WO2009004906A1 - Substrate treatment method, substrate treatment apparatus, reducing agent sheet, and computer-readable storage medium - Google Patents

Substrate treatment method, substrate treatment apparatus, reducing agent sheet, and computer-readable storage medium Download PDF

Info

Publication number
WO2009004906A1
WO2009004906A1 PCT/JP2008/060764 JP2008060764W WO2009004906A1 WO 2009004906 A1 WO2009004906 A1 WO 2009004906A1 JP 2008060764 W JP2008060764 W JP 2008060764W WO 2009004906 A1 WO2009004906 A1 WO 2009004906A1
Authority
WO
WIPO (PCT)
Prior art keywords
reducing agent
substrate treatment
agent sheet
substrate
computer
Prior art date
Application number
PCT/JP2008/060764
Other languages
French (fr)
Japanese (ja)
Inventor
Yoichiro Fujinaga
Kunihiro Furuya
Original Assignee
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Publication of WO2009004906A1 publication Critical patent/WO2009004906A1/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00—Furnaces of a kind not covered by any preceding group
    • F27B17/0016—Chamber type furnaces
    • F27B17/0025—Especially adapted for treating semiconductor wafers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D5/00—Supports, screens, or the like for the charge within the furnace
    • F27D5/0037—Supports specially adapted for semi-conductors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D7/00—Forming, maintaining, or circulating atmospheres in heating chambers
    • F27D7/06—Forming or maintaining special atmospheres or vacuum within heating chambers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

A reducing agent sheet is adsorbed on a second holding member in a treatment apparatus, while a substrate having a metallic part formed on its surface is adsorbed on a first holding member. A nitrogen gas is introduced into a treatment chamber to produce a low-oxygen atmosphere in the inside of the treatment chamber. Subsequently, the reducing agent sheet is heated with a heater to a temperature equal to or higher than the reduction initiation temperature. The second holding member is moved down until the reducing agent sheet comes to contact with the metallic part of the substrate. The reducing agent sheet and the metal part are contacted with each other for a predetermined period to reduce the oxidized film formed on the surface of the metallic part of the substrate, thereby removing the oxidized film.
PCT/JP2008/060764 2007-07-04 2008-06-12 Substrate treatment method, substrate treatment apparatus, reducing agent sheet, and computer-readable storage medium WO2009004906A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007176092 2007-07-04
JP2007-176092 2007-07-04

Publications (1)

Publication Number Publication Date
WO2009004906A1 true WO2009004906A1 (en) 2009-01-08

Family

ID=40225960

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/060764 WO2009004906A1 (en) 2007-07-04 2008-06-12 Substrate treatment method, substrate treatment apparatus, reducing agent sheet, and computer-readable storage medium

Country Status (2)

Country Link
TW (1) TW200917371A (en)
WO (1) WO2009004906A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09266188A (en) * 1996-03-29 1997-10-07 Hitachi Ltd Surface purifying method
JP2003231097A (en) * 2002-02-08 2003-08-19 Mitsubishi Gas Chem Co Inc Structure mounting thin-film type particle having skeleton composed of carbon on substrate and its manufacturing method
JP2004068044A (en) * 2002-08-01 2004-03-04 Honda Motor Co Ltd Method for removing oxide on zinc-based alloy
WO2007013445A1 (en) * 2005-07-25 2007-02-01 Tokyo Electron Limited Method for processing metal member and apparatus for processing metal member

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09266188A (en) * 1996-03-29 1997-10-07 Hitachi Ltd Surface purifying method
JP2003231097A (en) * 2002-02-08 2003-08-19 Mitsubishi Gas Chem Co Inc Structure mounting thin-film type particle having skeleton composed of carbon on substrate and its manufacturing method
JP2004068044A (en) * 2002-08-01 2004-03-04 Honda Motor Co Ltd Method for removing oxide on zinc-based alloy
WO2007013445A1 (en) * 2005-07-25 2007-02-01 Tokyo Electron Limited Method for processing metal member and apparatus for processing metal member

Also Published As

Publication number Publication date
TW200917371A (en) 2009-04-16

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