WO2009069845A1 - Bio-sensor having sensing unit made from nano-sized resist-derived carbon - Google Patents
Bio-sensor having sensing unit made from nano-sized resist-derived carbon Download PDFInfo
- Publication number
- WO2009069845A1 WO2009069845A1 PCT/KR2007/006801 KR2007006801W WO2009069845A1 WO 2009069845 A1 WO2009069845 A1 WO 2009069845A1 KR 2007006801 W KR2007006801 W KR 2007006801W WO 2009069845 A1 WO2009069845 A1 WO 2009069845A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sensor portion
- biosensor
- insulation layer
- sensor
- biomolecules
- Prior art date
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title description 11
- 229910052799 carbon Inorganic materials 0.000 title description 9
- 239000002105 nanoparticle Substances 0.000 title description 2
- 239000002243 precursor Substances 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 18
- 238000001459 lithography Methods 0.000 claims abstract description 3
- 238000009413 insulation Methods 0.000 claims description 29
- 239000000758 substrate Substances 0.000 claims description 13
- 229920000642 polymer Polymers 0.000 description 18
- 238000005516 engineering process Methods 0.000 description 8
- 238000005459 micromachining Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 238000010894 electron beam technology Methods 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000007769 metal material Substances 0.000 description 3
- 239000012085 test solution Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000002041 carbon nanotube Substances 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002070 nanowire Substances 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000009739 binding Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000338 in vitro Methods 0.000 description 1
- 238000001727 in vivo Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/403—Cells and electrode assemblies
- G01N27/406—Cells and probes with solid electrolytes
- G01N27/407—Cells and probes with solid electrolytes for investigating or analysing gases
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/28—Electrolytic cell components
- G01N27/30—Electrodes, e.g. test electrodes; Half-cells
- G01N27/327—Biochemical electrodes, e.g. electrical or mechanical details for in vitro measurements
- G01N27/3275—Sensing specific biomolecules, e.g. nucleic acid strands, based on an electrode surface reaction
- G01N27/3278—Sensing specific biomolecules, e.g. nucleic acid strands, based on an electrode surface reaction involving nanosized elements, e.g. nanogaps or nanoparticles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y15/00—Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y35/00—Methods or apparatus for measurement or analysis of nanostructures
Definitions
- the present invention relates to a biosensor for detecting biomolecules and, more particularly, to a biosensor having a nano-size sensor portion composed of pyrolyzed carbon.
- MEMS micromachining-based semiconductor processing technology
- the MEMS Micro-Electro-Mechanical System
- the MEMS refers to a technology with which a sensor, an actuator and an electro-mechanical device each having an extremely small size in the order of microns are manufactured through a micromachining process derived from a semiconductor manufacturing process, particularly an integrated circuit technology.
- the micro mechanical device manufactured by the micromachining process has a size and precision degree of several microns or less. Advantages of the micromachining process reside in that it can realize miniaturization, high performance, versatility and integration of a device through an extremely precise micromachining work while enhancing the stability and reliability of the device.
- the micromachining technology can realize a unitary integrated system, thereby eliminating the need to perform an additional fabricating operation. This makes it possible to cost- effectively mass-produce micro structures through a series of process steps.
- Bio-MEMS A MEMS used in the field of bio-engineering is referred to as Bio-MEMS.
- the Bio-MEMS The Bio-MEMS
- MEMS is a combination term of biotechnology and MEMS and means a micro device capable of analyzing biomolecules in vivo or in vitro.
- One representative product using the Bio-MEMS is a biosensor.
- the biosensor refers to an ultra-small sensor which includes a sensor portion for detecting biomolecules and a signal generating portion for generating an electrical or chemical signal corresponding to the biomolecules detected.
- the biosensor is divided into a mechanical biosensor and an electrical biosensor.
- the mechanical biosensor determines the kind and amount of biomolecules by measuring the resonant frequency or displacement of a cantilever having a pressure resistor, a piezoelectric material or a field-effect transistor formed thereon.
- the resonant frequency or displacement of the cantilever varies when the pressure resistor, the piezoelectric material or the field-effect transistor reacts with biomolecules.
- the electrical biosensor determines the kind and amount of biomolecules by measuring the change in electric resistance of a sensor portion made of a semiconductor nano wire, a carbon nano tube or a conductive polymer. The change in electric resistance occurs when the sensor portion makes a binding reaction with biomolecules.
- the electrical biosensor has an advantage in that it can accurately determine the biomolecules using a nano-size sensor portion such as a carbon nano tube or a semiconductor nano wire.
- a nano-size sensor portion such as a carbon nano tube or a semiconductor nano wire.
- it is difficult to manufacture a sensor portion of arbitrary shape in a nano size.
- additional process steps such as etching, deposition or the like, which makes it costly to produce the sensor portion in a nano size.
- a biosensor for detecting biomolecules including: a sensor portion for making contact with biomolecules to be detected; an electrode for supplying an electric current to the sensor portion; and a connector portion for electrically interconnecting the sensor portion and the electrode, wherein the sensor portion is made from a pyrolyzed photo-sensitive sensor portion precursor obtained through a lithography process.
- the present invention it is possible to easily manufacture a micro biosensor by forming a sensor portion precursor with a high molecular polymer through a photolithography process and then pyrolyzing the sensor portion precursor to form a sensor portion composed of conductive carbon.
- the present biosensor is capable of accurately detecting biomolecules adhering to the sensor portion. This is because the biosensor is provided with an exposure window for allowing the biomolecules to make contact with the sensor portion with ease and because a vacant space is formed between the sensor portion and a substrate.
- Fig. 1 shows a substrate and an underlying insulation layer with electrodes.
- Fig. 2 illustrates a process for forming a sensor portion precursor in accordance with one embodiment of the present invention.
- FIG. 3 illustrates a process for forming a sensor portion in accordance with one embodiment of the present invention.
- FIG. 4 shows a substrate provided with a connector portion in accordance with one embodiment of the present invention.
- FIG. 5 shows a biosensor provided with an exposure window in accordance with one embodiment of the present invention.
- FIG. 6 is a section view of a biosensor in accordance with another embodiment of the present invention, specifically illustrating a sensor portion and its vicinity. Best Mode for Carrying out the Invention
- Fig. 1 shows a substrate and an underlying insulation layer with electrodes.
- an underlying insulation layer 2 is formed on the upper surface of a substrate 1.
- a silicon, quartz or ceramic substrate may be used as the substrate 1.
- a silicon oxide or silicon nitride film may be used as the underlying insulation layer 2.
- the electrodes 3 and the alignment marks 4 provided on the upper surface of the underlying insulation layer 2 are produced by a photolithography process. More specifically, a polymer mask having patterns of the electrodes 3 and the alignment marks 4 pierced therethrough is attached to the upper surface of the underlying insulation layer 2. A metallic material is then applied onto the polymer mask thus attached. Thereafter, the polymer mask is separated from the underlying insulation layer 2 to thereby form the electrodes 3 and the alignment marks 4 on the underlying insulation layer 2.
- FIG. 2 illustrates a process for forming a sensor portion precursor in accordance with one embodiment of the present invention.
- a photo-sensitive layer 5 composed of a polymer is applied on the upper surface of the underlying insulation layer 2 on which the electrodes 3 and the alignment marks 4 have been formed.
- a polymer mask 6 having a sensor portion pattern pierced therethrough is attached to the upper surface of the photo-sensitive layer 5.
- the alignment marks 4 are used in aligning the sensor portion pattern of the polymer mask 6 at a specified position on the underlying insulation layer 2.
- the photo-sensitive layer 5 is lithographed using the polymer mask 6 having the sensor portion pattern pierced therethrough.
- electron beams B are irradiated on the photo-sensitive layer 5 from above the polymer mask 6, at which time only the electron beams passed through the sensor portion pattern reach the photo-sensitive layer 5.
- the photo-sensitive layer 5 is preferably made of a high molecular polymer. After the electron beams B are irradiated on the photo-sensitive layer 5 through the sensor portion pattern, the polymer mask 6 is separated from the photo-sensitive layer 5 and is then developed with a developer solution.
- the portion of the photo-sensitive layer 5 irradiated with the electron beams is left intact, but the portion of the photo-sensitive layer 5 not irradiated with the electron beams is completely dissolved away in the developer solution.
- a portion of the photo-sensitive layer 5 corresponding to the sensor portion pattern of the polymer mask 6, i.e., a sensor portion precursor is left on the upper surface of the underlying insulation layer 2.
- Fig. 3 illustrates a process for forming a sensor portion by pyrolyzing the sensor portion precursor.
- a sensor portion precursor 7 composed of a high molecular polymer is formed on the underlying insulation layer 2 after the photosensitive layer 5 is developed. Heat H is applied on the sensor portion precursor 7 to pyrolyze the same. The sensor portion precursor 7 thus pyrolyzed is converted to a sensor portion composed of conductive carbon.
- the sensor portion precursor 7 is heated to an elevated temperature, nitrogen, oxygen and the like constituting the sensor portion precursor 7 are removed and only a carbon component is left as it is.
- the carbon component has an amorphous structure.
- the electric conductivity and residual stress of the pyrolyzed sensor portion precursor 7 varies depending on the heating temperature and time of the sensor portion precursor 7, the chemical components of the polymer constituting the sensor portion precursor 7 and the kind of additives added to the sensor portion precursor 7.
- the sensor portion precursor 7 is pyrolyzed by heating the same to a temperature of from 500 0 C to 700 0 C for 0.5 to 2 hours in an oven. This produces a sensor portion 8 made from a pyrolyzed photo-sensitive sensor portion precursor.
- FIG. 4 illustrates the substrate provided with connector portions in accordance with one preferred embodiment of the present invention.
- connector portions 9 for electrically interconnecting the sensor portion 8 and the electrodes 3 are formed through a photolithography process. More specifically, a polymer mask having patterns of the connector portions 9 pierced therethrough is attached to the underlying insulation layer 2 in alignment with the alignment marks 4 so that the connector portions 9 can be formed between the sensor portion 8 and the electrodes 3. A metallic material is applied on the polymer mask, at which time the metallic material is filled in the patterns of the connector portions 9. If the polymer mask is removed, the connector portions 9 for electrically interconnecting the sensor portion 8 and the electrodes 3 are formed on the underlying insulation layer 2.
- Fig. 5 illustrates a biosensor having an exposure window in accordance with one embodiment of the present invention.
- a covering insulation layer 10 is formed to the upper surface of the underlying insulation layer 2 on which the connector portions 9 are formed.
- the task of forming the covering insulation layer 10 on the underlying insulation layer 2 is performed by applying PMMA (polymethyl methacrylate), SOG (spin-on-glass), polyimide or the like on the upper surface of the underlying insulation layer 2 in a liquid or gas phase.
- PMMA polymethyl methacrylate
- SOG spin-on-glass
- polyimide polyimide
- An exposure window 11 through which to expose the sensor portion 8 to biomolecules is formed in the covering insulation layer 10 to lie just above the sensor portion 8. If a test solution is allowed to flow over the covering insulation layer 10 of the biosensor, a part of the test solution enters the exposure window 11 and makes contact with the sensor portion 8. Thus the biomolecules contained in the test solution adhere to the sensor portion 8.
- the electric resistance of the sensor portion 8 varies with the kind and amount of the biomolecules adhering to the sensor portion 8.
- the electric resistance of the sensor portion 8 can be measured by supplying an electric current to the sensor portion 8 through the electrodes 3 and the connector portions 9. Based on the electric resistance thus measured, it is possible to detect the kind and amount of the biomolecules adhering to the sensor portion 8.
- FIG. 6 is a section view of a biosensor in accordance with another embodiment of the present invention, specifically illustrating a sensor portion and its vicinity.
- a portion of the underlying insulation layer 2 positioned below the sensor portion 8 is etched away to form a vacant space 12 between the sensor portion 8 and the substrate 1. Formation of the vacant space 12 makes it possible to reduce the electric resistance attributable to the contact between the underlying insulation layer 2 and the sensor portion 8. Accordingly, it is possible to accurately measure the change in electric resistance of the sensor portion 8 caused by the biomolecules adhering thereto.
- the present biosensor is capable of accurately detecting biomolecules adhering to the sensor portion. This is because the biosensor is provided with an exposure window for allowing the biomolecules to make contact with the sensor portion with ease and because a vacant space is formed between the sensor portion and the substrate.
Abstract
Provided is a biosensor for detecting biomolecules. The biosensor includes a sensor portion for making contact with biomolecules to be detected, an electrode for supplying an electric current to the sensor portion and a connector portion for electrically interconnecting the sensor portion and the electrode. The sensor portion is made from a pyrolyzed photo-sensitive sensor portion precursor obtained through a lithography process.
Description
Description
BIO-SENSOR HAVING SENSING UNIT MADE FROM NANO- SIZED RESIST-DERIVED CARBON
Technical Field
[1] The present invention relates to a biosensor for detecting biomolecules and, more particularly, to a biosensor having a nano-size sensor portion composed of pyrolyzed carbon. Background Art
[2] As a method for integrating a micro mechanical device, there is known a semiconductor processing technology using micromachining. The micromachining-based semiconductor processing technology, which is often referred to as "MEMS," has contributed to the development of a two-dimensional silicon processing technology represented by the conventional planar technology to a three-dimensional structure processing technology.
[3] The MEMS (Micro-Electro-Mechanical System) refers to a technology with which a sensor, an actuator and an electro-mechanical device each having an extremely small size in the order of microns are manufactured through a micromachining process derived from a semiconductor manufacturing process, particularly an integrated circuit technology. The micro mechanical device manufactured by the micromachining process has a size and precision degree of several microns or less. Advantages of the micromachining process reside in that it can realize miniaturization, high performance, versatility and integration of a device through an extremely precise micromachining work while enhancing the stability and reliability of the device. In addition, the micromachining technology can realize a unitary integrated system, thereby eliminating the need to perform an additional fabricating operation. This makes it possible to cost- effectively mass-produce micro structures through a series of process steps.
[4] A MEMS used in the field of bio-engineering is referred to as Bio-MEMS. The Bio-
MEMS is a combination term of biotechnology and MEMS and means a micro device capable of analyzing biomolecules in vivo or in vitro. One representative product using the Bio-MEMS is a biosensor. The biosensor refers to an ultra-small sensor which includes a sensor portion for detecting biomolecules and a signal generating portion for generating an electrical or chemical signal corresponding to the biomolecules detected.
[5] The biosensor is divided into a mechanical biosensor and an electrical biosensor. The mechanical biosensor determines the kind and amount of biomolecules by measuring the resonant frequency or displacement of a cantilever having a pressure resistor, a piezoelectric material or a field-effect transistor formed thereon. The resonant
frequency or displacement of the cantilever varies when the pressure resistor, the piezoelectric material or the field-effect transistor reacts with biomolecules. In contrast, the electrical biosensor determines the kind and amount of biomolecules by measuring the change in electric resistance of a sensor portion made of a semiconductor nano wire, a carbon nano tube or a conductive polymer. The change in electric resistance occurs when the sensor portion makes a binding reaction with biomolecules.
Disclosure of Invention Technical Problem
[6] The electrical biosensor has an advantage in that it can accurately determine the biomolecules using a nano-size sensor portion such as a carbon nano tube or a semiconductor nano wire. However, it is difficult to manufacture a sensor portion of arbitrary shape in a nano size. In order to manufacture a nano-size sensor portion using a semiconductor manufacturing process, there is a need to perform additional process steps such as etching, deposition or the like, which makes it costly to produce the sensor portion in a nano size.
[7] Therefore, it is an object of the present invention to provide a novel biosensor having a nano-size sensor portion composed of pyrolyzed carbon, which can be cost-effectively manufactured through a simple process. Technical Solution
[8] In accordance with the present invention, there is provided a biosensor for detecting biomolecules, including: a sensor portion for making contact with biomolecules to be detected; an electrode for supplying an electric current to the sensor portion; and a connector portion for electrically interconnecting the sensor portion and the electrode, wherein the sensor portion is made from a pyrolyzed photo-sensitive sensor portion precursor obtained through a lithography process.
Advantageous Effects
[9] With the present invention, it is possible to easily manufacture a micro biosensor by forming a sensor portion precursor with a high molecular polymer through a photolithography process and then pyrolyzing the sensor portion precursor to form a sensor portion composed of conductive carbon. In addition, the present biosensor is capable of accurately detecting biomolecules adhering to the sensor portion. This is because the biosensor is provided with an exposure window for allowing the biomolecules to make contact with the sensor portion with ease and because a vacant space is formed between the sensor portion and a substrate. Brief Description of Drawings
[10] Fig. 1 shows a substrate and an underlying insulation layer with electrodes.
[11] Fig. 2 illustrates a process for forming a sensor portion precursor in accordance with one embodiment of the present invention.
[12] Fig. 3 illustrates a process for forming a sensor portion in accordance with one embodiment of the present invention.
[13] Fig. 4 shows a substrate provided with a connector portion in accordance with one embodiment of the present invention.
[14] Fig. 5 shows a biosensor provided with an exposure window in accordance with one embodiment of the present invention.
[15] Fig. 6 is a section view of a biosensor in accordance with another embodiment of the present invention, specifically illustrating a sensor portion and its vicinity. Best Mode for Carrying out the Invention
[16] Hereinafter, a biosensor in accordance with the present invention will be described in detail with reference to Figs. 1 through 6.
[17] Fig. 1 shows a substrate and an underlying insulation layer with electrodes. Referring to Fig. 1, an underlying insulation layer 2 is formed on the upper surface of a substrate 1. On the upper surface of the underlying insulation layer 2, there are formed electrodes 3 and alignment marks 4. A silicon, quartz or ceramic substrate may be used as the substrate 1. A silicon oxide or silicon nitride film may be used as the underlying insulation layer 2.
[18] The electrodes 3 and the alignment marks 4 provided on the upper surface of the underlying insulation layer 2 are produced by a photolithography process. More specifically, a polymer mask having patterns of the electrodes 3 and the alignment marks 4 pierced therethrough is attached to the upper surface of the underlying insulation layer 2. A metallic material is then applied onto the polymer mask thus attached. Thereafter, the polymer mask is separated from the underlying insulation layer 2 to thereby form the electrodes 3 and the alignment marks 4 on the underlying insulation layer 2.
[19] Fig. 2 illustrates a process for forming a sensor portion precursor in accordance with one embodiment of the present invention. Referring to Fig. 2, a photo- sensitive layer 5 composed of a polymer is applied on the upper surface of the underlying insulation layer 2 on which the electrodes 3 and the alignment marks 4 have been formed. A polymer mask 6 having a sensor portion pattern pierced therethrough is attached to the upper surface of the photo-sensitive layer 5. The alignment marks 4 are used in aligning the sensor portion pattern of the polymer mask 6 at a specified position on the underlying insulation layer 2.
[20] The photo-sensitive layer 5 is lithographed using the polymer mask 6 having the sensor portion pattern pierced therethrough. First, electron beams B are irradiated on
the photo-sensitive layer 5 from above the polymer mask 6, at which time only the electron beams passed through the sensor portion pattern reach the photo-sensitive layer 5. The photo-sensitive layer 5 is preferably made of a high molecular polymer. After the electron beams B are irradiated on the photo-sensitive layer 5 through the sensor portion pattern, the polymer mask 6 is separated from the photo-sensitive layer 5 and is then developed with a developer solution. As the photo-sensitive layer 5 is developed with the developer solution, the portion of the photo-sensitive layer 5 irradiated with the electron beams is left intact, but the portion of the photo-sensitive layer 5 not irradiated with the electron beams is completely dissolved away in the developer solution. Thus only a portion of the photo- sensitive layer 5 corresponding to the sensor portion pattern of the polymer mask 6, i.e., a sensor portion precursor, is left on the upper surface of the underlying insulation layer 2.
[21] Fig. 3 illustrates a process for forming a sensor portion by pyrolyzing the sensor portion precursor. Referring to Fig. 3, a sensor portion precursor 7 composed of a high molecular polymer is formed on the underlying insulation layer 2 after the photosensitive layer 5 is developed. Heat H is applied on the sensor portion precursor 7 to pyrolyze the same. The sensor portion precursor 7 thus pyrolyzed is converted to a sensor portion composed of conductive carbon. In other words, if the sensor portion precursor 7 is heated to an elevated temperature, nitrogen, oxygen and the like constituting the sensor portion precursor 7 are removed and only a carbon component is left as it is. The carbon component has an amorphous structure. The electric conductivity and residual stress of the pyrolyzed sensor portion precursor 7 varies depending on the heating temperature and time of the sensor portion precursor 7, the chemical components of the polymer constituting the sensor portion precursor 7 and the kind of additives added to the sensor portion precursor 7. Preferably, the sensor portion precursor 7 is pyrolyzed by heating the same to a temperature of from 5000C to 7000C for 0.5 to 2 hours in an oven. This produces a sensor portion 8 made from a pyrolyzed photo-sensitive sensor portion precursor.
[22] Fig. 4 illustrates the substrate provided with connector portions in accordance with one preferred embodiment of the present invention. Referring to Fig. 4, connector portions 9 for electrically interconnecting the sensor portion 8 and the electrodes 3 are formed through a photolithography process. More specifically, a polymer mask having patterns of the connector portions 9 pierced therethrough is attached to the underlying insulation layer 2 in alignment with the alignment marks 4 so that the connector portions 9 can be formed between the sensor portion 8 and the electrodes 3. A metallic material is applied on the polymer mask, at which time the metallic material is filled in the patterns of the connector portions 9. If the polymer mask is removed, the connector portions 9 for electrically interconnecting the sensor portion 8 and the electrodes 3 are
formed on the underlying insulation layer 2.
[23] Fig. 5 illustrates a biosensor having an exposure window in accordance with one embodiment of the present invention. Referring to Fig. 5, a covering insulation layer 10 is formed to the upper surface of the underlying insulation layer 2 on which the connector portions 9 are formed. The task of forming the covering insulation layer 10 on the underlying insulation layer 2 is performed by applying PMMA (polymethyl methacrylate), SOG (spin-on-glass), polyimide or the like on the upper surface of the underlying insulation layer 2 in a liquid or gas phase.
[24] An exposure window 11 through which to expose the sensor portion 8 to biomolecules is formed in the covering insulation layer 10 to lie just above the sensor portion 8. If a test solution is allowed to flow over the covering insulation layer 10 of the biosensor, a part of the test solution enters the exposure window 11 and makes contact with the sensor portion 8. Thus the biomolecules contained in the test solution adhere to the sensor portion 8. In this case, the electric resistance of the sensor portion 8 varies with the kind and amount of the biomolecules adhering to the sensor portion 8. The electric resistance of the sensor portion 8 can be measured by supplying an electric current to the sensor portion 8 through the electrodes 3 and the connector portions 9. Based on the electric resistance thus measured, it is possible to detect the kind and amount of the biomolecules adhering to the sensor portion 8.
[25] Fig. 6 is a section view of a biosensor in accordance with another embodiment of the present invention, specifically illustrating a sensor portion and its vicinity. Referring to Fig. 6, a portion of the underlying insulation layer 2 positioned below the sensor portion 8 is etched away to form a vacant space 12 between the sensor portion 8 and the substrate 1. Formation of the vacant space 12 makes it possible to reduce the electric resistance attributable to the contact between the underlying insulation layer 2 and the sensor portion 8. Accordingly, it is possible to accurately measure the change in electric resistance of the sensor portion 8 caused by the biomolecules adhering thereto. Industrial Applicability
[26] With the present invention, it is possible to cost-effectively and easily manufacture a micro biosensor by forming a sensor portion precursor with a high molecular polymer through a photolithography process and then pyrolyzing the sensor portion precursor to form a sensor portion composed of conductive carbon.
[27] In addition, the present biosensor is capable of accurately detecting biomolecules adhering to the sensor portion. This is because the biosensor is provided with an exposure window for allowing the biomolecules to make contact with the sensor portion with ease and because a vacant space is formed between the sensor portion and
the substrate.
[28] The embodiments set forth hereinabove have been presented for illustrative purpose only and, therefore, the present invention is not limited to these embodiments. It will be understood by those skilled in the art that various changes and modifications may be made without departing from the scope of the invention defined in the claims.
Claims
[1] A biosensor for detecting biomolecules, comprising: a sensor portion for making contact with biomolecules to be detected; an electrode for supplying an electric current to the sensor portion; and a connector portion for electrically interconnecting the sensor portion and the electrode, wherein the sensor portion is made from a pyrolyzed photo-sensitive sensor portion precursor obtained through a lithography process.
[2] The biosensor as recited in claim 1, further comprising an covering insulation layer formed on the sensor portion, the electrode and the connector portion, the covering insulation layer having an exposure window through which the sensor portion is exposed to the biomolecules to be detected.
[3] The biosensor as recited in claim 2, further comprising a substrate and an underlying insulation layer formed on the substrate, and wherein the sensor portion, the electrode and the connector portion are formed on the underlying insulation layer.
[4] The biosensor as recited in claim 3, wherein a portion of the underlying insulation layer positioned below the sensor portion is etched away to form a vacant space between the sensor portion and the substrate.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2007-0121047 | 2007-11-26 | ||
KR1020070121047A KR100927616B1 (en) | 2007-11-26 | 2007-11-26 | Biosensor with Carbon Sensing |
Publications (1)
Publication Number | Publication Date |
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WO2009069845A1 true WO2009069845A1 (en) | 2009-06-04 |
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Application Number | Title | Priority Date | Filing Date |
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PCT/KR2007/006801 WO2009069845A1 (en) | 2007-11-26 | 2007-12-24 | Bio-sensor having sensing unit made from nano-sized resist-derived carbon |
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KR (1) | KR100927616B1 (en) |
WO (1) | WO2009069845A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11275312B1 (en) | 2020-11-30 | 2022-03-15 | Waymo Llc | Systems and methods for verifying photomask cleanliness |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020088521A (en) * | 2001-05-18 | 2002-11-29 | 주식회사 아이센스 | Biosensors with porous chromatographic membranes and enhanced sampling capability |
KR20070033794A (en) * | 2005-09-22 | 2007-03-27 | 전자부품연구원 | Nanowire Device Manufacturing Method |
-
2007
- 2007-11-26 KR KR1020070121047A patent/KR100927616B1/en not_active IP Right Cessation
- 2007-12-24 WO PCT/KR2007/006801 patent/WO2009069845A1/en active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020088521A (en) * | 2001-05-18 | 2002-11-29 | 주식회사 아이센스 | Biosensors with porous chromatographic membranes and enhanced sampling capability |
KR20070033794A (en) * | 2005-09-22 | 2007-03-27 | 전자부품연구원 | Nanowire Device Manufacturing Method |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11275312B1 (en) | 2020-11-30 | 2022-03-15 | Waymo Llc | Systems and methods for verifying photomask cleanliness |
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KR20090054267A (en) | 2009-05-29 |
KR100927616B1 (en) | 2009-11-23 |
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