WO2009113865A1 - Passive cooling system for photo voltaic modules - Google Patents
Passive cooling system for photo voltaic modules Download PDFInfo
- Publication number
- WO2009113865A1 WO2009113865A1 PCT/NO2009/000082 NO2009000082W WO2009113865A1 WO 2009113865 A1 WO2009113865 A1 WO 2009113865A1 NO 2009000082 W NO2009000082 W NO 2009000082W WO 2009113865 A1 WO2009113865 A1 WO 2009113865A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- pvs
- panel
- cooling
- heat
- relaxation time
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 86
- 239000004020 conductor Substances 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 21
- 238000012546 transfer Methods 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 238000012360 testing method Methods 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 11
- 230000015556 catabolic process Effects 0.000 abstract description 2
- 238000006731 degradation reaction Methods 0.000 abstract description 2
- 239000003570 air Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000002482 conductive additive Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000036561 sun exposure Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
- H02S40/40—Thermal components
- H02S40/42—Cooling means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention is related to Photo Voltaic Solar (PVS) panels, and especially to a passive cooling system improving the performance of the PV panels.
- PV Photo Voltaic Solar
- WO Al 03/098705 disclose a photovoltaic module comprising a heat sink in thermal contact with the photovoltaic material.
- the heat sink of this publication comprises a plurality of fins 12 that are movable between a first position substantially parallel to the mounting surface of the heat sink and a second position non-parallel to the mounting surface of the heat sink.
- the first position of the fins is used when assembling a module for facilitating for example lamination of the heat sink to the photovoltaic material.
- the handling of the heat sink during production of the module is simplified, the actual manufacturing of the heat sink itself is complex. There are also additional problems related to locating and adjusting the fins of the heat sinks after installation of a panel according to this publication.
- Cooling can be provided by both active and passive systems.
- Active cooling systems include Rankine cycle system and absorption system, both of which require additional hardware and costs.
- Passive cooling systems make use of three natural processes: convection cooling, radiation cooling and evaporation cooling from water surfaces exposed to the atmosphere.
- One prior art approach to solve the cooling problem in a cost effective manner is to provide cooling fins attached to the backside of the PVS panel. See for example US 4118249 A.
- the heat sink fin geometry acts to cool the module by convective air flow up the backside of the module. This cools the module rapidly up the back; however, heat transfer perpendicular to the air flow is relatively lower. This phenomenon has been documented for example by the Arizona State University (ASU). It is known from field test measurements from ASU that a module with heat sink arrangement can have a 25C temperature difference from the centre to the edge of the module. This reduces performance and lifetime of the module due to uneven current flow and stress gradients (due to variations in material expansion) across the module.
- a heat sink device comprising cooling fins, wherein the fins are oriented in an upwardly arrangement permitting airflow between the cooling fins from a bottom edge of the PVS panel to an upper edge of the PVS panel, is arranged, wherein the PVS panel is attached in thermal contact with a backside of the PVS panel, wherein the heat sink device comprises a least one heat bridge arranged in a transversal arrangement relative to the cooling fins orientation, wherein the heat bridge is providing a substantial homogenous temperature over the whole surface of the PVS panel within a relaxation time period below a predefined threshold level.
- the threshold level for the thermal relaxation time is a function of the actual cooling module when it is actually in thermal contact with the PVS panel.
- the relaxation time threshold is defined as the time elapsed when bringing a temperature of two distal points respectively located in each respective end of the heat bridge, wherein the temperature is measured on the PVS panel surface in these respective points under Standard Test Conditions (STC) as known to a person skilled in the art of Photo Voltaic Solar Panels. It is within the scope of the present invention to use other definitions of the relaxation time, providing other means for providing the effect of substantial equal temperatures across a surface of the PVS panel.
- STC Standard Test Conditions
- the heat bridge is arranged as a base plate made of aluminium supporting the cooling fins, and wherein a thickness of the base plate is sufficient to provide a transversal heat conducting capacity of the base plate enabling the thermal relaxation time to be below the predefined threshold level.
- the heat bridge is arranged as a strip of thermal conducting material in thermal contact with an upper edge of the cooling fins, or at a bottom edge of the cooling fins, or at both the upper and lower edges, respectively, thereby providing the transversal arrangement of the heat bridge with a thermal relaxation time below the predefined threshold level.
- the heat bridge is arranged as strips or patches of heat conductive material arranged in between the heat sink device and the back side of the PVS panel when assembled, wherein the material of the strips or patches provides a heat conductive capacity providing the thermal relaxation time below the predefined threshold level.
- the heat bridge is arranged as a frame surrounding the PVS panel's outer perimeter, and wherein the frame comprises a heat conducting material providing the thermal relaxation time below the predefined threshold level.
- the heat bridge is arranged as a transversal part of a supporting external structure that is used when mounting the PVS panel at a location for utilization of the PVS panel.
- Figure 1 illustrates a prior art PVS panel with passive cooling fins.
- Figure 2 illustrates a view of the cooling fins attached to the backside of the PVS panel in figure 1.
- Figure 3 illustrates the effect of uneven temperature between to separate location on the PVS panel.
- Figure 4 illustrates an example of embodiment of the present invention.
- Figure 5 illustrates another example of embodiment of the present invention.
- Figure 6 illustrates the concept of thermal relaxation time.
- FIG 1 illustrates an example of a PVS panel being cooled by protruding cooling fins 10.
- the cooling fins can be manufactured as a collection of modules assembled onto the backside of the panel (as illustrated in figure 1) or as an unbroken module covering the whole backside of the PVS module.
- Thermal conducting glue 11 is used to connect the cooling fins 10 to the photo voltaic cells 13.
- a cover 14 made of glass is the side of the PVS module that is facing the sun.
- Figure 2 illustrates the arrangement of the fins on a backside of a PVS panel. Air may flow from the bottom edge of the PVS module to the top edge of the module.
- the transversal cooling effect can be extremely variable.
- An effect of the arrangement of the cooling fins is that air flow in a transversal direction relative to the upwardly direction of the fins actually impair the air flow due to the protruding feature of the fins.
- the temperature difference between a middle section of the PVS panel and sections close to the perimeter can be as much as 25 0 C. This seriously impair the performance of the PVS panel, and the effect of the cooling fins can actually contribute to harm the PVS panel in stead of promoting a long lifetime of he panel, for example.
- the uneven cooling provided by the cooling fins is also due to the fact that locally, just beneath a cooling fin section, the cooling can be extremely effective.
- an aspect of the present invention is to arrange a heat bridge in a transversal direction relative to the fin geometry that provides a thermal conductivity in this direction that substantially equalize the temperature difference between different locations on the PVS panel surface.
- FIG. 3 illustrates a situation wherein two different spots Tl and T2 have different temperatures.
- the backside of this example of PVS panel has cooling fins (not shown) which provides an effective cooling from the bottom side of the panel to the upper edge of the panel. Therefore, any temperature difference along the underlying sections of a cooling fin is minimal when measuring the temperature at the bottom end of the cooling fin compared to the upper end of the cooling fin. It is the temperature difference that can be between the different local sections underneath the respective cooling fins, and the temperature difference that can be present between different sections of the PVS panel surface due to uneven air flow conditions, that causes the problem.
- an additional heat transfer channel or bridge providing a good heat conducting capacity between the respective cooling fins in the transversal direction of the fin geometry is sufficient to substantially equalize the temperature between respective longitudinal sections of the cooling panel.
- This is illustrated in figure 3 such that heat flows from the T2 area first in a transversal direction due to an arranged heat bridge, and then along a longitudinal direction along a cooling fin to the area marked Tl. It is important to understand that the location of the heat bridge between the two sections comprising respectively the Tl and T2 area do not necessarily have to be located close to any of the areas Tl and T2.
- any location of a heat bridge thermally connecting the respective cooling fins in a transversal direction is sufficient to achieve the goal of the present invention, as long as the cooling capacity of the heat bridge provides a reasonably quick substantial equalization of temperature between distal areas of the PVS panel.
- Figure 4 illustrates an example of embodiment of a cooling device according to the present invention comprising four transversal heat bridges.
- the arrows exemplify heat transfer form the middle section of the PVS panel to the outer sections of the PVS panel.
- Figure 5 illustrates another example of embodiment of the present invention wherein a heat bridge is arranged in a bottom part and an upper part of the PVS panel.
- the heat bridge can also be embodied as a frame around the whole PVS panel, or be part of a supporting frame used when installing a PVS panel at location.
- the heat bridge can be made of any material providing a transport of the heat according to the present invention, wherein the time elapsed for transporting heat should be low.
- Good heat conductors prove a quick relaxation time for the PVS panel providing an equal temperature profile across the panel almost instantaneously.
- Examples of materials can be carbon paper, thermo conducting plastic materials, two phase materials, conductive adhesive materials etc. It is within the scope of the present invention to use any type of material, composition of materials, and/or any form of mechanical arrangement utilizing such materials providing the necessary relaxation time below a predefined threshold level.
- Figure 6 illustrates the falling temperature as a function of elapsed time for an example of embodiment of the present invention. The crossing of the curve 60 on the time axis illustrates the threshold level of the relaxation time.
- the relaxation time threshold is defined as the time elapsed when bringing a temperature of two distal points respectively located in each respective end of the heat bridge, wherein the temperature is measured on the PVS panel surface in these respective points under Standard Test Conditions (STC) as known to a person skilled in the art of Photo Voltaic Solar Panels.
- the predefined threshold level for the relaxation time is defined as elapsed time for transversal heat transfer per lateral meter of the actual cooling fin assembly used to cool the PVS panel when the cooling fin assembly is mounted on the backside of the panel, when operating under a STC environment.
- Another effect of the heat bridge arrangement according to the present invention is to solve the problem of "hot spots" on a PVS panel surface.
- the PVS panels are usually located on the roof of a building, or other outdoor areas having clear view of the sky, wherein the panel surfaces are faced towards the sun. This insures exposure to the sun the whole day.
- other buildings, trees, etc. may provide a shadow on the surface of one or a multiple of panels. The shadow may also only cover a part of the surface. This provides the condition called "hot spot".
- the electrical and thermal conditions in the panel can decline to such an extent that the power output and lifetime of the panel may be permanently damaged.
- a thermal bridge according to the present invention will substantially facilitate the problem with hot spots.
- thermal bridges are included in the solar panel.
- the thermal bridges reduces the thermal relaxation time in the solar panel.
- the flow of heat across the solar panel is enhanced and a thermal relaxation time of about 5 mins has been observed.
- thermal bridges are included in the panel.
- the thermal bridges in the solar panel allow heat to be transported across transversly to the direction of the protruding cooling finns on the the module such that a substantial homogeneous temperature difference across the surface is achieved. Examples of method steps are:
- the solar panel is constructed in a way known in prior art.
- the bridging can either be added, after step 2, where a high heat conducting material is applied that makes contact between each profile section.
- the bridging could also be some heat conductive additives in the adhesive that allow the adhesive to act as a conductive heat source.
- thermal bridges can then be added to thermally connect the fins.
- a thermally conductive material such as a paste, tape or0 metallic strip for example, can be attached between the cooling profiles, or be located in between the cooling fiins and the underside of the cooling finns, and also be attached to the backside of the cooling fins and the surface of the module the cooling finns are attaced to. Examples of materials are listed in table 1 below. In other examples of embodiments, the bridge and bridge materials can be located along the entire strip, or at 5 the edges, or at points between the cooling profiles.
- thermal bridge must be in thermal contact between the cooling fin plates, hi an example of embodiment, such materials are 0
- k b is at least 10 ⁇ 2 5 x k a i u , where k a i u is the conductivity of aluminum. 5
- the area of bridge coverage (A b / A T ) and thermal conductivity (K b /K a j) should be sufficient to provide adequate thermal transfer.
- the following relationship between these parameters are:
- this can be satisfied using silver conductive paste between the cooling profiles.
- Table 1 Examples of materials with thermal conductivity properties according to the present invention:
Landscapes
- Photovoltaic Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP09721102A EP2269234A4 (en) | 2008-03-11 | 2009-03-09 | Passive cooling system for photo voltaic modules |
JP2010550623A JP2011518427A (en) | 2008-03-11 | 2009-03-09 | Passive cooling system for photovoltaic modules |
AU2009224099A AU2009224099A1 (en) | 2008-03-11 | 2009-03-09 | Passive cooling system for Photo Voltaic modules |
CN200980108852XA CN101986796A (en) | 2008-03-11 | 2009-03-09 | Passive cooling system for photo voltaic modules |
US12/922,076 US20110110036A1 (en) | 2008-03-11 | 2009-03-09 | Passive cooling system for photo voltaic modules |
BRPI0908579A BRPI0908579A2 (en) | 2008-03-11 | 2009-03-09 | passive cooling system for photovoltaic modules |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NO20081283 | 2008-03-11 | ||
NO20081283 | 2008-03-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009113865A1 true WO2009113865A1 (en) | 2009-09-17 |
Family
ID=41065419
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/NO2009/000082 WO2009113865A1 (en) | 2008-03-11 | 2009-03-09 | Passive cooling system for photo voltaic modules |
Country Status (8)
Country | Link |
---|---|
US (1) | US20110110036A1 (en) |
EP (1) | EP2269234A4 (en) |
JP (1) | JP2011518427A (en) |
KR (1) | KR20100136982A (en) |
CN (1) | CN101986796A (en) |
AU (1) | AU2009224099A1 (en) |
BR (1) | BRPI0908579A2 (en) |
WO (1) | WO2009113865A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3029367A1 (en) * | 2014-11-27 | 2016-06-03 | Systovi | PHOTOVOLTAIC PANEL WITH RADIATORS |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0889524A2 (en) * | 1997-06-30 | 1999-01-07 | Sun Microsystems, Inc. | Scalable and modular heat sink-heat pipe cooling system |
WO1999027761A1 (en) * | 1997-11-21 | 1999-06-03 | Muuntolaite Oy | Cooling element for an unevenly distributed heat load |
WO2001063665A1 (en) * | 2000-02-25 | 2001-08-30 | The Australian National University | A convective heatsink |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3999238A (en) * | 1974-08-09 | 1976-12-28 | Hanson Douglas R | Pan cleaning apparatus |
JPH1136540A (en) * | 1997-07-14 | 1999-02-09 | Sekisui Chem Co Ltd | Installation construction of solar cell module |
US20060249198A1 (en) * | 2005-05-09 | 2006-11-09 | Jin-Geun Rhee | Photovoltaic power generating unit having radiating fins |
US20070215198A1 (en) * | 2006-03-16 | 2007-09-20 | United Technologies Corporation | Solar cell system with thermal management |
NO20063098L (en) * | 2006-07-04 | 2008-01-07 | Norsk Solkraft As | solar device |
-
2009
- 2009-03-09 AU AU2009224099A patent/AU2009224099A1/en not_active Abandoned
- 2009-03-09 EP EP09721102A patent/EP2269234A4/en not_active Withdrawn
- 2009-03-09 US US12/922,076 patent/US20110110036A1/en not_active Abandoned
- 2009-03-09 JP JP2010550623A patent/JP2011518427A/en active Pending
- 2009-03-09 BR BRPI0908579A patent/BRPI0908579A2/en not_active IP Right Cessation
- 2009-03-09 KR KR1020107022718A patent/KR20100136982A/en not_active Application Discontinuation
- 2009-03-09 WO PCT/NO2009/000082 patent/WO2009113865A1/en active Application Filing
- 2009-03-09 CN CN200980108852XA patent/CN101986796A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0889524A2 (en) * | 1997-06-30 | 1999-01-07 | Sun Microsystems, Inc. | Scalable and modular heat sink-heat pipe cooling system |
WO1999027761A1 (en) * | 1997-11-21 | 1999-06-03 | Muuntolaite Oy | Cooling element for an unevenly distributed heat load |
WO2001063665A1 (en) * | 2000-02-25 | 2001-08-30 | The Australian National University | A convective heatsink |
Non-Patent Citations (1)
Title |
---|
See also references of EP2269234A4 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3029367A1 (en) * | 2014-11-27 | 2016-06-03 | Systovi | PHOTOVOLTAIC PANEL WITH RADIATORS |
Also Published As
Publication number | Publication date |
---|---|
JP2011518427A (en) | 2011-06-23 |
KR20100136982A (en) | 2010-12-29 |
EP2269234A1 (en) | 2011-01-05 |
BRPI0908579A2 (en) | 2015-09-15 |
EP2269234A4 (en) | 2012-08-22 |
AU2009224099A1 (en) | 2009-09-17 |
CN101986796A (en) | 2011-03-16 |
US20110110036A1 (en) | 2011-05-12 |
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