL FIELD
The present invention relates to a surface-mountable waveguide filter arrangement comprising a first surface-mountable wave-guide part, a second surface-mountable wave-guide part and a dielectric carrier material, the dielectric carrier material comprising a first main side and a second main side, each main side having a respective metalization pattern. The first surface-mountable wave-guide part comprises a first wall, a second wall a third wall and an open side, which second and third walls are arranged to contact at least a part of the corresponding metalization pattern on the first main side when the first surface-mountable wave-guide part is mounted, all the walls together essentially forming a U-shape. The second surface- mountable wave-guide part comprises a first wall, a second wall a third wall and an open side, which second and third walls are arranged to contact at least a part of the corresponding metalization pattern on the second main side when the second surface-mountable wave-guide part is mounted, all the walls together essentially forming a U-shape.
BACKGROUND
When designing microwave circuits, transmission lines and waveguides are commonly used. A transmission line is normally formed on a dielectric carrier material. Due to losses in the dielectric carrier material, it is sometimes not possible to use any transmission lines. When there for example is a diplexer in the layout, the diplexer may have to be realized in waveguide technology. Waveguides are normally filled with air or other low-loss materials.
Waveguide components, such as diplexers, used today are large mechanical components screwed into a mechanical cabinet and connected to different parts such as for example an antenna via some type of wave-guide flange. It
is desirable to mount waveguide components on a dielectric carrier material, such that it forms a surface-mounted waveguide structure.
Such a surface-mounted waveguide is normally made having three walls and one open side. Metal ization is then provided on the side of the dielectric carrier material facing the waveguide, where the metalization serves as the remaining wall of the waveguide, thus closing the waveguide structure when the waveguide is fitted to the dielectric carrier material.
An example of surface-mountable waveguides is disclosed in the paper "Surface-mountable metalized plastic waveguide filter suitable for high volume production" by Thomas J Mϋller, Wilfried Grabherr, and Bernd Adelseck, 33rd European Microwave Conference, Munich 2003. Here, a surface-mountable waveguide is arranged to be mounted on a so-called footprint on a circuit board. A microstrip conductor to waveguide transition is disclosed, where the end of the microstrip conductor acts as a probe for feeding the waveguide's opening.
Surface-mounted waveguide filters are often used in diplexer structures, where a diplexer structure needs to support different frequency channels within a certain frequency band. In the prior art Figure 1 , a surface-mounted waveguide filter P1 of a known type is shown from one of its short ends, being mounted on a printed circuit board (PCB) P2. The electric field (E-field) P3 is shown, running mainly perpendicular to the surface of the PCB P2.
In order to obtain the different frequency channels required, each filter in the diplexer structure has to be calibrated by means of screws (one screw P4 shown in Figure 1 ) which are screwed into a filter wall. The screws form matching elements when they protrude the filter wall, entering cavity structures of the filter in a previously known way. By setting each screw at a certain protrusion, a calibrated filter is obtained, but finding the optimal level of protrusion is a time-consuming task which generates high costs. All screws
naturally also have to be locked in place when their correct positions are found.
There is thus an obvious disadvantage with the surface-mounted waveguide filters of today, where all different frequency channels required have to be calibrated by hand, with all problems connected with such a procedure.
SUMMARY
The object of the present invention is to provide a surface-mountable waveguide filter, where the disadvantages above are taken care of, i.e. a surface-mountable waveguide filter where the components do not need calibration by hand, which today normally is performed by means of screws.
This problem is solved by means of a waveguide arrangement as mentioned initially. Furthermore, when the surface-mountable waveguide parts are mounted, their respective open sides face each other, the dielectric carrier material being positioned between the first surface-mountable wave-guide part and the second surface-mountable wave-guide part. In this manner, the surface-mountable waveguide parts together form a waveguide filter with separate frequency band defining means being positioned between the first surface-mountable wave-guide part and the second surface-mountable wave-guide part, the electrical field being oriented mainly parallel to the first and second main sides.
According to a preferred embodiment, the separate frequency band defining means is comprised in the metalization pattern formed on one of the main sides.
According to another preferred embodiment, the separate frequency band defining means is constituted by an electrically conducting sheet which is positioned between one of the waveguide parts and its adjacent main side.
Other preferred embodiments are evident from the dependent claims.
A number of advantages are provided by the present invention. For example:
- Using a separate frequency defining means reduces the complexity of the two waveguide components. To change frequency, only the separate frequency defining means has to be redesigned.
- The waveguide components include no frequency defining means. This makes it possible to manufacture the waveguide components in high volume independently to the frequency.
- The invention gives the opportunity to built filter structures in a modular way, this gives a huge number of combination of channel frequencies.
- The invention can be assembled in an ordinary pick and place process.
BRIEF DESCRIPTION OF THE DRAWINGS
The present invention will now be described more in detail with reference to the appended drawings, where:
Figure 1 is an end view of a prior art configuration;
Figure 2a shows an end view of a first embodiment example;
Figure 2b shows a perspective view of a first embodiment example;
Figure 3 shows a typical frequency band defining copper pattern;
Figure 4 shows a dielectric material prepared for a second embodiment example;
Figure 5 shows an end view of the second embodiment example;
Figure 6 shows an electrically conducting sheet as used in the second embodiment example; and
Figure 7 shows a perspective view of a magnetic feeding probe.
DETAILED DESCRIPTION
In Figure 2a and Figure 2b, showing a respective end view and perspective view of a first embodiment example of the present invention, a dielectric carrier material 1 is shown, having a first main side 2 and a second main side 3, originally having a metallic copper cladding on both sides. The copper on the first and second main sides 2, 3 is etched or milled away to such an extent that desired copper patterns are formed on the first and second main sides 2, 3. A first surface-mountable waveguide part 4 is mounted on a part of the copper pattern on the first main side 2, and a second surface- mountable waveguide part 5 is mounted on a part of the copper pattern on the second main side 3, together forming a composite waveguide structure 6. These copper patterns will be discussed more in detail later in the description.
Each wave-guide part 4, 5 is made in an electrically conducting material and has three respective walls 7, 8 9; 10, 11 , 12 and one open side 13, 14, which is arranged to face the dielectric carrier material 1.
According to the present invention, the surface-mountable waveguide parts
4, 5 are mounted such that their respective open sides 13, 14 face each other, the dielectric carrier material 1 being positioned between the surface- mountable waveguide parts 4, 5, such that the surface-mountable waveguide
parts 4, 5 together form a waveguide filter, the E-field E being oriented mainly parallel to the first and second main sides 2, 3.
Regarding the first surface-mountable wave-guide part 4, also with reference to Figure 2a and 2b, a first wall 7 is arranged to be parallel to the dielectric carrier material 1 when the first surface-mountable wave-guide part 4 is mounted, and then held at a distance from said material by means of a second wall 8 and third wall 9, which second and third walls 8, 9 are arranged to contact the part of the copper pattern on the first main side 2, all the walls 7, 8, 9 together essentially forming a U-shape when regarding the first surface-mountable wave-guide part 4 from its short end. The second surface-mountable wave-guide part 5 has the same configuration of its walls 10, 11 , 12.
The wave-guide parts 4, 5 are mounted in a known way, each having a longitudinally extending flange part 15, 16; 17, 18 comprised in each of the second walls 8, 11 and third walls 9, 12, the flanges 15, 16; 17, 18 being arranged to be the parts of these walls 8, 11 ; 9, 12 which contact the parts of the respective copper patterns when the wave-guide parts 4, 5 are mounted. The flanges 15, 16; 17, 18 are soldered, or glued by means of electrically conducting glue. The parts of the respective copper patterns which the flanges 15, 16; 17, 18 are mounted to constitute so-called footprints, which preferably comprise via holes, enabling electric contact between the adjacent waveguide parts 4, 5 through the dielectric carrier material 1.
With reference also to Figure 3, showing only the dielectric carrier material 1 , in order to obtain filter functionality, the copper is removed from one of the main sides 2, 3, in this example the second main side 3, in a shape mainly corresponding to the open sides 13, 14 of the surface-mountable waveguide parts 4, 5, leaving the corresponding footprint (not shown) for mounting of the second waveguide part 5. On the other main side, in this example the first main side 2, the copper is removed in such a way that a copper pattern 19 is formed on the dielectric carrier material 1.
The copper pattern 19 constitutes a first type of frequency band defining means for the surface-mountable wave-guide filter, where thus only the dielectric carrier material's copper cladding comprises the frequency-specific parts, and not any of the surface-mountable waveguide parts 4, 5. The copper pattern 19 in this case also comprises the corresponding footprint.
This simplifies the design, since only the frequency band defining copper pattern, which normally is etched, has to be changed for obtaining different frequency characteristics.
The frequency band defining copper pattern 19 shown in Figure 3, where a number of openings 19a, 19b, 19c, 19d, 19e, 19f, 19g, 19h are formed in the copper cladding, constitutes an example of how such a frequency band defining copper pattern may appear. Here, only the copper is removed, the dielectric carrier material 1 is not penetrated.
On the other hand, in an alternative to this embodiment example, the apertures are formed by openings through both the copper cladding and the dielectric carrier material 1 , for example by means of drilling or milling.
In the following, a second embodiment example will be disclosed. With reference to Figure 4, an aperture 20 is formed through both the copper cladding and the dielectric carrier material 1 , for example by means of drilling or milling, the aperture mainly corresponding to the open sides 13, 14 of the surface-mountable waveguide parts 4, 5, leaving on the first main side 2 a footprint 21 for the first surface-mountable waveguide part 4. On the second main side 3, a corresponding footprint (not shown) is formed for the second surface-mountable waveguide part 5. Preferably, but not shown, a number of via holes are made in the footprints 21 , connecting them.
In order to obtain filter functionality, a thin electrically conducting sheet 22, as shown in Figure 5 and Figure 6, is inserted between one of the surface- mountable waveguide parts 4, 5 and its adjacent main side 2, 3, in this example between the first surface-mountable waveguide part 5 and the first
main side 2. The sheet 22 is thus in electrical contact with the first surface- mountable waveguide part 5 and the first main side 2.
The electrically conducting sheet 22 constitutes a second type of frequency band defining means for the surface-mountable wave-guide filter, where thus only the electrically conducting sheet 22 comprises the frequency-specific parts, and not any of the surface-mountable waveguide parts 4, 5, the dielectric carrier material 1 or its copper cladding. This simplifies the design, since only the frequency band defining electrically conducting sheet 22, which normally is etched or laser-milled, has to be changed for obtaining different frequency characteristics.
The electrically conducting sheet 22 shown in detail in Figure 6, where a number of openings 22a, 22b, 22c, 22d, 22e, 22f, 22g, 22h are formed in the sheet 22, constitutes an example of how such a frequency band defining electrically conducting sheet 22 may appear.
It is of course possible only to remove the copper cladding, not forming an aperture in the dielectric carrier material itself.
By means of the present invention, a high degree of freedom and versatility is acquired, since it is now possible to choose the desired components from a number of prefabricated parts and mount them in such a way that a desired filter and diplexer is obtained. In other words, a modular building block technique may be used, offering a large number of combinations.
Such a modular building block technique is of course suitable for a so-called pick and place machine, which automatically assembles the desired waveguide structures.
There are a lot of different ways to feed a waveguide structure; one feeding technique will be disclosed with reference to Figure 7. In Figure 7, a magnetic probe 23 is feeding a waveguide part 24.
The present invention is not limited to the embodiment examples according to the above, but may vary freely within the scope of the appended claims.
For example, the copper used may be any suitable conducting material constituting a metalization, for example silver or gold. All patterns formed in the metalization form metalization patterns. The metalization may be deposited onto the dielectric material by various methods, for example printing, plating, or rolling. There may also be several layers of metalization, for example an additional layer comprising solder.
The electrically conducting sheet, used as an alternative frequency band defining means, is made in any suitable conducting material, for example copper, silver or gold. The sheet may also be made in a non-conducting material, such as plastic, which is covered by a thin layer of metalization.
The waveguide parts may also be made in a non-conducting material, such as plastic, which is covered by a thin layer of metalization.
The dielectric material may comprise several layers if necessary, the layers comprising different types of circuitry. Such a layer structure may also be necessary for mechanical reasons.
The flanges may be of any suitable form, generally forming flange parts.
All fastenings of parts are preferably made by means of soldering or gluing with electrically conducting glue or other suitable adhesive. Mechanical retention is of course also possible, i.e. using screws or the like.
Generally, there may not be any need for a particular footprint, but some kind of guidance for the mounting of the surface-mountable waveguide parts 4, 5 is preferred.
Claims
1. A surface-mountable waveguide filter arrangement comprising a first surface-mountable wave-guide part (4), a second surface-mountable wave-guide part (5) and a dielectric carrier material (1 ), the dielectric carrier material (1 ) comprising a first main side (2) and a second main side (3), each main side (2, 3) having a respective metalization pattern, the first surface- mountable wave-guide part (4) comprising a first wall (7), a second wall (8) a third wall (9) and an open side (13), which second and third walls (8, 9) are arranged to contact at least a part of the corresponding metalization pattern on the first main side (2) when the first surface-mountable wave-guide part (4) is mounted, all the walls (7, 8, 9) together essentially forming a U-shape, the second surface-mountable wave-guide part (5) comprising a first wall (10), a second wall (11 ) a third wall (12) and an open side (14), which second and third walls (11 , 12) are arranged to contact at least a part of the corresponding metalization pattern on the second main side (3) when the second surface-mountable wave-guide part (5) is mounted, all the walls (10, 11 , 12) together essentially forming a U-shape, characterized in that when the surface-mountable waveguide parts (4, 5) are mounted, their respective open sides (13, 14) face each other, the dielectric carrier material (1 ) being positioned between the first surface-mountable wave-guide part (4) and the second surface-mountable wave-guide part (5), such that the surface- mountable waveguide parts (4, 5) together form a waveguide filter with separate frequency band defining means (19, 22) being positioned between the first surface-mountable wave-guide part (4) and the second surface- mountable wave-guide part (5), the electrical field (E) being oriented mainly parallel to the first and second main sides (2, 3).
2. A surface-mountable waveguide filter arrangement according to claim 1 , characterized in that the separate frequency band defining means is comprised in the metalization pattern (19) formed on one of the main sides (2, 3).
3. A surface-mountable waveguide filter arrangement according to claim 1 , characterized in that the separate frequency band defining means is constituted by an electrically conducting sheet (22) which is positioned between one of the waveguide parts (4, 5) and its adjacent main side (2, 3).
4. A surface-mountable waveguide filter arrangement according to any one of the previous claims, characterized in that a magnetic probe (23) is used for waveguide feeding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2008/054591 WO2009127253A1 (en) | 2008-04-16 | 2008-04-16 | A waveguide filter arrangement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2008/054591 WO2009127253A1 (en) | 2008-04-16 | 2008-04-16 | A waveguide filter arrangement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2009127253A1 true WO2009127253A1 (en) | 2009-10-22 |
Family
ID=40032611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2008/054591 WO2009127253A1 (en) | 2008-04-16 | 2008-04-16 | A waveguide filter arrangement |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2009127253A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018012368A1 (en) * | 2016-07-13 | 2018-01-18 | 日本電気株式会社 | Waveguide filter |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4028650A (en) * | 1972-05-23 | 1977-06-07 | Nippon Hoso Kyokai | Microwave circuits constructed inside a waveguide |
| US5004993A (en) * | 1989-09-19 | 1991-04-02 | The United States Of America As Represented By The Secretary Of The Navy | Constricted split block waveguide low pass filter with printed circuit filter substrate |
| JPH09307305A (en) * | 1996-05-20 | 1997-11-28 | Fujitsu General Ltd | Feed horn for linear polarized wave |
-
2008
- 2008-04-16 WO PCT/EP2008/054591 patent/WO2009127253A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4028650A (en) * | 1972-05-23 | 1977-06-07 | Nippon Hoso Kyokai | Microwave circuits constructed inside a waveguide |
| US5004993A (en) * | 1989-09-19 | 1991-04-02 | The United States Of America As Represented By The Secretary Of The Navy | Constricted split block waveguide low pass filter with printed circuit filter substrate |
| JPH09307305A (en) * | 1996-05-20 | 1997-11-28 | Fujitsu General Ltd | Feed horn for linear polarized wave |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018012368A1 (en) * | 2016-07-13 | 2018-01-18 | 日本電気株式会社 | Waveguide filter |
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