WO2008135179A1 - Process for applying a metal coating to a non-conductive substrate - Google Patents
Process for applying a metal coating to a non-conductive substrate Download PDFInfo
- Publication number
- WO2008135179A1 WO2008135179A1 PCT/EP2008/003345 EP2008003345W WO2008135179A1 WO 2008135179 A1 WO2008135179 A1 WO 2008135179A1 EP 2008003345 W EP2008003345 W EP 2008003345W WO 2008135179 A1 WO2008135179 A1 WO 2008135179A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- acid
- metal
- complexing agent
- group
- composition
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010504553A JP5279815B2 (en) | 2007-05-03 | 2008-04-24 | Method of applying a metal coating to a non-conductive substrate |
US12/451,191 US8152914B2 (en) | 2007-05-03 | 2008-04-24 | Process for applying a metal coating to a non-conductive substrate |
BRPI0810798-0A BRPI0810798B1 (en) | 2007-05-03 | 2008-04-24 | PROCESS FOR APPLICATION OF METAL COATING IN A NON-CONDUCTIVE SUBSTRATE. |
KR1020157013086A KR20150063593A (en) | 2007-05-03 | 2008-04-24 | Process for applying a metal coating to a non-conductive substrate |
CN2008800145982A CN101675186B (en) | 2007-05-03 | 2008-04-24 | Process for applying a metal coating to a non-conductive substrate |
KR20157007162A KR20150038717A (en) | 2007-05-03 | 2008-04-24 | Process for applying a metal coating to a non-conductive substrate |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP07008950.3 | 2007-05-03 | ||
EP07008950A EP1988192B1 (en) | 2007-05-03 | 2007-05-03 | Process for applying a metal coating to a non-conductive substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008135179A1 true WO2008135179A1 (en) | 2008-11-13 |
Family
ID=38468848
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2008/003345 WO2008135179A1 (en) | 2007-05-03 | 2008-04-24 | Process for applying a metal coating to a non-conductive substrate |
Country Status (10)
Country | Link |
---|---|
US (1) | US8152914B2 (en) |
EP (1) | EP1988192B1 (en) |
JP (1) | JP5279815B2 (en) |
KR (3) | KR101579191B1 (en) |
CN (1) | CN101675186B (en) |
BR (1) | BRPI0810798B1 (en) |
ES (1) | ES2395736T3 (en) |
PL (1) | PL1988192T3 (en) |
PT (1) | PT1988192E (en) |
WO (1) | WO2008135179A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011035921A1 (en) | 2009-09-28 | 2011-03-31 | Atotech Deutschland Gmbh | Process for applying a metal coating to a non-conductive substrate |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2581469B1 (en) * | 2011-10-10 | 2015-04-15 | Enthone, Inc. | Aqueous activator solution and process for electroless copper deposition on laser-direct structured substrates |
ES2688876T3 (en) * | 2012-02-01 | 2018-11-07 | Atotech Deutschland Gmbh | Nickel non-electrolytic plating bath |
EP2784181B1 (en) * | 2013-03-27 | 2015-12-09 | ATOTECH Deutschland GmbH | Electroless copper plating solution |
CN104916820B (en) * | 2015-05-12 | 2017-05-10 | 北京理工大学 | Novel silicon-based negative electrode material for lithium ion battery and preparation method therefor |
EP3296428B1 (en) * | 2016-09-16 | 2019-05-15 | ATOTECH Deutschland GmbH | Method for depositing a metal or metal alloy on a surface |
KR20220143007A (en) * | 2020-02-19 | 2022-10-24 | 닛산 가가쿠 가부시키가이샤 | Electroless plating base agent containing polymer and metal fine particles |
CN111778496B (en) * | 2020-07-14 | 2022-04-19 | 赤壁市聚茂新材料科技有限公司 | Activating agent for nickel plating of tin alloy activated copper layer and nickel plating method |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0538006A1 (en) * | 1991-10-15 | 1993-04-21 | ENTHONE-OMI, Inc. | Direct metallization process |
EP0616053A1 (en) * | 1993-03-18 | 1994-09-21 | Atotech Usa, Inc. | Self accelerating and replenishing non-formaldehyde immersion coating method and composition |
WO1996029452A1 (en) * | 1995-03-17 | 1996-09-26 | Atotech Deutschland Gmbh | Process for the selective or partial electrolytic metallization of surfaces of substrates made from non-conducting materials |
EP0913502A1 (en) * | 1997-04-07 | 1999-05-06 | Okuno Chemical Industries Co., Ltd. | Method of electroplating nonconductive plastic molded product |
US5910340A (en) * | 1995-10-23 | 1999-06-08 | C. Uyemura & Co., Ltd. | Electroless nickel plating solution and method |
EP1306465A2 (en) * | 2001-10-24 | 2003-05-02 | Shipley Co. L.L.C. | Stabilizers for electroless plating solutions and methods of use thereof |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3011920A (en) | 1959-06-08 | 1961-12-05 | Shipley Co | Method of electroless deposition on a substrate and catalyst solution therefor |
US3682671A (en) | 1970-02-05 | 1972-08-08 | Kollmorgen Corp | Novel precious metal sensitizing solutions |
US3984290A (en) | 1973-10-01 | 1976-10-05 | Georgy Avenirovich Kitaev | Method of forming intralayer junctions in a multilayer structure |
AT331943B (en) | 1973-11-05 | 1976-08-25 | Erz & Stahl Ges M B H | SOLVENTS FOR PAINT |
US5007990A (en) | 1987-07-10 | 1991-04-16 | Shipley Company Inc. | Electroplating process |
US4810333A (en) | 1987-12-14 | 1989-03-07 | Shipley Company Inc. | Electroplating process |
JP2657423B2 (en) | 1988-03-03 | 1997-09-24 | ブラスベルク・オーベルフレヒェンテヒニーク・ゲー・エム・ベー・ハー | Novel through-hole plated printed circuit board and manufacturing method thereof |
US4919768A (en) | 1989-09-22 | 1990-04-24 | Shipley Company Inc. | Electroplating process |
RU1819556C (en) * | 1990-01-15 | 1993-06-07 | Институт физиологии и биохимии растений АН МССР | Composition for regulation of growth and development of fruit tress |
US5213841A (en) | 1990-05-15 | 1993-05-25 | Shipley Company Inc. | Metal accelerator |
DE4024552A1 (en) * | 1990-08-02 | 1992-02-06 | Henkel Kgaa | DERIVATIVE AMINO STINIC ACID AS A COMPLEXING AGENT |
JPH08296049A (en) * | 1995-04-24 | 1996-11-12 | Nitto Chem Ind Co Ltd | Electroless nickel plating bath using monoamine-type biodegradable chelating agent |
JPH08325742A (en) * | 1995-05-31 | 1996-12-10 | Nitto Chem Ind Co Ltd | Electroless copper plating bath using monoamine type bio-degradable chelating agent |
JP2000144439A (en) * | 1998-10-30 | 2000-05-26 | Kizai Kk | Plating treating method for nonconductor stock, and electroless treating solution composition therefor |
DE19850359A1 (en) | 1998-11-02 | 2000-05-04 | Bayer Ag | Process for the preparation of aspartic acid derivatives |
US6870026B1 (en) * | 1999-09-17 | 2005-03-22 | Lidochem, Inc. | Chelation compositions |
US7166688B1 (en) | 2000-07-08 | 2007-01-23 | Lidochem, Inc. | Chelation compositions |
JP4843164B2 (en) * | 2001-08-21 | 2011-12-21 | 日本リーロナール有限会社 | Method for forming copper-resin composite material |
EP1513009A1 (en) | 2003-08-29 | 2005-03-09 | AgfaPhoto GmbH | Container for photochemicals |
EP1734156B1 (en) * | 2005-06-10 | 2017-03-01 | Enthone, Inc. | Process for the direct metallization of nonconductive substrates |
DE102009029558A1 (en) * | 2009-09-17 | 2011-03-31 | Schott Solar Ag | electrolyte composition |
-
2007
- 2007-05-03 EP EP07008950A patent/EP1988192B1/en active Active
- 2007-05-03 PT PT70089503T patent/PT1988192E/en unknown
- 2007-05-03 PL PL07008950T patent/PL1988192T3/en unknown
- 2007-05-03 ES ES07008950T patent/ES2395736T3/en active Active
-
2008
- 2008-04-24 KR KR1020097025285A patent/KR101579191B1/en active IP Right Grant
- 2008-04-24 BR BRPI0810798-0A patent/BRPI0810798B1/en active IP Right Grant
- 2008-04-24 CN CN2008800145982A patent/CN101675186B/en active Active
- 2008-04-24 KR KR20157007162A patent/KR20150038717A/en not_active Application Discontinuation
- 2008-04-24 JP JP2010504553A patent/JP5279815B2/en active Active
- 2008-04-24 KR KR1020157013086A patent/KR20150063593A/en not_active Application Discontinuation
- 2008-04-24 US US12/451,191 patent/US8152914B2/en active Active
- 2008-04-24 WO PCT/EP2008/003345 patent/WO2008135179A1/en active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0538006A1 (en) * | 1991-10-15 | 1993-04-21 | ENTHONE-OMI, Inc. | Direct metallization process |
EP0616053A1 (en) * | 1993-03-18 | 1994-09-21 | Atotech Usa, Inc. | Self accelerating and replenishing non-formaldehyde immersion coating method and composition |
WO1996029452A1 (en) * | 1995-03-17 | 1996-09-26 | Atotech Deutschland Gmbh | Process for the selective or partial electrolytic metallization of surfaces of substrates made from non-conducting materials |
US5910340A (en) * | 1995-10-23 | 1999-06-08 | C. Uyemura & Co., Ltd. | Electroless nickel plating solution and method |
EP0913502A1 (en) * | 1997-04-07 | 1999-05-06 | Okuno Chemical Industries Co., Ltd. | Method of electroplating nonconductive plastic molded product |
EP1306465A2 (en) * | 2001-10-24 | 2003-05-02 | Shipley Co. L.L.C. | Stabilizers for electroless plating solutions and methods of use thereof |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011035921A1 (en) | 2009-09-28 | 2011-03-31 | Atotech Deutschland Gmbh | Process for applying a metal coating to a non-conductive substrate |
EP2305856A1 (en) | 2009-09-28 | 2011-04-06 | ATOTECH Deutschland GmbH | Process for applying a metal coating to a non-conductive substrate |
Also Published As
Publication number | Publication date |
---|---|
PT1988192E (en) | 2013-01-24 |
EP1988192B1 (en) | 2012-12-05 |
KR20150038717A (en) | 2015-04-08 |
ES2395736T3 (en) | 2013-02-14 |
CN101675186B (en) | 2012-03-07 |
PL1988192T3 (en) | 2013-04-30 |
KR20150063593A (en) | 2015-06-09 |
KR101579191B1 (en) | 2015-12-21 |
JP5279815B2 (en) | 2013-09-04 |
KR20100017608A (en) | 2010-02-16 |
EP1988192A1 (en) | 2008-11-05 |
BRPI0810798A2 (en) | 2014-10-29 |
CN101675186A (en) | 2010-03-17 |
US8152914B2 (en) | 2012-04-10 |
US20100119713A1 (en) | 2010-05-13 |
JP2010526205A (en) | 2010-07-29 |
BRPI0810798B1 (en) | 2020-03-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8152914B2 (en) | Process for applying a metal coating to a non-conductive substrate | |
KR100495164B1 (en) | Pretreating agent for metal plating | |
JP3929399B2 (en) | Method for electroless metal plating | |
CZ64194A3 (en) | Method of applying metal coating to electrically non-conducting substrate and composition of matters containing self-accelerating and additive immersion mixture for making the same | |
US20050199587A1 (en) | Non-chrome plating on plastic | |
EP2305856A1 (en) | Process for applying a metal coating to a non-conductive substrate | |
WO1998045505A1 (en) | Method of electroplating nonconductive plastic molded product | |
TW201546241A (en) | Composition and process for metallizing nonconductive plastic surfaces | |
EP2809825A2 (en) | Electroless nickel plating bath | |
JP3826544B2 (en) | Catalyst composition for electroless plating | |
TWI767101B (en) | Method for forming metal film on polyimind resin | |
KR102632802B1 (en) | Coating agent for forming oxide film, method for manufacturing oxide film, and method for manufacturing metal plating structure | |
JP2000282245A (en) | CONDITIONER COMPOSITION AND METHOD FOR INCREASING AMOUNT OF Pd-Sn COLLOIDAL CATALYST TO BE ADSORBED USING THE SAME | |
Chiang et al. | Formation of PdS compounds in direct metallization via Pd/Sn catalyst activation | |
JPH0148349B2 (en) | ||
JP2000212762A (en) | Electroless copper plating method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200880014598.2 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 08749126 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 3506/KOLNP/2009 Country of ref document: IN |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2010504553 Country of ref document: JP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 12451191 Country of ref document: US |
|
ENP | Entry into the national phase |
Ref document number: 20097025285 Country of ref document: KR Kind code of ref document: A |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 08749126 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: PI0810798 Country of ref document: BR Kind code of ref document: A2 Effective date: 20091029 |