WO2009084392A1 - Molding die apparatus and method for manufacturing molded resin article - Google Patents
Molding die apparatus and method for manufacturing molded resin article Download PDFInfo
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- WO2009084392A1 WO2009084392A1 PCT/JP2008/072426 JP2008072426W WO2009084392A1 WO 2009084392 A1 WO2009084392 A1 WO 2009084392A1 JP 2008072426 W JP2008072426 W JP 2008072426W WO 2009084392 A1 WO2009084392 A1 WO 2009084392A1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/006—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor using an electrostatic field for applying the material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
- B29C33/424—Moulding surfaces provided with means for marking or patterning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/756—Microarticles, nanoarticles
Definitions
- the mold apparatus has a plurality of switches 3a to 3e capable of turning on / off the plurality of second electrodes 2a to 2e.
- a control unit (not shown) that performs ON / OFF control of the switches 3a to 3e is provided.
- the speed at which the resin spreads into the mold can be controlled, and a low viscosity resin (several hundred cp or less) is filled into a mold having a fine structure of several tens of nanometers to several hundred ⁇ m. Even in this case, there is no risk of entrainment of bubbles, and generation of voids can be prevented.
- the nozzle 14 is conductive, it can also be used as the first electrode, and the nozzle 14 and the second electrodes 12a to 12e inside the insulating layer 11b are electrically connected.
- Other configurations are the same as those of the first embodiment.
- the mold apparatus has a simple configuration as compared with the first embodiment, and the mold apparatus can be manufactured relatively easily.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Abstract
A molding die apparatus is provided with a molding die (1) to be filled with a resin (6); a nozzle (4) for supplying the resin (6); a first electrode and a second electrode; an insulating layer (1b) which is arranged between the first electrode and the second electrode and constitutes a part of the molding die (1); a plurality of switches for applying voltages to the both first and second electrodes; and a control section for controlling the switches to be turned on and off. The molding die (1) in the molding die apparatus is filled with the resin (6) by an electrostatic attractive force formed by voltage application. A method for manufacturing a molded resin article using such molding die apparatus is also provided.
Description
本発明は静電引力を利用した金型装置及び該金型装置を利用した樹脂成型品の製造方法に関する。
The present invention relates to a mold apparatus using electrostatic attraction and a method for producing a resin molded product using the mold apparatus.
光学部品や、微細流路等の微細形状の作製方法としてナノインプリント技術が注目されている。例えば、ナノインプリント技術としては、微細形状を施した金型に熱硬化樹脂や紫外線硬化樹脂を充填し、微細形状をした樹脂成形品を得る方法等がある。
Nanoimprint technology is attracting attention as a method for producing fine shapes such as optical components and fine channels. For example, as a nanoimprint technique, there is a method of filling a finely shaped mold with a thermosetting resin or an ultraviolet curable resin to obtain a finely shaped resin molded product.
しかし、金型の形状が微細となってくると、樹脂が充填していくことが困難となる。また、金型で微細形状を成形する場合、形状を破壊せずに金型から離形するための離型処理が重要となる。しかしながら金型に撥水性の離型処理が施されている場合は、樹脂の表面張力の影響が大きくなるため流動性が阻害される。
However, as the mold shape becomes finer, it becomes difficult to fill the resin. Further, when a fine shape is formed by a mold, a mold release process for releasing from the mold without destroying the shape is important. However, when the mold is subjected to a water-repellent mold release treatment, the influence of the surface tension of the resin is increased, so that the fluidity is inhibited.
例えば、下記非特許文献では、上記問題を解決するものとして、静電引力（クーロン力）を利用した原理を開示している。図８ａは樹脂３３が絶縁層３１を介して電極３２と接触している様子を示す。また、図８ｂに示すように樹脂３３と電極３２の間に電圧をかけることにより、絶縁層３１を介して静電引力で樹脂３３の絶縁層３１への接触角が小さくなることや、これを応用して樹脂３３を容易に金型へ充填することが知られている。
For example, the following non-patent document discloses a principle using electrostatic attraction (Coulomb force) as a solution to the above problem. FIG. 8 a shows a state in which the resin 33 is in contact with the electrode 32 through the insulating layer 31. Also, as shown in FIG. 8b, by applying a voltage between the resin 33 and the electrode 32, the contact angle of the resin 33 to the insulating layer 31 is reduced by electrostatic attraction via the insulating layer 31, It is known that the resin 33 is easily filled into the mold by applying.
なお、図８ａ、図８ｂ中の“＋”、“－”は絶縁層３１を介して樹脂がプラス側に帯電している様子を模式的に示したものである。
Junghoon Leeらが雑誌『Sensors and Actuators』A 95(2002)巻の259～268ページで2002年に発表したタイトル『Electrowetting andelectrowetting-on-dielectric for microscale liquid handling』 Note that “+” and “−” in FIGS. 8 a and 8 b schematically show that the resin is charged to the plus side via theinsulating layer 31.
The title "Electrowetting and electrowetting-on-dielectric for microscale liquid handling" published in 2002 by Junghoon Lee et al. On pages 259-268 of the magazine "Sensors and Actuators" A 95 (2002)
Junghoon Leeらが雑誌『Sensors and Actuators』A 95(2002)巻の259～268ページで2002年に発表したタイトル『Electrowetting andelectrowetting-on-dielectric for microscale liquid handling』 Note that “+” and “−” in FIGS. 8 a and 8 b schematically show that the resin is charged to the plus side via the
The title "Electrowetting and electrowetting-on-dielectric for microscale liquid handling" published in 2002 by Junghoon Lee et al. On pages 259-268 of the magazine "Sensors and Actuators" A 95 (2002)
ところで、粘性の低い樹脂（約２００ｃｐ以下）を微細形状を施した金型へ充填する場合、樹脂が広がって行く速度が速いと気泡を巻き込んでボイド発生の原因となる。しかしながら、上記従来技術では、樹脂が金型上へ広がって行く速度は、ノズルからの噴射圧でしかコントロールできない。
By the way, when filling a low-viscosity resin (about 200 cp or less) into a mold having a fine shape, if the speed at which the resin spreads is high, bubbles are involved and voids are generated. However, in the above prior art, the speed at which the resin spreads on the mold can be controlled only by the injection pressure from the nozzle.
上記課題を解決するために本発明では、樹脂が充填される金型と、該樹脂を供給するノズルと、第１電極及び第２電極と、該第１電極と該第２電極の間に設けられ、前記金型の一部を構成する絶縁層と、前記第１及び前記第２の両電極に電圧を印加する複数のスイッチと、該複数のスイッチをＯＮ／ＯＦＦ制御する制御部とを有し、電圧の印加により形成される静電引力により樹脂が金型に充填されるようにした金型装置及び該金型装置を用いた樹脂成形品の製造方法を採用したものである。
In order to solve the above problems, in the present invention, a mold filled with resin, a nozzle for supplying the resin, a first electrode and a second electrode, and a gap between the first electrode and the second electrode are provided. And an insulating layer constituting a part of the mold, a plurality of switches for applying a voltage to the first and second electrodes, and a control unit for controlling ON / OFF of the plurality of switches. In addition, a mold apparatus in which a mold is filled with resin by electrostatic attraction formed by applying a voltage and a method for manufacturing a resin molded product using the mold apparatus are employed.
本発明の金型装置及び樹脂成形品の製造方法によれば、金型に樹脂をノズルから供給し、第２電極のスイッチを順次ＯＮすることで、樹脂と第２電極間に絶縁層を介して静電引力が発生し、順次樹脂が金型へ充填されていく。その際、樹脂が金型へ広がって行く速度をコントロールでき、粘性の低い樹脂（約２００ｃｐ以下）を金型へ充填する場合でも、気泡を巻き込む虞がない。
According to the mold apparatus and the method of manufacturing a resin molded product of the present invention, the resin is supplied to the mold from the nozzle, and the switch of the second electrode is sequentially turned on, so that the insulating layer is interposed between the resin and the second electrode. As a result, electrostatic attraction is generated, and the resin is sequentially filled into the mold. At that time, the speed at which the resin spreads to the mold can be controlled, and even when a resin having a low viscosity (about 200 cp or less) is filled into the mold, there is no possibility of entraining bubbles.
以下、本発明の実施例１の形態を図１乃至図５に示す。図１は静電引力を利用した金型装置の斜視図、図２は金型の正面図、図３、図４、図５はそれぞれ図２のＡ－Ａ断面図であり、図３は樹脂の充填前、図４は樹脂の金型への充填途中、図５は金型への樹脂の充填完了を示す図である。
Hereinafter, embodiments of the first embodiment of the present invention are shown in FIGS. 1 is a perspective view of a mold apparatus using electrostatic attraction, FIG. 2 is a front view of the mold, FIGS. 3, 4, and 5 are cross-sectional views taken along line AA of FIG. 2, and FIG. FIG. 4 is a diagram showing the completion of filling of the resin into the mold, and FIG. 5 is a diagram showing completion of filling of the resin into the mold.
これらの図において、金型装置は樹脂を充填し所定の形状に作製するための金型１、静電引力を発生させ樹脂を金型へ充填させるための第２電極２、第２電極２の電圧をＯＮ、ＯＦＦするためのスイッチ３、樹脂を金型１へ供給するためのノズル４などから構成され、該ノズル４は第１電極を兼用している。なお、該ノズル４が第1電極を兼用しない構成としてもよい。
In these drawings, a mold apparatus includes a mold 1 for filling a resin into a predetermined shape, a second electrode 2 for generating electrostatic attraction and filling the mold with the resin, and a second electrode 2. A switch 3 for turning on and off the voltage, a nozzle 4 for supplying resin to the mold 1, and the like are used. The nozzle 4 also serves as the first electrode. The nozzle 4 may be configured not to serve as the first electrode.
金型１は例えばＳｉ基板１ａと、ＳｉＯ２やエポキシ樹脂などの絶縁性材料で形成した絶縁層１ｂと、Ｓｉ基板１ｃの三層からなる。Ｓｉ基板１ａには成形する樹脂製品に応じて、十数ｎｍ～数百μｍの凹凸パターンがフォトリソなどの方法で形成されている。また、Ｓｉ基板１ａには離型に十分耐えうる図示しない撥水性の離型層を形成している。
The mold 1 is composed of, for example, three layers: a Si substrate 1a, an insulating layer 1b formed of an insulating material such as SiO 2 or an epoxy resin, and a Si substrate 1c. The Si substrate 1a is formed with a concavo-convex pattern of several tens of nanometers to several hundreds of micrometers by a method such as photolithography according to the resin product to be molded. Further, a water-repellent release layer (not shown) that can sufficiently withstand the release is formed on the Si substrate 1a.
前記絶縁層１ｂの内部には第２電極２ａ～２ｅが埋め込まれている。この第２電極２ａ～２ｅは、Ｓｉ基板１ａの溝部の延伸方向に５つ並んでいる。なお第２電極はアルミニウムなどの導電性材料からなり、第２電極及び絶縁層はスパッタ装置を用いて形成する。その際、絶縁層の厚みは２０００～４０００Å、第２電極の厚みは１０００～１８００Åの厚さで形成する。第２電極の数は５つに限らず樹脂の広がり速度に応じて適宜決定できる。その後、Ｓｉ基板１ａ、絶縁層１ｂ及びＳｉ基板１ｃを絶縁性の接着材などで貼り合わせることにより金型１が完成する。
The second electrodes 2a to 2e are embedded in the insulating layer 1b. Five second electrodes 2a to 2e are arranged in the extending direction of the groove of the Si substrate 1a. Note that the second electrode is made of a conductive material such as aluminum, and the second electrode and the insulating layer are formed using a sputtering apparatus. At this time, the insulating layer is formed to a thickness of 2000 to 4000 mm, and the second electrode is formed to a thickness of 1000 to 1800 mm. The number of second electrodes is not limited to five and can be determined as appropriate according to the spreading speed of the resin. Thereafter, the die 1 is completed by bonding the Si substrate 1a, the insulating layer 1b, and the Si substrate 1c with an insulating adhesive or the like.
金型装置は、複数の第２電極２ａ～２ｅをＯＮ／ＯＦＦ可能な複数のスイッチ３ａ～３ｅを有している。また、スイッチ３ａ～３ｅをＯＮ／ＯＦＦ制御する図示しない制御部を有している。
The mold apparatus has a plurality of switches 3a to 3e capable of turning on / off the plurality of second electrodes 2a to 2e. In addition, a control unit (not shown) that performs ON / OFF control of the switches 3a to 3e is provided.
ノズル４は導電性材料で形成することで第１電極として兼用し、該ノズル４と絶縁層１ｂの内部にある第２電極２ａ～２ｅ（以下、本実施例１では、「電極２ａ～２ｅ」と略記する。）が電気的に接続されている。また、第１電極と第２電極には電圧を供給する電源５を有する。
The nozzle 4 is formed of a conductive material and is also used as the first electrode. The nozzle 4 and the second electrodes 2a to 2e (hereinafter referred to as “electrodes 2a to 2e” in the first embodiment) inside the insulating layer 1b. Are electrically connected. Further, the first electrode and the second electrode have a power source 5 for supplying a voltage.
次に、金型装置を用いた樹脂成形品の製造方法について説明する。金型１には紫外線により硬化する樹脂６がノズル４から必要量吐出される。ノズル４から吐出した樹脂６は、図３乃至図５で示す電極２ａの上部近傍から電極２ｅの方向へ向かって充填されることになる。
Next, a method for producing a resin molded product using a mold apparatus will be described. A required amount of resin 6 that is cured by ultraviolet rays is discharged from the nozzle 4 to the mold 1. The resin 6 discharged from the nozzle 4 is filled from the vicinity of the upper portion of the electrode 2a shown in FIGS. 3 to 5 toward the electrode 2e.
ここで図４乃至図５で示すように、スイッチ３ａ～３ｅを３ａから順にＯＮさせることで、該電極２ａ～２ｅとノズル４の間に電源５により１００～５００Ｖの電圧を印加する。これにより、電極２ａ～２ｅと樹脂６の間に静電引力が形成され、樹脂６を前記金型１の電極２ａの上部近傍から電極２ｅの方向へ順々に充填させることができる。また、各スイッチ３ａ～３ｅをＯＮするタイミングは、樹脂６の広がる速度を画像カメラでセンシングし、その信号を制御部に入力し、自動で各スイッチをＯＮする。より詳細に説明すると、最初のステップとして、樹脂の金型への供給が開始されるとスイッチ３ａをＯＮにし、電極２ａとノズル４の間に電圧を印加する。次のステップとして、電極２ａの近傍に樹脂が十分に広がるのを画像カメラでセンシングした後に、制御部を用いてスイッチ３ｂをＯＮにする。そして、次のステップとして、電極２ｂの近傍に樹脂が十分に広がるのを画像カメラでセンシングした後に、制御部を用いてスイッチ３ｃをＯＮにする。以下同様にスイッチ３ｄ～３ｅをＯＮにする。各スイッチ３ａ～３ｅをＯＮするタイミングは、制御部で容易に変更できるので、樹脂の金型に広がる速度を速くしたり、逆に遅くしたりすることができる。その際、樹脂が金型に広がる速度は樹脂の粘性により決定されるが、樹脂の粘性が低い場合は、広がる速度を遅くすることにより、気泡を巻き込むこと虞がなくなり、ボイド発生の防止に有効である。
Here, as shown in FIGS. 4 to 5, by turning on the switches 3a to 3e in order from 3a, a voltage of 100 to 500 V is applied between the electrodes 2a to 2e and the nozzle 4 by the power source 5. As a result, an electrostatic attractive force is formed between the electrodes 2a to 2e and the resin 6, and the resin 6 can be sequentially filled from the vicinity of the upper portion of the electrode 2a of the mold 1 in the direction of the electrode 2e. In addition, when the switches 3a to 3e are turned on, the speed at which the resin 6 spreads is sensed by the image camera, the signal is input to the control unit, and the switches are automatically turned on. More specifically, as a first step, when the supply of resin to the mold is started, the switch 3a is turned on and a voltage is applied between the electrode 2a and the nozzle 4. As the next step, after sensing with the image camera that the resin has sufficiently spread in the vicinity of the electrode 2a, the switch 3b is turned on using the control unit. Then, as the next step, after sensing with the image camera that the resin has sufficiently spread in the vicinity of the electrode 2b, the switch 3c is turned on using the control unit. Similarly, switches 3d to 3e are turned on. Since the timing for turning on each of the switches 3a to 3e can be easily changed by the control unit, the speed of spreading in the resin mold can be increased or decreased. At that time, the speed at which the resin spreads to the mold is determined by the viscosity of the resin, but if the viscosity of the resin is low, there is no risk of entrainment of bubbles by slowing down the spreading speed, which is effective in preventing voids. It is.
上述したように、本発明では、樹脂が金型へ広がって行く速度をコントロールでき、粘性の低い樹脂（数百ｃｐ以下）を十数ｎｍ～数百μｍの微細構造を有する金型へ充填する場合でも、気泡を巻込む虞がなくなり、ボイドの発生を防止できる。
As described above, in the present invention, the speed at which the resin spreads into the mold can be controlled, and a low viscosity resin (several hundred cp or less) is filled into a mold having a fine structure of several tens of nanometers to several hundred μm. Even in this case, there is no risk of entrainment of bubbles, and generation of voids can be prevented.
なお、ノズル４をプラス極、電極２をマイナス極としているが、ノズル４をマイナス極、電極２をプラス極としても良い。
Although the nozzle 4 is a positive electrode and the electrode 2 is a negative electrode, the nozzle 4 may be a negative electrode and the electrode 2 may be a positive electrode.
その後、金型１上部より紫外線を照射し、樹脂６を硬化する。そして、金型１から樹脂６を剥離することで樹脂成形品の製造が完了する。
Thereafter, the resin 6 is cured by irradiating with ultraviolet rays from the upper part of the mold 1. Then, the resin 6 is peeled from the mold 1 to complete the production of the resin molded product.
ここで、材質、粘度を変化させて樹脂を充填した結果を表１に示す。材質はアクリル系樹脂とエポキシ系樹脂を用意し粘度は表１の通りである。また、実験結果は電子顕微鏡（ＳＥＭ）を用いて成形された樹脂成形品を観察して、ボイドの発生の有無を確認することで評価した。その結果、ボイドの発生が無いことを確認した。
Here, the results of filling the resin by changing the material and viscosity are shown in Table 1. Acrylic resin and epoxy resin are prepared as materials, and the viscosities are as shown in Table 1. In addition, the experimental results were evaluated by observing resin molded products molded using an electron microscope (SEM) and confirming the presence or absence of voids. As a result, it was confirmed that no void was generated.
以下、本発明の実施例２の形態を図６乃至図７に示す。図６は金型の正面図、図７は図６のＢ－Ｂ断面図である。
Hereinafter, embodiments of the second embodiment of the present invention are shown in FIGS. 6 is a front view of the mold, and FIG. 7 is a cross-sectional view taken along the line BB of FIG.
実施例２において、金型１１はＳｉ基板１１ａと、ＳｉＯ２やエポキシ樹脂などの絶縁性材料で形成した絶縁層１１ｂの２層からなり、Ｓｉ基板１１ａと絶縁層１１ｂは絶縁性の接着剤で貼り合せてある。また、前記Ｓｉ基板１１ａは成形する樹脂製品に応じて、十数ｎｍ～数百μｍの凹凸パターンがエッチングなどの方法で形成されている。また、金型の表面には離型に十分耐えうる図示しない撥水性の離型層を形成している。
In the second embodiment, the mold 11 is composed of two layers, an Si substrate 11a and an insulating layer 11b formed of an insulating material such as SiO2 or epoxy resin. The Si substrate 11a and the insulating layer 11b are bonded with an insulating adhesive. Combined. The Si substrate 11a is formed with a concavo-convex pattern of several tens of nanometers to several hundred μm by a method such as etching according to the resin product to be molded. Further, a water-repellent release layer (not shown) that can sufficiently withstand the release is formed on the surface of the mold.
前記絶縁層１１ｂの内部には第２電極１２ａ～１２ｅが埋め込まれている。また、第２電極１２ａ～１２ｅは、Ｓｉ基板１１ａの溝部の延伸方向に５つ並んでいる。第２電極の数は５つに限らず樹脂の広がり速度等に応じて適宜決定できる。また、各々の第２電極は電圧をＯＮ／ＯＦＦ可能なスイッチ１３ａ～１３ｅをそれぞれ有している。さらに、電極のスイッチを自動的にＯＮ／ＯＦＦ制御する図示しない制御部を有している。
The second electrodes 12a to 12e are embedded in the insulating layer 11b. Further, five second electrodes 12a to 12e are arranged in the extending direction of the groove portion of the Si substrate 11a. The number of second electrodes is not limited to five, and can be determined as appropriate according to the spreading speed of the resin. Each of the second electrodes has switches 13a to 13e capable of turning on / off the voltage. Furthermore, a control unit (not shown) that automatically controls ON / OFF of the electrode switch is provided.
ここで、ノズル１４は導電性としたことから第１電極として兼用でき、該ノズル１４と絶縁層１１ｂの内部にある第２電極１２ａ～１２ｅが電気的に接続されている。その他の構成は実施例１と同様である。実施例２は、実施例１と比べた場合、金型装置が簡単な構成となり、比較的容易に金型装置を作製することができる。
Here, since the nozzle 14 is conductive, it can also be used as the first electrode, and the nozzle 14 and the second electrodes 12a to 12e inside the insulating layer 11b are electrically connected. Other configurations are the same as those of the first embodiment. In the second embodiment, the mold apparatus has a simple configuration as compared with the first embodiment, and the mold apparatus can be manufactured relatively easily.
なお、実施例１の表１と同じ条件で実験を行ったところ、出来上った樹脂成形品については、ボイドの発生がないことが確認された。
In addition, when an experiment was performed under the same conditions as in Table 1 of Example 1, it was confirmed that no voids were generated in the finished resin molded product.
Claims (6)
- 樹脂が充填される金型と、
該樹脂を供給するノズルと、
第１電極及び複数個設けられた第２電極と、
該第１電極と該第２電極の間に設けられ、前記金型の一部を構成する絶縁層と、
前記第１電極及び第２電極間に電圧を印加する複数のスイッチと、
該複数のスイッチをＯＮ／ＯＦＦ制御する制御部とを有し、
電圧の印加により形成される静電引力により樹脂が金型に充填されることを特徴とする金型装置。 A mold filled with resin;
A nozzle for supplying the resin;
A first electrode and a plurality of second electrodes;
An insulating layer provided between the first electrode and the second electrode and constituting a part of the mold;
A plurality of switches for applying a voltage between the first electrode and the second electrode;
A control unit for ON / OFF control of the plurality of switches,
A mold apparatus, wherein a mold is filled with a resin by electrostatic attraction formed by applying a voltage. - 前記第２電極が金型の一部を構成することを特徴とする請求項１に記載された金型装置。 2. The mold apparatus according to claim 1, wherein the second electrode constitutes a part of a mold.
- 前記第２電極は前記絶縁層に埋設されていることを特徴とする請求項１に記載された金型装置。 The mold apparatus according to claim 1, wherein the second electrode is embedded in the insulating layer.
- 前記ノズルが第１電極を兼用していることを特徴とする請求項１に記載された金型装置。 The mold apparatus according to claim 1, wherein the nozzle also serves as the first electrode.
- 前記制御部は、前記複数個設けられた第２電極のうちノズル近傍の電極から順次スイッチをＯＮするように制御することを特徴とする請求項１に記載された金型装置。 2. The mold apparatus according to claim 1, wherein the control unit performs control so that a switch is sequentially turned on from an electrode near a nozzle among the plurality of second electrodes provided.
- 請求項１に記載の金型装置を用いることを特徴とする樹脂成形品の製造方法。 A method for producing a resin molded product, wherein the mold apparatus according to claim 1 is used.
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| JP2009547974A JPWO2009084392A1 (en) | 2007-12-27 | 2008-12-10 | Mold apparatus and method for manufacturing resin molded product |
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| JP2007335486 | 2007-12-27 |
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| JP2011061001A (en) * | 2009-09-10 | 2011-03-24 | Toshiba Corp | Pattern forming method |
| WO2014113970A1 (en) | 2013-01-25 | 2014-07-31 | Suzhou Red Maple Wind Blade Mould Co., Ltd | Electrostatic elimination from a mould |
| JP2019012186A (en) * | 2017-06-30 | 2019-01-24 | スリーエム イノベイティブ プロパティズ カンパニー | Manufacturing method of article with concave or convex portion |
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| JPH07195384A (en) * | 1993-12-28 | 1995-08-01 | Toshiba Corp | Cast resin molding and its production |
| JP2001137757A (en) * | 1999-11-16 | 2001-05-22 | Dainippon Printing Co Ltd | Method for controlling electric field discharge and electric field discharge head |
| JP2003311800A (en) * | 2002-04-24 | 2003-11-05 | Ricoh Co Ltd | Method and mold for molding thin plastic molded product |
| JP2004025656A (en) * | 2002-06-26 | 2004-01-29 | Fuji Xerox Co Ltd | Manufacturing method for microlens array, electrolyte and microlens array resin material for use in the same, and matrix manufacturing device |
| JP2005527974A (en) * | 2002-05-24 | 2005-09-15 | ワイ． チョウ，スティーヴン， | Method and apparatus for field induced pressure imprint lithography |
| WO2007024323A2 (en) * | 2005-06-17 | 2007-03-01 | The University Of North Carolina At Chapel Hill | Nanoparticle fabrication methods, systems, and materials |
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- 2008-12-10 JP JP2009547974A patent/JPWO2009084392A1/en not_active Withdrawn
- 2008-12-10 WO PCT/JP2008/072426 patent/WO2009084392A1/en active Application Filing
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| JPH07195384A (en) * | 1993-12-28 | 1995-08-01 | Toshiba Corp | Cast resin molding and its production |
| JP2001137757A (en) * | 1999-11-16 | 2001-05-22 | Dainippon Printing Co Ltd | Method for controlling electric field discharge and electric field discharge head |
| JP2003311800A (en) * | 2002-04-24 | 2003-11-05 | Ricoh Co Ltd | Method and mold for molding thin plastic molded product |
| JP2005527974A (en) * | 2002-05-24 | 2005-09-15 | ワイ． チョウ，スティーヴン， | Method and apparatus for field induced pressure imprint lithography |
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| JP2011061001A (en) * | 2009-09-10 | 2011-03-24 | Toshiba Corp | Pattern forming method |
| US8753803B2 (en) | 2009-09-10 | 2014-06-17 | Kabushiki Kaisha Toshiba | Pattern forming method |
| WO2014113970A1 (en) | 2013-01-25 | 2014-07-31 | Suzhou Red Maple Wind Blade Mould Co., Ltd | Electrostatic elimination from a mould |
| EP2949018A4 (en) * | 2013-01-25 | 2016-08-31 | Suzhou Red Maple Wind Blade Mould Co Ltd | Electrostatic elimination from a mould |
| JP2019012186A (en) * | 2017-06-30 | 2019-01-24 | スリーエム イノベイティブ プロパティズ カンパニー | Manufacturing method of article with concave or convex portion |
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