WO2009044646A1 - Substrate treating apparatus and substrate treating method - Google Patents

Substrate treating apparatus and substrate treating method Download PDF

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Publication number
WO2009044646A1
WO2009044646A1 PCT/JP2008/067101 JP2008067101W WO2009044646A1 WO 2009044646 A1 WO2009044646 A1 WO 2009044646A1 JP 2008067101 W JP2008067101 W JP 2008067101W WO 2009044646 A1 WO2009044646 A1 WO 2009044646A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate treating
drying chamber
wafer
drying
supplied
Prior art date
Application number
PCT/JP2008/067101
Other languages
French (fr)
Japanese (ja)
Inventor
Hiroshi Tanaka
Toshiyuki Shiokawa
Takao Inada
Original Assignee
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007327442A external-priority patent/JP5122265B2/en
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Priority to US12/680,799 priority Critical patent/US9070549B2/en
Publication of WO2009044646A1 publication Critical patent/WO2009044646A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

While a wafer (W) is immersed in a cleaning liquid in a cleaning bath (22), a drying gas is supplied in a generally horizontal direction, in an oblique direction slightly downward with respect to the generally horizontal direction, or in a vertically downward direction into a drying chamber (23). While the drying gas is being supplied into the drying chamber (23), the wafer (W) is transferred from the cleaning bath (22) into the drying chamber (23). When a part of the wafer (W) is still in the cleaning liquid, the supply of the cleaning gas is stopped. After the wafer (W) is transferred into the drying chamber (23), the drying gas is supplied into the drying chamber (23) in an oblique direction slightly upward with respect to the generally horizontal direction or in a vertical upward direction.
PCT/JP2008/067101 2007-10-01 2008-09-22 Substrate treating apparatus and substrate treating method WO2009044646A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/680,799 US9070549B2 (en) 2007-10-01 2008-09-22 Substrate processing apparatus and substrate processing method

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007257806 2007-10-01
JP2007-257806 2007-10-01
JP2007-327442 2007-12-19
JP2007327442A JP5122265B2 (en) 2007-10-01 2007-12-19 Substrate processing apparatus and substrate processing method

Publications (1)

Publication Number Publication Date
WO2009044646A1 true WO2009044646A1 (en) 2009-04-09

Family

ID=40526074

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/067101 WO2009044646A1 (en) 2007-10-01 2008-09-22 Substrate treating apparatus and substrate treating method

Country Status (1)

Country Link
WO (1) WO2009044646A1 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10163164A (en) * 1996-12-04 1998-06-19 Dainippon Screen Mfg Co Ltd Substrate treatment method and substrate treatment apparatus
JPH1116876A (en) * 1997-06-27 1999-01-22 Tokyo Electron Ltd Apparatus for dry processing
JP2002299310A (en) * 2001-03-29 2002-10-11 Dainippon Screen Mfg Co Ltd Substrate processing apparatus
JP2003075067A (en) * 2002-05-30 2003-03-12 Dainippon Screen Mfg Co Ltd Cleaning/drying apparatus for substrate
JP2006332244A (en) * 2005-05-25 2006-12-07 Dainippon Screen Mfg Co Ltd Substrate processing apparatus and substrate processing method
JP2006332642A (en) * 2005-05-26 2006-12-07 Semes Co Ltd Substrate cleaning/drying apparatus and method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10163164A (en) * 1996-12-04 1998-06-19 Dainippon Screen Mfg Co Ltd Substrate treatment method and substrate treatment apparatus
JPH1116876A (en) * 1997-06-27 1999-01-22 Tokyo Electron Ltd Apparatus for dry processing
JP2002299310A (en) * 2001-03-29 2002-10-11 Dainippon Screen Mfg Co Ltd Substrate processing apparatus
JP2003075067A (en) * 2002-05-30 2003-03-12 Dainippon Screen Mfg Co Ltd Cleaning/drying apparatus for substrate
JP2006332244A (en) * 2005-05-25 2006-12-07 Dainippon Screen Mfg Co Ltd Substrate processing apparatus and substrate processing method
JP2006332642A (en) * 2005-05-26 2006-12-07 Semes Co Ltd Substrate cleaning/drying apparatus and method

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