WO2009008455A1 - Glass-integrated resin molding and method of molding therefor - Google Patents
Glass-integrated resin molding and method of molding therefor Download PDFInfo
- Publication number
- WO2009008455A1 WO2009008455A1 PCT/JP2008/062420 JP2008062420W WO2009008455A1 WO 2009008455 A1 WO2009008455 A1 WO 2009008455A1 JP 2008062420 W JP2008062420 W JP 2008062420W WO 2009008455 A1 WO2009008455 A1 WO 2009008455A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resin
- glass
- molding
- resin molding
- glass member
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14336—Coating a portion of the article, e.g. the edge of the article
- B29C45/14434—Coating brittle material, e.g. glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0001—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor characterised by the choice of material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14311—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/40—Glass
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
Abstract
A glass-integrated resin molding composed of a glass member and a resin molding in which, in place of customary thermosetting resins, use is made of a thermoplastic resin moldable through a simpler process and in which the bonding strength therebetween is satisfactory. There is disclosed a glass integrating resin molding method, including injecting a resin in a metal mold having a glass member disposed therein and forming a resin molding around the glass member so as to attain integration with the glass member, thereby obtaining a glass-integrated resin molding. As this resin, use is made of a resin composition obtained by blending a compound having hydroxyl and/or epoxy in its molecule with a thermoplastic resin as a base resin. Preferably, the thermoplastic resin is a liquid crystal polymer or crystalline resin (exclusive of the liquid crystal polymer). Also preferably, the compound with hydroxyl is a phenoxy resin, and the compound with epoxy is an epoxy resin.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-183141 | 2007-07-12 | ||
JP2007183141A JP2010214589A (en) | 2007-07-12 | 2007-07-12 | Glass-integrated resin molding, and molding method therefor |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009008455A1 true WO2009008455A1 (en) | 2009-01-15 |
Family
ID=40228626
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/062420 WO2009008455A1 (en) | 2007-07-12 | 2008-07-09 | Glass-integrated resin molding and method of molding therefor |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2010214589A (en) |
WO (1) | WO2009008455A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112662131A (en) * | 2020-12-22 | 2021-04-16 | 广东盈骅新材料科技有限公司 | Liquid crystal modified resin composition, composite resin, prepreg and printed wiring board |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101408647B1 (en) * | 2012-02-29 | 2014-06-17 | 주식회사 프레코 | Crime prevention glass manufacturing method and the apparatus |
JP6251485B2 (en) * | 2012-03-01 | 2017-12-20 | 東洋樹脂株式会社 | Optical inspection base with optical inspection window |
JP6079534B2 (en) * | 2013-09-30 | 2017-02-15 | 沖電気工業株式会社 | Bill discrimination device |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01310924A (en) * | 1988-06-10 | 1989-12-15 | Nippon Petrochem Co Ltd | Method for insert molding of thermotropic liquid crystal |
JPH0446961A (en) * | 1990-06-15 | 1992-02-17 | Dainippon Ink & Chem Inc | Resin composition |
JPH0450258A (en) * | 1990-06-19 | 1992-02-19 | Mitsubishi Kasei Corp | Liquid crystal polyester resin composition |
JPH08113719A (en) * | 1994-10-14 | 1996-05-07 | Nippon Petrochem Co Ltd | Sealing material for electrical and electronic part |
JPH09262864A (en) * | 1996-03-28 | 1997-10-07 | Polyplastics Co | Insert molding |
JP2002096634A (en) * | 2000-09-25 | 2002-04-02 | Asahi Glass Co Ltd | Production method of window plate material with fixing member |
JP2005240003A (en) * | 2004-01-27 | 2005-09-08 | Mitsubishi Engineering Plastics Corp | Thermoplastic polyester resin composition and insert-molded article |
-
2007
- 2007-07-12 JP JP2007183141A patent/JP2010214589A/en not_active Withdrawn
-
2008
- 2008-07-09 WO PCT/JP2008/062420 patent/WO2009008455A1/en active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01310924A (en) * | 1988-06-10 | 1989-12-15 | Nippon Petrochem Co Ltd | Method for insert molding of thermotropic liquid crystal |
JPH0446961A (en) * | 1990-06-15 | 1992-02-17 | Dainippon Ink & Chem Inc | Resin composition |
JPH0450258A (en) * | 1990-06-19 | 1992-02-19 | Mitsubishi Kasei Corp | Liquid crystal polyester resin composition |
JPH08113719A (en) * | 1994-10-14 | 1996-05-07 | Nippon Petrochem Co Ltd | Sealing material for electrical and electronic part |
JPH09262864A (en) * | 1996-03-28 | 1997-10-07 | Polyplastics Co | Insert molding |
JP2002096634A (en) * | 2000-09-25 | 2002-04-02 | Asahi Glass Co Ltd | Production method of window plate material with fixing member |
JP2005240003A (en) * | 2004-01-27 | 2005-09-08 | Mitsubishi Engineering Plastics Corp | Thermoplastic polyester resin composition and insert-molded article |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112662131A (en) * | 2020-12-22 | 2021-04-16 | 广东盈骅新材料科技有限公司 | Liquid crystal modified resin composition, composite resin, prepreg and printed wiring board |
CN112662131B (en) * | 2020-12-22 | 2023-10-20 | 广东盈骅新材料科技有限公司 | Liquid crystal modified resin composition, composite resin, prepreg and printed wiring board |
Also Published As
Publication number | Publication date |
---|---|
JP2010214589A (en) | 2010-09-30 |
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