WO2009028227A1 - 木質チップの配向積層装置および配向積層体の製造方法 - Google Patents

木質チップの配向積層装置および配向積層体の製造方法 Download PDF

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Publication number
WO2009028227A1
WO2009028227A1 PCT/JP2008/055641 JP2008055641W WO2009028227A1 WO 2009028227 A1 WO2009028227 A1 WO 2009028227A1 JP 2008055641 W JP2008055641 W JP 2008055641W WO 2009028227 A1 WO2009028227 A1 WO 2009028227A1
Authority
WO
WIPO (PCT)
Prior art keywords
orienting
wood chips
transporting
chips
laminating
Prior art date
Application number
PCT/JP2008/055641
Other languages
English (en)
French (fr)
Inventor
Yasuyuki Kori
Masaki Shimada
Original Assignee
Sekisui Chemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008020912A external-priority patent/JP2009073163A/ja
Application filed by Sekisui Chemical Co., Ltd. filed Critical Sekisui Chemical Co., Ltd.
Publication of WO2009028227A1 publication Critical patent/WO2009028227A1/ja

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/08—Moulding or pressing
    • B27N3/10—Moulding of mats
    • B27N3/14—Distributing or orienting the particles or fibres
    • B27N3/143—Orienting the particles or fibres

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)

Abstract

　木質チップの搬送の際における滞留に伴う上下方向の配向の不具合を解消した木質チップの配向積層装置や配向積層方法を提供する。 　木質チップの配向積層装置を、幅方向に均された状態で供給手段から連続的に供給される、結合剤の混和された木質チップを搬送手段の搬送方向に配向する配向手段と、該配向手段により配向状態にされた木質チップを積層させながら搬送する搬送手段とを備えてなるものであって、木質チップの滑り止め処理が該搬送手段に施されているか、或いは、木質チップの滑り止め処理を施すための機器が付設されているものとする。
PCT/JP2008/055641 2007-08-29 2008-03-26 木質チップの配向積層装置および配向積層体の製造方法 WO2009028227A1 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-222452 2007-08-29
JP2007222452 2007-08-29
JP2008-020912 2008-01-31
JP2008020912A JP2009073163A (ja) 2007-08-29 2008-01-31 木質チップの配向積層装置および配向積層体の製造方法

Publications (1)

Publication Number Publication Date
WO2009028227A1 true WO2009028227A1 (ja) 2009-03-05

Family

ID=40386959

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055641 WO2009028227A1 (ja) 2007-08-29 2008-03-26 木質チップの配向積層装置および配向積層体の製造方法

Country Status (1)

Country Link
WO (1) WO2009028227A1 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3515099B2 (ja) * 2002-03-27 2004-04-05 積水化学工業株式会社 木質系複合材の製造方法
JP2004292168A (ja) * 2003-03-11 2004-10-21 Sekisui Chem Co Ltd 木質チップの配向積層装置および配向積層方法
JP2005053215A (ja) * 2003-03-12 2005-03-03 Sekisui Chem Co Ltd 木質チップの配向積層装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3515099B2 (ja) * 2002-03-27 2004-04-05 積水化学工業株式会社 木質系複合材の製造方法
JP2004292168A (ja) * 2003-03-11 2004-10-21 Sekisui Chem Co Ltd 木質チップの配向積層装置および配向積層方法
JP2005053215A (ja) * 2003-03-12 2005-03-03 Sekisui Chem Co Ltd 木質チップの配向積層装置

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