WO2009090098A3 - Method and apparatus for producing a solar cell - Google Patents
Method and apparatus for producing a solar cell Download PDFInfo
- Publication number
- WO2009090098A3 WO2009090098A3 PCT/EP2009/000279 EP2009000279W WO2009090098A3 WO 2009090098 A3 WO2009090098 A3 WO 2009090098A3 EP 2009000279 W EP2009000279 W EP 2009000279W WO 2009090098 A3 WO2009090098 A3 WO 2009090098A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- conductor material
- silicon substrate
- producing
- solar cell
- laser beam
- Prior art date
Links
- 239000004020 conductor Substances 0.000 abstract 7
- 239000000463 material Substances 0.000 abstract 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 5
- 229910052710 silicon Inorganic materials 0.000 abstract 5
- 239000010703 silicon Substances 0.000 abstract 5
- 239000000758 substrate Substances 0.000 abstract 5
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 235000011837 pasties Nutrition 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/048—Coating on selected surface areas, e.g. using masks using irradiation by energy or particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
In a method for producing a solar cell by application of electrically conductive conductor material (21, 25) onto one side (14, 15) of a silicon substrate (13), a conductor material carrier (18) is arranged at a distance from the silicon substrate (13). The conductor material carrier (18) is transparent and has a pasty conductor material (21) on a side (20) facing the silicon substrate (13). A focused laser beam (23) is injected onto that side (19) of the conductor material carrier (18) which is remote from the silicon substrate (13) in order to detach the conductor material (21, 25) in a special form corresponding to the points or lines on which the laser beam (23) impinges. In this case, the detached conductor material (21, 25) is transferred to the opposite surface (14, 15) of the silicon substrate (13). There, a desired structure which is solidified by baking is formed.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008005845.9 | 2008-01-17 | ||
DE102008005845 | 2008-01-17 | ||
DE102008057228A DE102008057228A1 (en) | 2008-01-17 | 2008-11-04 | Method and device for producing a solar cell |
DE102008057228.4 | 2008-11-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009090098A2 WO2009090098A2 (en) | 2009-07-23 |
WO2009090098A3 true WO2009090098A3 (en) | 2010-03-25 |
Family
ID=40785517
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2009/000279 WO2009090098A2 (en) | 2008-01-17 | 2009-01-17 | Method and apparatus for producing a solar cell |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE102008057228A1 (en) |
WO (1) | WO2009090098A2 (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009020774B4 (en) * | 2009-05-05 | 2011-01-05 | Universität Stuttgart | Method for contacting a semiconductor substrate |
DE102009053776A1 (en) * | 2009-11-19 | 2011-06-01 | Systaic Cells Gmbh | Emitter formation with a laser |
DE102009059042A1 (en) | 2009-12-10 | 2011-06-16 | Schmid Technology Gmbh | Method and device for transferring printing substance from a printing substrate to a substrate |
GB201009847D0 (en) * | 2010-06-11 | 2010-07-21 | Dzp Technologies Ltd | Deposition method, apparatus, printed object and uses |
DE102011075025A1 (en) * | 2011-04-29 | 2012-10-31 | Schmid Technology Gmbh | Method and device for applying printing substance |
DE102011103481B4 (en) * | 2011-06-03 | 2017-08-17 | Leibniz-Institut für Oberflächenmodifizierung e.V. | Selective removal of thin layers by means of pulsed laser radiation for thin-film structuring |
DE102011077462A1 (en) * | 2011-06-14 | 2012-12-20 | Robert Bosch Gmbh | Method, arrangement and process aid for producing a crystalline solar cell |
DE102011077450A1 (en) * | 2011-06-14 | 2012-12-20 | Robert Bosch Gmbh | Method and device for producing a crystalline solar cell |
DE102011085714A1 (en) * | 2011-11-03 | 2013-05-08 | Boraident Gmbh | Method and device for generating a laser-supported electrically conductive contacting of an object surface |
EP2731126A1 (en) | 2012-11-09 | 2014-05-14 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Method for bonding bare chip dies |
CN106687617B (en) * | 2014-07-15 | 2020-04-07 | 奈特考尔技术公司 | Laser transfer IBC solar cell |
DE102017110040B4 (en) | 2017-05-10 | 2020-08-27 | LPKF SolarQuipment GmbH | Printing device and printing method for transferring a printing substance from an endlessly rotating printing substance carrier to a substrate |
WO2020152352A1 (en) * | 2019-01-25 | 2020-07-30 | Mycronic AB | Laser induced forward transfer with high throughput and recycling of donor material on a transparent drum |
CN111276566B (en) * | 2020-01-21 | 2022-06-07 | 中国海洋大学 | All-inorganic perovskite solar cell prepared based on liquid phase continuous spin coating direct phase transition method and preparation method and application thereof |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0331022A2 (en) * | 1988-03-01 | 1989-09-06 | Texas Instruments Incorporated | Radiation induced pattern deposition |
US5725706A (en) * | 1996-03-12 | 1998-03-10 | The Whitaker Corporation | Laser transfer deposition |
US5935462A (en) * | 1994-10-24 | 1999-08-10 | Matsushita Electric Industrial Co., Ltd. | Repair of metal lines by electrostatically assisted laser ablative deposition |
US6159832A (en) * | 1998-03-18 | 2000-12-12 | Mayer; Frederick J. | Precision laser metallization |
-
2008
- 2008-11-04 DE DE102008057228A patent/DE102008057228A1/en not_active Withdrawn
-
2009
- 2009-01-17 WO PCT/EP2009/000279 patent/WO2009090098A2/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0331022A2 (en) * | 1988-03-01 | 1989-09-06 | Texas Instruments Incorporated | Radiation induced pattern deposition |
US5935462A (en) * | 1994-10-24 | 1999-08-10 | Matsushita Electric Industrial Co., Ltd. | Repair of metal lines by electrostatically assisted laser ablative deposition |
US5725706A (en) * | 1996-03-12 | 1998-03-10 | The Whitaker Corporation | Laser transfer deposition |
US6159832A (en) * | 1998-03-18 | 2000-12-12 | Mayer; Frederick J. | Precision laser metallization |
Also Published As
Publication number | Publication date |
---|---|
DE102008057228A1 (en) | 2009-07-23 |
WO2009090098A2 (en) | 2009-07-23 |
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