WO2009006663A3 - Composite material containing a carbide layer - Google Patents

Composite material containing a carbide layer Download PDF

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Publication number
WO2009006663A3
WO2009006663A3 PCT/AT2008/000251 AT2008000251W WO2009006663A3 WO 2009006663 A3 WO2009006663 A3 WO 2009006663A3 AT 2008000251 W AT2008000251 W AT 2008000251W WO 2009006663 A3 WO2009006663 A3 WO 2009006663A3
Authority
WO
WIPO (PCT)
Prior art keywords
carbide layer
composite material
material containing
carbon nanomaterial
areas
Prior art date
Application number
PCT/AT2008/000251
Other languages
German (de)
French (fr)
Other versions
WO2009006663A2 (en
Inventor
Theodore Schmitt
Original Assignee
Electrovac Ag
Theodore Schmitt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electrovac Ag, Theodore Schmitt filed Critical Electrovac Ag
Publication of WO2009006663A2 publication Critical patent/WO2009006663A2/en
Publication of WO2009006663A3 publication Critical patent/WO2009006663A3/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00Coating not provided for in groups C23C2/00 - C23C24/00
    • C23C26/02Coating not provided for in groups C23C2/00 - C23C24/00 applying molten material to the substrate
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C26/00Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C47/00Making alloys containing metallic or non-metallic fibres or filaments
    • C22C47/08Making alloys containing metallic or non-metallic fibres or filaments by contacting the fibres or filaments with molten metal, e.g. by infiltrating the fibres or filaments placed in a mould
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C47/00Making alloys containing metallic or non-metallic fibres or filaments
    • C22C47/14Making alloys containing metallic or non-metallic fibres or filaments by powder metallurgy, i.e. by processing mixtures of metal powder and fibres or filaments
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C26/00Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
    • C22C2026/002Carbon nanotubes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)

Abstract

A composite material (1) is proposed which comprises at least one carbon nanomaterial (2) comprising a carbon nanostructure and a further material (3), in order that a further temperature use range and a high service stability is enabled, in that the carbon nanomaterial (2) comprises at least in areas a carbide layer formed on the surface of the carbon nanomaterial (2) and in that the further material (3) comprises a metal layer and/or metal alloy layer adhering at least in areas to the carbide layer.
PCT/AT2008/000251 2007-07-10 2008-07-09 Composite material containing a carbide layer WO2009006663A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ATA1066/2007 2007-07-10
AT10662007A AT505491B1 (en) 2007-07-10 2007-07-10 COMPOSITE

Publications (2)

Publication Number Publication Date
WO2009006663A2 WO2009006663A2 (en) 2009-01-15
WO2009006663A3 true WO2009006663A3 (en) 2009-06-04

Family

ID=40130962

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/AT2008/000251 WO2009006663A2 (en) 2007-07-10 2008-07-09 Composite material containing a carbide layer

Country Status (2)

Country Link
AT (1) AT505491B1 (en)
WO (1) WO2009006663A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009018762B4 (en) * 2009-04-27 2011-06-22 EADS Deutschland GmbH, 85521 A method of producing a metallic composite with carbon nanotubes and a near-net shape component of this composite material

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0898310A2 (en) * 1997-08-19 1999-02-24 Sumitomo Electric Industries, Ltd. Heat sink for semiconductors and manufacturing process thereof
US6171691B1 (en) * 1997-02-06 2001-01-09 Sumitomo Electric Industries, Ltd. Heat sink material for use with semiconductor component and method for fabricating the same, and semiconductor package using the same
WO2004005566A2 (en) * 2002-07-04 2004-01-15 Centre National De La Recherche Scientifique (C.N.R.S.) Method for making a composite product and in particular a heat sink
WO2004102659A2 (en) * 2003-05-08 2004-11-25 Curamik Electronics Gmbh Composite material, electrical circuit or electric module
JP2006245127A (en) * 2005-03-01 2006-09-14 Toshiba Corp Semiconductor device and its manufacturing method
EP1798301A1 (en) * 2005-09-07 2007-06-20 E & F Corporation Titanium alloy composite material, method for production of the material, titanium clad material using the material, and method for manufacture of the clad

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6171691B1 (en) * 1997-02-06 2001-01-09 Sumitomo Electric Industries, Ltd. Heat sink material for use with semiconductor component and method for fabricating the same, and semiconductor package using the same
EP0898310A2 (en) * 1997-08-19 1999-02-24 Sumitomo Electric Industries, Ltd. Heat sink for semiconductors and manufacturing process thereof
WO2004005566A2 (en) * 2002-07-04 2004-01-15 Centre National De La Recherche Scientifique (C.N.R.S.) Method for making a composite product and in particular a heat sink
WO2004102659A2 (en) * 2003-05-08 2004-11-25 Curamik Electronics Gmbh Composite material, electrical circuit or electric module
JP2006245127A (en) * 2005-03-01 2006-09-14 Toshiba Corp Semiconductor device and its manufacturing method
EP1798301A1 (en) * 2005-09-07 2007-06-20 E & F Corporation Titanium alloy composite material, method for production of the material, titanium clad material using the material, and method for manufacture of the clad

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
BALBUENA P B ET AL: "Role of the catalyst in the growth of single-wall carbon nanotubes", JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, AMERICAN SCIENTIFIC PUBLISHERS, US, vol. 6, no. 5, 1 May 2006 (2006-05-01), pages 1247 - 1258, XP009112400, ISSN: 1533-4880 *
CHA S I ET AL: "Extraordinary strengthening effect of carbon nanotubes in metal-matrix nanocomposites processed by molecular-level mixing", ADVANCED MATERIALS 20050606 WILEY-VCH VERLAG DE, vol. 17, no. 11, 6 June 2005 (2005-06-06), pages 1377 - 1381, XP002516313 *
HUANG L ET AL: "The synthesis of carbon nanotubes and zirconium carbide composite films on a glass substrate", NANOTECHNOLOGY MAY 2004 INSTITUTE OF PHYSICS PUBLISHING GB, vol. 15, no. 5, May 2004 (2004-05-01), pages 663 - 666, XP002516319 *
LEROY W P ET AL: "Solid-state formation of titanium carbide and molybdenum carbide as contacts for carbon-containing semiconductors", JOURNAL OF APPLIED PHYSICS AIP USA, vol. 99, no. 6, 15 March 2006 (2006-03-15), pages 63704 - 1, XP002516314, ISSN: 0021-8979 *
LIJIE CI ET AL: "Investigation of the interfacial reaction between multi-walled carbon nanotubes and aluminum", ACTA MATERIALIA ELSEVIER UK, vol. 54, no. 20, December 2006 (2006-12-01), pages 5367 - 5375, XP002516316, ISSN: 1359-6454 *

Also Published As

Publication number Publication date
AT505491B1 (en) 2010-06-15
WO2009006663A2 (en) 2009-01-15
AT505491A1 (en) 2009-01-15

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