WO2008156005A1 - Semiconductor failure analyzer, semiconductor failure analysis method and semiconductor failure analysis program - Google Patents
Semiconductor failure analyzer, semiconductor failure analysis method and semiconductor failure analysis program Download PDFInfo
- Publication number
- WO2008156005A1 WO2008156005A1 PCT/JP2008/060545 JP2008060545W WO2008156005A1 WO 2008156005 A1 WO2008156005 A1 WO 2008156005A1 JP 2008060545 W JP2008060545 W JP 2008060545W WO 2008156005 A1 WO2008156005 A1 WO 2008156005A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- failure
- analysis
- semiconductor failure
- analyzer
- failure analysis
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Computer Hardware Design (AREA)
- Toxicology (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
A failure analyzer (10) is provided with an inspection information acquiring section (11) for acquiring a failure monitor image (P2) of a semiconductor device; a layout information acquiring section (12) for acquiring layout information; and a failure analysis section (13) which performs failure analysis. The failure analysis section (13) refers to the failure monitor image, and sets an analysis region in accordance with reaction information obtained from the failure monitor image. Then, the failure analysis section extracts, as a failure candidate wiring, a wiring passing through the analysis region from among a plurality of wirings included in the layout of the semiconductor device, refers to each distance between the candidate wiring and other wiring of the plurality of wirings, and acquires proximity wring information for the candidate wiring. Thus, the semiconductor failure analyzer which can surely and efficiently analyze failures of the semiconductor device by using the failure monitor image, an analysis method and an analysis program are provided.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-162972 | 2007-06-20 | ||
| JP2007162972A JP5155602B2 (en) | 2007-06-20 | 2007-06-20 | Semiconductor failure analysis apparatus, failure analysis method, and failure analysis program |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2008156005A1 true WO2008156005A1 (en) | 2008-12-24 |
Family
ID=40156163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2008/060545 WO2008156005A1 (en) | 2007-06-20 | 2008-06-09 | Semiconductor failure analyzer, semiconductor failure analysis method and semiconductor failure analysis program |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5155602B2 (en) |
| TW (1) | TWI502668B (en) |
| WO (1) | WO2008156005A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5707127B2 (en) * | 2010-12-28 | 2015-04-22 | ルネサスエレクトロニクス株式会社 | Semiconductor device failure analysis method |
| TWI480543B (en) * | 2013-02-21 | 2015-04-11 | Macronix Int Co Ltd | Test pattern design for semiconductor devices and method of utilizing thereof |
| CN110501626B (en) * | 2018-05-17 | 2022-09-23 | 瑞昱半导体股份有限公司 | Method for generating test database of electronic device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003303746A (en) * | 2002-04-08 | 2003-10-24 | Hitachi Ltd | Method and system for analyzing failure of semiconductor and program for failure analysis of semiconductor |
| JP2007005497A (en) * | 2005-06-22 | 2007-01-11 | Hamamatsu Photonics Kk | Semiconductor failure analyzing device, failure analyzing method and failure analyzing program |
-
2007
- 2007-06-20 JP JP2007162972A patent/JP5155602B2/en active Active
-
2008
- 2008-06-09 WO PCT/JP2008/060545 patent/WO2008156005A1/en active Application Filing
- 2008-06-12 TW TW097121957A patent/TWI502668B/en active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003303746A (en) * | 2002-04-08 | 2003-10-24 | Hitachi Ltd | Method and system for analyzing failure of semiconductor and program for failure analysis of semiconductor |
| JP2007005497A (en) * | 2005-06-22 | 2007-01-11 | Hamamatsu Photonics Kk | Semiconductor failure analyzing device, failure analyzing method and failure analyzing program |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009004505A (en) | 2009-01-08 |
| TW200917403A (en) | 2009-04-16 |
| JP5155602B2 (en) | 2013-03-06 |
| TWI502668B (en) | 2015-10-01 |
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