WO2009025078A1 - Structure de connexion et procédé de connexion - Google Patents

Structure de connexion et procédé de connexion Download PDF

Info

Publication number
WO2009025078A1
WO2009025078A1 PCT/JP2008/002207 JP2008002207W WO2009025078A1 WO 2009025078 A1 WO2009025078 A1 WO 2009025078A1 JP 2008002207 W JP2008002207 W JP 2008002207W WO 2009025078 A1 WO2009025078 A1 WO 2009025078A1
Authority
WO
WIPO (PCT)
Prior art keywords
connection
connection structure
resistor
diode
led chip
Prior art date
Application number
PCT/JP2008/002207
Other languages
English (en)
Japanese (ja)
Inventor
Noritsugu Enomoto
Takenobu Yabu
Shigeki Motomura
Yoshiyuki Suzuki
Original Assignee
The Furukawa Electric Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007217031A external-priority patent/JP4934545B2/ja
Priority claimed from JP2007217033A external-priority patent/JP4823987B2/ja
Priority claimed from JP2007217030A external-priority patent/JP4934544B2/ja
Priority claimed from JP2007217032A external-priority patent/JP4934546B2/ja
Priority claimed from JP2007217029A external-priority patent/JP4934543B2/ja
Application filed by The Furukawa Electric Co., Ltd. filed Critical The Furukawa Electric Co., Ltd.
Publication of WO2009025078A1 publication Critical patent/WO2009025078A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/002—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips making direct electrical contact, e.g. by piercing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/02002—Arrangements for conducting electric current to or from the device in operations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Led Device Packages (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

L'invention concerne une structure de connexion qui facilite une connexion d'une puce DEL (31), d'une diode (32) et d'une résistance (33) à un câble plat (100). La structure de connexion a un boîtier de dispositif (11) pour contenir la puce DEL (31), la diode (32) et la résistance (33) et a aussi un boîtier de borne (12) pour contenir des bornes plates (21) et des bornes (22, 23) avec des pattes.
PCT/JP2008/002207 2007-08-23 2008-08-13 Structure de connexion et procédé de connexion WO2009025078A1 (fr)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP2007217031A JP4934545B2 (ja) 2007-01-10 2007-08-23 接続構造及び接続方法
JP2007-217029 2007-08-23
JP2007217033A JP4823987B2 (ja) 2007-01-10 2007-08-23 接続構造及び接続方法
JP2007217030A JP4934544B2 (ja) 2007-01-10 2007-08-23 接続構造及び接続方法
JP2007217032A JP4934546B2 (ja) 2007-01-10 2007-08-23 接続構造及び接続方法
JP2007-217030 2007-08-23
JP2007217029A JP4934543B2 (ja) 2007-01-10 2007-08-23 接続構造及び接続方法
JP2007-217032 2007-08-23
JP2007-217033 2007-08-23
JP2007-217031 2007-08-23

Publications (1)

Publication Number Publication Date
WO2009025078A1 true WO2009025078A1 (fr) 2009-02-26

Family

ID=40379713

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/002207 WO2009025078A1 (fr) 2007-08-23 2008-08-13 Structure de connexion et procédé de connexion

Country Status (1)

Country Link
WO (1) WO2009025078A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016001395A1 (fr) * 2014-07-04 2016-01-07 Idz Concept Embase de support pour composant electrique cable, module d'eclairage correspondant, procede de realisation d'un module associe et vetement correspondant
EP3091275A1 (fr) * 2015-05-08 2016-11-09 OSRAM GmbH Procédé d'assemblage de dispositifs d'éclairage et dispositif correspondant

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5961051A (ja) * 1982-09-30 1984-04-07 Fujitsu Ltd Ｉｃソケツト
JPH0745346A (ja) * 1993-07-30 1995-02-14 Nec Corp チップ部品用ソケット
JPH0951070A (ja) * 1995-08-08 1997-02-18 Fujitsu Ltd パッケージ
WO2005088191A1 (fr) * 2004-03-11 2005-09-22 Moriyama Sangyo Kabushiki Kaisha Dispositif de prise femelle
JP2006128652A (ja) * 2004-09-29 2006-05-18 Furukawa Electric Co Ltd:The 発光部品搭載フラットケーブルの固定構造
JP2006210537A (ja) * 2005-01-26 2006-08-10 Furukawa Electric Co Ltd:The Ｌｅｄ発光構造体の放熱構造

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5961051A (ja) * 1982-09-30 1984-04-07 Fujitsu Ltd Ｉｃソケツト
JPH0745346A (ja) * 1993-07-30 1995-02-14 Nec Corp チップ部品用ソケット
JPH0951070A (ja) * 1995-08-08 1997-02-18 Fujitsu Ltd パッケージ
WO2005088191A1 (fr) * 2004-03-11 2005-09-22 Moriyama Sangyo Kabushiki Kaisha Dispositif de prise femelle
JP2006128652A (ja) * 2004-09-29 2006-05-18 Furukawa Electric Co Ltd:The 発光部品搭載フラットケーブルの固定構造
JP2006210537A (ja) * 2005-01-26 2006-08-10 Furukawa Electric Co Ltd:The Ｌｅｄ発光構造体の放熱構造

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016001395A1 (fr) * 2014-07-04 2016-01-07 Idz Concept Embase de support pour composant electrique cable, module d'eclairage correspondant, procede de realisation d'un module associe et vetement correspondant
FR3023421A1 (fr) * 2014-07-04 2016-01-08 Idz Concept Embase de support pour composant electrique cable
US10012373B2 (en) 2014-07-04 2018-07-03 Idz Concept Mounting base for an electrical component having a housing with a groove with a convergent bottom for crimping an electrical wire
EP3091275A1 (fr) * 2015-05-08 2016-11-09 OSRAM GmbH Procédé d'assemblage de dispositifs d'éclairage et dispositif correspondant

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