WO2008152506A3 - A method and a device for depositing or removing a layer on/from a workpiece, an analysis method and device for analysing an expected layer thickness, a method for setting up a database for such an analysis method or device, as well as such a database - Google Patents

A method and a device for depositing or removing a layer on/from a workpiece, an analysis method and device for analysing an expected layer thickness, a method for setting up a database for such an analysis method or device, as well as such a database Download PDF

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Publication number
WO2008152506A3
WO2008152506A3 PCT/IB2008/001905 IB2008001905W WO2008152506A3 WO 2008152506 A3 WO2008152506 A3 WO 2008152506A3 IB 2008001905 W IB2008001905 W IB 2008001905W WO 2008152506 A3 WO2008152506 A3 WO 2008152506A3
Authority
WO
WIPO (PCT)
Prior art keywords
layer thickness
workpiece
expected
database
specific element
Prior art date
Application number
PCT/IB2008/001905
Other languages
French (fr)
Other versions
WO2008152506A2 (en
Inventor
Den Bossche Bart Juul Wihelmina Van
Original Assignee
Elsyca N V
Den Bossche Bart Juul Wihelmina Van
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Elsyca N V, Den Bossche Bart Juul Wihelmina Van filed Critical Elsyca N V
Publication of WO2008152506A2 publication Critical patent/WO2008152506A2/en
Publication of WO2008152506A3 publication Critical patent/WO2008152506A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0117—Pattern shaped electrode used for patterning, e.g. plating or etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Abstract

The invention relates, inter alia, to a method for depositing or removing a layer on/from a workpiece, wherein an electrolyte is present between said workpiece and at least one counter electrode and a potential difference is applied between said workpiece and said counter electrode for depositing or removing said layer. The deposition or removal is preceded by an analysis phase, in which an expected layer thickness of the layer to be deposited or removed is calculated on the basis of data from a database. During the analysis phase an expected potential distribution in the electrolyte near the workpiece is calculated, whilst an expected local potential difference between the electrolyte and the workpiece is calculated at least at a specific element on the workpiece. At least the layer thickness at at least one historic specific element stored in the database is retrieved in said database, of which historic specific element at least the local potential difference at least substantially corresponds to the expected local potential difference of the specific element provided on the workpiece, which layer thickness is regarded as the expected layer thickness at the specific element on the workpiece. Subsequently the expected layer thickness is compared to a desired layer thickness at the specific element, whereupon, if the difference between the expected layer thickness and the desired layer thickness exceeds a predetermined value, measures are taken to change the expected local potential difference at the specific element so that the layer thickness to be realised and the desired layer thickness substantially correspond.
PCT/IB2008/001905 2007-06-12 2008-06-09 A method and a device for depositing or removing a layer on/from a workpiece, an analysis method and device for analysing an expected layer thickness, a method for setting up a database for such an analysis method or device, as well as such a database WO2008152506A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1033973A NL1033973C2 (en) 2007-06-12 2007-06-12 Method and device for depositing or removing a layer on a workpiece, analysis method and device for analyzing an expected layer thickness, a method for manufacturing a database for such an analysis method or device, and such a database.
NL1033973 2007-06-12

Publications (2)

Publication Number Publication Date
WO2008152506A2 WO2008152506A2 (en) 2008-12-18
WO2008152506A3 true WO2008152506A3 (en) 2009-03-12

Family

ID=38952109

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2008/001905 WO2008152506A2 (en) 2007-06-12 2008-06-09 A method and a device for depositing or removing a layer on/from a workpiece, an analysis method and device for analysing an expected layer thickness, a method for setting up a database for such an analysis method or device, as well as such a database

Country Status (2)

Country Link
NL (1) NL1033973C2 (en)
WO (1) WO2008152506A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2007221C2 (en) * 2011-08-04 2013-02-05 Elsyca N V A device suitable for the electrochemical processing of an object, a holder suitable for such a device and a method for the electrochemical processing of an object.
EP2754735B1 (en) 2013-01-11 2020-07-22 Elsyca N.V. A device suitable for the electrochemical processing of an object, and a method for the electrochemical processing of an object
US9677191B2 (en) 2013-01-17 2017-06-13 Elsyca N.V. Device suitable for the electrochemical processing of an object, a holder suitable for such a device, and a method for the electrochemical processing of an object

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0440027A2 (en) * 1990-01-29 1991-08-07 Shipley Company Inc. Additive for acid-copper electroplating baths to increase throwing power
EP1113094A2 (en) * 1999-11-19 2001-07-04 Ebara Corporation Plating analysis method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0440027A2 (en) * 1990-01-29 1991-08-07 Shipley Company Inc. Additive for acid-copper electroplating baths to increase throwing power
EP1113094A2 (en) * 1999-11-19 2001-07-04 Ebara Corporation Plating analysis method

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
DATABASE INSPEC [online] THE INSTITUTION OF ELECTRICAL ENGINEERS, STEVENAGE, GB; June 2002 (2002-06-01), DRUESNE F ET AL: "A new 3D electroplating simulation & design tool", XP002466065, Database accession no. 7385890 *
DECONINCK J ET AL: "Benefits of modelling for the electroplating industry", GALVANOTECHNIK, May 2007 (2007-05-01), XP002466064, Retrieved from the Internet <URL:http://elscya.com/_X2/Elsyca/Documents/Galvanotechnik%20May%202007.pdf> [retrieved on 20080124] *
DRUESNE F;: "A new 3D electroplating simulation & design tool", 2002, XP002466063, Retrieved from the Internet <URL:http://www.smartcatshield.com/docs/SURFIN2001.pdf> [retrieved on 20080124] *
PLATING AND SURFACE FINISHING AMERICAN ELECTROPLATERS & SURFACE FINISHERS SOC USA, vol. 89, no. 6, June 2002 (2002-06-01), pages 20 - 24, XP002466062, ISSN: 0360-3164 *

Also Published As

Publication number Publication date
WO2008152506A2 (en) 2008-12-18
NL1033973C2 (en) 2008-12-15

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