WO2009112626A1 - Method for packaging a component film comprising electronic components - Google Patents

Method for packaging a component film comprising electronic components Download PDF

Info

Publication number
WO2009112626A1
WO2009112626A1 PCT/FI2008/000041 FI2008000041W WO2009112626A1 WO 2009112626 A1 WO2009112626 A1 WO 2009112626A1 FI 2008000041 W FI2008000041 W FI 2008000041W WO 2009112626 A1 WO2009112626 A1 WO 2009112626A1
Authority
WO
WIPO (PCT)
Prior art keywords
module
film
component
edge
order
Prior art date
Application number
PCT/FI2008/000041
Other languages
French (fr)
Inventor
Sampo Aallos
Original Assignee
Zipic Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zipic Oy filed Critical Zipic Oy
Priority to PCT/FI2008/000041 priority Critical patent/WO2009112626A1/en
Publication of WO2009112626A1 publication Critical patent/WO2009112626A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Definitions

  • Invention relates to a method for packaging a component film with several layers including electronic components in order to be a module equipped with a lid which module comprises a connection area with its one or several edge parts and flexible coating material is used as a component film and it is bent at least at one edge comprising the connection area approximately 90° up- or downwards in order to reduce the surface area that the film needs whereupon the connection area belonging to the mentioned edge moves to the vertical part of the film in order to further reduce the surface area required by the connecting of the module.
  • a packaging method in which an electronic circuit formed of components is connected to a circuitry base either by using soldering knobs or reversing coupling technique or by increasing a copper connection between the circuit and the circuitry base.
  • CSP chip scale package
  • MCM multi chip module
  • circuits and other components are stacked first on bases and these ready-made layers are piled up on top of each other for example by soldering.
  • connections of the modules having one or several layers have been made protruding at the edges of the module in such a way that they take room or the module has been equipped with soldering knobs or corresponding at their bottom and all the films piled up on top of each other are correspondingly connected to each other either by soldering knobs or for example by bonding with a thread.
  • the disadvantage of these is the room that the connection of the module takes at the circuit board after the connections have been established at the edges of the module. Testing of the reciprocal connections of all the films piled up on top of each other is impossible before a ready-made module. Because of this the whole module is defective if only one connection turns out to be a failure.
  • An electronic module which can be bent with the help of wall elements attached to the other side of the component film, is known from the publication JP 4078190 the walls of which electronic module, keep the module in shape in such a way that the module will have an upper surface protected by a wall and side parts that are protected with walls. All the components are connected to the inner part of the module. There is only one film layer in this case. The component density can be improved because the components can be connected also to the vertical sides. The component density will however stay very minor.
  • the present new invention is a three-dimensional packaging method in which a flexible film is utilized.
  • the joint connections are made at the edges of the film structure.
  • a support structure is used at the outer surface of the film and inside the film, if needed. It is characteristic of the method according to the invention that when the module is being formed, several component films (2a - c) are placed on top of each other and bent edges belonging to them are directed to various sides of the module.
  • the structure according to the method can be used in order to package a single circuit or to a module comprising several components.
  • a module can be composed of several separate layers or the layers can be attached to each other with the help of the inner connections of the module.
  • the components are connected to a flexible base by soldering, glueing or increasing the circuitry between the component and the base. There can be components on each side of the base.
  • a support structure is installed underneath the base and a metallic frame is usually laid on top of it. The edges of the flexible film are bent between the support structures.
  • the connection areas of the module are at the edges of the flexible edge - inside or outside.
  • the module is connected to the product usually by soldering or by using connectors meant for the flexible circuit board.
  • the inner support structure can be metal, plastic or other agent possessing the sufficient stiffness or it can be a plastic agent that can be hardened during the manufacturing process.
  • Component layers on the films can be separate whereupon the connections of these layers outside the module are made at various sides of the module.
  • nested structures can be established whereupon one or several sides of the module have several circuitry and support structures on top of one another.
  • the capacity of the module is utilized efficiently and - if needed - the height of the base can vary inside the layers according to the height of the components by scaling or by setting a layer at the bottom of the module to a deviant angle.
  • the methods enables the fact that the testing of the module can be performed as outlines of several modules and in addition to that the capacity of the module has been minimized because the size and thickness differences of the components are taken into consideration when the layers and the shape of the layer are being selected.
  • Figure 1 shows the lid of the module diagonally shown.
  • Figure 2 shows a flexible component film diagonally shown.
  • Figure 3 shows the inner support of the module diagonally shown.
  • Figure 4 shows the module packaged according to the invention.
  • Figure 5 shows a flexible component film as a side view and shown from the end part.
  • Figure 6 shows another flexible component film and shown from the end.
  • Figure 7 shows a third component film as a side view.
  • Figure 8 shows a layer module packaged according to the invention.
  • a support structure 1 that is external to the module which structure is advantageously a metallic lid equipped with edges.
  • a circuit formed on a flexible film 2 with the help of components, for example in the area 4 above the film 2 and/or in the area 6 underneath it.
  • edge parts on the film 2 which edge parts have connection areas 5 in relation to the outer equivalent connectors.
  • inner support 3 of the module which inner support is for example a thin metal sheet or a plastic sheet.
  • a module that is compiled is shown in the figure 4 in a certain scale.
  • the flexible edges of the film 2 have been turned down 90° and the lid 1 and the inner support 3 support the film 2 in such a way that the edge parts stay directed directly downwards.
  • the connection areas 5 are now located at the bottom edge of the module and the connection can be performed via them for example to the counterparts of the circuit board located underneath them.
  • the area 4 of the film 2 can be stiffened with one component that has essentially the size of the area 4 or can be stiffened with several components located in the area 4 in such a way that the overlap lines can be free from the components and the film 2 can be easily bent at the right place.
  • Component films 2a - 2c that can be piled on top of each other are shown in the figures 5, 6 and 7. They all have a flexible film as a material and at least one bendable connecting edge with its connection area 5.
  • the films 2 a - c of the figures 5 - 7 are piled in one case on top of each other in such a way that they don't have any reciprocal connections, but the connections are established only via the areas 5 of the edge parts to the circuit board of to a corresponding place.
  • the films 2 can have components on each side.
  • the films 2 a - c also comprise reciprocal connections and at least one film 2 is bent down at its edge parts and it has a connection area 5 out of the module.

Abstract

Method for packaging a component film (2) with several layers including electronic components in order to be a module equipped with a lid (1) which module comprises a connection area (5) with its one or several edge parts and a flexible film material is used as a component film (2) and it is bent up or downwards at its one edge comprising the connection area (5) approximately 90° in order to reduce the surface area required by the film (2) whereupon the connection area (5) belonging to the mentioned edge moves to the vertical part of the film in order to further reduce the surface area required by the connecting of the module. When the module is being formed, several component films (2 a - c) are located on top of each other and the bent edges belonging to them are directed to various sides of the module.

Description

METHOD FOR PACKAGING A COMPONENT FILM COMPRISING ELECTRONIC COMPONENTS
Invention relates to a method for packaging a component film with several layers including electronic components in order to be a module equipped with a lid which module comprises a connection area with its one or several edge parts and flexible coating material is used as a component film and it is bent at least at one edge comprising the connection area approximately 90° up- or downwards in order to reduce the surface area that the film needs whereupon the connection area belonging to the mentioned edge moves to the vertical part of the film in order to further reduce the surface area required by the connecting of the module.
Previously a packaging method is known in which an electronic circuit formed of components is connected to a circuitry base either by using soldering knobs or reversing coupling technique or by increasing a copper connection between the circuit and the circuitry base. For example CSP (chip scale package) and various MCM (multi chip module) methods are such methods. The original connection areas of the circuit are moved in such a way that the connection areas of the new, protected structure are spread evenly to cover the bottom area of the whole circuit casing. Because there will be less and less connections after this, it enables the connection with simplier and cheaper production methods than what the direct connection methods of the circuit allow.
Also methods, in which circuits and other components are stacked first on bases and these ready-made layers are piled up on top of each other for example by soldering, are known.
Also methods are known in which exposed circuits are arranged in layers on top of each other and circuits are connected electrically after this onto a common base by bonding with a thread. From above mentioned methods for example the publications WO 03039974, US 2005139980, WO 2006089171 and the publication WO 2004073064 can be shown.
In these solutions the connections of the modules having one or several layers have been made protruding at the edges of the module in such a way that they take room or the module has been equipped with soldering knobs or corresponding at their bottom and all the films piled up on top of each other are correspondingly connected to each other either by soldering knobs or for example by bonding with a thread. The disadvantage of these is the room that the connection of the module takes at the circuit board after the connections have been established at the edges of the module. Testing of the reciprocal connections of all the films piled up on top of each other is impossible before a ready-made module. Because of this the whole module is defective if only one connection turns out to be a failure.
An electronic module, which can be bent with the help of wall elements attached to the other side of the component film, is known from the publication JP 4078190 the walls of which electronic module, keep the module in shape in such a way that the module will have an upper surface protected by a wall and side parts that are protected with walls. All the components are connected to the inner part of the module. There is only one film layer in this case. The component density can be improved because the components can be connected also to the vertical sides. The component density will however stay very minor.
The present new invention is a three-dimensional packaging method in which a flexible film is utilized. The joint connections are made at the edges of the film structure. A support structure is used at the outer surface of the film and inside the film, if needed. It is characteristic of the method according to the invention that when the module is being formed, several component films (2a - c) are placed on top of each other and bent edges belonging to them are directed to various sides of the module.
The structure according to the method can be used in order to package a single circuit or to a module comprising several components. A module can be composed of several separate layers or the layers can be attached to each other with the help of the inner connections of the module. The components are connected to a flexible base by soldering, glueing or increasing the circuitry between the component and the base. There can be components on each side of the base. A support structure is installed underneath the base and a metallic frame is usually laid on top of it. The edges of the flexible film are bent between the support structures. The connection areas of the module are at the edges of the flexible edge - inside or outside. The module is connected to the product usually by soldering or by using connectors meant for the flexible circuit board. The inner support structure can be metal, plastic or other agent possessing the sufficient stiffness or it can be a plastic agent that can be hardened during the manufacturing process.
Component layers on the films can be separate whereupon the connections of these layers outside the module are made at various sides of the module.
Also nested structures can be established whereupon one or several sides of the module have several circuitry and support structures on top of one another.
The capacity of the module is utilized efficiently and - if needed - the height of the base can vary inside the layers according to the height of the components by scaling or by setting a layer at the bottom of the module to a deviant angle.
The methods enables the fact that the testing of the module can be performed as outlines of several modules and in addition to that the capacity of the module has been minimized because the size and thickness differences of the components are taken into consideration when the layers and the shape of the layer are being selected.
In the following the invention is described more detailed by referring to the accompanying drawing in which
Figure 1 shows the lid of the module diagonally shown.
Figure 2 shows a flexible component film diagonally shown. Figure 3 shows the inner support of the module diagonally shown.
Figure 4 shows the module packaged according to the invention.
Figure 5 shows a flexible component film as a side view and shown from the end part.
Figure 6 shows another flexible component film and shown from the end.
Figure 7 shows a third component film as a side view. Figure 8 shows a layer module packaged according to the invention.
In the figure 1 a support structure 1 that is external to the module is shown which structure is advantageously a metallic lid equipped with edges. In the figure 2 there is a circuit formed on a flexible film 2 with the help of components, for example in the area 4 above the film 2 and/or in the area 6 underneath it. In addition to that there are edge parts on the film 2 which edge parts have connection areas 5 in relation to the outer equivalent connectors.
In the figure 3 there is inner support 3 of the module which inner support is for example a thin metal sheet or a plastic sheet. A module that is compiled is shown in the figure 4 in a certain scale. The flexible edges of the film 2 have been turned down 90° and the lid 1 and the inner support 3 support the film 2 in such a way that the edge parts stay directed directly downwards. The connection areas 5 are now located at the bottom edge of the module and the connection can be performed via them for example to the counterparts of the circuit board located underneath them. The area 4 of the film 2 can be stiffened with one component that has essentially the size of the area 4 or can be stiffened with several components located in the area 4 in such a way that the overlap lines can be free from the components and the film 2 can be easily bent at the right place.
Component films 2a - 2c that can be piled on top of each other are shown in the figures 5, 6 and 7. They all have a flexible film as a material and at least one bendable connecting edge with its connection area 5. The films 2 a - c of the figures 5 - 7 are piled in one case on top of each other in such a way that they don't have any reciprocal connections, but the connections are established only via the areas 5 of the edge parts to the circuit board of to a corresponding place. The films 2 can have components on each side. In another embodiment the films 2 a - c also comprise reciprocal connections and at least one film 2 is bent down at its edge parts and it has a connection area 5 out of the module.
In the figure 8 there are films 2 a - c that have been packaged to be a module with the help of a lid 1 and an inner support 3. There is a connection from all the films 2 a - c through a connection area of a bent edge part to the circuit board located underneath the films. All the connecting areas 5 are each located at the different side of the module. The edge parts that are bent down are directed directly downwards supported by the edges of the Hd 1 and the edges of the inner support 3 and stay at the bent position.

Claims

1. Method for packaging a component film (2) with several layers including electronic components in order to be a module equipped with a lid (1) which module comprises a connection area (5) with its one or several edge parts and a flexible film material is used as a component film (2) and it is bent up or downwards at its one edge comprising the connection area (5) approximately 90° in order to reduce the surface area required by the film (2) whereupon the connection area (5) belonging to the mentioned edge moves to the vertical part of the film in order to further reduce the surface area required by the connecting of the module, characterized in that when the module is being formed, several component films (2 a - c) are located on top of each other and the bent edges belonging to t55hem are directed to various sides of the module.
2. Method according to the claim 1, characterized in that the bending of the edge of the component film (2) is performed or the bent position is ensured with the help of the lid part (1) of the module which lid comprises the edges.
3. Method according to the claim 1, characterized in that the bending line of the edge of the component film (2) is ensured by locating a component to the area (4) that is meant to stay even on the film which component has essentially the size of the area (4) or by locating several components that stiffen the area (4) and are placed in such a way that is suitable for the purpose.
4. Method according to the claim 1, characterized in that in order to support the module it is equipped with an inner support (3) and with a Hd part (1) equipped with edges.
5. Method according to the claim 1, characterized in that a metallic structure is used as a lid part (1) in order to reduce radio interferences.
6. Method according to the claim 1, characterized in that component films (2) are located se#fal layers on top of each other and they are connected with each other inside the mόmile and at least one film (2) is equipped with a bent edge part.
7. Method according to the claim 1, characterized in that a film, to each side of which electronic components have been connected, is used as a component film (2).
PCT/FI2008/000041 2008-03-14 2008-03-14 Method for packaging a component film comprising electronic components WO2009112626A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/FI2008/000041 WO2009112626A1 (en) 2008-03-14 2008-03-14 Method for packaging a component film comprising electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/FI2008/000041 WO2009112626A1 (en) 2008-03-14 2008-03-14 Method for packaging a component film comprising electronic components

Publications (1)

Publication Number Publication Date
WO2009112626A1 true WO2009112626A1 (en) 2009-09-17

Family

ID=41064793

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FI2008/000041 WO2009112626A1 (en) 2008-03-14 2008-03-14 Method for packaging a component film comprising electronic components

Country Status (1)

Country Link
WO (1) WO2009112626A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19861112A1 (en) * 1998-03-11 2001-08-30 Freudenberg Carl Fa Housing with a contact area
JP2002078158A (en) * 2000-08-31 2002-03-15 Sumitomo Wiring Syst Ltd Assembling method for electric junction box
US20020051349A1 (en) * 2000-10-31 2002-05-02 Yazaki Corporation Structure of drawing out flexible circuit member
US6417027B1 (en) * 1999-06-10 2002-07-09 Micron Technology, Inc. High density stackable and flexible substrate-based devices and systems and methods of fabricating
JP2005303243A (en) * 2004-03-15 2005-10-27 Hitachi Chem Co Ltd Printed circuit board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19861112A1 (en) * 1998-03-11 2001-08-30 Freudenberg Carl Fa Housing with a contact area
US6417027B1 (en) * 1999-06-10 2002-07-09 Micron Technology, Inc. High density stackable and flexible substrate-based devices and systems and methods of fabricating
JP2002078158A (en) * 2000-08-31 2002-03-15 Sumitomo Wiring Syst Ltd Assembling method for electric junction box
US20020051349A1 (en) * 2000-10-31 2002-05-02 Yazaki Corporation Structure of drawing out flexible circuit member
JP2005303243A (en) * 2004-03-15 2005-10-27 Hitachi Chem Co Ltd Printed circuit board

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