WO2009037645A3 - Led package - Google Patents

Led package Download PDF

Info

Publication number
WO2009037645A3
WO2009037645A3 PCT/IB2008/053763 IB2008053763W WO2009037645A3 WO 2009037645 A3 WO2009037645 A3 WO 2009037645A3 IB 2008053763 W IB2008053763 W IB 2008053763W WO 2009037645 A3 WO2009037645 A3 WO 2009037645A3
Authority
WO
WIPO (PCT)
Prior art keywords
optical element
lighting element
emitting surface
substrate
led package
Prior art date
Application number
PCT/IB2008/053763
Other languages
French (fr)
Other versions
WO2009037645A2 (en
Inventor
Wouter P Kaandorp
Jan Kloosterman
Josef A Schug
Original Assignee
Philips Intellectual Property
Koninkl Philips Electronics Nv
Wouter P Kaandorp
Jan Kloosterman
Josef A Schug
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Intellectual Property, Koninkl Philips Electronics Nv, Wouter P Kaandorp, Jan Kloosterman, Josef A Schug filed Critical Philips Intellectual Property
Publication of WO2009037645A2 publication Critical patent/WO2009037645A2/en
Publication of WO2009037645A3 publication Critical patent/WO2009037645A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/155—Surface emitters, e.g. organic light emitting diodes [OLED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/176—Light sources where the light is generated by photoluminescent material spaced from a primary light generating element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

It is provided a LED package (10) for use in a lamp, particularly headlight or taillight of a motor vehicle, comprising a substrate (12) comprising an upper surface (18), at least one lighting element (14) for emitting light via an emitting surface (40) pointing away from the upper surface, wherein the lighting element (14) comprises a LED (28) connected to the substrate, and an optical element (16) for guiding the emitted light, whereby the optical element comprises an aperture (34) by which the lighting element is received and the optical element extends from above the emitting surface at least partially to until below the lighting element for at least partially receiving the substrate. Since the optical element extends over the whole height of the lighting element not only the whole light emitted via the emitting surface but also the whole light emitted via side faces connected to the emitting surface are guided by the optical element and used for illumination leading to an improved efficiency of the LED package.
PCT/IB2008/053763 2007-09-20 2008-09-17 Led package WO2009037645A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP07116837.1 2007-09-20
EP07116837 2007-09-20

Publications (2)

Publication Number Publication Date
WO2009037645A2 WO2009037645A2 (en) 2009-03-26
WO2009037645A3 true WO2009037645A3 (en) 2009-07-09

Family

ID=40430015

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2008/053763 WO2009037645A2 (en) 2007-09-20 2008-09-17 Led package

Country Status (2)

Country Link
TW (1) TW200931683A (en)
WO (1) WO2009037645A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6880328B2 (en) * 2018-09-07 2021-06-02 ルミレッズ ホールディング ベーフェー Support for light emitting elements and luminaires
CN114341545A (en) 2019-07-08 2022-04-12 亮锐控股有限公司 Support for light emitting elements and lighting devices
EP3819533A1 (en) 2019-11-06 2021-05-12 Lumileds Holding B.V. Carrier for lighting modules and lighting device
EP3875838B1 (en) * 2020-03-06 2023-09-20 Lumileds Holding B.V. Lighting device with light guide
JP2023525000A (en) * 2020-05-07 2023-06-14 ルミレッズ リミテッド ライアビリティ カンパニー Lighting device including support structure with improved thermal and optical properties

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6063970A (en) * 1983-09-17 1985-04-12 Fanuc Ltd Light emitting diode radiating parallel rays
JP2002043629A (en) * 2000-07-24 2002-02-08 Yamakawa Akira Led projector and lens body for use therein
WO2003036720A2 (en) * 2001-10-22 2003-05-01 Koninklijke Philips Electronics N.V. Led chip package
WO2004068597A2 (en) * 2003-01-27 2004-08-12 3M Innovative Properties Company Phosphor based light sources utilizing total internal reflection
WO2005083804A1 (en) * 2004-01-29 2005-09-09 Acol Technologies S.A. Light emitting diode with integral heat dissipation means
US20050219840A1 (en) * 2004-03-30 2005-10-06 Holder Ronald G Apparatus and method for improved illumination area fill
WO2006089450A2 (en) * 2005-02-28 2006-08-31 Lucea Ag Wey & Spiess Treuhand- Und Revisionsgesellschaft Light source
US20060268555A1 (en) * 2004-02-17 2006-11-30 Kelly William M Utility lamp
US20070120109A1 (en) * 2005-11-30 2007-05-31 Fujifilm Corporation Surface light-source device using light-emitting elements

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6476551B1 (en) 1998-01-30 2002-11-05 Ricoh Company, Ltd. LED array head and minute reflection optical elements array for use in the LED array head

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6063970A (en) * 1983-09-17 1985-04-12 Fanuc Ltd Light emitting diode radiating parallel rays
JP2002043629A (en) * 2000-07-24 2002-02-08 Yamakawa Akira Led projector and lens body for use therein
WO2003036720A2 (en) * 2001-10-22 2003-05-01 Koninklijke Philips Electronics N.V. Led chip package
WO2004068597A2 (en) * 2003-01-27 2004-08-12 3M Innovative Properties Company Phosphor based light sources utilizing total internal reflection
WO2005083804A1 (en) * 2004-01-29 2005-09-09 Acol Technologies S.A. Light emitting diode with integral heat dissipation means
US20060268555A1 (en) * 2004-02-17 2006-11-30 Kelly William M Utility lamp
US20050219840A1 (en) * 2004-03-30 2005-10-06 Holder Ronald G Apparatus and method for improved illumination area fill
WO2006089450A2 (en) * 2005-02-28 2006-08-31 Lucea Ag Wey & Spiess Treuhand- Und Revisionsgesellschaft Light source
US20070120109A1 (en) * 2005-11-30 2007-05-31 Fujifilm Corporation Surface light-source device using light-emitting elements

Also Published As

Publication number Publication date
WO2009037645A2 (en) 2009-03-26
TW200931683A (en) 2009-07-16

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