WO2009052544A1 - Dispositif d'implantation d'ions - Google Patents
Dispositif d'implantation d'ions Download PDFInfo
- Publication number
- WO2009052544A1 WO2009052544A1 PCT/AU2007/001709 AU2007001709W WO2009052544A1 WO 2009052544 A1 WO2009052544 A1 WO 2009052544A1 AU 2007001709 W AU2007001709 W AU 2007001709W WO 2009052544 A1 WO2009052544 A1 WO 2009052544A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- filament
- gas
- anode
- magnetron
- way
- Prior art date
Links
- 238000005468 ion implantation Methods 0.000 title claims description 9
- 239000000919 ceramic Substances 0.000 claims description 8
- 210000002445 nipple Anatomy 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 239000010937 tungsten Substances 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims 9
- 239000003989 dielectric material Substances 0.000 claims 2
- 239000003779 heat-resistant material Substances 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 230000004048 modification Effects 0.000 claims 1
- 238000012986 modification Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 2
- 150000002500 ions Chemical class 0.000 description 7
- 230000004927 fusion Effects 0.000 description 2
- INFDPOAKFNIJBF-UHFFFAOYSA-N paraquat Chemical compound C1=C[N+](C)=CC=C1C1=CC=[N+](C)C=C1 INFDPOAKFNIJBF-UHFFFAOYSA-N 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005381 potential energy Methods 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
- H01J37/08—Ion sources; Ion guns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J27/00—Ion beam tubes
- H01J27/02—Ion sources; Ion guns
- H01J27/08—Ion sources; Ion guns using arc discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/06—Sources
- H01J2237/061—Construction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/06—Sources
- H01J2237/061—Construction
- H01J2237/062—Reducing size of gun
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/06—Sources
- H01J2237/08—Ion sources
- H01J2237/0815—Methods of ionisation
- H01J2237/082—Electron beam
Definitions
- the magnetron filament cathode being electrically heated and negatively biased compared to the annular anode, will during operation emit a planar stream of electrons outwards from the filament and towards the inside of the annular anode.
- the gas to be ionized may then be fed directly into the filament, where the gas will first be heated, before entering the ion chamber through the said planar stream of electrons, the consequent collisions between the gas molecules and the streaming electrons, will result in a high proportion of the gas molecules becoming ionized.
- the ionized gas molecules may consequently be accelerated or guided by way of electric potential fields.
- This invention relates to an ion implantation device, which can be manufactured with one of several standard vacuum flanges, in order that it may easily be fitted to existing vacuum chambers, where the implantation of gaseous ions are required.
- this device utilizes a commonly available microwave magnetron filament to heat and ionize the gas.
- the utilisation of a common microwave magnetron filament results in a highly effective device and significantly reduces the cost.
- the effectiveness of the novel design results from the way that the gas to be ionized is guided through the heated filament and injected directly into a powerful planar stream of electrons. Description of Drawings
- Standard vacuum flange clamps are required, and have been omitted from the diagram.
- the Starfire ion implantation device may be used wherever high flow rates of ionized gas is required, processes such as ion etching, ion cutting, ion implantation into particle accelerators or ion injection into electrostatic or magnetic confinement fusion reactors.
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Combustion & Propulsion (AREA)
- Electron Sources, Ion Sources (AREA)
Abstract
L'invention porte sur un nouveau dispositif et une nouvelle méthode d'ionisation et d'implantation de molécules de gaz dans un système à vide comprenant une cathode à filament chaud. La cathode est nichée dans une anode annulaire et ledit filament est chauffé par un courant à basse tension, et polarisé négativement par rapport à l'anode par un potentiel à haute tension. En fonctionnement, le dispositif crée un courant régulier plane d'électrons allant de la cathode à l'anode. Le gaz à ioniser passe sur ledit filament où ses molécules sont d'abord chauffées puis dépouillées d'un ou plusieurs de leurs électrons.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/AU2007/001709 WO2009052544A1 (fr) | 2007-10-26 | 2007-10-26 | Dispositif d'implantation d'ions |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/AU2007/001709 WO2009052544A1 (fr) | 2007-10-26 | 2007-10-26 | Dispositif d'implantation d'ions |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009052544A1 true WO2009052544A1 (fr) | 2009-04-30 |
Family
ID=40578944
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/AU2007/001709 WO2009052544A1 (fr) | 2007-10-26 | 2007-10-26 | Dispositif d'implantation d'ions |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2009052544A1 (fr) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5350905A (en) * | 1991-11-20 | 1994-09-27 | Goldstar Co., Ltd. | Magnetron for a microwave oven |
US6350356B1 (en) * | 1997-11-26 | 2002-02-26 | Vapor Technologies, Inc. | Linear magnetron arc evaporation or sputtering source |
US20070114435A1 (en) * | 2005-10-07 | 2007-05-24 | Kwon Ui-Hui | Filament member, ion source, and ion implantation apparatus |
-
2007
- 2007-10-26 WO PCT/AU2007/001709 patent/WO2009052544A1/fr active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5350905A (en) * | 1991-11-20 | 1994-09-27 | Goldstar Co., Ltd. | Magnetron for a microwave oven |
US6350356B1 (en) * | 1997-11-26 | 2002-02-26 | Vapor Technologies, Inc. | Linear magnetron arc evaporation or sputtering source |
US20070114435A1 (en) * | 2005-10-07 | 2007-05-24 | Kwon Ui-Hui | Filament member, ion source, and ion implantation apparatus |
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