WO2009116743A3 - Led package - Google Patents

Led package Download PDF

Info

Publication number
WO2009116743A3
WO2009116743A3 PCT/KR2009/001190 KR2009001190W WO2009116743A3 WO 2009116743 A3 WO2009116743 A3 WO 2009116743A3 KR 2009001190 W KR2009001190 W KR 2009001190W WO 2009116743 A3 WO2009116743 A3 WO 2009116743A3
Authority
WO
WIPO (PCT)
Prior art keywords
light
emitting chip
led package
plate
wavelength
Prior art date
Application number
PCT/KR2009/001190
Other languages
French (fr)
Korean (ko)
Other versions
WO2009116743A2 (en
Inventor
유태경
오승현
Original Assignee
(주)루멘스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)루멘스 filed Critical (주)루멘스
Publication of WO2009116743A2 publication Critical patent/WO2009116743A2/en
Publication of WO2009116743A3 publication Critical patent/WO2009116743A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements

Abstract

This invention is provided to maximize the efficiency of excited-light emission by limiting the wavelength of a light emitted from an independent fluorescent material. For this purpose, the invention provides an LED package that includes: a plate, at least one light-emitting chip that is bonded to the plate, a primary medium that is applied onto the light-emitting chip and emits a light having a wavelength different from the light of the light-emitting chip, and a secondary medium through which the light from the light-emitting chip penetrates.
PCT/KR2009/001190 2008-03-21 2009-03-10 Led package WO2009116743A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2008-0026515 2008-03-21
KR1020080026515A KR20090100967A (en) 2008-03-21 2008-03-21 Light emitting diode package

Publications (2)

Publication Number Publication Date
WO2009116743A2 WO2009116743A2 (en) 2009-09-24
WO2009116743A3 true WO2009116743A3 (en) 2009-11-12

Family

ID=41091359

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/001190 WO2009116743A2 (en) 2008-03-21 2009-03-10 Led package

Country Status (2)

Country Link
KR (1) KR20090100967A (en)
WO (1) WO2009116743A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101630327B1 (en) * 2009-11-19 2016-06-15 엘지디스플레이 주식회사 Light emitting device and back light unit using the same
KR101859149B1 (en) 2011-04-14 2018-05-17 엘지이노텍 주식회사 Light emitting device package
KR101103674B1 (en) 2010-06-01 2012-01-11 엘지이노텍 주식회사 Light emitting device
KR101675588B1 (en) * 2011-03-07 2016-11-11 엘지이노텍 주식회사 Light emitting device package
KR101459555B1 (en) * 2011-11-02 2014-11-07 엘지이노텍 주식회사 Light emitting device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006114854A (en) * 2004-10-18 2006-04-27 Sharp Corp Semiconductor light emitting device, and backlight device for liquid crystal display
JP2007537590A (en) * 2004-05-13 2007-12-20 ソウル オプト デバイス カンパニー リミテッド Light emitting device combining RGB light emitting diode and phosphor
KR20080006641A (en) * 2005-06-07 2008-01-16 가부시키가이샤후지쿠라 Substrate for light-emitting device mounting, light-emitting device module, illuminating device, display and traffic signal device
KR100811723B1 (en) * 2007-03-30 2008-03-11 서울반도체 주식회사 Led package

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007537590A (en) * 2004-05-13 2007-12-20 ソウル オプト デバイス カンパニー リミテッド Light emitting device combining RGB light emitting diode and phosphor
JP2006114854A (en) * 2004-10-18 2006-04-27 Sharp Corp Semiconductor light emitting device, and backlight device for liquid crystal display
KR20080006641A (en) * 2005-06-07 2008-01-16 가부시키가이샤후지쿠라 Substrate for light-emitting device mounting, light-emitting device module, illuminating device, display and traffic signal device
KR100811723B1 (en) * 2007-03-30 2008-03-11 서울반도체 주식회사 Led package

Also Published As

Publication number Publication date
KR20090100967A (en) 2009-09-24
WO2009116743A2 (en) 2009-09-24

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