WO2009089565A1 - Printhead with exterior surface profiled for wiping maintenance station - Google Patents
Printhead with exterior surface profiled for wiping maintenance station Download PDFInfo
- Publication number
- WO2009089565A1 WO2009089565A1 PCT/AU2008/000043 AU2008000043W WO2009089565A1 WO 2009089565 A1 WO2009089565 A1 WO 2009089565A1 AU 2008000043 W AU2008000043 W AU 2008000043W WO 2009089565 A1 WO2009089565 A1 WO 2009089565A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- printhead
- printhead assembly
- assembly according
- nozzle face
- ics
- Prior art date
Links
- 238000012423 maintenance Methods 0.000 title description 4
- 239000003822 epoxy resin Substances 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- 239000008393 encapsulating agent Substances 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 4
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 230000009974 thixotropic effect Effects 0.000 claims description 2
- 238000000465 moulding Methods 0.000 description 18
- 229920000106 Liquid crystal polymer Polymers 0.000 description 6
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 6
- 239000011324 bead Substances 0.000 description 6
- 239000000356 contaminant Substances 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 5
- 239000000428 dust Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- CXXRQFOKRZJAJA-UHFFFAOYSA-N 1,2,3,5-tetrachloro-4-(2,5-dichlorophenyl)benzene Chemical compound ClC1=CC=C(Cl)C(C=2C(=C(Cl)C(Cl)=CC=2Cl)Cl)=C1 CXXRQFOKRZJAJA-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011440 grout Substances 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1606—Coating the nozzle area or the ink chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/145—Arrangement thereof
- B41J2/155—Arrangement thereof for line printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J25/00—Actions or mechanisms not otherwise provided for
- B41J25/34—Bodily-changeable print heads or carriages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/20—Modules
Definitions
- the present invention relates to the field of inkjet printing and in particular, inkjet printers with pagewidth printheads.
- Pagewidth printheads increase print speeds as the printhead does not traverse back and forth across the page to deposit a line of an image.
- the pagewidth printhead simply deposits the ink on the media as it moves past at high speeds.
- Such printheads have made it possible to perform full colour 1600dpi printing at speeds in the vicinity of 60 pages per minute, speeds previously unattainable with conventional inkjet printers.
- the high resolution and print speeds are largely due to the self cooling operation of the printheads. Excess heat does not build up in the nozzles because it is removed from the printhead with the ejected ink drops. This allows the nozzles to be closer together and the nozzle firing rate is limited only by the ink refill rate.
- the self cooling operation relies on low ejection energies which in turn correspond to small nozzles and low drop volumes. Another factor that assists low energy ejection is a short nozzle aperture length.
- the nozzles define a geometric shape (typically circular or elliptical) and the aperture length is the thickness of the structure (such as a nozzle plate) which defines the nozzle.
- a long nozzle aperture length has a high fluidic drag on the ink drop as it is ejected through the nozzle.
- the Applicant's printhead designs keep the nozzle aperture length relatively short (less than 5 microns).
- the small nozzles clog easily and paper dust or dried ink on the nozzle face (the exterior surface defining the array of nozzle apertures) can cause color mixing between closely spaced nozzles of different color.
- the paper dust and other contaminants can be removed by wiping the nozzle face.
- contact pressure with wiper is critical for effective cleaning. Unfortunately, the pressure needed for effective cleaning can damage the delicate structures of the printhead IC.
- the present invention provides a printhead assembly for an inkjet printer, the printhead assembly comprising: an elongate printhead IC having a nozzle face defining an array of nozzles; a support structure for supporting the elongate printhead IC on an external surface such that its length is transverse to a media feed direction through the printer; wherein, the external surface being configured such that it has a section that is flush with a long side edge of the elongate printhead IC.
- the invention mounts the printhead ICs so that a wiping surface is guided on to the nozzle face rather impacting on a side of the printhead IC sitting proud of the mounting surface. This allows the wiper to effectively clean the nozzle face without using a contact pressure that damages the delicate nozzle structures.
- the Applicant's work has found that a printhead IC mounted such that it sits proud of the external surface requires a wiper to have a high contact force for it to clean the nozzle face. However, the force is damaging to the printhead IC and in particular the edge that first contacts the wiper. Reducing the contact force causes the wiper blade to bounce off the edge of the printhead IC and bounce several times across the nozzle face. Consequently, the wiper does not contact the nozzle face at several points and hence fails to clean away contaminants.
- the printhead assembly has a plurality of elongate printhead ICs mounted end to end on the support structure such that in use the printhead assembly is a pagewidth printhead and the long side edge of each of the printhead ICs align with each other.
- the support structure has an epoxy resin adjacent the long side edges of the printhead ICs, the epoxy resin being profiled such that it is flush with the nozzle faces of the printhead ICs.
- the printhead ICs each have a line of wire bonds along a trailing long side edge opposite the long side edge adjacent the epoxy resin.
- the epoxy resin is thixotropic prior to setting.
- the wire bonds are encased in encapsulant profiled to present a surface inclined upwardly from the nozzle face.
- the nozzle face is planar.
- the nozzle face is lithographically deposited silicon dioxide.
- the nozzle face is lithographically deposited silicon nitride.
- the printhead assembly is provided as a printhead cartridge for user insertion and removal from a printer.
- Figure 1 shows the printhead cartridge of the present invention installed the print engine of a printer
- Figure 2 shows the print engine without the printhead cartridge installed to expose the inlet and outlet ink couplings
- Figure 3 is a perspective of the complete printhead cartridge according to the present invention
- Figure 4 shows the printhead cartridge of Fig. 3 with the protective cover removed
- Figure 5 is an exploded is a partial perspective of the printhead assembly within the printhead cartridge of Fig. 3;
- Figure 6 is an exploded perspective of the printhead assembly without the inlet or outlet manifolds or the top cover molding;
- Figures 7A and 7B are partial section views of the printhead assembly with the wiper blade cleaning the nozzle face.
- Figure 1 shows a printhead cartridge 2 installed in a print engine 3.
- the print engine 3 is the mechanical heart of a printer which can have many different external casing shapes, ink tank locations and capacities, as well as different media feed and collection trays.
- the printhead cartridge 2 is inserted and removed by the user lifting and lowering the latch 126.
- the print engine 3 forms an electrical connection with contacts on the printhead cartridge 2 and a fluid coupling is formed via the sockets 120 and the inlet and outlet manifolds, 48 and 50 respectively.
- Figure 2 shows the print engine 3 with the printhead cartridge removed to reveal the apertures 122 in each of the sockets 120.
- Each aperture 122 receives one of the spouts 52 on the inlet and outlet manifolds.
- the ink tanks have an arbitrary position and configuration but simply connect to hollow spigots 124 at the rear of the sockets 120.
- Figure 3 is a perspective of the complete printhead cartridge 2.
- the top molding 44 has a central web for structural stiffness and to provide grip textured surfaces 58 for manipulating the cartridge during insertion and removal.
- the base portion of the protective cover 42 protects the printhead ICs (not shown) and line of contacts (not shown) prior to installation in the printer.
- Caps 56 are integrally formed with the base portion and cover the ink inlets and outlets (see 54 and 52 of Fig. 5).
- Figure 4 shows the printhead assembly 2 with its protective cover 42 removed to expose the printhead ICs on the bottom surface and the line of contacts 33 on the side surface.
- the protective cover is discarded to the recycling waste or fitted to the printhead cartridge being replaced to contain leakage from residual ink.
- Figure 5 is a partially exploded perspective of the printhead assembly 2.
- the top cover 44 has been removed reveal the inlet manifold 48 and the outlet manifold 50.
- the inlet and outlet shrouds 46 and 47 have been removed to better expose the five inlet and outlet spouts 52.
- the inlet and outlet manifolds 48 and 50 form a fluid connection between each of the individual inlets and outlets and the corresponding main channel in the LCP molding.
- the main channel extends the length of the LCP molding and it feeds a series of fine channels on the underside of the LCP molding.
- a line of air cavities are formed above each of the main channels 24. Any shock waves or pressure pulses in the ink are damped by compressing the air the air cavities.
- Figure 6 is an exploded perspective of the printhead assembly without the inlet or outlet manifolds or the top cover molding.
- the main channels 24 for each ink color and their associated air cavities 26 are formed in the channel molding 68 and the cavity molding 72 respectively.
- Adhered to the bottom of the channel molding 68 is a die attach film 66.
- the die attach film 66 mounts the printhead ICs 31 to the channel molding such that the fine channels on the underside of the channel molding 68 are in fluid communication with the printhead ICs 31 via small laser ablated holes through the film.
- Both the channel molding 68 and the top cover molding 72 are molded from LCP (liquid crystal polymer) because of its stiffness and coefficient of thermal expansion that closely matches that of silicon. It will be appreciated that a relatively long structure such as a pagewidth printhead should minimize any thermal expansion differences between the silicon substrate of the printhead ICs 31 and their supporting structure.
- Figures 7A and 7B are partial section views of the printhead assembly being cleaned by a wiper blade actuated by the printhead maintenance facility of the print engine 3. The operation of the printhead maintenance facility is described in detail in the Applicant's copending US Patent Application, Our Docket N0.RREOI6US, the contents of which is incorporated by reference.
- Figure 7A shows the cavity molding 72 with the air cavities 26, the channel molding 68 defining the main channels 24.
- a die attach film 66 is adhered to the underside of the channel molding 68 and the printhead ICs 31 are mounted end to end to extend the width of the print media.
- a paper guide 140 attaches to the front of the LCP moldings 68 and 72. This sets the gap between the nozzles and the media substrate during printing.
- a layer of epoxy resin 130 is applied to the die attach film 66.
- the resin layer 130 contacts the wiper blade 138 as it moves across the exterior face of the printhead assembly.
- the thickness of the resin layer 130 is controlled such that it is flush with the nozzle faces of the printhead ICs 31. This essentially grouts the step created by the side of the printhead ICs 31.
- the front edges of the printhead ICs are shielded from hard impacts with the wiper. Consequently, there is less damage and wear to the printhead ICs 31 and the wiper can clean effectively using only a modest contact force. Impact with the front edge of the nozzle face can cause the wiper blade to bounce and lose contact with he printhead IC.
- the printhead ICs are fabricated such that the nozzle face is planarized. A flat nozzle face cleans more easily as dust and contaminants have little to anchor to apart from the nozzle openings themselves. This process has been described in detail in the Applicant co-pending USSN 11/877667 (Our Docket No. MPNO 13US), the contents of which are incorporated by reference. Briefly, the nozzle structures have a layer of photo resist deposited over them which is then sealed under a nozzle face layer of silicon oxide and or silicon nitride. The relatively hard silicon nitride or silicon oxide has better wear resistance than printhead ICs with a nozzle face of polymer resist material.
- Figure 7B shows the wiper blade 138 at the trailing edge of the printhead IC 31.
- the wiper pushes a bead 136 of dust and contaminants ahead of itself.
- a bead of encapsulant material 132 At the trailing edge is a bead of encapsulant material 132.
- the encapsulant 132 encases the wire bonds (not shown) that transmit power and print data to the printhead ICs 31.
- the power and data are fed from the print engine controller (not shown) to a line of contacts 142 at the edge of a flex PCB 144.
- the flex PCB 144 wraps around to a recessed surface 146 on the underside of the printhead assembly.
- Recessing the flex PCB relative to the printhead IC lowers the height of the wire bond loops and therefore allows the encapsulant bead 132 to be lower.
- the Applicant uses this to advantage by profiling the encapsulant bead 132 to form an inclined surface 134 ramping up from the nozzle face of the printhead IC.
- the inclined surface 134 pushes the contaminant bead 136 firmly up onto the wiper 138.
- the wiper 138 eventually lifts off the exterior surface, the contaminant bead 136 is much less likely to remain on the printhead.
- the encapsulant 132 and the epoxy resin layer 130 are the same polymer material.
- the polymer material should be thixorropic; that is, it should not flow under its own weight. In this way, the encapsulant 132 and the grout epoxy 130 can be accurately profiled and shaped without risk of the material flowing to a different shape.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Ink Jet (AREA)
Abstract
A printhead assembly with an elongate printhead IC having a nozzle face defining an array of nozzles, and a support structure for supporting the elongate printhead IC on an external surface such that its length is transverse to a media feed direction through the printer. The external surface has a section that is flush with a long side edge of the elongate printhead IC.
Description
PRINTHEAD WITH EXTERIOR SURFACE PROFILED FOR WIPING
MAINTENANCE STATION
FIELD OF THE INVENTION The present invention relates to the field of inkjet printing and in particular, inkjet printers with pagewidth printheads.
BACKGROUND OF THE INVENTION
The Applicant has developed a wide range of printers that employ pagewidth printheads instead of traditional reciprocating printhead designs. Pagewidth designs increase print speeds as the printhead does not traverse back and forth across the page to deposit a line of an image. The pagewidth printhead simply deposits the ink on the media as it moves past at high speeds. Such printheads have made it possible to perform full colour 1600dpi printing at speeds in the vicinity of 60 pages per minute, speeds previously unattainable with conventional inkjet printers.
The high resolution and print speeds are largely due to the self cooling operation of the printheads. Excess heat does not build up in the nozzles because it is removed from the printhead with the ejected ink drops. This allows the nozzles to be closer together and the nozzle firing rate is limited only by the ink refill rate. The self cooling operation relies on low ejection energies which in turn correspond to small nozzles and low drop volumes. Another factor that assists low energy ejection is a short nozzle aperture length. The nozzles define a geometric shape (typically circular or elliptical) and the aperture length is the thickness of the structure (such as a nozzle plate) which defines the nozzle. A long nozzle aperture length has a high fluidic drag on the ink drop as it is ejected through the nozzle. The Applicant's printhead designs keep the nozzle aperture length relatively short (less than 5 microns).
The small nozzles clog easily and paper dust or dried ink on the nozzle face (the exterior surface defining the array of nozzle apertures) can cause color mixing between closely spaced nozzles of different color. The paper dust and other contaminants can be removed by wiping the nozzle face. However, contact pressure with wiper is critical for effective cleaning. Unfortunately, the pressure needed for effective cleaning can damage the delicate structures of the printhead IC.
SUMMARY OF THE INVENTION
Accordingly, the present invention provides a printhead assembly for an inkjet printer, the printhead assembly comprising: an elongate printhead IC having a nozzle face defining an array of nozzles; a support structure for supporting the elongate printhead IC on an external surface such that its length is transverse to a media feed direction through the printer; wherein, the external surface being configured such that it has a section that is flush with a long side edge of the elongate printhead IC.
The invention mounts the printhead ICs so that a wiping surface is guided on to the nozzle face rather impacting on a side of the printhead IC sitting proud of the mounting surface. This allows the wiper to effectively clean the nozzle face without using a contact pressure that damages the delicate nozzle structures. The Applicant's work has found that a printhead IC mounted such that it sits proud of the external surface requires a wiper to have a high contact force for it to clean the nozzle face. However, the force is damaging to the printhead IC and in particular the edge that first contacts the wiper. Reducing the contact force causes the wiper blade to bounce off the edge of the printhead IC and bounce several times across the nozzle face. Consequently, the wiper does not contact the nozzle face at several points and hence fails to clean away contaminants.
Preferably, the printhead assembly has a plurality of elongate printhead ICs mounted end to end on the support structure such that in use the printhead assembly is a pagewidth printhead and the long side edge of each of the printhead ICs align with each other. Preferably, the support structure has an epoxy resin adjacent the long side edges of the printhead ICs, the epoxy resin being profiled such that it is flush with the nozzle faces of the printhead ICs. Preferably, the printhead ICs each have a line of wire bonds along a trailing long side edge opposite the long side edge adjacent the epoxy resin. Preferably, the epoxy resin is thixotropic prior to setting. Preferably, the wire bonds are encased in encapsulant profiled to present a surface inclined upwardly from the nozzle face. Preferably, the nozzle face is planar. In a further preferred form, the nozzle face is lithographically deposited silicon dioxide. Optionally, the nozzle face is lithographically deposited silicon nitride. Preferably, the printhead assembly is provided as a printhead cartridge for user insertion and removal from a printer.
BRIEF DESCRIPTION OF THE DRAWINGS
Preferred embodiments of the invention will now be described by way of example only, with reference to the accompanying drawings, in which:
Figure 1 shows the printhead cartridge of the present invention installed the print engine of a printer;
Figure 2 shows the print engine without the printhead cartridge installed to expose the inlet and outlet ink couplings; Figure 3 is a perspective of the complete printhead cartridge according to the present invention;
Figure 4 shows the printhead cartridge of Fig. 3 with the protective cover removed;
Figure 5 is an exploded is a partial perspective of the printhead assembly within the printhead cartridge of Fig. 3; Figure 6 is an exploded perspective of the printhead assembly without the inlet or outlet manifolds or the top cover molding; and,
Figures 7A and 7B are partial section views of the printhead assembly with the wiper blade cleaning the nozzle face.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
Figure 1 shows a printhead cartridge 2 installed in a print engine 3. The print engine 3 is the mechanical heart of a printer which can have many different external casing shapes, ink tank locations and capacities, as well as different media feed and collection trays. The printhead cartridge 2 is inserted and removed by the user lifting and lowering the latch 126. The print engine 3 forms an electrical connection with contacts on the printhead cartridge 2 and a fluid coupling is formed via the sockets 120 and the inlet and outlet manifolds, 48 and 50 respectively. Figure 2 shows the print engine 3 with the printhead cartridge removed to reveal the apertures 122 in each of the sockets 120. Each aperture 122 receives one of the spouts 52 on the inlet and outlet manifolds. As discussed above, the ink tanks have an arbitrary position and configuration but simply connect to hollow spigots 124 at the rear of the sockets 120.
Figure 3 is a perspective of the complete printhead cartridge 2. The printhead cartridge
2 has a top molding 44 and a removable protective cover 42. The top molding 44 has a central web for structural stiffness and to provide grip textured surfaces 58 for manipulating the
cartridge during insertion and removal. The base portion of the protective cover 42 protects the printhead ICs (not shown) and line of contacts (not shown) prior to installation in the printer. Caps 56 are integrally formed with the base portion and cover the ink inlets and outlets (see 54 and 52 of Fig. 5).
Figure 4 shows the printhead assembly 2 with its protective cover 42 removed to expose the printhead ICs on the bottom surface and the line of contacts 33 on the side surface. The protective cover is discarded to the recycling waste or fitted to the printhead cartridge being replaced to contain leakage from residual ink. Figure 5 is a partially exploded perspective of the printhead assembly 2. The top cover 44 has been removed reveal the inlet manifold 48 and the outlet manifold 50. The inlet and outlet shrouds 46 and 47 have been removed to better expose the five inlet and outlet spouts 52. The inlet and outlet manifolds 48 and 50 form a fluid connection between each of the individual inlets and outlets and the corresponding main channel in the LCP molding. The main channel extends the length of the LCP molding and it feeds a series of fine channels on the underside of the LCP molding. A line of air cavities are formed above each of the main channels 24. Any shock waves or pressure pulses in the ink are damped by compressing the air the air cavities.
Figure 6 is an exploded perspective of the printhead assembly without the inlet or outlet manifolds or the top cover molding. The main channels 24 for each ink color and their associated air cavities 26 are formed in the channel molding 68 and the cavity molding 72 respectively. Adhered to the bottom of the channel molding 68 is a die attach film 66. The die attach film 66 mounts the printhead ICs 31 to the channel molding such that the fine channels on the underside of the channel molding 68 are in fluid communication with the printhead ICs 31 via small laser ablated holes through the film.
Both the channel molding 68 and the top cover molding 72 are molded from LCP (liquid crystal polymer) because of its stiffness and coefficient of thermal expansion that closely matches that of silicon. It will be appreciated that a relatively long structure such as a pagewidth printhead should minimize any thermal expansion differences between the silicon substrate of the printhead ICs 31 and their supporting structure.
Figures 7A and 7B are partial section views of the printhead assembly being cleaned by a wiper blade actuated by the printhead maintenance facility of the print engine 3. The operation of the printhead maintenance facility is described in detail in the Applicant's copending US Patent Application, Our Docket N0.RREOI6US, the contents of which is incorporated by reference. Figure 7A shows the cavity molding 72 with the air cavities 26, the channel molding 68 defining the main channels 24. A die attach film 66 is adhered to the underside of the channel molding 68 and the printhead ICs 31 are mounted end to end to extend the width of the print media. A paper guide 140 attaches to the front of the LCP moldings 68 and 72. This sets the gap between the nozzles and the media substrate during printing.
A layer of epoxy resin 130 is applied to the die attach film 66. The resin layer 130 contacts the wiper blade 138 as it moves across the exterior face of the printhead assembly. The thickness of the resin layer 130 is controlled such that it is flush with the nozzle faces of the printhead ICs 31. This essentially grouts the step created by the side of the printhead ICs 31. With the resin layer 130 guiding the wiper blade 138 onto the nozzle face, the front edges of the printhead ICs are shielded from hard impacts with the wiper. Consequently, there is less damage and wear to the printhead ICs 31 and the wiper can clean effectively using only a modest contact force. Impact with the front edge of the nozzle face can cause the wiper blade to bounce and lose contact with he printhead IC.
The printhead ICs are fabricated such that the nozzle face is planarized. A flat nozzle face cleans more easily as dust and contaminants have little to anchor to apart from the nozzle openings themselves. This process has been described in detail in the Applicant co-pending USSN 11/877667 (Our Docket No. MPNO 13US), the contents of which are incorporated by reference. Briefly, the nozzle structures have a layer of photo resist deposited over them which is then sealed under a nozzle face layer of silicon oxide and or silicon nitride. The relatively hard silicon nitride or silicon oxide has better wear resistance than printhead ICs with a nozzle face of polymer resist material.
Figure 7B shows the wiper blade 138 at the trailing edge of the printhead IC 31. The wiper pushes a bead 136 of dust and contaminants ahead of itself. At the trailing edge is a bead of encapsulant material 132. The encapsulant 132 encases the wire bonds (not shown) that transmit power and print data to the printhead ICs 31. The power and data are fed from the print engine controller (not shown) to a line of contacts 142 at the edge of a flex PCB 144. The flex PCB 144 wraps around to a recessed surface 146 on the underside of the printhead assembly. Recessing the flex PCB relative to the printhead IC lowers the height of the wire bond loops and therefore allows the
encapsulant bead 132 to be lower. The Applicant uses this to advantage by profiling the encapsulant bead 132 to form an inclined surface 134 ramping up from the nozzle face of the printhead IC. The inclined surface 134 pushes the contaminant bead 136 firmly up onto the wiper 138. When the wiper 138 eventually lifts off the exterior surface, the contaminant bead 136 is much less likely to remain on the printhead.
For convenience, the encapsulant 132 and the epoxy resin layer 130 are the same polymer material. The polymer material should be thixorropic; that is, it should not flow under its own weight. In this way, the encapsulant 132 and the grout epoxy 130 can be accurately profiled and shaped without risk of the material flowing to a different shape.
Claims
1. A printhead assembly for an inkjet printer, the printhead assembly comprising: an elongate printhead IC having a nozzle face defining an array of nozzles; a support structure for supporting the elongate printhead IC on an external surface such that its length is transverse to a media feed direction through the printer; wherein, the external surface being configured such that it has a section that is flush with a long side edge of the elongate printhead IC.
2. A printhead assembly according to claim 1 wherein the printhead assembly has a plurality of elongate printhead ICs mounted end to end on the support structure such that in use the printhead assembly is a pagewidth printhead and the long side edge of each of the printhead ICs align with each other.
3. A printhead assembly according to claim 2 wherein the support structure has an epoxy resin adjacent the long side edges of the printhead ICs, the epoxy resin being profiled such that it is flush with the nozzle faces of the printhead ICs.
4. A printhead assembly according to claim 3 wherein the printhead ICs each have a line of wire bonds along a trailing long side edge opposite the long side edge adjacent the epoxy resin.
5. A printhead assembly according to claim 4 wherein the epoxy resin is thixotropic prior to setting.
6. A printhead assembly according to claim 4 wherein the wire bonds are encased in encapsulant profiled to present a surface inclined upwardly from the nozzle face.
7. A printhead assembly according to claim 1 wherein the nozzle face is planar.
8. A printhead assembly according to claim 1 wherein the nozzle face is lithographically deposited silicon dioxide.
9. A printhead assembly according to claim 8 wherein the nozzle face is lithographically deposited silicon nitride.
10. A printhead assembly according to claim 1 wherein the printhead assembly is provided as a printhead cartridge for user insertion and removal from a printer.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/AU2008/000043 WO2009089565A1 (en) | 2008-01-16 | 2008-01-16 | Printhead with exterior surface profiled for wiping maintenance station |
EP08700341.4A EP2252462B1 (en) | 2008-01-16 | 2008-01-16 | Printhead with exterior surface profiled for wiping maintenance station |
TW097116116A TW200932536A (en) | 2008-01-16 | 2008-05-01 | Printhead with exterior surface profiled for wiping maintenance station |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/AU2008/000043 WO2009089565A1 (en) | 2008-01-16 | 2008-01-16 | Printhead with exterior surface profiled for wiping maintenance station |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009089565A1 true WO2009089565A1 (en) | 2009-07-23 |
Family
ID=40884980
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/AU2008/000043 WO2009089565A1 (en) | 2008-01-16 | 2008-01-16 | Printhead with exterior surface profiled for wiping maintenance station |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP2252462B1 (en) |
TW (1) | TW200932536A (en) |
WO (1) | WO2009089565A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10369793B2 (en) | 2015-10-15 | 2019-08-06 | Hewlett-Packard Development Company, L.P. | Service structures in print heads |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2134377B1 (en) * | 2007-02-28 | 2012-07-18 | Symrise AG | Fragrance dispenser |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09150521A (en) * | 1995-11-29 | 1997-06-10 | Funai Electric Co Ltd | Wiper for cleaning print head |
US20020122097A1 (en) | 1999-10-29 | 2002-09-05 | Beerling Timothy E. | Electrical interconnect for an inkjet die |
US20060098040A1 (en) * | 2004-11-09 | 2006-05-11 | Samsung Electronics Co., Ltd. | Inkjet image forming apparatus comprising a nozzle cleaning unit and method of using the same |
-
2008
- 2008-01-16 WO PCT/AU2008/000043 patent/WO2009089565A1/en active Application Filing
- 2008-01-16 EP EP08700341.4A patent/EP2252462B1/en not_active Not-in-force
- 2008-05-01 TW TW097116116A patent/TW200932536A/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09150521A (en) * | 1995-11-29 | 1997-06-10 | Funai Electric Co Ltd | Wiper for cleaning print head |
US20020122097A1 (en) | 1999-10-29 | 2002-09-05 | Beerling Timothy E. | Electrical interconnect for an inkjet die |
US20060098040A1 (en) * | 2004-11-09 | 2006-05-11 | Samsung Electronics Co., Ltd. | Inkjet image forming apparatus comprising a nozzle cleaning unit and method of using the same |
Non-Patent Citations (1)
Title |
---|
See also references of EP2252462A4 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10369793B2 (en) | 2015-10-15 | 2019-08-06 | Hewlett-Packard Development Company, L.P. | Service structures in print heads |
Also Published As
Publication number | Publication date |
---|---|
TW200932536A (en) | 2009-08-01 |
EP2252462A4 (en) | 2013-04-03 |
EP2252462A1 (en) | 2010-11-24 |
EP2252462B1 (en) | 2015-01-07 |
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