WO2009028364A1 - Dicing apparatus - Google Patents

Dicing apparatus Download PDF

Info

Publication number
WO2009028364A1
WO2009028364A1 PCT/JP2008/064799 JP2008064799W WO2009028364A1 WO 2009028364 A1 WO2009028364 A1 WO 2009028364A1 JP 2008064799 W JP2008064799 W JP 2008064799W WO 2009028364 A1 WO2009028364 A1 WO 2009028364A1
Authority
WO
WIPO (PCT)
Prior art keywords
bellows
oil pan
remnants
dicing apparatus
tables
Prior art date
Application number
PCT/JP2008/064799
Other languages
French (fr)
Japanese (ja)
Inventor
Junichi Ito
Original Assignee
Tokyo Seimitsu Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co., Ltd. filed Critical Tokyo Seimitsu Co., Ltd.
Priority to JP2009530058A priority Critical patent/JPWO2009028364A1/en
Publication of WO2009028364A1 publication Critical patent/WO2009028364A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Auxiliary Devices For Machine Tools (AREA)

Abstract

Provided is a dicing apparatus, which arranges an oil pan (20) just below X-tables (16 and 18) thereby to retain the capacity of the oil pan (20) sufficiently and to improve the drainage. In the dicing apparatus (1), guide rails (22 and 36) and ball screws (24 and 38) for guiding the X-tables (16 and 18) movably in an X-direction are arranged along the side faces of the oil pan (20), and a pair of bellows (34 and 46) for covering the guide rails (22 and 36) and the ball screws (24 and 38) are likewise arranged vertically along the side faces of the oil pan (20). The remnants having stuck to the bellows (34 and 46) flow down along the bellows (34 and 46) by their own weights, and drop into the oil pan (20) having a sufficient capacity, so that they are discharged. As a result, the remnants do not deposit in the bellows (34 and 46), so that the breakage of the bellows (34 and 46), as might otherwise be caused by the deposition of the remnants, can be prevented.
PCT/JP2008/064799 2007-08-28 2008-08-20 Dicing apparatus WO2009028364A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009530058A JPWO2009028364A1 (en) 2007-08-28 2008-08-20 Dicing machine

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007220930 2007-08-28
JP2007-220930 2007-08-28

Publications (1)

Publication Number Publication Date
WO2009028364A1 true WO2009028364A1 (en) 2009-03-05

Family

ID=40387087

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/064799 WO2009028364A1 (en) 2007-08-28 2008-08-20 Dicing apparatus

Country Status (3)

Country Link
JP (1) JPWO2009028364A1 (en)
TW (1) TW200911455A (en)
WO (1) WO2009028364A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112405219A (en) * 2020-10-20 2021-02-26 南京合信自动化有限公司 Environment-friendly polishing robot with quick positioning mechanism for machining mechanical parts

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5495832B2 (en) * 2009-04-24 2014-05-21 株式会社東京精密 Dicing apparatus, dicing apparatus unit and dicing method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003197560A (en) * 2001-12-21 2003-07-11 Tokyo Seimitsu Co Ltd Dicing machine
JP2005349551A (en) * 2004-06-14 2005-12-22 Sodick Co Ltd Cutting device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003197560A (en) * 2001-12-21 2003-07-11 Tokyo Seimitsu Co Ltd Dicing machine
JP2005349551A (en) * 2004-06-14 2005-12-22 Sodick Co Ltd Cutting device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112405219A (en) * 2020-10-20 2021-02-26 南京合信自动化有限公司 Environment-friendly polishing robot with quick positioning mechanism for machining mechanical parts
CN112405219B (en) * 2020-10-20 2022-09-23 南京合信自动化有限公司 Machine parts machining is with machine people of polishing with quick positioning mechanism

Also Published As

Publication number Publication date
JPWO2009028364A1 (en) 2010-12-02
TW200911455A (en) 2009-03-16

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