WO2009000865A3 - Peltierelementanordnung - Google Patents
Peltierelementanordnung Download PDFInfo
- Publication number
- WO2009000865A3 WO2009000865A3 PCT/EP2008/058114 EP2008058114W WO2009000865A3 WO 2009000865 A3 WO2009000865 A3 WO 2009000865A3 EP 2008058114 W EP2008058114 W EP 2008058114W WO 2009000865 A3 WO2009000865 A3 WO 2009000865A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- peltier element
- heat exchanger
- element arrangement
- exchanger modules
- transfer surfaces
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
- F28F1/22—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means having portions engaging further tubular elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
Abstract
Die Erfindung betrifft eine Peltierelementanordnung mit einem sandwichartig zwischen Wärmetauscheranordnungen aufgenommenen Peltierelement, wobei die Wärmetauscheranordnungen jeweils mehrere Wärmetauschermodule aufweisen, die mit Wärmeübertragungsflächen einander angrenzend angeordnet sind, wobei die Wärmeübertragungsflächen der Wärmetauschemodule unterschiedlich groß ausgebildet sind, und die Wärmetauschermodule von einer Kaltseite oder Warmseite des Peltierelements ausgehend stufenweise vergrößerte Wärmeübertragungsflächen aufweisen.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007029509 | 2007-06-25 | ||
DE102007029509.1 | 2007-06-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009000865A2 WO2009000865A2 (de) | 2008-12-31 |
WO2009000865A3 true WO2009000865A3 (de) | 2009-09-24 |
Family
ID=39832656
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2008/058114 WO2009000865A2 (de) | 2007-06-25 | 2008-06-25 | Peltierelementanordnung |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2009000865A2 (de) |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3006979A (en) * | 1959-04-09 | 1961-10-31 | Carrier Corp | Heat exchanger for thermoelectric apparatus |
US3270513A (en) * | 1965-06-21 | 1966-09-06 | Westinghouse Electric Corp | Thermoelectric water cooler |
US5031689A (en) * | 1990-07-31 | 1991-07-16 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Flexible thermal apparatus for mounting of thermoelectric cooler |
US5040381A (en) * | 1990-04-19 | 1991-08-20 | Prime Computer, Inc. | Apparatus for cooling circuits |
JPH08121898A (ja) * | 1994-10-25 | 1996-05-17 | Matsushita Electric Works Ltd | 熱電変換装置 |
US5561981A (en) * | 1993-10-05 | 1996-10-08 | Quisenberry; Tony M. | Heat exchanger for thermoelectric cooling device |
JPH09196505A (ja) * | 1996-01-22 | 1997-07-31 | Zexel Corp | 熱電装置 |
US6502405B1 (en) * | 2001-10-19 | 2003-01-07 | John Van Winkle | Fluid heat exchanger assembly |
US6574967B1 (en) * | 2002-01-31 | 2003-06-10 | Samsung Electronics Co., Ltd. | Cooling and heating apparatus using thermoelectric module |
JP2006066822A (ja) * | 2004-08-30 | 2006-03-09 | Denso Corp | 熱電変換装置 |
US20060157102A1 (en) * | 2005-01-12 | 2006-07-20 | Showa Denko K.K. | Waste heat recovery system and thermoelectric conversion system |
US20060168969A1 (en) * | 2005-02-03 | 2006-08-03 | Ligong Mei | Compact high-performance thermoelectric device for air cooling applications |
-
2008
- 2008-06-25 WO PCT/EP2008/058114 patent/WO2009000865A2/de active Application Filing
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3006979A (en) * | 1959-04-09 | 1961-10-31 | Carrier Corp | Heat exchanger for thermoelectric apparatus |
US3270513A (en) * | 1965-06-21 | 1966-09-06 | Westinghouse Electric Corp | Thermoelectric water cooler |
US5040381A (en) * | 1990-04-19 | 1991-08-20 | Prime Computer, Inc. | Apparatus for cooling circuits |
US5031689A (en) * | 1990-07-31 | 1991-07-16 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Flexible thermal apparatus for mounting of thermoelectric cooler |
US5561981A (en) * | 1993-10-05 | 1996-10-08 | Quisenberry; Tony M. | Heat exchanger for thermoelectric cooling device |
JPH08121898A (ja) * | 1994-10-25 | 1996-05-17 | Matsushita Electric Works Ltd | 熱電変換装置 |
JPH09196505A (ja) * | 1996-01-22 | 1997-07-31 | Zexel Corp | 熱電装置 |
US6502405B1 (en) * | 2001-10-19 | 2003-01-07 | John Van Winkle | Fluid heat exchanger assembly |
US6574967B1 (en) * | 2002-01-31 | 2003-06-10 | Samsung Electronics Co., Ltd. | Cooling and heating apparatus using thermoelectric module |
JP2006066822A (ja) * | 2004-08-30 | 2006-03-09 | Denso Corp | 熱電変換装置 |
US20060157102A1 (en) * | 2005-01-12 | 2006-07-20 | Showa Denko K.K. | Waste heat recovery system and thermoelectric conversion system |
US20060168969A1 (en) * | 2005-02-03 | 2006-08-03 | Ligong Mei | Compact high-performance thermoelectric device for air cooling applications |
Also Published As
Publication number | Publication date |
---|---|
WO2009000865A2 (de) | 2008-12-31 |
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