WO2009034610A1 - Method of preventing detachment of deposited film on substrate retention tool in thin-film forming apparatus and thin-film forming apparatus - Google Patents

Method of preventing detachment of deposited film on substrate retention tool in thin-film forming apparatus and thin-film forming apparatus Download PDF

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Publication number
WO2009034610A1
WO2009034610A1 PCT/JP2007/067637 JP2007067637W WO2009034610A1 WO 2009034610 A1 WO2009034610 A1 WO 2009034610A1 JP 2007067637 W JP2007067637 W JP 2007067637W WO 2009034610 A1 WO2009034610 A1 WO 2009034610A1
Authority
WO
WIPO (PCT)
Prior art keywords
thin
forming apparatus
film
film forming
substrate
Prior art date
Application number
PCT/JP2007/067637
Other languages
French (fr)
Japanese (ja)
Inventor
Hitoshi Jimba
Masahiro Shibamoto
David Djulianto Djayaprawira
Original Assignee
Canon Anelva Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Anelva Corporation filed Critical Canon Anelva Corporation
Priority to PCT/JP2007/067637 priority Critical patent/WO2009034610A1/en
Publication of WO2009034610A1 publication Critical patent/WO2009034610A1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/85—Coating a support with a magnetic layer by vapour deposition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

On a return traveling passage between unload lock chamber (2) for recovering substrate (9) after film formation from substrate retention tool (90) and load lock chamber (1) for mounting substrate (9) before film formation on the substrate retention tool (90), film detachment preventing chamber (710) is airtightly connected to the unload lock chamber (2) and the load lock chamber (1). The film detachment preventing chamber (710) thereinside is provided with film coating means for coating on the deposition film of the surfaces of substrate retention tool (90) and retention claw (91).
PCT/JP2007/067637 2007-09-11 2007-09-11 Method of preventing detachment of deposited film on substrate retention tool in thin-film forming apparatus and thin-film forming apparatus WO2009034610A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/067637 WO2009034610A1 (en) 2007-09-11 2007-09-11 Method of preventing detachment of deposited film on substrate retention tool in thin-film forming apparatus and thin-film forming apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/067637 WO2009034610A1 (en) 2007-09-11 2007-09-11 Method of preventing detachment of deposited film on substrate retention tool in thin-film forming apparatus and thin-film forming apparatus

Publications (1)

Publication Number Publication Date
WO2009034610A1 true WO2009034610A1 (en) 2009-03-19

Family

ID=40451635

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/067637 WO2009034610A1 (en) 2007-09-11 2007-09-11 Method of preventing detachment of deposited film on substrate retention tool in thin-film forming apparatus and thin-film forming apparatus

Country Status (1)

Country Link
WO (1) WO2009034610A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09199424A (en) * 1996-01-17 1997-07-31 Hitachi Ltd Epitaxial growth
JP2001156158A (en) * 1999-11-24 2001-06-08 Anelva Corp Thin-film forming apparatus
JP2004137556A (en) * 2002-10-17 2004-05-13 Renesas Technology Corp Semiconductor manufacturing apparatus
JP2007084908A (en) * 2005-09-26 2007-04-05 Tokyo Electron Ltd Substrate treatment method and recording medium

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09199424A (en) * 1996-01-17 1997-07-31 Hitachi Ltd Epitaxial growth
JP2001156158A (en) * 1999-11-24 2001-06-08 Anelva Corp Thin-film forming apparatus
JP2004137556A (en) * 2002-10-17 2004-05-13 Renesas Technology Corp Semiconductor manufacturing apparatus
JP2007084908A (en) * 2005-09-26 2007-04-05 Tokyo Electron Ltd Substrate treatment method and recording medium

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