WO2009081355A3 - Optical disk format for direct writing materials on a substrate - Google Patents

Optical disk format for direct writing materials on a substrate Download PDF

Info

Publication number
WO2009081355A3
WO2009081355A3 PCT/IB2008/055438 IB2008055438W WO2009081355A3 WO 2009081355 A3 WO2009081355 A3 WO 2009081355A3 IB 2008055438 W IB2008055438 W IB 2008055438W WO 2009081355 A3 WO2009081355 A3 WO 2009081355A3
Authority
WO
WIPO (PCT)
Prior art keywords
carrier
substrate
optical disk
direct writing
disk format
Prior art date
Application number
PCT/IB2008/055438
Other languages
French (fr)
Other versions
WO2009081355A2 (en
Inventor
Floris Maria Hermansz Crompvoets
Coen Adrianus Verschuren
Original Assignee
Koninklijke Philips Electronics N.V.
U.S. Philips Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics N.V., U.S. Philips Corporation filed Critical Koninklijke Philips Electronics N.V.
Publication of WO2009081355A2 publication Critical patent/WO2009081355A2/en
Publication of WO2009081355A3 publication Critical patent/WO2009081355A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/048—Coating on selected surface areas, e.g. using masks using irradiation by energy or particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process

Abstract

A direct write carrier, system and method include an optical assembly configured to direct a writing laser and a tracking laser. A carrier has a material layer and a tracking layer. The carrier is moveable relative to the optical assembly such that when the material layer is energized by the writing laser, direct writing is provided to a surface below the carrier. The tracking layer includes readable data which is employed to control one of the optical assembly and a position of the carrier.
PCT/IB2008/055438 2007-12-19 2008-12-18 Optical disk format for direct writing materials on a substrate WO2009081355A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US1476807P 2007-12-19 2007-12-19
US61/014,768 2007-12-19

Publications (2)

Publication Number Publication Date
WO2009081355A2 WO2009081355A2 (en) 2009-07-02
WO2009081355A3 true WO2009081355A3 (en) 2010-01-14

Family

ID=40671231

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2008/055438 WO2009081355A2 (en) 2007-12-19 2008-12-18 Optical disk format for direct writing materials on a substrate

Country Status (2)

Country Link
TW (1) TW200945339A (en)
WO (1) WO2009081355A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201019579D0 (en) * 2010-11-19 2010-12-29 Lingvitae Holding As Method and apparatus for direct writing
FR2980859B1 (en) * 2011-09-30 2013-10-11 Commissariat Energie Atomique LITHOGRAPHY METHOD AND DEVICE
EP2660352A1 (en) * 2012-05-02 2013-11-06 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Donor sheet and method for light induced forward transfer manufacturing
EP2731126A1 (en) 2012-11-09 2014-05-14 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Method for bonding bare chip dies
EP2824699A1 (en) 2013-07-08 2015-01-14 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Providing a chip die with electrically conductive elements
EP3058113B1 (en) * 2013-10-14 2020-12-02 Orbotech Ltd. Lift printing of multi-composition material structures
US10193004B2 (en) 2014-10-19 2019-01-29 Orbotech Ltd. LIFT printing of conductive traces onto a semiconductor substrate
US10633758B2 (en) 2015-01-19 2020-04-28 Orbotech Ltd. Printing of three-dimensional metal structures with a sacrificial support
WO2017085712A1 (en) 2015-11-22 2017-05-26 Orbotech Ltd Control of surface properties of printed three-dimensional structures
TW201901887A (en) 2017-05-24 2019-01-01 以色列商奧寶科技股份有限公司 Electrical interconnection circuit components on the substrate without prior patterning
EP3521483A1 (en) * 2018-02-06 2019-08-07 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Lift deposition apparatus and method
EP3800033A1 (en) * 2019-09-30 2021-04-07 Ricoh Company, Ltd. Irradiation target flying apparatus, three-dimensional modeling apparatus, and irradiation target flying method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6792326B1 (en) * 1999-05-24 2004-09-14 Potomac Photonics, Inc. Material delivery system for miniature structure fabrication
WO2007064040A1 (en) * 2005-12-02 2007-06-07 Ricoh Company, Ltd. Multilayer optical information recording medium, optical head, and optical drive

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6792326B1 (en) * 1999-05-24 2004-09-14 Potomac Photonics, Inc. Material delivery system for miniature structure fabrication
WO2007064040A1 (en) * 2005-12-02 2007-06-07 Ricoh Company, Ltd. Multilayer optical information recording medium, optical head, and optical drive

Also Published As

Publication number Publication date
WO2009081355A2 (en) 2009-07-02
TW200945339A (en) 2009-11-01

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