WO2008137951A3 - Plating apparatus and method - Google Patents

Plating apparatus and method Download PDF

Info

Publication number
WO2008137951A3
WO2008137951A3 PCT/US2008/062943 US2008062943W WO2008137951A3 WO 2008137951 A3 WO2008137951 A3 WO 2008137951A3 US 2008062943 W US2008062943 W US 2008062943W WO 2008137951 A3 WO2008137951 A3 WO 2008137951A3
Authority
WO
WIPO (PCT)
Prior art keywords
plating
support member
processing volume
point
shaft
Prior art date
Application number
PCT/US2008/062943
Other languages
French (fr)
Other versions
WO2008137951A2 (en
Inventor
Yixiang Xie
Steven Anderson
Miles A Prim
Thomas H Oberlitner
Fernando M Sanchez
Gerard Minogue
Solomon Basame
Original Assignee
Surfect Technologies Inc
Yixiang Xie
Steven Anderson
Miles A Prim
Thomas H Oberlitner
Fernando M Sanchez
Gerard Minogue
Solomon Basame
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Surfect Technologies Inc, Yixiang Xie, Steven Anderson, Miles A Prim, Thomas H Oberlitner, Fernando M Sanchez, Gerard Minogue, Solomon Basame filed Critical Surfect Technologies Inc
Publication of WO2008137951A2 publication Critical patent/WO2008137951A2/en
Publication of WO2008137951A3 publication Critical patent/WO2008137951A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/04—Removal of gases or vapours ; Gas or pressure control
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/003—Electroplating using gases, e.g. pressure influence
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Abstract

A plating computer having a plating cell with an interior processing volume configured to contain a plating solution for a plating process, a cell mounting platform connected at least at a first point to an actuator and at a second point to a movable attachment member, a rotatable substrate support member positioned in the processing volume and having a longitudinally extending shaft extending from a non-substrate engaging side of the support member, a transducer coupled to the longitudinally extending shaft and being configured to impart energy to the substrate support member via the shaft, and at least one detachable chemistry module in fluid communication with the processing volume.
PCT/US2008/062943 2007-05-07 2008-05-07 Plating apparatus and method WO2008137951A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US91656307P 2007-05-07 2007-05-07
US60/916,563 2007-05-07

Publications (2)

Publication Number Publication Date
WO2008137951A2 WO2008137951A2 (en) 2008-11-13
WO2008137951A3 true WO2008137951A3 (en) 2009-03-19

Family

ID=39590887

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/062943 WO2008137951A2 (en) 2007-05-07 2008-05-07 Plating apparatus and method

Country Status (2)

Country Link
TW (1) TW200923134A (en)
WO (1) WO2008137951A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10385471B2 (en) 2013-03-18 2019-08-20 Spts Technologies Limited Electrochemical deposition chamber
GB2512056B (en) 2013-03-18 2018-04-18 Spts Technologies Ltd Electrochemical deposition chamber

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6261433B1 (en) * 1998-04-21 2001-07-17 Applied Materials, Inc. Electro-chemical deposition system and method of electroplating on substrates
EP1170402A1 (en) * 2000-07-07 2002-01-09 Applied Materials, Inc. Coated anode system
US20040016637A1 (en) * 2002-07-24 2004-01-29 Applied Materials, Inc. Multi-chemistry plating system
US20040124090A1 (en) * 2002-12-30 2004-07-01 Chen-Chung Du Wafer electroplating apparatus and method
US20050245083A1 (en) * 1998-03-20 2005-11-03 Semitool, Inc. Apparatus and method for electrochemically depositing metal on a semiconductor workpiece

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050245083A1 (en) * 1998-03-20 2005-11-03 Semitool, Inc. Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
US6261433B1 (en) * 1998-04-21 2001-07-17 Applied Materials, Inc. Electro-chemical deposition system and method of electroplating on substrates
EP1170402A1 (en) * 2000-07-07 2002-01-09 Applied Materials, Inc. Coated anode system
US20040016637A1 (en) * 2002-07-24 2004-01-29 Applied Materials, Inc. Multi-chemistry plating system
US20040124090A1 (en) * 2002-12-30 2004-07-01 Chen-Chung Du Wafer electroplating apparatus and method

Also Published As

Publication number Publication date
WO2008137951A2 (en) 2008-11-13
TW200923134A (en) 2009-06-01

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