WO2009009516A3 - Nano shower for chip-scale cooling - Google Patents

Nano shower for chip-scale cooling Download PDF

Info

Publication number
WO2009009516A3
WO2009009516A3 PCT/US2008/069386 US2008069386W WO2009009516A3 WO 2009009516 A3 WO2009009516 A3 WO 2009009516A3 US 2008069386 W US2008069386 W US 2008069386W WO 2009009516 A3 WO2009009516 A3 WO 2009009516A3
Authority
WO
WIPO (PCT)
Prior art keywords
coolant
chip
chip package
cools
shower
Prior art date
Application number
PCT/US2008/069386
Other languages
French (fr)
Other versions
WO2009009516A2 (en
Inventor
Yuandong Gu
Wei Yang
Original Assignee
Honeywell Int Inc
Yuandong Gu
Wei Yang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/901,603 external-priority patent/US20090014158A1/en
Application filed by Honeywell Int Inc, Yuandong Gu, Wei Yang filed Critical Honeywell Int Inc
Publication of WO2009009516A2 publication Critical patent/WO2009009516A2/en
Publication of WO2009009516A3 publication Critical patent/WO2009009516A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20345—Sprayers; Atomizers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A nano shower cools a chip when a coolant sprays onto the chip package from an array of electro spray nozzles. Ideally, the coolant is not conductive and otherwise not harmful to electronics. As such, perfluorocarbons are ideal coolants. Distilled water also works in certain applications. A voltage difference between the coolant and chip package causes the coolant to spray from the electro spray nozzles onto the chip package. The coolant cools the chip package by evaporating or by absorbing heat and flowing away.
PCT/US2008/069386 2007-07-12 2008-07-08 Nano shower for chip-scale cooling WO2009009516A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US94946407P 2007-07-12 2007-07-12
US60/949,464 2007-07-12
US11/901,603 US20090014158A1 (en) 2007-07-12 2007-09-18 Nano shower for chip-scale cooling
US11/901,603 2007-09-18

Publications (2)

Publication Number Publication Date
WO2009009516A2 WO2009009516A2 (en) 2009-01-15
WO2009009516A3 true WO2009009516A3 (en) 2009-03-26

Family

ID=40229441

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/069386 WO2009009516A2 (en) 2007-07-12 2008-07-08 Nano shower for chip-scale cooling

Country Status (1)

Country Link
WO (1) WO2009009516A2 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02155258A (en) * 1988-12-07 1990-06-14 Fujitsu Ltd Jet-cooled semiconductor device
JPH0330457A (en) * 1989-06-28 1991-02-08 Hitachi Ltd Semiconductor device cooling method and semiconductor device
US5329419A (en) * 1991-10-21 1994-07-12 Nec Corporation Integrated circuit package having a cooling mechanism
JPH06196599A (en) * 1992-12-22 1994-07-15 Nec Corp Cooling mechanism for integrated circuit
JP2006303264A (en) * 2005-04-22 2006-11-02 Mitsubishi Electric Corp Cooling device of semiconductor module

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02155258A (en) * 1988-12-07 1990-06-14 Fujitsu Ltd Jet-cooled semiconductor device
JPH0330457A (en) * 1989-06-28 1991-02-08 Hitachi Ltd Semiconductor device cooling method and semiconductor device
US5329419A (en) * 1991-10-21 1994-07-12 Nec Corporation Integrated circuit package having a cooling mechanism
JPH06196599A (en) * 1992-12-22 1994-07-15 Nec Corp Cooling mechanism for integrated circuit
JP2006303264A (en) * 2005-04-22 2006-11-02 Mitsubishi Electric Corp Cooling device of semiconductor module

Also Published As

Publication number Publication date
WO2009009516A2 (en) 2009-01-15

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