WO2009041357A1 - Photosensitive composition and method of forming pattern from the same - Google Patents

Photosensitive composition and method of forming pattern from the same Download PDF

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Publication number
WO2009041357A1
WO2009041357A1 PCT/JP2008/066973 JP2008066973W WO2009041357A1 WO 2009041357 A1 WO2009041357 A1 WO 2009041357A1 JP 2008066973 W JP2008066973 W JP 2008066973W WO 2009041357 A1 WO2009041357 A1 WO 2009041357A1
Authority
WO
WIPO (PCT)
Prior art keywords
photosensitive composition
acid
decomposes
come
polymer
Prior art date
Application number
PCT/JP2008/066973
Other languages
French (fr)
Japanese (ja)
Inventor
Sou Kamimura
Shuji Hirano
Original Assignee
Fujifilm Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corporation filed Critical Fujifilm Corporation
Publication of WO2009041357A1 publication Critical patent/WO2009041357A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

A photosensitive composition for use in steps for producing semiconductor devices including ICs, in the production of circuit boards for liquid crystals, thermal heads, etc., and in other photofabrication steps, etc. It has been improved in four points, i.e., sensitivity, resolution, line edge roughness, and pattern falling. Also provided is a method of forming a pattern from the composition. The photosensitive composition comprises (A) a polymer which has repeating units of a specific acetal structure having a leaving group not having a cyclic structure therein and which decomposes by the action of an acid to come to have enhanced solubility in an alkaline developing solution, (B) a polymer which has repeating units of a specific acetal structure having a leaving group having a cyclic structure therein and which decomposes by the action of an acid to come to have enhanced solubility in an alkaline developing solution, and (C) a compound which generates an acid upon irradiation with actinic rays or a radiation.
PCT/JP2008/066973 2007-09-25 2008-09-19 Photosensitive composition and method of forming pattern from the same WO2009041357A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-247251 2007-09-25
JP2007247251A JP2009080162A (en) 2007-09-25 2007-09-25 Photosensitive composition and pattern forming method using the same

Publications (1)

Publication Number Publication Date
WO2009041357A1 true WO2009041357A1 (en) 2009-04-02

Family

ID=40511242

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/066973 WO2009041357A1 (en) 2007-09-25 2008-09-19 Photosensitive composition and method of forming pattern from the same

Country Status (2)

Country Link
JP (1) JP2009080162A (en)
WO (1) WO2009041357A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015159655A1 (en) * 2014-04-16 2015-10-22 東レ株式会社 Photosensitive resin composition, method for manufacturing conductive pattern, substrate, element, and touchscreen
CN113227178A (en) * 2019-10-02 2021-08-06 丸善石油化学株式会社 Crosslinked polymer for resist

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6910108B2 (en) * 2015-03-31 2021-07-28 住友化学株式会社 Method for manufacturing resin, resist composition and resist pattern
JPWO2020129611A1 (en) * 2018-12-20 2021-11-04 丸善石油化学株式会社 Polymer for resist having hydrophilic protecting group

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002139838A (en) * 2000-10-31 2002-05-17 Fuji Photo Film Co Ltd Positive type resist composition
JP2004078106A (en) * 2002-08-22 2004-03-11 Fuji Photo Film Co Ltd Positive type photoresist composition
JP2004271629A (en) * 2003-03-05 2004-09-30 Fuji Photo Film Co Ltd Positive resist composition
JP2004287195A (en) * 2003-03-24 2004-10-14 Fuji Photo Film Co Ltd Positive resist composition
JP2004333549A (en) * 2003-04-30 2004-11-25 Tokyo Ohka Kogyo Co Ltd Positive resist composition and method of forming resist pattern
WO2006059569A1 (en) * 2004-12-03 2006-06-08 Tokyo Ohka Kogyo Co., Ltd. Positive resist composition and method of forming resist pattern

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002139838A (en) * 2000-10-31 2002-05-17 Fuji Photo Film Co Ltd Positive type resist composition
JP2004078106A (en) * 2002-08-22 2004-03-11 Fuji Photo Film Co Ltd Positive type photoresist composition
JP2004271629A (en) * 2003-03-05 2004-09-30 Fuji Photo Film Co Ltd Positive resist composition
JP2004287195A (en) * 2003-03-24 2004-10-14 Fuji Photo Film Co Ltd Positive resist composition
JP2004333549A (en) * 2003-04-30 2004-11-25 Tokyo Ohka Kogyo Co Ltd Positive resist composition and method of forming resist pattern
WO2006059569A1 (en) * 2004-12-03 2006-06-08 Tokyo Ohka Kogyo Co., Ltd. Positive resist composition and method of forming resist pattern

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015159655A1 (en) * 2014-04-16 2015-10-22 東レ株式会社 Photosensitive resin composition, method for manufacturing conductive pattern, substrate, element, and touchscreen
JPWO2015159655A1 (en) * 2014-04-16 2017-04-13 東レ株式会社 Photosensitive resin composition, method for producing conductive pattern, substrate, element and touch panel
US10001704B2 (en) 2014-04-16 2018-06-19 Toray Industries, Inc. Photosensitive resin composition, method of manufacturing conductive pattern, substrate, element, and touch panel
CN113227178A (en) * 2019-10-02 2021-08-06 丸善石油化学株式会社 Crosslinked polymer for resist
CN113227178B (en) * 2019-10-02 2023-09-22 丸善石油化学株式会社 Crosslinked polymer for resist

Also Published As

Publication number Publication date
JP2009080162A (en) 2009-04-16

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