WO2009124159A1

WO2009124159A1 - Method for producing composite member of metal member and resin member

Info

Publication number: WO2009124159A1
Application number: PCT/US2009/039231
Authority: WO
Inventors: Yuji Saga
Original assignee: E. I. Du Pont De Nemours And Company
Priority date: 2008-04-03
Filing date: 2009-04-02
Publication date: 2009-10-08
Also published as: JP2011516310A; EP2259907A1; CN101983118A; US8715534B2; US20090250666A1

Abstract

The invention discloses an injection molding method for manufacture of a metal-resin composite member; wherein the resin composition used in the method includes a plurality of metal particles having one or more metal melting points between about 200 °C and 400 °C; said resin composition is heated to a temperature higher than the resin melting point and higher than one or more metal melting points to provide a heated resin composition; and wherein injecting said heated resin into a mold results in contact of said heated resin with one or more disposed heated metal member(s) to provide a composite member.

Description

METHOD FORPRODUCING COMPOSITE MEMBEROF METAL MEMBER

AND RESIN MEMBER

Field of the Invention

The present invention relates to material science and a method for molding composite members having metal members and polymer resin members.

BACKGROUND OF INVENTION

Parts made only of either metal members or resin members are commonly used in the fields of automobiles, electronic devices, industrial machinery, and the like. That is, a commonly used method is to produce members made of metal or members made of resin, which are then assembled. By contrast, there has recently been more interest in composite members which include both metal members and resin members in the interests of fully exploiting the features of both metal and resin, producing more light-weight members, and reducing costs of manufacturing. An example of a method for producing composite members of metal members and resin members is a technique utilizing insert molding. When a composite member is formed using insert molding, a metal member is first inserted in the mold. Molten resin is then injected into the mold, filling the mold with resin. The resin is cooled to solidification, and the composite member of the desired shape is taken out of the mold.

However, because resin and metal are inherently difficult to bond, the resulting composite members tend to separate where the component members are joined together. JP Patent No. 2,878,967 (Nakagawa, et al.) discloses a method to strengthen adhesion between resin and metal in metal-insert molding process comprising pretreating the metal surface with an alkoxysilane compound. JP laid open patent No. 2004-346255 discloses a polyamide composition containing a silane coupling agent and an epoxy-modified styrene elastomer to strengthen adhesion with metal.

There is a need to develop means for improving the bonding strength between the metal and resin without additional process steps.

Furthermore, when the resin has high thermal conductivity, early solidification of the resin is a problem. In other words, because of the high thermal conductivity of the resin, the resin tends to solidify while the mold is being filled with the resin, preventing the resin from spreading throughout the mold.

With respect to techniques for heating the resin supplied to a mold, US 4,340,551 has disclosed a technique in which IH is employed to control the temperature of mold surface where the resin is supplied. SUMMARY OF INVENTION

An object of the invention is to provide a method for producing composite members having powerful bonding strength between metal members and resin members.

One embodiment of the invention is a method for producing a composite member having a metal member and a resin member, the method comprising the steps of: a) providing a resin composition comprising (i) thermoplastic resin having a resin melting point and/or a glass transition, and a solidification point; and (ii) a plurality of metal particles having one or more metal melting points between about 130 °C and 400 °C; disposing one or more metal member(s) in a moid cavity, each said metal member(s) having at least one exposed surface, and said mold cavity, optionally, having at least one mold cavity exposed surface; b) heating the one or more metal member(s) to a temperature equal or higher than at least one of the melting points of the plurality of metai particles to provide one or more heated metal member(s); c) heating the thermoplastic resin composition to a temperature higher than the resin melting point or the glass transition temperature and higher than one or more metal melting points to provide a heated resin; d) injecting the heated resin into the moid to contact each heated metat member(s) exposed surface to provide a heated composite member; and e) cooling said heated composite member below the resin soiidification point. f) A further embodiment of the invention is composite member made by the method as disclosed above.

DESCRIPTION OF FIGURES Figure 1 illustrates a mold for practicing the method of the invention. Figure 2 illustrates a composite molded product provided by the method of the invention.

Figure 3 illustrates the metal particles within the resin used for practicing the method of the invention.

OETAiLED DESCRIPiTON OF THE INVENTION The method of the invention requires a resin composition having i) a thermoplastic resin having a resin melting point and/or a glass transition, and a solidification point; and (it) a piurality of metai particles having one or more metal melting points. The melting point and glass transition temperature of the thermoplastic resin and metal meiting points can be determined by peak temperature obtained by differentia! scanning calorimetry (DSC) in a heating cycle; and the resin solidification point can be determined in a corresponding cooiing cycle from the melt according to ASTM D 3418.

The resin is a thermoplastic resin that is crystalline, serni-crystailine or amorphous. Examples of thermoplastic resins useful in the invention include poiyolefin resins such as polyethylene and polypropylene, polyamide resins such as nyion-6, nyion-66, nyion-11 , nylon-12, and aromatic polyamides, polyester resins such as polyethylene terephthaiate, polybutylene terephthaiate. and poiycycfohexyimethylene terephthaiate, and ABS resins, polycarbonate resins, modified polyphenyiene ether resins, poiyaceta! resins, polyphenyiene sulfide resins, fυfly aromatic polyester resins, poiyether ether ketone resins, poiyether sυifone restns, poiysuifone resins, and poiyamide-imide resins. Copolymers of any combination of components forming such resins are aiso included . These thermoplastic resins may aiso be used individually or in combinations of two or more. Preferred thermoplastic resins for various aspects of the invention include those selected from the group consisting of polyamide resins, polyester resins, poiyphenylene sulfide resins. Preferably, the resin has a meiting point or glass transition temperature higher than 150 °C, and more preferably between 200 °C and 400 ^:NC. A preferred resin class is liquid crystal polyesters wherein both the dioi and diacid component have aromatic ring.

The "plurality of metal particies" having one or more metai melting points includes a single metai composition having a single metal meiting point or a mixture of metal compositions having multiple metal meiting points. The metal melting points may be determined using DSC; and are evidenced by one or more significant endotherm(s) in the heating scan. Preferabiy iow-meiting metals are used in the method of the invention having melting points, at the peak of the endotherms as observed by DSC, of between 130 °C and about 400 °C, and more preferably between 200 °C and about 300 °C . Examples of such low-melting metais include Sn alloys such as Sn-Cu, Sn-Al, Sn-Zn, Sn-Te, Sn-Pt, Su-P, Sn- Mn, Sn-Sb, Sn-Ag, Sn-Ag-Cu, Sn-Ag-Cu-Bi, Sn-Ag-Cu-Sb, Sn-Ca, Sn-Mg, Sn-Au, Sn-Ba, and Sn-Ge; and Li alloys such as Al-Li, Cu-Li, and Zn-Li. Preferred metai compositions are Sn-Cu, Sn-Sb, Sn-Al, Sn-Zn, Sn-Pt, Sn-Mn, Sn-Ag. Sn-Ag-Cu, Sn-Ag-Cu-Bi, Sn-Ag-Cu-Sb, Sn-Au, Ai-Li, and Zn-Li. More preferred are Sn-Cu, Sn-Ai, and Sn-Zn. It is even more preferable to use Sn-Cu alloys, as they are available with a range of melting points. The metal particles can include spherical, flaked, and needled shapes; as so desired by the artisan. The metal particle diameter is not particularly limited. However, from the perspective of contributing to the adhesive strength between the metal member and resin member, the particle diameter before being blended with the resin is preferabiy 1 to 300 μm. By particle diameter is meant the wetght- average mean particle diameter that can be determined using a laser diffraction type particle size distribution analyzer such as a Cirrus Granulometer (Model 920) or a Couiter laser diffraction type particle size distribution analyzer (LS-230).

Other materials may be added as needed, in addition to the resin and metal particles, in the resin composition. Additives include flame retardants, reinforcing agents, inorganic fillers, plasticizers. rubbers, nucleating agents, flame retardant synergists, heat stabilizers, antioxidants, dyes, pigments, mold release agents, lubricants, UV stabilizers, adhesion promoters other than the metai particles disclosed above, and the like.

The content of each component in the resin composition is not particularly limited and may be determined as desired according to the functions required of the molded product and the materials that are used. In one embodiment, based on the total volume of the resin member, the resin member will preferably include the resin in an amount of 95 to 30 vol%, and more preferably 80 to 40 voi%. The plurality of metal particles will preferably be included in an amount of 1 to 20 vol%_: and more preferably 3 to 10 vo!%.

The method of the invention further requires one or more metal members). Any metal or metai alloy, having at least 100 °C higher melting point than the highest temperature used in the method, may be used as the metal member, such as steel, nickel, chromium, copper, zinc, titanium, aluminum, or magnesium, or alloys of such metals. In one embodiment the one or more metal members) have at least one surface formed with aluminum or iron.

A mold (1) for practicing the method of the invention is illustrated in Figure 1. Metal members (2) are disposed in the proximity of heaters (3) within the mold cavity (4). The heaters (3) are used in heating the metal members and, optionally, the mold cavity (4). The heaters (3) are preferably induction heaters having a metal core (7), a coil (8) for conducting current, and a power supply (9). The mold (1) may have additional heaters (not shown) to provide additional heating to the mold cavity (4). One or more resin injection ports (5) provides heated resin to the mold cavity (4) such that when injected the heated resin contacts the metal member exposed surface (2A).

The method of the invention includes (b) disposing one or more metal member(s) in a mold cavity (4); such that at least one exposed surface (2A) of the metal member remains available to the resin, to be injected. The one or more metal members may be pre-heated outside the mold, before disposing in the mold cavity, if so desired by the artisan. In one embodiment the at least one exposed surface of the metal member (2A), optionally, can be pre-treated with a coupling agent to further enhance adhesion with the resin to be injected. Examples of coupling agents include silane, titanate, zirconate, aluminate. and zircoaluminate coupling agents.

Metal hydroxides and alkoxides useful as coupling agents include those of Group HIa thru Villa, Ib, lib, IMb, and IVb of the Periodic Table and the lanthanides. Specific coupling agents are metal hydroxides and alkoxides of metals selected from the group consisting of Tt, Zr, Mn, Fe, Co, Ni, Cu, Zn, Al, and B. Preferred metal hydroxides and alkoxides are those of Ti and Zr. Specific metal aikoxide coupling agents are titanate and zirconate orthoesters and chelates including compounds of the formula (I), (II) and (III).

wherein

M is Ti or Zr;

R is a monovalent C₁ - C₆ linear or branched alkyl; Y is a divalent radical selected from -CH(CH₃)-, -C(CH₃)=CH₂-, or -

CH₂CH₂-;

X is selected from OH, -N(R¹)₂, -C(O)OR³, -C(O)R³, -CO₂-A-; wherein

R¹ is a -CH₃ or C₂ - C₄ linear or branched alkyl, optionally substituted with a hydroxyl or interrupted with an ether oxygen; provided that no more than one heteroatom is bonded to any one carbon atom;

R³ is C₁ - C₄ linear or branched alkyl;

A⁺ is selected from NH₄ ⁺, Li⁺, Na⁺. or K⁺

The one or more metal member(s) are heated to a temperature equal or higher than at least one of the melting points of the plurality of metal particles included in the resin composition. The heating of the metal member(s) may be done partially or completely outside the mold cavity. In one embodiment heating the metal member(s) are performed in the mold by induction heating. In one embodiment the resin solidification point is higher than the melting point of the metal particles, and the one or more metal member(s) are heated to a temperature between the resin solidification temperature and the melting point of the resin. In a preferred embodiment the one or more metal rnember(s) are heated to a temperature at least + 10 °C over the resin solidification point and the resin melting point, in another embodiment wherein the resin solidification point is lower than the melting point of the metal particles, the one or more metal member(s) are heated to a temperature between the metal particles melting point and the metal particles meiting point + 100 °C. In a preferred embodiment the one or more metal members(s) are heated to a temperature between the metal particles melting point and the metal particles melting point + 50 °C. The metal members can be heated using well known heating methods such as induction heating (IH) or resistance heating, and preferably induction heating.

The resin composition is heated to a temperature higher than the resin melting point (if present) or higher than the glass transition temperature; and higher than one or more metal melting points to provide a heated resin. The heated resin is then injected into the mold cavity having the one or more heated metal member(s) to contact said metal member exposed surface to provide a heated composite member. In this way, the metal particles will contact the exposed surface of the one or more heated metal member(s), and afford a firm junction between the metal particles, in their molten state, and the heated metal member(s); as well as greater tnterfacial junction strength between the metal member(s) and resin member. The interfacial junction strength is preferably at least 3 IvIPa, and more preferably at least 10 MPa. The junction strength can be determined by a tenstfe tester equipped with a load cell, and tests can be conducted by attaching to each of the metai members and resin members a jig for attachment to the tester. The junction strength can also be assumed to be at or over the breaking strength of the resin member if the resin member becomes broken when the metal member and resin member are separated off the tester.

In another embodiment, the mold cavity optionally has at least one mold cavtty exposed surface that may be heated, in addition to the one or more metal members). This can lead to the undesirable result of the resin composition becoming joined to the mold cavity exposed surface It is desirable to have a mold cavity exposed surface wherein part, and preferably all of, said surface is treated to inhibit adhesion with the metai particles. For example, the moid cavity exposed surface can be treated with fluoropoiymer release agents.

Cooling the heated composite member below the resin solidification point. solidifies the resin composition and allows the composite member to be released from the mold. The solidification point is the point in the cooling cycle wherein the resin solidifies, and no longer flows; either by cooling below the glass transition of the resin, or by cooling below the crystallization point of the resin. Depending on the type of resin composition, cooling may include turning off the induction heaters; and cooling the resin by lowering the mold temperature to or below the matrix resin solidification temperature with a cooling medium that passes through the moid.

Another embodiment of the invention is a composite member made by the method of the invention as disclosed above. Another embodiment is a composite member made by the method of the invention as disclosed above that is an electronic component, A further embodiment is said electronic component that further comprises a light emitting diode.

Another embodiment is a composite member made by the method of the invention as disclosed above that is an automotive component. A further embodiment is said automotive component thai further comprises a light emitting diode.

The composite member obtained by the method of the invention can be used in a wide range of applications such as electronic products, automotive products, electrical products, and industrial machinery products. Electronic products include illumination devices with LEDs, hard disks, and the like.

Materials

HTN501 : Zytel® HTN 501, supplied by EJ. du Pont de Nemours and Co.. is a copolyamide made from terephthalic acid, adipic acid, and hexamethylenediamtne; wherein the two acids are used in a 55:45 molar ratio.

Melting temperature and solidification temperature measured by DSC are 310°C and 273°C (cooling cycle), respectively.

Sn-Ag-Cu alloy having a melting point (peak temperature) of 219 °C measured by

DSC and a mean particle diameter of 20 μm, supplied by Senju Metal industry Co., Ltd in Japan. Copper powder: Cu powder having a mean particie diameter of 10 μm.

Graphite: CB-150 supplied by Nippon Graphite Industries, Ltd in Japan. Example 1

Peilets of a resin composition listed in Table 1 were prepared using a twin-screw extruder.

[Table 1]

As illustrated in FIG. 1, two 1 mm thick aluminum plates were inserted into a mold cavity in which an induction heater (IH) system had been embedded. The mold was closed, the aluminum plates [metal members (2)} and mold heated via the induction heaters until the moid surface contacting the aluminum plates had reached 250 °C. The pellets of resin composition of Table 1 was heated to 320 °C, melted, and injected into the moid. The mold temperature was lowered to 150 °C, and a metal/resin composite member as illustrated in FiG. 2 was removed from the mold.

When attempts were made to separate the aluminum and resin, the resin broke, revealing that the aluminum and resin were firmly bonded. Because the resin broke, the interfacial junction strength between the metal and resin in the composite product could be assumed to be at least 62 MPa, which was the breaking strength of the resin.

Comparative Example 1

A metal/resin composite member was prepared in the same manner as in Example 1 except that a 35% glass fiber reinforced high-melting poiyamide (Zytel (R)HTN 51G35L supplied by E. I. du Pont de Nemours and Co.) was used as the resin. The resin composition contained no metal particles havtng a melting point in the range of 130 - 400 °C; but had a resin melting point of 300 °C. Inspection of the resulting composite member, showed the aluminum plates and resin were not joined at all.

Comparative Example 2 A metal/resin composite molded product was prepared in the same manner as in Example 1 except that the moid temperature was fixed at 150 °C (below the meitiπg point of at least one of the metal particles) with an oil temperature control system instead of an !H system to inject the resin composition into the moid. Inspection of the resulting composite member, showed the aluminum plates and resin were not joined at all.

As shown above, the method of the present invention provides a metai/resin composite member of high strength. Adequate strength was not obtained when the resin composition contained no metal particles having a melting point in the range of 130 - 400 °C (Comparative Example 1) or when the mold temperature was tower than the melting point of the metal particles(Comparative Example 2)

Claims

CLAIMS WHAT IS CLAIMED IS:

1. A method for producing a composite member having a metai member and a resin member, the method comprising the steps of. a) providing a resin composition comprising (i) thermoplastic resin having a resin melting point and/or a glass transition, and a solidification point; and (ii) a plurality of metal particles having one or more metal melting points between about 130 °C and 400 °C; b) disposing one or more metal member(s) in a moid cavity, each said metal member(s) having at least one exposed surface, and said mold cavity, optionally, having at least one mold cavity exposed surface; c) heating the one or more metal member(s) to a temperature equal or higher than at least one of the meittng potnts of the plurality of metal particles to provide one or more heated metal member(s); d) heating the resin composition to a temperature higher than the resin melting point and higher than one or more metal melting points to provide a heated resin; e) injecting the heated resin into the mold to contact each heated metai member(s) exposed surface to provide a heated composite member; and f) cooling said heated composite member below the resin solidification point.

2. The method of claim 1 , wherein heating the metal member is performed in the mold by induction heating.

3. The method of claim 1 wherein the metal particles are a Sn alloy or Li alloy.

4. The method of claim 1 , wherein the metai particles are selected from the group consisting of Sn-Cu alloys, Sn-Sb alloys, Sn-Ai alloys, Sn-Zn alloys, Sn-Pt alloys, Sn-Mn alloys, Sn-Ag alloys, Sn-Ag-Cu ailσys, Sn-Ag-Cu-Bi alloys, Sn-Ag-Cu-Sb alloys, Sn-Au alloys, Ai-Li alloys, and Zn-Li alloys.

5. The method of claim 1 , wherein part, or all of_: at least one mold cavity exposed surface is treated to inhibit adhesion with the metal particles.

6. A composite member made by the method of claim 1.

7, The composite member of claim 7 that is an electronic component,

8. The electronic component of claim 8 that further comprises a light emitting diode.

9. The composite member of claim 7 that is an automotive component.