WO2009054049A1 - Substrate module, device having substrate module, and mounting method - Google Patents

Substrate module, device having substrate module, and mounting method Download PDF

Info

Publication number
WO2009054049A1
WO2009054049A1 PCT/JP2007/070660 JP2007070660W WO2009054049A1 WO 2009054049 A1 WO2009054049 A1 WO 2009054049A1 JP 2007070660 W JP2007070660 W JP 2007070660W WO 2009054049 A1 WO2009054049 A1 WO 2009054049A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
substrate module
mounting method
connector
section
Prior art date
Application number
PCT/JP2007/070660
Other languages
French (fr)
Japanese (ja)
Inventor
Misao Umematsu
Original Assignee
Fujitsu Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Limited filed Critical Fujitsu Limited
Priority to PCT/JP2007/070660 priority Critical patent/WO2009054049A1/en
Publication of WO2009054049A1 publication Critical patent/WO2009054049A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1487—Blade assemblies, e.g. blade cases or inner arrangements within a blade
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/185—Mounting of expansion boards

Abstract

A device is provided with a first substrate (30) for inputting/outputting signals; a connector (32) arranged on the first substrate (30); first fixing members (70a, 70b), which are arranged upright on the first substrate (30) and have hook sections (73); a second substrate (80), which is connected to the first substrate (30) through the connector (32) and inputs/outputs the signals; and a second fixing member (90), wherein a section (95) to be hooked to the hook section (73) is formed by bending a board-like member connected to the second substrate (80) to the side opposite to the second substrate (80).
PCT/JP2007/070660 2007-10-23 2007-10-23 Substrate module, device having substrate module, and mounting method WO2009054049A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/070660 WO2009054049A1 (en) 2007-10-23 2007-10-23 Substrate module, device having substrate module, and mounting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/070660 WO2009054049A1 (en) 2007-10-23 2007-10-23 Substrate module, device having substrate module, and mounting method

Publications (1)

Publication Number Publication Date
WO2009054049A1 true WO2009054049A1 (en) 2009-04-30

Family

ID=40579159

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/070660 WO2009054049A1 (en) 2007-10-23 2007-10-23 Substrate module, device having substrate module, and mounting method

Country Status (1)

Country Link
WO (1) WO2009054049A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01133796U (en) * 1988-03-03 1989-09-12
JPH04321296A (en) * 1991-04-22 1992-11-11 Matsushita Electric Ind Co Ltd Printed board mounting device
JPH1084193A (en) * 1996-08-13 1998-03-31 Samsung Electron Co Ltd Fixing device of subsidiary circuit board of electronic product
JP2005166907A (en) * 2003-12-02 2005-06-23 Funai Electric Co Ltd Vertical substrate fixing structure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01133796U (en) * 1988-03-03 1989-09-12
JPH04321296A (en) * 1991-04-22 1992-11-11 Matsushita Electric Ind Co Ltd Printed board mounting device
JPH1084193A (en) * 1996-08-13 1998-03-31 Samsung Electron Co Ltd Fixing device of subsidiary circuit board of electronic product
JP2005166907A (en) * 2003-12-02 2005-06-23 Funai Electric Co Ltd Vertical substrate fixing structure

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