WO2008143278A1 - Device wafer polishing pad, polishing body, polishing tool constituting body, and polishing method - Google Patents

Device wafer polishing pad, polishing body, polishing tool constituting body, and polishing method Download PDF

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Publication number
WO2008143278A1
WO2008143278A1 PCT/JP2008/059317 JP2008059317W WO2008143278A1 WO 2008143278 A1 WO2008143278 A1 WO 2008143278A1 JP 2008059317 W JP2008059317 W JP 2008059317W WO 2008143278 A1 WO2008143278 A1 WO 2008143278A1
Authority
WO
WIPO (PCT)
Prior art keywords
polishing
conductive layer
device wafer
tool constituting
pad
Prior art date
Application number
PCT/JP2008/059317
Other languages
French (fr)
Japanese (ja)
Inventor
Daisuke Abe
Seiichi Kondo
Taro Enomoto
Shigeru Tominaga
Original Assignee
Roki Techno Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Roki Techno Co., Ltd. filed Critical Roki Techno Co., Ltd.
Priority to JP2009515252A priority Critical patent/JP4500885B2/en
Publication of WO2008143278A1 publication Critical patent/WO2008143278A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H5/00—Combined machining
    • B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
    • B23H5/08—Electrolytic grinding

Abstract

It is possible to provide a device wafer polishing pad, a polishing body, a polishing tool constituting body, and a polishing method which can polish a conductive layer for forming device wafer wiring without damaging the conductive layer. An electrolyte cell (C1) for electrical communication is formed by electro-chemically connecting a conductive layer (D1) to an anode electrode (63) via an electrolyte solution (E) so as to make the conductive layer (D1) an anode. An electrolyte cell (C2) for polishing is formed by electro-chemically connecting the conductive layer (D1) to a cathode electrode (65) via the electrolyte solution (E) independently of the electrolyte cell (C1) for electrical communication. Thus, the conductive layer (D1) is polished electro-chemical-mechanically.
PCT/JP2008/059317 2007-05-22 2008-05-21 Device wafer polishing pad, polishing body, polishing tool constituting body, and polishing method WO2008143278A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009515252A JP4500885B2 (en) 2007-05-22 2008-05-21 Device wafer polishing pad, polishing body, polishing tool structure and polishing method

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-135167 2007-05-22
JP2007135167 2007-05-22
JP2007262960 2007-10-09
JP2007-262960 2007-10-09

Publications (1)

Publication Number Publication Date
WO2008143278A1 true WO2008143278A1 (en) 2008-11-27

Family

ID=40031973

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059317 WO2008143278A1 (en) 2007-05-22 2008-05-21 Device wafer polishing pad, polishing body, polishing tool constituting body, and polishing method

Country Status (2)

Country Link
JP (1) JP4500885B2 (en)
WO (1) WO2008143278A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004276219A (en) * 2003-03-18 2004-10-07 Ebara Corp Electrolytic machining liquid, electrolytic machining device, and wiring machining method
WO2005061177A1 (en) * 2003-12-03 2005-07-07 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
JP2005260224A (en) * 2004-02-27 2005-09-22 Asm Nutool Inc System for electrochemical mechanical polishing

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004276219A (en) * 2003-03-18 2004-10-07 Ebara Corp Electrolytic machining liquid, electrolytic machining device, and wiring machining method
WO2005061177A1 (en) * 2003-12-03 2005-07-07 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
JP2005260224A (en) * 2004-02-27 2005-09-22 Asm Nutool Inc System for electrochemical mechanical polishing

Also Published As

Publication number Publication date
JP4500885B2 (en) 2010-07-14
JPWO2008143278A1 (en) 2010-08-12

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