WO2009002797A2 - Packaging multiple measurands into a combinational sensor system using elastomeric seals - Google Patents
Packaging multiple measurands into a combinational sensor system using elastomeric seals Download PDFInfo
- Publication number
- WO2009002797A2 WO2009002797A2 PCT/US2008/067481 US2008067481W WO2009002797A2 WO 2009002797 A2 WO2009002797 A2 WO 2009002797A2 US 2008067481 W US2008067481 W US 2008067481W WO 2009002797 A2 WO2009002797 A2 WO 2009002797A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sensor
- substrate
- asic
- lead frame
- measurands
- Prior art date
Links
- 238000004806 packaging method and process Methods 0.000 title description 5
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 230000003750 conditioning effect Effects 0.000 claims abstract description 8
- 238000005070 sampling Methods 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 5
- 238000005516 engineering process Methods 0.000 claims description 4
- 238000005459 micromachining Methods 0.000 claims description 3
- 230000004044 response Effects 0.000 abstract description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 15
- 229910052710 silicon Inorganic materials 0.000 description 15
- 239000010703 silicon Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000001143 conditioned effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002463 transducing effect Effects 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
Definitions
- Embodiments are generally related to sensor methods and systems. Embodiments are additionally related to methods and systems for manufacturing and packaging multiple sensors in a single package. Embodiments are also related to combinational sensors.
- MEMS Micro-Electro-Mechanical Systems
- flow or pressure transducer can be used to measure flow or pressure and with a reliable accuracy.
- MEMS based sensors have been implemented, for example, in various independent sensing devices, such as medical applications, some of which utilize silicon based thermal mass flow or piezoresistive sensing technology for measuring wide ranges of flow and pressure.
- Other multiple sensing implementations for example, include instrumentation and environmental applications.
- MEMS involve the integration of micro-mechanical elements, sensor actuators, and electronic components on a common silicon substrate through the use of micro fabrication technology. While the electronics can be fabricated using integrated circuit (IC) process sequences (e.g., CMOS, Bipolar, or BICMOS processes), the micromechanical components can be fabricated utilizing compatible "micromachining” processes that selectively etch away parts of the silicon wafer or add new structural layers to form the mechanical and electromechanical devices.
- IC integrated circuit
- a signal conditioning/signal amplification capability be incorporated into the sensor. It is believed that there are currently no sensors available for efficiently and accurately measuring multiple measurands. Therefore, to overcome the forgoing shortcomings, it is desirable to provide for a suitable packaging method and/or system for measuring multiple measurands. It is further believed that if such a sensor is implemented, the result sensor design can assist in lowering installation and development costs, while eliminating secondary operations and shortening the design cycle time.
- a combinational sensor system for measuring multiple measurands includes a flow sensor, a pressure sensor and a humidity sensor.
- the pressure sensor and humidity sensor can have independent access to the media and is ratiomethc to the supply voltage, whereas the flow sensor is sensitive to openings to the flow path.
- the combinational sensor utilizes elastomehc seals in which at least one seal is electrically conductive.
- An Application Specific Integrated Circuit (ASIC) is generally associated with the combinational sensor, wherein the ASIC can be placed on a patterned electrically conductive substrate, e.g. printed circuit board or thick film based ceramic, or lead frame for signal conditioning in order to detect flow, pressure, humidity or temperature.
- ASIC Application Specific Integrated Circuit
- the transducers can be arranged in order to optimize accuracy and/or response time of the combinational sensor system or optimal access to the media.
- the geometry of the combinational sensor system for measuring multiple measurands includes a pressure transducing silicon die which includes piezoresistive material.
- a MEMS (Microelectromechanical System) sensing diaphragm is generally associated with the piezoresistive material, wherein the sensing diaphragm deflects when a pressure is applied thereto.
- An impedance circuit is generally embedded with one or more piezoresistive elements on the sensing diaphragm to which the pressure to be detected is applied. Electrical connections to the piezoresistive elements are made to electrical contacts placed on either the front or back-side of the silicon die.
- the silicon die is located between a patterned sandwich combination of a conductive elastomehc seal and a non-conductive elastomeric pressure seal making electrical connections to respective electrical contacts on the surface of a silicon die.
- a non-conductive elastomeric pressure seal makes a mechanical seal on the opposite face on the silicon die.
- the combinational sensor system can also include other silicon-based transducers which can include a humidity sensor.
- This embodiment of a transducer can be mounted in a similar manner to the pressure transducing silicon die in the above.
- the patterned sandwich combination of conductive elastomeric seal and non-conductive elastomeric pressure seal can be used for providing an electrical contact from the impedance circuit associated with the silicon piezoresistive material to the patterned electrically conductive substrate or lead frame connected to the ASIC.
- This generally includes an un-amplified Wheatstone bridge output or an amplified output of the bridge response of a pressure transducer.
- the non-conductive elastomeric pressure seal can be placed on the non-conductive regions of a silicon die.
- the non-conductive pressure seal on each elastomeric seal will also provide a liquid seal allowing for very high humidity or liquid media.
- FIG. 1 illustrates a perspective view of a combinational sensor system, which can be implemented in accordance with a preferred embodiment
- FIG. 2 illustrates a sectional view A-A of a combinational sensor system, which can be implemented in accordance with an alternative embodiment
- FIG. 3 illustrates a detailed view of the pressure sensor shown in FIGS. 1 -2, in accordance with a preferred embodiment
- FIG. 4 illustrates a high level flow diagram of operations depicting logical operational steps of a method for designing a combinational sensor system, in accordance with a preferred embodiment.
- FIG. 1 illustrates a perspective view of a combinational sensor system 100, which can be implemented in accordance with a preferred embodiment.
- the combinational sensor 100 can measure multiple measurands and includes a flow tube 180 in association with an mass flow die 130, a pressure sensor 150 and a humidity sensor 160.
- a pair of sampling ports 120 and 125 can be provided.
- the pressure sensor 150 and the humidity sensor 160 can each possess independent access to the media and are ratiomethc to the supply voltage (not shown), whereas the air flow die 130 is sensitive to openings to the flow path of the flow tube 180.
- An ASIC 170 is generally associated with the combinational sensor system 100.
- the ASIC 170 can be placed on a patterned electrically conductive substrate or lead frame 190 for signal conditioning in order to detect flow, pressure, humidity and/or temperature.
- An electrical interconnect 1 10 can be utilized for the electrical connection of the combinational sensor system 100 to the supporting application.
- the pressure sensor 150, humidity sensor 160, and air flow die 130 can be arranged in a manner that distributes the transducers 130, 150, or 160 in order to optimize the accuracy and/or response time of the combinational sensor system 100.
- FIG. 2 illustrates a sectional view A-A of a combinational sensor system 200 with a flow restrictor or pitot tube flow-sampling element 210, which can be implemented in accordance with an alternative embodiment.
- a flow restrictor or pitot tube flow-sampling element 210 which can be implemented in accordance with an alternative embodiment.
- FIGS. 1-3 identical or similar parts or elements are generally indicated by identical reference numerals.
- the flow tube 180, the air flow transducer 130, the pressure transducer 150 and the humidity transducer 160 depicted in FIG. 1 also appears in the configuration of sensor 200 depicted in FIG. 2.
- Arrow 280 indicates the bi-directional flow of air through the flow tube 180, which passes through the flow restrictor or over a flow-sampling element such as a pitot tube 210.
- a pair of sampling ports 120 and 125 is generally arranged in adjacent locations of flow tube 180. For the Pitot tube, ports 120 and 125 will reside on opposite sides of 210. Another pair of sampling ports 290 and 295 can be arranged in any position of flow tube 180. The media flows into the sampling ports 120 and 125 arranged in the flow tube 180 and which is exposed to the pressure sensor 150 and humidity sensor 160 for measurement.
- the geometry of the transducers 150 and 160 for measuring multiple measurands includes a piezoresistive material or humidity sensitive dielectric material (not shown) located between a patterned sandwich combination of conductive elastomeric and non-conductive elastomeric pressure seal 230 and 250 and a non-conductive elastomeric pressure seal 220 and 260.
- the patterned sandwich combination of conductive elastomeric and non-conductive elastomeric pressure seal 230 and 250 can be used for the electrical connection of the sensors 160 and 150 to the substrate 190 that connects to the ASIC 170 and for mechanical "sealing" around the conductive connections to prevent shorting and leaking.
- the non-conductive elastomeric seal 220 and 260 can be utilized for mechanical "sealing" of the sensors 160 and 150 within the combinational sensor 100.
- the pressure sensor 150 includes a sensing diaphragm 270 that is generally associated with the piezoresistive material, wherein the sensing diaphragm 270 deflects when a pressure is applied thereto.
- the ASIC 170 is generally placed on a patterned electrically conductive substrate or lead frame 190 so that either a temperature sensor in the ASIC 170 or other temperature sensing mechanism local to the other measurands can be used for temperature compensation.
- the pressure sensor 150 and humidity sensor 160 are ratiomethc to the supply voltage (not shown). [0024] FIG.
- FIG. 3 illustrates a detailed view of the pressure sensor 150 depicted in FIG. 1 , which can be implemented in accordance with a preferred embodiment.
- the pressure sensor 150 contains a diaphragm 270 that includes two sets of piezoresistors 310 and 320 buried in the face of a thin, chemically-etched silicon diaphragm 270.
- the pressure causes the diaphragm 270 to flex, inducing a stress or strain in the diaphragm 270 and the buried resistors 310 and 320.
- the resistors 310 and 320 values change in proportion to the stress applied and thereafter produces an electrical signal.
- the patterned sandwich combination of conductive elastomeric seal and non-conductive elastomeric pressure seal 230 can be utilized for providing an electrical contact from the impedance circuit associated with the silicon piezoresistors 310 and 320 to a patterned electrically conductive substrate or lead frame 190 connected to the ASIC 170.
- Such a configuration generally includes the use of an un- amplified Wheatstone bridge output or an amplified output of the bridge response of the pressure sensor 150.
- the silicon piezoresistors 310 and 320 can be configured as a four-resistor Wheatstone bridge fabricated on a single monolithic die utilizing micromachining technology.
- the non- conductive elastomeric pressure seal 260 can be placed on the backside. The patterned sandwich combination of conductive elastomeric seal and non-conductive elastomeric pressure seal 230 and the non-conductive elastomeric pressure seal 260 also provide a liquid seal allowing for very high humidity or liquid media.
- FIG. 4 illustrates a high level flow diagram of operations depicting a method 400 for designing a combinational sensor system, in accordance with a preferred embodiment.
- the pressure sensor 150, flow transducer 130, humidity transducer 160 and ASIC 170 can be arranged apart from each other on substrate 190, as depicted at block 410.
- a flow resthctor or a flow-sampling element such as a pitot tube 210 can be disposed in flow tube 180.
- Flow sensor die 130 can be disposed in sensing channel of flow tube 140, as shown at block 430.
- a sensing element of pressure transducer 150 and humidity transducer 160 can be sandwiched between two elastomeric seal 230, 260 and 220, 250 on the substrate 190.
- the conductive elastomeric seal 230 and 250 can be patterned for providing an electrical contact to a patterned electrically conductive substrate or lead frame 190 connected to the ASIC 170, as depicted at block 450.
- the non-conductive elastomeric seal 220 and 260 can be patterned for providing mechanical sealing for the transducers 160 and 150, as illustrated at block 460.
- Non-conductive elastomeric seal can also be patterned for providing mechanical sealing for the sensor housing, as illustrated at block 470.
- the combinational sensor system described herein can be inexpensively manufactured and marketed and can include temperature compensation and calibration capabilities, along with media flow-through ports and true "wet" differential sensing. Such a sensor system is also operable after exposure to frozen conditions with a choice of termination for gage sensors.
- the disclosed combinational sensor system can also provide interchangeability, proven elastomeric construction, ASIC-based signal conditioning and digital output and can be used to measure vacuum or positive pressure.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
- Micromachines (AREA)
- Testing Or Calibration Of Command Recording Devices (AREA)
Abstract
A combinational sensor system for measuring multiple measurands includes a flow transducer, a pressure transducer and a humidity transducer. The pressure and humidity transducers are provided with independent access to sensed media and are ratiometric to a supply voltage, whereas the flow sensor is sensitive to openings to the flow path. The combinational sensor system utilizes elastomeric seals that include patterned electrically conductive and non-conductive seals. An ASIC is generally associated with the combinational sensor, and is located on a patterned electrically conductive substrate lead frame or for signal conditioning in order to detect any of the sensed measurands. The transducers can be arranged in a manner that distributes the transducers to optimize the accuracy and response time of the combinational sensor system.
Description
PACKAGING MULTIPLE MEASURANDS INTO A COMBINATIONAL SENSOR SYSTEM USING ELASTOMERIC SEALS
TECHNICAL FIELD
[001] Embodiments are generally related to sensor methods and systems. Embodiments are additionally related to methods and systems for manufacturing and packaging multiple sensors in a single package. Embodiments are also related to combinational sensors.
BACKGROUND OF THE INVENTION
[002] Many processes and devices have been implemented and used for measuring more then one measurand simultaneously. A miniature MEMS (Micro-Electro-Mechanical Systems) based flow or pressure transducer can be used to measure flow or pressure and with a reliable accuracy. Such MEMS based sensors have been implemented, for example, in various independent sensing devices, such as medical applications, some of which utilize silicon based thermal mass flow or piezoresistive sensing technology for measuring wide ranges of flow and pressure. Other multiple sensing implementations, for example, include instrumentation and environmental applications.
[003] MEMS involve the integration of micro-mechanical elements, sensor actuators, and electronic components on a common silicon substrate through the use of micro fabrication technology. While the electronics can be fabricated using integrated circuit (IC) process sequences (e.g., CMOS, Bipolar, or BICMOS processes), the micromechanical components can be fabricated utilizing compatible "micromachining" processes that selectively etch away parts of the silicon wafer or add new structural layers to form the mechanical and electromechanical devices.
[004] The majority of prior art transducers are either sold with calibrated or un-calibrated analog outputs or as transducers with small-signal
outputs, either of which may need to be conditioned and calibrated by the end user within their system. Further, the analog signals conditioned by the user must pass through an analog-to-digital converter so that the output signals can be processed by the system, which may be microcontroller- based. The most common measurands are flow, pressure, temperature and humidity and the output signals from the raw transducers are typically not linear and vary as a function of temperature.
[005] In some sending applications, it is preferred that a signal conditioning/signal amplification capability be incorporated into the sensor. It is believed that there are currently no sensors available for efficiently and accurately measuring multiple measurands. Therefore, to overcome the forgoing shortcomings, it is desirable to provide for a suitable packaging method and/or system for measuring multiple measurands. It is further believed that if such a sensor is implemented, the result sensor design can assist in lowering installation and development costs, while eliminating secondary operations and shortening the design cycle time.
BRIEF SUMMARY
[006] The following summary is provided to facilitate an understanding of some of the innovative features unique to the embodiments disclosed and is not intended to be a full description. A full appreciation of the various aspects of the embodiments can be gained by taking the entire specification, claims, drawings, and abstract as a whole.
[007] It is, therefore, one aspect of the present invention to provide for improved sensor methods and systems.
[008] It is another aspect of the present invention to provide packaging for a combinational sensor for measuring multiple measurands.
[009] It is another aspect of the present invention to provide for a method of designing a combinational pressure sensor system for measuring multiple measurands.
[0010] The aforementioned aspects and other objectives and advantages can now be achieved as described herein. A combinational sensor system for measuring multiple measurands includes a flow sensor, a pressure sensor and a humidity sensor. The pressure sensor and humidity sensor can have independent access to the media and is ratiomethc to the supply voltage, whereas the flow sensor is sensitive to openings to the flow path. The combinational sensor utilizes elastomehc seals in which at least one seal is electrically conductive. An Application Specific Integrated Circuit (ASIC) is generally associated with the combinational sensor, wherein the ASIC can be placed on a patterned electrically conductive substrate, e.g. printed circuit board or thick film based ceramic, or lead frame for signal conditioning in order to detect flow, pressure, humidity or temperature. The transducers can be arranged in order to optimize accuracy and/or response time of the combinational sensor system or optimal access to the media.
[001 1] The geometry of the combinational sensor system for measuring multiple measurands includes a pressure transducing silicon die which includes piezoresistive material. A MEMS (Microelectromechanical System) sensing diaphragm is generally associated with the piezoresistive material, wherein the sensing diaphragm deflects when a pressure is applied thereto. An impedance circuit is generally embedded with one or more piezoresistive elements on the sensing diaphragm to which the pressure to be detected is applied. Electrical connections to the piezoresistive elements are made to electrical contacts placed on either the front or back-side of the silicon die. The silicon die is located between a patterned sandwich combination of a conductive elastomehc seal and a non-conductive elastomeric pressure seal making electrical connections to respective electrical contacts on the surface of a silicon die. A non-conductive elastomeric pressure seal makes a mechanical seal on the opposite face on the silicon die.
[0012] The combinational sensor system can also include other silicon-based transducers which can include a humidity sensor. This embodiment of a transducer can be mounted in a similar manner to the pressure transducing silicon die in the above.
[0013] The patterned sandwich combination of conductive elastomeric seal and non-conductive elastomeric pressure seal can be used for providing an electrical contact from the impedance circuit associated with the silicon piezoresistive material to the patterned electrically conductive substrate or lead frame connected to the ASIC. This generally includes an un-amplified Wheatstone bridge output or an amplified output of the bridge response of a pressure transducer. The non-conductive elastomeric pressure seal can be placed on the non-conductive regions of a silicon die. The non-conductive pressure seal on each elastomeric seal will also provide a liquid seal allowing for very high humidity or liquid media.
BRIEF DESCRIPTION OF THE DRAWINGS
[0014] The accompanying figures, in which like reference numerals refer to identical or functionally-similar elements throughout the separate views and which are incorporated in and form a part of the specification, further illustrate the embodiments and, together with the detailed description, serve to explain the embodiments disclosed herein.
[0015] FIG. 1 illustrates a perspective view of a combinational sensor system, which can be implemented in accordance with a preferred embodiment;
[0016] FIG. 2 illustrates a sectional view A-A of a combinational sensor system, which can be implemented in accordance with an alternative embodiment;
[0017] FIG. 3 illustrates a detailed view of the pressure sensor shown in FIGS. 1 -2, in accordance with a preferred embodiment; and
[0018] FIG. 4 illustrates a high level flow diagram of operations depicting logical operational steps of a method for designing a combinational sensor system, in accordance with a preferred embodiment.
DETAILED DESCRIPTION
[0019] The particular values and configurations discussed in these non-limiting examples can be varied and are cited merely to illustrate at least one embodiment and are not intended to limit the scope thereof.
[0020] FIG. 1 illustrates a perspective view of a combinational sensor system 100, which can be implemented in accordance with a preferred embodiment. The combinational sensor 100 can measure multiple measurands and includes a flow tube 180 in association with an mass flow die 130, a pressure sensor 150 and a humidity sensor 160. A pair of sampling ports 120 and 125 can be provided. The pressure sensor 150 and the humidity sensor 160 can each possess independent access to the media and are ratiomethc to the supply voltage (not shown), whereas the air flow die 130 is sensitive to openings to the flow path of the flow tube 180.
[0021 ] An ASIC 170 is generally associated with the combinational sensor system 100. The ASIC 170 can be placed on a patterned electrically conductive substrate or lead frame 190 for signal conditioning in order to detect flow, pressure, humidity and/or temperature. An electrical interconnect 1 10 can be utilized for the electrical connection of the combinational sensor system 100 to the supporting application. The pressure sensor 150, humidity sensor 160, and air flow die 130 can be arranged in a manner that distributes the transducers 130, 150, or 160 in order to optimize the accuracy and/or response time of the combinational sensor system 100.
[0022] FIG. 2 illustrates a sectional view A-A of a combinational sensor system 200 with a flow restrictor or pitot tube flow-sampling element 210, which can be implemented in accordance with an alternative embodiment. Note that in FIGS. 1-3, identical or similar parts or elements are generally indicated by identical reference numerals. For example, the flow tube 180, the air flow transducer 130, the pressure transducer 150 and the humidity transducer 160 depicted in FIG. 1 also appears in the configuration of sensor
200 depicted in FIG. 2. Arrow 280 indicates the bi-directional flow of air through the flow tube 180, which passes through the flow restrictor or over a flow-sampling element such as a pitot tube 210. In the case of a flow restrictor 210 disposed in the flow tube 180 creates a pressure drop in the air flow bypass chamber 140. A pair of sampling ports 120 and 125 is generally arranged in adjacent locations of flow tube 180. For the Pitot tube, ports 120 and 125 will reside on opposite sides of 210. Another pair of sampling ports 290 and 295 can be arranged in any position of flow tube 180. The media flows into the sampling ports 120 and 125 arranged in the flow tube 180 and which is exposed to the pressure sensor 150 and humidity sensor 160 for measurement.
[0023] The geometry of the transducers 150 and 160 for measuring multiple measurands includes a piezoresistive material or humidity sensitive dielectric material (not shown) located between a patterned sandwich combination of conductive elastomeric and non-conductive elastomeric pressure seal 230 and 250 and a non-conductive elastomeric pressure seal 220 and 260. The patterned sandwich combination of conductive elastomeric and non-conductive elastomeric pressure seal 230 and 250 can be used for the electrical connection of the sensors 160 and 150 to the substrate 190 that connects to the ASIC 170 and for mechanical "sealing" around the conductive connections to prevent shorting and leaking. The non-conductive elastomeric seal 220 and 260 can be utilized for mechanical "sealing" of the sensors 160 and 150 within the combinational sensor 100. The pressure sensor 150 includes a sensing diaphragm 270 that is generally associated with the piezoresistive material, wherein the sensing diaphragm 270 deflects when a pressure is applied thereto. The ASIC 170 is generally placed on a patterned electrically conductive substrate or lead frame 190 so that either a temperature sensor in the ASIC 170 or other temperature sensing mechanism local to the other measurands can be used for temperature compensation. The pressure sensor 150 and humidity sensor 160 are ratiomethc to the supply voltage (not shown).
[0024] FIG. 3 illustrates a detailed view of the pressure sensor 150 depicted in FIG. 1 , which can be implemented in accordance with a preferred embodiment. The pressure sensor 150 contains a diaphragm 270 that includes two sets of piezoresistors 310 and 320 buried in the face of a thin, chemically-etched silicon diaphragm 270. The pressure causes the diaphragm 270 to flex, inducing a stress or strain in the diaphragm 270 and the buried resistors 310 and 320. The resistors 310 and 320 values change in proportion to the stress applied and thereafter produces an electrical signal. The patterned sandwich combination of conductive elastomeric seal and non-conductive elastomeric pressure seal 230 can be utilized for providing an electrical contact from the impedance circuit associated with the silicon piezoresistors 310 and 320 to a patterned electrically conductive substrate or lead frame 190 connected to the ASIC 170.
[0025] Such a configuration generally includes the use of an un- amplified Wheatstone bridge output or an amplified output of the bridge response of the pressure sensor 150. The silicon piezoresistors 310 and 320 can be configured as a four-resistor Wheatstone bridge fabricated on a single monolithic die utilizing micromachining technology. The non- conductive elastomeric pressure seal 260 can be placed on the backside. The patterned sandwich combination of conductive elastomeric seal and non-conductive elastomeric pressure seal 230 and the non-conductive elastomeric pressure seal 260 also provide a liquid seal allowing for very high humidity or liquid media.
[0026] FIG. 4 illustrates a high level flow diagram of operations depicting a method 400 for designing a combinational sensor system, in accordance with a preferred embodiment. The pressure sensor 150, flow transducer 130, humidity transducer 160 and ASIC 170 can be arranged apart from each other on substrate 190, as depicted at block 410. Thereafter, as indicated at block 420, a flow resthctor or a flow-sampling
element such as a pitot tube 210 can be disposed in flow tube 180. Flow sensor die 130 can be disposed in sensing channel of flow tube 140, as shown at block 430. Next, as described at block 440, a sensing element of pressure transducer 150 and humidity transducer 160 can be sandwiched between two elastomeric seal 230, 260 and 220, 250 on the substrate 190.
[0027] The conductive elastomeric seal 230 and 250 can be patterned for providing an electrical contact to a patterned electrically conductive substrate or lead frame 190 connected to the ASIC 170, as depicted at block 450. The non-conductive elastomeric seal 220 and 260 can be patterned for providing mechanical sealing for the transducers 160 and 150, as illustrated at block 460. Non-conductive elastomeric seal can also be patterned for providing mechanical sealing for the sensor housing, as illustrated at block 470.
[0028] The combinational sensor system described herein can be inexpensively manufactured and marketed and can include temperature compensation and calibration capabilities, along with media flow-through ports and true "wet" differential sensing. Such a sensor system is also operable after exposure to frozen conditions with a choice of termination for gage sensors. The disclosed combinational sensor system can also provide interchangeability, proven elastomeric construction, ASIC-based signal conditioning and digital output and can be used to measure vacuum or positive pressure.
[0029] It will be appreciated that variations of the above-disclosed and other features and functions, or alternatives thereof, may be desirably combined into many other different systems or applications. Also that various presently unforeseen or unanticipated alternatives, modifications, variations or improvements therein may be subsequently made by those skilled in the art which are also intended to be encompassed by the following claims.
Claims
1. A combinational sensor system for measuring multiple measurands, comprising: a plurality of transducer elements arranged apart from one another on a substrate of a sensor having a flow tube; and a plurality of sampling ports positioned along the flow tube adjacent to the said substrate in order to provide said sensor with an ability to measure a plurality of measurands.
2. The system of claim 1 further comprising an ASIC associated with said sensor, wherein said ASIC is placed on a patterned electrically conductive substrate or lead frame for signal conditioning in order to detect multiple measurands.
3. The system of claim 2 further comprising: a conductive elastomeric seal and a non-conductive elastomehc seal positioned on said plurality of transducers; and a plurality of electrical connectors associated with said patterned electrically conductive substrate or lead frame, wherein said substrate or lead frame forms an electrical connection with said ASIC of said sensor.
4. The system of claim 3 wherein said conductive elastomeric seal is adapted for use in electrically connecting said plurality of transducers to said substrate that connects to said ASIC.
5. The system of claim 3 wherein said non-conductive elastomeric seal is adapted for use in mechanically sealing said plurality of sensors within said sensor.
6. The system of claim 1 wherein said plurality of transducers comprises a piezoresistive pressure transducer.
7. A combinational sensor system for measuring multiple measurands, comprising: a plurality of transducer elements arranged apart from one another on a substrate of a sensor having a flow tube; a plurality of sampling ports positioned along the flow tube adjacent to the said substrate in order to provide said sensor with an ability to measure a plurality of measurands; and an ASIC associated with said sensor, wherein said ASIC is placed on a patterned electrically conductive substrate or lead frame for signal conditioning in order to detect multiple measurands.
8. The system of claim 7 further comprising: a conductive elastomeric seal and a non-conductive elastomehc seal positioned on said plurality of transducers; and a plurality of electrical connectors associated with said patterned electrically conductive substrate or lead frame, wherein said substrate or lead frame forms an electrical connection with said ASIC of said sensor.
9. A combinational sensor system for measuring multiple measurands, comprising: a plurality of transducer elements arranged apart from one another on a substrate of a sensor having a flow tube; a plurality of sampling ports positioned along the flow tube adjacent to the said substrate in order to provide said sensor with an ability to measure a plurality of measurands; an ASIC associated with said sensor, wherein said ASIC is placed on a patterned electrically conductive substrate or lead frame for signal conditioning in order to detect multiple measurands; a conductive elastomeric seal and a non-conductive elastomeric seal positioned on said plurality of transducers; and a plurality of electrical connectors associated with said patterned electrically conductive substrate or lead frame, wherein said substrate or lead frame forms an electrical connection with said ASIC of said sensor.
10. The system of claim 9 wherein said plurality of transducers comprises a temperature transducer, said impedance circuit comprises a four-resistor Wheatstone bridge fabricated on a single monolithic die utilizing micromachining technology, and said plurality of transducers is ratiomethc to a supply voltage.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08795937.5A EP2160571B1 (en) | 2007-06-22 | 2008-06-19 | Packaging multiple measurands into a combinational sensor system using elastomeric seals |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/821,421 | 2007-06-22 | ||
US11/821,421 US7832269B2 (en) | 2007-06-22 | 2007-06-22 | Packaging multiple measurands into a combinational sensor system using elastomeric seals |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009002797A2 true WO2009002797A2 (en) | 2008-12-31 |
WO2009002797A3 WO2009002797A3 (en) | 2009-04-09 |
Family
ID=40135098
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2008/067481 WO2009002797A2 (en) | 2007-06-22 | 2008-06-19 | Packaging multiple measurands into a combinational sensor system using elastomeric seals |
Country Status (4)
Country | Link |
---|---|
US (1) | US7832269B2 (en) |
EP (1) | EP2160571B1 (en) |
CN (1) | CN101329187B (en) |
WO (1) | WO2009002797A2 (en) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8175835B2 (en) * | 2006-05-17 | 2012-05-08 | Honeywell International Inc. | Flow sensor with conditioning-coefficient memory |
US8104340B2 (en) * | 2008-12-19 | 2012-01-31 | Honeywell International Inc. | Flow sensing device including a tapered flow channel |
US8061211B1 (en) * | 2009-06-19 | 2011-11-22 | Odyssian Technology, Llc | Seal with integrated sensor |
US8656772B2 (en) | 2010-03-22 | 2014-02-25 | Honeywell International Inc. | Flow sensor with pressure output signal |
US8113046B2 (en) | 2010-03-22 | 2012-02-14 | Honeywell International Inc. | Sensor assembly with hydrophobic filter |
US8397586B2 (en) | 2010-03-22 | 2013-03-19 | Honeywell International Inc. | Flow sensor assembly with porous insert |
US8756990B2 (en) | 2010-04-09 | 2014-06-24 | Honeywell International Inc. | Molded flow restrictor |
US9003877B2 (en) | 2010-06-15 | 2015-04-14 | Honeywell International Inc. | Flow sensor assembly |
US8418549B2 (en) | 2011-01-31 | 2013-04-16 | Honeywell International Inc. | Flow sensor assembly with integral bypass channel |
DE102010043062A1 (en) * | 2010-10-28 | 2012-05-03 | Robert Bosch Gmbh | Sensor device for detecting a flow characteristic of a fluid medium |
DE102010043083A1 (en) * | 2010-10-28 | 2012-05-03 | Robert Bosch Gmbh | Sensor device for detecting a flow characteristic of a fluid medium |
US8695417B2 (en) | 2011-01-31 | 2014-04-15 | Honeywell International Inc. | Flow sensor with enhanced flow range capability |
CN102680018A (en) * | 2011-03-09 | 2012-09-19 | 刘胜 | Multifunctional combined sensor |
CN102680158A (en) * | 2011-03-09 | 2012-09-19 | 刘胜 | Integrated micro pressure flow sensor based on silicon through-hole technology |
US8718981B2 (en) | 2011-05-09 | 2014-05-06 | Honeywell International Inc. | Modular sensor assembly including removable sensing module |
US9103705B2 (en) * | 2012-02-27 | 2015-08-11 | Freescale Semiconductor, Inc. | Combined environmental parameter sensor |
US9112586B2 (en) * | 2012-09-10 | 2015-08-18 | Broadcom Corporation | Radio circuits and components thereof including temperature responsive liquid MEMS |
EP2720034B1 (en) * | 2012-10-12 | 2016-04-27 | ams International AG | Integrated Circuit comprising a relative humidity sensor and a thermal conductivity based gas sensor |
DE202013103404U1 (en) * | 2012-10-19 | 2013-08-20 | Endress + Hauser Flowtec Ag | Temperature sensor and thermal flow meter |
US9052217B2 (en) | 2012-11-09 | 2015-06-09 | Honeywell International Inc. | Variable scale sensor |
CN103278196A (en) * | 2013-05-30 | 2013-09-04 | 苏州中崟传感股份有限公司 | Integrated sensor |
US10442685B2 (en) * | 2014-03-31 | 2019-10-15 | Nxp Usa, Inc. | Microelectronic packages having hermetic cavities and methods for the production thereof |
CN104034454B (en) * | 2014-06-13 | 2016-05-25 | 江苏多维科技有限公司 | A kind of sensor chip for many physical quantities and preparation method thereof |
EP3176544B1 (en) * | 2014-07-30 | 2019-10-23 | Hitachi Automotive Systems, Ltd. | Physical-quantity detection device |
CN104236628A (en) * | 2014-09-16 | 2014-12-24 | 武汉大学 | Four-degree-of-freedom combined sensor |
WO2016121179A1 (en) | 2015-01-30 | 2016-08-04 | 日立オートモティブシステムズ株式会社 | Physical quantity detection device and electronic device |
US9952079B2 (en) | 2015-07-15 | 2018-04-24 | Honeywell International Inc. | Flow sensor |
CN108227575A (en) * | 2017-12-27 | 2018-06-29 | 上海矽润科技有限公司 | A kind of compound multichannel sensor |
CN109186819B (en) * | 2018-09-10 | 2021-09-28 | 上海平脉科技有限公司 | MEMS pressure sensor module |
CN109405990A (en) * | 2018-11-27 | 2019-03-01 | 广东电网有限责任公司惠州供电局 | A kind of system for detecting temperature |
CN110231121A (en) * | 2018-12-18 | 2019-09-13 | 贵州航天计量测试技术研究所 | A kind of oil well logging sensor comprehensive detection system and method |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4668102A (en) | 1985-05-08 | 1987-05-26 | Honeywell Inc. | Temperature and flow station |
KR20050075225A (en) | 2004-01-16 | 2005-07-20 | 삼성전자주식회사 | Mems monolithic multi-functional integrated sensor and methods for fabricating the same |
US7162927B1 (en) | 2005-12-16 | 2007-01-16 | Honeywell International Inc. | Design of a wet/wet amplified differential pressure sensor based on silicon piezoresistive technology |
WO2007115055A2 (en) | 2006-03-30 | 2007-10-11 | Honeywell International Inc. | Modular sensor system for measuring multiple measurands in a common package |
Family Cites Families (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3410287A (en) | 1966-05-16 | 1968-11-12 | Bendix Corp | Pure fluid velocity sensor control apparatus |
US4341107A (en) | 1980-10-14 | 1982-07-27 | Tylan Corporation | Calibratable system for measuring fluid flow |
DE3153268C2 (en) | 1981-01-31 | 1988-01-28 | Friedrich Wilh. Schwing Gmbh, 4690 Herne, De | Two-cylinder viscous-material pump, preferably concrete pump |
US5050429A (en) | 1990-02-22 | 1991-09-24 | Yamatake-Honeywell Co., Ltd. | Microbridge flow sensor |
US5000478A (en) | 1990-03-15 | 1991-03-19 | Monroe Auto Equipment Company | Shock absorber with Doppler fluid velocity sensor |
US5184107A (en) | 1991-01-28 | 1993-02-02 | Honeywell, Inc. | Piezoresistive pressure transducer with a conductive elastomeric seal |
US5410916A (en) | 1994-06-24 | 1995-05-02 | Honeywell Inc. | Flowthrough pressure sensor |
US5631417A (en) | 1995-09-06 | 1997-05-20 | General Motors Corporation | Mass air flow sensor structure with bi-directional airflow incident on a sensing device at an angle |
US5735267A (en) | 1996-03-29 | 1998-04-07 | Ohmeda Inc. | Adaptive control system for a medical ventilator |
US5892145A (en) | 1996-12-18 | 1999-04-06 | Alliedsignal Inc. | Method for canceling the dynamic response of a mass flow sensor using a conditioned reference |
DE19732474C2 (en) | 1997-07-28 | 2001-08-23 | Siemens Ag | Control device, in particular for an automatic motor vehicle transmission |
US5827960A (en) | 1997-08-28 | 1998-10-27 | General Motors Corporation | Bi-directional mass air flow sensor having mutually-heated sensor elements |
US6543449B1 (en) | 1997-09-19 | 2003-04-08 | Respironics, Inc. | Medical ventilator |
US20030062045A1 (en) | 1998-09-18 | 2003-04-03 | Respironics, Inc. | Medical ventilator |
US6911894B2 (en) | 1998-12-07 | 2005-06-28 | Honeywell International Inc. | Sensor package for harsh environments |
US7258003B2 (en) | 1998-12-07 | 2007-08-21 | Honeywell International Inc. | Flow sensor with self-aligned flow channel |
US6250149B1 (en) * | 1999-04-08 | 2001-06-26 | The Boeing Company | System and method for generating aircraft flight data using a flush-mounted air data system |
TW463184B (en) | 1999-04-09 | 2001-11-11 | Murata Manufacturing Co | Temperature sensor, method of producing same and method of mounting same to a circuit board |
US6595049B1 (en) | 1999-06-18 | 2003-07-22 | Mks Instruments, Inc. | Thermal mass flow sensor with improved sensitivity and response time |
DE19952055A1 (en) | 1999-10-28 | 2001-05-17 | Bosch Gmbh Robert | Mass flow sensor comprises a frame, a membrane held by the frame, a metal layer, a heating element, a temperature measuring element and a moisture barrier arranged above the metal layer |
US6681625B1 (en) | 2000-01-19 | 2004-01-27 | Lockheed Martin Corporation | Constant-temperature-difference bidirectional flow sensor |
US6655207B1 (en) | 2000-02-16 | 2003-12-02 | Honeywell International Inc. | Flow rate module and integrated flow restrictor |
US6761165B2 (en) | 2000-02-29 | 2004-07-13 | The Uab Research Foundation | Medical ventilator system |
JP2003526097A (en) | 2000-03-08 | 2003-09-02 | ローズマウント インコーポレイテッド | Two-way differential pressure fluid sensor |
JP2001272260A (en) | 2000-03-27 | 2001-10-05 | Ngk Spark Plug Co Ltd | Mass flow rate sensor and mass flowmeter using the same |
DE10047194C1 (en) | 2000-09-23 | 2002-03-07 | Bosch Gmbh Robert | Device for testing fire alarm consisting of smoke detector and gas sensor comprises testing head holding alarm, first gas bottle having first gas outlet opening protruding into testing head, and gas bottle for process gas |
DE50115743D1 (en) | 2000-09-29 | 2011-01-27 | Tormaxx Gmbh | GAS OR HEATER, GAS GENERATOR OR HEAT GENERATOR, SMOKE GENERATOR AND METHOD FOR CHECKING A GAS DETECTOR OR HEAT DETECTOR, AND METHOD FOR CHECKING A SMOKE GAS DETECTOR |
US6626175B2 (en) | 2000-10-06 | 2003-09-30 | Respironics, Inc. | Medical ventilator triggering and cycling method and mechanism |
US6591674B2 (en) | 2000-12-21 | 2003-07-15 | Honeywell International Inc. | System for sensing the motion or pressure of a fluid, the system having dimensions less than 1.5 inches, a metal lead frame with a coefficient of thermal expansion that is less than that of the body, or two rtds and a heat source |
DE10130379A1 (en) | 2001-06-23 | 2003-01-02 | Bosch Gmbh Robert | Micromechanical mass flow sensor and method for its production |
US6958689B2 (en) | 2001-09-21 | 2005-10-25 | Rosemount Aerospace Inc. | Multi-sensor fire detector with reduced false alarm performance |
US6681623B2 (en) | 2001-10-30 | 2004-01-27 | Honeywell International Inc. | Flow and pressure sensor for harsh fluids |
US6904799B2 (en) | 2002-06-12 | 2005-06-14 | Polar Controls, Inc. | Fluid velocity sensor with heated element kept at a differential temperature above the temperature of a fluid |
US6867602B2 (en) | 2002-07-09 | 2005-03-15 | Honeywell International Inc. | Methods and systems for capacitive balancing of relative humidity sensors having integrated signal conditioning |
US6724612B2 (en) | 2002-07-09 | 2004-04-20 | Honeywell International Inc. | Relative humidity sensor with integrated signal conditioning |
US7073392B2 (en) | 2002-07-19 | 2006-07-11 | Celerity, Inc. | Methods and apparatus for pressure compensation in a mass flow controller |
US6684695B1 (en) | 2002-10-08 | 2004-02-03 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Mass flow sensor utilizing a resistance bridge |
US6904907B2 (en) | 2002-11-19 | 2005-06-14 | Honeywell International Inc. | Indirect flow measurement through a breath-operated inhaler |
US7233845B2 (en) | 2003-03-21 | 2007-06-19 | Siemens Canada Limited | Method for determining vapor canister loading using temperature |
US6929031B2 (en) | 2003-03-28 | 2005-08-16 | Eaton Corporation | Electro-hydraulic manifold assembly with lead frame mounted pressure sensors |
SE0301767D0 (en) | 2003-06-18 | 2003-06-18 | Siemens Elema Ab | User interface for a medical ventilator |
US6871537B1 (en) | 2003-11-15 | 2005-03-29 | Honeywell International Inc. | Liquid flow sensor thermal interface methods and systems |
US6945118B2 (en) | 2004-01-13 | 2005-09-20 | Honeywell International Inc. | Ceramic on metal pressure transducer |
DE102004008903B3 (en) | 2004-02-24 | 2005-09-15 | Siemens Ag | Mass flow sensor for measuring mass air flow in induction tract of internal combustion engine has additional sensor element installed in recess of component connected to main channel by coupling element |
US7084378B2 (en) | 2004-02-26 | 2006-08-01 | Mack Trucks, Inc. | Mass-flow sensor heating element protection method and apparatus |
US6912918B1 (en) | 2004-03-10 | 2005-07-05 | General Electric Company | Mass flow sensor and methods of determining mass flow of a fluid |
US6958565B1 (en) | 2004-04-05 | 2005-10-25 | Honeywell International Inc. | Passive wireless piezoelectric smart tire sensor with reduced size |
US7107835B2 (en) | 2004-09-08 | 2006-09-19 | Honeywell International Inc. | Thermal mass flow sensor |
TWI306297B (en) | 2005-02-18 | 2009-02-11 | Yamaha Corp | Lead frame, sensor including lead frame and method of forming sensor including lead frame |
CN100416233C (en) * | 2006-09-30 | 2008-09-03 | 浙江麦姆龙仪表有限公司 | Measuring method and its device for external leading sampling of pipeline gas flow |
US7430918B2 (en) * | 2006-12-04 | 2008-10-07 | Honeywell International Inc. | Amplified flow through pressure sensor |
-
2007
- 2007-06-22 US US11/821,421 patent/US7832269B2/en active Active
- 2007-08-03 CN CN200710139926.9A patent/CN101329187B/en not_active Expired - Fee Related
-
2008
- 2008-06-19 WO PCT/US2008/067481 patent/WO2009002797A2/en active Application Filing
- 2008-06-19 EP EP08795937.5A patent/EP2160571B1/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4668102A (en) | 1985-05-08 | 1987-05-26 | Honeywell Inc. | Temperature and flow station |
KR20050075225A (en) | 2004-01-16 | 2005-07-20 | 삼성전자주식회사 | Mems monolithic multi-functional integrated sensor and methods for fabricating the same |
US7162927B1 (en) | 2005-12-16 | 2007-01-16 | Honeywell International Inc. | Design of a wet/wet amplified differential pressure sensor based on silicon piezoresistive technology |
WO2007115055A2 (en) | 2006-03-30 | 2007-10-11 | Honeywell International Inc. | Modular sensor system for measuring multiple measurands in a common package |
Non-Patent Citations (1)
Title |
---|
See also references of EP2160571A4 |
Also Published As
Publication number | Publication date |
---|---|
WO2009002797A3 (en) | 2009-04-09 |
US7832269B2 (en) | 2010-11-16 |
EP2160571A4 (en) | 2017-02-15 |
US20080314118A1 (en) | 2008-12-25 |
CN101329187B (en) | 2015-09-16 |
EP2160571A2 (en) | 2010-03-10 |
EP2160571B1 (en) | 2018-01-17 |
CN101329187A (en) | 2008-12-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7832269B2 (en) | Packaging multiple measurands into a combinational sensor system using elastomeric seals | |
EP2568270B1 (en) | Packaged sensor with multiple sensors elements | |
CN108072487B (en) | Method and apparatus for calibrating a pressure sensor | |
US7430918B2 (en) | Amplified flow through pressure sensor | |
EP2189773B1 (en) | Design of wet/wet differential pressure sensor based on microelectronic packaging process | |
EP2270455B1 (en) | Force sensor apparatus | |
US7150195B2 (en) | Sealed capacitive sensor for physical measurements | |
US7508040B2 (en) | Micro electrical mechanical systems pressure sensor | |
EP1883798B1 (en) | Pressure sensor using compressible sensor body | |
EP1359402B1 (en) | Pressure sensor | |
US6901794B2 (en) | Multiple technology flow sensor | |
EP3287758B1 (en) | Differential pressure sensor incorporating common mode error compensation | |
US20100083764A1 (en) | Redundant self compensating leadless pressure sensor | |
EP3258235A1 (en) | Differential pressure transducer | |
KR20010032103A (en) | Micromechanical differential pressure sensor device | |
JPH10197316A (en) | Density correction-type liquid level detecting device | |
Pernu et al. | Ultra-high sensitivity surface-micromachined capacitive differential pressure sensor for low-pressure applications | |
EP3748323B1 (en) | Differential pressure transducer | |
WO2009124875A1 (en) | Flow-rate sensor and method for manufacturing thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 08795937 Country of ref document: EP Kind code of ref document: A2 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2008795937 Country of ref document: EP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |