WO2009046702A3 - Device and method for forming coatings on substrates inside vacuum chambers - Google Patents

Device and method for forming coatings on substrates inside vacuum chambers Download PDF

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Publication number
WO2009046702A3
WO2009046702A3 PCT/DE2008/001650 DE2008001650W WO2009046702A3 WO 2009046702 A3 WO2009046702 A3 WO 2009046702A3 DE 2008001650 W DE2008001650 W DE 2008001650W WO 2009046702 A3 WO2009046702 A3 WO 2009046702A3
Authority
WO
WIPO (PCT)
Prior art keywords
anode
fingers
cathode
connection contact
oriented
Prior art date
Application number
PCT/DE2008/001650
Other languages
German (de)
French (fr)
Other versions
WO2009046702A2 (en
Inventor
Carl-Friedrich Meyer
Original Assignee
Fraunhofer Ges Forschung
Carl-Friedrich Meyer
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Ges Forschung, Carl-Friedrich Meyer filed Critical Fraunhofer Ges Forschung
Publication of WO2009046702A2 publication Critical patent/WO2009046702A2/en
Publication of WO2009046702A3 publication Critical patent/WO2009046702A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32541—Shape
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32055—Arc discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32568—Relative arrangement or disposition of electrodes; moving means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3438—Electrodes other than cathode

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Plasma Technology (AREA)

Abstract

In the device, a pulsed direct current arc is ignited between at least one cathode and at least one anode (1), and thereby a plasma is formed. In addition, the cathode(s) and anode(s) can be moved relative to each other. Multiple anode fingers (9) are present on the anodes and are separated from each other entirely or partially by slits, the anode fingers oriented in the direction of a substrate to be coated. The anode(s) are constructed with an anode foot (1.1), which is designed in the shape of a flange oriented radially to the outside. An electrical connection contact (6) of the anode is arranged there. In one embodiment, an anode finger foot (9.1) oriented outward is present on the anode fingers and has an electrical connection contact. The anode fingers can also be connected to a connection contact in an electrically conducting manner, such that a magnetic field is formed with the anode current, to guide electric arc discharges about the arc spot thereof on the cathode.
PCT/DE2008/001650 2007-10-10 2008-10-06 Device and method for forming coatings on substrates inside vacuum chambers WO2009046702A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200710049649 DE102007049649B4 (en) 2007-10-10 2007-10-10 Apparatus and method for forming coatings on substrates within vacuum chambers
DE102007049649.6 2007-10-10

Publications (2)

Publication Number Publication Date
WO2009046702A2 WO2009046702A2 (en) 2009-04-16
WO2009046702A3 true WO2009046702A3 (en) 2009-06-18

Family

ID=40260879

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2008/001650 WO2009046702A2 (en) 2007-10-10 2008-10-06 Device and method for forming coatings on substrates inside vacuum chambers

Country Status (2)

Country Link
DE (1) DE102007049649B4 (en)
WO (1) WO2009046702A2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000013201A1 (en) * 1998-08-26 2000-03-09 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Device and method for coating substrates in a vacuum
US20070034501A1 (en) * 2005-08-09 2007-02-15 Efim Bender Cathode-arc source of metal/carbon plasma with filtration
EP1826810A2 (en) * 2006-02-22 2007-08-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Assembly for separating particles from a plasma

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3836451A (en) * 1968-12-26 1974-09-17 A Snaper Arc deposition apparatus
DE4401986A1 (en) * 1994-01-25 1995-07-27 Dresden Vakuumtech Gmbh Method for operating a vacuum arc evaporator and power supply device therefor
IL116939A0 (en) * 1996-01-29 1996-05-14 Netanya Plasmatek Ltd Plasma torch apparatus
DE19850217C1 (en) 1998-08-26 2000-03-30 Fraunhofer Ges Forschung Coating of substrates in vacuum involves using a porous target which also functions for intermediate storage and/or passage of a gas or a gas mixture being supplied to the plasma
DE19924094C2 (en) 1999-05-21 2003-04-30 Fraunhofer Ges Forschung Vacuum arc evaporator and method for its operation
DE10024827B4 (en) * 1999-11-17 2008-03-27 Applied Materials Gmbh & Co. Kg Electrode arrangement and its use

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000013201A1 (en) * 1998-08-26 2000-03-09 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Device and method for coating substrates in a vacuum
US20070034501A1 (en) * 2005-08-09 2007-02-15 Efim Bender Cathode-arc source of metal/carbon plasma with filtration
EP1826810A2 (en) * 2006-02-22 2007-08-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Assembly for separating particles from a plasma

Also Published As

Publication number Publication date
DE102007049649B4 (en) 2011-12-08
DE102007049649A1 (en) 2009-04-16
WO2009046702A2 (en) 2009-04-16

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